JP2002374060A - Electronic circuit board - Google Patents
Electronic circuit boardInfo
- Publication number
- JP2002374060A JP2002374060A JP2001182360A JP2001182360A JP2002374060A JP 2002374060 A JP2002374060 A JP 2002374060A JP 2001182360 A JP2001182360 A JP 2001182360A JP 2001182360 A JP2001182360 A JP 2001182360A JP 2002374060 A JP2002374060 A JP 2002374060A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- electronic component
- solder resist
- circuit board
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、表面実装部品を
実装するための電子回路板に関するもので、詳しくは電
子部品の自己位置補正作用を弱めることなく電子部品横
のはんだボール発生を抑制し、高密度実装に適した電子
回路板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board for mounting surface mount components, and more particularly, to suppressing the occurrence of solder balls beside electronic components without weakening the self-position correction action of the electronic components. The present invention relates to an electronic circuit board suitable for high-density mounting.
【０００２】[0002]
【従来の技術】電子回路板は、基板上の銅箔をエッチン
グなどの方法で所定のパターンを形成した後、そのはん
だ付けパッド部以外にはんだの付着を防止するソルダレ
ジストがコーティングされている。2. Description of the Related Art An electronic circuit board is formed by forming a predetermined pattern on a copper foil on a substrate by etching or the like, and then coating a solder resist for preventing adhesion of solder to portions other than the soldering pad portion.
【０００３】図２２乃至２４は、例えば実開昭６２−３
６５８０号公報及び特開平６−６１６２９号公報に記載
されている従来の電子回路板を示す図であり、図２２は
電子回路板の一部を拡大した図、図２３は図２２のＡ−
Ａ線断面図，図２４は図２２のＢ−Ｂ線断面図をであ
る。図において、１はガラスエポキシなどで形成された
基板、２は形成されたはんだ付け用パッド、３はソルダ
レジスト、４は最終的にパッド３にはんだ付けされる電
子部品、５はソルダレジスト３に形成された開口部であ
る。FIG. 22 to FIG.
FIG. 22 is a diagram showing a conventional electronic circuit board described in Japanese Patent Application Laid-Open No. 6580 and JP-A-6-61629. FIG. 22 is an enlarged view of a part of the electronic circuit board, and FIG.
24 is a sectional view taken along line A, and FIG. 24 is a sectional view taken along line BB of FIG. In the drawing, 1 is a substrate formed of glass epoxy or the like, 2 is a formed soldering pad, 3 is a solder resist, 4 is an electronic component finally soldered to the pad 3, and 5 is a solder resist 3. It is an opening formed.
【０００４】図２３に示すように、一般にソルダレジス
ト３はパッド２の厚みよりも薄く形成されており、また
ソルダレジスト３の開口部５は位置ずれによってパッド
２を覆わないようパッド２よりわずかに大きく開口して
いる。As shown in FIG. 23, generally, the solder resist 3 is formed thinner than the thickness of the pad 2, and the opening 5 of the solder resist 3 is slightly smaller than the pad 2 so as not to cover the pad 2 due to displacement. It has a large opening.
【０００５】また、図２５乃至２７は、例えば実開昭６
２−３６５８０号公報に記載されている他の従来の電子
回路板を示す図である。図２５は電子回路板の一部を拡
大した図，図２６はＡ−Ａ方向の断面図，図２７はＢ−
Ｂ方向の断面図を表している。FIG. 25 to FIG.
It is a figure which shows the other conventional electronic circuit board described in 2-36580 gazettes. 25 is an enlarged view of a part of the electronic circuit board, FIG. 26 is a cross-sectional view in the AA direction, and FIG.
2 shows a cross-sectional view in the B direction.
【０００６】図２６に示すように、ソルダレジスト３の
開口部５はパッド２を僅かに覆うようパッド２より僅か
に小さく開口している。この場合パッド２の周囲のソル
ダレジスト３は、パッド２を覆っているためパッド２よ
り僅かに高くなるよう形成されている。As shown in FIG. 26, the opening 5 of the solder resist 3 is slightly smaller than the pad 2 so as to slightly cover the pad 2. In this case, the solder resist 3 around the pad 2 is formed to be slightly higher than the pad 2 because it covers the pad 2.
【０００７】[0007]
【発明が解決しようとする課題】従来の電子回路板は以
上のように構成されているので、以下に示す問題点があ
った。電子回路板に電子部品４をはんだ付けする場合、
パッド２上にソルダペーストを印刷などの方法で塗布
後、電子部品４を実装、加熱はんだ付けするが、図２２
乃至２４に示した従来の電子回路板では電子部品４を実
装するときに塗布されているソルダペーストが押さえつ
けられてパッド２からはみ出し、電子部品４下のソルダ
レジスト３上まで至る。Since the conventional electronic circuit board is configured as described above, there are the following problems. When soldering the electronic component 4 to the electronic circuit board,
After applying a solder paste on the pad 2 by printing or the like, the electronic component 4 is mounted and soldered by heating.
In the conventional electronic circuit boards shown in Nos. 1 to 24, the solder paste applied when mounting the electronic component 4 is pressed down, protrudes from the pad 2, and reaches the solder resist 3 under the electronic component 4.
【０００８】一般にリフロー加熱では１５０℃程度の温
度で予備加熱後はんだを溶融させるが、予備加熱時に流
動性が高まったソルダペーストが電子部品４とパッド
２、又は電子部品４と電子部品４下のソルダレジスト３
間の隙間を毛細管現象によって更に広がることによっ
て、電子部品４下にはみ出すソルダペースト量が増大す
る。In general, the solder is melted after preheating at a temperature of about 150 ° C. in the reflow heating, and the solder paste having increased fluidity during the preheating is applied to the electronic component 4 and the pad 2 or the electronic component 4 and the electronic component 4 Solder resist 3
By further expanding the gap therebetween by the capillary phenomenon, the amount of solder paste protruding below the electronic component 4 increases.
【０００９】この電子部品４下のソルダペーストがリフ
ロー加熱してはんだを溶融したときにパッド２上のはん
だと一体とならず、電子部品４横にはんだボールが発生
し、電気的短絡や発生したはんだボールが製品組み込み
後の振動などによって電子部品横から外れて移動し、他
の電子部品を電気的に短絡させるなどの不具合が発生す
る問題点があった。When the solder paste under the electronic component 4 is reflow-heated to melt the solder, the solder paste is not integrated with the solder on the pad 2, and solder balls are generated beside the electronic component 4, resulting in an electrical short circuit or occurrence. There has been a problem in that the solder ball moves off the side of the electronic component due to vibrations after the product is incorporated and the other electronic components are electrically short-circuited.
