JP2002313891A - Tray for substrate transport and manufacturing method therefor - Google Patents
Tray for substrate transport and manufacturing method thereforInfo
- Publication number
- JP2002313891A JP2002313891A JP2001116570A JP2001116570A JP2002313891A JP 2002313891 A JP2002313891 A JP 2002313891A JP 2001116570 A JP2001116570 A JP 2001116570A JP 2001116570 A JP2001116570 A JP 2001116570A JP 2002313891 A JP2002313891 A JP 2002313891A
- Authority
- JP
- Japan
- Prior art keywords
- tray
- substrate
- concave portion
- hole
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は基板を載置して搬送
および処理を行うための基板搬送用トレーおよびその製
造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate carrying tray for carrying a substrate and carrying and processing the substrate, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来基板上に回路パターンを形成する方
法としては、基板に金属からなる薄膜を形成し、前記金
属からなる薄膜上にレジストを塗布し、露光装置を用い
て基板上に所望の回路パターンを露光し、現像した後、
エッチングし、アッシングし、リンスする方法が用いら
れている。2. Description of the Related Art Conventionally, as a method of forming a circuit pattern on a substrate, a thin film made of a metal is formed on a substrate, a resist is applied on the thin film made of the metal, and a desired pattern is formed on the substrate using an exposure apparatus. After exposing and developing the circuit pattern,
Etching, ashing, and rinsing methods are used.
【０００３】これらの工程の中でエッチング、アッシン
グ、リンス処理は、一般に基板を搬送用トレーに載置し
て連続して行われる。このためアッシング後の基板には
アッシングに用いたガスが残留し、次のリンス処理で用
いる水と反応して腐食性のある酸が形成され、前記基板
搬送用トレーを溶解させるという問題が発生する。In these processes, etching, ashing, and rinsing are generally performed continuously with a substrate placed on a transfer tray. For this reason, the gas used for ashing remains on the substrate after ashing, and reacts with water used in the next rinsing process to form a corrosive acid, which causes a problem that the substrate transport tray is dissolved. .
【０００４】一方この問題を解決するために、基板搬送
用トレー自体をセラミックで構成したり、金属製トレー
本体の表面にセラミックの皮膜を形成したりして耐久性
を向上させる構成が知られている。On the other hand, in order to solve this problem, there has been known a structure in which the substrate transfer tray itself is made of ceramic or a ceramic film is formed on the surface of a metal tray body to improve durability. I have.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
ように基板搬送用トレー自体をセラミックで構成した
り、金属製トレー本体の表面にセラミックの皮膜を形成
したりすると、耐久性は向上するが表面の凹凸が大きく
基板と密着しにくい上、セラミックと基板との熱伝導性
が悪いため、基板表面に温度分布が生じ易くなる。However, if the substrate transfer tray itself is made of ceramic or a ceramic film is formed on the surface of the metal tray body as in the prior art, the durability is improved, but the surface is not improved. The unevenness of the substrate is large, it is difficult to adhere to the substrate, and the thermal conductivity between the ceramic and the substrate is poor, so that a temperature distribution is easily generated on the substrate surface.
【０００６】このようなトレーをドライエッチングなど
に使用すると、基板表面に生じた温度分布によりエッチ
ング状態に差異を生じ、熱伝導の悪い部分では基板の表
面温度が上昇し、レジストが変形してパターンの寸法精
度が悪くなったり、サイドエッチングが生じ、回路パタ
ーンの線幅などがばらつくという課題を有していた。When such a tray is used for dry etching or the like, a difference occurs in an etching state due to a temperature distribution generated on the surface of the substrate. However, there has been a problem that the dimensional accuracy is deteriorated, side etching occurs, and the line width of the circuit pattern varies.
【０００７】本発明は上記従来の課題を解決するもので
あり、基板搬送用トレーと基板の熱伝導性を良くするこ
とにより基板の温度分布を均一にし、回路パターンの線
幅などをばらつきにくくするとともに、エッチング、ア
ッシング、リンス処理などに用いることのできる耐久性
のある基板搬送用トレーを提供することを目的とするも
のである。The present invention has been made to solve the above-mentioned conventional problems, and improves the thermal conductivity of the substrate carrying tray and the substrate to make the temperature distribution of the substrate uniform and to reduce the variation in the line width of the circuit pattern. It is another object of the present invention to provide a durable substrate transport tray that can be used for etching, ashing, rinsing, and the like.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明は以下の構成を有するものである。In order to achieve the above object, the present invention has the following arrangement.
【０００９】本発明の請求項１に記載の発明は、凹部を
有し、熱伝導性に優れた物質からなるトレー本体の一部
表面を絶縁性を有するとともに柔軟性を有する物質で構
成した構成を有しており、これにより基板と基板搬送用
トレーの密着性を向上させるという作用効果が得られ
る。The invention according to claim 1 of the present invention has a structure in which a part of a tray body having a concave portion and made of a material having excellent heat conductivity is made of a material having insulation and flexibility. This has the effect of improving the adhesion between the substrate and the substrate transport tray.
【００１０】本発明の請求項２に記載の発明は、熱伝導
性に優れた物質はアルミニウム、アルミニウム合金、
銅、銅合金のうちのいずれかであるという構成を有して
おり、これにより基板搬送用トレーの熱伝導性を良くす
るという作用効果が得られる。According to a second aspect of the present invention, the material having excellent thermal conductivity is aluminum, an aluminum alloy,
It has a configuration in which it is either copper or a copper alloy, whereby the effect of improving the thermal conductivity of the substrate carrying tray can be obtained.
【００１１】本発明の請求項３に記載の発明は、絶縁性
を有しかつ柔軟性を有する物質で構成した部分はトレー
本体の凹部の表面であるという構成を有しており、これ
により基板を基板搬送用トレーの凹部に静電吸着させる
という作用効果が得られる。According to a third aspect of the present invention, the portion made of a material having an insulating property and flexibility is a surface of the concave portion of the tray main body, whereby the substrate is formed. The effect of electrostatic adsorption on the concave portion of the substrate carrying tray is obtained.
【００１２】本発明の請求項４に記載の発明は、絶縁性
を有しかつ柔軟性を有する物質はポリイミドであるとい
う構成を有しており、これにより基板と基板搬送用トレ
ーの熱伝導性を高めるとともに、基板を基板搬送用トレ
ーに静電吸着させるという作用効果が得られる。According to a fourth aspect of the present invention, there is provided a structure in which the insulating and flexible substance is polyimide, whereby the thermal conductivity of the substrate and the substrate carrying tray is reduced. And the effect of electrostatically attracting the substrate to the substrate transport tray is obtained.
【００１３】本発明の請求項５に記載の発明は、トレー
本体の凹部に載置された基板を取り出すための突き上げ
用ピンが通る貫通孔および基板を吸着するための貫通孔
を設けた構成を有しており、これにより基板を容易に取
り出せるとともに、基板を基板搬送用トレーに吸着でき
るという作用効果が得られる。According to a fifth aspect of the present invention, there is provided a structure in which a through-hole through which a push-up pin for taking out a substrate placed in a concave portion of a tray main body and a through-hole for sucking a substrate are provided. Accordingly, there is obtained an operational effect that the substrate can be easily taken out and the substrate can be sucked to the substrate carrying tray.
