JP2003139616A - Infrared detector and method for manufacturing the same - Google Patents
Infrared detector and method for manufacturing the sameInfo
- Publication number
- JP2003139616A JP2003139616A JP2001333559A JP2001333559A JP2003139616A JP 2003139616 A JP2003139616 A JP 2003139616A JP 2001333559 A JP2001333559 A JP 2001333559A JP 2001333559 A JP2001333559 A JP 2001333559A JP 2003139616 A JP2003139616 A JP 2003139616A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- detection element
- base
- infrared
- infrared detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、赤外線検出器及び
その製造方法に関し、特に赤外線検出素子を収納した容
器内が真空状態とされる赤外線検出器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared detector and a method for manufacturing the same, and more particularly to an infrared detector in which a container accommodating an infrared detecting element is in a vacuum state.
【０００２】[0002]
【従来の技術】図８は、従来の赤外線検出器を示す断面
図である。この赤外線検出器は、２次元アレイ状に画素
を配置した非冷却型の赤外線検出素子２、電子冷却素子
４、メタルプレート６、セラミックスプレート８、端子
１０、メタルリング１２、ウインドウ１４、メタルキャ
ップ１６、ワイヤボンディング１８、ゲッター２０、排
気管２２を含んで構成される。2. Description of the Related Art FIG. 8 is a sectional view showing a conventional infrared detector. This infrared detector includes an uncooled infrared detecting element 2 in which pixels are arranged in a two-dimensional array, an electronic cooling element 4, a metal plate 6, a ceramics plate 8, a terminal 10, a metal ring 12, a window 14, a metal cap 16. , Wire bonding 18, getter 20, and exhaust pipe 22.
【０００３】赤外線検出素子２は、２次元アレイ状に画
素を配置したイメージセンサであり、各画素は、入力す
る赤外線エネルギーによる温度変化をダイオード又は、
抵抗値の変化として検出する。この赤外線検出素子は非
冷却型であるが、所定温度範囲に維持される必要があ
る。この温度維持のために、ペルチェ効果を利用した電
子冷却素子４が設けられている。The infrared detecting element 2 is an image sensor in which pixels are arranged in a two-dimensional array, and each pixel is a diode or a temperature change caused by infrared energy input.
It is detected as a change in resistance. Although this infrared detection element is an uncooled type, it needs to be maintained within a predetermined temperature range. In order to maintain this temperature, the electronic cooling element 4 utilizing the Peltier effect is provided.
【０００４】端子１０は、検出器の内部の赤外線検出素
子２やゲッター２０と検出器の外部とを接続する電気的
端子であり、メタルプレート６に設けられた孔を貫通す
る。赤外線検出素子２と端子１０との間は、ワイヤボン
ディング１８で電気的に接続される。ゲッター２０は、
真空中への放出ガスを吸着する。The terminal 10 is an electrical terminal for connecting the infrared detecting element 2 inside the detector and the getter 20 to the outside of the detector, and penetrates a hole provided in the metal plate 6. The infrared detection element 2 and the terminal 10 are electrically connected by wire bonding 18. Getter 20
Adsorbs released gas into vacuum.
【０００５】メタルプレート６は金属材料で形成され、
電子冷却素子４及び赤外線検出素子２を支持する。端子
１０を通すためにメタルプレート６に開けられる孔は、
導電性を有するメタルプレート６と端子１０との短絡を
避けるために、端子１０の断面より大きく形成される。
セラミックスプレート８は、メタルプレート６と端子１
０とに気密接合され、それら両者間の隙間を塞ぎ、検出
器内部の気密を保つ。The metal plate 6 is made of a metal material,
The electronic cooling element 4 and the infrared detection element 2 are supported. The hole formed in the metal plate 6 for passing the terminal 10 is
In order to avoid a short circuit between the metal plate 6 having conductivity and the terminal 10, it is formed larger than the cross section of the terminal 10.
The ceramic plate 8 includes the metal plate 6 and the terminal 1.
It is airtightly joined to 0 and closes the gap between them to keep the inside of the detector airtight.
【０００６】メタルリング１２は金属材料で形成され、
メタルプレート６上に気密接合される。メタルキャップ
１６は金属材料で形成され、メタルリング１２に溶接接
合される。ウィンドウ１４は、赤外線を透過する材料で
形成され、メタルキャップ１６に設けられた開口に気密
接合される。The metal ring 12 is made of a metal material,
It is airtightly joined to the metal plate 6. The metal cap 16 is made of a metal material and is welded to the metal ring 12. The window 14 is formed of a material that transmits infrared rays, and is airtightly joined to the opening provided in the metal cap 16.
【０００７】排気管２２は、メタルプレート８を貫通
し、検出器の内部と外部とを連通する。The exhaust pipe 22 penetrates the metal plate 8 and connects the inside and the outside of the detector.
【０００８】上述のように赤外線検出素子２は、入射し
た赤外線エネルギーによる温度変化を検出するものであ
る。この赤外線検出器が高い温度分解能を得るために
は、入射した赤外線エネルギーが周囲に拡散しないよう
に内部を真空に保つ必要がある。そのため、検出器容器
を構成する各部相互の接合部は真空気密構造とされる。
排気管２２は、検出器の容器内部を真空に排気する際に
利用され、容器内部を真空に排気した後、つぶして封じ
る構造となっている。As described above, the infrared detecting element 2 detects the temperature change due to the incident infrared energy. In order for this infrared detector to obtain a high temperature resolution, it is necessary to maintain a vacuum inside so that the incident infrared energy does not diffuse to the surroundings. For this reason, the joints between the constituent parts of the detector container have a vacuum-tight structure.
The exhaust pipe 22 is used when the inside of the container of the detector is evacuated to a vacuum, and has a structure in which the inside of the container is evacuated to a vacuum and then crushed and sealed.
【０００９】図９は従来のゲッターを示す模式図であ
る。ゲッター２０はガスを吸着する機能を発揮するた
め、真空中にて４００〜９００℃に加熱する必要があ
る。この加熱のために、ゲッター２０はヒータを内蔵し
ており、端子１０を用いてヒータへの通電が行われる。FIG. 9 is a schematic view showing a conventional getter. Since the getter 20 exerts a function of adsorbing gas, it needs to be heated to 400 to 900 ° C. in vacuum. For this heating, the getter 20 has a built-in heater, and the terminal 10 is used to energize the heater.
