JP2003158354A - Mount inspection method of wiring board - Google Patents
Mount inspection method of wiring boardInfo
- Publication number
- JP2003158354A JP2003158354A JP2001356253A JP2001356253A JP2003158354A JP 2003158354 A JP2003158354 A JP 2003158354A JP 2001356253 A JP2001356253 A JP 2001356253A JP 2001356253 A JP2001356253 A JP 2001356253A JP 2003158354 A JP2003158354 A JP 2003158354A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electrode terminal
- liquid crystal
- electrode terminals
- dummy electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電極端子を有する
一方の配線基板と電極端子を有する他方の配線基板との
実装状態を検査する配線基板の実装検査方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board mounting inspection method for inspecting the mounting state of one wiring board having electrode terminals and the other wiring board having electrode terminals.
【0002】[0002]
【従来の技術】従来、電子機器一般の回路基板と回路基
板との接続や液晶表示装置を製造する際の液晶表示パネ
ルのモジュール化工程において、一方の配線基板に設け
られた電極端子と他方の配線基板に設けられた電極端子
との両電極端子の接続状態は、その電子機器の信頼性を
確保する上でも電極端子のファインピッチ化が急速に進
んでいることからも従来から重要な課題となっている。
特に、液晶表示装置においては、電極端子と電極端子と
の導通不良が表示精度に大きく影響するため、高精度且
つ簡単な導通検査が求められている。以下に電子機器の
一例として、液晶表示装置を説明する。2. Description of the Related Art Conventionally, in the process of connecting circuit boards of general electronic equipment to circuit boards or in the process of modularizing a liquid crystal display panel when manufacturing a liquid crystal display device, electrode terminals provided on one wiring board and other The connection state of both electrode terminals with the electrode terminals provided on the wiring board is an important issue from the past because the fine pitch of the electrode terminals is rapidly advancing in order to secure the reliability of the electronic device. Has become.
In particular, in a liquid crystal display device, a poor conduction between electrode terminals greatly affects display accuracy, and therefore a highly accurate and simple continuity test is required. A liquid crystal display device will be described below as an example of the electronic apparatus.
【0003】液晶表示装置の製造においては、液晶を狭
持するいわゆるセル工程に続くモジュール化工程におい
て、液晶パネルに対してこれを駆動するための半導体素
子が実装されるととともに、液晶パネルの外周に半導体
素子に伝送信号又は電源を供給するプリント配線基板及
びフレキシブル配線基板が実装される。In the manufacture of a liquid crystal display device, a semiconductor element for driving the liquid crystal panel is mounted on a liquid crystal panel in a modularization process following a so-called cell process for sandwiching the liquid crystal, and the outer periphery of the liquid crystal panel is mounted. A printed wiring board and a flexible wiring board for supplying a transmission signal or power to the semiconductor element are mounted on the semiconductor device.
【0004】これらの配線基板の電気的接続方法として
は、例えば、ゴムコネクション法、ヒートシール法、異
方性導電フィルム法、TAB(tape automated bondin
g)法、COG(chip on glass)法等の提案がされてい
るが、今日では、モジュール化工程の自動化およびプロ
セススループットの観点からTAB法とCOG法が主流
となっている。TAB法は、液晶セルとプリント配線基
板とを、ドライバLSIを搭載したTCP(tape carri
er package)といわれるフレキシブル配線基板を利用し
て接続する方法である。なお、COG法は、液晶層を挟
持する一対の基板の一方の基板に直接駆動用ドライバ素
子を搭載する方法である。As a method for electrically connecting these wiring boards, for example, a rubber connection method, a heat sealing method, an anisotropic conductive film method, and a TAB (tape automated bondin) method are used.
Although the g) method, the COG (chip on glass) method and the like have been proposed, the TAB method and the COG method are predominant in use today from the viewpoint of automation of the modularization process and process throughput. In the TAB method, a liquid crystal cell and a printed wiring board are mounted on a TCP (tape carri) mounted with a driver LSI.
er package) is a method of connecting using a flexible wiring board. Note that the COG method is a method in which a driver element for driving is directly mounted on one of a pair of substrates sandwiching a liquid crystal layer.
【0005】図7は、TAB法による液晶パネルLの各
配線基板131a,120,110の接続構成図であ
る。液晶パネルLは、一対のガラス基板131a,13
1bと、一対のガラス基板131a,131bの間に挟
持される液晶層とを備え、一方のガラス基板131aの
外周縁部にはフレキシブル配線基板120を介してプリ
ント配線基板110が配されている。FIG. 7 is a connection configuration diagram of each wiring board 131a, 120, 110 of the liquid crystal panel L by the TAB method. The liquid crystal panel L includes a pair of glass substrates 131a and 13a.
1b and a liquid crystal layer sandwiched between a pair of glass substrates 131a and 131b, and a printed wiring board 110 is arranged on the outer peripheral edge of one glass substrate 131a via a flexible wiring board 120.
【0006】プリント配線基板110は、多種類の電子
部品(図示せず)を主に半田付けやACFを用いて実装
しており、フレキシブル配線基板120のドライバ素子
ICに入力するドライバ素子入力信号を伝送する。プリ
ント配線基板110には、通常、所定の銅箔パターンと
半田レジストパターンとを形成したガラスエポキシ基板
が用いられる。プリント配線基板110のフレキシブル
配線基板120側表面には、複数の電極端子112がプ
リント配線基板110の一辺側に沿って所定ピッチで形
成されている。電極端子112は、プリント配線基板1
10のプリント配線や電子部品が配される面(裏面)と
は反対側の面(表面)に形成されている。The printed wiring board 110 is mounted with various kinds of electronic parts (not shown) mainly by soldering or ACF, and a driver element input signal input to the driver element IC of the flexible wiring board 120 is input. To transmit. As the printed wiring board 110, a glass epoxy board on which a predetermined copper foil pattern and a solder resist pattern are formed is usually used. On the surface of the printed wiring board 110 on the flexible wiring board 120 side, a plurality of electrode terminals 112 are formed at a predetermined pitch along one side of the printed wiring board 110. The electrode terminal 112 is the printed wiring board 1
It is formed on the surface (front surface) opposite to the surface (rear surface) on which the printed wirings and electronic components 10 are arranged.
【0007】TAB法に用いられるフレキシブル配線基
板120は、ポリイミドのフィルムからなり、ドライバ
素子ICが実装されている。フレキシブル配線基板12
0には、その長手方向の両辺に向けて多数の入力用電極
端子122aと出力用電極端子122bがパターンニン
グされ、これら入出力用電極端子122a,122bは
所定ピッチで配列されている。入出力用電極端子122
a,122bはドライバ素子ICの入力端子と出力端子
に接続される。また、入力用電極端子122aは、プリ
ント配線基板110に設けられた電極端子112と接続
され、出力用電極端子122bは、一方のガラス基板1
31aの電極端子132に接続される。液晶パネルを駆
動する駆動用信号は、プリント配線基板110の電極端
子112から、フレキシブル配線基板120の入力用電
極端子122a、ドライバ素子IC、出力用電極端子1
12bを介して、液晶セル130の一方の基板(ガラス
基板)131aの電極端子132に伝送される。なお、
入力用電極端子122aの配線ピッチは、プリント配線
基板側が200〜400ミクロンメートル程度、出力用
電極端子122bの配線ピッチは、100〜200ミク
ロンメートル程度である。The flexible wiring board 120 used in the TAB method is made of a polyimide film and has a driver element IC mounted thereon. Flexible wiring board 12
0 is patterned with a large number of input electrode terminals 122a and output electrode terminals 122b toward both sides in the longitudinal direction, and these input / output electrode terminals 122a and 122b are arranged at a predetermined pitch. Input / output electrode terminal 122
a and 122b are connected to the input terminal and the output terminal of the driver element IC. The input electrode terminal 122a is connected to the electrode terminal 112 provided on the printed wiring board 110, and the output electrode terminal 122b is connected to the one glass substrate 1.