【００１４】本発明の請求項６に記載の発明は、凹部を
有し、熱伝導性に優れた物質からなるトレー本体の凹部
の表面は絶縁性を有しかつ柔軟性を有する物質で構成
し、前記トレー本体の凹部より外側の表面は耐蝕性また
は耐スパッタリング性を有する物質であるという構成を
有しており、これにより基板と基板搬送用トレーの熱伝
導性を高め、基板を基板搬送用トレーに静電吸着させる
とともに、基板搬送用トレーの耐久性を向上させるとい
う作用効果が得られる。According to a sixth aspect of the present invention, the surface of the concave portion of the tray body, which has a concave portion and is made of a material having excellent thermal conductivity, is made of an insulating and flexible material. The surface of the tray body outside the recess is made of a material having corrosion resistance or sputtering resistance, thereby increasing the thermal conductivity of the substrate and the substrate transfer tray, and transferring the substrate to the substrate transfer substrate. The effect of electrostatically adsorbing the tray and improving the durability of the substrate transport tray can be obtained.
【００１５】本発明の請求項７に記載の発明は、熱伝導
性に優れた物質はアルミニウム、アルミニウム合金、
銅、銅合金のうちのいずれかであるという構成を有して
おり、これにより基板搬送用トレーの熱伝導性を高め、
均熱化できるという作用効果が得られる。According to a seventh aspect of the present invention, the material having excellent thermal conductivity is aluminum, an aluminum alloy,
Copper, has a configuration that is one of the copper alloy, thereby increasing the thermal conductivity of the substrate transport tray,
The effect of being able to equalize the temperature is obtained.
【００１６】本発明の請求項８に記載の発明は、絶縁性
を有しかつ柔軟性を有する物質で構成した部分はトレー
本体の凹部の表面であるという構成を有しており、これ
により基板を基板搬送用トレーの凹部に静電吸着させる
という作用効果が得られる。The invention according to claim 8 of the present invention has a structure in which the portion made of an insulating and flexible material is the surface of the concave portion of the tray main body, whereby the substrate The effect of electrostatic adsorption on the concave portion of the substrate carrying tray is obtained.
【００１７】本発明の請求項９に記載の発明は、絶縁性
を有しかつ柔軟性を有する物質はポリイミドであるとい
う構成を有しており、これにより基板と基板搬送用トレ
ーの熱伝導性を高めるとともに、基板を基板搬送用トレ
ーに静電吸着させるという作用効果が得られる。According to a ninth aspect of the present invention, there is provided a structure in which the material having an insulating property and flexibility is polyimide, whereby the substrate and the tray for transporting the substrate are thermally conductive. And the effect of electrostatically attracting the substrate to the substrate transport tray is obtained.
【００１８】本発明の請求項１０に記載の発明は、耐蝕
性または耐スパッタリング性を有する物質は白金、アル
マイト、セラミックのうちのいずれかであるという構成
を有しており、これにより基板搬送用トレーの耐久性を
高めることができるという作用効果が得られる。According to a tenth aspect of the present invention, the substance having corrosion resistance or sputtering resistance has a structure in which it is one of platinum, alumite, and ceramic, and thereby, the substrate transport The operational effect that the durability of the tray can be increased can be obtained.
【００１９】本発明の請求項１１に記載の発明は、トレ
ー本体の凹部に載置された基板を取り出すための突き上
げ用ピンが通る貫通孔および基板を吸着するための貫通
孔を設けた構成を有しており、これにより基板を容易に
取り出せるとともに、基板を基板搬送用トレーに吸着で
きるという作用効果が得られる。According to an eleventh aspect of the present invention, there is provided a structure in which a through-hole through which a push-up pin for taking out a substrate placed in a concave portion of a tray main body and a through-hole for sucking a substrate are provided. Accordingly, there is obtained an operational effect that the substrate can be easily taken out and the substrate can be sucked to the substrate carrying tray.
【００２０】本発明の請求項１２に記載の発明は、トレ
ー本体の凹部に貫通孔を有する溝を設けたという構成を
有しており、これにより基板と基板搬送用トレーの間の
気体を容易に抜くことができるという作用効果が得られ
る。The twelfth aspect of the present invention has a configuration in which a groove having a through hole is provided in a concave portion of the tray main body, thereby facilitating gas between the substrate and the substrate transport tray. The effect of being able to be pulled out is obtained.
【００２１】本発明の請求項１３に記載の発明は、貫通
孔を有する溝は凹部の外周部に形成し、載置された基板
を取り出すための突き上げ用ピンが通る貫通孔は前記凹
部の中央部に形成した構成を有しており、これにより基
板と基板搬送用のトレーの間の空気などの気体を容易に
抜くことができるという作用効果が得られる。According to a thirteenth aspect of the present invention, the groove having the through hole is formed in the outer peripheral portion of the concave portion, and the through hole through which the push-up pin for taking out the mounted substrate passes is formed at the center of the concave portion. This has the effect of being able to easily remove gas such as air between the substrate and the tray for transporting the substrate.
【００２２】本発明の請求項１４に記載の発明は、貫通
孔を有する溝はトレー本体の凹部に中央部に形成し、載
置された基板を取り出すための突き上げ用ピンが通る貫
通孔を前記トレー本体の凹部の外周部に形成した構成を
有しており、これにより基板と基板搬送用トレーの間の
空気などの気体を容易に抜くことができるという作用効
果が得られる。According to a fourteenth aspect of the present invention, the groove having the through hole is formed in the center of the concave portion of the tray main body, and the through hole through which the push-up pin for taking out the mounted substrate passes is formed. It has a configuration formed on the outer peripheral portion of the concave portion of the tray main body, whereby the effect of easily removing gas such as air between the substrate and the substrate transport tray can be obtained.
【００２３】本発明の請求項１５に記載の発明は、トレ
ー本体の凹部に載置された基板を取り出すための突き上
げ用ピンが通る貫通孔および基板を吸着するための貫通
孔を設けた構成を有しており、これにより基板を容易に
取り出せるとともに、基板を基板搬送用トレーに吸着で
きるという作用効果が得られる。According to a fifteenth aspect of the present invention, there is provided a configuration in which a through-hole through which a push-up pin for taking out a substrate placed in a concave portion of a tray main body and a through-hole for sucking a substrate are provided. Accordingly, there is obtained an operational effect that the substrate can be easily taken out and the substrate can be sucked to the substrate carrying tray.
【００２４】本発明の請求項１６に記載の発明は、凹部
を有し、熱伝導性に優れた物質からなるトレー本体の凹
部の表面は絶縁性を有しかつ柔軟性を有する物質で構成
し、前記トレー本体の凹部より外側の表面は耐蝕性また
は耐スパッタリング性を有する物質で構成し、前記トレ
ー本体の凹部の外周部に貫通孔を有する溝を形成し、前
記突き上げ用ピンが通る貫通孔は前記凹部の中央部に形
成した構成を有しており、これにより基板と基板搬送用
トレーの熱伝導性を高め、基板を基板搬送用トレーに静
電吸着させるとともに基板搬送用トレーの耐久性を高め
ることができるという作用効果が得られる。The invention according to claim 16 of the present invention is characterized in that the surface of the concave portion of the tray body which has a concave portion and is made of a material having excellent heat conductivity is made of an insulating and flexible material. The surface of the tray body outside the recess is made of a material having corrosion resistance or sputtering resistance, and a groove having a through hole is formed in the outer periphery of the recess of the tray body, and the through-hole through which the push-up pin passes is formed. Has a configuration formed in the center of the concave portion, thereby increasing the thermal conductivity of the substrate and the substrate transport tray, electrostatically attracting the substrate to the substrate transport tray, and improving the durability of the substrate transport tray. Can be obtained.
【００２５】本発明の請求項１７に記載の発明は、熱伝
導性に優れた物質はアルミニウム、アルミニウム合金、
銅、銅合金のうちのいずれかであるという構成を有して
おり、これにより基板搬送用トレーの熱伝導性を高め、
均熱化できるという作用効果が得られる。According to the invention of claim 17 of the present invention, the substance having excellent thermal conductivity is aluminum, an aluminum alloy,
Copper, has a configuration that is one of the copper alloy, thereby increasing the thermal conductivity of the substrate transport tray,
The effect of being able to equalize the temperature is obtained.
