JP2003243889A - Electronic part mounting device and method therefor - Google Patents
Electronic part mounting device and method thereforInfo
- Publication number
- JP2003243889A JP2003243889A JP2002043258A JP2002043258A JP2003243889A JP 2003243889 A JP2003243889 A JP 2003243889A JP 2002043258 A JP2002043258 A JP 2002043258A JP 2002043258 A JP2002043258 A JP 2002043258A JP 2003243889 A JP2003243889 A JP 2003243889A
- Authority
- JP
- Japan
- Prior art keywords
- holding member
- component
- replacement
- component holding
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、部品供給装置から
電子部品を取り出して回路基板に実装する部品保持部材
の交換が可能な電子部品実装装置、及び該電子部品実装
装置にて実行される電子部品実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting device capable of exchanging a component holding member for picking up an electronic component from a component supply device and mounting it on a circuit board, and an electronic component mounting device. Regarding the component mounting method.
【０００２】[0002]
【従来の技術】電子部品を保持する吸着ノズルを有する
部品装着ヘッドと、上記吸着ノズルの交換を行うための
ノズル交換部とを備えた電子部品実装装置では、従来、
吸着ノズルによる電子部品の吸着状態に基づいて上記吸
着ノズルの良否を判断していた。そして吸着ノズルが不
良であると判断されたときには、該吸着ノズルを上記ノ
ズル交換部に備えた予備の正常な吸着ノズルと交換する
ことにより、回路基板への実装動作を続行させていた。
以下に具体的に説明する。2. Description of the Related Art An electronic component mounting apparatus including a component mounting head having a suction nozzle for holding an electronic component and a nozzle exchanging section for exchanging the suction nozzle has been conventionally known.
The quality of the suction nozzle is judged based on the suction state of the electronic component by the suction nozzle. When it is determined that the suction nozzle is defective, the suction nozzle is replaced with a normal spare suction nozzle provided in the nozzle replacement section to continue the mounting operation on the circuit board.
This will be specifically described below.
【０００３】図１０に示す従来の電子部品実装装置２０
において、部品装着ヘッド９はＸＹ平面上を移動自在
で、搭載した８本の吸着ノズル１〜８を個別に、その軸
方向へ昇降、及び軸周りに回転可能に構成されている。
このような部品装着ヘッド９は、部品供給装置１１から
供給される電子部品を上記吸着ノズル１〜８にて吸着
し、部品認識装置１０にて認識された各電子部品の吸着
姿勢に基づいて姿勢補正を行う。一方、プリント基板
は、移送装置１２にて当該電子部品実装装置２０に搬入
され位置決めされる。上記姿勢補正後、部品装着ヘッド
９は、上記プリント基板の実装位置に、吸着している電
子部品を順次、実装する。又、部品装着ヘッド９に装填
されている吸着ノズルでは実装できない電子部品がある
場合には、当該電子部品実装装置２０に備えたノズル交
換部１３にて、部品装着ヘッド９に装填済の吸着ノズル
を、電子部品に適合した吸着ノズルに交換することによ
り実装動作を続行する。A conventional electronic component mounting apparatus 20 shown in FIG.
In the above, the component mounting head 9 is movable on the XY plane, and is configured such that the eight mounted suction nozzles 1 to 8 can be individually moved up and down in the axial direction and rotated about the axis.
Such a component mounting head 9 sucks the electronic components supplied from the component supply device 11 by the suction nozzles 1 to 8 described above, and determines the posture based on the suction posture of each electronic component recognized by the component recognition device 10. Make a correction. On the other hand, the printed circuit board is carried into the electronic component mounting apparatus 20 by the transfer device 12 and positioned. After the posture correction, the component mounting head 9 sequentially mounts the sucked electronic component on the mounting position of the printed circuit board. If there is an electronic component that cannot be mounted by the suction nozzle mounted on the component mounting head 9, the nozzle exchanging unit 13 provided in the electronic component mounting apparatus 20 causes the suction nozzle already mounted on the component mounting head 9. Is replaced with a suction nozzle suitable for the electronic component to continue the mounting operation.
【０００４】尚、特開平１０−１６３６８９号公報に
は、部品装着ヘッドにて部品供給装置から電子部品の吸
着を行う際に、ある吸着ノズルが連続して設定回数以上
連続して吸着ミスを起こしたときには、該吸着ノズルを
不良と判断し、予備の正常な吸着ノズルに交換して実装
動作を続行する技術が開示されている。In Japanese Patent Laid-Open No. 10-163689, when a component mounting head picks up an electronic component from a component supply device, a certain suction nozzle continuously causes a suction error more than a set number of times. In that case, a technique is disclosed in which the suction nozzle is determined to be defective, and a spare normal suction nozzle is replaced to continue the mounting operation.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述し
たような従来の電子部品実装装置による実装動作では、
上述したように吸着ノズルの交換作業が発生した場合、
ノズル交換の動作が実装プログラムと違う動作をするこ
とにより、生産性が悪化するという問題があった。例え
ば、図１１に示すノズル交換部において、ＳＴ１〜ＳＴ
８、及びＳＴ１７〜ＳＴ２４を使用して、ノズル交換を
１回行って実装動作を行うプログラムがある場合におい
て、ＳＴ８の吸着ノズルが不良となったと仮定する。こ
の場合、当該電子部品実装装置は、不良となったＳＴ８
に等価である代替ノズルをノズル交換部にて探す。その
結果、ＳＴ９〜ＳＴ１６が代替ノズルとして使用可能で
あれば、ＳＴ９〜ＳＴ１６の任意の一つとノズル交換し
て実装動作を行う。したがって、ノズル交換動作は、上
記実装動作プログラムに元々含まれる１回のノズル交換
と、上記不良となった吸着ノズルの交換との合わせて２
回となり、生産性が低下していた。本発明は、このよう
な問題点を解決するためになされたもので、不良の部品
保持部材が発生してその交換動作を行った場合でも、基
板の生産性の向上が可能な電子部品実装装置、及び電子
部品実装方法を提供することを目的とする。However, in the mounting operation by the conventional electronic component mounting apparatus as described above,
When the suction nozzle replacement work occurs as described above,
There is a problem that productivity deteriorates because the nozzle replacement operation is different from the mounting program. For example, in the nozzle exchanging unit shown in FIG. 11, ST1 to ST
8 and ST17 to ST24, it is assumed that the suction nozzle in ST8 is defective when there is a program for performing the mounting operation by performing the nozzle replacement once. In this case, the electronic component mounting apparatus becomes defective in ST8.
Find an alternative nozzle that is equivalent to As a result, if ST9 to ST16 can be used as alternative nozzles, the mounting operation is performed by replacing the nozzle with any one of ST9 to ST16. Therefore, the nozzle replacement operation is a total of 2 replacements of one nozzle replacement originally included in the mounting operation program and replacement of the defective suction nozzle.
Times, and productivity fell. The present invention has been made to solve such problems, and an electronic component mounting apparatus capable of improving the productivity of a substrate even when a defective component holding member is generated and the replacement operation is performed. , And an electronic component mounting method.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明は以下のように構成する。即ち、本発明の第
１態様の電子部品実装装置は、複数の部品保持部材を着
脱可能に装填し該部品保持部材にて保持した電子部品を
回路基板へ実装する部品実装ヘッドと、上記部品保持部
材と交換可能であって上記電子部品を保持可能でかつ上
記部品実装ヘッドにおける上記部品保持部材の数を超え
る数の交換用部品保持部材を有する交換ステーション
と、上記部品実装ヘッドの動作制御を行い、かつ上記部
品実装ヘッドに装填されている上記部品保持部材の種類
及び配列に関する主パターンに一致する副パターンが上
記交換ステーションにおける上記交換用部品保持部材の
配置に含まれるか否かを検索し、該検索結果に基づいて
上記部品実装ヘッドに装填されている上記主パターンの
上記部品保持部材を上記副パターンの上記交換用部品保
持部材に交換可能か否かを判断する制御装置と、を備え
たことを特徴とする。In order to achieve the above object, the present invention is configured as follows. That is, the electronic component mounting apparatus according to the first aspect of the present invention includes a component mounting head that detachably loads a plurality of component holding members and mounts electronic components held by the component holding members on a circuit board; A replacement station that is replaceable with a member and that can hold the electronic component and that has a number of replacement component holding members that exceeds the number of the component holding members in the component mounting head, and that controls the operation of the component mounting head. , And whether or not a sub-pattern corresponding to the main pattern regarding the type and arrangement of the component holding member loaded in the component mounting head is included in the arrangement of the replacement component holding member at the exchange station, Based on the search result, the component holding member of the main pattern loaded in the component mounting head is held by the replacement component of the sub-pattern. Characterized by comprising a control device for determining whether replacement is possible or not to wood, the.
【０００７】又、上記制御装置は、不具合の生じた不良
部品保持部材、及び該不良部品保持部材と交換可能な交
換用部品保持部材の、上記交換ステーション内における
配置換えを上記部品実装ヘッドに行わせる動作制御を行
うことができる。Further, the control device relocates the defective component holding member having a defect and the replacement component holding member replaceable with the defective component holding member in the replacement station to the component mounting head. Operation control can be performed.
【０００８】又、上記交換ステーションに備わる上記交
換用部品保持部材の配置換えを行う保持部材交換装置を
さらに備え、上記制御装置は、不具合の生じた不良部品
保持部材、及び該不良部品保持部材と交換可能な交換用
部品保持部材の、上記交換ステーション内における配置
換えを上記保持部材交換装置に行わせる動作制御を行う
ことができる。Further, a holding member exchanging device for relocating the replacement component holding member provided in the exchanging station is further provided, and the control device includes a defective component holding member having a defect and the defective component holding member. It is possible to perform operation control that causes the holding member exchanging device to reposition the exchangeable replacement component holding member in the exchange station.
【０００９】又、上記交換ステーションは、上記交換用
部品保持部材を一列状に配列しかつ上記部品実装ヘッド
における上記主パターンを構成する上記部品保持部材と
の交換場所である交換部分と、列状に配置された上記交
換用部品保持部材を移動させて、上記交換部分にて上記
副パターンを形成する保持部材移動装置と、を有するこ
とができる。Further, the replacement station has a replacement portion, which is a replacement place for arranging the replacement component holding members in one row, and a place for exchanging with the component holding member forming the main pattern of the component mounting head, and a row. And a holding member moving device that moves the replacement component holding member arranged in the above position to form the sub-pattern at the replacement portion.