It is connected to the electrode terminal 132 of 31a. A driving signal for driving the liquid crystal panel is supplied from the electrode terminal 112 of the printed wiring board 110 to the input electrode terminal 122a of the flexible wiring board 120, the driver element IC, and the output electrode terminal 1.
It is transmitted to the electrode terminal 132 of one substrate (glass substrate) 131a of the liquid crystal cell 130 via 12b. In addition,
The wiring pitch of the input electrode terminals 122a is about 200 to 400 μm on the printed wiring board side, and the wiring pitch of the output electrode terminals 122b is about 100 to 200 μm.
【0008】プリント配線基板110の電極端子112
と、フレキシブル配線基板120の入力用電極端子12
2aとは、半田付けや異方導電性接着剤(Anistropic C
onductive Film:ACF)によって接続されている。一
方、液晶セル130の電極端子132と、フレキシブル
配線基板120の出力用電極端子122bとは、両者間
に熱硬化性の樹脂フィルム内に導電性粒子を分散させた
異方導電性接着剤を挟んで加熱圧着することによって接
続される。Electrode terminal 112 of printed wiring board 110
And the input electrode terminal 12 of the flexible wiring board 120.
2a means soldering or anisotropic conductive adhesive (Anistropic C
onductive film (ACF). On the other hand, between the electrode terminal 132 of the liquid crystal cell 130 and the output electrode terminal 122b of the flexible wiring board 120, an anisotropic conductive adhesive having conductive particles dispersed in a thermosetting resin film is sandwiched therebetween. They are connected by heating and pressure bonding.
【0009】かかる液晶パネルLにおいては、各々の電
極端子間の接続状態が液晶パネルLの表示精度に大きく
影響するため、プリント配線基板110の電極端子11
2とフレキシブル配線基板120の入力側電極端子12
2aとの接続個所は、従来、目視による検査が行われて
おり、その信頼性の観点から目視検査を補う方法がいく
つか開発されている。In such a liquid crystal panel L, since the connection state between the respective electrode terminals has a great influence on the display accuracy of the liquid crystal panel L, the electrode terminals 11 of the printed wiring board 110.
2 and the input-side electrode terminal 12 of the flexible wiring board 120
Conventionally, the connection point with 2a has been visually inspected, and some methods have been developed to supplement the visual inspection from the viewpoint of its reliability.
【0010】液晶パネルの接続個所の接続状態を検査す
る第1の方法は、フレキシブル配線基板120の両端に
切り欠き部123を設け、プリント配線基板110には
ダミー電極端子D100を設けて検査する方法である
(図8)。フレキシブル配線基板120をプリント配線
基板110の所定個所に配置して半田付けやACFを介
在させて接続した後に、切り欠き部123にダミー電極
端子D100が確認できる場合は、フレキシブル配線基
板120の配置にズレがなく、電極端子112と入力用
電極端子122aとの接続状態が良好であるとし、一
方、切り欠き部123にダミー電極端子D100が確認
できない場合は、フレキシブル配線基板120の配置に
ズレが生じ、電極端子112と入力用電極端子122a
との接続状態が不良であるとする。The first method for inspecting the connection state of the connection points of the liquid crystal panel is to provide the cutouts 123 at both ends of the flexible wiring board 120 and the dummy electrode terminals D100 on the printed wiring board 110 for inspection. (FIG. 8). When the dummy electrode terminal D100 can be confirmed in the cutout 123 after the flexible wiring board 120 is arranged at a predetermined position of the printed wiring board 110 and connected by soldering or interposing ACF, the flexible wiring board 120 is arranged. It is assumed that there is no deviation and the connection state between the electrode terminal 112 and the input electrode terminal 122a is good. On the other hand, when the dummy electrode terminal D100 cannot be confirmed in the cutout 123, the arrangement of the flexible wiring board 120 is misaligned. , Electrode terminal 112 and input electrode terminal 122a
It is assumed that the connection state with is poor.
【0011】第2の方法は、特開平6−59269号公
報に、液晶パネルに第1のダミー電極端子を設け、絶縁
フィルムには当該第1のダミー電極端子に接続する一対
の第2のダミー電極端子を設け、第1のダミー電極端子
と第2のダミー電極端子との接触抵抗を検査することに
より、液晶パネルの電極端子と、絶縁フィルムの電極端
子との接続状態を検査する方法が開示されている。A second method is disclosed in Japanese Unexamined Patent Publication No. 6-59269, in which a liquid crystal panel is provided with a first dummy electrode terminal, and an insulating film is provided with a pair of second dummy electrodes connected to the first dummy electrode terminal. Disclosed is a method of inspecting a connection state between an electrode terminal of a liquid crystal panel and an electrode terminal of an insulating film by providing an electrode terminal and inspecting a contact resistance between the first dummy electrode terminal and the second dummy electrode terminal. Has been done.
【0012】[0012]
【発明が解決しようとする課題】しかしながら、従来の
上記第1の接続状態検査方法では、各切り欠き部123
ごとに目視による検査を行う必要があるため、高精度な
実装状態の検査を行うことは不可能であった。すなわ
ち、通常は、電極端子同士は多少のズレを生じて接合さ
れるものであるが、その位置ズレが許容限度を超えるも
のであるか否かを検査することは不可能であった。ま
た、導通不良の原因として、プリント配線基板110と
フレキシブル配線基板120が厚み方向の傾斜が生じて
いる場合(つまり、プリント配線基板110とフレキシ
ブル配線基板120との平行度が失われている場合)に
は、切り欠き部123からダミー電極端子D100が観
察されるにもかかわらず、導通不良を検出することがで
きない問題を有していた。However, in the above-mentioned first conventional connection state inspection method, each notch portion 123 is provided.
Since it is necessary to visually inspect each of them, it is impossible to inspect the mounting state with high accuracy. That is, normally, the electrode terminals are joined together with some deviation, but it was impossible to inspect whether the positional deviation exceeded the allowable limit. In addition, when the printed wiring board 110 and the flexible wiring board 120 are inclined in the thickness direction as a cause of the conduction failure (that is, when the parallelism between the printed wiring board 110 and the flexible wiring board 120 is lost). However, although the dummy electrode terminal D100 is observed from the cutout 123, there is a problem that the conduction failure cannot be detected.
【0013】また、従来の上記第2の方法では、対向す
るダミー電極端子の接触抵抗を測定するため、液晶パネ
ルと絶縁フィルムの両方に各々対応するダミー電極端子
を形成し、一方の配線基板と他方の配線基板とで対応さ
せるような複雑な形成をしなければならない。また、か
かる方法では、液晶表示パネルにダミー電極端子を形成
しているが、近年の小型化傾向による狭額縁化の要請の
高い液晶表示パネルにダミー電極端子を形成すること
は、この狭額縁化の要請にも反する。Further, in the above-mentioned second conventional method, in order to measure the contact resistance of the dummy electrode terminals which face each other, the dummy electrode terminals corresponding to both the liquid crystal panel and the insulating film are formed, and one of the wiring boards is formed. A complicated formation must be made so as to correspond to the other wiring board. Further, in such a method, the dummy electrode terminals are formed on the liquid crystal display panel. However, forming the dummy electrode terminals on the liquid crystal display panel, which is highly required due to the recent trend toward miniaturization, is difficult. Against the request of.