【００２６】本発明の請求項１８に記載の発明は、絶縁
性を有しかつ柔軟性を有する物質で構成した部分はトレ
ー本体の凹部の表面であるという構成を有しており、こ
れにより基板を基板搬送用トレーの凹部に静電吸着させ
るという作用効果が得られる。The invention according to claim 18 of the present invention has a structure in which the portion made of an insulating and flexible substance is the surface of the concave portion of the tray main body, and thereby the substrate is formed. The effect of electrostatic adsorption on the concave portion of the substrate carrying tray is obtained.
【００２７】本発明の請求項１９に記載の発明は、絶縁
性を有しかつ柔軟性を有する物質はポリイミドであると
いう構成を有しており、これにより基板と基板搬送用ト
レーの熱伝導性を高め、基板を基板搬送用トレーに静電
吸着させるという作用効果が得られる。The invention according to a nineteenth aspect of the present invention has a structure in which the insulating and flexible substance is a polyimide, which allows the heat transfer between the substrate and the substrate carrying tray. And the effect of electrostatically attracting the substrate to the substrate carrying tray can be obtained.
【００２８】本発明の請求項２０に記載の発明は、耐蝕
性または耐スパッタリング性を有する物質は白金、アル
マイト、セラミックのうちのいずれかであるという構成
を有しており、これにより基板搬送用トレーの耐久性を
高めることができるという作用効果が得られる。According to a twentieth aspect of the present invention, the substance having corrosion resistance or sputtering resistance is one of platinum, alumite, and ceramic, thereby providing a substrate transporting material. The operational effect that the durability of the tray can be increased can be obtained.
【００２９】本発明の請求項２１に記載の発明は、トレ
ー本体の凹部に載置された基板を取り出すための突き上
げ用ピンが通る貫通孔および基板を吸着するための貫通
孔を設けた構成を有しており、これにより基板を容易に
取り出せるとともに、基板を基板搬送用トレーに吸着で
きるという作用効果が得られる。According to a twenty-first aspect of the present invention, there is provided a configuration in which a through-hole through which a push-up pin for taking out a substrate placed in a concave portion of a tray main body and a through-hole for sucking a substrate are provided. Accordingly, there is obtained an operational effect that the substrate can be easily taken out and the substrate can be attracted to the substrate carrying tray.
【００３０】本発明の請求項２２に記載の発明は、熱伝
導性に優れた物質からなるトレー本体に凹部を設ける工
程と、前記トレー本体に突き上げ用ピンが通る貫通孔、
基板を吸着するための貫通孔および貫通孔を有する溝を
形成する工程と、前記トレー本体の凹部より外側の表面
に耐蝕性または耐スパッタリング性を有する物質を配設
する工程と、前記トレー本体の凹部に絶縁性を有しかつ
柔軟性を有する物質を配設する工程からなる方法であ
り、これにより熱伝導性に優れ、耐久性のある基板搬送
用トレーが得られるという作用効果が得られる。According to a twenty-second aspect of the present invention, a step of providing a concave portion in a tray body made of a material having excellent thermal conductivity, a through hole through which a push-up pin passes through the tray body,
Forming a groove having a through-hole and a through-hole for adsorbing a substrate, arranging a substance having corrosion resistance or sputtering resistance on a surface outside the concave portion of the tray main body, This is a method including a step of disposing a substance having insulation and flexibility in the concave portion, whereby the effect of obtaining a substrate transfer tray having excellent heat conductivity and durability can be obtained.
【００３１】本発明の請求項２３に記載の発明は、熱伝
導性に優れた物質のトレー本体の凹部に絶縁性を有しか
つ柔軟性を有する物質を設ける方法は、液状物質の塗布
またはシート状物質の接着のいずれかであり、これによ
り絶縁性を有しかつ柔軟性を有する物質を容易に設ける
という作用効果が得られる。According to a twenty-third aspect of the present invention, there is provided a method of providing an insulating and flexible material in a concave portion of a tray body made of a material having excellent thermal conductivity, the method comprising applying a liquid material or a sheet. This is an effect of easily providing a material having insulating properties and flexibility.
【００３２】本発明の請求項２４に記載の発明は、シー
ト状物質の接着は熱圧着であるという方法であり、これ
により絶縁性を有しかつ柔軟性を有する物質を容易に設
けるという作用効果が得られる。The invention according to claim 24 of the present invention is a method in which the bonding of the sheet-like substance is performed by thermo-compression bonding, thereby providing an insulating and flexible substance easily. Is obtained.
【００３３】本発明の請求項２５に記載の発明は、熱伝
導性に優れた物質からなるトレー本体に凹部を設ける工
程と、前記トレー本体に突き上げ用ピンが通る貫通孔、
基板を吸着するための貫通孔および貫通孔を有する溝を
形成する工程と、前記トレー本体の凹部側の全面に耐蝕
性または耐スパッタリング性を有する物質を設ける工程
と、前記トレー本体の凹部で耐蝕性または耐スパッタリ
ング性を有する物質を設けた上に絶縁性を有しかつ柔軟
性を有する物質を設ける工程からなる方法であり、これ
により絶縁性を有しかつ柔軟性を有する物質を容易に設
けるという作用効果が得られる。According to a twenty-fifth aspect of the present invention, there is provided a method of forming a concave portion in a tray main body made of a material having excellent heat conductivity;
Forming a through hole for adsorbing the substrate and a groove having a through hole; providing a material having corrosion resistance or sputtering resistance on the entire surface of the concave portion of the tray main body; Is a method of providing a material having insulating properties and flexibility, and then providing a material having insulating properties and flexibility, thereby easily providing a material having insulating properties and flexibility. The operation and effect are obtained.
【００３４】[0034]
【発明の実施の形態】（実施の形態１）以下に本発明の
実施の形態１を用いて、本発明の請求項１〜１１につい
て説明する。(Embodiment 1) Hereinafter, claims 1 to 11 of the present invention will be described using Embodiment 1 of the present invention.
【００３５】図１（ａ）は本発明の実施の形態１におけ
る基板搬送用トレーの平面図、図１（ｂ）は図１（ａ）
の断面図である。FIG. 1A is a plan view of a substrate carrying tray according to Embodiment 1 of the present invention, and FIG. 1B is a plan view of FIG.
FIG.
【００３６】１はトレー本体、２は凹部、３は突き上げ
用ピンが通る貫通孔、４は基板を吸着するための貫通
孔、５は絶縁性を有しかつ柔軟性を有する物質、６は耐
蝕性または耐スパッタリング性を有する物質である。1 is a tray main body, 2 is a concave portion, 3 is a through hole through which a push-up pin passes, 4 is a through hole for sucking a substrate, 5 is an insulating and flexible material, and 6 is corrosion resistant. It is a substance having a resistance or a sputtering resistance.
【００３７】アルミニウムなどからなる金属板を所定の
寸法に切り出し、旋盤などにより所定形状に研削した
後、ボール盤などにより突き上げ用ピンが通る貫通孔
３、および基板を吸着するための貫通孔を形成し次に１
００〜１５０℃で焼鈍処理することにより加工による歪
みを除去し、その後所定形状になるようにプレスなどで
押圧することにより反りなどの平面度を補正する。After a metal plate made of aluminum or the like is cut into a predetermined size and ground into a predetermined shape by a lathe or the like, a through hole 3 through which a push-up pin passes and a through hole for sucking a substrate are formed by a drilling machine or the like. Then 1
The distortion due to the processing is removed by annealing at 00 to 150 ° C., and then the flatness such as warpage is corrected by pressing with a press or the like so as to have a predetermined shape.