【００１０】[0010]
【発明が解決しようとする課題】上述のような従来の赤
外線検出器では、容器内部を真空に排気するために、容
器内部を真空ポンプに連結するための排気管を有するた
め、部品点数が多く、低コスト化、小型化が妨げられる
という問題があった。また、ゲッターについては、ヒー
タを内蔵させるために、ゲッター製造の自動化が出来
ず、低コスト化が妨げられるという問題があった。The conventional infrared detector as described above has a large number of parts because it has an exhaust pipe for connecting the inside of the container to a vacuum pump in order to evacuate the inside of the container to a vacuum. However, there is a problem that cost reduction and miniaturization are hindered. Further, regarding the getter, since the heater is built in, there is a problem that the getter manufacturing cannot be automated and the cost reduction is hindered.
【００１１】本発明は上記問題点を解消するためになさ
れたもので、一層の低コスト化、小型化を実現する赤外
線検出器、及びその製造方法を提供することを目的とす
る。The present invention has been made to solve the above problems, and an object of the present invention is to provide an infrared detector which realizes further cost reduction and size reduction, and a manufacturing method thereof.
【００１２】[0012]
【課題を解決するための手段】本発明に係る赤外線検出
器は、赤外線検出素子と、当該赤外線検出素子が載置さ
れる基台と、当該基台上に被せられ前記赤外線検出素子
を内包する空間を気密封止するキャップとを含む赤外線
検出器において、前記キャップは、前記赤外線検出素子
を取り囲み、溶着材を介して前記基台に接合されるフラ
ンジ部を有し、前記フランジ部の内周側のエッジは面取
りされているものである。An infrared detector according to the present invention includes an infrared detection element, a base on which the infrared detection element is mounted, and an infrared detection element which is covered on the base. In an infrared detector including a cap that hermetically seals a space, the cap has a flange portion that surrounds the infrared detection element and is joined to the base via a welding material, and an inner circumference of the flange portion. The side edges are chamfered.
【００１３】他の本発明に係る赤外線検出器は、キャッ
プが、赤外線検出素子を取り囲み、溶着材を介して基台
に接合されるフランジ部と、外部から前記赤外線検出素
子への赤外線の入射を可能とする窓部とを有し、前記フ
ランジ部と前記基台との接合面は、前記溶着材との親和
性を高める表面加工を施され、前記キャップの前記窓部
及びその近傍領域は、前記表面加工を施されず、前記溶
着材との親和性が低いことを特徴とするものである。In the infrared detector according to another aspect of the present invention, the cap surrounds the infrared detection element, and the flange portion joined to the base through the welding material and the infrared radiation from the outside to the infrared detection element. Having a window portion that enables it, the joint surface between the flange portion and the base is subjected to a surface treatment that enhances the affinity with the welding material, and the window portion of the cap and a region in the vicinity thereof, It is characterized in that it is not subjected to the surface treatment and has a low affinity with the welding material.
【００１４】別の本発明に係る赤外線検出器は、キャッ
プが、開口を有したフレームと、前記フレームの開口に
溶着材を介して取り付けられ、外部から前記赤外線検出
素子への赤外線の入射を可能とする窓部とを有し、前記
フレームは、赤外線検出素子を取り囲み、溶着材を介し
て基台に接合されるフランジ部を有し、前記窓部と前記
開口との接合部分及び、前記フランジ部と前記基台との
接合部分はそれぞれ円形に構成されるものである。In another infrared detector according to the present invention, a cap is attached to a frame having an opening and an opening of the frame via a welding material, and infrared rays can be incident on the infrared detecting element from the outside. And a window portion, the frame surrounds the infrared detection element, and has a flange portion joined to the base via a welding material, a joint portion between the window portion and the opening, and the flange. The joint portion between the portion and the base is formed in a circular shape.
【００１５】さらに別の本発明に係る赤外線検出器は、
加熱により活性化され、気密封止された空間内のガスを
吸収するガス吸収部材を有し、キャップは、金属で形成
されたフレームを含み、前記フレームの内面に前記ガス
吸収部材が接着されるものである。Yet another infrared detector according to the present invention is
A gas absorbing member that is activated by heating and absorbs gas in the hermetically sealed space is provided, and the cap includes a frame formed of metal, and the gas absorbing member is bonded to an inner surface of the frame. It is a thing.
【００１６】本発明に係る赤外線検出器の製造方法は、
赤外線検出素子が載置された基台と、当該基台上に被せ
られ前記赤外線検出素子を内包する空間を気密封止する
キャップとを含む赤外線検出器の製造方法であって、前
記基台及び前記キャップが互いに分離した状態で、前記
基台、前記キャップ及びそれらを接合する溶着材を真空
雰囲気中にて、少なくとも前記溶着材の融点以上に加熱
する加熱ステップと、前記溶着材が溶融した状態及び前
記真空雰囲気を維持したまま、前記溶着材を介して前記
基台及び前記キャップを接合する接合ステップと、前記
基台及び前記キャップが接合された状態で、それらを前
記溶着材の融点未満に冷却する冷却する冷却ステップと
を有するものである。The manufacturing method of the infrared detector according to the present invention is as follows.
A method of manufacturing an infrared detector comprising a base on which an infrared detection element is mounted, and a cap which is covered on the base and hermetically seals a space containing the infrared detection element, wherein the base and A heating step of heating the base, the cap and the welding material joining them in the vacuum atmosphere to at least the melting point of the welding material or more in a state where the cap is separated from each other, and the welding material is melted. And, while maintaining the vacuum atmosphere, a joining step of joining the base and the cap via the welding material, and, in a state where the base and the cap are joined, reduce them to less than the melting point of the welding material. And a cooling step of cooling.
【００１７】[0017]
【発明の実施の形態】次に、本発明の実施形態について
図面を参照して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.
【００１８】［実施の形態１］図１は本発明の第１の実
施形態である赤外線検出器の概略の構造を示す断面図で
ある。赤外線検出素子５０は非冷却で動作可能な赤外線
イメージセンサであり、２次元アレイ状に配列された各
画素は、例えばダイオード型又はボロメータ型の赤外線
センサにより構成される。この赤外線検出素子は非冷却
型であるが、所定温度範囲に維持する必要がある。この
温度維持のために、ペルチェ効果を利用した電子冷却素
子５２を備える。電子冷却素子５２は、赤外線検出素子
５０の裏面に接し、赤外線検出素子５０の温度を制御す
る。[First Embodiment] FIG. 1 is a sectional view showing the schematic structure of an infrared detector according to the first embodiment of the present invention. The infrared detection element 50 is an infrared image sensor that can operate without cooling, and each pixel arranged in a two-dimensional array is configured by, for example, a diode type or bolometer type infrared sensor. Although this infrared detecting element is an uncooled type, it needs to be maintained within a predetermined temperature range. To maintain this temperature, the electronic cooling element 52 utilizing the Peltier effect is provided. The electronic cooling element 52 contacts the back surface of the infrared detection element 50 and controls the temperature of the infrared detection element 50.