【００１０】また、図２５乃至２７に示した他の従来の
電子回路板では、パッド２上にソルダレジスト３を僅か
に覆うようにした場合、パッド２の電子部品４側のソル
ダレジスト３が高くなっているため、益々電子部品４下
にはみ出したソルダペーストがパッド２上のはんだと一
体となりにくく、更に顕著に電子部品４横にはんだボー
ルが発生する問題点があった。In another conventional electronic circuit board shown in FIGS. 25 to 27, when the solder resist 3 is slightly covered on the pad 2, the solder resist 3 on the electronic component 4 side of the pad 2 is high. As a result, the solder paste protruding more and more under the electronic component 4 is less likely to be integrated with the solder on the pad 2, and there has been a problem that solder balls are more remarkably generated beside the electronic component 4.
【００１１】電子部品４は一般にパッド２から多少ずれ
て実装されてもはんだの表面張力による自己位置補正作
用が働き、はんだ付け後にパッドの中心に戻ることが知
られている。このときソルダペースト中のフラックスに
よって電子部品４が電子回路板から浮いた状態になるこ
とで更に作用が高まる。It is generally known that the electronic component 4 returns to the center of the pad after soldering, even if the electronic component 4 is mounted with a slight deviation from the pad 2 due to the surface tension of the solder. At this time, the action is further enhanced by the electronic component 4 being floated from the electronic circuit board by the flux in the solder paste.
【００１２】ソルダレジスト３がパッド２を覆わないよ
うパッド２より僅かに大きく開口している場合、フラッ
クスが電子部品４の周囲のソルダレジスト３上に広がっ
てしまうため、自己位置補正作用が弱いという問題点が
あった。If the solder resist 3 has a slightly larger opening than the pad 2 so as not to cover the pad 2, the flux spreads on the solder resist 3 around the electronic component 4, so that the self-position correction effect is weak. There was a problem.
【００１３】この発明は、上記のような問題点を解決す
るためになされたもので、電子部品の自己位置補正作用
を弱めることなく電子部品横のはんだボール発生を抑制
し、高密度実装に適した電子回路板を得ることを目的と
する。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and suppresses the occurrence of solder balls beside electronic components without weakening the self-position correcting action of the electronic components, and is suitable for high-density mounting. To obtain an electronic circuit board.
【００１４】[0014]
【課題を解決するための手段】この発明に係る電子回路
板は、開口部を設けてはんだ付け用パッドが露出するよ
う基板表面にソルダレジストをコーティングし、かつパ
ッドに電子部品が実装される電子回路板において、電子
部品の貼着方向におけるパッドの周縁とソルダレジスト
の開口部における開口縁は、間隔をあけて配置するもの
である。An electronic circuit board according to the present invention has an electronic circuit board in which an opening is provided to coat a solder resist on a substrate surface so that a soldering pad is exposed, and an electronic component is mounted on the pad. In the circuit board, the peripheral edge of the pad in the direction in which the electronic component is attached and the opening edge of the opening of the solder resist are spaced from each other.
【００１５】また、電子部品の貼着方向におけるパッド
の周縁とソルダレジストの開口部における開口縁との間
隔は、パッド上にソルダペーストを塗布後、電子部品を
実装したときにパッドから電子部品下にはみだしたソル
ダペーストがソルダレジストの開口縁まで至らない距離
としたものである。The distance between the peripheral edge of the pad in the direction in which the electronic component is attached and the opening edge of the opening of the solder resist is determined by applying a solder paste on the pad and then mounting the electronic component on the pad. The distance is set so that the protruding solder paste does not reach the opening edge of the solder resist.
【００１６】また、電子部品の貼着方向におけるパッド
の周縁とソルダレジストの開口部における開口縁は、５
０μｍ以上の間隔をあけて配置するものである。The peripheral edge of the pad in the direction in which the electronic component is attached and the opening edge of the opening of the solder resist are 5
They are arranged with an interval of 0 μm or more.
【００１７】また、ソルダレジストの開口部は、電子部
品の貼着方向を除いて、パッドより僅かに大きく開口し
ているものである。The opening of the solder resist is slightly larger than the pad except for the direction in which the electronic component is attached.
【００１８】また、電子部品の貼着方向におけるパッド
の周縁とソルダレジストの開口部における開口縁は、間
隔をあけて配置すると共に、電子部品の貼着方向以外の
少なくとも２辺でパッドの周縁に重なるようソルダレジ
ストを配置したものである。Further, the peripheral edge of the pad in the direction of attaching the electronic component and the opening edge of the opening of the solder resist are spaced apart from each other, and at least two sides other than the attaching direction of the electronic component are attached to the peripheral edge of the pad. A solder resist is arranged so as to overlap.
【００１９】また、はんだ付けパッド開口面積を一定と
し、ソルダレジストで覆う分だけパッド面積を増加させ
るものである。Further, the opening area of the soldering pad is made constant, and the pad area is increased by the amount covered with the solder resist.
【００２０】また、開口部を設けてはんだ付け用パッド
が露出するよう基板表面にソルダレジストをコーティン
グし、かつパッドに電子部品が実装される電子回路板に
おいて、電子部品横に電子部品に沿うようソルダレジス
トの開口部を広げたものである。Further, in an electronic circuit board on which an electronic component is mounted on a surface of a substrate by coating a solder resist so that an opening is provided and a soldering pad is exposed, and an electronic component is mounted on the pad, the electronic component is arranged alongside the electronic component. The opening of the solder resist is enlarged.
【００２１】また、電子部品をはんだ付けするパッドを
備えた電子回路板において、パッドの電子部品の貼着方
向側端部に突起部を設け、突起部が電子部品横に臨むよ
うにしたものである。Further, in an electronic circuit board provided with a pad for soldering an electronic component, a projection is provided at an end of the pad in a direction in which the electronic component is attached, so that the projection faces the side of the electronic component. is there.