【００３８】このようにして得られたトレー本体１の凹
部２をフォトマスクなどで覆い、白金をスパッタリング
することにより耐蝕性または耐スパッタリング性を有す
る物質６を形成する。The concave portion 2 of the tray main body 1 thus obtained is covered with a photomask or the like, and platinum is sputtered to form a material 6 having corrosion resistance or sputtering resistance.
【００３９】その後、凹部２よりも外側の耐蝕性または
耐スパッタリング性を有する物質６を設けた部分にレジ
ストを塗布する。Thereafter, a resist is applied to a portion outside the recess 2 where the substance 6 having corrosion resistance or sputtering resistance is provided.
【００４０】次に凹部２に液状のポリイミドをスピンコ
ートなどにより塗布し、２００℃で熱処理することによ
り絶縁性を有しかつ柔軟性を有する物質５を設け、所定
の位置に突き上げ用ピンが通る貫通孔３および基板を吸
着するための貫通孔４を開け、その後レジストを除去す
る。Next, a liquid polyimide is applied to the concave portion 2 by spin coating or the like, and a heat treatment is performed at 200 ° C. to provide an insulating and flexible substance 5, and a push-up pin passes through a predetermined position. A through hole 3 and a through hole 4 for adsorbing the substrate are opened, and then the resist is removed.
【００４１】なお、ポリイミドの膜厚が薄い場合はスピ
ンコートを複数回繰り返して膜厚を厚くしてもかまわな
い。また、トレー本体１および絶縁性を有しかつ柔軟性
を有する物質５に設けた貫通孔３及び４は、絶縁性を有
しかつ柔軟性を有する物質５を設けた後、一度に形成し
てもかまわない。When the polyimide film is thin, spin coating may be repeated a plurality of times to increase the film thickness. Further, the through holes 3 and 4 provided in the tray body 1 and the insulating and flexible substance 5 are formed at a time after the insulating and flexible substance 5 is provided. It doesn't matter.
【００４２】なお、絶縁性を有しかつ柔軟性を有する物
質５を設ける方法としては、スピンコートに換えて予め
フィルム状に成形したシートを所定の場所に接着する方
法を用いてもかまわない。As a method of providing the insulating and flexible substance 5, a method in which a sheet formed in a film shape in advance is adhered to a predetermined place instead of spin coating may be used.
【００４３】その後、所定形状になるようにプレスなど
で押圧することにより反りなどの平面度を補正する。な
お、反りなどの平面度の補正は、トレー本体１の形成後
と最終段階の２回行っても、最終段階１回だけ行っても
かまわない。Thereafter, flatness such as warpage is corrected by pressing with a press or the like so as to have a predetermined shape. The correction of the flatness such as the warp may be performed twice after forming the tray body 1 and in the final stage, or may be performed only once in the final stage.
【００４４】このようにして得られた基板搬送用トレー
をドライエッチングに使用した場合について説明する。The case where the substrate transfer tray thus obtained is used for dry etching will be described.
【００４５】図５はエッチング、アッシング、リンスの
一連処理を行う装置である。FIG. 5 shows an apparatus for performing a series of processes of etching, ashing, and rinsing.
【００４６】９は準備室、１０は予備室、１１はエッチ
ング室、１２はアッシング室、１３はリンス室である。9 is a preparation room, 10 is a spare room, 11 is an etching room, 12 is an ashing room, and 13 is a rinsing room.
【００４７】ＬａＴｉＯ3などからなる基板にレジスト
を塗布し、フォトマスクを重ねて露光し、映像装置（図
示せず）にてレジストを現像、洗浄する。A resist is applied to a substrate made of LaTiO 3 or the like, a photomask is overlaid and exposed, and the resist is developed and washed by an image device (not shown).
【００４８】こうして得られた基板を準備室９にてトレ
ー本体１の凹部２に乗せる。次に、予備室１０へ搬送し
１Ｐａ程度まで真空に引き、さらにエッチング室１１に
搬送し、１×１０-3Ｐａ以下になるまで真空引きした
後、塩素系ガスを導入しながら圧力調整を行いエッチン
グ装置に高周波電力を印加する。The substrate thus obtained is placed in the recess 2 of the tray body 1 in the preparation room 9. Next, the wafer is transferred to the preliminary chamber 10 and evacuated to about 1 Pa, further transferred to the etching chamber 11 and evacuated to 1 × 10 −3 Pa or less. Then, the pressure is adjusted while introducing a chlorine-based gas. High frequency power is applied to the etching device.
【００４９】この時、基板上のレジストのない部分はイ
オン化した粒子が照射されエッチングされると同時に発
熱する。基板が強誘電体の場合、電界が加えられるとそ
の基板表面が帯電し静電気が発生する。At this time, a portion of the substrate where there is no resist is irradiated with ionized particles and is etched, and simultaneously generates heat. When the substrate is a ferroelectric substance, when an electric field is applied, the surface of the substrate is charged and static electricity is generated.
【００５０】トレー本体１の凹部２に設けた物質５は、
絶縁性を有するとともに柔軟性を有するため、その絶縁
性により基板がトレー本体１と絶縁され、基板に帯電し
た静電気により基板がトレー本体１に静電気力により引
きつけられ固定される。The substance 5 provided in the recess 2 of the tray body 1
Since the substrate has both insulating properties and flexibility, the substrate is insulated from the tray main body 1 by the insulating properties, and the substrate is attracted and fixed to the tray main body 1 by the static electricity charged on the substrate by the electrostatic force.
【００５１】また一方凹部２に設けた物質５の柔軟性に
より、基板の凹凸や反りを吸収して基板と密着するため
熱伝導性が良くなり、基板の温度を均一にするとともに
エッチングによって発生した熱を効率よくトレー側に放
熱し、基板温度の上昇を防ぐことができる。On the other hand, the flexibility of the substance 5 provided in the concave portion 2 absorbs the unevenness and warpage of the substrate and makes it adhere to the substrate, so that the thermal conductivity is improved. The heat can be efficiently dissipated to the tray side, and a rise in substrate temperature can be prevented.
【００５２】従って凹部２に設けた物質５が絶縁性と柔
軟性の両方の性質を兼ね備えることにより初めてこのよ
うな効果が得られるものである。Therefore, such an effect can be obtained only when the substance 5 provided in the concave portion 2 has both the insulating property and the flexibility property.
【００５３】また、エッチングの際、トレー本体１上で
基板がない部分も基板と同様にイオン化した粒子が照射
されるが、予め白金をスパッタリングすることにより耐
蝕性または耐スパッタリング性を有する物質６を形成し
ておくことにより損傷を抑制することができる。なお、
白金に代えて耐蝕性または耐スパッタリング性を有する
アルマイトやセラミックなどの物質を用いてもかまわな
い。At the time of etching, ionized particles are also irradiated on a portion of the tray main body 1 where no substrate is present, as in the case of the substrate. However, a material 6 having corrosion resistance or sputtering resistance is formed by sputtering platinum in advance. By forming them, damage can be suppressed. In addition,
Instead of platinum, a material such as alumite or ceramic having corrosion resistance or sputtering resistance may be used.
【００５４】次に、予備室１０を経由してアッシング室
１２に搬送し、１Ｐａ程度まで真空引きする。Next, the wafer is transported to the ashing chamber 12 via the preliminary chamber 10 and evacuated to about 1 Pa.