【００１０】又、上記検索の結果、上記主パターンに一
致する上記副パターンが上記交換ステーションに存在し
ないとき、上記制御装置は、上記部品実装ヘッドに装填
されている上記部品保持部材の種類に類似しかつ上記電
子部品を保持可能な、上記交換用部品保持部材に含まれ
る等価交換用部品保持部材をも含めて上記主パターンに
類似する類似副パターンの有無を検索することができ
る。Further, as a result of the search, when the sub-pattern matching the main pattern does not exist in the exchange station, the control device is similar to the type of the component holding member loaded in the component mounting head. In addition, it is possible to search for the presence or absence of a similar sub-pattern similar to the main pattern, including the equivalent replacement component holding member included in the replacement component holding member and capable of holding the electronic component.
【００１１】本発明の第２態様の電子部品実装方法は、
複数の部品保持部材を有する部品実装ヘッドによって上
記部品保持部材で保持した電子部品を回路基板へ実装す
る電子部品実装方法であって、上記部品保持部材が不良
となり交換を要するとき、該不良部品保持部材のみなら
ず、上記不良部品保持部材以外の正常部品保持部材をも
交換の対象とし、上記部品実装ヘッドにおける部品保持
部材の交換回数が最小になるように、上記部品実装ヘッ
ドにおける部品保持部材の種類及び配列に関する主パタ
ーンに一致する交換用部品保持部材の種類及び配列に関
する副パターンを交換ステーションに配置されている上
記交換用部品保持部材から検索し、一致する配置が確認
されたときには、上記部品実装ヘッドにおける上記主パ
ターンにて構成される上記部品保持部材を上記副パター
ンにて構成される上記交換用部品保持部材に入れ換えて
電子部品実装を行う、ことを特徴とする。The electronic component mounting method according to the second aspect of the present invention is
An electronic component mounting method for mounting an electronic component held by the component holding member on a circuit board by a component mounting head having a plurality of component holding members, wherein when the component holding member becomes defective and needs to be replaced, the defective component holding Not only the member but also the normal component holding member other than the defective component holding member is to be replaced, and the component holding member of the component mounting head is designed to minimize the number of times of replacement of the component holding member in the component mounting head. When the sub-pattern regarding the type and arrangement of the replacement part holding member that matches the main pattern regarding the type and arrangement is searched from the replacement part holding member arranged in the exchange station, and the matching arrangement is confirmed, the above-mentioned parts The component holding member configured by the main pattern in the mounting head is configured by the sub pattern. Performing electronic component mounting interchanged in serial replacement component holding member, characterized in that.
【００１２】上記第２態様において、上記交換ステーシ
ョンの上記交換用部品保持部材に不良が生じたとき、上
記副パターンの検索を行う前に、上記副パターンを形成
するように上記交換用部品保持部材の配置換えを行うよ
うにしてもよい。In the second aspect, when a defect occurs in the replacement component holding member of the replacement station, the replacement component holding member is formed so that the sub pattern is formed before the sub pattern is searched. May be rearranged.
【００１３】上記第２態様において、上記検索の結果、
上記主パターンに一致する上記副パターンが上記交換ス
テーションに存在しないとき、上記部品実装ヘッドに装
填されている上記部品保持部材の種類に類似しかつ上記
電子部品を保持可能な、上記交換用部品保持部材に含ま
れる等価交換用部品保持部材をも含めて上記主パターン
若しくは上記主パターンに類似する類似副パターンの有
無を検索するようにしてもよい。In the second aspect, as a result of the search,
When the sub-pattern corresponding to the main pattern is not present in the replacement station, the replacement-parts holder is similar to the kind of the parts-holding member loaded in the component mounting head and can hold the electronic parts. The presence or absence of the main pattern or a similar sub-pattern similar to the main pattern, including the equivalent replacement component holding member included in the member, may be searched.
【００１４】[0014]
【発明の実施の形態】本発明の実施形態である電子部品
実装装置及び方法について、図を参照しながら以下に説
明する。ここで、上記電子部品実装方法は、上記電子部
品実装装置にて実行される。又、各図において、同じ構
成部分については同じ符号を付している。又、電子部品
を実装する回路基板の種類が変化すれば当然に上記電子
部品を保持するための部品保持部材の交換が発生するこ
とから、以下の実施形態は、同一種類の回路基板へ電子
部品を実装するときにおける部品保持部材の交換の場合
に関するものである。図１に示す本実施形態の電子部品
実装装置１０１は、部品供給装置１１１と、部品実装ヘ
ッド１２１と、ヘッド移動装置１３１と、基板搬送装置
１４１と、部品認識装置１５１と、交換ステーション１
６１と、制御装置１８１とを備える。上記部品供給装置
１１１は、上記基板搬送装置１４１にて当該電子部品実
装装置１０１へ搬入されてくる回路基板１９１へ実装す
る電子部品１９２の供給を行う装置であり、当該電子部
品実装装置１０１では、電子部品１９２を収納したテー
プを巻回したリールを装填して部品供給を行ういわゆる
パーツカセット形態の第１供給装置１１１−１と、電子
部品１９２を載置したトレイにて部品供給を行ういわゆ
るトレイ形態の第２供給装置１１１−２とを有する。BEST MODE FOR CARRYING OUT THE INVENTION An electronic component mounting apparatus and method according to an embodiment of the present invention will be described below with reference to the drawings. Here, the electronic component mounting method is executed by the electronic component mounting apparatus. Further, in each drawing, the same reference numerals are given to the same components. Further, if the type of the circuit board on which the electronic component is mounted changes, the component holding member for holding the electronic component naturally needs to be replaced. The present invention relates to the case of exchanging the component holding member when mounting. The electronic component mounting apparatus 101 of the present embodiment shown in FIG. 1 includes a component supply device 111, a component mounting head 121, a head moving device 131, a board transfer device 141, a component recognition device 151, and a replacement station 1.
61 and a control device 181. The component supply device 111 is a device that supplies the electronic component 192 to be mounted on the circuit board 191 that is carried into the electronic component mounting apparatus 101 by the board transfer device 141. In the electronic component mounting apparatus 101, A first supply device 111-1 in the form of a so-called parts cassette that supplies a component by loading a reel wound with a tape containing an electronic component 192, and a so-called tray that supplies a component with a tray on which the electronic component 192 is placed. Form of the second supply device 111-2.
【００１５】上記部品実装ヘッド１２１は、上記電子部
品１９２を保持する部品保持部材１２２を複数有する。
当該電子部品実装装置１０１では、上記部品保持部材１
２２は、吸引装置１２３による吸引動作にて電子部品１
９２を吸着するノズル形態にてなり、図示するＸ軸方向
に沿って一列に、部品保持部材１２２−１〜１２２−８
の８本を有し、保持する電子部品１９２の形状、サイズ
等に応じた形状及び大きさにてなる。尚、部品保持部材
１２２は、上記ノズル形態に限定されるものではなく例
えば電子部品１９２を挟持するチャック形態等であって
もよく、さらにその数も上記８本に限定されるものでは
ない。又、部品保持部材１２２−１〜１２２−８は、着
脱構造１２５により、部品実装ヘッド１２１の本体部１
２４に対してそれぞれ独立して着脱可能である。上記着
脱構造１２５としては、例えば図４に示すように、上記
本体部１２４に取り付けられ先端にボールを進退可能に
設けたボールプランジャ１２５−１と、上記部品保持部
材１２２に形成され上記ボールが嵌合される溝部１２５
−２とを有する構造である。該構造によれば、上記本体
部１２４に部品保持部材１２２を挿入することで、ボー
ルプランジャ１２５−１の上記ボールが上記溝部１２５
−２に嵌合し、部品保持部材１２２が本体部１２４に固
定され、一方、部品保持部材１２２を引っ張ることで、
上記溝部１２５−２から上記ボールが外れ、本体部１２
４から部品保持部材１２２を引き抜くことができる。さ
らに又、部品保持部材１２２のそれぞれは、上記部品実
装ヘッド１２１に備わる駆動装置にて上記本体部１２４
とともに軸周りに回転可能であり、かつ軸方向に昇降移
動可能である。The component mounting head 121 has a plurality of component holding members 122 for holding the electronic components 192.
In the electronic component mounting apparatus 101, the component holding member 1
22 is the electronic component 1 by the suction operation by the suction device 123.
In the form of a nozzle that sucks 92, the component holding members 122-1 to 122-8 are arranged in a line along the illustrated X-axis direction.
And the shape and size of the electronic component 192 to be held are in accordance with the shape and size of the electronic component 192 to be held. The component holding member 122 is not limited to the nozzle shape described above, and may be, for example, a chuck shape that holds the electronic component 192, and the number thereof is not limited to the above eight. Further, the component holding members 122-1 to 122-8 are attached / detached by the attachment / detachment structure 125.
24 can be independently attached and detached. As the attachment / detachment structure 125, for example, as shown in FIG. 4, the ball plunger 125-1 attached to the body portion 124 and provided at the tip end to allow the ball to advance and retreat, and the ball formed on the component holding member 122 are fitted. Groove part 125 to be fitted
It is a structure having -2. According to this structure, by inserting the component holding member 122 into the body portion 124, the ball of the ball plunger 125-1 is moved to the groove portion 125.
-2, the component holding member 122 is fixed to the main body portion 124, while the component holding member 122 is pulled,
The ball is disengaged from the groove 125-2, and the main body 12
It is possible to pull out the component holding member 122 from No. 4. Furthermore, each of the component holding members 122 is attached to the body portion 124 by a driving device provided in the component mounting head 121.
Along with it, it can rotate around the axis and can move up and down in the axial direction.
【００１６】ヘッド移動装置１３１は、上述の部品実装
ヘッド１２１をＸ，Ｙ方向へ移動させる装置であり、当
該部品実装装置１０１では、図１に示すようにＹ方向に
延在し、それぞれボールネジ機構を有する一対のＹ駆動
部１３１−１と、Ｘ方向に延在しボールネジ機構を有す
るＸ駆動部１３１−２とを有する。又、Ｘ駆動部１３１
−２には上記部品実装ヘッド１２１が取り付けられ、か
つＸ駆動部１３１−２は上記一対のＹ駆動部１３１−１
に懸架されＹ駆動部１３１−１にてＹ方向に移動可能で
ある。よって、Ｙ駆動部１３１−１及びＸ駆動部１３１
−２の動作により、部品実装ヘッド１２１は、Ｘ及びＹ
方向へ自由に移動可能である。The head moving device 131 is a device for moving the component mounting head 121 in the X and Y directions. In the component mounting device 101, the head moving device 131 extends in the Y direction as shown in FIG. And a pair of Y drive parts 131-1 having a ball screw mechanism and an X drive part 131-2 extending in the X direction and having a ball screw mechanism. In addition, the X drive unit 131
-2, the component mounting head 121 is attached, and the X drive unit 131-2 is the pair of Y drive units 131-1.
It can be moved in the Y-direction by the Y-driving unit 131-1. Therefore, the Y drive unit 131-1 and the X drive unit 131
-2 operation causes the component mounting head 121 to move in X and Y directions.