【００１９】複数設けられた端子５４は、検出器の内部
の赤外線検出素子５０や電子冷却素子５２及びゲッター
５６と検出器の外部とを接続する電気的端子である。赤
外線検出素子５０と端子５４との間は、例えば金やアル
ミニウムを線材として用いたワイヤボンディング６０で
電気的に接続され、駆動信号の入力や赤外線検知信号の
出力がこれら端子５４を介して行われる。ゲッター５６
は例えばジルコニウム、バナジウム、鉄を焼結させて成
形したものであり、ヒータを内蔵する。そのヒータが端
子５４から通電され発熱することにより、ゲッター５６
は表面を活性化され、容器内の真空中への放出ガスを吸
着して真空の劣化を防止する。電子冷却素子５２は端子
５４から通電され、赤外線検出素子５０の温度を制御す
る。The plurality of terminals 54 are electrical terminals for connecting the infrared detecting element 50, the electronic cooling element 52 and the getter 56 inside the detector to the outside of the detector. The infrared detection element 50 and the terminal 54 are electrically connected by wire bonding 60 using, for example, gold or aluminum as a wire material, and a drive signal is input and an infrared detection signal is output through the terminal 54. . Getter 56
Is formed by sintering zirconium, vanadium, iron, for example, and has a built-in heater. When the heater is energized from the terminal 54 to generate heat, the getter 56
The surface is activated and the released gas in the vacuum in the container is adsorbed to prevent the deterioration of the vacuum. The electronic cooling element 52 is energized from the terminal 54 and controls the temperature of the infrared detection element 50.
【００２０】セラミックパッケージ５８は、例えば、ア
ルミナや窒化アルミナからなる積層セラミックスで形成
され、電子冷却素子５２、赤外線検出素子５０、端子５
４を支持する。また、セラミックパッケージ５８には、
例えば端子５４との電気的配線のために、導体パター
ン、スルーホールが形成される。セラミックパッケージ
５８の中央部と外周部との間には段差が設けられ、中央
部が低く形成され、ここに電子冷却素子５２及び赤外線
検出素子５０の積層体が載置される。一方、外周部上面
の内側寄りの領域には、導体パターンとして端子５４に
導通するボンディングパッドが形成され、これと赤外線
検出素子５０との間がワイヤボンディング６０により接
続される。The ceramic package 58 is made of, for example, a laminated ceramic made of alumina or alumina nitride, and has a thermoelectric cooler 52, an infrared detector 50, and a terminal 5.
Support 4. In addition, the ceramic package 58,
For example, a conductor pattern and a through hole are formed for electrical wiring with the terminal 54. A step is provided between the central portion and the outer peripheral portion of the ceramic package 58, the central portion is formed low, and the laminated body of the electronic cooling element 52 and the infrared detection element 50 is placed there. On the other hand, a bonding pad, which is a conductor pattern and is electrically connected to the terminal 54, is formed in the inner region of the upper surface of the outer peripheral portion, and the infrared detection element 50 and the bonding pad are connected by wire bonding 60.
【００２１】キャップ６２は、セラミックパッケージ５
８の上部を覆い、これにより、気密封止された空間が形
成され、当該空間内に赤外線検出素子５０が収納され
る。キャップ６２は、金属材料で形成されたメタルキャ
ップ６４（フレーム）と当該メタルキャップ６４に設け
られた開口６６に気密接続されるウィンドウ６８とを含
んで構成される。ウィンドウ６８は赤外線を透過する部
材であり、例えばゲルマニウムやシリコンで構成され
る。また開口６６は赤外線検出素子５０の受光面に対向
する位置に設けられる。このウィンドウ６８を介して、
外部の赤外線が赤外線検出素子５０に入射することがで
きる。メタルキャップ６４の縁にはフランジ部７０が設
けられ、このフランジ部７０がセラミックパッケージ５
８の外周部上面の外側寄りの領域に接合される。フラン
ジ部７０を設けることにより、メタルキャップ６４とセ
ラミックパッケージ５８との接合面積を確保することが
でき、赤外線検出素子５０が配置される内部空間の気密
の信頼性が向上する。The cap 62 is a ceramic package 5
The upper part of 8 is covered, thereby forming a hermetically sealed space, and the infrared detection element 50 is housed in the space. The cap 62 includes a metal cap 64 (frame) made of a metal material and a window 68 hermetically connected to an opening 66 provided in the metal cap 64. The window 68 is a member that transmits infrared rays, and is made of, for example, germanium or silicon. The opening 66 is provided at a position facing the light receiving surface of the infrared detection element 50. Through this window 68,
External infrared rays can enter the infrared detection element 50. A flange portion 70 is provided on the edge of the metal cap 64, and this flange portion 70 is used for the ceramic package 5.
The outer peripheral surface of the outer peripheral portion 8 is joined to the outer region. By providing the flange portion 70, the bonding area between the metal cap 64 and the ceramic package 58 can be secured, and the reliability of the airtightness of the internal space in which the infrared detection element 50 is arranged is improved.
【００２２】ウィンドウ６８とメタルキャップ６４と
は、例えば、酸化鉛系の低融点ガラス材７４を溶着材と
して用いて接合され、キャップ６２が形成される。キャ
ップ６２とセラミックパッケージ５８とは真空雰囲気中
で接合されることにより、内部空間が真空とされる。キ
ャップ６２のフランジ部７０とセラミックパッケージ５
８との接合は、はんだ等のロウ材７２を溶着材として用
いて行われる。The window 68 and the metal cap 64 are joined by using, for example, a lead oxide-based low melting point glass material 74 as a welding material to form the cap 62. By bonding the cap 62 and the ceramic package 58 in a vacuum atmosphere, the internal space is evacuated. Flange portion 70 of cap 62 and ceramic package 5
8 is joined by using a brazing material 72 such as solder as a welding material.