【００２２】また、電子部品をはんだ付けするパッドを
備えた電子回路板において、パッドを台形状とし、その
長辺が電子部品の貼着方向側になるように配置し、長辺
の寸法を電子部品の幅より大きくしてパッドの一部が電
子部品横に臨むようにしたものである。Further, in an electronic circuit board having pads for soldering electronic components, the pads are trapezoidal, and the long sides are arranged so as to be in the direction of sticking the electronic components, and the dimension of the long side is determined by the electronic component. The width of the pad is larger than the width of the component so that part of the pad faces the side of the electronic component.
【００２３】また、パッドに突起部を設ける又はパッド
を台形状にしたものにおいて、開口部を設けてはんだ付
け用パッドが露出するよう基板表面にソルダレジストを
コーティングしたものである。Further, in the case where the pad is provided with a protrusion or the pad is formed in a trapezoidal shape, the surface of the substrate is coated with a solder resist so that an opening is provided and the soldering pad is exposed.
【００２４】また、パッドに突起部を設ける又はパッド
を台形状にしたものにおいて、開口部を設けてはんだ付
け用パッドが露出するよう基板表面にソルダレジストを
コーティングし、電子部品の貼着方向におけるパッドの
周縁とソルダレジストの開口部における開口縁は、間隔
をあけて配置するものである。In the case where the pad is provided with a projection or the pad is trapezoidal, an opening is provided and the surface of the substrate is coated with a solder resist so that the soldering pad is exposed. The peripheral edge of the pad and the opening edge in the opening of the solder resist are arranged at an interval.
【００２５】また、ソルダレジストを設けないものにお
いて、パッドに突起部を設ける又はパッドを台形状にし
たものである。Further, in the case where no solder resist is provided, a projection is provided on the pad or the pad is trapezoidal.
【００２６】また、開口部を設けてはんだ付け用パッド
が露出するよう基板表面にソルダレジストをコーティン
グし、電子部品の貼着方向におけるパッドの周縁と前記
ソルダレジストの開口部における開口縁は、間隔をあけ
て配置し、電子部品の貼着方向以外の少なくとも２辺で
前記パッドの周縁に重なるようソルダレジストを配置し
たものである。Also, a solder resist is coated on the surface of the substrate so as to expose the soldering pad by providing an opening, and the peripheral edge of the pad in the direction of attaching the electronic component and the opening edge in the opening of the solder resist are spaced apart from each other. , And a solder resist is arranged so as to overlap the periphery of the pad on at least two sides other than the bonding direction of the electronic component.
【００２７】[0027]
【発明の実施の形態】以下、この発明の実施の形態を図
に基づいて説明する。 実施の形態１．図１乃至３は実施の形態１を示す図で、
図１は電子回路板の要部を拡大した平面図、図２は図１
のＡ−Ａ線断面図、図３は図１のＢ−Ｂ線断面図であ
る。電子回路板は、基板上の銅箔をエッチングなどの方
法で所定のパターンを形成した後、そのはんだ付けパッ
ド部以外にはんだの付着を防止するソルダレジストがコ
ーティングされている。図において、１はガラスエポキ
シなどで形成された基板、２は形成されたはんだ付け用
のパッド、３はソルダレジスト、４は最終的に２個のパ
ッド２にはんだ付けされる電子部品、５はソルダレジス
ト３に形成された開口部である。パッド２はソルダレジ
スト３に形成された矩形の開口部５に配置される。パッ
ド２の厚みは２０〜５０μｍ程度であり、ソルダレジス
ト３の厚みはそれよりも５〜２０μｍ程度薄く形成され
ている。Embodiments of the present invention will be described below with reference to the drawings. Embodiment 1 FIG. 1 to 3 show the first embodiment.
FIG. 1 is an enlarged plan view of a main part of the electronic circuit board, and FIG.
FIG. 3 is a sectional view taken along line AA of FIG. 1, and FIG. 3 is a sectional view taken along line BB of FIG. An electronic circuit board is formed by forming a predetermined pattern on a copper foil on a substrate by etching or the like, and then coating a solder resist for preventing adhesion of solder to portions other than the soldering pad portion. In the figure, 1 is a substrate formed of glass epoxy or the like, 2 is a formed soldering pad, 3 is a solder resist, 4 is an electronic component finally soldered to two pads 2, 5 is This is an opening formed in the solder resist 3. The pad 2 is arranged in a rectangular opening 5 formed in the solder resist 3. The thickness of the pad 2 is about 20 to 50 μm, and the thickness of the solder resist 3 is about 5 to 20 μm thinner.
【００２８】図２に示すように、ソルダレジスト３の開
口部５における開口縁は、電子部品４の貼着方向を除く
３辺においては位置ずれによってパッド２を覆わないよ
うパッド２の周縁より僅かに大きく開口し、電子部品４
の貼着方向においてはパッド２の周縁から５０μｍ以上
の大きな間隔を空けて開口している。As shown in FIG. 2, the opening edge of the opening 5 of the solder resist 3 is slightly smaller than the peripheral edge of the pad 2 so as not to cover the pad 2 due to misalignment on three sides other than the bonding direction of the electronic component 4. Opening in the electronic component 4
In the sticking direction, the pad 2 is opened at a large interval of 50 μm or more from the periphery of the pad 2.
【００２９】電子回路板に電子部品４をはんだ付けする
ために、パッド２上にソルダペーストを印刷などの方法
で塗布後、電子部品４を実装したときに塗布されている
ソルダペーストが押さえつけられてパッド２からはみ出
すが、電子部品４の貼着方向のソルダレジスト３はパッ
ド２の周縁から間隔を設けているため電子部品４下には
み出したソルダペーストはソルダレジスト３上まで至ら
ず、基板１上にのみ広がる。In order to solder the electronic component 4 to the electronic circuit board, after applying a solder paste on the pad 2 by printing or the like, the solder paste applied when the electronic component 4 is mounted is pressed down. Although the solder paste protrudes from the pad 2, the solder resist 3 in the bonding direction of the electronic component 4 is spaced from the periphery of the pad 2, so that the solder paste protruding below the electronic component 4 does not reach the solder resist 3 but on the substrate 1. Spread only in.
【００３０】続いてリフロー加熱時に実施する１５０℃
程度の予備加熱で流動性が高まったソルダペーストの広
がりを電子部品４下に配置したソルダレジスト３が防止
する。Successively, at 150 ° C., which is performed during reflow heating.
The solder resist 3 disposed under the electronic component 4 prevents the spread of the solder paste having increased fluidity due to the preliminary heating.