You can move freely in any direction.
【００１７】上記基板搬送装置１４１は、当該電子部品
実装装置１０１に対する回路基板１９１の搬入及び搬出
を行う装置である。上記部品認識装置１５１は、上記部
品実装ヘッド１２１の部品保持部材１２２に保持された
電子部品１９２の保持姿勢を撮像する装置であり、撮像
情報を上記制御装置１８１へ送出する。上記撮像情報
は、部品保持部材１２２の良否判断の材料とされる。The board transfer device 141 is a device for loading and unloading the circuit board 191 with respect to the electronic component mounting apparatus 101. The component recognition device 151 is a device that images the holding posture of the electronic component 192 held by the component holding member 122 of the component mounting head 121, and sends the image pickup information to the control device 181. The imaging information is used as a material for determining the quality of the component holding member 122.
【００１８】上記交換ステーション１６１は、上記部品
実装ヘッド１２１に対して着脱可能に装填されている上
記部品保持部材１２２と交換可能であって電子部品１９
２を保持しかつ部品実装ヘッド１２１における部品保持
部材１２２の数を超える数の交換用部品保持部材１６２
を有する。該交換用部品保持部材１６２は、機能的、及
び上述の溝部１２５−２に関する構造において上記部品
保持部材１２２と変わるものではなく、サイズや形状等
が異なる種々の電子部品１９２を保持可能なように、部
品保持部材１２２と比べて電子部品１９２に接触する部
分等のサイズ等が異なる部材である。尚、交換ステーシ
ョン１６１に備わる交換用部品保持部材１６２の全てが
部品保持部材１２２と異なる部材であることはなく、一
部は同一である。又、本実施形態では上述のように部品
実装ヘッド１２１は一列状に８本の部品保持部材１２２
−１〜１２２−８を配列している。よって、詳細後述す
るが、これら部品保持部材１２２−１〜１２２−８が一
度に交換可能なように、部品保持部材１２２の配列に対
応して図７に示すように、交換ステーション１６１には
８本の交換用部品保持部材１６２が一列に配置されてい
る。尚、本実施形態では、交換ステーション１６１に
は、図５に示すように、交換用部品保持部材１６２を収
納する装填部分１６３が３行８列にて配列されている。
又、部品保持部材１２２を交換するとき、部品実装ヘッ
ド１２１に装填されている部品保持部材１２２を交換ス
テーション１６１に退避させる必要があることから、図
７に示すように例えば装填部分１６３−１〜１６３−８
には交換用部品保持部材１６２が存在しない。The exchange station 161 is replaceable with the component holding member 122 which is detachably mounted on the component mounting head 121, and is an electronic component 19.
2 and the number of replacement component holding members 162 that exceeds the number of component holding members 122 in the component mounting head 121.
Have. The replacement component holding member 162 is functionally the same as the component holding member 122 in the structure related to the groove 125-2 described above, and is designed to be capable of holding various electronic components 192 having different sizes, shapes, and the like. Compared to the component holding member 122, the size of the portion that contacts the electronic component 192 is different. It should be noted that all of the replacement component holding members 162 provided in the replacement station 161 are not different from the component holding member 122, and some of them are the same. Further, in the present embodiment, as described above, the component mounting head 121 includes the eight component holding members 122 arranged in a line.
-1 to 122-8 are arranged. Therefore, as will be described in detail later, as shown in FIG. 7 corresponding to the arrangement of the component holding members 122 so that these component holding members 122-1 to 122-8 can be replaced at a time, the replacement station 161 has 8 units. Book replacement component holding members 162 are arranged in a line. In the present embodiment, as shown in FIG. 5, the replacement station 161 is provided with loading portions 163 for accommodating the replacement component holding members 162 arranged in 3 rows and 8 columns.
Further, when the component holding member 122 is replaced, it is necessary to retract the component holding member 122 loaded in the component mounting head 121 to the replacement station 161, so that, for example, as shown in FIG. 163-8
Does not have a replacement component holding member 162.
【００１９】さらに又、上記部品実装ヘッド１２１に装
填されている部品保持部材１２２と、交換ステーション
１６１に設けられている交換用部品保持部材１６２との
交換動作を、詳細後述するように制御装置１８１の制御
により自動的に実行可能とするため、交換ステーション
１６１には、図４及び図６に示すような保持機構１６４
が備わる。種々の構造が考えられるが、本実施形態にお
ける上記保持機構１６４は、くさび形のカム１６４−１
がシリンダ１６４−２にて昇、降することに対応して、
一対の開閉レバー１６４−３が開、閉する機構であり、
上記装填部分１６３の各行毎、つまり装填部分１６３−
１〜１６３−８、装填部分１６３−９〜１６３−１６、
及び装填部分１６３−１７〜１６３−２４に対応してそ
れぞれ設けられている。又、上記シリンダ１６４−２の
動作は、制御装置１３０にて制御される。Furthermore, the replacement operation of the component holding member 122 loaded in the component mounting head 121 and the replacement component holding member 162 provided in the replacement station 161, as will be described later in detail, is a control device 181. Therefore, the exchange station 161 has a holding mechanism 164 as shown in FIGS.
Is equipped with. Although various structures are conceivable, the holding mechanism 164 in the present embodiment is the wedge-shaped cam 164-1.
Corresponding to ascending and descending in cylinder 164-2,
A mechanism for opening and closing the pair of opening / closing levers 164-3,
Each row of the loading portion 163, that is, the loading portion 163-
1-163-8, loading portion 163-9-163-16,
And the loading portions 163-17 to 163-24, respectively. The operation of the cylinder 164-2 is controlled by the controller 130.
【００２０】このような保持機構１６４は以下のように
動作する。即ち、通常、上記カム１６４−１は、上昇位
置にあり開閉レバー１６４−３は図６に示すように開い
ている。一方、部品保持部材１２２の交換のため、部品
保持部材１２２が交換ステーション１６１の上記装填部
分１６３に装填された後、上記シリンダ１６４−２にて
カム１６４−１を下降させて、一対の開閉レバー１６４
−３を閉じる。これにより、図４に示すように、開閉レ
バー１６４−３は、上記装填されている部品保持部材１
２２に形成されている溝１２６の部分に係合し溝１２６
部分を挟持する。よって、該挟持状態にて、上記本体部
１２４における上記部品保持部材１２２の保持部分を上
昇させることで、上記ボールプランジャ１２５−１と、
部品保持部材１２２の溝１２５−２との係合が外れ、上
記装填部分１６３に部品保持部材１２２を収納した状態
で本体部１２４のみが上昇可能である。Such a holding mechanism 164 operates as follows. That is, normally, the cam 164-1 is in the raised position and the opening / closing lever 164-3 is open as shown in FIG. On the other hand, in order to replace the component holding member 122, after the component holding member 122 is loaded in the loading portion 163 of the replacement station 161, the cam 164-1 is lowered by the cylinder 164-2, and the pair of opening / closing levers is opened. 164
-3 is closed. As a result, as shown in FIG. 4, the opening / closing lever 164-3 causes the loaded component holding member 1 to move.
22 is engaged with a portion of the groove 126 formed in the groove 126.
Hold the part. Therefore, by raising the holding portion of the component holding member 122 in the main body portion 124 in the sandwiched state, the ball plunger 125-1 and
Only the main body portion 124 can be lifted in a state where the component holding member 122 is disengaged from the groove 125-2 and the component holding member 122 is housed in the loading portion 163.
【００２１】上記制御装置１８１は、当該電子部品実装
装置１０１の動作制御を行う装置であり、具体的には、
上述した、部品供給装置１１１、部品実装ヘッド１２
１、吸引装置１２３、ヘッド移動装置１３１、基板搬送
装置１４１、部品認識装置１５１、及び交換ステーショ
ン１６１の保持機構１６４等の動作制御を行い、かつ以
下に述べる部品保持部材１２２の交換動作に関する動作
制御を行う。又、制御装置１８１に備わる記憶部１８２
には、回路基板１９１の搬入から、当該回路基板１９１
への電子部品１９２の実装動作を経て、実装済回路基板
の搬出までの動作に関して必要なプログラムが格納され
ている。よって以下に述べる、部品保持部材１２２の自
動交換動作に関する動作制御も、制御装置１８１は、上
記プログラムに従い実行する。従って、上記実装動作及
び上記交換動作に関して、制御装置１８１は、部品実装
ヘッド１２１に装填されている各部品保持部材１２２の
種類及び装填位置を理解しており、かつ交換ステーショ
ン１６１に配置されている各交換用部品保持部材１６２
の種類及び装填位置を理解している。The control device 181 is a device for controlling the operation of the electronic component mounting device 101, and specifically,
The component supply device 111 and the component mounting head 12 described above.
1, the suction device 123, the head moving device 131, the substrate transfer device 141, the component recognition device 151, the holding mechanism 164 of the replacement station 161, and the like, and the operation control regarding the replacement operation of the component holding member 122 described below. I do. Further, the storage unit 182 provided in the control device 181
From the carrying in of the circuit board 191 to the circuit board 191
A program necessary for the operation of mounting the electronic component 192 on the board to the operation of carrying out the mounted circuit board is stored. Therefore, the control device 181 also executes the operation control relating to the automatic replacement operation of the component holding member 122 described below according to the program. Therefore, regarding the mounting operation and the replacement operation, the control device 181 understands the type and loading position of each component holding member 122 loaded in the component mounting head 121, and is arranged in the exchange station 161. Each replacement component holding member 162
Understand the types and loading positions.
【００２２】以上説明した構成を有する本実施形態の電
子部品実装装置１０１にて実行される電子部品実装方法
について以下に説明する。尚、回路基板１９１の搬入及
び搬出動作、回路基板１９１への電子部品１９２の実装
に関する動作については、公知の電子部品実装装置にて
実行される動作に同じであるので、ここでの説明は省略
する。よって以下には、部品実装ヘッド１２１に装填さ
れている部品保持部材１２２と、交換ステーション１６
１に備わる交換用部品保持部材１６２との交換動作を主
として説明を行う。An electronic component mounting method executed by the electronic component mounting apparatus 101 of the present embodiment having the above-described structure will be described below. The operation of loading and unloading the circuit board 191 and the operation relating to the mounting of the electronic component 192 on the circuit board 191 are the same as the operation executed by the known electronic component mounting apparatus, and therefore the description thereof is omitted here. To do. Therefore, hereinafter, the component holding member 122 loaded in the component mounting head 121 and the replacement station 16 will be described.
The replacement operation with the replacement component holding member 162 provided in No. 1 will be mainly described.