【００２３】図２は、フランジ部７０とセラミックパッ
ケージ５８との接合部分を拡大した断面図である。メタ
ルキャップ６４は、ウィンドウ６８が接合される水平な
上部平面部８０と、これに連なる垂直の側壁部８２と、
側壁部８２から外側へ水平に広がるフランジ部７０とを
有する。フランジ部７０の内周側のエッジは面取りさ
れ、傾斜した面取り面８４が形成される。ロウ材７２
は、この面取り面８４にて良好なフィレット８８を形成
することができ、接合強度及び気密性の向上が図られ
る。FIG. 2 is an enlarged sectional view of a joint portion between the flange portion 70 and the ceramic package 58. The metal cap 64 includes a horizontal upper flat surface portion 80 to which the window 68 is joined, and a vertical side wall portion 82 continuous with the horizontal upper flat surface portion 80.
And a flange portion 70 that horizontally extends outward from the side wall portion 82. The inner peripheral edge of the flange portion 70 is chamfered to form an inclined chamfered surface 84. Brazing material 72
A good fillet 88 can be formed on the chamfered surface 84, and the bonding strength and airtightness can be improved.
【００２４】図３は、他のフランジ部７０の形態におけ
る、フランジ部７０とセラミックパッケージ５８との接
合部分を拡大した断面図である。この形態では、フラン
ジ部７０の内周側のエッジは面取りされ、丸みを帯びた
丸取り面８６が形成される。この場合においても、ロウ
材７２は、この丸取り面８６にて良好なフィレット８８
を形成することができ、接合強度及び気密性の向上が図
られる。FIG. 3 is an enlarged sectional view of a joint portion between the flange portion 70 and the ceramic package 58 in another form of the flange portion 70. In this form, the edge on the inner peripheral side of the flange portion 70 is chamfered to form a rounded rounded surface 86. Even in this case, the brazing material 72 has a good fillet 88 on the rounded surface 86.
Can be formed, and the bonding strength and airtightness can be improved.
【００２５】［実施の形態２］本発明の第２の実施形態
に係る赤外線検出器は、上記第１の実施形態と概ね同じ
構成であり、以下、相違点のみ説明する。なお、上記第
１の実施形態と同様の構成要素については同じ符号を付
す。[Second Embodiment] An infrared detector according to a second embodiment of the present invention has substantially the same configuration as that of the first embodiment, and only the differences will be described below. The same components as those in the first embodiment are designated by the same reference numerals.
【００２６】図４は、キャップ６２の構成を説明するた
めの模式的な断面図である。本検出器の特徴は、キャッ
プ６２のフランジ部７０とセラミックパッケージ５８と
の接合面に、ロウ材７２との親和性を高める表面処理が
施される点にある。図４において、ロウ材７２が接触す
ることが期待される領域（表面処理領域１００）に当該
表面処理が施される。一方、キャップ６２の他の部分、
少なくともウィンドウ６８及びその近傍領域には当該表
面処理は施されない。例えば、ロウ材７２がはんだであ
る場合の表面処理は、ニッケルメッキし、その上に金メ
ッキを施す処理である。FIG. 4 is a schematic sectional view for explaining the structure of the cap 62. The feature of this detector is that the joint surface between the flange portion 70 of the cap 62 and the ceramic package 58 is subjected to a surface treatment for enhancing the affinity with the brazing material 72. In FIG. 4, the surface treatment is applied to a region (surface treatment region 100) where the brazing material 72 is expected to come into contact. On the other hand, the other part of the cap 62,
At least the window 68 and its vicinity are not subjected to the surface treatment. For example, when the brazing material 72 is solder, the surface treatment is nickel plating and then gold plating.
【００２７】これにより、キャップ６２とセラミックパ
ッケージ５８とを接合した際に、ロウ材７２の流れ出し
によるウィンドウ６８の汚染を防止することができ、ま
た接合面でのロウ材７２の厚さを均一にすることができ
る。Thus, when the cap 62 and the ceramic package 58 are joined together, the window 68 can be prevented from being contaminated due to the flow-out of the brazing material 72, and the thickness of the brazing material 72 at the joining surface can be made uniform. can do.
【００２８】［実施の形態３］本発明の第３の実施形態
に係る赤外線検出器は、上記第１の実施形態と概ね同じ
構成であり、以下、相違点のみ説明する。なお、上記第
１の実施形態と同様の構成要素については同じ符号を付
す。[Embodiment 3] An infrared detector according to a third embodiment of the present invention has substantially the same configuration as that of the first embodiment, and only differences will be described below. The same components as those in the first embodiment are designated by the same reference numerals.
【００２９】図５は、第３の実施形態に係る赤外線検出
器の特徴を説明する模式的な斜視図である。本検出器で
は、キャップ６２の上面形状が円形に構成される。すな
わち、メタルキャップ６４は円形であり、これに対応し
てフランジ部７０も円形に形成される。また、図には現
れていないが、赤外線の取り込み口となるメタルキャッ
プ６４の開口６６も円形に形成され、ウィンドウ６８も
円形に形成される。FIG. 5 is a schematic perspective view for explaining the features of the infrared detector according to the third embodiment. In this detector, the upper surface of the cap 62 has a circular shape. That is, the metal cap 64 has a circular shape, and the flange portion 70 correspondingly has a circular shape. Although not shown in the figure, the opening 66 of the metal cap 64, which serves as an infrared ray intake port, is also formed in a circular shape, and the window 68 is also formed in a circular shape.
【００３０】また、セラミックパッケージ５８の外周部
上面にはフランジ部７０と接合される円形領域に接合用
メタライズ１１０が施される。Further, on the upper surface of the outer peripheral portion of the ceramic package 58, a metallization 110 for joining is applied to a circular region joined to the flange portion 70.
【００３１】この構成では、フランジ部７０とセラミッ
クパッケージ５８との接合面は円形（ドーナツ形状）と
なる。またメタルキャップ６４とウィンドウ６８との接
合面も円形（ドーナツ形状）となる。この構造では、ロ
ウ材７２や低融点ガラス材７４が硬化時とその後の使用
時とでの温度差により、各接合部に発生する熱応力が接
合部の円周の各方向に対称、均一となる。すなわち、各
接合部に局所的な過大な応力が発生せず、各接合部での
クラック発生や気密漏れを防ぐことができる。また、赤
外線検出器の使用環境下で受ける温度サイクルにも強い
構造が得られる。In this structure, the joint surface between the flange portion 70 and the ceramic package 58 has a circular shape (a donut shape). The joining surface between the metal cap 64 and the window 68 is also circular (donut shape). In this structure, due to the temperature difference between the brazing material 72 and the low-melting-point glass material 74 during curing and subsequent use, the thermal stress generated in each joint is symmetrical and uniform in each direction of the circumference of the joint. Become. That is, local excessive stress does not occur at each joint, and cracking and airtight leakage at each joint can be prevented. In addition, a structure that is resistant to the temperature cycle under the usage environment of the infrared detector can be obtained.