【００５５】次に、酸素などのガスを導入しながら圧力
を１００Ｐａ程度に制御し、高周波電力を印加すること
により残留したレジストをガス化して除去する。Next, the pressure is controlled to about 100 Pa while introducing a gas such as oxygen, and the remaining resist is gasified and removed by applying high-frequency power.
【００５６】次に、予備室１０を経由してリンス室１３
へ搬送し、トレー本体１に設けた基板を吸着するための
貫通孔４より吸引することにより基板をトレー本体１に
吸着させ、トレー本体１を回転させながら還元性を有し
かつ導電性を有する水溶液を塗布した後、イオン交換水
で洗浄し、その後高速回転させて水分を除去する。Next, the rinsing chamber 13 is moved through the preliminary chamber 10.
The substrate is sucked into the tray body 1 by sucking the substrate through the through hole 4 for sucking the substrate provided in the tray body 1, and has a reducing property and electrical conductivity while rotating the tray body 1. After applying the aqueous solution, it is washed with ion-exchanged water, and then rotated at high speed to remove water.
【００５７】ここで、トレー本体１に基板を吸引させた
のは、基板をトレー本体１に固定してその後の回転処理
をし易くするためである。Here, the reason why the substrate is sucked into the tray main body 1 is to fix the substrate to the tray main body 1 and to facilitate the subsequent rotation processing.
【００５８】洗浄の際に用いる還元性を有しかつ導電性
を有する水溶液は、基板やトレー本体１に残留している
エッチングの際に用いた塩素系ガスのイオン化した粒子
を除去する効果があり、また数十Ω／ｃｍの導電性があ
ればこれ以外のものを用いてもかまわない。The aqueous solution having reducibility and conductivity used for cleaning has an effect of removing ionized particles of chlorine-based gas used for etching remaining on the substrate and the tray body 1. Any other material having conductivity of several tens of ohms / cm may be used.
【００５９】その後、予備室１０を経由して準備室９に
もどし、トレー本体１の凹部２に設けた突き上げ用ピン
が通る貫通孔３を通してピンを挿入して基板を突き上
げ、トレー本体１より基板を取り出す。Thereafter, the substrate is returned to the preparation chamber 9 via the preparatory chamber 10, and the pins are inserted through the through holes 3 provided in the recesses 2 of the tray body 1, through which the pins for pushing up pass. Take out.
【００６０】上記基板搬送用トレーは耐蝕性、耐スパッ
タリング性があるため繰り返し使用することが可能であ
る。The substrate transfer tray has corrosion resistance and sputtering resistance, and can be used repeatedly.
【００６１】以上のように本発明の実施の形態１によれ
ば、トレー本体１の凹部２に絶縁性を有しかつ柔軟性を
有する物質５を設けることにより、基板とトレー本体１
の密着性および熱伝導性を良くし、基板の温度を均一に
することにより回路パターンの線幅などのばらつきが小
さくできるとともに、トレー本体１の凹部２より外側の
表面は耐蝕性または耐スパッタリング性を有する物質で
構成することにより耐久性を向上させ繰り返し使用する
ことができる。As described above, according to the first embodiment of the present invention, the substrate and the tray main body 1 are provided by providing the insulating and flexible substance 5 in the recess 2 of the tray main body 1.
The uniformity of the substrate temperature can reduce the variation in the line width of the circuit pattern and the like, so that the surface of the tray body 1 outside the concave portion 2 has corrosion resistance or sputtering resistance. By using a material having the following, the durability can be improved and the material can be used repeatedly.
【００６２】（実施の形態２）以下に本発明の実施の形
態２を用いて、本発明の請求項１２，１３，１５〜２４
について説明する。(Embodiment 2) In the following, a second embodiment of the present invention will be described by using claims 12, 13, 15 to 24 of the present invention.
Will be described.
【００６３】図２（ａ）は本発明の実施の形態２におけ
る基板搬送用トレーの平面図、図２（ｂ）は図２（ａ）
の断面図である。図２において実施の形態１の図１で説
明したものと同一のものは同一番号を付与し、詳細な説
明は省略する。FIG. 2A is a plan view of a substrate carrying tray according to Embodiment 2 of the present invention, and FIG. 2B is a plan view of FIG.
FIG. In FIG. 2, the same components as those described in FIG. 1 of the first embodiment are denoted by the same reference numerals, and detailed description is omitted.
【００６４】本実施の形態２の図２と実施の形態１の図
１と相違する点は、トレー本体１の凹部２に貫通孔８を
有する溝７を設けたことおよびその位置関係である。The difference between FIG. 2 of the second embodiment and FIG. 1 of the first embodiment is that a groove 7 having a through hole 8 is provided in the concave portion 2 of the tray main body 1 and its positional relationship.
【００６５】すなわち、実施の形態１では凹部２に載置
された基板を取り出すための突き上げ用ピンが通る貫通
孔３および基板を吸着するための貫通孔４の２種類の貫
通孔を設けた構成になっているが、実施の形態２ではそ
れらに加えて貫通孔８を有する溝７を設けた構成であ
り、かつ貫通孔８を有する溝７は前記トレー本体１の凹
部２の外周部に形成し、載置された基板を取り出すため
の突き上げ用ピンが通る貫通孔３は前記トレー本体１の
凹部２の中央部に形成する構成にしたものである。That is, in the first embodiment, two types of through-holes are provided: a through-hole 3 through which a push-up pin for taking out the substrate placed in the recess 2 passes, and a through-hole 4 for sucking the substrate. However, in the second embodiment, a groove 7 having a through hole 8 is provided in addition thereto, and the groove 7 having a through hole 8 is formed on the outer peripheral portion of the concave portion 2 of the tray main body 1. The through-hole 3 through which the push-up pin for taking out the mounted substrate passes is formed at the center of the concave portion 2 of the tray main body 1.
【００６６】トレー本体１の凹部２に貫通孔８を有する
溝７を設けたこと以外は実施の形態１と同様にして基板
搬送用トレーを形成した。A substrate transfer tray was formed in the same manner as in the first embodiment except that a groove 7 having a through hole 8 was provided in the concave portion 2 of the tray body 1.
【００６７】図２は貫通孔８を有する溝７は前記トレー
本体１の凹部２の外周部に形成し、載置された基板を取
り出すための突き上げ用ピンが通る貫通孔３は前記トレ
ー本体１の凹部２の中央部に形成する構成である。FIG. 2 shows that the groove 7 having the through hole 8 is formed in the outer periphery of the concave portion 2 of the tray main body 1, and the through hole 3 through which the push-up pin for taking out the mounted substrate passes passes through the tray main body 1. Is formed at the center of the concave portion 2 of FIG.
【００６８】例えば基板をトレー本体１に載置する際に
基板とトレー本体１の間にガス（例えば空気など）が残
留し、基板が浮いたり移動したりすることが起こるが、
トレー本体１の凹部２に貫通孔８を有する溝７を設ける
ことにより残留ガスを容易に素早く取り除くことがで
き、基板の浮きや移動を防止できるものであり、実施の
形態１と比較して基板の位置をさらに安定化させること
ができる。For example, when a substrate is placed on the tray main body 1, gas (eg, air) remains between the substrate and the tray main body 1, and the substrate may float or move.
By providing the groove 7 having the through hole 8 in the concave portion 2 of the tray main body 1, the residual gas can be easily and quickly removed, and the floating and movement of the substrate can be prevented. Can be further stabilized.
【００６９】（実施の形態３）以下に本発明の実施の形
態３を用いて、本発明の請求項１４について説明する。(Embodiment 3) Hereinafter, Embodiment 14 of the present invention will be described using Embodiment 3 of the present invention.