【００２３】本実施形態における部品実装方法に含まれ
る部品保持部材１２２の交換動作では、実装動作におけ
る生産性の低下を防ぐため、上記交換動作が最小回数で
済むように交換方法が行われる。よって、従来では、不
良となった部品保持部材１２２のみを交換の対象として
いたが、本実施形態では、交換動作が最小回数で済むの
であれば不良の部品保持部材１２２のみならず正常であ
る部品保持部材１２２についても交換の対象とする。
尚、上記部品実装ヘッド１２１に備わる部品保持部材１
２２が不良となり交換を要すると制御装置１８１が判断
する方法として、本実施形態においても従来の場合と同
様に、部品認識装置１５１にて撮像された、各部品保持
部材１２２における電子部品１９２の吸着姿勢の撮像情
報に基づき、設定回数以上、連続して吸着ミスを生じた
部品保持部材１２２について、制御装置１８１は不良と
判断する。上記交換動作について、さらに具体的に以下
に説明する。In the replacement operation of the component holding member 122 included in the component mounting method according to the present embodiment, in order to prevent a decrease in productivity in the mounting operation, the replacement method is performed so that the replacement operation can be performed a minimum number of times. Therefore, in the past, only the defective component holding member 122 was targeted for replacement, but in the present embodiment, if the replacement operation can be performed a minimum number of times, not only the defective component holding member 122 but also the normal component The holding member 122 is also subject to replacement.
In addition, the component holding member 1 provided in the component mounting head 121.
As a method for the control device 181 to determine that the device 22 is defective and needs to be replaced, also in the present embodiment, as in the conventional case, the electronic component 192 is picked up by each component holding member 122 and imaged by the component recognition device 151. The control device 181 determines that the component holding member 122 in which the suction error has occurred consecutively more than the set number of times is defective based on the imaging information of the posture. The exchange operation will be described more specifically below.
【００２４】例えば、部品実装ヘッド１２１に装填され
ている部品保持部材１２２−１〜１２２−８、及び図７
に示すように、交換ステーション１６１に配置されてい
る交換用部品保持部材１６２−１７〜１６２−２４を使
用して実装動作を行うプログラムがある場合を想定す
る。尚、ここでは、図７に示す、交換用部品保持部材１
６２−９〜１６２−１６のノズル種類は「Ｓ」であり、
交換用部品保持部材１６２−１７〜１６２−２４のノズ
ル種類は「Ｍ」であるとする。又、部品実装ヘッド１２
１に備わる部品保持部材１２２−１〜１２２−８のノズ
ル種類は「Ｓ」であるとする。実装動作中に、部品保持
部材１２２−８が不良になった場合、他の部品保持部材
１２２−１〜１２２−７の内から部品保持部材１２２−
８の代用可能な部品保持部材を使用して、実装中の回路
基板１９１に対する部品実装動作を完了させる。そして
次の回路基板１９１に対する部品実装動作を開始する前
に、図２に示すステップ１にて以下の動作を行う。即
ち、上述したように、制御装置１８１は、部品保持部材
１２２−１〜１２２−８の各保持部材について、その種
類及びこれらの配列に関する情報を有し、かつ交換ステ
ーション１６１における交換用部品保持部材１６２の種
類及び配列に関する情報を有する。そこで、制御装置１
８１は、ステップ１にて、現在、部品実装ヘッド１２１
に装填されている部品保持部材１２２−１〜１２２−８
の種類及び配列に関する情報を抽出する。尚、抽出され
た上記種類及び配列に関する情報を主パターンとする。For example, the component holding members 122-1 to 122-8 loaded in the component mounting head 121 and FIG.
As shown in, it is assumed that there is a program for performing the mounting operation using the replacement component holding members 162-17 to 162-24 arranged in the replacement station 161. Incidentally, here, the replacement component holding member 1 shown in FIG.
The nozzle type of 62-9 to 162-16 is “S”,
The nozzle type of the replacement component holding members 162-17 to 162-24 is “M”. Also, the component mounting head 12
The nozzle type of the component holding members 122-1 to 122-8 included in No. 1 is “S”. When the component holding member 122-8 becomes defective during the mounting operation, the component holding member 122-1 is selected from the other component holding members 122-1 to 122-7.
The substitute component holding member 8 is used to complete the component mounting operation for the circuit board 191 being mounted. Then, before starting the component mounting operation on the next circuit board 191, the following operation is performed in step 1 shown in FIG. That is, as described above, the control device 181 has information about the types and arrangements of the holding members of the component holding members 122-1 to 122-8, and the replacement component holding member in the replacement station 161. It has information about 162 types and sequences. Therefore, the control device 1
Reference numeral 81 denotes the component mounting head 121 currently used in step 1.
Holding members 122-1 to 122-8 loaded in the
Extract information about the type and sequence of. The extracted information about the type and arrangement is used as the main pattern.
【００２５】次のステップ２では、制御装置１８１は、
上記主パターンに一致する副パターンを、交換用部品保
持部材１６２の種類及び配列に関する情報から検索す
る。検索方法としては、不良が発生しない場合において
上記プログラムにて実行される保持部材の交換回数以下
の回数にて、交換対象である部品保持部材を交換可能と
なるパターンを検索する。この場合、８本のノズル種類
「Ｓ」にてなる部品保持部材１２２−１〜１２２−８を
１回で交換できるパターンを検索する。次のステップ３
では、制御装置１８１は、上記副パターンを抽出したか
否かを判断する。該判断の結果、本例では上述のように
図７に示す交換用部品保持部材１６２−９〜１６２−１
６がノズル種類「Ｓ」であり保持部材の並び方も一致す
ると仮定すると、交換用部品保持部材１６２−９〜１６
２−１６が抽出される。抽出された場合にはステップ４
へ進み、生産に使用する保持部材を、上記部品保持部材
１２２−１〜１２２−８から交換用部品保持部材１６２
−９〜１６２−１６に変更する。つまり、制御装置１８
１の動作制御により、まず一旦、部品実装ヘッド１２１
に装填されている部品保持部材１２２−１〜１２２−８
を交換ステーション１６１における空の装填部分１６３
−１〜１６３−８へ、上述した保持機構１６４を動作さ
せて収納する。その後、部品実装ヘッド１２１を交換用
部品保持部材１６２−９〜１６２−１６の上方へ移動さ
せて、部品実装ヘッド１２１に交換用部品保持部材１６
２−９〜１６２−１６を装填させる。このように本実施
形態では、不良の部品保持部材１２２だけでなく正常な
部品保持部材１２２も含めて全ての部品保持部材１２２
を交換用部品保持部材１６２に交換する。そして、該交
換用部品保持部材１６２−９〜１６２−１６にて実装動
作を開始する。In the next step 2, the controller 181
A sub-pattern that matches the main pattern is searched from the information regarding the type and arrangement of the replacement component holding member 162. As a search method, when a defect does not occur, a pattern that makes it possible to replace the component holding member that is the replacement target is searched a number of times less than or equal to the number of times the holding member is replaced by the program. In this case, a pattern that allows replacement of the component holding members 122-1 to 122-8 with eight nozzle types “S” at one time is searched. Next step 3
Then, the control device 181 determines whether or not the sub pattern is extracted. As a result of the judgment, in this example, as described above, the replacement component holding members 162-9 to 162-1 shown in FIG.
Assuming that 6 is the nozzle type “S” and the arrangement of the holding members is also the same, replacement part holding members 162-9 to 16
2-16 are extracted. Step 4 if extracted
Then, the holding member used for production is changed from the above-mentioned component holding members 122-1 to 122-8 to the replacement component holding member 162.
Change to -9 to 162-16. That is, the control device 18
First, the component mounting head 121
Holding members 122-1 to 122-8 loaded in the
Empty loading portion 163 at the exchange station 161
The holding mechanism 164 described above is operated and stored in -1 to 163-8. After that, the component mounting head 121 is moved above the replacement component holding members 162-9 to 162-16, and the component mounting head 121 is moved to the replacement component holding member 16 by the component mounting head 121.
2-9 to 162-16 are loaded. As described above, in this embodiment, all the component holding members 122 including not only the defective component holding member 122 but also the normal component holding member 122 are included.
Is replaced with a replacement component holding member 162. Then, the mounting operation is started by the replacement component holding members 162-9 to 162-16.
【００２６】上述のように本実施形態によれば、例とし
た上記プログラムの実行中に部品保持部材１２２−８が
不良になったと仮定したとき、（１）部品保持部材１２
２−１〜１２２−８のすべてを返却し、（２）交換用部
品保持部材１６２−９〜１６２−１６を保持し、上記プ
ログラムに従い、（３）交換用部品保持部材１６２−９
〜１６２−１６を返却し、（４）交換用部品保持部材１
６２−１７〜１６２−２４を保持するというノズル交換
動作になる。このように、本実施形態によれば、ノズル
交換に要する動作回数は、４回となる。一方、従来で
は、部品保持部材１２２−８が不良になった時点で、
（１）部品保持部材１２２−８を返却し、（２）部品保
持部材１２２−８の代わりをなす例えば交換用部品保持
部材１６２−１６を保持させる。そして、交換用部品保
持部材１６２−１７〜１６２−２４への交換時には、ま
ず、（３）部品保持部材１２２−１〜７を返却し、
（４）交換用部品保持部材１６２−１６の返却を行い、
そして（５）交換用部品保持部材１６２−１７〜１６２
−２４を保持するというノズル交換動作になる。よって
従来では、ノズル交換に要する動作回数は、５回とな
る。このように、本実施形態によれば、従来に比べて、
ノズル交換に要する動作回数を減少することができ、生
産性の向上に寄与することができる。As described above, according to this embodiment, when it is assumed that the component holding member 122-8 becomes defective during the execution of the above-described program, (1) the component holding member 12
2-1 to 122-8 are all returned, (2) holding the replacement component holding members 162-9 to 162-16, and (3) replacing component holding member 162-9 according to the above program.
~ 162-16 are returned, and (4) Replacement component holding member 1
The nozzle replacement operation is to hold 62-17 to 162-24. Thus, according to this embodiment, the number of operations required for nozzle replacement is four. On the other hand, conventionally, when the component holding member 122-8 becomes defective,
(1) The component holding member 122-8 is returned, and (2) a replacement component holding member 162-16, which is a substitute for the component holding member 122-8, is held. Then, at the time of replacement with the replacement component holding members 162-17 to 162-24, first, (3) the component holding members 122-1 to 12-7 are returned,
(4) Return the replacement component holding member 162-16,
And (5) replacement component holding members 162-17 to 162
The nozzle replacement operation is to hold -24. Therefore, conventionally, the number of operations required for nozzle replacement is five. Thus, according to this embodiment,
The number of operations required for nozzle replacement can be reduced, which can contribute to improvement in productivity.