【００３１】この結果、電子部品４下に広がるソルダペ
ースト量が少なくなり、リフロー加熱してはんだを溶融
したときに電子部品４下に広がったソルダペーストとパ
ッド２上のはんだが一体となり、電子部品４横のはんだ
ボール発生を抑制することが可能となる。As a result, the amount of the solder paste spread under the electronic component 4 is reduced, and when the solder is melted by reflow heating, the solder paste spread under the electronic component 4 and the solder on the pad 2 are integrated, and It is possible to suppress the generation of four horizontal solder balls.
【００３２】実施の形態２．図４乃至９は実施の形態２
を示す図で、図４はパッドの２辺を覆った電子回路板の
要部を拡大した平面図、図５は図４のＡ−Ａ線断面図、
図６は図４のＢ−Ｂ線断面図、図７はパッドの３辺を覆
った電子回路板の要部を拡大した平面図、図８は図７の
Ａ−Ａ線断面図、図９は図７のＢ−Ｂ線断面図である。
上記実施の形態１では、ソルダレジスト３の開口部５に
おける開口縁は、電子部品４の貼着方向を除く３辺にお
いて、パッド２の周縁より僅かに大きくソルダレジスト
３を開口していたが、本実施の形態は電子部品４の貼着
方向を除く少なくとも２辺においてパッド２の周縁を僅
かに覆うよう開口し、電子部品４の貼着方向においては
パッド２の周縁から５０μｍ以上の間隔を空けて開口す
るものである。Embodiment 2 FIG. 4 to 9 show the second embodiment.
4 is an enlarged plan view of a main part of the electronic circuit board covering two sides of the pad, FIG. 5 is a cross-sectional view taken along line AA of FIG.
6 is a cross-sectional view taken along line BB of FIG. 4, FIG. 7 is an enlarged plan view of a main part of the electronic circuit board covering three sides of the pad, FIG. 8 is a cross-sectional view taken along line AA of FIG. FIG. 8 is a sectional view taken along line BB of FIG. 7.
In the first embodiment, the opening edge of the opening portion 5 of the solder resist 3 is slightly larger than the peripheral edge of the pad 2 on three sides excluding the direction in which the electronic component 4 is attached. In the present embodiment, an opening is provided so as to slightly cover the periphery of the pad 2 on at least two sides other than the bonding direction of the electronic component 4, and is spaced from the circumference of the pad 2 by 50 μm or more in the bonding direction of the electronic component 4. It opens.
【００３３】この実施の形態では、図６及び図９に示す
ようにパッド２上をソルダレジスト３が覆うよう開口
し、かつ電子部品４の貼着方向においてはパッド２の周
縁から５０μｍ以上の間隔を空けて開口する構成にした
ので、電子部品４下に広がるソルダペースト量を少なく
することができ、実施の形態１と同様に電子部品横のは
んだボール発生を抑制する効果を得られると共に、パッ
ド２上よりソルダレジスト３が高くなっているためリフ
ロー加熱時に実施する１５０℃程度の予備加熱で流動性
が高まったソルダペーストが電子部品４の周囲のソルダ
レジスト３上への広がりを防止でき、ソルダペースト中
のフラックスによる電子部品４の浮力が得られるため自
己位置補正作用を強く働かせることが可能となる。In this embodiment, as shown in FIG. 6 and FIG. 9, an opening is provided so as to cover the pad 2 with the solder resist 3, and a distance of 50 μm or more from the peripheral edge of the pad 2 in the direction in which the electronic component 4 is attached. Since the opening is formed with a gap, the amount of solder paste spreading under the electronic component 4 can be reduced, and the effect of suppressing the generation of solder balls beside the electronic component can be obtained as in the first embodiment. Since the solder resist 3 is higher than the solder resist 2 above, the solder paste whose fluidity has been increased by preheating at about 150 ° C. performed at the time of reflow heating can be prevented from spreading on the solder resist 3 around the electronic component 4. Since the buoyancy of the electronic component 4 is obtained by the flux in the paste, the self-position correcting action can be made to work strongly.
【００３４】また、従来と同一はんだ付けパッド開口面
積を得る場合、ソルダレジスト３で覆う分だけパッド面
積が増加し、ソルダレジスト３がパッド２を押える働き
をするためパッド２と基板１の密着力を向上させること
ができ、微小部品実装信頼性を向上させることが可能と
なる。In order to obtain the same solder pad opening area as in the prior art, the pad area is increased by the amount covered with the solder resist 3, and the solder resist 3 acts to press the pad 2, so that the adhesion between the pad 2 and the substrate 1 is increased. Can be improved, and the reliability of micro component mounting can be improved.
【００３５】実施の形態３．図１０乃至１２は実施の形
態３を示す図で、図１０は電子回路板の要部を拡大した
平面図、図１１は図１０のＡ−Ａ線断面図、図１２は図
１０のＢ−Ｂ線断面図である。上記実施の形態１では、
ソルダレジスト３の開口部５における開口縁は、電子部
品４の貼着方向を除く３辺において、パッド２の周縁よ
り僅かに大きくソルダレジスト３を開口していたが、更
に電子部品４横にソルダレジスト３の開口部５を電子部
品４に沿うように広げて開口するようにしてもよい。Embodiment 3 FIG. 10 to 12 show a third embodiment. FIG. 10 is an enlarged plan view of a main part of an electronic circuit board, FIG. 11 is a sectional view taken along line AA of FIG. 10, and FIG. It is a B sectional view. In the first embodiment,
The opening edge of the opening 5 of the solder resist 3 was slightly larger than the peripheral edge of the pad 2 on three sides excluding the bonding direction of the electronic component 4. The opening 5 of the resist 3 may be widened and opened along the electronic component 4.
【００３６】ソルダレジスト３の開口部５における開口
縁は、電子部品４の貼着方向を除く３辺において、パッ
ド２の周縁より僅かに大きくソルダレジスト３を開口
し、更にソルダレジスト３の開口部５を電子部品４に沿
うように、５０μｍ×５０μｍ以上のサイズで広げる。The opening edge of the opening 5 of the solder resist 3 is slightly larger than the peripheral edge of the pad 2 on three sides other than the bonding direction of the electronic component 4, and the opening of the solder resist 3 is further increased. 5 is spread in a size of 50 μm × 50 μm or more along the electronic component 4.