【0014】そこで、本発明の目的は、一方の配線基板
にのみダミー電極端子を形成するだけで、一方の配線基
板と他方の配線基板の実装検査を行うことが可能であ
り、簡易で高精度な配線基板の実装検査方法を提供する
ことにある。Therefore, an object of the present invention is to make it possible to perform a mounting inspection of one wiring board and the other wiring board only by forming dummy electrode terminals on only one wiring board, which is simple and highly accurate. Another object of the present invention is to provide a mounting inspection method for a flexible wiring board.
【0015】[0015]
【課題を解決するための手段】上記課題を解決し上記目
的を達成するために、本発明の請求項1記載の配線基板
の実装検査方法は、電極端子を有する一方の配線基板と
電極端子を有する他方の配線基板との実装状態を検査す
る配線基板の実装検査方法において、一方の配線基板に
その任意の一の電極端子と所定間隔を設けて検査用のダ
ミー電極端子を少なくとも一つ配し、一方の配線基板と
他方の配線基板を重ね合わせた場合における各電極端子
の位置ズレを、上記検査用のダミー電極端子と接触する
他方の配線基板の電極端子を介して、上記任意の一の電
極端子と検査用のダミー電極端子との導通状態の有無に
より検査することを特徴とする。In order to solve the above-mentioned problems and achieve the above-mentioned object, a wiring board mounting inspection method according to a first aspect of the present invention is characterized in that one wiring board having electrode terminals and one electrode terminal are provided. In a wiring board mounting inspection method for inspecting a mounting state with the other wiring board having, at least one dummy electrode terminal for inspection is arranged on one wiring board at a predetermined interval from any one electrode terminal thereof. , The positional deviation of each electrode terminal when one wiring board and the other wiring board are overlapped, through the electrode terminal of the other wiring board in contact with the dummy electrode terminal for inspection, It is characterized in that the inspection is performed depending on whether or not there is a conduction state between the electrode terminal and the dummy electrode terminal for inspection.
【0016】本発明によれば、上記検査用のダミー電極
端子と接触する他方の配線基板の電極端子を介して上記
任意の一の電極端子と検査用のダミー電極端子との導通
状態の有無を検査することから、ダミー電極端子は一方
の配線基板に設けられていれば足りる。導通状態の検査
は、検査用テスタのプローブ(探針)を接触させる等し
て行う。そして、一方の基板の任意の一の電極端子とダ
ミー電極端子との導通状態の有無を検査することによっ
て、他方の配線基板の電極端子が対応する一方の配線基
板の電極端子と接触し、且つ、ダミー電極端子と任意の
一の電極端子との間に設けられた所定間隔を超えるズレ
が生じている場合は、ダミー電極端子と任意の一の電極
端子とが導通状態となるために、各電極端子の位置ズレ
による導通不良が生じていることを検査することができ
る。一方、他方の配線基板の電極端子が対応する一方の
配線基板の電極端子に接触し、且つ、ダミー電極端子と
任意の一の電極端子との間に設けられた所定間隔を超え
ない程度のズレであるか、又はズレないで正確に位置合
わせされている場合は、他方の配線基板の電極端子がダ
ミー電極端子に接触せず、ダミー電極端子と任意の一の
電極端子とが導通状態とならないために、各電極端子の
位置ズレによる導通不良が生じていないことを検査する
ことができる。According to the present invention, whether or not there is a conduction state between the arbitrary one electrode terminal and the dummy electrode terminal for inspection through the electrode terminal of the other wiring substrate which is in contact with the dummy electrode terminal for inspection is determined. From the inspection, it is sufficient if the dummy electrode terminals are provided on one wiring board. The inspection of the conduction state is performed by bringing the probe (probe) of the inspection tester into contact. Then, by inspecting whether or not there is a conduction state between any one electrode terminal and the dummy electrode terminal of one substrate, the electrode terminal of the other wiring substrate comes into contact with the corresponding electrode terminal of one wiring substrate, and , If a deviation exceeding a predetermined interval provided between the dummy electrode terminal and the arbitrary one electrode terminal occurs, the dummy electrode terminal and the arbitrary one electrode terminal are brought into conduction with each other. It can be inspected that the conduction failure has occurred due to the displacement of the electrode terminals. On the other hand, the electrode terminals of the other wiring board are in contact with the corresponding electrode terminals of the one wiring board, and there is a gap that does not exceed the predetermined interval provided between the dummy electrode terminal and any one electrode terminal. If it is, or is correctly aligned without deviation, the electrode terminal of the other wiring board does not contact the dummy electrode terminal and the dummy electrode terminal and any one electrode terminal do not become conductive. Therefore, it can be inspected that the conduction failure due to the positional deviation of each electrode terminal does not occur.
【0017】本発明の請求項2記載の配線基板の実装検
査方法は、請求項1記載の配線基板を前提として、前記
一方の配線基板のダミー電極端子は、前記電極端子の左
右両側に配されていることを特徴とする。なお、前記任
意の一の電極端子の左右に配されていても、複数の(一
群の)電極端子の左右両側に配されていても良い。The wiring board mounting inspection method according to claim 2 of the present invention is based on the wiring board according to claim 1, and the dummy electrode terminals of the one wiring board are arranged on both left and right sides of the electrode terminal. It is characterized by It should be noted that the electrodes may be arranged on the left and right of the arbitrary one electrode terminal, or may be arranged on the left and right sides of a plurality of (group of) electrode terminals.
【0018】この発明によれば、ダミー電極端子は電極
端子の左右に配されていることから、一方の配線基板の
左右の一方端側のみならず他方端側でも導通状態の有無
が検査され、一方の配線基板と他方の配線基板が傾いて
配置された場合や、一方の配線基板と他方の配線基板と
が左右いずれの方向に位置ズレした場合にも検査が行わ
れるようになる。According to the present invention, since the dummy electrode terminals are arranged on the left and right sides of the electrode terminals, the presence or absence of the conductive state is inspected not only on the one end side of the one wiring board but also on the other end side thereof. The inspection is performed even when one wiring board and the other wiring board are arranged at an inclination, or when one wiring board and the other wiring board are misaligned in the left or right direction.
【0019】本発明の請求項3記載の配線基板の実装検
査方法は、請求項1又は請求項2記載の発明を前提とし
て、前記他方の配線基板は一対の基板間に液晶層が挟持
される液晶表示パネルの一方の基板であり、前記一方の
配線基板はこの一方の基板に対応して配されるフレキシ
ブル配線基板であるか、または、前記他方の配線基板は
一対の基板間に液晶層が挟持される液晶表示パネルの一
方の基板の外周に配されるフレキシブル配線基板であ
り、前記一方の配線基板はこのフレキシブル配線基板に
対応して配されるプリント配線基板であることを特徴と
する。The wiring board mounting inspection method according to claim 3 of the present invention is based on the invention of claim 1 or 2, wherein the other wiring board has a liquid crystal layer sandwiched between a pair of substrates. One of the substrates of the liquid crystal display panel, the one wiring substrate is a flexible wiring substrate arranged corresponding to the one substrate, or the other wiring substrate has a liquid crystal layer between a pair of substrates. The flexible wiring board is arranged on the outer periphery of one substrate of the sandwiched liquid crystal display panel, and the one wiring board is a printed wiring board arranged corresponding to the flexible wiring board.