【００２７】一方、ステップ３にて、抽出不可と判断さ
れたときにはステップ５に進む。ステップ５では、不良
となった部品保持部材１２２−８の種類に類似する種類
にてなる等価交換用部品保持部材まで検索範囲を広げて
検索動作を行う。ここで、上記等価交換用部品保持部材
とは、上記交換用部品保持部材１６２に含まれる部材で
あり、不良の部品保持部材の種類に類似しかつ不良部品
保持部材が保持すべき電子部品１９２を保持可能な保持
部材である。以下に具体的に説明する。図３は、保持す
る部品に対する適性ノズルの選択を示した表であり、記
憶部１８２に記憶させることができる。吸着する電子部
品１９２は、その体積に応じて吸着に適切な部品保持部
材１２２が決まっており、操作者による選択、又は上記
プログラムにより図３の表に基づいて自動的に選択され
る。しかし、電子部品１９２の大きさによっては、２種
類以上の部品保持部材１２２にて吸着可能な場合があ
る。このようなときには、吸着可能な予備ノズル、つま
り上記等価交換用部品保持部材として、上記記憶部１８
２に記憶しておくことにより、吸着可能な部品保持部材
の本数を増やすことができる。即ち、上記等価交換用部
品保持部材を用いることで、ノズル交換の回数を減らす
ことができ、生産性を向上させることができる。On the other hand, if it is determined in step 3 that the extraction is impossible, the process proceeds to step 5. In step 5, the search operation is performed by expanding the search range to the equivalent replacement component holding member of a type similar to the defective component holding member 122-8. Here, the equivalent replacement component holding member is a member included in the replacement component holding member 162, and is an electronic component 192 similar to the type of the defective component holding member and to be held by the defective component holding member. It is a holding member capable of holding. This will be specifically described below. FIG. 3 is a table showing the selection of suitable nozzles for the held components, which can be stored in the storage unit 182. The electronic component 192 to be adsorbed has a component holding member 122 suitable for adsorption according to its volume, and is automatically selected by the operator or by the above program based on the table of FIG. However, depending on the size of the electronic component 192, the electronic component 192 may be able to be sucked by two or more types of component holding members 122. In such a case, the storage unit 18 is used as a spare nozzle capable of sucking, that is, as the equivalent replacement component holding member.
By storing it in No. 2, it is possible to increase the number of component holding members that can be sucked. That is, by using the equivalent replacement component holding member, it is possible to reduce the number of nozzle replacements and improve productivity.
【００２８】具体的に説明すると、図３に示すように、
体積１０〜６０ｃｍ３の電子部品１９２を吸着する場
合、上記等価交換用部品保持部材を使用しないときに
は、体積１０〜３０ｃｍ３の電子部品１９２は、ノズル
種類「Ｓ」の部品保持部材１２２にて、体積３０〜６０
ｃｍ３の電子部品１９２はノズル種類「Ｍ」の部品保持
部材１２２にて吸着する必要がある。よって、ノズル種
類「Ｓ」の部品保持部材１２２が部品装着ヘッド１２１
に装填されているとき、体積３０〜６０ｃｍ３の電子部
品１９２を保持するためには、部品保持部材１２２の交
換が必要となる。一方、上記等価交換用部品保持部材と
して、ノズル種類「Ｍ」の部品保持部材１２２を部品装
着ヘッド１２１に装填しておくことで、１０〜６０ｃｍ
３の電子部品１９２の全てを保持することが可能とな
り、ノズル交換が不要となり、生産性の向上を図ること
ができる。More specifically, as shown in FIG.
When adsorbing the electronic component 192 having a volume 10～60Cm 3, when not in use the equivalent replacement component holding member, an electronic component 192 having a volume 10 to 30 cm 3, at the component holding member 122 of the nozzle type "S", Volume 30-60
The electronic component 192 of cm 3 needs to be sucked by the component holding member 122 of the nozzle type “M”. Therefore, the component holding member 122 of the nozzle type “S” becomes the component mounting head 121.
In order to hold the electronic component 192 having a volume of 30 to 60 cm 3 when it is loaded in, the component holding member 122 needs to be replaced. On the other hand, by mounting the component holding member 122 of the nozzle type “M” on the component mounting head 121 as the equivalent replacement component holding member, 10 to 60 cm is obtained.
It becomes possible to hold all the three electronic components 192, and it is not necessary to replace the nozzle, and productivity can be improved.
【００２９】上述の例の場合、不良となった部品保持部
材１２２−８の種類は「Ｓ」であるので、種類「Ｍ」が
種類「Ｓ」に類似すると仮定したとき、上記ステップ５
では、上記主パターンに類似する類似副パターンが上記
交換ステーション１６１における交換用部品保持部材１
６２の配置内から検索される。上述のように、上記等価
交換用部品保持部材として交換用部品保持部材１６２−
１７〜１６２−２４が該当することから、上記検索で
は、交換用部品保持部材１６２−９〜１６２−２４内か
ら、上記主パターンに類似する類似副パターンが検索さ
れる。In the above example, since the type of the component holding member 122-8 that has become defective is "S", assuming that the type "M" is similar to the type "S", the above step 5
Then, a similar sub-pattern similar to the main pattern has a replacement part holding member 1 at the replacement station 161.
It is searched from within the arrangement of 62. As described above, the replacement component holding member 162-as the equivalent replacement component holding member.
Since 17 to 162-24 are applicable, in the above search, a similar sub pattern similar to the above main pattern is searched from within the replacement part holding members 162-9 to 162-24.
【００３０】次のステップ６では、上記類似副パターン
が抽出されたか否かが判断される。抽出された場合は、
ステップ７へ進み、基板生産に使用する、部品実装ヘッ
ド１２１における上記主パターンの部品保持部材１２２
から上記類似副パターンの交換用部品保持部材１６２に
交換する。具体的な交換方法は、上記ステップ４におけ
る場合と同様である。一方、上記ステップ６にて上記類
似副パターンが抽出されない場合には、上記不良部品保
持部材１２２を含む上記主パターンに類似する上記類似
副パターンも存在しないことになるので、不良部品保持
部材１２２のみを個別に交換することにより生産を継続
させる。In the next step 6, it is judged whether or not the similar sub-pattern has been extracted. If extracted,
Proceeding to step 7, the component holding member 122 of the main pattern in the component mounting head 121 used for board production.
To the replacement component holding member 162 having the similar sub-pattern. The specific replacement method is the same as that in step 4 above. On the other hand, when the similar sub pattern is not extracted in step 6, the similar sub pattern similar to the main pattern including the defective component holding member 122 also does not exist, so only the defective component holding member 122 is included. Production is continued by individually replacing
【００３１】上述の説明では、交換ステーション１６１
に装填されている交換用部品保持部材１６２−９〜１６
２−２４の配列状態は変更することなく、上記副パター
ン及び上記類似副パターンの検索を行った。よって、上
記ステップ６では、上記類似副パターンも抽出されない
場合が生じることもある。しかしながら、上記副パター
ン及び上記類似副パターンが抽出されない場合であって
も、交換ステーション１６１内で、一部の交換用部品保
持部材１６２の配置を変更することで、上記副パターン
及び上記類似副パターンが形成される場合もある。以下
に説明する各構成例は、この点に着目したものである。
つまり、上述したように制御装置１８１は、交換ステー
ション１６１に装填されている全ての交換用部品保持部
材１６２の種類及び配置位置を把握していることから、
上記副パターン及び上記類似副パターンが抽出されない
場合には、上記副パターン及び上記類似副パターンの少
なくとも一方を生成可能なように、交換用部品保持部材
１６２の配置の変更を演算することが可能である。In the above description, the exchange station 161.
Replacement member holding members 162-9 to 16 loaded in the
The subpattern and the similar subpattern were searched without changing the arrangement state of 2-24. Therefore, in the step 6, the similar sub-pattern may not be extracted in some cases. However, even if the sub-pattern and the similar sub-pattern are not extracted, by changing the arrangement of some of the replacement component holding members 162 in the exchange station 161, the sub-pattern and the similar sub-pattern are changed. May be formed. Each configuration example described below focuses on this point.
That is, as described above, the control device 181 knows the types and the arrangement positions of all the replacement component holding members 162 loaded in the replacement station 161,
When the sub-pattern and the similar sub-pattern are not extracted, it is possible to calculate the change of the arrangement of the replacement component holding member 162 so that at least one of the sub-pattern and the similar sub-pattern can be generated. is there.
【００３２】上記配置変更用の演算の結果、上記副パタ
ーン及び上記類似副パターンの少なくとも一方が生成さ
れたときには、制御装置１８１は、部品実装ヘッド１２
１及び上記保持機構１６４の動作制御を行い、部品実装
ヘッド１２１及び上記保持機構１６４を用いて交換用部
品保持部材１６２の配置換えを行う。該動作は、交換用
部品保持部材１６２の配置換えに部品実装ヘッド１２１
を利用することから、ある回路基板１９１への実装動作
が終了した後に行う。例えば部品保持部材１２２−８が
不良になった場合を例に採ると、上記実装動作の終了
後、部品実装ヘッド１２１の部品保持部材１２２−１〜
１２２−８の全てを、交換ステーション１６１の空の装
填部分１６３−１〜１６３−８へ返却する。次に制御装
置１８１の動作制御により、上記装填部分１６３−８に
存在する上記部品保持部材１２２−８、及び上記部品保
持部材１２２−８と同一であり正常であり装填部分１６
３−１６に存在する交換用部品保持部材１６２−１６を
部品実装ヘッド１２１に取り付ける。次に、制御装置１
８１の動作制御により、上記部品保持部材１２２−８
を、上記装填部分１６３−１６へ返却する。次に、制御
装置１８１の動作制御により、上記交換用部品保持部材
１６２−１６を上記装填部分１６３−８に装填する。こ
れにて両者の配置が変更される。このようにして、交換
ステーション１６１における交換用部品保持部材１６２
の配置を調整し、以後、上述したステップ１〜７の動作
を行う。従って、部品保持部材の無駄な交換回数を減ら
すことができ基板生産の効率を向上させることができ
る。When at least one of the sub-pattern and the similar sub-pattern is generated as a result of the operation for changing the arrangement, the control device 181 causes the mounting head 12 to mount.
1 and the holding mechanism 164 are controlled, and the replacement component holding member 162 is relocated using the component mounting head 121 and the holding mechanism 164. This operation is performed by changing the arrangement of the replacement component holding member 162 and mounting the component mounting head 121.
Is used after the mounting operation on a certain circuit board 191 is completed. For example, taking the case where the component holding member 122-8 becomes defective as an example, the component holding members 122-1 to 122-1 of the component mounting head 121 after the above mounting operation is completed.
All 122-8 are returned to the empty loading portions 163-1 to 163-8 of the exchange station 161. Next, by the operation control of the control device 181, the component holding member 122-8 existing in the loading portion 163-8 and the loading portion 16 which is the same as the component holding member 122-8 and is normal.