【００３２】［実施の形態４］本発明の第４の実施形態
に係る赤外線検出器は、上記第１の実施形態と概ね同じ
構成であり、以下、相違点のみ説明する。なお、上記第
１の実施形態と同様の構成要素については同じ符号を付
す。[Fourth Embodiment] An infrared detector according to a fourth embodiment of the present invention has substantially the same structure as that of the first embodiment, and only the differences will be described below. The same components as those in the first embodiment are designated by the same reference numerals.
【００３３】図６は、第４の実施形態に係る赤外線検出
器の概略の構造を示す断面図である。本検出器では、メ
タルキャップ６４の内面にゲッター１２０が溶接接合さ
れる。このゲッター１２０はヒータを内蔵していない。
このゲッター１２０を活性化する場合には、キャップ６
２の外側に外部ヒータ１２２を当接させる。外部ヒータ
１２２はメタルキャップ６４にて当接され、外部ヒータ
１２２からの熱はメタルキャップ６４を介して、内側の
ゲッター１２０に伝達される。これによりゲッター１２
０が加熱され、活性化される。FIG. 6 is a sectional view showing a schematic structure of an infrared detector according to the fourth embodiment. In this detector, the getter 120 is welded to the inner surface of the metal cap 64. This getter 120 does not have a built-in heater.
When activating this getter 120, the cap 6
The external heater 122 is brought into contact with the outer side of 2. The external heater 122 is brought into contact with the metal cap 64, and heat from the external heater 122 is transferred to the inside getter 120 via the metal cap 64. This allows getter 12
0 is heated and activated.
【００３４】この構成では、ゲッター内にヒータを内蔵
する必要がなく、ゲッターを保持しヒータに通電する端
子、その他の通電用の配線を省略することができるの
で、部品点数削減による低コスト化を図ることができ
る。With this structure, it is not necessary to incorporate a heater in the getter, and terminals for holding the getter and energizing the heater and other wiring for energization can be omitted, so that the cost can be reduced by reducing the number of parts. Can be planned.
【００３５】［実施の形態５］本発明の第５の実施形態
は、上述の各赤外線検出器の製造方法に関するものであ
る。図７は、本発明の赤外線検出器を製造する方法を説
明する模式図である。本方法により製造される赤外線検
出器は、上記各実施形態と同じ構成であり、以下、上記
実施形態の赤外線検出器の構成要素の符号を参照して説
明を行う。[Fifth Embodiment] The fifth embodiment of the present invention relates to a method for manufacturing the above-mentioned infrared detectors. FIG. 7 is a schematic diagram illustrating a method for manufacturing the infrared detector of the present invention. The infrared detector manufactured by this method has the same configuration as that of each of the above-described embodiments, and hereinafter, description will be given with reference to the reference numerals of the constituent elements of the infrared detector of the above-described embodiment.
【００３６】図７は、キャップ６２とセラミックパッケ
ージ５８との接合を行う製造装置の模式図である。真空
チャンバ１３０内には、キャップ６２を加熱するための
ヒータ１３２と、セラミックパッケージ５８を加熱する
ためのヒータ１３４とが上下に配列される。上に位置す
るヒータ１３４には、電子冷却素子５２や赤外線検出素
子５０の載置等が行われたセラミックパッケージ５８が
セットされる。また下のヒータ１３２には、メタルキャ
ップ６４とウィンドウ６８とが接合され組み立て終わっ
たキャップ６２がセットされる。キャップ６２はアーム
１３６に支持され、このアーム１３６は、上下駆動装置
１３８に連結され、上下移動される。アーム１３６が下
に降ろされた状態で、真空チャンバ１３０内の真空引き
が開始され、またヒータ１３２，１３４への通電が開始
される。真空チャンバ１３０内が十分に真空引きされ、
またキャップ６２又はセラミックパッケージ５８の接合
部分に配置されたロウ材が溶融されると、上下駆動装置
１３８を動作させて、アーム１３６と共にキャップ６２
が上に移動され、キャップ６２がセラミックパッケージ
５８に加圧密着される。両者が接合された状態で、ヒー
タ１３２，１３４による加熱を停止し、冷却することに
より、ロウ材が固まり、内部が真空に引かれた赤外線検
出器が組み上がる。FIG. 7 is a schematic view of a manufacturing apparatus for joining the cap 62 and the ceramic package 58. Inside the vacuum chamber 130, a heater 132 for heating the cap 62 and a heater 134 for heating the ceramic package 58 are vertically arranged. A ceramic package 58 on which the electronic cooling element 52 and the infrared detection element 50 are mounted is set in the heater 134 located above. On the lower heater 132, the assembled cap 62 in which the metal cap 64 and the window 68 are joined is set. The cap 62 is supported by an arm 136, and this arm 136 is connected to a vertical drive device 138 and moved vertically. With the arm 136 lowered, the evacuation of the vacuum chamber 130 is started, and the heaters 132 and 134 are also energized. The inside of the vacuum chamber 130 is sufficiently evacuated,
Further, when the brazing material disposed at the joint portion of the cap 62 or the ceramic package 58 is melted, the vertical drive device 138 is operated and the cap 62 together with the arm 136 is operated.
Is moved upward, and the cap 62 is pressed and tightly attached to the ceramic package 58. In a state where the both are joined, the heating by the heaters 132 and 134 is stopped and the cooling is performed, so that the brazing material is solidified and the infrared detector whose inside is evacuated is assembled.
【００３７】このように、十分真空引きされた雰囲気中
にて、キャップ６２とセラミックパッケージ５８との加
熱、接合を行うことにより、加熱時に内部部品やはんだ
から放出されるガスを外部に排出することができ、内部
を高い真空状態にすることができる。As described above, by heating and bonding the cap 62 and the ceramic package 58 in a sufficiently evacuated atmosphere, the gas released from the internal parts and solder during heating is discharged to the outside. It is possible to create a high vacuum inside.