【0020】この発明によれば、一対の基板間に液晶層
が挟持される液晶表示パネルの一方の基板とこれに対応
するフレキシブル配線基板との各電極端子の接続状態を
検査することができ、又、フレキシブル配線基板とこれ
に対応するプリント配線基板との電極端子の接続状態を
検査することができる。いずれの関係でも、本発明によ
れば一方の配線基板にのみダミー電極端子を形成するだ
けで一方の配線基板と他方の配線基板の実装検査を行う
ことができる。また、液晶表示パネルの一方の基板には
ダミー電極端子を形成する必要がないために、近年の小
型化傾向による狭額縁化の要請の高い液晶表示パネルに
対応した実装検査を行うことができる。According to the present invention, it is possible to inspect the connection state of each electrode terminal between one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates and a corresponding flexible wiring substrate, Further, the connection state of the electrode terminals between the flexible wiring board and the corresponding printed wiring board can be inspected. In any case, according to the present invention, the mounting inspection of one wiring board and the other wiring board can be performed only by forming the dummy electrode terminals on only one wiring board. Further, since it is not necessary to form dummy electrode terminals on one substrate of the liquid crystal display panel, it is possible to carry out a mounting inspection corresponding to a liquid crystal display panel which is highly required to have a narrow frame due to the recent trend toward miniaturization.
【0021】[0021]
【発明の実施の形態】以下、本発明の実施の形態を図面
を引用しながら説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【0022】本実施の形態は、図1及び図2に示すよう
に、液晶表示装置におけるTAB法による実装に本発明
を適用したものである。すなわち、液晶層を一対の基板
で挟み込んだ液晶表示パネルLと、液晶表示パネルLの
外周に配されるプリント配線基板10と、液晶表示パネ
ルLとプリント配線基板10との間に配され液晶表示パ
ネルLを表示するための駆動用半導体素子ICが設けら
れたフレキシブル配線基板20とからなる(図1参
照)。フレキシブル配線基板20の電極端子22と液晶
表示パネルLの電極端子32は対応するように対向する
直線状に形成され、フレキシブル配線基板20の電極端
子21(21a…21z)とプリント配線基板10の電
極端子11(11a…11z)は対応するように対向す
る直線状に形成されている。続する順番は、まず液晶表
示パネルLとフレキシブル配線基板20とを接続し、次
にフレキシブル配線基板20とプリント配線基板10と
を接続する。液晶表示パネルLとフレキシブル配線基板
20、フレキシブル配線基板20とプリント配線基板1
0の接続には、異方導電性接着剤(Anistropic Conduct
ive Film、以下ACFと称する)等を使用している。な
お、ACFによる圧着は、TCPを1個ずつ圧着する個
別圧着、配線基板の1辺を多数の圧着ヘッドで同時に圧
着する多ヘッド一括圧着、配線基板の1辺を1個の圧着
ヘッドで同時に圧着する1ヘッド一括圧着等がある。In this embodiment, as shown in FIGS. 1 and 2, the present invention is applied to mounting by a TAB method in a liquid crystal display device. That is, a liquid crystal display panel L in which a liquid crystal layer is sandwiched between a pair of substrates, a printed wiring board 10 disposed on the outer periphery of the liquid crystal display panel L, and a liquid crystal display disposed between the liquid crystal display panel L and the printed wiring board 10. The flexible wiring board 20 is provided with a driving semiconductor element IC for displaying the panel L (see FIG. 1). The electrode terminals 22 of the flexible wiring board 20 and the electrode terminals 32 of the liquid crystal display panel L are correspondingly formed in a linear shape facing each other, and the electrode terminals 21 (21a ... 21z) of the flexible wiring board 20 and the electrodes of the printed wiring board 10 are formed. The terminals 11 (11a ... 11z) are formed in a straight line shape corresponding to each other. The order of continuing is to connect the liquid crystal display panel L and the flexible wiring board 20 first, and then connect the flexible wiring board 20 and the printed wiring board 10. Liquid crystal display panel L and flexible wiring board 20, flexible wiring board 20 and printed wiring board 1
Anisotropic conductive adhesive (Anistropic Conductive Adhesive)
ive film, hereinafter referred to as ACF) or the like. Note that the ACF crimping includes individual crimping in which TCPs are crimped one by one, multi-head batch crimping in which one side of the wiring board is simultaneously crimped by a plurality of crimping heads, and one side of the wiring board is crimped simultaneously by one crimping head There is one head batch compression.
【0023】液晶パネルLを構成する一対の基板31
a,31bのうちの第1の基板31aは、第2の基板3
1bよりも大きく形成され、このため両基板31a,3
1bを重ね合わせると、第1の基板31aの外周縁部に
一部張り出した実装領域が形成され、この実装領域に、
アルミニウム(Al)などによる電極端子32が配設さ
れている。電極端子32は入力用電極端子であり、半導
体素子ICからの液晶駆動用の信号を液晶層に伝送す
る。A pair of substrates 31 constituting the liquid crystal panel L
The first substrate 31a of the a and 31b is the second substrate 3
1b, so that both substrates 31a, 3 are formed.
When 1b is superposed, a mounting region that partially projects to the outer peripheral edge of the first substrate 31a is formed, and in this mounting region,
Electrode terminals 32 made of aluminum (Al) or the like are provided. The electrode terminal 32 is an input electrode terminal and transmits a liquid crystal driving signal from the semiconductor element IC to the liquid crystal layer.
【0024】フレキシブル配線基板20は、ポリイミド
のフィルムからなり、LSI等のドライバ素子ICを実
装している。フレキシブル配線基板20のプリント配線
基板10側には、多数の入力用電極端子21がパターン
形成され、液晶パネルL側には、多数の出力用電極端子
22がパターン形成され、ドライバ素子ICにそれぞれ
接続されている。The flexible wiring board 20 is made of a polyimide film and has a driver element IC such as an LSI mounted thereon. A large number of input electrode terminals 21 are patterned on the printed wiring board 10 side of the flexible wiring board 20, and a large number of output electrode terminals 22 are formed on the liquid crystal panel L side, which are respectively connected to the driver element ICs. Has been done.
【0025】プリント配線基板10は、通常、所定の銅
箔パターンと半田レジストパターンとを形成したガラス
エポキシ基板が用いられる。このプリント配線基板10
には、複数の電極端子11がフレキシブル配線基板20
側に沿うように一定ピッチに形成されている。電極端子
11は、プリント配線基板10のプリント配線や電子部
品が配置される面(裏面)とは反対側の面(表面)に形
成されている。The printed wiring board 10 is usually a glass epoxy board on which a predetermined copper foil pattern and solder resist pattern are formed. This printed wiring board 10
The plurality of electrode terminals 11 are arranged in the flexible wiring board 20.
It is formed at a constant pitch along the side. The electrode terminal 11 is formed on the surface (front surface) opposite to the surface (back surface) on which the printed wiring and electronic components of the printed wiring board 10 are arranged.
【0026】プリント配線基板10の電極端子11の左
右両端の電極端子11aと11zの外側には、各々第1
のダミー電極端子D1と第2のダミー電極端子D2が導
通検査用として配されている。最左側の電極端子11a
に対しては、第1の引き出し線H1が設けられ、最右側
の電極端子11zに対しては、第2の引き出し線H2が
設けられている。第1及び第2の引き出し線H1,H2
と第1及び第2のダミー電極端子D1,D2は、アルミ
ニウム(Al)等を素材としており、電極端子11a…
11zと同一工程で形成されている。On the outer sides of the electrode terminals 11a and 11z at the left and right ends of the electrode terminal 11 of the printed wiring board 10, the first terminals are respectively provided.
The dummy electrode terminal D1 and the second dummy electrode terminal D2 are provided for the continuity test. Leftmost electrode terminal 11a
Is provided with a first lead line H1, and the rightmost electrode terminal 11z is provided with a second lead line H2. First and second lead lines H1, H2
The first and second dummy electrode terminals D1 and D2 are made of aluminum (Al) or the like, and the electrode terminals 11a ...
It is formed in the same process as 11z.
