JP6582803B2 - 電子デバイス、液体吐出ヘッド、および、電子デバイスの製造方法 - Google Patents
電子デバイス、液体吐出ヘッド、および、電子デバイスの製造方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
前記複数の基板のうちの一の基板には、空間が形成され、
前記空間を区画する面のうちの一面は可動領域であり、
前記可動領域は、前記空間側から可動領域の厚さ方向の途中まで窪んだ凹部を有し、
基板積層方向に垂直な方向において、前記凹部の内寸は前記空間の内寸よりも大きく、
前記一の基板における前記空間を区画する壁と、前記凹部の底面の少なくとも一部と、が接着剤により接着されていることを特徴とする。
前記壁と前記凹部の底面とを接着する接着剤と、が前記壁を通じて連続している構成を採用することが望ましい。
前記一の基板には、液体を吐出するノズルと連通する前記空間としての圧力室が形成され、
前記圧力室の一部を区画する可動領域を変位させる圧電素子が設けられたことを特徴とする。
前記可動領域の前記空間側の面に、基板積層方向に垂直な方向における内寸が前記空間の前記方向の内寸よりも大きい凹部を形成する凹部形成工程と、
前記一の基板における前記可動領域側とは反対側の面に他の基板を接着剤により接合して前記第1の基板と前記他の基板との間から漏出した接着剤により、前記一の基板における前記空間を区画する壁と前記凹部の底面の少なくとも一部を接着する接着工程と、
を含むことを特徴とする。
前記一の基板の前記可動領域側の面とは反対側の面に、前記空間に対応する部分に開口を有するマスクを形成するマスク形成工程と、
前記マスクを介して前記一の基板をエッチングすることにより、当該一の基板に前記空間を形成する空間形成工程と、
マスク除去液により前記マスクを除去すると共に、前記空間に露出した前記可動領域を前記マスク除去液に曝すマスク除去工程と、
を含むことが望ましい。
前記マスクは、窒化シリコンから形成され、
前記マスク除去液は、フッ化水素水溶液であることが望ましい。
Claims (6)
- 複数の基板が基板積層方向に積層された状態で相互に接合された電子デバイスであって、
前記複数の基板のうちの一の基板には、可動領域と複数の壁とで区画される空間が形成され、
前記可動領域は、前記空間側から可動領域の厚さ方向の途中まで窪んだ凹部を有し、
前記凹部は、前記基板積層方向で前記壁と重なる部分に切欠部を有し、
前記基板積層方向に垂直な方向において、前記凹部の内寸は前記壁間での前記空間の内寸よりも大きく、
前記一の基板における前記壁と、前記凹部の底面の少なくとも一部と、が、前記切欠部に導入された接着剤により接着されていることを特徴とする電子デバイス。 - 前記一の基板と、前記一の基板における前記可動領域側とは反対側の面に接合された他の基板と、の間の接着剤と、
前記壁と前記凹部の底面とを接着する接着剤と、が前記壁を通じて連続していることを特徴とする請求項1に記載の電子デバイス。 - 前記接着剤が、エポキシ基を含む有機化合物であることを特徴とする請求項1または請求項2に記載の電子デバイス。
- 請求項1から請求項3の何れか一項に記載の電子デバイスを備えた液体吐出ヘッドであって、
前記一の基板には、液体を吐出するノズルと連通する前記空間としての圧力室が形成され、
前記圧力室の一部を区画する可動領域を変位させる圧電素子が設けられたことを特徴とする液体吐出ヘッド。 - 複数の基板が積層された状態で相互に接合され、前記複数の基板のうちの一の基板に形成された空間を区画する面のうちの一面が可動領域である電子デバイスの製造方法であって、
前記可動領域の前記空間側の面に、基板積層方向に垂直な方向における内寸が前記空間の前記方向の内寸よりも大きい凹部を形成する凹部形成工程と、
前記一の基板における前記可動領域側とは反対側の面に他の基板を接着剤により接合して前記一の基板と前記他の基板との間から漏出した接着剤により、前記一の基板における前記空間を区画する壁と前記凹部の底面の少なくとも一部を接着する接着工程と、
を含み、
前記凹部形成工程は、
前記一の基板の前記可動領域側の面とは反対側の面に、前記空間に対応する部分に開口を有するマスクを形成するマスク形成工程と、
前記マスクを介して前記一の基板をエッチングすることにより、当該一の基板に前記空間を形成する空間形成工程と、
マスク除去液により前記マスクを除去すると共に、前記空間に露出した前記可動領域を前記マスク除去液に曝すことで前記凹部を形成するマスク除去工程と、
を含むことを特徴とする電子デバイスの製造方法。 - 前記可動領域の少なくとも前記空間側の面は、酸化シリコンから形成され、
前記マスクは、窒化シリコンから形成され、
前記マスク除去液は、フッ化水素水溶液であることを特徴とする請求項5に記載の電子デバイスの製造方法。
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JP2015187840A JP6582803B2 (ja) | 2015-09-25 | 2015-09-25 | 電子デバイス、液体吐出ヘッド、および、電子デバイスの製造方法 |
CN201610677838.3A CN106553450B (zh) | 2015-09-25 | 2016-08-16 | 电子设备、液体喷出头以及电子设备的制造方法 |
US15/273,420 US9937716B2 (en) | 2015-09-25 | 2016-09-22 | Electronic device, liquid ejecting head, and electronic device manufacturing method |
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JP2017103267A (ja) * | 2015-11-30 | 2017-06-08 | セイコーエプソン株式会社 | 圧電素子、圧電素子の形成方法および超音波装置 |
US10553720B2 (en) * | 2016-11-29 | 2020-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of removing an etch mask |
JP7087310B2 (ja) * | 2017-09-13 | 2022-06-21 | セイコーエプソン株式会社 | 液体噴射ヘッドおよび液体噴射装置 |
JP7031293B2 (ja) | 2017-12-25 | 2022-03-08 | セイコーエプソン株式会社 | 圧電デバイス、液体吐出ヘッド、及び液体吐出装置 |
JP7087413B2 (ja) | 2018-01-31 | 2022-06-21 | セイコーエプソン株式会社 | 圧電デバイス、液体噴射ヘッド、および、液体噴射装置 |
JP7095482B2 (ja) * | 2018-08-18 | 2022-07-05 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置及び液体噴射ヘッドのバイアス電位の設定方法 |
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JP3684815B2 (ja) * | 1998-02-13 | 2005-08-17 | セイコーエプソン株式会社 | インクジェット式記録ヘッドおよびそれらの製造方法 |
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US6303042B1 (en) * | 1999-03-02 | 2001-10-16 | Eastman Kodak Company | Making ink jet nozzle plates |
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CN101102897A (zh) * | 2004-11-19 | 2008-01-09 | 爱克发印艺公司 | 将喷嘴板粘接到喷墨打印头上的改进的方法 |
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US7654651B2 (en) * | 2006-01-17 | 2010-02-02 | Canon Kabushiki Kaisha | Liquid discharge head and manufacturing method of the same |
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JP2007184639A (ja) * | 2007-03-26 | 2007-07-19 | Toshiba Corp | 半導体装置の製造方法 |
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