【００３８】[0038]
【発明の効果】本発明の赤外線検出器によれば、フラン
ジ部の内周側のエッジが面取りされることにより、キャ
ップと基台とを接合する溶着材が良好なフィレットを形
成し、接合強度及び気密性の向上が図られる。According to the infrared detector of the present invention, by chamfering the inner peripheral edge of the flange portion, the welding material for joining the cap and the base forms a good fillet, and the joining strength is improved. And the airtightness is improved.
【００３９】また他の本発明の赤外線検出器によれば、
フランジ部と基台とを接合する溶着材との親和性を高め
る表面加工が、フランジ部と基台との接合面に施され、
一方、窓部及びその近傍領域には施されない構成によ
り、キャップと基台とを接合した際に、溶着材の流れ出
しによる窓部の汚染を防止することができ、また接合面
での溶着材の厚さを均一にすることができる。According to another infrared detector of the present invention,
Surface processing that enhances compatibility with the welding material that joins the flange and the base is performed on the joint surface between the flange and the base,
On the other hand, since the structure is not applied to the window portion and its vicinity, it is possible to prevent the window portion from being contaminated due to the flow-out of the welding material when the cap and the base are joined, and to prevent the welding material on the joining surface from being contaminated. The thickness can be made uniform.
【００４０】別の本発明の赤外線検出器によれば、キャ
ップを構成する窓部とフレームとの接合部分、及びフラ
ンジ部と基台との接合部分がそれぞれ円形に構成される
ことにより、各接合部の溶着材が硬化した時とその後の
使用時とでの温度差により、各接合部に発生する熱応力
が接合部の円周の各方向に対称、均一となる。すなわ
ち、各接合部に局所的な過大な応力が発生せず、各接合
部でのクラック発生や気密漏れを防ぐことができる。ま
た、赤外線検出器の使用環境下で受ける温度サイクルに
も強い構造が得られる。According to another infrared detector of the present invention, since each of the joint portion between the window portion and the frame constituting the cap and the joint portion between the flange portion and the base are formed in a circular shape, each joint is formed. Due to the temperature difference between the time when the welding material of the portion is hardened and the time of subsequent use, the thermal stress generated in each joint is symmetrical and uniform in each direction of the circumference of the joint. That is, local excessive stress does not occur at each joint, and cracking and airtight leakage at each joint can be prevented. In addition, a structure that is resistant to the temperature cycle under the usage environment of the infrared detector can be obtained.
【００４１】さらに別の本発明の赤外線検出器によれ
ば、ガス吸着部材がキャップの金属製のフレームの内面
に接着されるので、このガス吸着部材を加熱して活性化
する処理をキャップの外部のヒータから行うことが可能
である。つまり、ガス吸着部材を活性化するためのヒー
タを内蔵する必要がなく、その内蔵ヒータに通電する端
子やその他の通電用の配線を省略することができるの
で、部品点数削減による低コスト化を図ることができ
る。According to still another infrared detector of the present invention, since the gas adsorbing member is adhered to the inner surface of the metal frame of the cap, the process of heating and activating the gas adsorbing member is performed outside the cap. It can be performed from the heater. That is, it is not necessary to incorporate a heater for activating the gas adsorbing member, and terminals for energizing the built-in heater and other wiring for energization can be omitted, so that cost reduction can be achieved by reducing the number of parts. be able to.
【００４２】本発明の赤外線検出器の製造方法によれ
ば、基台及びキャップが分離した状態で、真空雰囲気中
にて加熱して溶着材を溶融し、両者を接合することによ
り、加熱時に内部部品や溶着材から放出されるガスを外
部に排出することができ、内部を高い真空状態にするこ
とができる。また、基台とキャップとを接合後に真空に
引くための排気管が不要となり、部品点数削減による低
コスト化を図ることができる効果が得られる。According to the method for manufacturing an infrared detector of the present invention, in the state where the base and the cap are separated, heating is performed in a vacuum atmosphere to melt the welding material, and the two are joined to each other, so that the inside is heated. The gas released from the parts and the welding material can be discharged to the outside, and the inside can be brought to a high vacuum state. Further, an exhaust pipe for drawing a vacuum after joining the base and the cap is not required, and an effect that the cost can be reduced by reducing the number of parts can be obtained.
【図１】 本発明の第１の実施形態である赤外線検出器
の概略の構造を示す断面図である。FIG. 1 is a sectional view showing a schematic structure of an infrared detector that is a first embodiment of the present invention.
【図２】 フランジ部とセラミックパッケージとの接合
部分の一例の拡大した断面図である。FIG. 2 is an enlarged cross-sectional view of an example of a joint portion between a flange portion and a ceramic package.
【図３】 フランジ部とセラミックパッケージとの接合
部分の他の例の拡大した断面図である。FIG. 3 is an enlarged cross-sectional view of another example of the joint portion between the flange portion and the ceramic package.
【図４】 本発明の第２の実施形態である赤外線検出器
におけるキャップの構成を説明するための模式的な断面
図である。FIG. 4 is a schematic cross-sectional view for explaining the configuration of a cap in an infrared detector that is a second embodiment of the present invention.
【図５】 本発明の第３の実施形態である赤外線検出器
の特徴を説明する模式的な斜視図である。FIG. 5 is a schematic perspective view illustrating characteristics of an infrared detector that is a third embodiment of the present invention.
【図６】 本発明の第４の実施形態である赤外線検出器
の概略の構造を示す断面図である。FIG. 6 is a sectional view showing a schematic structure of an infrared detector according to a fourth embodiment of the present invention.
【図７】 本発明の赤外線検出器を製造する方法を説明
するための製造装置の模式図である。FIG. 7 is a schematic view of a manufacturing apparatus for explaining a method for manufacturing the infrared detector of the present invention.
【図８】 従来の赤外線検出器を示す断面図である。FIG. 8 is a cross-sectional view showing a conventional infrared detector.
【図９】 従来のゲッターを示す模式図である。FIG. 9 is a schematic view showing a conventional getter.