【0027】第1のダミー電極端子D1は、プリント配
線基板10の最左側(配列方向LT側)の電極端子11
aに沿う直線状に形成されている。この第1のダミー電
極端子D1は、フレキシブル配線基板20の入力用電極
端子21aと、その入力用電極端子21aと接触するプ
リント配線基板10の電極端子11aとの間で導通状態
の有無を検査するもので、入力用電極端子11aとの間
には所定間隔Saが設けられている。この所定間隔Sa
は、液晶パネルLのモジュール化における規格値(スペ
ース寸法)以上にフレキシブル配線基板20とプリント
配線基板10とが位置ズレした場合(許容範囲以上の位
置ズレした場合)に、フレキシブル配線基板20の入力
用電極端子21を介してプリント配線基板10の電極端
子11aと第1のダミー電極端子D1とが導通する間隔
である。すなわち、第1のダミー電極端子D1は、フレ
キシブル配線基板20の入力用電極端子21がプリント
配線基板10側に接触する部分を図2、図3中における
点線で示す符号13とすると、この符号13の幅は、電
極端子11aから第1のダミー電極端子D1に亘る幅を
有している。また、第1ダミー電極端子D1には、引出
し線を介して端子パッドPDが設けられている。そし
て、最左側の電極端子11aにも引出し線H1を介して
端子パッドPHが設けられており、上記第1のダミー電
極端子D1の端子パッドPDとの距離が近づけられてい
る。なお、各電極端子11,21,22はアルミニウム
(Al)等を素材としており、電極端子11と入力用電
極端子21の配線ピッチは、200〜400μm程度、
出力用電極端子22の配線ピッチは、100〜200μ
m程度である。上記許容許容範囲以上の位置ズレか否か
は、これらの値の半分程度は位置ズレ許容範囲である
が、その値は統計的に割り出すことで精度が高められ
る。The first dummy electrode terminal D1 is an electrode terminal 11 on the leftmost side (arrangement direction LT side) of the printed wiring board 10.
It is formed in a straight line along a. The first dummy electrode terminal D1 is inspected for a conduction state between the input electrode terminal 21a of the flexible wiring board 20 and the electrode terminal 11a of the printed wiring board 10 that is in contact with the input electrode terminal 21a. A predetermined space Sa is provided between the input electrode terminal 11a and the input electrode terminal 11a. This predetermined interval Sa
Is input to the flexible wiring board 20 when the flexible wiring board 20 and the printed wiring board 10 are misaligned by more than the standard value (space dimension) in the modularization of the liquid crystal panel L (when misaligned by more than the allowable range). It is a distance in which the electrode terminal 11a of the printed wiring board 10 and the first dummy electrode terminal D1 are electrically connected to each other through the use electrode terminal 21. That is, in the first dummy electrode terminal D1, if the portion where the input electrode terminal 21 of the flexible wiring board 20 contacts the printed wiring board 10 is designated by the numeral 13 shown by the dotted line in FIGS. 2 and 3, this numeral 13 Has a width extending from the electrode terminal 11a to the first dummy electrode terminal D1. Further, the first dummy electrode terminal D1 is provided with a terminal pad PD via a lead wire. The leftmost electrode terminal 11a is also provided with the terminal pad PH via the lead wire H1, and the distance between the first dummy electrode terminal D1 and the terminal pad PD is reduced. Each electrode terminal 11, 21, 22 is made of aluminum (Al) or the like, and the wiring pitch between the electrode terminal 11 and the input electrode terminal 21 is about 200 to 400 μm.
The wiring pitch of the output electrode terminals 22 is 100 to 200 μ.
It is about m. About half of these values are within the allowable positional deviation range, and the accuracy of the positional deviation can be improved by statistically determining the value.
【0028】第2のダミー電極端子D2は、プリント配
線基板10の最右側端(配列方向RT側)の電極端子1
1zに沿う直線状に形成されている。この第2のダミー
電極端子D2も、同じように、電極端子11zとの間に
は所定間隔Szが設けられている。また、第2ダミー電
極端子D2には、引出し線を介して端子パッドPDが設
けられ、最右側の電極端子11zにも引出し線H2を介
して端子パッドPHが設けられており、上記第2のダミ
ー電極端子D2の端子パッドPDとの距離が近づけられ
ている。なお、第1のダミー電極端子D1と電極端子1
1aとの所定間隔Saと、第2のダミー電極端子D2と
電極端子11zとの所定間隔Szは同じである。The second dummy electrode terminal D2 is the electrode terminal 1 at the rightmost end (arrangement direction RT side) of the printed wiring board 10.
It is formed in a straight line along 1z. Similarly, the second dummy electrode terminal D2 is also provided with a predetermined space Sz between the second dummy electrode terminal D2 and the electrode terminal 11z. Further, the second dummy electrode terminal D2 is provided with a terminal pad PD via a lead wire, and the rightmost electrode terminal 11z is also provided with a terminal pad PH via a lead wire H2. The dummy electrode terminal D2 is close to the terminal pad PD. The first dummy electrode terminal D1 and the electrode terminal 1
The predetermined distance Sa between the first dummy electrode terminal D2 and the electrode terminal 11z is the same as the predetermined distance Sa between the first dummy electrode terminal D2 and the electrode terminal 11z.
【0029】ここで、第1のダミー電極端子D1と第2
のダミー電極端子D2は、電極端子11a,11zの両
外側に設けず、どちらか一方の電極端子11にのみ設け
られても良い。この場合は、プリント配線基板10に一
つのダミー電極端子D1(或いはD2)を設けるだけで
足りることになる。また、一対のダミー電極端子D1,
D2は、電極端子11の配列の両端の電極端子11a,
11zに設けず、配列の中間に配置されているいずれか
の電極端子11b…11yに設けられても良く、又、各
電極端子11a…11zの左右に設けられても良い。さ
らに、第1と第2のダミー電極端子D1,D2は、図6
に示すように、その先端部D1aを屈曲させてプリント
配線基板10の一辺側端部に向かせないようにしても良
い。Here, the first dummy electrode terminal D1 and the second dummy electrode terminal D1
The dummy electrode terminal D2 may not be provided on both outer sides of the electrode terminals 11a and 11z, and may be provided only on one of the electrode terminals 11. In this case, it is sufficient to provide the printed wiring board 10 with one dummy electrode terminal D1 (or D2). In addition, a pair of dummy electrode terminals D1,
D2 is an electrode terminal 11a at both ends of the array of electrode terminals 11,
11z may be provided on any of the electrode terminals 11b ... 11y arranged in the middle of the arrangement, or may be provided on the left and right of each of the electrode terminals 11a ... 11z. Further, the first and second dummy electrode terminals D1 and D2 are
As shown in FIG. 7, the tip portion D1a may be bent so as not to face the one side edge portion of the printed wiring board 10.
【0030】次に、本実施の形態の配線基板の実装状態
検査方法について説明する。第1の引き出し線H1の端
子パッドPHと、第1のダミー電極端子D1の端子パッ
ドPDに検査用テスタのプローブ(探針)を接触させ
て、その間の接触抵抗値を測定することによって、一方
の電極端子11と他方の入力用電極端子21との導通状
態を検査する。なお、端子パッドPH、PDに検査テス
タの探針を接触させなくとも、第1又は第2のダミー電
極端子D1,D2と電極端子11a又は電極端子11z
に直接接触させても良い。そして、一方の電極端子11
と他方の入力用電極端子21とが所定の許容範囲以上の
位置ズレであるか否かを検査することができるが、以
下、具体的に図面を用いて説明する。Next, a method of inspecting the mounting state of the wiring board of this embodiment will be described. The terminal pad PH of the first lead wire H1 and the terminal pad PD of the first dummy electrode terminal D1 are brought into contact with the probe (probe) of the tester for inspection, and the contact resistance value between them is measured. The electrical connection between the electrode terminal 11 and the other input electrode terminal 21 is inspected. Even if the probe of the inspection tester is not brought into contact with the terminal pads PH and PD, the first or second dummy electrode terminals D1 and D2 and the electrode terminal 11a or the electrode terminal 11z.