【００３７】この場合にも、電子部品４下に広がるソル
ダペースト量を少なくすることができ、またリフロー加
熱時のフラックスが広がる方向を電子部品４と基板１の
間ではなく、電子部品４の側面に沿うようコントロール
できるため電子部品４下に広がったソルダペーストとパ
ッド２上のはんだが一体となりやすく、実施の形態１と
同様に部品横のはんだボール発生を抑制する効果を得ら
れる。Also in this case, the amount of the solder paste spreading under the electronic component 4 can be reduced, and the direction in which the flux at the time of reflow heating spreads is not set between the electronic component 4 and the substrate 1 but on the side of the electronic component 4. Therefore, the solder paste spread under the electronic component 4 and the solder on the pad 2 can be easily integrated, and the effect of suppressing the generation of solder balls beside the component can be obtained as in the first embodiment.
【００３８】実施の形態４．図１３乃至１５は実施の形
態４を示す図で、図１３は電子回路板の要部を拡大した
平面図、図１４は図１３のＡ−Ａ線断面図、図１５は図
１３のＢ−Ｂ線断面図である。上記実施の形態１では、
ソルダレジスト３の開口部５における開口縁は、電子部
品４の貼着方向を除く３辺において、パッド２の周縁よ
り僅かに大きくソルダレジスト３を開口し、更に電子部
品４の貼着方向においてパッド２の周縁から間隔を空け
て開口していたが、本実施の形態ではそれらに加えてパ
ッド２の電子部品４の貼着方向の端部両側に電子部品４
と垂直となるよう２０μｍ以上の突起部６を形成し、ソ
ルダレジスト３もその形状に合わせたものである。Embodiment 4 FIG. 13 to 15 show the fourth embodiment, FIG. 13 is an enlarged plan view of a main part of the electronic circuit board, FIG. 14 is a sectional view taken along line AA of FIG. 13, and FIG. It is a B sectional view. In the first embodiment,
The opening edge of the opening 5 of the solder resist 3 is slightly larger than the peripheral edge of the pad 2 on three sides other than the bonding direction of the electronic component 4, and the pad is opened in the bonding direction of the electronic component 4. In the present embodiment, in addition to these, the electronic components 4 are provided on both sides of the end of the pad 2 in the attaching direction of the electronic component 4.
A protrusion 6 of 20 μm or more is formed so as to be perpendicular to the solder resist 3, and the solder resist 3 is also adapted to the shape.
【００３９】パッド２に電子部品４と垂直となるよう２
０μｍ以上の突起部６を形成することで、電子部品横の
はんだボール発生を抑制する効果を得られるが、それに
加えて電子部品４の貼着方向においてはパッド２の周縁
から５０μｍ以上の間隔を空けてソルダレジスト３の開
口縁を配置することで効果が高まる。The pad 2 is set so as to be perpendicular to the electronic component 4.
By forming the projections 6 of 0 μm or more, the effect of suppressing the generation of solder balls on the side of the electronic component can be obtained. In addition, in the bonding direction of the electronic component 4, the interval of 50 μm or more from the periphery of the pad 2 is required. The effect is enhanced by arranging the opening edge of the solder resist 3 in a space.
【００４０】本実施の形態によれば、実施の形態３に加
えパッド２が電子部品４横にあるため、更にはんだ溶融
時に電子部品４下に広がったソルダペーストとパッド２
上のはんだが一体となりやすく、実施の形態１と同様に
電子部品横のはんだボール発生を抑制する効果が得られ
る。また、電子部品４の貼着方向においてパッド２の周
縁から５０μｍ以上の間隔を空けてソルダレジスト３の
開口縁を配置することで効果が高まる。According to the present embodiment, in addition to the third embodiment, since the pad 2 is located beside the electronic component 4, the solder paste and the pad 2 spread below the electronic component 4 when the solder is melted further.
The upper solder is easily integrated, and an effect of suppressing the generation of solder balls beside the electronic component can be obtained as in the first embodiment. Further, the effect is enhanced by arranging the opening edge of the solder resist 3 at a distance of 50 μm or more from the peripheral edge of the pad 2 in the attaching direction of the electronic component 4.
【００４１】尚、本実施の形態におけるパッド形状の場
合、ソルダレジストを設けない電子回路板に対しても有
効である。In the case of the pad shape according to the present embodiment, the present invention is also effective for an electronic circuit board having no solder resist.
【００４２】実施の形態５．図１６乃至１８は実施の形
態５を示す図で、図１６は電子回路板の要部を拡大した
平面図、図１７は図１６のＡ−Ａ線断面図、図１８は図
１６のＢ−Ｂ線断面図である。上記実施の形態４では、
ソルダレジスト３の開口部５における開口縁は、電子部
品４の貼着方向を除く３辺において、パッド２の周縁よ
り僅かに大きくソルダレジスト３を開口し、更に電子部
品４横に突起部６を持つパッド形状としたが、本実施の
形態では、電子部品側が長い辺となり、対向する辺と滑
らかに結ぶ台形状のパッド２とし、ソルダレジスト３の
開口部５の形状もパッド２の形状に合わせたものであ
る。パッド２の電子部品側の長辺を電子部品４の幅より
長くすることで、パッド２の一部を電子部品４の横に配
設することができる。Embodiment 5 FIG. 16 to 18 show the fifth embodiment. FIG. 16 is an enlarged plan view of a main part of the electronic circuit board, FIG. 17 is a sectional view taken along line AA of FIG. 16, and FIG. It is a B sectional view. In Embodiment 4 described above,
The opening edge of the opening 5 of the solder resist 3 is slightly larger than the peripheral edge of the pad 2 on the three sides excluding the bonding direction of the electronic component 4, and the protrusion 6 is formed on the side of the electronic component 4. In this embodiment, the electronic component side is a long side, and in this embodiment, the trapezoidal pad 2 is smoothly connected to the opposing side. It is a thing. By making the long side of the electronic component 4 of the pad 2 longer than the width of the electronic component 4, a part of the pad 2 can be arranged beside the electronic component 4.
【００４３】パッド２を上記のような台形状とすること
で、はんだボール発生を抑制する効果を得られるが、そ
れに加えて電子部品４の貼着方向においてはパッド２の
周縁から５０μｍ以上の間隔を空けてソルダレジスト３
の開口縁を配置することで効果が高まる。By forming the pad 2 in the trapezoidal shape as described above, the effect of suppressing the generation of solder balls can be obtained. In addition, in the direction in which the electronic component 4 is attached, a distance of 50 μm or more from the periphery of the pad 2 is obtained. With solder resist 3
The effect is enhanced by arranging the opening edges.