５０ 赤外線検出素子、５２ 電子冷却素子、５４ 端
子、５６，１２０ ゲッター、５８ セラミックパッケ
ージ、６０ ワイヤボンディング、６２ キャップ、６
４ メタルキャップ、６８ ウィンドウ、７０ フラン
ジ部、７２ ロウ材、７４ 低融点ガラス材、８４ 面
取り面、８６ 丸取り面、１００ 表面処理領域、１１
０ 接合用メタライズ、１２２ 外部ヒータ、１３０
真空チャンバ、１３２，１３４ ヒータ、１３６ アー
ム、１３８ 上下駆動装置。50 infrared detection element, 52 electronic cooling element, 54 terminals, 56, 120 getter, 58 ceramic package, 60 wire bonding, 62 cap, 6
4 metal cap, 68 window, 70 flange part, 72 brazing material, 74 low melting glass material, 84 chamfered surface, 86 rounded surface, 100 surface treatment area, 11
0 bonding metallization, 122 external heater, 130
Vacuum chamber, 132,134 heater, 136 arm, 138 vertical drive device.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2G065 AA11 AB02 BA12 BA14 BA34 BA37 BA38 CA19 CA21 DA18 2G066 BA09 BA44 BA53 BA55 BA60 BB11 CA02 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 2G065 AA11 AB02 BA12 BA14 BA34 BA37 BA38 CA19 CA21 DA18 2G066 BA09 BA44 BA53 BA55 BA60 BB11 CA02
Claims (5)
が載置される基台と、当該基台上に被せられ前記赤外線
検出素子を内包する空間を気密封止するキャップとを含
む赤外線検出器において、 前記キャップは、前記赤外線検出素子を取り囲み、溶着
材を介して前記基台に接合されるフランジ部を有し、 前記フランジ部の内周側のエッジは面取りされているこ
と、 を特徴とする赤外線検出器。1. An infrared detector including an infrared detection element, a base on which the infrared detection element is mounted, and a cap which is placed on the base and hermetically seals a space containing the infrared detection element. In the above, the cap has a flange portion that surrounds the infrared detection element and is joined to the base via a welding material, and an edge on an inner peripheral side of the flange portion is chamfered. Infrared detector.
が載置される基台と、当該基台上に被せられ前記赤外線
検出素子を内包する空間を気密封止するキャップとを含
む赤外線検出器において、 前記キャップは、 前記赤外線検出素子を取り囲み、溶着材を介して前記基
台に接合されるフランジ部と、 外部から前記赤外線検出素子への赤外線の入射を可能と
する窓部と、を有し、 前記フランジ部と前記基台との接合面は、前記溶着材と
の親和性を高める表面加工を施され、 前記キャップの前記窓部及びその近傍領域は、前記表面
加工を施されず、前記溶着材との親和性が低いこと、 を特徴とする赤外線検出器。2. An infrared detector comprising an infrared detection element, a base on which the infrared detection element is mounted, and a cap which is placed on the base and hermetically seals a space containing the infrared detection element. In the above, the cap has a flange portion that surrounds the infrared detection element and is joined to the base through a welding material, and a window portion that allows infrared rays to enter the infrared detection element from the outside. However, the joint surface between the flange portion and the base is subjected to a surface treatment for enhancing the affinity with the welding material, the window portion of the cap and the vicinity thereof are not subjected to the surface treatment, An infrared detector having a low affinity with the welding material.
が載置される基台と、当該基台上に被せられ前記赤外線
検出素子を内包する空間を気密封止するキャップとを含
む赤外線検出器において、 前記キャップは、 開口を有したフレームと、 前記フレームの開口に溶着材を介して取り付けられ、外
部から前記赤外線検出素子への赤外線の入射を可能とす
る窓部と、を有し、 前記フレームは、前記赤外線検出素子を取り囲み、溶着
材を介して前記基台に接合されるフランジ部を有し、 前記窓部と前記開口との接合部分及び、前記フランジ部
と前記基台との接合部分はそれぞれ円形に構成されるこ
と、 を特徴とする赤外線検出器。3. An infrared detector including an infrared detection element, a base on which the infrared detection element is mounted, and a cap that covers the base and hermetically seals a space containing the infrared detection element. In the above, the cap has a frame having an opening, and a window part that is attached to the opening of the frame through a welding material and allows infrared rays to enter the infrared detection element from the outside. The frame has a flange portion that surrounds the infrared detection element and is joined to the base through a welding material, a joint portion between the window portion and the opening, and a joint between the flange portion and the base. The infrared detector is characterized in that each part is formed in a circular shape.
が載置される基台と、当該基台上に被せられ前記赤外線
検出素子を内包する空間を気密封止するキャップとを含
む赤外線検出器において、 加熱により活性化され、前記気密封止された空間内のガ
スを吸収するガス吸収部材を有し、 前記キャップは、金属で形成されたフレームを含み、 前記フレームの内面に前記ガス吸収部材が接着されるこ
と、 を特徴とする赤外線検出器。4. An infrared detector including an infrared detection element, a base on which the infrared detection element is mounted, and a cap which is placed on the base and hermetically seals a space containing the infrared detection element. In, there is a gas absorbing member that is activated by heating and absorbs gas in the hermetically sealed space, the cap includes a frame formed of metal, and the gas absorbing member is provided on an inner surface of the frame. The infrared detector is characterized by being adhered.