May be brought into direct contact with. Then, one electrode terminal 11
It is possible to inspect whether or not the other input electrode terminal 21 and the other input electrode terminal 21 are out of position by a predetermined allowable range or more, which will be specifically described below with reference to the drawings.
【0031】図3(a)にフレキシブル配線基板20が
ズレることがなくプリント配線基板10の所定個所に配
置された場合、つまり、フレキシブル配線基板20の入
力用電極端子21がプリント配線基板10の電極端子1
1にズレることがなく正確に重なるように配置された場
合の実装状態を示す。この実装状態では、入力用電極端
子21は、対応する各電極端子11に重なるように配置
され、第1及び第2のダミー電極端子D1,D2とは接
触していないので、ダミー電極端子D1,D2と電極端
子11a,11zとは導通状態とならない。In FIG. 3A, when the flexible wiring board 20 is arranged at a predetermined position on the printed wiring board 10 without displacement, that is, the input electrode terminals 21 of the flexible wiring board 20 are electrodes of the printed wiring board 10. Terminal 1
1 shows a mounting state when they are arranged so as to be accurately overlapped with each other without shifting to 1. In this mounted state, the input electrode terminals 21 are arranged so as to overlap the corresponding electrode terminals 11 and are not in contact with the first and second dummy electrode terminals D1 and D2. D2 and the electrode terminals 11a and 11z are not electrically connected.
【0032】図3(b)にフレキシブル配線基板20が
配列方向LTに向かって少しズレてプリント配線基板1
0に配置された場合、つまり、フレキシブル配線基板2
0の各入力用引出し電極端子21が、プリント配線基板
10の電極端子11にほぼ重なるように配置されてお
り、所定間隔Saを超えない程度に少しズレた場合の実
装状態を示す。入力用電極端子21は、対応する各電極
端子11にほぼ重なるように配置され、第1及び第2の
ダミー電極端子D1,D2とは接触していない。この場
合もダミー電極端子D1,D2と電極端子11a,11
zとは導通状態とならない。この範囲の位置ズレは許容
範囲の位置ズレである。In FIG. 3B, the flexible wiring board 20 is slightly displaced in the arrangement direction LT and the printed wiring board 1
0, that is, the flexible wiring board 2
Each of the input lead-out electrode terminals 21 of 0 is arranged so as to substantially overlap with the electrode terminal 11 of the printed wiring board 10, and shows a mounted state in which the input lead-out electrode terminals 21 are slightly displaced so as not to exceed the predetermined interval Sa. The input electrode terminals 21 are arranged so as to substantially overlap with the corresponding electrode terminals 11, and are not in contact with the first and second dummy electrode terminals D1 and D2. Also in this case, the dummy electrode terminals D1 and D2 and the electrode terminals 11a and 11
It does not become conductive with z. The positional deviation within this range is within the allowable range.
【0033】図3(c)にフレキシブル配線基板20が
配列方向LTに向かって大きくズレてプリント配線基板
10に配置された場合、つまり、フレキシブル配線基板
20の入力用電極端子21がプリント配線基板10の電
極端子11に少し重なるように配置されており、且つ所
定間隔Saを超える程度に大きくズレた場合の実装状態
を示す。入力用電極端子21は、対応する各電極端子1
1に少し重なるように配置され、第1のダミー電極端子
D1と接触している。この場合はダミー電極端子D1,
D2と電極端子11a,11zとが導通状態とる。この
範囲の位置ズレば許容範囲を超えた位置ズレである。In FIG. 3C, when the flexible wiring board 20 is arranged on the printed wiring board 10 with a large deviation in the arrangement direction LT, that is, the input electrode terminals 21 of the flexible wiring board 20 are arranged on the printed wiring board 10. 2 shows a mounting state in which the electrode terminals 11 are slightly overlapped with the electrode terminals 11 and are largely displaced by a distance exceeding the predetermined interval Sa. The input electrode terminal 21 corresponds to the corresponding electrode terminal 1
The first dummy electrode terminal D1 is in contact with the first dummy electrode terminal D1. In this case, the dummy electrode terminal D1,
D2 and the electrode terminals 11a and 11z are brought into conduction. If the positional deviation is within this range, the positional deviation exceeds the allowable range.
【0034】つまり、本実施の形態では、電極端子11
の配列方向LT側に第1のダミー電極端子D1が配され
ているため、フレキシブル配線基板20が配列方向LT
に向かって所定間隔Saを超える程度に大きくズレる
と、第1のダミー電極端子D1と電極端子11aとが入
力用電極端子21aを介して接続される。That is, in the present embodiment, the electrode terminal 11
Since the first dummy electrode terminals D1 are arranged on the side of the arrangement direction LT of, the flexible wiring board 20 is arranged in the arrangement direction LT.
If it deviates to the extent of exceeding the predetermined distance Sa, the first dummy electrode terminal D1 and the electrode terminal 11a are connected via the input electrode terminal 21a.
【0035】第2のダミー電極端子D2は、電極端子1
1zの配列方向RT側に沿うように配されている。した
がって、フレキシブル配線基板20が配列方向RTに向
かって所定間隔Szを超える程度に大きくズレてプリン
ト配線基板10に配置された場合には、入力用電極端子
21は、対応する各電極端子11に少し重なるように配
置され、第2のダミー電極端子D2と接触する(図3
(d))。つまり、第2のダミー電極端子D2と電極端
子11zとが入力用電極端子21zを介して接続され
る。The second dummy electrode terminal D2 is the electrode terminal 1
It is arranged so as to be along the RT side of the 1z array direction. Therefore, when the flexible wiring board 20 is arranged on the printed wiring board 10 with a large deviation from the predetermined spacing Sz in the arrangement direction RT, the input electrode terminals 21 are slightly different from the corresponding electrode terminals 11. The second dummy electrode terminals D2 are arranged so as to overlap each other (see FIG. 3).
(D)). That is, the second dummy electrode terminal D2 and the electrode terminal 11z are connected via the input electrode terminal 21z.
【0036】また、本実施の形態では、プリント配線基
板10の左右両側に第1のダミー電極端子D1と第2の
ダミー電極端子D2が設けているため、図4に示すよう
に、フレキシブル配線基板20が斜めにズレて配置され
た場合の導通不良をも検出することができる。この場合
は、第2のダミー電極端子D2と電極端子11zとは導
通しないが、第1のダミー電極端子D1は入力用電極端
子21aを介して電極端子11aと導通する。両側で異
なった結果が得られることで、フレキシブル配線基板2
0とプリント配線基板10との正確な重ね合わせ実装が
保障されているか否かを検査できる。なお、第1のダミ
ー電極端子D1と第2のダミー電極端子D2がプリント
配線基板10の電極端子11aと電極端子11zの外側
に同じ所定間隔Sa,Szで設けられている場合は、左
右両方向LT,RTの位置ズレを検査することができ
る。つまり、左側LTにズレた場合も、右側RTにズレ
た場合も検査できる。Further, in this embodiment, since the first dummy electrode terminal D1 and the second dummy electrode terminal D2 are provided on both left and right sides of the printed wiring board 10, as shown in FIG. It is also possible to detect a conduction failure when the 20 is obliquely displaced. In this case, the second dummy electrode terminal D2 and the electrode terminal 11z are not electrically connected, but the first dummy electrode terminal D1 is electrically connected to the electrode terminal 11a via the input electrode terminal 21a. Flexible wiring board 2 because different results are obtained on both sides
It is possible to inspect whether or not the correct overlay mounting of 0 and the printed wiring board 10 is guaranteed. When the first dummy electrode terminal D1 and the second dummy electrode terminal D2 are provided outside the electrode terminals 11a and 11z of the printed wiring board 10 at the same predetermined intervals Sa and Sz, the left and right directions LT are set. , RT position deviation can be inspected. In other words, it is possible to inspect both when there is a shift to the left LT and when there is a shift to the right RT.