【００４４】本実施の形態によれば、実施の形態４と同
様にパッド２が電子部品４横にあるため、更にはんだ溶
融時に電子部品４下に広がったソルダペーストとパッド
２上のはんだが一体となりやすく、実施の形態１と同様
に部品横のはんだボール発生を抑制する効果を得られ
る。また、電子部品４の貼着方向においてパッド２の周
縁から５０μｍ以上の間隔を空けてソルダレジスト３の
開口縁を配置することで効果が高まる。According to the present embodiment, since pad 2 is on the side of electronic component 4 as in the fourth embodiment, the solder paste spread under electronic component 4 when the solder is further melted and the solder on pad 2 are integrated. Thus, the effect of suppressing the generation of solder balls beside components can be obtained as in the first embodiment. Further, the effect is enhanced by arranging the opening edge of the solder resist 3 at a distance of 50 μm or more from the peripheral edge of the pad 2 in the attaching direction of the electronic component 4.
【００４５】尚、本実施の形態におけるパッド形状の場
合、ソルダレジストを設けない電子回路板に対しても有
効である。In the case of the pad shape according to the present embodiment, it is effective for an electronic circuit board without a solder resist.
【００４６】実施の形態６．図１９乃至２１は実施の形
態６を示す図で、図１９は電子回路板の要部を拡大した
平面図、図２０は図１９のＡ−Ａ線断面図、図２１は図
１９のＢ−Ｂ線断面図である。上記実施の形態５では、
電子部品側を除く３辺において、パッド２の周縁より僅
かに大きくソルダレジスト３を開口した台形状パッド形
状の例を示したが、本実施の形態は、それに加えて電子
部品側を除く少なくとも２辺においてパッド２の周縁を
僅かに覆うようソルダレジスト３を開口し、電子部品側
においてはパッド２から５０μｍ以上の間隔を空けてソ
ルダレジスト３を開口したものである。Embodiment 6 FIG. 19 to 21 show the sixth embodiment. FIG. 19 is an enlarged plan view of a main part of the electronic circuit board, FIG. 20 is a sectional view taken along the line AA of FIG. 19, and FIG. It is a B sectional view. In the fifth embodiment,
Although an example of a trapezoidal pad shape in which the solder resist 3 is opened slightly larger than the periphery of the pad 2 on three sides excluding the electronic component side has been described, the present embodiment additionally has at least two trapezoidal shapes excluding the electronic component side. The solder resist 3 is opened so as to slightly cover the periphery of the pad 2 on the side, and the solder resist 3 is opened at an interval of 50 μm or more from the pad 2 on the electronic component side.
【００４７】本実施の形態によれば、実施の形態５と同
様にパッド２が電子部品４横にあるため、更にはんだ溶
融時にはんだ溶融時に電子部品４下に広がったソルダペ
ーストとパッド２上のはんだと一体となりやすく、実施
の形態１と同様に部品横のはんだボール発生を抑制する
効果を得られる。また、実施の形態２と同じくパッド２
上をソルダレジスト３が覆っているためリフロー加熱時
に実施する１５０℃程度の予備加熱で流動性が高まった
ソルダペーストが電子部品４の周囲のソルダレジスト３
上への広がりを防止でき、ソルダペースト中のフラック
スによる電子部品の浮力が得られるため自己位置補正作
用を強く働かせることが可能となる。According to the present embodiment, the pad 2 is located beside the electronic component 4 in the same manner as in the fifth embodiment. It is easy to be integrated with the solder, and an effect of suppressing the generation of solder balls beside components can be obtained as in the first embodiment. Also, as in the second embodiment, the pad 2
Since the solder resist 3 covers the upper part, the solder paste whose fluidity has been increased by preheating at about 150 ° C. performed during reflow heating is applied to the solder resist 3 around the electronic component 4.
Spreading upward can be prevented, and the buoyancy of the electronic component due to the flux in the solder paste can be obtained, so that the self-position correction function can be strongly exerted.
【００４８】また、従来と同一はんだ付けパッド開口面
積を得る場合、ソルダレジスト３で覆う分だけパッド面
積が増加し、ソルダレジスト３がパッド２を押える働き
をするためパッド２と基板１の密着力を向上させること
ができ、微小部品実装信頼性を向上させることが可能と
なる。In order to obtain the same solder pad opening area as the conventional one, the pad area is increased by the amount covered with the solder resist 3 and the solder resist 3 acts to press the pad 2, so that the adhesion between the pad 2 and the substrate 1 is increased. Can be improved, and the reliability of micro component mounting can be improved.
【００４９】[0049]
【発明の効果】以上のようにこの発明によれば、電子部
品の自己位置補正作用を弱めることなく電子部品横のは
んだボール発生を抑制し、高密度実装に適した電子回路
板を得ることができる。As described above, according to the present invention, it is possible to obtain an electronic circuit board suitable for high-density mounting by suppressing the occurrence of solder balls beside electronic components without weakening the self-position correcting action of the electronic components. it can.
【図面の簡単な説明】[Brief description of the drawings]
【図１】 実施の形態１を示す図で、電子回路板の要部
を拡大した平面図である。FIG. 1 shows the first embodiment, and is an enlarged plan view of a main part of an electronic circuit board.
【図２】 実施の形態１を示す図で、図１のＡ−Ａ線断
面図である。FIG. 2 shows the first embodiment, and is a cross-sectional view taken along line AA of FIG.
【図３】 実施の形態１を示す図で、図１のＢ−Ｂ線断
面図である。FIG. 3 shows the first embodiment, and is a cross-sectional view taken along the line BB of FIG. 1;
【図４】 実施の形態２を示す図で、パッドの２辺を覆
った電子回路板の要部を拡大した平面図である。FIG. 4 is a diagram showing the second embodiment, and is an enlarged plan view of a main part of an electronic circuit board covering two sides of a pad.
【図５】 実施の形態２を示す図で、図４のＡ−Ａ線断
面図である。FIG. 5 is a view showing the second embodiment, and is a cross-sectional view taken along line AA of FIG. 4;
【図６】 実施の形態２を示す図で、図４のＢ−Ｂ線断
面図である。FIG. 6 shows the second embodiment, and is a cross-sectional view taken along line BB of FIG.
【図７】 実施の形態２を示す図で、パッドの３辺を覆
った電子回路板の要部を拡大した平面図である。FIG. 7 is a diagram showing the second embodiment, and is an enlarged plan view of a main part of an electronic circuit board covering three sides of a pad.
【図８】 実施の形態２を示す図で、図７のＡ−Ａ線断
面図である。8 is a view showing the second embodiment, and is a cross-sectional view taken along the line AA of FIG. 7;
【図９】 実施の形態２を示す図で、図７のＢ−Ｂ線断
面図である。FIG. 9 is a view showing the second embodiment, and is a cross-sectional view taken along the line BB of FIG. 7;
【図１０】 実施の形態３を示す図で、電子回路板の要
部を拡大した平面図である。FIG. 10 is a diagram showing the third embodiment, and is an enlarged plan view of a main part of the electronic circuit board.
【図１１】 実施の形態３を示す図で、図１０のＡ−Ａ
線断面図である。11 is a diagram showing Embodiment Mode 3, and is a diagram showing AA of FIG. 10;
It is a line sectional view.
【図１２】 実施の形態３を示す図で、図１０のＢ−Ｂ
線断面図である。FIG. 12 is a view showing the third embodiment, and is BB in FIG. 10;
It is a line sectional view.
【図１３】 実施の形態４を示す図で、電子回路板の要
部を拡大した平面図である。FIG. 13 is a diagram showing the fourth embodiment, and is an enlarged plan view of a main part of the electronic circuit board.
【図１４】 実施の形態４を示す図で、図１３のＡ−Ａ
線断面図である。FIG. 14 is a view showing the fourth embodiment, and is AA in FIG. 13;
It is a line sectional view.
【図１５】 実施の形態４を示す図で、図１３のＢ−Ｂ
線断面図である。FIG. 15 is a view showing the fourth embodiment, and is BB in FIG. 13;
It is a line sectional view.
【図１６】 実施の形態５を示す図で、電子回路板の要
部を拡大した平面図である。FIG. 16 is a diagram showing the fifth embodiment, and is an enlarged plan view of a main part of the electronic circuit board.
【図１７】 実施の形態５を示す図で、図１６のＡ−Ａ
線断面図である。FIG. 17 is a diagram showing the fifth embodiment, and is AA in FIG. 16;
It is a line sectional view.
【図１８】 実施の形態５を示す図で、図１６のＢ−Ｂ
線断面図である。FIG. 18 is a diagram showing the fifth embodiment, and is a cross-sectional view taken along line BB of FIG. 16;
It is a line sectional view.
【図１９】 実施の形態６を示す図で、電子回路板の要
部を拡大した平面図である。FIG. 19 is a diagram showing the sixth embodiment, and is an enlarged plan view of a main part of the electronic circuit board.
【図２０】 実施の形態６を示す図で、図１９のＡ−Ａ
線断面図である。FIG. 20 is a view showing the sixth embodiment, and is AA in FIG. 19;
It is a line sectional view.
【図２１】 実施の形態６を示す図で、図１９のＢ−Ｂ
線断面図である。FIG. 21 is a diagram showing the sixth embodiment, and is a cross-sectional view taken along line BB of FIG. 19;
It is a line sectional view.
【図２２】 従来の電子回路板の要部を拡大した平面図
である。FIG. 22 is an enlarged plan view of a main part of a conventional electronic circuit board.
【図２３】 図２２のＡ−Ａ線断面図である。23 is a sectional view taken along line AA of FIG. 22.
【図２４】 図２２のＢ−Ｂ線断面図である。24 is a sectional view taken along line BB of FIG. 22.
【図２５】 他の従来の電子回路板の要部を拡大した平
面図である。FIG. 25 is an enlarged plan view of a main part of another conventional electronic circuit board.
【図２６】 図２５のＡ−Ａ線断面図である。26 is a sectional view taken along line AA of FIG. 25.
【図２７】 図２５のＢ−Ｂ線断面図である。FIG. 27 is a sectional view taken along line BB of FIG. 25.
１ 基板、２ パッド、３ ソルダレジスト、４ 電子
部品、５ 開口部、６突起部。1 substrate, 2 pads, 3 solder resist, 4 electronic components, 5 openings, 6 protrusions.
Claims (13)
出するよう基板表面にソルダレジストをコーティング
し、かつ前記パッドに電子部品が実装される電子回路板
において、 前記電子部品の貼着方向における前記パッドの周縁と前
記ソルダレジストの開口部における開口縁は、間隔をあ
けて配置することを特徴とする電子回路板。1. An electronic circuit board in which an opening is provided and a solder resist is coated on a substrate surface so that a soldering pad is exposed, and an electronic component is mounted on the pad. An electronic circuit board, wherein a peripheral edge of the pad and an opening edge in an opening of the solder resist are spaced from each other.
ッドの周縁と前記ソルダレジストの開口部における開口
縁との間隔は、前記パッド上にソルダペーストを塗布
後、前記電子部品を実装したときに前記パッドから前記
電子部品下にはみだした前記ソルダペーストが前記ソル
ダレジストの開口縁まで至らない距離とすることを特徴
とする請求項１記載の電子回路板。2. A gap between a peripheral edge of the pad and an opening edge of an opening of the solder resist in a bonding direction of the electronic component is determined by applying a solder paste on the pad and mounting the electronic component. 2. The electronic circuit board according to claim 1, wherein the solder paste protruding under the electronic component from the pad does not reach the opening edge of the solder resist.
ッドの周縁と前記ソルダレジストの開口部における開口
縁は、５０μｍ以上の間隔をあけて配置することを特徴
とする請求項２記載の電子回路板。3. The electronic circuit according to claim 2, wherein a peripheral edge of said pad in an attaching direction of said electronic component and an opening edge of an opening of said solder resist are arranged at an interval of 50 μm or more. Board.
子部品の貼着方向を除いて、前記パッドより僅かに大き
く開口していることを特徴とする請求項１記載の電子回
路板。4. The electronic circuit board according to claim 1, wherein an opening of the solder resist is slightly larger than the pad except for a direction in which the electronic component is attached.
も２辺で前記パッドの周縁に重なるよう前記ソルダレジ
ストを配置したことを特徴とする請求項１記載の電子回
路板。5. The electronic circuit board according to claim 1, wherein the solder resist is arranged so as to overlap the periphery of the pad on at least two sides other than the direction in which the electronic component is attached.
前記ソルダレジストで覆う分だけパッド面積を増加させ
ることを特徴とする請求項５記載の電子回路板。6. The solder pad opening area is fixed,
6. The electronic circuit board according to claim 5, wherein a pad area is increased by an amount corresponding to the solder resist.
出するよう基板表面にソルダレジストをコーティング
し、かつ前記パッドに電子部品が実装される電子回路板
において、 前記電子部品横に該電子部品に沿うよう前記ソルダレジ
ストの開口部を広げたことを特徴とする電子回路板。7. An electronic circuit board in which an opening is provided and a solder resist is coated on a surface of a substrate so that a soldering pad is exposed, and an electronic component is mounted on the pad, wherein the electronic component is provided next to the electronic component. An electronic circuit board, wherein an opening of the solder resist is widened so as to conform to the above.
た電子回路板において、前記パッドの前記電子部品の貼
着方向側端部に突起部を設け、該突起部が前記電子部品
横に臨むようにしたことを特徴とする電子回路板。8. An electronic circuit board having a pad for soldering an electronic component, wherein a projection is provided at an end of the pad in a direction in which the electronic component is attached, and the projection faces the side of the electronic component. An electronic circuit board, characterized in that:
た電子回路板において、前記パッドを台形状とし、その
長辺が前記電子部品の貼着方向側になるように配置し、
長辺の寸法を前記電子部品の幅より大きくして該パッド
の一部が前記電子部品横に臨むようにしたことを特徴と
する電子回路板。9. An electronic circuit board having a pad for soldering an electronic component, wherein the pad has a trapezoidal shape, and is disposed such that a long side thereof is on a sticking direction side of the electronic component.
An electronic circuit board, wherein a dimension of a long side is larger than a width of the electronic component so that a part of the pad faces a side of the electronic component.
露出するよう基板表面にソルダレジストをコーティング
したことを特徴とする請求項８又は請求項９記載の電子
回路板。10. The electronic circuit board according to claim 8, wherein the substrate surface is coated with a solder resist so that an opening is provided to expose the soldering pad.
パッドの周縁と前記ソルダレジストの開口部における開
口縁は、間隔をあけて配置することを特徴とする請求項
１０記載の電子回路板。11. The electronic circuit board according to claim 10, wherein a peripheral edge of said pad in an attaching direction of said electronic component and an opening edge of an opening of said solder resist are arranged at an interval.
とする請求項８又は請求項９記載の電子回路板。12. The electronic circuit board according to claim 8, wherein no solder resist is provided.
露出するよう基板表面にソルダレジストをコーティング
し、前記電子部品の貼着方向における前記パッドの周縁
と前記ソルダレジストの開口部における開口縁は、間隔
をあけて配置し、前記電子部品の貼着方向以外の少なく
とも２辺で前記パッドの周縁に重なるよう前記ソルダレ
ジストを配置したことを特徴とする請求項９記載の電子
回路板。13. A solder resist is coated on a substrate surface so as to expose an soldering pad by providing an opening, and a peripheral edge of the pad in an attaching direction of the electronic component and an opening edge of the opening of the solder resist are formed. 10. The electronic circuit board according to claim 9, wherein the solder resist is arranged at intervals, and the solder resist is arranged so as to overlap the periphery of the pad on at least two sides other than the bonding direction of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001182360A JP2002374060A (en) | 2001-06-15 | 2001-06-15 | Electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001182360A JP2002374060A (en) | 2001-06-15 | 2001-06-15 | Electronic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002374060A true JP2002374060A (en) | 2002-12-26 |
Family
ID=19022480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001182360A Pending JP2002374060A (en) | 2001-06-15 | 2001-06-15 | Electronic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002374060A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004228364A (en) * | 2003-01-23 | 2004-08-12 | Toyota Industries Corp | Surface mounting structure of surface mounting electronic part |
| JP2006108449A (en) * | 2004-10-06 | 2006-04-20 | Nitto Denko Corp | Wiring circuit board and its manufacturing method |
| WO2012172890A1 (en) * | 2011-06-15 | 2012-12-20 | 住友電工プリントサーキット株式会社 | Printed-wiring board, electronic-component mounting structure, and method for manufacturing electronic-component mounting structure |
| JP2015056228A (en) * | 2013-09-10 | 2015-03-23 | 株式会社小糸製作所 | Printed circuit board and vehicular lighting fixture |
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|---|---|---|---|---|
| JPH0323965U (en) * | 1989-07-15 | 1991-03-12 | ||
| JPH0661629A (en) * | 1992-08-12 | 1994-03-04 | Unisia Jecs Corp | Printed wiring board |
| JPH0710976U (en) * | 1993-07-28 | 1995-02-14 | キンセキ株式会社 | Substrate resist coating structure |
| JPH07297526A (en) * | 1994-04-20 | 1995-11-10 | Nec Niigata Ltd | Printed-circuit board |
| JP2000022315A (en) * | 1998-06-29 | 2000-01-21 | Unisia Jecs Corp | Circuit components mounting board |
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2001
- 2001-06-15 JP JP2001182360A patent/JP2002374060A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323965U (en) * | 1989-07-15 | 1991-03-12 | ||
| JPH0661629A (en) * | 1992-08-12 | 1994-03-04 | Unisia Jecs Corp | Printed wiring board |
| JPH0710976U (en) * | 1993-07-28 | 1995-02-14 | キンセキ株式会社 | Substrate resist coating structure |
| JPH07297526A (en) * | 1994-04-20 | 1995-11-10 | Nec Niigata Ltd | Printed-circuit board |
| JP2000022315A (en) * | 1998-06-29 | 2000-01-21 | Unisia Jecs Corp | Circuit components mounting board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004228364A (en) * | 2003-01-23 | 2004-08-12 | Toyota Industries Corp | Surface mounting structure of surface mounting electronic part |
| JP2006108449A (en) * | 2004-10-06 | 2006-04-20 | Nitto Denko Corp | Wiring circuit board and its manufacturing method |
| JP4588405B2 (en) * | 2004-10-06 | 2010-12-01 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
| WO2012172890A1 (en) * | 2011-06-15 | 2012-12-20 | 住友電工プリントサーキット株式会社 | Printed-wiring board, electronic-component mounting structure, and method for manufacturing electronic-component mounting structure |
| JP2015056228A (en) * | 2013-09-10 | 2015-03-23 | 株式会社小糸製作所 | Printed circuit board and vehicular lighting fixture |
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