該基台上に被せられ前記赤外線検出素子を内包する空間
を気密封止するキャップとを含む赤外線検出器の製造方
法であって、 前記基台及び前記キャップが互いに分離した状態で、前
記基台、前記キャップ及びそれらを接合する溶着材を真
空雰囲気中にて、少なくとも前記溶着材の融点以上に加
熱する加熱ステップと、 前記溶着材が溶融した状態及び前記真空雰囲気を維持し
たまま、前記溶着材を介して前記基台及び前記キャップ
を接合する接合ステップと、 前記基台及び前記キャップが接合された状態で、それら
を前記溶着材の融点未満に冷却する冷却する冷却ステッ
プと、 を有することを特徴とする製造方法。5. A method of manufacturing an infrared detector, comprising: a base on which an infrared detection element is placed; and a cap that covers the base and hermetically seals a space containing the infrared detection element. A heating step of heating the base, the cap and the welding material joining them in the vacuum atmosphere to at least the melting point of the welding material or more in a state where the base and the cap are separated from each other; A joining step of joining the base and the cap through the welding material while maintaining the molten state of the material and the vacuum atmosphere; and welding the base and the cap in a joined state. And a cooling step of cooling to below the melting point of the material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001333559A JP3913037B2 (en) | 2001-10-30 | 2001-10-30 | Infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001333559A JP3913037B2 (en) | 2001-10-30 | 2001-10-30 | Infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003139616A true JP2003139616A (en) | 2003-05-14 |
| JP3913037B2 JP3913037B2 (en) | 2007-05-09 |
Family
ID=19148804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001333559A Expired - Lifetime JP3913037B2 (en) | 2001-10-30 | 2001-10-30 | Infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3913037B2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007505300A (en) * | 2003-09-09 | 2007-03-08 | ブラウン ゲーエムベーハー | Heatable infrared sensor and infrared thermometer with infrared sensor |
| JP2007073721A (en) * | 2005-09-07 | 2007-03-22 | Nissan Motor Co Ltd | Vacuum package and method for manufacturing same |
| JP2007533160A (en) * | 2004-04-15 | 2007-11-15 | サエス ゲッターズ ソシエタ ペル アチオニ | Integrated getter for vacuum or inert gas package LED |
| US7479635B2 (en) | 2007-01-25 | 2009-01-20 | Showa Optronics Co., Ltd. | Infrared detector package |
| JP2010054262A (en) * | 2008-08-27 | 2010-03-11 | Kyocera Corp | Window member for sensor, and package for sensor and sensor device using the same |
| WO2010095367A1 (en) | 2009-02-19 | 2010-08-26 | 日本電気株式会社 | Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package |
| US7851903B2 (en) | 2007-06-04 | 2010-12-14 | Showa Optronics Co., Ltd. | Infrared detector with plurality of metallization between first and second container members |
| EP2272516A2 (en) | 2002-11-20 | 2011-01-12 | Japan Tobacco, Inc. | 4-Oxoquinoline compound and use thereof as HIV integrase inhibitor |
| CN102564595A (en) * | 2011-12-14 | 2012-07-11 | 北京卫星环境工程研究所 | Infrared thermal-wave detecting system for vacuum low-temperature environment |
| US8525323B2 (en) | 2008-07-25 | 2013-09-03 | Nec Corporation | Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105136314B (en) * | 2015-08-24 | 2018-11-06 | 北京环境特性研究所 | The implementation method and device of thermal infrared imager under a kind of vacuum low-temperature environment |
-
2001
- 2001-10-30 JP JP2001333559A patent/JP3913037B2/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2272516A2 (en) | 2002-11-20 | 2011-01-12 | Japan Tobacco, Inc. | 4-Oxoquinoline compound and use thereof as HIV integrase inhibitor |
| EP3406596A1 (en) | 2002-11-20 | 2018-11-28 | Japan Tobacco Inc. | 4-oxoquinoline compound and use thereof as hiv integrase inhibitor |
| EP4059923A1 (en) | 2002-11-20 | 2022-09-21 | Japan Tobacco Inc. | 4-oxoquinoline compound and use thereof as hiv integrase inhibitor |
| JP2007505300A (en) * | 2003-09-09 | 2007-03-08 | ブラウン ゲーエムベーハー | Heatable infrared sensor and infrared thermometer with infrared sensor |
| JP2007533160A (en) * | 2004-04-15 | 2007-11-15 | サエス ゲッターズ ソシエタ ペル アチオニ | Integrated getter for vacuum or inert gas package LED |
| JP2007073721A (en) * | 2005-09-07 | 2007-03-22 | Nissan Motor Co Ltd | Vacuum package and method for manufacturing same |
| US7479635B2 (en) | 2007-01-25 | 2009-01-20 | Showa Optronics Co., Ltd. | Infrared detector package |
| US7851903B2 (en) | 2007-06-04 | 2010-12-14 | Showa Optronics Co., Ltd. | Infrared detector with plurality of metallization between first and second container members |
| US8525323B2 (en) | 2008-07-25 | 2013-09-03 | Nec Corporation | Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package |
| JP2010054262A (en) * | 2008-08-27 | 2010-03-11 | Kyocera Corp | Window member for sensor, and package for sensor and sensor device using the same |
| WO2010095367A1 (en) | 2009-02-19 | 2010-08-26 | 日本電気株式会社 | Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package |
| CN102564595A (en) * | 2011-12-14 | 2012-07-11 | 北京卫星环境工程研究所 | Infrared thermal-wave detecting system for vacuum low-temperature environment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3913037B2 (en) | 2007-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106470938B (en) | Method for manufacturing the device including hermetically sealed vacuum casting and getter | |
| JP3913037B2 (en) | Infrared detector | |
| JP3853234B2 (en) | Infrared detector | |
| US20060060785A1 (en) | Component for detecting electromagnetic radiation, particularly infrared radiation, infrared optical imaging unit including such a component and process for implementing it | |
| JP2013222735A (en) | Infrared ray sensor package, infrared ray sensor module, and electronic apparatus | |
| CN100411183C (en) | Infrared imaging sensor and its vacuum packing method | |
| JP2008298708A (en) | Infrared detector and manufacturing method thereof | |
| US7084010B1 (en) | Integrated package design and method for a radiation sensing device | |
| JP4758118B2 (en) | Infrared detector and gas adsorption means activation method for infrared detector | |
| TWI613429B (en) | Infrared sensor with high-vacuum packaging structure and method for packaging the same | |
| JPH09229765A (en) | Infrared detector | |
| JP2006145610A (en) | Package for housing optical component | |
| US5296710A (en) | Infrared radiation detector | |
| JP4862325B2 (en) | Vacuum package and manufacturing method thereof | |
| JPH10132654A (en) | Container for infrared detection element, and production thereof | |
| TW201533855A (en) | Device package method and structure thereof | |
| JP3422193B2 (en) | Infrared detector | |
| JPH09126882A (en) | Infrared picture detector, its manufacture, and die-bonding jig | |
| KR101632975B1 (en) | Method for manufacturing an infrared sensor package and infrafed sensor package by the same | |
| US20130186945A1 (en) | Manufacturing method for electronic device and electronic device manufacturing apparatus | |
| US5386920A (en) | Vacuum package tubeless enclosure with self-welded flanges | |
| WO2023090002A1 (en) | Semiconductor device, electronic apparatus, and manufacturing method for semiconductor device | |
| JP2008216174A (en) | Infrared detector and method of manufacturing the same | |
| JP4950262B2 (en) | Method for activating gas adsorption means of infrared detector | |
| JPH08247840A (en) | Electron cooling type infrared-ray detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040426 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20040426 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060803 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060815 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061012 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061107 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061228 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070115 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070130 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070130 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 3913037 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100209 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110209 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120209 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130209 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130209 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140209 Year of fee payment: 7 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |