JP2003109435A - Transparent conductive film and its manufacturing method - Google Patents
Transparent conductive film and its manufacturing methodInfo
- Publication number
- JP2003109435A JP2003109435A JP2002227332A JP2002227332A JP2003109435A JP 2003109435 A JP2003109435 A JP 2003109435A JP 2002227332 A JP2002227332 A JP 2002227332A JP 2002227332 A JP2002227332 A JP 2002227332A JP 2003109435 A JP2003109435 A JP 2003109435A
- Authority
- JP
- Japan
- Prior art keywords
- transparent conductive
- conductive film
- pattern
- electroless plating
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種表示装置の漏
洩電磁波遮蔽膜、各種電子デバイスの透明電極、または
透明面状発熱体等として有用な高い透明性と導電性を兼
ね備えた透明導電膜およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent conductive film having both high transparency and conductivity, which is useful as a leakage electromagnetic wave shielding film for various display devices, a transparent electrode for various electronic devices, or a transparent planar heating element. The manufacturing method is related.
【０００２】[0002]
【従来の技術】従来、ＣＲＴ，ＰＤＰ，液晶ディスプレ
イ等の各種表示装置の漏洩電磁波遮蔽膜、各種電子デバ
イスの透明電極、または透明面状発熱体等として用いら
れる透明導電膜には、導電性メッシュを透明基体に貼り
付けたもの、金属やＩＴＯ等の導電性材料を蒸着やスパ
ッタリングによって透明基体上に形成したもの、および
特開平 5-16281号公報、特開平 5-283889 号公報に開示
されているような透明導電膜があった。2. Description of the Related Art Conventionally, a conductive mesh is used as a transparent conductive film used as a leakage electromagnetic wave shielding film for various display devices such as CRTs, PDPs, liquid crystal displays, transparent electrodes of various electronic devices, or transparent heating elements. Is attached to a transparent substrate, a conductive material such as metal or ITO is formed on the transparent substrate by vapor deposition or sputtering, and disclosed in JP-A-5-16281 and JP-A-5-283889. There was such a transparent conductive film.
【０００３】これらの公報に開示された透明導電膜の概
要は、以下のようにして製造されたものである。
透明基体上に親水性透明樹脂層を形成し、メッキ触
媒を吸着させる。
親水性透明樹脂層上に無電解メッキ層を形成する。
親水性透明樹脂層を黒色にする。
無電解メッキ層上にパターン状のレジスト部を形成
する。
非レジスト部をエッチングにより除去しパターン化
された透明導電膜を形成する。The outline of the transparent conductive film disclosed in these publications is manufactured as follows. A hydrophilic transparent resin layer is formed on a transparent substrate to adsorb a plating catalyst. An electroless plating layer is formed on the hydrophilic transparent resin layer. Make the hydrophilic transparent resin layer black. A patterned resist portion is formed on the electroless plating layer. The non-resist portion is removed by etching to form a patterned transparent conductive film.
【０００４】〔問題点〕前記従来の透明導電膜では、次
に示すような多様な問題点があった。導電性メッシュを
透明基体に貼り付けた場合には、金属製メッシュや、繊
維の表面を金属でメッキしたメッシュが用いられる。そ
れぞれのメッシュは規格の定まったものが用いられるた
めに、メッシュの線幅やピッチを自由に変更することが
難しく、特に、線幅を小さくするには限界があり、視認
性に劣るものであった。また、視認性を高めるためにメ
ッシュ表面を黒色化し、メッシュ表面の反射を抑えよう
とする場合、工程が煩雑となり、コストが高くなる。[Problems] The conventional transparent conductive film has various problems as described below. When the conductive mesh is attached to the transparent substrate, a metal mesh or a mesh in which the surface of the fiber is plated with metal is used. Since each mesh has a specified standard, it is difficult to freely change the line width and pitch of the mesh.Especially, there is a limit to reducing the line width and the visibility is poor. It was In addition, when the mesh surface is blackened in order to improve visibility and the reflection of the mesh surface is suppressed, the process becomes complicated and the cost increases.
【０００５】金属やＩＴＯ等の導電性材料を蒸着やスパ
ッタリングによって透明基体上に形成した場合には、金
属光沢のため視認性が悪く、また、充分な導電性を得る
ために膜厚を厚くすると、光が吸収されるため、著しく
透過性が悪くなる。また、ＩＴＯ等の透明導電性材料の
膜では、導電性が低く、用途が限定され、かつ高価であ
る。When a conductive material such as metal or ITO is formed on a transparent substrate by vapor deposition or sputtering, visibility is poor due to metallic luster, and if the film thickness is increased to obtain sufficient conductivity. Since the light is absorbed, the transparency is significantly deteriorated. In addition, a film of a transparent conductive material such as ITO has low conductivity, its use is limited, and it is expensive.
【０００６】公報記載の透明導電膜の場合には、透明基
体上に親水性透明樹脂層を形成して製造されたものであ
るため、製造工程が複雑となり、コスト的にも高価にな
る。また、黒色化された親水性樹脂層は、無電解メッキ
時に析出した微細金属粒子により遮光されるものである
が、黒色度が充分でなく、金属微粒子による反射があ
り、また、透明導電膜を斜視した場合には金属光沢色が
目立つ。In the case of the transparent conductive film described in the publication, since it is manufactured by forming a hydrophilic transparent resin layer on a transparent substrate, the manufacturing process becomes complicated and the cost becomes high. Further, the blackened hydrophilic resin layer is shielded by the fine metal particles deposited during electroless plating, but the blackness is not sufficient and there is reflection by the metal fine particles, and the transparent conductive film is formed. When viewed obliquely, a metallic luster color is noticeable.
【０００７】[0007]
【発明が解決しようとする課題】本発明は前記課題を解
決するために成されたものであり、そのための課題は、
金属微粒子による反射や金属光沢の程度が少なく高い透
明性と導電性とを兼ね備えた透明導電膜、および、複雑
な工程を必要とせず製造が容易で安価にできる透明導電
膜の製造方法を提供することにある。The present invention has been made to solve the above problems, and the problems to be solved by the present invention are as follows.
Provided are a transparent conductive film having a high degree of transparency and conductivity with little degree of reflection and metallic luster due to metal fine particles, and a method of manufacturing a transparent conductive film which does not require complicated steps and can be manufactured easily and at low cost. Especially.
【０００８】[0008]
【課題を解決するための手段】本発明における請求項１
に係る透明導電膜は、透明基体表面に所定のパターンに
形成された金属超微粒子触媒層と、この金属超微粒子触
媒層上に形成された金属層とからなり、前記パターンの
平均開口径と平均線幅との比が平均開口径／平均線幅≧
７であることを特徴とするものである。[Means for Solving the Problems] Claim 1 in the present invention
The transparent conductive film according to, comprises a metal ultrafine particle catalyst layer formed in a predetermined pattern on the surface of a transparent substrate, and a metal layer formed on the metal ultrafine particle catalyst layer. The ratio with the line width is the average aperture diameter / average line width ≧
It is characterized by being 7.
【０００９】請求項２に係る透明導電膜は、前記所定の
パターンが格子状あるいは網目状であることを特徴とす
る。請求項３に係る透明導電膜は、 前記金属超微粒子
触媒層が貴金属超微粒子からなることを特徴とする。請
求項４に係る透明導電膜は、前記金属層がＡｕ，Ａｇ，
Ｃｕ，Ｃｒ，Ｎｉ，Ｓｎ，Ｚｎ，Ｃｏの１種以上を含有
することを特徴とする。The transparent conductive film according to a second aspect of the present invention is characterized in that the predetermined pattern has a lattice shape or a mesh shape. The transparent conductive film according to claim 3 is characterized in that the metal ultrafine particle catalyst layer is made of noble metal ultrafine particles. In the transparent conductive film according to claim 4, the metal layer is Au, Ag,
It is characterized by containing at least one of Cu, Cr, Ni, Sn, Zn and Co.
【００１０】また、請求項５に係る透明導電膜は、透明
基体表面上に無電解メッキ触媒を含有するペーストでパ
ターン印刷を行い、このパターン印刷された無電解メッ
キ触媒上に無電解メッキ処理を施して、パターン印刷部
のみに金属層を形成させることを特徴とするものであ
る。Further, the transparent conductive film according to claim 5 is pattern printed on the surface of the transparent substrate with a paste containing an electroless plating catalyst, and electroless plating is performed on the pattern printed electroless plating catalyst. It is characterized in that the metal layer is formed only on the pattern printing portion.
【００１１】請求項６に係る透明導電膜の製造方法は、
前記ペーストが前記無電解メッキ触媒として貴金属超微
粒子を含有することを特徴とする。請求項７に係る透明
導電膜の製造方法は、前記ペーストがチキソトロピー性
を有することを特徴とする。請求項８に係る透明導電膜
の製造方法は、前記ペーストが黒色顔料を含むものであ
ることを特徴とする。請求項９に係る透明導電膜の製造
方法は、前記パターン印刷がスクリーン印刷であること
を特徴とする。A method of manufacturing a transparent conductive film according to claim 6 is
The paste contains ultrafine noble metal particles as the electroless plating catalyst. In the method for manufacturing a transparent conductive film according to a seventh aspect, the paste has thixotropic properties. The method for manufacturing a transparent conductive film according to claim 8 is characterized in that the paste contains a black pigment. The method for manufacturing a transparent conductive film according to a ninth aspect is characterized in that the pattern printing is screen printing.
【００１２】[0012]
【発明の実施の形態】以下、本発明の実施の形態を具体
的に説明する。ただし、この実施の形態は、発明の趣旨
をより良く理解させるため具体的に説明するものであ
り、特に指定のない限り、発明内容を限定するものでは
ない。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below. However, this embodiment is specifically described for better understanding of the gist of the invention, and does not limit the content of the invention unless otherwise specified.
【００１３】〔透明導電膜〕この実施の形態では、スク
リーン印刷によりパターン印刷を行って、ガラスまたは
プラスチック等の透明基板表面に、所定のパターンを有
する無電解メッキ触媒層を形成し、次いで、無電解メッ
キ処理を施すことによって、無電解メッキ触媒層上に金
属層を形成させ、複雑な工程を必要とせずに、容易に、
所定のパターンを形成した金属層を有する透明導電膜を
製造することができ、この方法によって製造された透明
導電膜は、高い導電性と透明性とを兼ね備える。[Transparent Conductive Film] In this embodiment, pattern printing is performed by screen printing to form an electroless plating catalyst layer having a predetermined pattern on the surface of a transparent substrate such as glass or plastic. By performing electrolytic plating treatment, a metal layer is formed on the electroless plating catalyst layer, and it is possible to easily and easily without the need for complicated steps.
A transparent conductive film having a metal layer having a predetermined pattern can be manufactured, and the transparent conductive film manufactured by this method has both high conductivity and transparency.
【００１４】所定のパターンとしては、格子状、網目
状、ストライプ状等に形成することができ、特に、格子
状または網目状に形成することが好ましい。このように
して所定のパターンを形成した金属層を有する透明導電
膜では、その開口率を 60 ％以上とすることで、ＣＲ
Ｔ，ＰＤＰ，液晶ディスプレイ等の各種表示装置におけ
る漏洩電磁波遮蔽膜として必要とされる高い透明性を得
ることができる。The predetermined pattern can be formed in a lattice shape, a mesh shape, a stripe shape, or the like, and it is particularly preferable to form the lattice pattern or the mesh shape. In the transparent conductive film having the metal layer on which the predetermined pattern is formed in this way, by setting the aperture ratio to 60% or more, the CR
It is possible to obtain high transparency required as a leakage electromagnetic wave shielding film in various display devices such as T, PDP and liquid crystal displays.
【００１５】〔無電解メッキ触媒〕使用可能な無電解メ
ッキ触媒としては、Ｐｄ，Ａｕ，Ａｇ，Ｐｔ等の貴金属
超微粒子が挙げられる。[Electroless Plating Catalyst] Examples of the electroless plating catalyst that can be used include noble metal ultrafine particles such as Pd, Au, Ag and Pt.
【００１６】〔無電解メッキ触媒担持体〕無電解メッキ
触媒として、Ｐｄ，Ａｕ，Ａｇ，Ｐｔ等の貴金属超微粒
子を用いた場合、無電解メッキ触媒担持体としては、前
記無電解メッキ触媒と反対の表面電荷をもった粒子とし
て微細アルミナゲル、シリカゲル等を用いることが好ま
しい。[Electroless Plating Catalyst Carrier] When noble metal ultrafine particles such as Pd, Au, Ag and Pt are used as the electroless plating catalyst, the electroless plating catalyst carrier is opposite to the above electroless plating catalyst. It is preferable to use fine alumina gel, silica gel or the like as the particles having the surface charge.
【００１７】〔ペースト〕パターン印刷を行う場合に用
いるペーストは、特に制限はなく、触媒粒子間および触
媒粒子と基材との間をそれぞれ結合させるための接着性
が良いものが望ましく、その中でも粘度が高いものが好
ましい。また、分散剤、消泡脱泡剤、リベリング剤等
を、適宜、添加することができる。ペーストの粘度は 1
0 〜 1000 Ｐａ・ｓｅｃ（10000 〜 1000000ｃＰ）、好
ましくは 50 〜 500Ｐａ・ｓｅｃ（ 50000〜 500000 ｃ
Ｐ）とする。[Paste] The paste used when performing pattern printing is not particularly limited, and it is desirable that the paste has good adhesiveness for bonding between the catalyst particles and between the catalyst particles and the base material. It is preferable that the value is high. Further, a dispersant, a defoaming defoaming agent, a leveling agent and the like can be added as appropriate. Paste viscosity is 1
0 to 1000 Pa · sec (10000 to 1000000 cP), preferably 50 to 500 Pa · sec (50000 to 500000 cP)
P).
【００１８】溶媒としては、沸点が 200℃前後の比較的
高い沸点を有する溶媒が用いられ、例えば、テルピネオ
ール、ブチルカルビトール、ブチルカルビトールアセテ
ート、エチルカルビトール、エチルカルビトールアセテ
ート等が好適である。この場合、溶媒の沸点が低すぎる
と、ペースト作製時あるいはスクリーン印刷時に溶媒が
揮散して、ペーストの性状が変化、あるいはスクリーン
マスクのメッシュにペーストが目詰まりし、また、溶媒
の沸点が高すぎると、印刷後の乾燥に時間が掛かりすぎ
る。As the solvent, a solvent having a relatively high boiling point of around 200 ° C. is used, and for example, terpineol, butyl carbitol, butyl carbitol acetate, ethyl carbitol, ethyl carbitol acetate and the like are suitable. . In this case, if the boiling point of the solvent is too low, the solvent volatilizes during paste preparation or screen printing, the properties of the paste change, or the mesh of the screen mask is clogged with the paste, and the boiling point of the solvent is too high. And it takes too long to dry after printing.
【００１９】ペースト中に添加する結合剤（バインダ
ー）としては，特に制限はなく、エチルセルロース、ニ
トロセルロース等のセルロース誘導体系、アクリル系、
酢酸ビニル系、ＰＶＡ系等を用いることができる。The binder to be added to the paste is not particularly limited and may be a cellulose derivative type such as ethyl cellulose or nitrocellulose, an acrylic type,
Vinyl acetate type, PVA type and the like can be used.
【００２０】結合剤の量は、多いと基材との密着性は増
大するが、無電解メッキ触媒が、結合剤中に埋没し、後
工程の無電解メッキにおいて金属が析出しなくなる。ま
た、少なすぎると、ペーストと基材との密着が不充分と
なり好ましくない。したがって、結合剤の量はペースト
印刷、乾燥後、無電解メッキ触媒あるいは同触媒の担持
体が皮膜の表面に露出する程度が好ましい。When the amount of the binder is large, the adhesion to the substrate is increased, but the electroless plating catalyst is buried in the binder, and the metal does not precipitate in the electroless plating in the subsequent step. On the other hand, if the amount is too small, the adhesion between the paste and the substrate becomes insufficient, which is not preferable. Therefore, the amount of the binder is preferably such that the electroless plating catalyst or the carrier of the catalyst is exposed on the surface of the coating after paste printing and drying.
【００２１】ペーストへの要求特性のうち、微細なパタ
ーン印刷を行うためのペーストには、チキソトロピー性
（揺変性）が必要であり、微細アルミナゲル、シリカゲ
ル等の添加はペーストにその特性を付与することが可能
であるため、好ましい。Among the characteristics required of the paste, the paste for performing fine pattern printing needs to have thixotropic property (thixotropic property), and addition of fine alumina gel, silica gel, etc. imparts the characteristics to the paste. Therefore, it is preferable.
【００２２】ペーストには、無電解メッキ触媒微粒子を
無電解メッキ触媒と反対の表面電荷をもった粒子に担持
させて作製した担持体を含有させることにより、無電解
メッキ触媒を含有するペーストにチキソトロピー性（揺
変性）を付与することができ、スクリーン印刷時におい
て、精度の高いパターン形成が可能となる。The paste contains a carrier prepared by supporting fine particles of electroless plating catalyst on particles having a surface charge opposite to that of the electroless plating catalyst, so that the paste containing the electroless plating catalyst is thixotropic. Property (thixotropy) can be imparted, and highly precise pattern formation can be performed during screen printing.
【００２３】したがって、無電解メッキ触媒のペースト
への添加方法としては、ペーストへ直接添加しても構わ
ないが、貴金属超微粒子と反対の表面電荷をもった粒子
に貴金属超微粒子を担持させた担持体を、ペースト中に
均一に混合し、分散させることが望ましい。Therefore, as a method of adding the electroless plating catalyst to the paste, the electroless plating catalyst may be directly added to the paste. However, the noble metal ultrafine particles are carried on the particles having a surface charge opposite to that of the noble metal ultrafine particles. It is desirable to evenly mix and disperse the body in the paste.
【００２４】例えば、クエン酸で安定化された貴金属コ
ロイド粒子は、表面負電荷を有しているので、表面正荷
電のアルミナ微粒子（アルミナゲル）に吸着担持させた
ものを用い、これをペースト中に混練し、均一に分散さ
せる。For example, since the noble metal colloidal particles stabilized with citric acid have a surface negative charge, those particles adsorbed and supported on alumina fine particles (alumina gel) having a positive surface charge are used in the paste. Knead and disperse uniformly.
【００２５】〔黒色顔料〕無電解メッキ触媒を含有する
ペーストは、メッキ皮膜の金属光沢による透明基板裏面
の反射防止および色ムラや金属色の抑制のため、黒色顔
料を含有させることが望ましい。この場合の黒色顔料と
しては、ペースト中に分散容易な粒子径 0.1μｍ以下の
着色力の大きな黒色顔料が好ましい。例えば、カーボン
ブラック、Ｆｅ３Ｏ４，ＣｕＯ−Ｃｒ２Ｏ３，ＣｕＯ−
Ｆｅ ３Ｏ４−Ｍｎ２Ｏ３ ，ＣｏＯ−Ｆｅ２Ｏ３−Ｃｒ
２Ｏ３などが使用可能である。このうち、特に、カーボ
ンブラックが好ましい。[Black pigment] Contains an electroless plating catalyst
The paste is the back side of the transparent substrate due to the metallic luster of the plating film.
Black face to prevent reflections and to suppress color unevenness and metallic color
It is desirable to include a material. With the black pigment in this case
The particle size of 0.1 μm or less that can be easily dispersed in the paste.
A black pigment having high tinting strength is preferable. For example, carbon
Black, FeThreeOFour, CuO-CrTwoOThree, CuO-
Fe ThreeOFour-MnTwoOThree , CoO-FeTwoOThree-Cr
TwoOThreeEtc. can be used. Of these, especially the carb
Black is preferred.
【００２６】〔パターン印刷〕印刷法としては、特に制
限しないが、スクリーン印刷法が好適である。スクリー
ンマスクとしては、成膜後得られる透明導電膜の透明性
を維持するため、格子状構造または網目構造を有した開
口率 60 ％以上、平均開口径が７ｍｍ以下、平均開口径
／平均線幅≧７としたものを用いることが好ましい。ス
キージ走査速度、角度、印圧、スクリーンマスクの乳剤
の厚さ、紗の太さ、オープニング等は適宜選択可能であ
る。[Pattern Printing] The printing method is not particularly limited, but a screen printing method is preferable. As a screen mask, in order to maintain the transparency of the transparent conductive film obtained after film formation, it has a lattice structure or a mesh structure with an aperture ratio of 60% or more, an average aperture diameter of 7 mm or less, and an average aperture diameter / average line width. It is preferable to use one having ≧ 7. The squeegee scanning speed, angle, printing pressure, emulsion thickness of the screen mask, gauze thickness, opening, etc. can be appropriately selected.
【００２７】〔無電解メッキ処理〕通常の無電解メッキ
浴が使用可能である。使用できる金属としてはＡｕ，Ａ
ｇ，Ｃｕ，Ｃｒ，Ｎｉ，Ｓｕ，Ｚｎ，Ｃｏの一種以上を
含有する金属である。これらの金属の導電性の点から
は、Ａｇ，Ｃｕ，Ａｕ，Ｎｉ等が好ましい。例えば、無
電解Ｃｕメッキ浴、無電解Ｎｉ−Ｐメッキ浴、無電解Ｎ
ｉ−Ｂメッキ浴、無電解Ａｕメッキ浴等が使用可能であ
る。[Electroless Plating Treatment] An ordinary electroless plating bath can be used. The metals that can be used are Au and A
It is a metal containing at least one of g, Cu, Cr, Ni, Su, Zn and Co. Ag, Cu, Au, Ni and the like are preferable from the viewpoint of the conductivity of these metals. For example, electroless Cu plating bath, electroless Ni-P plating bath, electroless N
An i-B plating bath, an electroless Au plating bath or the like can be used.
【００２８】無電解メッキ処理においては、先の工程で
無電解メッキ触媒を含有するペーストをパターン印刷し
ているので、無電解メッキ時にはパターン印刷した部分
のみに金属の析出が起こり、高開口率の、即ち高い光透
過性を有した高導電性の皮膜を得ることができる。In the electroless plating process, since the paste containing the electroless plating catalyst is pattern-printed in the previous step, metal deposition occurs only in the pattern-printed portion during electroless plating, which results in a high aperture ratio. That is, a highly conductive film having high light transmittance can be obtained.
【００２９】〔パターン状透明導電膜の形成〕無電解メ
ッキ触媒を担持させた担持体を用いて透明導電膜を形成
させる場合について概略例示すると、図１（イ）〜
（ホ）に示すように、無電解メッキ触媒１を担持体２に
担持させてバインダー３とともに溶剤４に混合して分散
させたペースト５を調製し（イ）、スクリーン印刷によ
ってペースト５を基板６の表面上にパターン印刷し
（ロ）、印刷後に乾燥させて溶媒を揮散させ（ハ）、基
板６の表面にバインダー３により担持体２を結合した所
定形状のパターンを形成させるとともに、無電解メッキ
触媒１を担持体２の表面に露出させる（ニ）、さらに、
無電解メッキ処理を行って無電解メッキ触媒１を起点と
して金属を析出させ、基板６の表面に格子状または網目
状のパターンを有する金属層７を形成させる。[Formation of Patterned Transparent Conductive Film] A schematic example of forming a transparent conductive film by using a carrier carrying an electroless plating catalyst is shown in FIG.
As shown in (e), a paste 5 in which the electroless plating catalyst 1 is carried on a carrier 2 and mixed with a binder 4 and a solvent 4 and dispersed is prepared (a), and the paste 5 is screen-printed onto the substrate 6. Pattern is printed on the surface of (2), and after printing, it is dried to volatilize the solvent (3) to form a pattern of a predetermined shape in which the carrier 2 is bound by the binder 3 on the surface of the substrate 6 and electroless plating. Exposing the catalyst 1 to the surface of the carrier 2 (d), and
Electroless plating is performed to deposit a metal starting from the electroless plating catalyst 1 to form a metal layer 7 having a grid-like or mesh-like pattern on the surface of the substrate 6.
【００３０】また、この工程中でペースト５に無電解メ
ッキ触媒を直接に混入させても良い。その場合には、バ
インダーによって図中の担持体の代わりに触媒が基板６
に直接結合されていることになる。Further, the electroless plating catalyst may be directly mixed into the paste 5 in this step. In that case, the catalyst is used as the substrate 6 instead of the carrier in the figure by the binder.
Will be directly connected to.
【００３１】〔成膜後の透明導電膜〕このようにして、
無電解メッキ触媒含有印刷ペーストをパターン印刷する
と、印刷部のみ選択的に無電解メッキがなされるので、
得られる透明導電膜の特性はパターン印刷に大きく影響
される。メッキ皮膜（金属皮膜）部分は殆ど光透過性が
期待できないので開口部を設けて、透明性を確保する。
したがって、開口率は透明性に大きく影響する。このた
め、開口率を 60 ％以上とすることで必要な透明性を確
保する。[Transparent Conductive Film After Film Formation] In this way,
When the electroless plating catalyst-containing printing paste is pattern-printed, electroless plating is selectively performed only on the printed part.
The characteristics of the obtained transparent conductive film are greatly affected by pattern printing. Since almost no light transmission can be expected in the plating film (metal film), an opening is provided to ensure transparency.
Therefore, the aperture ratio greatly affects the transparency. Therefore, the required transparency is secured by setting the aperture ratio to 60% or more.
【００３２】開口パターンは、例えば格子状（網目状）
の構造が挙げられ、平均開口径／平均線幅≧７とするこ
とで、開口率（光透過率）60％以上を確保できる。開口
ピッチは大きいと格子状（網目状）構造が目立ち、視認
性が悪化するから、開口ピッチは細かい程好ましく、１
ｍｍ以下が好ましい。The opening pattern is, for example, a grid pattern (mesh pattern).
The following structure can be cited. By setting the average aperture diameter / average line width ≧ 7, the aperture ratio (light transmittance) of 60% or more can be secured. If the opening pitch is large, the lattice-like (mesh-like) structure is conspicuous and the visibility is deteriorated.
mm or less is preferable.
【００３３】透明導電膜の厚みは、特に限定されない
が、厚くなると視認性が悪くなり、即ち、視野角が狭く
なる。無電解メッキで得られる金属膜の比抵抗は一般に
10-6〜 10-5Ω・ｃｍであり、開口率 60 ％の場合、透
明導電膜の面抵抗は厚さ１μｍで１Ω／□以下の低抵抗
のものが得られる。したがって、無電解メッキによって
得られる金属膜の厚みは、数μｍ以下で充分であり、従
来品と比較して薄膜化が可能となり、視野角の広角化、
視認性の向上が達成できる。The thickness of the transparent conductive film is not particularly limited, but if it is thick, the visibility deteriorates, that is, the viewing angle becomes narrow. The specific resistance of the metal film obtained by electroless plating is generally
When the aperture ratio is 10 −6 to 10 −5 Ω · cm and the aperture ratio is 60%, the surface resistance of the transparent conductive film is as low as 1 Ω / □ or less at a thickness of 1 μm. Therefore, the thickness of the metal film obtained by the electroless plating is sufficient to be several μm or less, and it becomes possible to reduce the film thickness as compared with the conventional product, and the viewing angle is widened,
Visibility can be improved.
【００３４】成膜後の透明導電膜に含有させた黒色顔料
の効果は、メッキ皮膜の金属光沢による透明基板裏面
（透明基体側から透視した場合の面）の反射を防止する
ことができ、メッキによる析出金属皮膜の透明基板裏
面の色ムラ抑制および金属色呈示抑制ができる。The effect of the black pigment contained in the transparent conductive film after film formation can prevent reflection on the back surface of the transparent substrate (the surface when seen through from the transparent substrate side) due to the metallic luster of the plating film. It is possible to suppress the color unevenness of the deposited metal film on the back surface of the transparent substrate and the suppression of metal color presentation.
【００３５】その他、パターン形成金属層と組み合わせ
て使用することのできる皮膜には、
パターン状金属層上へのＡＧ（防眩）膜、パターン
状金属上あるいは裏面へのＮＩＲ（近赤外線）遮蔽膜、
裏面へのＡＲ（反射防止）膜等がある。Other films that can be used in combination with the patterned metal layer include an AG (antiglare) film on the patterned metal layer, and an NIR (near infrared) shielding film on the patterned metal or on the back surface. ,
There is an AR (antireflection) film on the back surface.
【００３６】[0036]
【実施例】〔第１実施例〕
（パラジウムコロイドの作製）精製水 89 重量部に塩化
パラジウム 1重量部を溶解し、さらにクエン酸三ナトリ
ウム 10 重量部を溶解して均一に攪拌した後、水素化ホ
ウ素ナトリウム 0.01重量部を添加して塩化パラジウム
を還元させ、クエン酸で安定、保護コロイド化されたパ
ラジウムコロイドを得た。その後、限外濾過により濃縮
脱塩を行い、パラジウム 0.5重量部を含有するパラジウ
ムコロイドを得た。EXAMPLES [First Example] (Preparation of Palladium Colloid) 1 part by weight of palladium chloride was dissolved in 89 parts by weight of purified water, 10 parts by weight of trisodium citrate were further dissolved and stirred uniformly, and then hydrogen was added. 0.01 parts by weight of sodium borohydride was added to reduce palladium chloride, and a palladium colloid which was stabilized with citric acid and formed into a protective colloid was obtained. After that, concentration and desalting were performed by ultrafiltration to obtain a palladium colloid containing 0.5 part by weight of palladium.
【００３７】（印刷用ペーストの作製）上記パラジウム
コロイド 10 重量部に適量の精製水を加え、この希薄パ
ラジウムコロイド溶液に日本アエロゾル製アルミナエア
ロゾルＡｌ２Ｏ３−Ｃ、 10 重量部を添加懸濁させる。
パラジウムコロイドはクエン酸で安定化されている為、
表面負荷電のコロイドであり、またアルミナゾルは逆に
表面正荷電を示す為、懸濁液中で静電的に吸着、ヘテロ
凝集を起こす。これを濾過により分離し、乾燥、解砕す
ることにより、パラジウムコロイドを担持したアルミナ
ゲルを得る。このパラジウムコロイド担持アルミナゲル
7重量部と 10 ％エチルセルローステルピネオール溶液
30 重量部を３本ロールミルを用いて均一に混練し、分
散させることにより印刷ペーストを作製した。得られた
ペーストの粘度は 80000ｃＰであった。(Preparation of Printing Paste) An appropriate amount of purified water was added to 10 parts by weight of the above-mentioned palladium colloid, and 10 parts by weight of alumina aerosol Al 2 O 3 -C manufactured by Nippon Aerosol was added to and suspended in this diluted palladium colloidal solution. .
Since the palladium colloid is stabilized with citric acid,
Since it is a surface negatively charged colloid, and alumina sol, on the contrary, exhibits a positive surface charge, it electrostatically adsorbs and causes heterocoagulation in suspension. This is separated by filtration, dried and crushed to obtain an alumina gel carrying a palladium colloid. This palladium colloid-supported alumina gel
7 parts by weight and 10% ethylcellulose terpineol solution
A printing paste was prepared by uniformly kneading 30 parts by weight using a three-roll mill and dispersing. The viscosity of the obtained paste was 80,000 cP.
【００３８】（スクリーン印刷）上記により得られたペ
ーストを次に示すスクリーンマスクに載せ、マイクロテ
ック社製スクリーン印刷機ＭＴ−７５０型を用い、３ｍ
ｍ厚（ 320×320 （ｍｍ））の正方形アクリル板上に印
刷を行った。スクリーンマスクは、枠サイズ 750×750
（ｍｍ）、パターンサイズ 300×300 （ｍｍ）、Ｌ／Ｓ
＝50／450 （μｍ）の格子状（メッシュ状）のパターン
を有し、乳剤の厚み： 10 μｍ、メッシュ開き（ステン
レス鋼）：325 メッシュ、線径： 16 μｍ、オープニン
グ： 62 ％である。(Screen printing) The paste obtained as described above was placed on the screen mask shown below, and 3 m in length using a screen printing machine MT-750 manufactured by Microtec.
Printing was performed on a square acrylic plate of m thickness (320 × 320 (mm)). Screen mask has a frame size of 750 x 750
(Mm), pattern size 300 × 300 (mm), L / S
= 50/450 (μm) lattice-like (mesh-like) pattern, emulsion thickness: 10 μm, mesh opening (stainless steel): 325 mesh, wire diameter: 16 μm, opening: 62%.
【００３９】また、スクリーン印刷条件は、印圧：1.6
Ｋｇ／ｃｍ２、スキージ速度：250ｍｍ／ｓｅｃ、クリ
アランス：3.0 ｍｍである。印刷後、室温で 15 分静置
後、 60 ℃の乾燥器にて 2時間乾燥を行った。得られた
印刷パターンは約Ｌ／Ｓ＝60／440 の格子状のもので、
ラインの切れ、印刷ムラ等は特に認められなかった。The screen printing condition is printing pressure: 1.6.
Kg / cm 2 , squeegee speed: 250 mm / sec, clearance: 3.0 mm. After printing, the plate was allowed to stand at room temperature for 15 minutes, and then dried in a dryer at 60 ° C for 2 hours. The print pattern obtained is a grid pattern of about L / S = 60/440,
No line breaks or printing irregularities were observed.
【００４０】（無電解Ｃｕメッキ）上記得られたパラジ
ウムコロイド含有ペースト印刷基板を奥野製薬（株）製
無電解銅メッキ液（ＯＰＣ−７５０シリーズ）中に浸漬
させ、20分間、20℃で無電解銅メッキを行った。攪拌は
エアー攪拌で行った。メッキ処理後に水洗い、乾燥を行
った。(Electroless Cu Plating) The palladium colloid-containing paste printed substrate obtained above was immersed in an electroless copper plating solution (OPC-750 series) manufactured by Okuno Chemical Industries Co., Ltd., and electroless for 20 minutes at 20 ° C. Copper plated. Stirring was performed by air stirring. After the plating treatment, it was washed with water and dried.
【００４１】得られた膜はラインの平均線幅が約 62 μ
ｍ、平均開口径が 438μｍの格子状パターンでメッキ施
工表面は黄金色の銅金属光沢、裏面は若干銅金属光沢を
示すがほぼ黒色の色調を呈していた。膜の平均厚みは 8
μｍである。The obtained film has an average line width of about 62 μm.
m, the average opening diameter was 438 μm, and the plated surface had a golden copper metallic luster on the surface and the back surface had a slight copper metallic luster, but had an almost black color tone. Mean thickness of membrane is 8
μm.
【００４２】また、この膜の表面抵抗値を三菱化学
（株）製ロレスタＡＰ（４端針法）を用いて測定した結
果、0.8 Ω／□であった。なお、平均線幅は、光学顕微
鏡を用い、膜の平面方向の形状を観察し、写真撮影して
50 カ所の線幅を測定し、平均化して求めた。The surface resistance of this film was measured by using Loresta AP (4-end needle method) manufactured by Mitsubishi Chemical Co., Ltd., and it was 0.8 Ω / □. The average line width was measured by observing the shape of the film in the plane direction using an optical microscope and taking a photograph.
The line widths at 50 locations were measured and averaged.
【００４３】膜厚は膜の一部を切り出し、熱硬化型の埋
め込み樹脂中に封入し、ミクロトームで断面方向に薄片
を切り出し、透過型電子顕微鏡で観察、線部の最高部の
厚みを 10 カ所測定し、平均化して求めた。The film thickness was obtained by cutting out a part of the film, encapsulating it in a thermosetting embedding resin, cutting out a thin piece in the cross-sectional direction with a microtome, and observing it with a transmission electron microscope. It was measured and averaged.
【００４４】膜の全光線透過率は、膜の一部を切り出
し、自動ヘーズメータ（東京電色（株）製）を用いて裏
面より測定した結果、72.7％であった。また、印刷面の
裏面の反射率は 4.1％であった。The total light transmittance of the film was 72.7% as a result of cutting out a part of the film and measuring from the back surface using an automatic haze meter (manufactured by Tokyo Denshoku Co., Ltd.). The reflectance of the back side of the printed surface was 4.1%.
【００４５】〔第２実施例〕実施例１のペースト作製条
件が下記に変更になる以外は同じ。
パラジウムコロイド担持アルミナゲル 6.5 重量部
カーボンブラック（三菱化学（株）製＃990 ） 0.5 重量部
10％エチルセルロースのテルピネオール溶液 30 重量部
ペースト粘度 72000 ｃＰ[Second Embodiment] The same as the second embodiment except that the conditions for producing the paste are changed as follows. Alumina gel supporting palladium colloid 6.5 parts by weight Carbon black (# 990 manufactured by Mitsubishi Chemical Corporation) 0.5 parts by weight 10% ethylcellulose terpineol solution 30 parts by weight Paste viscosity 72000 cP
【００４６】スクリーン印刷条件、使用マスク … 実
施例１と同じ
無電解Ｃｕメッキも同様
平均ライン線幅 60 μｍ
開口径 440 μｍ
膜厚 7 μｍScreen printing conditions, mask used: The same electroless Cu plating as in Example 1 has the same average line width 60 μm opening diameter 440 μm film thickness 7 μm
【００４７】表面抵抗 0.9 Ω／□
全光線透過率 75.3 ％
メッキ施工表面は黄金色の銅金属光沢
メッキ施工裏面は金属光沢が全く見られない黒色を呈し
ていた。
裏面の反射率は 2.9％Surface resistance 0.9 Ω / □ Total light transmittance 75.3% The plated surface had a golden copper metal luster The back surface had a black color with no metallic luster. The reflectance on the back side is 2.9%
【００４８】[0048]
【表１】 [Table 1]
【００４９】[0049]
【発明の効果】以上のように本発明では、請求項１に係
る透明導電膜では、透明基体表面に所定のパターンに形
成された金属超微粒子触媒層と、この金属超微粒子触媒
層上に形成された金属層とからなり、前記パターンの平
均開口径と平均線幅との比が平均開口径／平均線幅≧７
であることから、最適な透明性と導電性とに調整するこ
とができ、高い透明性と導電性とを兼ね備えることがで
きるともに、金属層による反射や金属光沢の程度を少な
くすることができる。As described above, according to the present invention, in the transparent conductive film according to the first aspect, the metal ultrafine particle catalyst layer formed in a predetermined pattern on the surface of the transparent substrate and the metal ultrafine particle catalyst layer are formed. And the ratio of the average aperture diameter to the average line width of the pattern is average aperture diameter / average line width ≧ 7.
Therefore, the optimum transparency and conductivity can be adjusted, and both high transparency and conductivity can be provided, and the degree of reflection and metallic luster due to the metal layer can be reduced.
【００５０】請求項２に係る透明導電膜では、前記所定
のパターンを格子状あるいは網目状としたことにより、
最適な透明性と導電性とを容易に調整する事ができる。
請求項３に係る透明導電膜では、金属超微粒子触媒層が
貴金属超微粒子からなるから、無電解メッキにより金属
超微粒子触媒層上に金属層を析出させることができ、効
果的に金属超微粒子触媒層に金属層を形成させることが
できる。請求項４に係る透明導電膜では、金属層がＡ
ｕ，Ａｇ，Ｃｕ，Ｃｒ，Ｎｉ，Ｓｎ，Ｚｎ，Ｃｏの１種
以上を含有することによって、良好な導電性を付与する
ことができる。In the transparent conductive film according to the second aspect, the predetermined pattern has a lattice shape or a mesh shape,
Optimal transparency and conductivity can be easily adjusted.
In the transparent conductive film according to claim 3, since the metal ultrafine particle catalyst layer is made of noble metal ultrafine particles, the metal layer can be deposited on the metal ultrafine particle catalyst layer by electroless plating, and the metal ultrafine particle catalyst can be effectively used. The layer can be formed with a metal layer. In the transparent conductive film according to claim 4, the metal layer is A
Good conductivity can be imparted by containing at least one of u, Ag, Cu, Cr, Ni, Sn, Zn, and Co.
【００５１】また、請求項５に係る透明導電膜の製造方
法では、透明基体表面上に無電解メッキ触媒を含有する
ペーストでパターン印刷を行い、このパターン印刷され
た無電解メッキ触媒層上に無電解メッキ処理を施して、
パターン印刷部のみに透明導電性の金属層を形成するこ
とにより、形成されたパターン状に導電性金属層を形成
できて、所定の透明性および導電性を有する透明導電膜
を低コストで効果的に形成させることができる。In the method for producing a transparent conductive film according to a fifth aspect, pattern printing is performed on the surface of a transparent substrate with a paste containing an electroless plating catalyst, and the pattern is printed on the electroless plating catalyst layer. Applying electrolytic plating,
By forming the transparent conductive metal layer only on the pattern printing part, the conductive metal layer can be formed in the formed pattern, and the transparent conductive film having predetermined transparency and conductivity can be effectively manufactured at low cost. Can be formed.
【００５２】請求項６に係る透明導電膜の製造方法で
は、ペーストが無電解メッキ触媒として貴金属超微粒子
を含有するから、無電解メッキ触媒を無電解メッキによ
るメッキ金属を析出させる核として効果的に機能させる
ことができ、金属層を容易に形成させることができる。
請求項７に係る透明導電膜の製造方法では、ペーストが
チキソトロピー性を有するために、印刷パターンを微細
な形状に形成させることができる。In the method for producing a transparent conductive film according to the sixth aspect, since the paste contains the noble metal ultrafine particles as the electroless plating catalyst, the electroless plating catalyst is effectively used as a nucleus for depositing the plated metal by electroless plating. It can function and a metal layer can be easily formed.
In the method of manufacturing the transparent conductive film according to the seventh aspect, since the paste has thixotropy, the printed pattern can be formed in a fine shape.
【００５３】請求項８に係る透明導電膜の製造方法で
は、ペーストが黒色顔料を含むことにより、メッキによ
り形成した金属層の透明基板裏面側の反射を防止できる
とともに色ムラを抑制することができる。請求項９に係
る透明導電膜の製造方法では、パターン印刷がスクリー
ン印刷であることにより、印刷工程を簡略化でき、作業
性を向上させることができるとともに低コスト化させる
ことができる。In the method for producing a transparent conductive film according to the eighth aspect, since the paste contains the black pigment, reflection of the metal layer formed by plating on the rear surface side of the transparent substrate can be prevented and color unevenness can be suppressed. . In the method for producing a transparent conductive film according to the ninth aspect, since the pattern printing is screen printing, the printing process can be simplified, the workability can be improved, and the cost can be reduced.
【図１】本発明によるパターン状透明導電膜の形成過程
を示す工程説明図であり、（イ）は調整されたペース
ト、（ロ）は基板上に印刷されたペースト、（ハ）は乾
燥中の印刷基板、（ニ）は基板上に形成された無電解メ
ッキ触媒を担持させた担持体のパターン、（ホ）は基板
上に形成された透明導電膜をそれぞれ示す側面拡大説明
図である。FIG. 1 is a process explanatory view showing a process of forming a patterned transparent conductive film according to the present invention, in which (a) is a prepared paste, (b) is a paste printed on a substrate, and (c) is being dried. FIG. 3 is a side enlarged explanatory view showing the printed substrate, (d) the pattern of the carrier that supports the electroless plating catalyst formed on the substrate, and (e) the transparent conductive film formed on the substrate.
１ 無電解メッキ触媒 ２ 担持体 ３ バインダー ４ 溶媒 ５ ペースト ６ 基板 ７ 金属層 1 Electroless plating catalyst 2 Carrier 3 binders 4 solvent 5 paste 6 substrate 7 metal layers
───────────────────────────────────────────────────── フロントページの続き (72)発明者 久保 泰生 千葉県船橋市豊富町585番地 住友大阪セ メント株式会社新規技術研究所内 Ｆターム(参考） 5G307 FA01 FA02 FB02 FC03 FC08 FC09 5G323 BA01 BB06 BC01 CA03 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Yasuo Kubo Sumitomo Osaka Center, 585 Tomimachi, Funabashi, Chiba Prefecture Mento Corporation New Technology Laboratory F term (reference) 5G307 FA01 FA02 FB02 FC03 FC08 FC09 5G323 BA01 BB06 BC01 CA03
Claims (9)
た金属超微粒子触媒層と、この金属超微粒子触媒層上に
形成された金属層とからなり、前記パターンの平均開口
径と平均線幅との比が平均開口径／平均線幅≧７である
ことを特徴とする透明導電膜。1. An ultrafine metal catalyst layer formed on a surface of a transparent substrate in a predetermined pattern, and a metal layer formed on the ultrafine metal catalyst layer, the average opening diameter and the average line width of the pattern. A transparent conductive film having a ratio of: average aperture diameter / average line width ≧ 7.
状であることを特徴とする請求項１記載の透明導電膜。2. The transparent conductive film according to claim 1, wherein the predetermined pattern has a lattice shape or a mesh shape.
からなることを特徴とする請求項１記載の透明導電膜。3. The transparent conductive film according to claim 1, wherein the metal ultrafine particle catalyst layer is composed of noble metal ultrafine particles.
ｉ，Ｓｎ，Ｚｎ，Ｃｏの１種以上を含有することを特徴
とする請求項１記載の透明導電膜。4. The metal layer is Au, Ag, Cu, Cr, N
The transparent conductive film according to claim 1, containing at least one of i, Sn, Zn, and Co.
するペーストでパターン印刷を行い、このパターン印刷
された無電解メッキ触媒上に無電解メッキ処理を施し
て、パターン印刷部のみに金属層を形成させることを特
徴とする透明導電膜の製造方法。5. A pattern is printed on the surface of a transparent substrate with a paste containing an electroless plating catalyst, and the electroless plating catalyst on which the pattern is printed is subjected to an electroless plating treatment to form a metal layer only on the pattern printing portion. A method for producing a transparent conductive film, which comprises:
て貴金属超微粒子を含有することを特徴とする請求項５
記載の透明導電膜の製造方法。6. The paste contains ultrafine noble metal particles as the electroless plating catalyst.
A method for producing the transparent conductive film as described above.
ことを特徴とする請求項５記載の透明導電膜の製造方
法。7. The method for producing a transparent conductive film according to claim 5, wherein the paste has thixotropic properties.
ことを特徴とする請求項５記載の透明導電膜の製造方
法。8. The method for producing a transparent conductive film according to claim 5, wherein the paste contains a black pigment.
ことを特徴とする請求項５記載の透明導電膜の製造方
法。9. The method for producing a transparent conductive film according to claim 5, wherein the pattern printing is screen printing.
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|---|---|---|---|
| JP2002227332A JP3895229B2 (en) | 2002-08-05 | 2002-08-05 | Method for producing transparent conductive film and transparent conductive film produced by this method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002227332A JP3895229B2 (en) | 2002-08-05 | 2002-08-05 | Method for producing transparent conductive film and transparent conductive film produced by this method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34816197A Division JP3363083B2 (en) | 1997-12-17 | 1997-12-17 | Transparent substrate and method for producing the same |
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| Publication Number | Publication Date |
|---|---|
| JP2003109435A true JP2003109435A (en) | 2003-04-11 |
| JP3895229B2 JP3895229B2 (en) | 2007-03-22 |
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|---|---|---|---|---|
| US7205096B2 (en) | 2004-11-23 | 2007-04-17 | Samsung Electronics Co., Ltd. | Method for forming metal pattern by using metal nanocrystals |
| US7205098B2 (en) | 2004-11-19 | 2007-04-17 | Samsung Corning Co., Ltd. | Method for manufacturing high-transmittance optical filter for image display devices |
| WO2008075771A1 (en) | 2006-12-21 | 2008-06-26 | Fujifilm Corporation | Conductive film and method for manufacturing the same |
| JP2009004432A (en) * | 2007-06-19 | 2009-01-08 | Dainippon Printing Co Ltd | Electromagnetic wave shielding member and manufacturing method thereof |
| WO2009063882A1 (en) * | 2007-11-13 | 2009-05-22 | Seiren Co., Ltd. | Process for producing transparent electroconductive member |
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| US7205098B2 (en) | 2004-11-19 | 2007-04-17 | Samsung Corning Co., Ltd. | Method for manufacturing high-transmittance optical filter for image display devices |
| US7205096B2 (en) | 2004-11-23 | 2007-04-17 | Samsung Electronics Co., Ltd. | Method for forming metal pattern by using metal nanocrystals |
| WO2008075771A1 (en) | 2006-12-21 | 2008-06-26 | Fujifilm Corporation | Conductive film and method for manufacturing the same |
| JP2009004432A (en) * | 2007-06-19 | 2009-01-08 | Dainippon Printing Co Ltd | Electromagnetic wave shielding member and manufacturing method thereof |
| WO2009063882A1 (en) * | 2007-11-13 | 2009-05-22 | Seiren Co., Ltd. | Process for producing transparent electroconductive member |
| EP2214178A1 (en) * | 2007-11-13 | 2010-08-04 | Seiren Co., Ltd. | Process for producing transparent electroconductive member |
| CN101855679A (en) * | 2007-11-13 | 2010-10-06 | 世联株式会社 | Process for producing transparent electroconductive member |
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| KR101479479B1 (en) * | 2007-11-13 | 2015-01-06 | 세이렌가부시끼가이샤 | Process for producing transparent electroconductive member |
| US10224126B2 (en) | 2014-10-07 | 2019-03-05 | Sharp Kabushiki Kaisha | Transparent conductor, method for producing transparent conductor, and touch panel |
| WO2016143201A1 (en) * | 2015-03-06 | 2016-09-15 | コニカミノルタ株式会社 | Transparent electrode, method for manufacturing same, and organic electroluminescent element |
| JPWO2016143201A1 (en) * | 2015-03-06 | 2018-01-18 | コニカミノルタ株式会社 | Transparent electrode, method for producing the same, and organic electroluminescence device |
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|---|---|
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