JP2002231559A - Laminated through-type capacitor - Google Patents
Laminated through-type capacitorInfo
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- JP2002231559A JP2002231559A JP2001028486A JP2001028486A JP2002231559A JP 2002231559 A JP2002231559 A JP 2002231559A JP 2001028486 A JP2001028486 A JP 2001028486A JP 2001028486 A JP2001028486 A JP 2001028486A JP 2002231559 A JP2002231559 A JP 2002231559A
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- capacitor
- internal
- multilayer feedthrough
- feedthrough capacitor
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、等価直列インタク
タンス（ＥＳＬ）を低減して高周波数域でより効果的に
ノイズ対策を実行可能でノイスフィルタ等に用いられる
積層貫通型コンデンサに係り、特に情報処理機器や通信
機器の回路に好適なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer feedthrough capacitor used in a noise filter or the like which can reduce noise equivalent series (ESL) more effectively in a high frequency range and can use it for noise filters. It is suitable for circuits of information processing equipment and communication equipment.
【０００２】[0002]
【従来の技術】近年の大半の情報処理機器や通信機器は
ディジタル化され、さらに情報処理能力の高速化よって
これらの機器で取り扱われるディジタル信号の高周波数
化が進んでいる。従って、これらの機器から発生するノ
イズも同様に高周波数域で増大する傾向にあり、多くの
機器には、ノイズ対策をして電磁波障害の防止や不要な
電圧変動の抑止を図る為の電子部品が使用されている。
そして、このノイズ対策の為の電子部品として、一般的
に積層コンデンサが採用されている。2. Description of the Related Art In recent years, most information processing devices and communication devices have been digitized, and the frequency of digital signals handled by these devices has been increasing due to the speeding up of information processing capability. Therefore, the noise generated from these devices also tends to increase in the high frequency range, and many devices have electronic components for preventing electromagnetic interference and suppressing unnecessary voltage fluctuations by taking measures against noise. Is used.
In general, a multilayer capacitor is used as an electronic component for noise suppression.
【０００３】しかし、積層コンデンサの寄生成分である
ＥＳＬ（等価直列インダクタンス）が、高周波数域のノ
イズ除去効果を阻害する為、機器の動作周波数等の一層
の高周波数化に伴って、その効果が不十分になってい
る。つまり、従来の積層コンデンサのように大きなＥＳ
Ｌを有したものでは、最近の高周波数化には適応できな
くなっている。However, ESL (equivalent series inductance), which is a parasitic component of the multilayer capacitor, hinders the effect of removing noise in a high frequency range. Insufficient. In other words, a large ES like a conventional multilayer capacitor
Those having L cannot be adapted to recent higher frequencies.
【０００４】そこで、高周波数域でのノイズ対策を図る
為に、ＥＳＬを低減したコンデンサとして積層型の貫通
コンデンサである積層貫通型コンデンサが製品化され用
いられており、この積層貫通型コンデンサ１１０を図７
から図１０に示し、以下に説明する。例えば図７に示す
形で使用されるこの積層貫通型コンデンサ１１０は、図
１０に示すように相互に対向する二側面に引き出された
第１貫通導体１１２を配置した誘電体シート１２２及
び、この二側面と異なる二側面に引き出された第２貫通
導体１１４を配置した誘電体シート１２４が、それぞれ
積層された図９に示す積層体１２０とされるような構造
になっている。Therefore, in order to take measures against noise in a high frequency range, a multilayer feed-through capacitor which is a multilayer feed-through capacitor has been commercialized and used as a capacitor with reduced ESL. FIG.
To FIG. 10 and described below. For example, the multilayer feedthrough capacitor 110 used in the form shown in FIG. 7 has a dielectric sheet 122 in which first through conductors 112 extending on two sides facing each other are arranged as shown in FIG. The dielectric sheet 124 on which the second penetrating conductors 114 drawn out from two side surfaces different from the side surfaces are arranged is formed into a laminated body 120 shown in FIG.
【０００５】さらに、図８及び図９に示すように、第１
貫通導体１１２が繋がる端子電極１３２を信号線路Ｓに
接続し得るように積層体１２０の端部に形成し、第２貫
通導体１１４が繋がる端子電極１３４をＧＮＤで示す接
地側に接続し得るように積層体１２０の側部に形成して
いる。尚、図７及び図８において、Ｃはコンデンサを示
し、ＥＳＬは等価直列インタクタンスを示す。[0005] Further, as shown in FIGS.
A terminal electrode 132 to which the through conductor 112 is connected is formed at an end of the laminated body 120 so as to be able to connect to the signal line S, and a terminal electrode 134 to which the second through conductor 114 is connected can be connected to the ground side indicated by GND. It is formed on the side of the laminate 120. 7 and 8, C indicates a capacitor, and ESL indicates an equivalent series inductance.
【０００６】[0006]
【発明が解決しようとする課題】しかし、最近の機器は
著しく高周波数化し、ノイズはますます増加する一方、
機器の低消費電力化から動作電圧が低下しており、機器
のノイズに対する耐久性は低下している。この為、ノイ
ズ対策用の電子部品には、より高い周波数域での高いノ
イズ除去効果が要求されるようになった。こうした現状
に対応する為、積層貫通型コンデンサにおいても更なる
ＥＳＬの低減化が重要な課題となった。本発明は上記事
実を考慮し、ＥＳＬを低減して高周波数域でより効果的
にノイズ対策を実行できる積層貫通型コンデンサを提供
することを目的とする。[Problems to be solved by the invention] However, the frequency of recent devices has been remarkably increased, and noise has been increasing.
The operating voltage has been reduced due to the reduction in power consumption of equipment, and the durability of equipment to noise has been reduced. For this reason, electronic components for noise suppression have been required to have a high noise removing effect in a higher frequency range. In order to cope with such a current situation, it has become an important issue to further reduce the ESL in the multilayer feedthrough capacitor. The present invention has been made in view of the above circumstances, and has as its object to provide a multilayer feedthrough capacitor that can reduce ESL and more effectively implement noise suppression in a high frequency range.
【０００７】[0007]
【課題を解決するための手段】請求項１による積層貫通
型コンデンサは、第１内部導体と第２内部導体との間に
少なくとも一枚の誘電体シートが挟まれつつこの誘電体
シートを複数枚積層してコンデンサ本体を形成し、第１
内部導体に接続される信号用端子電極及び第２内部導体
に接続されるグランド用端子電極が、コンデンサ本体の
側面にそれぞれ配置され、第２内部導体が、隣り合う分
割部分同士で電流が相互に逆向きに流れる形に、複数に
分割されることを特徴とする。According to a first aspect of the present invention, there is provided a multilayer feedthrough capacitor comprising a plurality of dielectric sheets sandwiched between a first inner conductor and a second inner conductor. Laminated to form a capacitor body,
A signal terminal electrode connected to the internal conductor and a ground terminal electrode connected to the second internal conductor are respectively arranged on the side surfaces of the capacitor body, and the second internal conductor allows current to flow between adjacent divided portions. It is characterized in that it is divided into a plurality of parts in the form of flowing in the opposite direction.
【０００８】請求項１に係る積層貫通型コンデンサによ
れば、第１内部導体と第２内部導体との間に少なくとも
一枚の誘電体シートが挟まれつつ誘電体シートを複数枚
積層してコンデンサ本体を形成しており、この第１内部
導体に接続される信号用端子電極及び第２内部導体に接
続されるグランド用端子電極が、コンデンサ本体の側面
にそれぞれ配置されている。そして、第２内部導体が、
隣り合う分割部分同士で電流が相互に逆向きに流れる形
に、複数に分割されている。[0008] According to the multilayer feedthrough capacitor according to the first aspect, a capacitor is formed by laminating a plurality of dielectric sheets while at least one dielectric sheet is sandwiched between the first inner conductor and the second inner conductor. A main body is formed, and a signal terminal electrode connected to the first internal conductor and a ground terminal electrode connected to the second internal conductor are respectively arranged on side surfaces of the capacitor main body. And the second inner conductor is
The adjacent divided portions are divided into a plurality of portions so that currents flow in opposite directions.
【０００９】つまり、グランド用端子電極に繋がる第２
内部導体が複数の分割部分に分割され、これら複数の分
割部分の内の相互に隣り合う分割部分同士で、電流が相
互に逆向きに流れるようになっている。従って、本請求
項に係る積層貫通型コンデンサによれば、第２内部導体
内の分割部分を流れる電流同士により磁界を相殺する作
用が生じ、この作用によって第２内部導体のインダクタ
ンスが減少してＥＳＬが低減され、高周波数域でより効
果的にノイズ対策を実行できるようになる。That is, the second terminal connected to the ground terminal electrode
The inner conductor is divided into a plurality of divided portions, and currents flow in mutually opposite directions in the mutually adjacent divided portions of the plurality of divided portions. Therefore, according to the multilayer feedthrough capacitor according to the present invention, the action of canceling the magnetic field by the currents flowing through the divided portions in the second inner conductor occurs, and this action reduces the inductance of the second inner conductor and reduces the ESL. Is reduced, and noise suppression can be more effectively performed in a high frequency range.
【００１０】請求項２に係る積層貫通型コンデンサによ
れば、請求項１の積層貫通型コンデンサと同様の構成の
他に、第２内部導体が、隣り合う分割部分同士で電流が
相互に逆向きに流れる形に二分割されるという構成を有
している。従って、第２内部導体が二つに分割され、こ
れら二つの分割部分の内の相互に隣り合う分割部分で、
電流が相互に逆向きに流れることで、請求項１と同様の
作用が生じるようになる。[0010] According to the multilayer feedthrough capacitor of the second aspect, in addition to the same configuration as the multilayer feedthrough capacitor of the first aspect, the second inner conductor is formed such that currents are opposite to each other between adjacent divided portions. It is configured to be divided into two in a shape that flows into Therefore, the second inner conductor is divided into two, and the two adjacent divided portions are adjacent to each other.
When the currents flow in opposite directions, the same operation as in the first aspect occurs.
【００１１】請求項３に係る積層貫通型コンデンサによ
れば、請求項１及び請求項２の積層貫通型コンデンサと
同様の構成の他に、第１内部導体と第２内部導体とが相
互に交差する方向に延びるように形成され、信号用端子
電極とグランド用端子電極とがコンデンサ本体の相互に
異なる側面に配置されるという構成を有している。従っ
て、請求項１と同様の作用が生じるだけでなく、コンデ
ンサ本体の側面にこれら端子電極が最適に配置されて積
層貫通型コンデンサの小型化を図ることも可能となる。According to the multilayer feedthrough capacitor of the third aspect, in addition to the same configuration as the multilayer feedthrough capacitor of the first and second aspects, the first internal conductor and the second internal conductor cross each other. And a terminal electrode for signal and a terminal electrode for ground are arranged on mutually different side surfaces of the capacitor body. Therefore, not only the same operation as in claim 1 occurs, but also the terminal electrodes are optimally arranged on the side surfaces of the capacitor main body, so that the size of the multilayer feedthrough capacitor can be reduced.
【００１２】[0012]
【発明の実施の形態】以下、本発明に係る積層貫通型コ
ンデンサの第１の実施の形態を図面に基づき説明する。
図１に示すように、誘電体シートであるセラミックグリ
ーンシートを複数枚積層した積層体を焼成することで得
られた直方体状の焼結体である誘電体素体１２を主要部
として、本発明の第１の実施の形態に係る電子部品であ
る積層貫通型コンデンサ１０が構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a multilayer feedthrough capacitor according to the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the present invention uses a dielectric element 12, which is a rectangular parallelepiped sintered body obtained by firing a laminate obtained by laminating a plurality of ceramic green sheets, which are dielectric sheets, as a main part. A multilayer feedthrough capacitor 10 as an electronic component according to the first embodiment is configured.
【００１３】図２及び図３に示すように、この誘電体素
体１２内の所定の高さ位置には、誘電体素体１２の図３
の手前側と奥側との間で延びる内部電極２１が配置され
ている。また、誘電体素体１２内において、セラミック
グリーンシートが焼結されたものであるセラミック層１
２Ａを隔てた内部電極２１の下方には、誘電体素体１２
の図３の左側と右側との間で延びる内部電極２２が配置
されている。As shown in FIGS. 2 and 3, a predetermined height position in the dielectric element 12
An internal electrode 21 extending between the near side and the far side of the horn is disposed. Further, in the dielectric body 12, the ceramic layer 1 formed by sintering the ceramic green sheet is used.
The dielectric element 12 is located below the internal electrode 21 separated by 2A.
An internal electrode 22 extending between the left side and the right side of FIG.
【００１４】さらに、誘電体素体１２内においてセラミ
ック層１２Ａを隔てた内部電極２２の下方には、内部電
極２１と同様に誘電体素体１２の図３の手前側と奥側と
の間で延びる内部電極２３が、配置されている。また、
誘電体素体１２内においてセラミック層１２Ａを隔てた
内部電極２３の下方には、内部電極２２と同様に誘電体
素体１２の図３の左側と右側との間で延びる内部電極２
４が、配置されている。Further, below the internal electrode 22 with the ceramic layer 12A therebetween in the dielectric element 12, similarly to the internal electrode 21, between the front side and the rear side of the dielectric element 12 in FIG. An extending internal electrode 23 is arranged. Also,
In the dielectric element 12, below the internal electrode 23 with the ceramic layer 12A interposed therebetween, like the internal electrode 22, the internal electrode 2 extending between the left and right sides of the dielectric element 12 in FIG.
4 are arranged.
【００１５】この為、これら内部電極２１から内部電極
２４までの内部電極が誘電体素体１２内において誘電体
層とされるセラミック層１２Ａで隔てられつつ相互に対
向して配置されることになる。つまり、内部電極２１と
内部電極２２との間に少なくとも一枚のセラミック層１
２Ａが挟まれ、また、内部電極２３と内部電極２４との
間に少なくとも一枚のセラミック層１２Ａが挟まれつ
つ、これらセラミック層１２Ａを複数枚積層してコンデ
ンサ本体である誘電体素体１２が形成されている。For this reason, the internal electrodes from the internal electrode 21 to the internal electrode 24 are arranged in the dielectric body 12 so as to be opposed to each other while being separated by the ceramic layer 12A as a dielectric layer. . That is, at least one ceramic layer 1 is disposed between the internal electrode 21 and the internal electrode 22.
2A, and at least one ceramic layer 12A is sandwiched between the internal electrode 23 and the internal electrode 24, and a plurality of these ceramic layers 12A are laminated to form the dielectric body 12, which is a capacitor body. Is formed.
【００１６】また、第１内部導体である内部電極２１、
２３で信号を伝達する経路を構成すると共に、これら内
部電極２１、２３に対して相互に交差する方向に延びる
第２内部導体である内部電極２２、２４でコンデンサを
構成する形とされている。尚、これら内部電極は単に４
層だけでなく、さらに多数層配置しても良く、また、こ
れら内部電極の材質としては、例えばニッケル、ニッケ
ル合金、銅或いは、銅合金が考えられる。Further, an internal electrode 21, which is a first internal conductor,
23 forms a path for transmitting a signal, and the internal electrodes 22 and 24 which are second internal conductors extending in a direction intersecting with the internal electrodes 21 and 23 form a capacitor. Note that these internal electrodes are simply 4
Not only the layers but also a larger number of layers may be arranged. As a material of these internal electrodes, for example, nickel, a nickel alloy, copper or a copper alloy can be considered.
【００１７】ここで、図３に示すように、内部電極２２
は相互に対向する一対の分割部分である電極構成部２２
Ａ、２２Ｂにより構成されており、また、内部電極２４
は同じく相互に対向する一対の分割部分である電極構成
部２４Ａ、２４Ｂにより構成されている。そして、電極
構成部２２Ａがその左端側で広幅に形成された幅広部４
１から右方向に延びる二本の突出部４２を有しており、
また、電極構成部２２Ｂがその右端側で広幅に形成され
た幅広部４３から左方向に延びる二本の突出部４４を有
していて、これら突出部４２と突出部４４とは交互に配
置される構造となっている。Here, as shown in FIG.
Represents an electrode constituting portion 22 which is a pair of divided portions facing each other.
A, 22B.
Is constituted by a pair of divided electrode parts 24A and 24B which are also opposed to each other. Then, the wide portion 4 in which the electrode configuration portion 22A is formed wide on the left end side.
It has two protrusions 42 extending from 1 to the right.
Further, the electrode constituting portion 22B has two protrusions 44 extending leftward from a wide portion 43 formed wide on the right end side, and the protrusions 42 and the protrusions 44 are arranged alternately. Structure.
【００１８】また、同じく電極構成部２４Ａがその左端
側で広幅に形成された幅広部４１から右方向に延びる二
本の突出部４２を有しており、また、電極構成部２４Ｂ
がその右端側で広幅に形成された幅広部４３から左方向
に延びる二本の突出部４４を有していて、上記と同様に
これら突出部４２と突出部４４とは交互に配置される構
造となっている。Similarly, the electrode component 24A has two protruding portions 42 extending rightward from a wide portion 41 formed wide at the left end thereof.
Has two protruding portions 44 extending leftward from a wide portion 43 formed wide on the right end side, and the protruding portions 42 and the protruding portions 44 are alternately arranged as described above. It has become.
【００１９】以上より、内部電極２２は、相互に隣り合
う分割部分である電極構成部２２Ａの突出部４２と電極
構成部２２Ｂの突出部４４とで、図３の矢印で示すよう
に電流が相互に逆向きに流れる形に、二分割された構造
とされており、また、内部電極２４は、相互に隣り合う
分割部分である電極構成部２４Ａの突出部４２と電極構
成部２４Ｂの突出部４４とで、図３の矢印で示すように
電流が相互に逆向きに流れる形に、二分割された構造と
されている。As described above, the internal electrode 22 is formed such that a current flows between the protruding portion 42 of the electrode forming portion 22A and the protruding portion 44 of the electrode forming portion 22B, which are adjacent divided portions, as shown by arrows in FIG. The internal electrode 24 has a projection 42 of the electrode configuration portion 24A and a projection 44 of the electrode configuration portion 24B, which are adjacent divided portions. Thus, as shown by arrows in FIG. 3, the structure is divided into two so that currents flow in opposite directions.
【００２０】さらに、図２及び図３に示す内部電極２
１、２３の両端部にそれぞれ接続されるように、一対の
信号用端子電極３１、３２が、図１に示す誘電体素体１
２の手前側の側面１２Ｂと奥側の側面１２Ｂにそれぞれ
配置されている。また、図２に示す内部電極２２、２４
の両端部にそれぞれ接続されるように、一対のグランド
用端子電極３３、３４が、図１に示す誘電体素体１２の
左側の側面１２Ｃと右側の側面１２Ｃにそれぞれ配置さ
れている。Further, the internal electrodes 2 shown in FIGS.
The pair of signal terminal electrodes 31 and 32 are connected to the dielectric element 1 shown in FIG.
2 are disposed on the front side surface 12B and the back side surface 12B, respectively. Further, the internal electrodes 22, 24 shown in FIG.
A pair of ground terminal electrodes 33 and 34 are arranged on the left side surface 12C and the right side surface 12C of the dielectric body 12 shown in FIG.
【００２１】以上の結果、本実施の形態では、図１に示
すように、積層貫通型コンデンサ１０の手前と奥の側面
１２Ｂに信号用端子電極３１、３２がそれぞれ配置さ
れ、左右の側面１２Ｃにグランド用端子電極３３、３４
がそれぞれ配置されることで、直方体である六面体形状
とされる誘電体素体１２の４つの側面１２Ｂ、１２Ｃに
端子電極３１〜３４がそれぞれ配置される４端子の構造
になっている。As a result, in the present embodiment, as shown in FIG. 1, signal terminal electrodes 31, 32 are arranged on the front and rear side surfaces 12B of the multilayer feedthrough capacitor 10, respectively, and on the left and right side surfaces 12C. Ground terminal electrodes 33, 34
Are arranged, respectively, to form a four-terminal structure in which the terminal electrodes 31 to 34 are respectively arranged on the four side faces 12B and 12C of the dielectric element body 12 having a rectangular parallelepiped hexahedron shape.
【００２２】次に、本実施の形態に係る積層貫通型コン
デンサ１０の作用を説明する。本実施の形態に係る積層
貫通型コンデンサ１０によれば、相互に交差する方向に
延びるように形成される内部電極２１と内部電極２２と
の間及び、同じく相互に交差する方向に延びるように形
成される内部電極２３と内部電極２４との間に、一層づ
つのセラミック層１２Ａがそれぞれ挟まれている。ま
た、内部電極２２と内部電極２３との間にも一層のセラ
ミック層１２Ａが挟まれている。そして、これらセラミ
ック層１２Ａが複数層積層されて誘電体素体１２を形成
している。Next, the operation of the multilayer feedthrough capacitor 10 according to the present embodiment will be described. According to the multilayer feedthrough capacitor 10 according to the present embodiment, it is formed between internal electrodes 21 and 22 formed to extend in directions intersecting each other, and also to extend in directions intersecting each other similarly. One ceramic layer 12A is sandwiched between the internal electrodes 23 and 24 to be formed. Further, one ceramic layer 12A is also sandwiched between the internal electrodes 22 and 23. A plurality of these ceramic layers 12A are laminated to form the dielectric body 12.
【００２３】この内部電極２１、２３に接続される信号
用端子電極３１、３２及び、内部電極２２、２４に接続
されるグランド用端子電極３３、３４が、誘電体素体１
２の相互に異なる側面にそれぞれ配置されている。さら
に、内部電極２２が、隣り合う電極構成部２２Ａの突出
部４２と電極構成部２２Ｂの突出部４４との間で図３の
矢印のように電流が相互に逆向きに流れる形で二分割さ
れ、また、内部電極２４が、隣り合う電極構成部２４Ａ
の突出部４２と電極構成部２４Ｂの突出部４４との間で
図３の矢印のように電流が相互に逆向きに流れる形で二
分割されている。The signal terminal electrodes 31 and 32 connected to the internal electrodes 21 and 23 and the ground terminal electrodes 33 and 34 connected to the internal electrodes 22 and 24 are formed by the dielectric element 1.
Two mutually different sides are arranged respectively. Furthermore, the internal electrode 22 is divided into two portions between the protruding portions 42 of the adjacent electrode forming portions 22A and the protruding portions 44 of the electrode forming portions 22B such that currents flow in opposite directions as shown by arrows in FIG. In addition, the internal electrode 24 is connected to the adjacent electrode configuration portion 24A.
3 is divided into two such that currents flow in opposite directions as shown by arrows in FIG.
【００２４】つまり、グランド用端子電極３３、３４に
繋がる内部電極２２、２４が、二つの電極構成部２２
Ａ、２２Ｂ及び電極構成部２４Ａ、２４Ｂにそれぞれ分
割され、これら二つの相互に隣り合う分割部分同士で、
電流が相互に逆向きに流れるようになっている。That is, the internal electrodes 22 and 24 connected to the ground terminal electrodes 33 and 34 are connected to the two electrode constituent portions 22.
A, 22B and the electrode components 24A, 24B, respectively.
The currents flow in opposite directions.
【００２５】従って、本実施の形態に係る積層貫通型コ
ンデンサ１０によれば、内部電極２２を構成する電極構
成部２２Ａ、２２Ｂ内を流れる電流同士及び、内部電極
２４を構成する電極構成部２４Ａ、２４Ｂ内を流れる電
流同士により、電流が流れるのに伴って発生する磁束が
互いに打ち消し合わされるように、磁界を相殺する作用
がそれぞれ生じる。そして、この作用によって内部電極
２２、２４自体が持つ寄生インダクタンスが減少してＥ
ＳＬが低減され、高周波数域でより効果的にノイズ対策
を実行できるようになる。Therefore, according to the multilayer feedthrough capacitor 10 of the present embodiment, the currents flowing through the electrode components 22A and 22B constituting the internal electrode 22 and the electrode components 24A constituting the internal electrode 24, The currents flowing through the 24B have an action of canceling the magnetic fields so that the magnetic fluxes generated as the current flows cancel each other. This action reduces the parasitic inductance of the internal electrodes 22 and 24 and reduces E
SL is reduced, and noise measures can be more effectively executed in a high frequency range.
【００２６】さらに、本実施の形態では、内部電極２
１、２３と内部電極２２、２４とが相互に交差する方向
に延びるように形成され、信号用端子電極３１、３２と
グランド用端子電極３３、３４とが誘電体素体１２の相
互に異なる側面に配置されているので、誘電体素体１２
の側面１２Ｂ、１２Ｃにこれら端子電極３１〜３４が最
適に配置されて積層貫通型コンデンサ１０の小型化を図
ることも可能となる。Further, in the present embodiment, the internal electrodes 2
1 and 23 and the internal electrodes 22 and 24 are formed so as to extend in a direction crossing each other, and the signal terminal electrodes 31 and 32 and the ground terminal electrodes 33 and 34 are formed on different side surfaces of the dielectric body 12. , The dielectric element 12
These terminal electrodes 31 to 34 are optimally arranged on the side surfaces 12B and 12C, and the size of the multilayer feedthrough capacitor 10 can be reduced.
【００２７】次に、本発明に係る積層貫通型コンデンサ
の第２の実施の形態を図４に基づき説明する。尚、第１
の実施の形態で説明した部材と同一の部材には同一の符
号を付して、重複した説明を省略する。図４に示すよう
に本実施の形態では、内部電極２２が、セラミック層１
２Ａの左端側から右方向に延びる２つの電極構成部２２
Ａ、２２Ｃを有していると共に、セラミック層１２Ａの
右端側から左方向に延びる２つの電極構成部２２Ｂ、２
２Ｄを有している。また、内部電極２４が同様に、セラ
ミック層１２Ａの左端側から右方向に延びる２つの電極
構成部２４Ａ、２４Ｃを有していると共に、セラミック
層１２Ａの右端側から左方向に延びる２つの電極構成部
２４Ｂ、２４Ｄを有している。Next, a second embodiment of the multilayer feedthrough capacitor according to the present invention will be described with reference to FIG. The first
The same members as those described in the embodiments are denoted by the same reference numerals, and redundant description will be omitted. As shown in FIG. 4, in the present embodiment, the internal electrodes 22
Two electrode components 22 extending rightward from the left end of 2A
A, 22C, and two electrode components 22B, 2C extending leftward from the right end of the ceramic layer 12A.
Has 2D. Similarly, the internal electrode 24 has two electrode components 24A and 24C extending rightward from the left end of the ceramic layer 12A, and two electrode components extending leftward from the right end of the ceramic layer 12A. Parts 24B and 24D.
【００２８】つまり、本実施の形態では、内部電極２２
が、相互に隣り合う分割部分である電極構成部２２Ａ、
２２Ｂ、２２Ｃ、２２Ｄで電流が相互に逆向きに流れる
形に、４つに分割され、また、内部電極２４が、相互に
隣り合う分割部分である電極構成部２４Ａ、２４Ｂ、２
４Ｃ、２４Ｄで電流が相互に逆向きに流れる形に、４つ
に分割されている。That is, in the present embodiment, the internal electrodes 22
Are electrode constituent parts 22A which are divided parts adjacent to each other,
22B, 22C, and 22D are divided into four parts so that currents flow in opposite directions, and the internal electrodes 24 are divided into electrode constituent parts 24A, 24B,
It is divided into four parts in such a manner that currents flow in opposite directions at 4C and 24D.
【００２９】従って、本実施の形態に係る積層貫通型コ
ンデンサ１０によっても、内部電極２２、２４内の分割
部分を流れる電流同士により磁界を相殺する作用が生
じ、第１の実施の形態と同様に、この作用によって内部
電極２２、２４自体が持つ寄生インダクタンスが減少し
てＥＳＬが低減され、高周波数域でより効果的にノイズ
対策を実行できるようになる。Accordingly, the multilayer feedthrough capacitor 10 according to the present embodiment also has the effect of canceling out the magnetic field by the currents flowing through the divided portions in the internal electrodes 22 and 24, as in the first embodiment. By this action, the parasitic inductance of the internal electrodes 22 and 24 themselves is reduced, and the ESL is reduced, so that noise countermeasures can be executed more effectively in a high frequency range.
【００３０】次に、本発明に係る積層貫通型コンデンサ
の第３の実施の形態を図５に基づき説明する。尚、第１
の実施の形態で説明した部材と同一の部材には同一の符
号を付して、重複した説明を省略する。図５に示すよう
に本実施の形態では、内部電極２２の一方の分割部分と
して、セラミック層１２Ａの左端側で広幅に形成される
と共にこの広幅の部分から右方向に延びるＬ字形の電極
構成部２２Ａが、形成されている。また、この内部電極
２２の他方の分割部分として、セラミック層１２Ａの右
端側で広幅に形成されると共にこの広幅の部分から左方
向に延びるＬ字形の電極構成部２２Ｂが、形成されてい
る。Next, a third embodiment of the multilayer feedthrough capacitor according to the present invention will be described with reference to FIG. The first
The same members as those described in the embodiments are denoted by the same reference numerals, and redundant description will be omitted. As shown in FIG. 5, in the present embodiment, as one of the divided portions of the internal electrode 22, an L-shaped electrode component portion formed wide on the left end side of the ceramic layer 12A and extending rightward from the wide portion. 22A are formed. In addition, as the other divided portion of the internal electrode 22, an L-shaped electrode configuration portion 22B that is formed wide on the right end side of the ceramic layer 12A and extends leftward from the wide portion is formed.
【００３１】一方、上記と同様に内部電極２４の一方の
分割部分として、セラミック層１２Ａの左端側で広幅に
形成されると共にこの広幅の部分から右方向に延びるＬ
字形の電極構成部２４Ａが、形成されている。また、こ
の内部電極２４の他方の分割部分として、セラミック層
１２Ａの右端側で広幅に形成されると共にこの広幅の部
分から左方向に延びるＬ字形の電極構成部２４Ｂが、形
成されている。On the other hand, similarly to the above, one divided portion of the internal electrode 24 is formed to be wide on the left end side of the ceramic layer 12A and extends rightward from the wide portion.
A letter-shaped electrode configuration portion 24A is formed. Further, as the other divided portion of the internal electrode 24, an L-shaped electrode configuration portion 24B which is formed wide on the right end side of the ceramic layer 12A and extends leftward from the wide portion is formed.
【００３２】つまり、本実施の形態では、内部電極２２
が、相互に隣り合う分割部分である電極構成部２２Ａと
電極構成部２２Ｂとで電流が相互に逆向きに流れる形
に、二分割され、また、内部電極２４が、相互に隣り合
う分割部分である電極構成部２４Ａと電極構成部２４Ｂ
とで電流が相互に逆向きに流れる形に、二分割されてい
る。That is, in the present embodiment, the internal electrodes 22
Is divided into two such that currents flow in opposite directions in the electrode configuration part 22A and the electrode configuration part 22B, which are adjacent to each other, and the internal electrode 24 is divided into two adjacent parts. Certain electrode components 24A and electrode components 24B
Is divided into two parts so that currents flow in opposite directions.
【００３３】従って、本実施の形態に係る積層貫通型コ
ンデンサ１０によっても、内部電極２２、２４内の分割
部分を流れる電流同士により磁界を相殺する作用が生
じ、第１の実施の形態と同様に、この作用によってＥＳ
Ｌが低減され、高周波数域でより効果的にノイズ対策を
実行できるようになる。Therefore, the multilayer feedthrough capacitor 10 according to the present embodiment also has the effect of canceling out the magnetic field by the currents flowing through the divided portions in the internal electrodes 22 and 24, as in the first embodiment. , By this action,
L is reduced, and noise countermeasures can be executed more effectively in a high frequency range.
【００３４】次に、ネットワークアナライザにより以下
の各試料のＥＳＬを測定した。つまり、コンデンサとし
て一般的な２端子型積層コンデンサ、従来例の積層貫通
型コンデンサ１１０、図１に示す本実施の形態の積層貫
通型コンデンサ１０のＥＳＬを、それぞれ測定した。Next, the ESL of each of the following samples was measured by a network analyzer. That is, the ESL of a general two-terminal multilayer capacitor as a capacitor, the multilayer feedthrough capacitor 110 of a conventional example, and the ESL of the multilayer feedthrough capacitor 10 of the present embodiment shown in FIG. 1 were measured.
【００３５】そして、この測定の結果として、２端子型
積層コンデンサではＥＳＬが１４２０ｐＨであり、従来
例の積層貫通型コンデンサ１１０ではＥＳＬが１６５ｐ
Ｈであるのに対して、本実施の形態の積層貫通型コンデ
ンサ１０ではＥＳＬが９８ｐＨであった。つまり、本発
明の実施の形態による積層貫通型コンデンサ１０では、
２端子型積層コンデンサ及び従来例の積層貫通型コンデ
ンサ１１０と比較して、ＥＳＬが大幅に低減されること
が確認された。As a result of this measurement, the ESL of the two-terminal multilayer capacitor is 1420 pH, and the ESL of the conventional multilayer feedthrough capacitor 110 is 165p.
H, whereas the ESL of the multilayer feedthrough capacitor 10 of the present embodiment was 98 pH. That is, in the multilayer feedthrough capacitor 10 according to the embodiment of the present invention,
It was confirmed that the ESL was significantly reduced as compared with the two-terminal multilayer capacitor and the conventional multilayer feedthrough capacitor 110.
【００３６】尚、図６に示すように、このＥＳＬは２π
ｆ0 ＝１／√（ＥＳＬ・Ｃ）の式より求められるもので
あり、ｆ0 は自己共振周波数でＣは静電容量である。ま
た、ここで用いた各試料の寸法としては、縦が３．２ｍ
ｍで横が１．６ｍｍとされ、静電容量としては、２端子
型積層コンデンサが１．０５μＦであり、従来例の積層
貫通型コンデンサが１．０１μＦであり、本実施の形態
の積層貫通型コンデンサ１０が１．０３μＦであった。As shown in FIG. 6, this ESL is 2π
f 0 = 1 / √ (ESL · C), where f 0 is the self-resonant frequency and C is the capacitance. The dimensions of each sample used here were 3.2 m in length.
m is 1.6 mm in width, and the capacitance is 1.05 μF for a two-terminal multilayer capacitor, 1.01 μF for a conventional multilayer feedthrough capacitor, and 1.01 μF for the multilayer feedthrough capacitor according to the present embodiment. The capacitor 10 was 1.03 μF.
【００３７】さらに、上記実施の形態に係る積層貫通型
コンデンサ１０は、４枚の内部電極２１〜２４及び４個
の端子電極３１〜３４を有する構造とされているもの
の、層数、内部電極の枚数及び、端子電極の数は、これ
らの数に限定されず、さらに多数としても良い。Furthermore, although the multilayer feedthrough capacitor 10 according to the above embodiment has a structure having four internal electrodes 21 to 24 and four terminal electrodes 31 to 34, the number of layers and the number of internal electrodes The number and the number of terminal electrodes are not limited to these numbers, and may be larger.
【００３８】[0038]
【発明の効果】本発明によれば、ＥＳＬを低減して高周
波数域でより効果的にノイズ対策を実行できる積層貫通
型コンデンサを提供することが可能となる。According to the present invention, it is possible to provide a multilayer feedthrough capacitor capable of reducing ESL and more effectively implementing noise countermeasures in a high frequency range.
【図１】本発明の第１の実施の形態に係る積層貫通型コ
ンデンサを示す斜視図である。FIG. 1 is a perspective view showing a multilayer feedthrough capacitor according to a first embodiment of the present invention.