The replacement component holding member 162-16 existing in 3-16 is attached to the component mounting head 121. Next, the control device 1
By the operation control of 81, the component holding member 122-8
Is returned to the loading portion 163-16. Next, the replacement part holding member 162-16 is loaded into the loading portion 163-8 by the operation control of the control device 181. This changes the arrangement of both. In this way, the replacement component holding member 162 in the replacement station 161.
The arrangement is adjusted, and thereafter, the operations of steps 1 to 7 described above are performed. Therefore, it is possible to reduce the number of useless replacements of the component holding members and improve the efficiency of board production.
【００３３】上述した、交換ステーション１６１におけ
る交換用部品保持部材１６２の配置換え動作では、上記
部品実装ヘッド１２１を利用して上記配置換えを行った
が、該形態に限定されるものではない。例えば図８に示
すように、交換ステーション１６１に保持部材交換装置
１６５をさらに備えた第２交換ステーション１６６を設
け、制御装置１８１にて保持部材交換装置１６５の動作
制御を行い上記配置換えを行うようにすることもでき
る。上記保持部材交換装置１６５は、部材保持部１６５
−１と、該部材保持部１６５−１が取り付けられ部材保
持部１６５−１をＹ方向に移動させるＹ駆動部１６５−
３と、該Ｙ駆動部１６５−３が取り付けられＹ駆動部１
６５−３をＸ方向に移動させるＸ駆動部１６５−２とを
有する。上記Ｘ駆動部１６５−２及びＹ駆動部１６５−
３は、例えばボールネジ機構を有し、制御装置１８１の
制御にて、部材保持部１６５−１をＸ，Ｙ方向へ自在に
移動する。In the above-described repositioning operation of the replacement component holding member 162 in the replacement station 161, the above-mentioned relocation is performed using the component mounting head 121, but the present invention is not limited to this form. For example, as shown in FIG. 8, the exchange station 161 is provided with a second exchange station 166 further provided with a holding member exchange device 165, and the controller 181 controls the operation of the holding member exchange device 165 to perform the above-mentioned rearrangement. You can also The holding member exchange device 165 has a member holding portion 165.
-1, and a Y drive unit 165 to which the member holding unit 165-1 is attached and which moves the member holding unit 165-1 in the Y direction.
3 and the Y drive unit 165-3 are attached to the Y drive unit 1
65-3 for moving the 65-3 in the X direction. The X drive section 165-2 and the Y drive section 165-
3 has, for example, a ball screw mechanism, and is free to move the member holding section 165-1 in the X and Y directions under the control of the control device 181.
【００３４】交換ステーション１６１に上記保持部材交
換装置１６５をさらに備えることで、制御装置１８１の
動作制御により、部品実装ヘッド１２１、及び保持部材
交換装置１６５をそれぞれ独立して動作させることがで
きる。上記不良部品保持部材１２２が発生したときに
は、部品実装ヘッド１２１に存在する不良部品保持部
材、例えば部品保持部材１２２−８を、交換ステーショ
ン１６１の、空の装填部分１６３−８に返却し、正常な
ノズルに相当し装填部分１６３−１６に存在する交換用
部品保持部材１６２−１６を部品実装ヘッド１２１に取
り付け、生産を行う。一方、該生産が行われている間
に、保持部材交換装置１６５は、上記装填部分１６３−
８に装填した不良部品保持部材１６２−８を、上記保持
部材交換装置１６５の部材保持部１６５−１にて保持し
て、装填部分１６３−１６へ移動する。該移動後、部品
実装ヘッド１２１は、上記交換用部品保持部材１６２−
１６を装填部分１６３−８に装填する。そして、装填部
分１６３−１７〜１６３−２４に装填されている交換用
部品保持部材１６２−１７〜１６２−２４を使用すると
き、部品実装ヘッド１２１に取り付けられている部品保
持部材１２２−１〜１２２−７は、装填部分１６３−１
〜１６３−７に返却される。以上の動作により部品保持
部材１２２−１〜１２２−８を全て正常な交換用部品保
持部材１６２−１７〜１６２−２４に交換することによ
り、上述の、部品実装ヘッド１２１を利用して保持部材
の交換を行う場合に比べて、回路基板１９１の生産が終
了した時点での保持部材の交換動作を削減することがで
きる。よって、部品実装ヘッド１２１の動作終了を待つ
必要がないことから、さらに生産効率を上げることがで
きる。By further providing the holding member exchanging device 165 in the exchanging station 161, the component mounting head 121 and the holding member exchanging device 165 can be independently operated by the operation control of the control device 181. When the defective component holding member 122 is generated, the defective component holding member existing in the component mounting head 121, for example, the component holding member 122-8 is returned to the empty loading portion 163-8 of the replacement station 161, and the normal mounting portion 163-8 is returned. The replacement component holding member 162-16 corresponding to the nozzle and existing in the loading portion 163-16 is attached to the component mounting head 121, and production is performed. On the other hand, while the production is being performed, the holding member exchanging device 165 is operated by the loading portion 163-.
The defective component holding member 162-8 loaded in No. 8 is held by the member holding portion 165-1 of the holding member exchanging device 165 and moved to the loading portion 163-16. After the movement, the component mounting head 121 has the replacement component holding member 162-.
16 is loaded into loading portion 163-8. Then, when the replacement component holding members 162-17 to 162-24 loaded in the loading portions 163-17 to 163-24 are used, the component holding members 122-1 to 122 attached to the component mounting head 121. -7 is a loading portion 163-1
~ Returned to 163-7. By exchanging all the component holding members 122-1 to 122-8 with the normal replacement component holding members 162-17 to 162-24 by the above operation, the above-described holding member of the holding member is utilized. It is possible to reduce the operation of exchanging the holding member at the time when the production of the circuit board 191 is finished, as compared with the case of exchanging. Therefore, it is not necessary to wait for the end of the operation of the component mounting head 121, so that the production efficiency can be further improved.
【００３５】さらに又、図８に示す第２交換ステーショ
ン１６６では、交換ステーション１６１内の交換用部品
保持部材１６２の配置換えを行う装置として、上記保持
部材交換装置１６５を設けたが、上記配置換えを行う方
法として、さらに図９に示す第３交換ステーション１６
７の形態を採ることもできる。該第３交換ステーション
１６７は、上記交換用部品保持部材１６２を一列状に配
列しかつ上記部品実装ヘッド１２１における上記主パタ
ーンを構成する上記部品保持部材１２２−１〜１２２−
８との交換場所である交換部分１６７−１と、列状に配
置された上記交換用部品保持部材１６２を移動させて、
上記交換部分１６７−１にて上記副パターンを形成する
保持部材移動装置１６７−２と、を有する。尚、上記交
換部分１６７−１は、上記保持機構１６４を有する。図
９に示す例では、上記保持部材移動装置１６７−２によ
る交換用部品保持部材１６２の移動経路を楕円状とし、
直線部分が上記交換部分１６７−１に該当する形態を採
っている。しかしながら上記移動経路は、上記楕円形に
限定されるものではなく、例えば上記交換部分１６７−
１を含む直線状であってもよい。尚、上記第３交換ステ
ーション１６７では、装填部分１６３−１〜１６３−８
は交換用部品保持部材が存在しない空きの状態である。
又、交換用部品保持部材１６２−９〜１６２−２６のノ
ズル種類は全て「Ｓ」としているが、勿論これに限定す
るものではない。又、上述の各例と同様に、制御装置１
８１は、交換用部品保持部材１６２−９〜１６２−２６
の配列状態を把握している。Further, in the second replacement station 166 shown in FIG. 8, the holding member replacement device 165 is provided as a device for carrying out the replacement of the replacement component holding member 162 in the replacement station 161, but the above replacement The third exchange station 16 shown in FIG.
It is also possible to take the form of 7. The third replacement station 167 has the replacement component holding members 162 arranged in a line and constitutes the main pattern of the component mounting head 121. The component holding members 122-1 to 122-
8 and the replacement part 167-1 which is the replacement place and the replacement part holding member 162 arranged in a row are moved,
And a holding member moving device 167-2 that forms the sub-pattern at the exchange portion 167-1. The replacement portion 167-1 has the holding mechanism 164. In the example shown in FIG. 9, the movement path of the replacement component holding member 162 by the holding member moving device 167-2 is elliptical,
The straight line portion corresponds to the exchange portion 167-1. However, the movement path is not limited to the elliptical shape, and for example, the exchange portion 167-
It may be a straight line including 1. In the third exchange station 167, the loading parts 163-1 to 163-8
Is a vacant state in which there is no replacement component holding member.
Further, the nozzle types of the replacement component holding members 162-9 to 162-26 are all set to "S", but of course the present invention is not limited to this. Further, similarly to the above-described examples, the control device 1
81 is a replacement component holding member 162-9 to 162-26.
Know the array status of.
【００３６】上記第３交換ステーション１６７によれ
ば、上述の例と同様に、部品実装ヘッド１２１の部品保
持部材１２２−８が不良になった場合、まず、部品実装
ヘッド１２１に取りつけられている部品保持部材１２２
−１〜１２２−８を第３交換ステーション１６７の装填
部分１６３−１〜１６３−８に返却する。そして、保持
部材移動装置１６７−２を動作させ、列状に配置された
上記交換用部品保持部材１６２−９〜１６２−２６を、
例えば反時計方向に回転させる。該回転の移動量は、上
記副パターン及び上記類似副パターンの少なくとも一方
が上記交換部分１６７−１にて形成されるような移動量
である。ここでは、正常な交換用部品保持部材１６２−
２６が交換部分１６７−１における装填部分１６３−１
に位置するように回転させる。これにて不良部品保持部
材１２２−８は、交換部分１６７−１から外れ、装填部
分１６３−９に位置する。よって、交換部分１６７−１
には、正常な保持部材が配列されることから、交換部分
１６７−１に配列されている交換用部品保持部材１６２
−２６、及び部品保持部材１２２−１〜１２２−７の８
本が部品実装ヘッド１２１に装填される。According to the third exchange station 167, when the component holding member 122-8 of the component mounting head 121 becomes defective as in the above example, first, the component mounted on the component mounting head 121. Holding member 122
-1 to 122-8 are returned to the loading parts 163-1 to 163-8 of the third exchange station 167. Then, the holding member moving device 167-2 is operated, and the replacement component holding members 162-9 to 162-26 arranged in a row are
For example, it is rotated counterclockwise. The amount of rotation movement is such that at least one of the sub-pattern and the similar sub-pattern is formed in the exchange portion 167-1. Here, a normal replacement part holding member 162-
26 is a loading portion 163-1 in the exchange portion 167-1.
Rotate to position. The defective component holding member 122-8 is now separated from the replacement portion 167-1 and is located at the loading portion 163-9. Therefore, the replacement part 167-1
Since the normal holding members are arranged in this area, the replacement component holding member 162 arranged in the replacement portion 167-1.
-26 and 8 of component holding members 122-1 to 122-7
The book is loaded into the component mounting head 121.
【００３７】このように上記第３交換ステーション１６
７では、図８に示す第２交換ステーション１６６の構成
と比較すると、交換ステーション１６１の上方にて移動
する保持部材交換装置１６５を省略することができるこ
とから、よりコンパクトな装置構成にて交換ステーショ
ン１６１内の交換用部品保持部材１６２の配置換えを行
うことができる。Thus, the third exchange station 16
In FIG. 7, compared with the configuration of the second exchange station 166 shown in FIG. 8, since the holding member exchange device 165 that moves above the exchange station 161 can be omitted, the exchange station 161 has a more compact device configuration. The arrangement of the replacement component holding member 162 can be changed.
【００３８】さらに又、上記第３交換ステーション１６
７に上記保持部材交換装置１６５を追加した構成を採る
こともできる。該構成によれば、上記移動経路に配列さ
れる交換用部品保持部材１６２の配列順を、保持部材交
換装置１６５を使用して変更することができる。よっ
て、図８に示す第２交換ステーション１６６が奏する、
部品実装ヘッド１２１の動作終了を待つ必要がなく、さ
らに生産効率を上げることができるという効果を得るこ
とができる。Furthermore, the third exchange station 16 is also provided.
It is also possible to adopt a configuration in which the holding member exchanging device 165 is added to item 7. With this configuration, the arrangement order of the replacement component holding members 162 arranged in the movement path can be changed by using the holding member changing device 165. Therefore, the second exchange station 166 shown in FIG.
It is not necessary to wait for the end of the operation of the component mounting head 121, and it is possible to obtain the effect of further increasing the production efficiency.
【００３９】尚、上述した実施形態では、上記主パター
ンにて構成される部品保持部材１２２−１〜１２２−８
の全てを一度に交換用部品保持部材１６２と交換した。
しかしながら、該形態に限定されるものではなく、不良
部品保持部材、例えば不良部品保持部材１２２−８を含
む複数の部品保持部材、例えば部品保持部材１２２−５
〜１２２−８における種類及び配列に対応する配置が交
換ステーション１６１内の交換用部品保持部材１６２の
配置に存在するときには、上記部品保持部材１２２−５
〜１２２−８のみを交換してもよい。尚、上述の説明で
は、不良ノズルの交換時期を、一つの基板の生産が終了
した後、同種の次の基板の生産開始までの間としました
が、これに限定されることなく、例えば不良ノズルが発
生した時点で交換を行うこともできる。Incidentally, in the above-mentioned embodiment, the component holding members 122-1 to 122-8 constituted by the above main pattern.
All of them were replaced with the replacement component holding members 162 at once.
However, the present invention is not limited to this form, and a plurality of component holding members including the defective component holding member, for example, the defective component holding member 122-8, for example, the component holding member 122-5.
~ 122-8 when the arrangement corresponding to the type and arrangement in the arrangement of the replacement component holding member 162 in the exchange station 161, the component holding member 122-5.
Only ~ 122-8 may be replaced. In the above description, the time to replace the defective nozzle is assumed to be between the end of production of one board and the start of production of the next board of the same type. It is also possible to replace it at the time of occurrence.
【００４０】[0040]
【発明の効果】以上詳述したように本発明の第１態様に
おける電子部品実装装置、及び第２態様の電子部品実装
方法によれば、部品実装ヘッド、交換ステーション、及
び制御装置を備え、部品実装ヘッドに装填されている部
品保持部材に関する主パターンに一致する副パターンが
交換ステーションに備わる交換用部品保持部材の配置に
存在するか否かを判断するようにした。よって、上記副
パターンが存在すると判断されたときであって、不良と
なった部品保持部材のみならず正常な部品保持部材も含
めて上記主パターンにてなる部品保持部材の全てを上記
副パターンにてなる交換用部品保持部材に交換した方
が、不良部品保持部材のみを交換する場合に比べて交換
回数が減るときには、上記主パターンにてなる部品保持
部材の全てを上記副パターンにてなる交換用部品保持部
材に交換することができる。よって、該交換動作を行っ
たときには、従来に比べて回路基板の生産性を向上させ
ることができる。As described above in detail, according to the electronic component mounting apparatus of the first aspect of the present invention and the electronic component mounting method of the second aspect, the component mounting head, the exchange station, and the control device are provided. It is determined whether or not there is a sub pattern corresponding to the main pattern of the component holding member loaded on the mounting head in the arrangement of the replacement component holding member provided in the exchange station. Therefore, when it is determined that the sub-pattern exists, all of the component holding members including the main pattern including the defective component holding member as well as the normal component holding member are set to the sub-pattern. When the number of replacements is smaller when the replacement part holding member for replacement is replaced with the defective part holding member only, all of the part holding members for the main pattern are replaced by the sub pattern. It can be replaced with a component holding member. Therefore, when the replacement operation is performed, the productivity of the circuit board can be improved as compared with the conventional case.
【００４１】又、上記第１態様では、上記交換ステーシ
ョンに配置される交換用部品保持部材の配列について部
品実装ヘッドを使用して変更することで、上記副パター
ンを形成できる場合も生じる。このようにして副パター
ンを形成できた場合には、上述の生産性の向上を図るこ
とができる。In the first aspect, the sub-pattern may be formed by changing the arrangement of the replacement component holding members arranged in the exchange station using the component mounting head. When the sub-pattern can be formed in this way, the productivity can be improved as described above.
【００４２】又、上記第１態様では、上記交換ステーシ
ョンに配置される交換用部品保持部材の配列について、
新たに設けた保持部材交換装置を使用して変更すること
で、上記副パターンを形成できる場合も生じる。このよ
うにして副パターンを形成できた場合には、上述の生産
性の向上を図ることができるとともに、部品実装ヘッド
を使用して変更する場合に比べて実装動作と並行して交
換用部品保持部材の配置換えが行える。よって、さらに
生産性の向上を図ることができる。In the first aspect, the arrangement of the replacement component holding members arranged at the replacement station is as follows.
In some cases, the sub-pattern can be formed by using a newly provided holding member exchanging device. When the sub-pattern can be formed in this manner, the productivity can be improved as described above, and the replacement component holding can be performed in parallel with the mounting operation as compared with the case of changing the component mounting head. The arrangement of members can be changed. Therefore, the productivity can be further improved.
【００４３】又、上記第１態様では、交換ステーション
において、交換部分と保持部材移動装置とを備えた形態
を採ることで、上記保持部材交換装置を設けた場合に比
べて、コンパクトな装置構成にて交換用部品保持部材の
配置換えを行うことができる。Further, in the first aspect, the exchange station is provided with the exchange part and the holding member moving device, so that the device configuration is compact as compared with the case where the holding member exchange device is provided. The arrangement of the replacement component holding member can be changed.
【００４４】さらに又、上記副パターンが上記交換ステ
ーションに存在しないとき、部品保持部材の種類に類似
しかつ電子部品を保持可能な等価交換用部品保持部材を
も含めて主パターンに類似する類似副パターンの有無を
検索することで、検索範囲が広がる。よって、さらに生
産性の向上を図ることができる。Furthermore, when the sub-pattern does not exist in the exchange station, the similar sub-pattern is similar to the type of the component holding member and is similar to the main pattern including an equivalent replacement component holding member capable of holding an electronic component. The search range is expanded by searching for the presence or absence of a pattern. Therefore, the productivity can be further improved.
【００４５】又、上記第２態様では、上記交換ステーシ
ョンに配置される交換用部品保持部材の配置内に、上記
副パターン及び上記類似副パターンが存在しないときに
は、これらが形成可能なように交換用部品保持部材の配
置を変更してもよい。該変更により、上述の生産性の向
上を図ることができる。In the second aspect, when the sub-pattern and the similar sub-pattern do not exist in the arrangement of the replacement part holding member arranged in the replacement station, the replacement pattern is formed so that they can be formed. The arrangement of the component holding member may be changed. By the change, the productivity can be improved as described above.
【図１】 本発明の実施形態における電子部品実装装置
の斜視図である。FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.
【図２】 図１に示す電子部品実装装置にて実行される
電子部品実装方法における動作を表すフローチャートで
ある。FIG. 2 is a flowchart showing an operation in an electronic component mounting method executed by the electronic component mounting apparatus shown in FIG.
【図３】 図１に示す電子部品実装装置に格納され、等
価交換用部品保持部材の検索に使用される情報を説明す
るための図である。FIG. 3 is a diagram for explaining information stored in the electronic component mounting apparatus shown in FIG. 1 and used for searching for an equivalent replacement component holding member.
【図４】 図１に示す電子部品実装装置に備わる交換ス
テーションの構造を説明するための図である。FIG. 4 is a diagram for explaining a structure of an exchange station included in the electronic component mounting apparatus shown in FIG.
【図５】 図１に示す電子部品実装装置に備わる交換ス
テーションにおける装填部分の配列状態を示す図であ
る。5 is a diagram showing an arrangement state of loading parts in an exchange station provided in the electronic component mounting apparatus shown in FIG.
【図６】 図１に示す電子部品実装装置に備わる交換ス
テーションの構造を説明するための図である。6 is a diagram for explaining the structure of an exchange station included in the electronic component mounting apparatus shown in FIG.
【図７】 図１に示す電子部品実装装置に備わる交換ス
テーションに備わる交換用部品保持部材の配置を説明す
るための図である。7 is a diagram for explaining the arrangement of replacement component holding members provided in the replacement station provided in the electronic component mounting apparatus shown in FIG.
【図８】 図１に示す電子部品実装装置に備わる交換ス
テーションの変形例を示す斜視図である。8 is a perspective view showing a modified example of the exchange station provided in the electronic component mounting apparatus shown in FIG.
【図９】 図１に示す電子部品実装装置に備わる交換ス
テーションの別の変形例を示す斜視図である。9 is a perspective view showing another modification of the exchange station included in the electronic component mounting apparatus shown in FIG.
【図１０】 従来の電子部品実装装置の斜視図である。FIG. 10 is a perspective view of a conventional electronic component mounting apparatus.
【図１１】 図１０に示す電子部品実装装置に備わるノ
ズル交換部におけるノズルの配置状態を説明するための
図である。FIG. 11 is a diagram for explaining a nozzle arrangement state in a nozzle exchanging unit included in the electronic component mounting apparatus shown in FIG.