【００７０】図３（ａ）は本発明の実施の形態３におけ
る基板搬送用トレーの平面図、図３（ｂ）は図３（ａ）
の断面図である。図３において実施の形態２の図２で説
明したものと同一のものは同一番号を付与し、詳細な説
明は省略する。FIG. 3A is a plan view of a substrate carrying tray according to the third embodiment of the present invention, and FIG. 3B is a plan view of FIG.
FIG. In FIG. 3, the same components as those described in FIG. 2 of the second embodiment are given the same reference numerals, and detailed description is omitted.
【００７１】本実施の形態３の図３と実施の形態２の図
２と相違する点は、トレー本体１の凹部２に設けた貫通
孔８を有する溝７の位置関係である。The difference between FIG. 3 of the third embodiment and FIG. 2 of the second embodiment is the positional relationship of the groove 7 having the through hole 8 provided in the concave portion 2 of the tray main body 1.
【００７２】すなわち、実施の形態２では貫通孔８を有
する溝７はトレー本体１の凹部２の外周部に形成し、載
置された基板を取り出すための突き上げ用ピンが通る貫
通孔３は前記トレー本体１の凹部２の中央部に形成する
構成であるが、実施の形態３では貫通孔８を有する溝７
は前記トレー本体１の凹部２の中央部に形成し、載置さ
れた基板を取り出すための突き上げ用ピンが通る貫通孔
３は前記トレー本体１の凹部２の外周部に形成する構成
にしたものである。That is, in the second embodiment, the groove 7 having the through hole 8 is formed on the outer peripheral portion of the concave portion 2 of the tray main body 1, and the through hole 3 through which the push-up pin for taking out the mounted substrate passes is formed. In the third embodiment, the groove is formed at the center of the concave portion 2 of the tray body 1.
Is formed at the center of the concave portion 2 of the tray main body 1, and a through hole 3 through which a push-up pin for taking out a mounted substrate passes is formed in the outer peripheral portion of the concave portion 2 of the tray main body 1. It is.
【００７３】トレー本体１の凹部２に載置された基板を
取り出すための突き上げ用ピンが通る貫通孔３と、貫通
孔８を有する溝７の位置関係を変えた以外は実施の形態
２と同様にして基板搬送用トレーを形成した。The same as the second embodiment except that the positional relationship between the through hole 3 through which the push-up pin for taking out the substrate placed in the concave portion 2 of the tray body 1 and the groove 7 having the through hole 8 is changed. To form a substrate transfer tray.
【００７４】すなわち、図３は貫通孔８を有する溝７は
前記トレー本体１の凹部２の中央部に形成し、載置され
た基板を取り出すための突き上げ用ピンが通る貫通孔３
は前記トレー本体１の凹部２の外周部に形成したもので
ある。That is, FIG. 3 shows that the groove 7 having the through hole 8 is formed at the center of the concave portion 2 of the tray main body 1 and through which the push-up pin for taking out the mounted substrate passes.
Is formed on the outer peripheral portion of the concave portion 2 of the tray body 1.
【００７５】例えば基板をトレー本体１に載置する際に
基板とトレー本体１の間にガス（例えば空気など）が残
留し、基板が浮いたり移動したりすることが起こるが、
トレー本体１の凹部２の中央部に貫通孔８を有する溝７
を設けることにより、基板またはトレー本体１が反り、
基板の中央部に空間ができた場合、残留ガスを容易に素
早く取り除くことができ、基板の浮きや移動を防止でき
るものであり、実施の形態２と比較して基板の位置を安
定化させることができる。For example, when a substrate is placed on the tray main body 1, gas (for example, air) remains between the substrate and the tray main body 1, and the substrate may float or move.
A groove 7 having a through hole 8 in the center of the recess 2 of the tray body 1
The substrate or the tray body 1 warps,
When a space is formed in the central portion of the substrate, the residual gas can be easily and quickly removed, and the floating and movement of the substrate can be prevented, and the position of the substrate can be stabilized as compared with the second embodiment. Can be.
【００７６】（実施の形態４）以下に本発明の実施の形
態４を用いて、本発明の請求項２５について説明する。(Embodiment 4) Hereinafter, Embodiment 25 of the present invention will be described with reference to Embodiment 4.
【００７７】図４（ａ）は本発明の実施の形態４におけ
る基板搬送用トレーの平面図、図４（ｂ）は図４（ａ）
の断面図である。図４において実施の形態２の図２で説
明したものと同一のものは同一番号を付与し、詳細な説
明は省略する。FIG. 4A is a plan view of a substrate carrying tray according to Embodiment 4 of the present invention, and FIG. 4B is a plan view of FIG.
FIG. In FIG. 4, the same components as those described in FIG. 2 of the second embodiment are denoted by the same reference numerals, and detailed description is omitted.
【００７８】本実施の形態４の図４と実施の形態２の図
２と相違する点は、基板搬送用トレーの凹部側の全面に
耐蝕性を有しかつ耐スパッタリング性を有する物質を配
設し、その上に基板載置用トレーの凹部に絶縁性を有し
柔軟性を有する物質を配設したことである。The difference between FIG. 4 of the fourth embodiment and FIG. 2 of the second embodiment is that a substance having corrosion resistance and sputtering resistance is provided on the entire surface of the substrate transfer tray on the concave side. In addition, an insulating and flexible substance is provided on the concave portion of the substrate mounting tray.
【００７９】すなわち、実施の形態２ではトレー本体１
の凹部２に絶縁性を有し柔軟性を有する物質のみを設け
る構成であるが、実施の形態４ではトレー本体１の凹部
２に下地として耐蝕性を有しかつ耐スパッタリング性を
有する物質６が設けられ、その上に絶縁性を有し柔軟性
を有する物質５を設ける構成にしたものである。That is, in the second embodiment, the tray body 1
In the fourth embodiment, only the material 6 having corrosion resistance and sputtering resistance is used as a base in the recess 2 of the tray body 1 in the fourth embodiment. This is configured so that a substance 5 having insulating properties and flexibility is provided thereon.
【００８０】これにより耐蝕性を有しかつ耐スパッタリ
ング性を有する物質６を設けるために凹部２をフォトマ
スクなどで覆う必要がないため、実施の形態２に比較し
てより簡単に基板搬送用トレーを作製することができ
る。As a result, it is not necessary to cover the concave portion 2 with a photomask or the like in order to provide the substance 6 having corrosion resistance and sputtering resistance. Can be produced.
【００８１】[0081]
【発明の効果】以上に示したように本発明によれば、熱
伝導性に優れた物質からなるトレー本体の凹部に絶縁性
を有しかつ柔軟性を有する物質を配設することにより、
基板とトレー本体の密着性および熱伝導性を良くし、基
板の温度を均一にすることにより回路パターンの線幅な
どのばらつきを小さくするとともに、トレー本体の凹部
より外側の表面は耐蝕性または耐スパッタリング性を有
する物質で構成することにより耐久性を向上させ繰り返
し使用することができる基板搬送用トレーを得ることが
できるという作用効果が得られる。As described above, according to the present invention, an insulating and flexible substance is provided in a concave portion of a tray body made of a substance having excellent heat conductivity.
Improving the adhesion and thermal conductivity between the board and the tray body, reducing the variations in circuit pattern line width by making the temperature of the board uniform, and the surface outside the recess of the tray body is resistant to corrosion or corrosion. The effect of being able to obtain a substrate transport tray that can be used repeatedly by improving durability and being able to be used repeatedly can be obtained by using a material having a sputtering property.
【図１】（ａ）本発明の実施の形態１における基板搬送
用トレーの平面図 （ｂ）本発明の実施の形態１における基板搬送用トレー
の断面図FIG. 1A is a plan view of a substrate transfer tray according to the first embodiment of the present invention. FIG. 1B is a cross-sectional view of the substrate transfer tray according to the first embodiment of the present invention.
【図２】（ａ）本発明の実施の形態２における基板搬送
用トレーの平面図 （ｂ）本発明の実施の形態２における基板搬送用トレー
の断面図2A is a plan view of a substrate transfer tray according to a second embodiment of the present invention. FIG. 2B is a cross-sectional view of the substrate transfer tray according to the second embodiment of the present invention.
【図３】（ａ）本発明の実施の形態３における基板搬送
用トレーの平面図 （ｂ）本発明の実施の形態３における基板搬送用トレー
の断面図FIG. 3A is a plan view of a substrate transfer tray according to a third embodiment of the present invention. FIG. 3B is a cross-sectional view of the substrate transfer tray according to the third embodiment of the present invention.
【図４】（ａ）本発明の実施の形態４における基板搬送
用トレーの平面図 （ｂ）本発明の実施の形態４における基板搬送用トレー
の断面図FIG. 4A is a plan view of a substrate transport tray according to a fourth embodiment of the present invention. FIG. 4B is a cross-sectional view of the substrate transport tray according to the fourth embodiment of the present invention.
【図５】エッチング、アッシング、リンスの一連処理を
行う装置を示す図FIG. 5 is a diagram showing an apparatus for performing a series of processes of etching, ashing, and rinsing;
１ トレー本体 ２ 凹部 ３ 突き上げ用ピンが通る貫通孔 ４ 基板を吸着するための貫通孔 ５ 絶縁性を有しかつ柔軟性を有する物質 ６ 耐蝕性または耐スパッタリング性を有する物質 ７ 溝 ８ 貫通孔 ９ 準備室 １０ 予備室 １１ エッチング室 １２ アッシング室 １３ リンス室 REFERENCE SIGNS LIST 1 tray main body 2 concave portion 3 through hole through which push-up pin passes 4 through hole for adsorbing substrate 5 material having insulation and flexibility 6 material having corrosion resistance or sputtering resistance 7 groove 8 through hole 9 Preparation room 10 Preparatory room 11 Etching room 12 Ashing room 13 Rinse room
───────────────────────────────────────────────────── フロントページの続き (72)発明者 稲本 吉将 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5F004 AA01 BB20 BB30 BD01 5F031 CA02 DA13 EA01 EA04 EA18 FA03 FA07 GA25 HA02 HA03 HA10 HA13 HA14 HA16 HA33 HA48 HA59 MA04 MA23 MA32 NA05 PA11 PA13 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Yoshimasa Inamoto 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5F004 AA01 BB20 BB30 BD01 5F031 CA02 DA13 EA01 EA04 EA18 FA03 FA07 GA25 HA02 HA03 HA10 HA13 HA14 HA16 HA33 HA48 HA59 MA04 MA23 MA32 NA05 PA11 PA13
Claims (25)
なるトレー本体の一部表面を絶縁性を有するとともに柔
軟性を有する物質で構成した基板搬送用トレー。1. A substrate transfer tray having a concave portion and a partial surface of a tray body made of a material having excellent thermal conductivity and made of a material having flexibility while having insulating properties.
アルミニウム合金、銅、銅合金のうちのいずれかである
請求項１に記載の基板搬送用トレー。2. The material having excellent thermal conductivity is aluminum,
The substrate transfer tray according to claim 1, wherein the tray is one of an aluminum alloy, copper, and a copper alloy.
構成した部分はトレー本体の凹部の表面である請求項１
に記載の基板搬送用トレー。3. The portion made of an insulating and flexible substance is a surface of a concave portion of a tray body.
The substrate transport tray according to 1.
ポリイミドである請求項１に記載の基板搬送用トレー。4. The substrate transfer tray according to claim 1, wherein the insulating and flexible substance is polyimide.
り出すための突き上げ用ピンが通る貫通孔および基板を
吸着するための貫通孔を設けた請求項１に記載の基板搬
送用トレー。5. The substrate transport tray according to claim 1, further comprising a through-hole through which a push-up pin for taking out the substrate placed in the concave portion of the tray main body and a through-hole for sucking the substrate are provided.
なるトレー本体の凹部の表面は絶縁性を有するとともに
柔軟性を有する物質で構成し、前記トレー本体の凹部よ
り外側の表面は耐蝕性または耐スパッタリング性を有す
る物質で構成した基板搬送用トレー。6. The surface of the concave portion of the tray main body having a concave portion and made of a material having excellent thermal conductivity is made of a material having an insulating property and flexibility, and the surface of the tray main body outside the concave portion is made of a material having flexibility. A substrate transport tray made of a material having corrosion resistance or sputtering resistance.
アルミニウム合金、銅、銅合金のうちのいずれかである
請求項６に記載の基板搬送用トレー。7. A material having excellent thermal conductivity is aluminum,
The substrate transport tray according to claim 6, wherein the substrate transport tray is any one of an aluminum alloy, copper, and a copper alloy.
構成した部分はトレー本体の凹部の表面である請求項６
に記載の基板搬送用トレー。8. The portion made of an insulating and flexible material is a surface of a concave portion of the tray body.
The substrate transport tray according to 1.
ポリイミドである請求項６に記載の基板搬送用トレー。9. The substrate transfer tray according to claim 6, wherein the insulating and flexible substance is polyimide.
する物質は白金、アルマイト、セラミックのうちのいず
れかである請求項６に記載の基板搬送用トレー。10. The substrate transport tray according to claim 6, wherein the substance having corrosion resistance or sputtering resistance is one of platinum, alumite, and ceramic.
取り出すための突き上げ用ピンが通る貫通孔および基板
を吸着するための貫通孔を設けた請求項６に記載の基板
搬送用トレー。11. The substrate carrying tray according to claim 6, further comprising a through hole through which a push-up pin for taking out the substrate placed in the concave portion of the tray main body and a through hole for sucking the substrate are provided.
らなるトレー本体の凹部に貫通孔を有する溝を設け、こ
のトレー本体の一部表面を絶縁性を有しかつ柔軟性を有
する物質で構成した基板搬送用トレー。12. A tray body having a recess and having a through hole in a recess of a tray body made of a material having excellent heat conductivity, and having a partial surface of the tray body having insulation and flexibility. A substrate transport tray made of a substance.
の外周部に形成し、載置された基板を取り出すための突
き上げ用ピンが通る貫通孔を前記凹部の中央部に形成し
た請求項１２に記載の基板搬送用トレー。13. A groove having a through hole is formed in an outer peripheral portion of a concave portion of the tray body, and a through hole through which a push-up pin for taking out a mounted substrate is formed is formed in a central portion of the concave portion. The substrate transport tray according to 1.
の中央部に形成し、載置された基板を取り出すための突
き上げ用ピンが通る貫通孔を前記凹部の外周部に形成し
た請求項１２に記載の基板搬送用トレー。14. A groove having a through hole is formed in a central portion of a concave portion of the tray body, and a through hole through which a push-up pin for taking out a mounted substrate is formed is formed in an outer peripheral portion of the concave portion. The substrate transport tray according to 1.
取り出すための突き上げ用ピンが通る貫通孔および基板
を吸着するための貫通孔を設けた請求項１２に記載の基
板搬送用トレー。15. The substrate transport tray according to claim 12, further comprising a through hole through which a push-up pin for taking out the substrate placed in the concave portion of the tray main body and a through hole for sucking the substrate are provided.
を取り出すための突き上げ用ピンが通る貫通孔および基
板を吸着するための貫通孔を有する基板搬送用トレーに
おいて、前記トレー本体は熱伝導性に優れた物質からな
り、このトレー本体の凹部の表面は絶縁性を有しかつ柔
軟性を有する物質で構成し、前記凹部より外側の表面は
耐蝕性または耐スパッタリング性を有する物質で構成
し、前記凹部の外周部に貫通孔を有する溝を形成し、前
記突き上げ用ピンが通る貫通孔は前記凹部の中央部に形
成した基板搬送用トレー。16. A substrate transport tray having a concave portion of a tray main body, a through hole through which a push-up pin for taking out a mounted substrate, and a through hole for sucking the substrate, wherein the tray main body is made of a heat conductive material. The surface of the concave portion of the tray body is made of a material having insulation and flexibility, and the surface outside the concave portion is made of a material having corrosion resistance or sputtering resistance. A groove having a through hole formed in an outer peripheral portion of the concave portion, and a through hole through which the push-up pin passes is formed in a central portion of the concave portion.
ム、アルミニウム合金、銅、銅合金のうちのいずれかで
ある請求項１６に記載の基板搬送用トレー。17. The substrate transfer tray according to claim 16, wherein the substance having excellent thermal conductivity is any one of aluminum, an aluminum alloy, copper, and a copper alloy.
で構成した部分はトレー本体の凹部の表面である請求項
１６に記載の基板搬送用トレー。18. The substrate carrying tray according to claim 16, wherein the portion made of an insulating and flexible substance is a surface of the concave portion of the tray body.
はポリイミドである請求項１６に記載の基板搬送用トレ
ー。19. The substrate carrying tray according to claim 16, wherein the insulating and flexible substance is polyimide.
する物質は白金、アルマイト、セラミックのうちのいず
れかである請求項１６に記載の基板搬送用トレー。20. The substrate transfer tray according to claim 16, wherein the substance having corrosion resistance or sputtering resistance is one of platinum, alumite, and ceramic.
取り出すための突き上げ用ピンが通る貫通孔および基板
を吸着するための貫通孔を設けた請求項１６に記載の基
板搬送用トレー。21. The substrate transfer tray according to claim 16, wherein a through hole through which a push-up pin for taking out the substrate placed in the concave portion of the tray main body and a through hole for sucking the substrate are provided.
本体に凹部を設ける工程と、前記トレー本体に突き上げ
用ピンが通る貫通孔、基板を吸着するための貫通孔およ
び貫通孔を有する溝を形成する工程と、前記トレー本体
の凹部より外側の表面に耐蝕性または耐スパッタリング
性を有する物質を設ける工程と、前記トレー本体の凹部
に絶縁性を有しかつ柔軟性を有する物質を設ける工程を
含む基板搬送用トレーの製造方法。22. A step of providing a recess in a tray body made of a material having excellent thermal conductivity, and forming a through hole through which a push-up pin passes, a through hole for sucking a substrate, and a groove having a through hole in the tray body. Forming, providing a substance having corrosion resistance or sputtering resistance on the surface outside the recess of the tray body, and providing an insulating and flexible substance in the recess of the tray body. A method for manufacturing a tray for transporting substrates, including:
柔軟性を有する物質を設けるのは、液状物質の塗布また
はシート状物質の接着のいずれかである請求項１８に記
載の基板搬送用トレーの製造方法。23. The substrate transfer method according to claim 18, wherein the provision of the insulating and flexible substance in the concave portion of the tray body is performed by applying a liquid substance or bonding a sheet substance. Tray manufacturing method.
求項１９に記載の基板搬送用トレーの製造方法。24. The method according to claim 19, wherein the bonding of the sheet material is thermocompression bonding.
本体に凹部を設ける工程と、前記トレー本体に突き上げ
用ピンが通る貫通孔、基板を吸着するための貫通孔およ
び貫通孔を有する溝を形成する工程と、前記トレー本体
の凹部側の全面に耐蝕性または耐スパッタリング性を有
する物質を設ける工程と、前記トレー本体の凹部で耐蝕
性または耐スパッタリング性を有する物質を設けた上に
絶縁性を有しかつ柔軟性を有する物質を設ける工程を含
む基板搬送用トレーの製造方法。25. A step of providing a concave portion in a tray body made of a material having excellent thermal conductivity, and forming a through hole through which a push-up pin passes, a through hole for sucking a substrate, and a groove having a through hole in the tray body. Forming, providing a material having corrosion resistance or sputtering resistance on the entire surface of the concave portion of the tray main body, and providing a material having corrosion resistance or sputtering resistance in the concave portion of the tray main body and insulating A method for manufacturing a substrate carrying tray, comprising the step of providing a flexible material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001116570A JP2002313891A (en) | 2001-04-16 | 2001-04-16 | Tray for substrate transport and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001116570A JP2002313891A (en) | 2001-04-16 | 2001-04-16 | Tray for substrate transport and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002313891A true JP2002313891A (en) | 2002-10-25 |
Family
ID=18967287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001116570A Pending JP2002313891A (en) | 2001-04-16 | 2001-04-16 | Tray for substrate transport and manufacturing method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002313891A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005101505A (en) * | 2003-03-13 | 2005-04-14 | Ventec-Ges Fuer Venturekapital & Unternehmensberatung Mbh | Mobile and transportable type electrostatic substrate holder |
| US7153365B2 (en) | 2002-12-27 | 2006-12-26 | Tokyo Ohka Kogyo Co., Ltd. | Tray for substrate |
| JP2010021403A (en) * | 2008-07-11 | 2010-01-28 | Ulvac Japan Ltd | Tray and cooling chamber |
| JP2010084164A (en) * | 2008-09-29 | 2010-04-15 | Epson Toyocom Corp | Plasma treatment apparatus |
| JP2012109409A (en) * | 2010-11-17 | 2012-06-07 | Ulvac Japan Ltd | Substrate transfer tray |
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| US7153365B2 (en) | 2002-12-27 | 2006-12-26 | Tokyo Ohka Kogyo Co., Ltd. | Tray for substrate |
| JP2005101505A (en) * | 2003-03-13 | 2005-04-14 | Ventec-Ges Fuer Venturekapital & Unternehmensberatung Mbh | Mobile and transportable type electrostatic substrate holder |
| JP2010021403A (en) * | 2008-07-11 | 2010-01-28 | Ulvac Japan Ltd | Tray and cooling chamber |
| JP2010084164A (en) * | 2008-09-29 | 2010-04-15 | Epson Toyocom Corp | Plasma treatment apparatus |
| JP2012109409A (en) * | 2010-11-17 | 2012-06-07 | Ulvac Japan Ltd | Substrate transfer tray |
| KR101574785B1 (en) * | 2014-08-08 | 2015-12-04 | 주식회사 소로나 | Tray for machining substrate and system adopting the tray |
| CN104176702A (en) * | 2014-09-05 | 2014-12-03 | 苏州中科纳福材料科技有限公司 | Device for large-area quick manufacture of nanometer material orderly-assembled functional film |
| JP2016149508A (en) * | 2015-02-13 | 2016-08-18 | 株式会社カネカ | Method of manufacturing solar cell |
| JP2016184632A (en) * | 2015-03-26 | 2016-10-20 | 豊田合成株式会社 | Semiconductor device manufacturing method and resist removing device |
| JP2017017286A (en) * | 2015-07-06 | 2017-01-19 | 株式会社ディスコ | Chuck table and cleaning device |
| TWI681485B (en) * | 2015-07-06 | 2020-01-01 | 日商迪思科股份有限公司 | Work clamp table and washing device |
| KR20180127808A (en) * | 2017-05-22 | 2018-11-30 | (주)코미코 | Method for Reducing Arcing Electrostatic Chuck |
| KR102155512B1 (en) | 2017-05-22 | 2020-09-14 | (주)코미코 | Method for Reducing Arcing Electrostatic Chuck |
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