【0037】なお、図5(a)に示すように、第2のダ
ミー電極端子D1と電極端子11との所定間隔Sを大き
く設けることにより、所定間隔Sよりも小さなズレは検
出せずに、所定間隔Sよりも大きなズレのみを検出す
る。一方、図5(b)に示すように、所定間隔Sを小さ
く設けることにより、小さなズレをも検出するため、位
置ズレの許容範囲を調節することができる。As shown in FIG. 5 (a), by providing a large predetermined distance S between the second dummy electrode terminal D1 and the electrode terminal 11, a deviation smaller than the predetermined distance S is not detected. Only deviations larger than the predetermined interval S are detected. On the other hand, as shown in FIG. 5B, by setting the predetermined interval S small, even a small deviation is detected, so that the allowable range of positional deviation can be adjusted.
【0038】このように本実施の形態によれば、一方の
配線基板のプリント配線基板10にのみダミー電極端子
D1,D2の少なくとも一方を形成するだけでプリント
配線基板10とフレキシブル配線基板20の実装検査を
行うことができ、所定間隔Sa,Szを超えない程度の
ズレ(許容範囲内の位置ズレ)である場合は、ダミー電
極端子D1,D2と電極端子11a,11zとの間が導
通せず、フレキシブル配線基板20が所定間隔Sa,S
zを超える程度のズレ(許容範囲外の位置ズレ)である
場合は、ダミー電極端子D1,D2と電極端子11a,
11zとの間が導通することで、フレキシブル配線基板
20とプリント配線基板10との実装状態を検査するこ
とができる。なお、電極端子11と電極端子21との接
触状態(接触面積)が狭い場合はそれが広い場合よりも
検査用テスタでの接触抵抗の測定値は高くなり、その測
定値の値が異なるので、この接触抵抗値からも許容範囲
内の位置ズレか否かを測定することも可能である。As described above, according to the present embodiment, the printed wiring board 10 and the flexible wiring board 20 are mounted by forming at least one of the dummy electrode terminals D1 and D2 only on the printed wiring board 10 of one wiring board. If the inspection can be performed and there is a deviation (positional deviation within an allowable range) that does not exceed the predetermined intervals Sa and Sz, the dummy electrode terminals D1 and D2 and the electrode terminals 11a and 11z are not electrically connected. , The flexible wiring board 20 has a predetermined spacing Sa, S
If the displacement is more than z (positional displacement outside the allowable range), the dummy electrode terminals D1 and D2 and the electrode terminals 11a,
The electrical connection between the flexible wiring board 20 and the printed wiring board 10 can be inspected by the conduction between the wiring board 11 and 11z. When the contact state (contact area) between the electrode terminal 11 and the electrode terminal 21 is narrow, the measured value of the contact resistance in the tester for inspection is higher than when it is wide, and the measured value is different. From this contact resistance value, it is also possible to measure whether or not there is a positional deviation within the allowable range.
【0039】本実施の形態では、フレキシブル配線基板
20とプリント配線基板10との実装状態で説明した
が、液晶パネルLを構成する一方の基板31aとフレキ
シブル配線基板20との関係でも同じようにして検査す
ることができる。本実施の形態の構成では、他方の配線
基板20の電極端子21をそのまま利用して、一方の配
線基板にのみダミー電極端子を形成するだけで一方の配
線基板と他方の配線基板の実装検査を行うことができる
ために、液晶セル30を構成する一方の基板31aとフ
レキシブル配線基板20との関係では、液晶表示パネル
の一方の基板31aにはダミー電極端子D1,D2を形
成せずとも良い。したがって、狭額縁化の要請の高い液
晶表示パネルに対応した実装状態検査を行うことができ
る。Although the flexible wiring board 20 and the printed wiring board 10 are mounted in the present embodiment, the same applies to the relationship between the flexible wiring board 20 and one board 31a constituting the liquid crystal panel L. Can be inspected. In the configuration of the present embodiment, the electrode terminal 21 of the other wiring board 20 is used as it is, and the dummy electrode terminals are formed only on one wiring board to perform the mounting inspection of the one wiring board and the other wiring board. Since it can be performed, the dummy electrode terminals D1 and D2 do not have to be formed on the one substrate 31a of the liquid crystal display panel in the relationship between the one substrate 31a forming the liquid crystal cell 30 and the flexible wiring substrate 20. Therefore, it is possible to perform the mounting state inspection corresponding to the liquid crystal display panel for which a narrow frame is highly required.
【0040】以上、本実施の形態では、TAB法の実装
による液晶表示パネルLに本発明を適用して説明した
が、COG実装や、その他の電子機器の一般の回路基板
の実装検査にも適用可能である。In the above, the present invention has been described by applying the present invention to the liquid crystal display panel L mounted by the TAB method, but it is also applied to COG mounting and mounting inspection of general circuit boards of other electronic devices. It is possible.
【0041】[0041]
【発明の効果】本発明の配線基板の実装検査方法によれ
ば、一方の配線基板にのみ検査用のダミー電極端子を少
なくとも一つ配するだけで、他方の配線基板の電極端子
を介して、一方の配線基板と他方の配線基板の実装状態
の良否を、導通の有無により検査することができるとと
もに、一方の電極端子と他方の電極端子とが所定の許容
範囲以上の位置ズレであるか否かを検査することができ
るので、簡単且つ高精度に検査することが可能になる。According to the wiring board mounting inspection method of the present invention, by disposing at least one dummy electrode terminal for inspection only on one wiring board, the electrode terminal of the other wiring board is provided. Whether the mounting state of one wiring board and the other wiring board is good or not can be inspected by the presence or absence of conduction, and whether or not one electrode terminal and the other electrode terminal are out of position by a predetermined allowable range or more. Since it can be inspected, it becomes possible to inspect easily and with high accuracy.
【0042】[0042]
【図1】本発明の一実施の形態の液晶表示パネルを示す
斜視図FIG. 1 is a perspective view showing a liquid crystal display panel according to an embodiment of the present invention.
【図2】上記実施の形態におけるプリント配線基板とフ
レキシブル配線基板との接続個所の平面図FIG. 2 is a plan view of a connection portion between a printed wiring board and a flexible wiring board in the above embodiment.
【図3】(a)はフレキシブル配線基板20がズレるこ
となくプリント配線基板10の所定個所に配置された場
合の状態を示す図、(b)はフレキシブル配線基板20
が配列方向LTに向かって少しズレてプリント配線基板
10に配置された場合の状態を示す図、(c)はフレキ
シブル配線基板20が配列方向LTに向かって大きくズ
レてプリント配線基板10に配置された場合の状態を示
す図、(d)はフレキシブル配線基板20が配列方向R
Tに向かって大きくズレてプリント配線基板10に配置
された場合の状態を示す図3A is a diagram showing a state where the flexible wiring board 20 is arranged at a predetermined position of the printed wiring board 10 without displacement, and FIG. 3B is a view showing the flexible wiring board 20.
Shows a state in which the flexible wiring board 20 is arranged on the printed wiring board 10 with a slight deviation in the arrangement direction LT, and (c) shows that the flexible wiring board 20 is arranged on the printed wiring board 10 with a large deviation in the arrangement direction LT. FIG. 7D is a view showing a state in which the flexible wiring board 20 has the arrangement direction R.
The figure which shows the state at the time of arrange | positioning on the printed wiring board 10 with a large deviation toward T.
【図4】上記実施の形態のフレキシブル配線基板が斜め
にズレてプリント配線基板に実装された場合の状態を示
す平面図FIG. 4 is a plan view showing a state in which the flexible wiring board according to the above-described embodiment is mounted on a printed wiring board with an oblique displacement.
【図5】(a)は第2のダミー電極端子D1と電極端子
11との所定間隔Sを大きく設けた場合の図、(b)は
第2のダミー電極端子D1と電極端子11との所定間隔
Sを小さく設けた場合の図FIG. 5A is a diagram showing a case where a predetermined gap S between the second dummy electrode terminal D1 and the electrode terminal 11 is set large, and FIG. 5B is a diagram showing a predetermined gap between the second dummy electrode terminal D1 and the electrode terminal 11. Diagram when the spacing S is small
【図6】上記一実施の形態の他の例を示す図FIG. 6 is a diagram showing another example of the above embodiment.
【図7】従来の液晶パネルの斜視図FIG. 7 is a perspective view of a conventional liquid crystal panel.
【図8】従来のフレキシブル配線基板とプリント配線基
板との接続個所の拡大平面図FIG. 8 is an enlarged plan view of a connection point between a conventional flexible wiring board and a printed wiring board.
10 プリント配線基板 11 電極端子 20 フレキシブル配線基板 21 出力用電極端子 22 入力用電極端子 30、130 液晶セル 31a、31b ガラス基板 D1 第1のダミー電極端子(ダミー電極端子) D2 第2のダミー電極端子(ダミー電極端子) H1、H2 引き出し線 L 液晶パネル IC ドライバ素子 LT、RT 電極端子の配列方向 10 printed wiring board 11 electrode terminals 20 Flexible wiring board 21 Output electrode terminal 22 Input electrode terminals 30, 130 Liquid crystal cell 31a, 31b glass substrates D1 First dummy electrode terminal (dummy electrode terminal) D2 Second dummy electrode terminal (dummy electrode terminal) H1, H2 Lead line L LCD panel IC driver element LT, RT Electrode terminal arrangement direction
フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) G09F 9/35 G09F 9/35 H05K 1/11 H05K 1/11 Z 3/00 3/00 T 3/40 3/40 Z (72)発明者 藤田 光 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 田中 一成 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 新見 秀樹 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 2H092 GA40 GA50 GA51 GA61 JB77 NA29 NA30 PA01 PA05 PA06 5C094 AA41 AA43 BA43 DB02 DB05 EA01 EA03 GB10 5E317 AA02 BB02 BB03 GG20 5E344 AA02 BB02 BB04 CD04 DD10 EE23 5G435 AA17 AA19 BB12 EE40 EE47 KK05 KK09 KK10 Front page continuation (51) Int.Cl. 7 Identification code FI theme code (reference) G09F 9/35 G09F 9/35 H05K 1/11 H05K 1/11 Z 3/00 3/00 T 3/40 3/40 Z (72) Inventor Hikaru Fujita 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Kazushige Tanaka 1006 Kadoma, Kadoma City Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor New Hideki Miki 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 2H092 GA40 GA50 GA51 GA61 JB77 NA29 NA30 PA01 PA05 PA06 5C094 AA41 AA43 BA43 DB02 DB05 EA01 EA03 GB10 5E317 AA02 BB02 BB02 BB02 BB02 BB03 BB02 BB02A02 CD04 DD10 EE23 5G435 AA17 AA19 BB12 EE40 EE47 KK05 KK09 KK10
Claims (3)
端子を有する他方の配線基板との実装状態を検査する配
線基板の実装検査方法において、 一方の配線基板にその任意の一の電極端子と所定間隔を
設けて導通検査用のダミー電極端子を少なくとも一つ配
し、 一方の配線基板と他方の配線基板を重ね合わせた場合に
おける各電極端子の位置ズレを、前記検査用のダミー電
極端子と接触する他方の配線基板の電極端子を介して、
前記任意の一の電極端子と導通検査用のダミー電極端子
との導通状態の有無により検査することを特徴とする配
線基板の実装検査方法。1. A wiring board mounting inspection method for inspecting a mounting state of one wiring board having an electrode terminal and another wiring board having an electrode terminal, wherein one wiring board is provided with an arbitrary one of the electrode terminals. At least one dummy electrode terminal for continuity inspection is arranged at a predetermined interval, and the positional deviation of each electrode terminal when one wiring board and the other wiring board are overlapped with each other is the dummy electrode terminal for inspection. Via the electrode terminal of the other wiring board that contacts
A mounting inspection method for a wiring board, characterized by inspecting whether or not there is a conduction state between the arbitrary one electrode terminal and a dummy electrode terminal for conduction inspection.
は、前記電極端子の左右両側に配されていることを特徴
とする請求項1記載の配線基板の実装検査方法。2. The wiring board mounting inspection method according to claim 1, wherein the dummy electrode terminals of the one wiring board are arranged on both left and right sides of the electrode terminal.
晶層が挟持される液晶表示パネルの一方の基板であり、
前記一方の配線基板はこの一方の基板に対応して配され
るフレキシブル配線基板であるか、または、前記他方の
配線基板は一対の基板間に液晶層が挟持される液晶表示
パネルの一方の基板の外周に配されるフレキシブル配線
基板であり、前記一方の配線基板はこのフレキシブル配
線基板に対応して配されるプリント配線基板であること
を特徴とする請求項1又は請求項2記載の配線基板の実
装検査方法。3. The other wiring substrate is one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates,
The one wiring substrate is a flexible wiring substrate arranged corresponding to the one substrate, or the other wiring substrate is one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates. 3. The wiring board according to claim 1, wherein the wiring board is a flexible wiring board disposed on the outer periphery of the wiring board, and the one wiring board is a printed wiring board arranged corresponding to the flexible wiring board. Mounting inspection method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001356253A JP2003158354A (en) | 2001-11-21 | 2001-11-21 | Mount inspection method of wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001356253A JP2003158354A (en) | 2001-11-21 | 2001-11-21 | Mount inspection method of wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003158354A true JP2003158354A (en) | 2003-05-30 |
Family
ID=19167808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001356253A Pending JP2003158354A (en) | 2001-11-21 | 2001-11-21 | Mount inspection method of wiring board |
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Country | Link |
---|---|
JP (1) | JP2003158354A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008003114A (en) * | 2006-06-20 | 2008-01-10 | Rohm Co Ltd | Display device |
JP2008083138A (en) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Ind Co Ltd | Plasma display device |
JP2008141078A (en) * | 2006-12-05 | 2008-06-19 | Brother Ind Ltd | Connection structure of wiring board and connection inspecting method thereof |
JP2012226058A (en) * | 2011-04-18 | 2012-11-15 | Japan Display East Co Ltd | Display device |
JP2020101737A (en) * | 2018-12-25 | 2020-07-02 | セイコーエプソン株式会社 | Electro-optic device and electronic apparatus |
-
2001
- 2001-11-21 JP JP2001356253A patent/JP2003158354A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008003114A (en) * | 2006-06-20 | 2008-01-10 | Rohm Co Ltd | Display device |
JP2008083138A (en) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Ind Co Ltd | Plasma display device |
JP2008141078A (en) * | 2006-12-05 | 2008-06-19 | Brother Ind Ltd | Connection structure of wiring board and connection inspecting method thereof |
JP2012226058A (en) * | 2011-04-18 | 2012-11-15 | Japan Display East Co Ltd | Display device |
JP2020101737A (en) * | 2018-12-25 | 2020-07-02 | セイコーエプソン株式会社 | Electro-optic device and electronic apparatus |
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