１２１…部品実装ヘッド、１２２…部品保持部材、１６
２…交換用部品保持部材、１６１…交換ステーション、
１６５…保持部材交換装置、１６７−１…交換部分、１
６７−２…保持部材移動装置、１８１…制御装置、１９
１…回路基板、１９２…電子部品。121 ... Component mounting head, 122 ... Component holding member, 16
2 ... Replacement part holding member, 161 ... Replacement station,
165 ... Holding member exchange device, 167-1 ... Exchange part, 1
67-2 ... Holding member moving device, 181 ... Control device, 19
1 ... Circuit board, 192 ... Electronic component.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 矢澤 隆 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 内山 宏 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 吉田 典晃 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E313 AA01 AA11 AA23 CC03 EE01 EE24 EE34 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Takashi Yazawa 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. (72) Inventor Hiroshi Uchiyama 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. (72) Inventor Noriaki Yoshida 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd. F-term (reference) 5E313 AA01 AA11 AA23 CC03 EE01 EE24 EE34
Claims (8)
能に装填し該部品保持部材にて保持した電子部品（１９
２）を回路基板（１９１）へ実装する部品実装ヘッド
（１２１）と、 上記部品保持部材と交換可能であって上記電子部品を保
持可能でかつ上記部品実装ヘッドにおける上記部品保持
部材の数を超える数の交換用部品保持部材（１６２）を
有する交換ステーション（１６１）と、 上記部品実装ヘッドの動作制御を行い、かつ上記部品実
装ヘッドに装填されている上記部品保持部材の種類及び
配列に関する主パターンに一致する副パターンが上記交
換ステーションにおける上記交換用部品保持部材の配置
に含まれるか否かを検索し、該検索結果に基づいて上記
部品実装ヘッドに装填されている上記主パターンの上記
部品保持部材を上記副パターンの上記交換用部品保持部
材に交換可能か否かを判断する制御装置（１８１）と、
を備えたことを特徴とする電子部品実装装置。1. An electronic component (19) in which a plurality of component holding members (122) are detachably loaded and held by the component holding members.
The component mounting head (121) for mounting 2) on the circuit board (191) is replaceable with the component holding member, capable of holding the electronic component, and exceeding the number of the component holding members in the component mounting head. A replacement station (161) having a number of replacement component holding members (162), and a main pattern for controlling the operation of the component mounting head and for the type and arrangement of the component holding members loaded in the component mounting head. Is searched for whether or not a sub-pattern matching the above is included in the arrangement of the replacement component holding member in the exchange station, and based on the search result, the component holding of the main pattern loaded in the component mounting head is held. A control device (181) for determining whether or not the member can be replaced with the replacement part holding member of the sub-pattern;
An electronic component mounting apparatus comprising:
品保持部材（１２２−８）、及び該不良部品保持部材と
交換可能な交換用部品保持部材（１６２−１６）の、上
記交換ステーション内における配置換えを上記部品実装
ヘッドに行わせる動作制御を行う、請求項１記載の電子
部品実装装置。2. The control device comprises: a defective component holding member (122-8) having a defect, and a replacement component holding member (162-16) replaceable with the defective component holding member, in the exchange station. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus controls the operation of causing the component mounting head to perform the rearrangement of the position.
用部品保持部材の配置換えを行う保持部材交換装置（１
６５）をさらに備え、 上記制御装置は、不具合の生じた不良部品保持部材（１
２２−８）、及び該不良部品保持部材と交換可能な交換
用部品保持部材（１６２−１６）の、上記交換ステーシ
ョン内における配置換えを上記保持部材交換装置に行わ
せる動作制御を行う、請求項１記載の電子部品実装装
置。3. A holding member exchanging device (1) for relocating the replacement component holding member provided in the exchange station.
65) is further provided, and the control device includes the defective component holding member (1
22-8), and the operation control for causing the holding member exchanging device to reposition the replacement component holding member (162-16) that can be replaced with the defective component holding member in the exchange station. 1. The electronic component mounting apparatus according to 1.
品保持部材を一列状に配列しかつ上記部品実装ヘッドに
おける上記主パターンを構成する上記部品保持部材との
交換場所である交換部分（１６７−１）と、列状に配置
された上記交換用部品保持部材を移動させて、上記交換
部分にて上記副パターンを形成する保持部材移動装置
（１６７−２）と、を有する、請求項１記載の電子部品
実装装置。4. The replacement station (167-1), wherein the replacement station is a replacement place for arranging the replacement component holding members in a line and with the component holding member forming the main pattern of the component mounting head. ) And a holding member moving device (167-2) that moves the replacement component holding members arranged in rows to form the sub-pattern at the replacement portion. Electronic component mounting equipment.
する上記副パターンが上記交換ステーションに存在しな
いとき、上記制御装置は、上記部品実装ヘッドに装填さ
れている上記部品保持部材の種類に類似しかつ上記電子
部品を保持可能な、上記交換用部品保持部材に含まれる
等価交換用部品保持部材（１６２−１７〜１６２−２
４）をも含めて上記主パターンに類似する類似副パター
ンの有無を検索する、請求項１記載の電子部品実装装
置。5. As a result of the search, when the sub-pattern matching the main pattern is not present in the exchange station, the controller is similar to the type of the component holding member loaded in the component mounting head. And an equivalent replacement component holding member (162-17 to 162-2) included in the replacement component holding member and capable of holding the electronic component.
The electronic component mounting apparatus according to claim 1, wherein the presence / absence of a similar sub-pattern similar to the main pattern including 4) is searched.
部品実装ヘッド（１２１）によって上記部品保持部材で
保持した電子部品（１９２）を回路基板（１９１）へ実
装する電子部品実装方法であって、 上記部品保持部材が不良となり交換を要するとき、該不
良部品保持部材のみならず、上記不良部品保持部材以外
の正常部品保持部材をも交換の対象とし、上記部品実装
ヘッドにおける部品保持部材の交換回数が最小になるよ
うに、上記部品実装ヘッドにおける部品保持部材の種類
及び配列に関する主パターンに一致する交換用部品保持
部材（１６２）の種類及び配列に関する副パターンを交
換ステーション（１６１）に配置されている上記交換用
部品保持部材から検索し、一致する配置が確認されたと
きには、上記部品実装ヘッドにおける上記主パターンに
て構成される上記部品保持部材を上記副パターンにて構
成される上記交換用部品保持部材に入れ換えて電子部品
実装を行う、ことを特徴とする電子部品実装方法。6. An electronic component mounting method for mounting an electronic component (192) held by the component holding member on a circuit board (191) by a component mounting head (121) having a plurality of component holding members (122). When the component holding member becomes defective and needs to be replaced, not only the defective component holding member but also the normal component holding members other than the defective component holding member are targeted for replacement, and the component holding member in the component mounting head is replaced. In order to minimize the number of times, a sub-pattern regarding the type and arrangement of the replacement component holding member (162) that matches the main pattern regarding the type and arrangement of the component holding members in the component mounting head is arranged in the exchange station (161). When a matching arrangement is found by searching from the replacement component holding member, the component mounting head The component holding member configured by serial main pattern performing electronic component mounting interchanged with the replacement part holding member made by the sub-pattern, the electronic component mounting method characterized by.
保持部材に不良が生じたとき、上記副パターンの検索を
行う前に、上記副パターンを形成するように上記交換用
部品保持部材の配置換えを行う、請求項６記載の電子部
品実装方法。7. When the replacement part holding member of the replacement station has a defect, the replacement part holding member is rearranged so as to form the sub-pattern before searching the sub-pattern. The electronic component mounting method according to claim 6, which is performed.
する上記副パターンが上記交換ステーションに存在しな
いとき、上記部品実装ヘッドに装填されている上記部品
保持部材の種類に類似しかつ上記電子部品を保持可能
な、上記交換用部品保持部材に含まれる等価交換用部品
保持部材（１６２−１７〜１６２−２４）をも含めて上
記主パターン若しくは上記主パターンに類似する類似副
パターンの有無を検索する、請求項６又は７記載の電子
部品実装方法。8. As a result of the search, when the sub-pattern that matches the main pattern does not exist in the exchange station, it is similar to the type of the component holding member loaded in the component mounting head and the electronic component. Is searched for the presence or absence of the main pattern or a similar sub-pattern similar to the main pattern including the equivalent replacement part holding members (162-17 to 162-24) included in the replacement part holding member. The electronic component mounting method according to claim 6 or 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002043258A JP3973447B2 (en) | 2002-02-20 | 2002-02-20 | Electronic component mounting apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002043258A JP3973447B2 (en) | 2002-02-20 | 2002-02-20 | Electronic component mounting apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003243889A true JP2003243889A (en) | 2003-08-29 |
| JP3973447B2 JP3973447B2 (en) | 2007-09-12 |
Family
ID=27783106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002043258A Expired - Fee Related JP3973447B2 (en) | 2002-02-20 | 2002-02-20 | Electronic component mounting apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3973447B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027233A (en) * | 2005-07-13 | 2007-02-01 | Juki Corp | Surface-mounting apparatus and nozzle replacement platform therefor |
| KR101180915B1 (en) * | 2007-10-11 | 2012-09-07 | 삼성테크윈 주식회사 | Chip mounter and chip mounting method using the same |
| WO2014196002A1 (en) * | 2013-06-03 | 2014-12-11 | 富士機械製造株式会社 | Nozzle management system |
| JP2017005068A (en) * | 2015-06-09 | 2017-01-05 | 富士機械製造株式会社 | Component mounting machine |
| KR20170077571A (en) * | 2015-12-28 | 2017-07-06 | 한화테크윈 주식회사 | A method for a nozzle scheduling of chip mounter |
-
2002
- 2002-02-20 JP JP2002043258A patent/JP3973447B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027233A (en) * | 2005-07-13 | 2007-02-01 | Juki Corp | Surface-mounting apparatus and nozzle replacement platform therefor |
| JP4664762B2 (en) * | 2005-07-13 | 2011-04-06 | Ｊｕｋｉ株式会社 | Nozzle exchange table for surface mounting device and surface mounting device |
| KR101180915B1 (en) * | 2007-10-11 | 2012-09-07 | 삼성테크윈 주식회사 | Chip mounter and chip mounting method using the same |
| WO2014196002A1 (en) * | 2013-06-03 | 2014-12-11 | 富士機械製造株式会社 | Nozzle management system |
| CN105265036A (en) * | 2013-06-03 | 2016-01-20 | 富士机械制造株式会社 | Nozzle management system |
| JPWO2014196002A1 (en) * | 2013-06-03 | 2017-02-23 | 富士機械製造株式会社 | Nozzle management system |
| JP2017005068A (en) * | 2015-06-09 | 2017-01-05 | 富士機械製造株式会社 | Component mounting machine |
| KR20170077571A (en) * | 2015-12-28 | 2017-07-06 | 한화테크윈 주식회사 | A method for a nozzle scheduling of chip mounter |
| KR102395591B1 (en) * | 2015-12-28 | 2022-05-06 | 한화정밀기계 주식회사 | A method for a nozzle scheduling of chip mounter |
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|---|---|
| JP3973447B2 (en) | 2007-09-12 |
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