【図２】本発明の第１の実施の形態に係る積層貫通型コ
ンデンサを示す断面図であって、図１の２−２矢視線断
面に対応する図である。FIG. 2 is a cross-sectional view illustrating the multilayer feed-through capacitor according to the first embodiment of the present invention, and is a view corresponding to a cross section taken along line 2-2 of FIG.
【図３】本発明の第１の実施の形態に係る積層貫通型コ
ンデンサの分解斜視図である。FIG. 3 is an exploded perspective view of the multilayer feedthrough capacitor according to the first embodiment of the present invention.
【図４】本発明の第２の実施の形態に係る積層貫通型コ
ンデンサの分解斜視図である。FIG. 4 is an exploded perspective view of a multilayer feedthrough capacitor according to a second embodiment of the present invention.
【図５】本発明の第３の実施の形態に係る積層貫通型コ
ンデンサの分解斜視図である。FIG. 5 is an exploded perspective view of a multilayer feedthrough capacitor according to a third embodiment of the present invention.
【図６】コンデンサのインピーダンス特性を表すグラフ
を示した図である。FIG. 6 is a diagram showing a graph illustrating impedance characteristics of a capacitor.
【図７】従来例の積層貫通型コンデンサを採用した回路
図である。FIG. 7 is a circuit diagram employing a conventional multilayer feedthrough capacitor.
【図８】従来例の積層貫通型コンデンサの等価回路図で
ある。FIG. 8 is an equivalent circuit diagram of a conventional multilayer feedthrough capacitor.
【図９】従来例の積層貫通型コンデンサを示す斜視図で
あって、信号の流れ及び接地の関係を示す図である。FIG. 9 is a perspective view showing a conventional multilayer feedthrough capacitor, showing the relationship between signal flow and grounding.
【図１０】従来例の積層貫通型コンデンサの積層構造を
示す分解斜視図である。FIG. 10 is an exploded perspective view showing a multilayer structure of a conventional multilayer feedthrough capacitor.
１０ 積層貫通型コンデンサ １２ 誘電体素体（コンデンサ本体） １２Ｂ、１２Ｃ 側面 ２１、２３ 内部電極（第１内部導体） ２２、２４ 内部電極（第２内部導体） ３１、３２ 信号用端子電極 ３３、３４ グランド用端子電極 DESCRIPTION OF SYMBOLS 10 Laminated through capacitor 12 Dielectric element body (capacitor main body) 12B, 12C Side surface 21, 23 Internal electrode (first internal conductor) 22, 24 Internal electrode (second internal conductor) 31, 32 Signal terminal electrode 33, 34 Ground terminal electrode
Claims (3)
なくとも一枚の誘電体シートが挟まれつつこの誘電体シ
ートを複数枚積層してコンデンサ本体を形成し、 第１内部導体に接続される信号用端子電極及び第２内部
導体に接続されるグランド用端子電極が、コンデンサ本
体の側面にそれぞれ配置され、 第２内部導体が、隣り合う分割部分同士で電流が相互に
逆向きに流れる形に、複数に分割されることを特徴とす
る積層貫通型コンデンサ。1. A capacitor body is formed by laminating a plurality of dielectric sheets while at least one dielectric sheet is sandwiched between a first inner conductor and a second inner conductor. A signal terminal electrode to be connected and a ground terminal electrode to be connected to the second internal conductor are respectively arranged on the side surfaces of the capacitor body, and the second internal conductor is arranged such that current flows in opposite directions between adjacent divided portions. A multilayer feedthrough capacitor characterized by being divided into a plurality in a flowing form.
で電流が相互に逆向きに流れる形に、二分割されること
を特徴とする請求項１記載の積層貫通型コンデンサ。2. The multilayer feedthrough capacitor according to claim 1, wherein the second inner conductor is divided into two such that currents flow in opposite directions between adjacent divided portions.
交差する方向に延びるように形成され、信号用端子電極
とグランド用端子電極とがコンデンサ本体の相互に異な
る側面に配置されたことを特徴とする請求項１或いは請
求項２記載の積層貫通型コンデンサ。3. The capacitor according to claim 1, wherein the first internal conductor and the second internal conductor are formed so as to extend in a direction intersecting each other, and the signal terminal electrode and the ground terminal electrode are arranged on mutually different side surfaces of the capacitor body. 3. The multilayer feedthrough capacitor according to claim 1, wherein:
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|---|---|---|---|
| JP2001028486A JP3727542B2 (en) | 2001-02-05 | 2001-02-05 | Multilayer feedthrough capacitor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001028486A JP3727542B2 (en) | 2001-02-05 | 2001-02-05 | Multilayer feedthrough capacitor |
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| Publication Number | Publication Date |
|---|---|
| JP2002231559A true JP2002231559A (en) | 2002-08-16 |
| JP3727542B2 JP3727542B2 (en) | 2005-12-14 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004025673A1 (en) * | 2002-09-10 | 2004-03-25 | Tdk Corporation | Multilayer capacitor |
| US6914767B2 (en) | 2003-03-12 | 2005-07-05 | Tdk Corporation | Multilayer capacitor |
| US6922329B2 (en) | 2003-08-21 | 2005-07-26 | Tdk Corporation | Multilayer capacitor |
-
2001
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004025673A1 (en) * | 2002-09-10 | 2004-03-25 | Tdk Corporation | Multilayer capacitor |
| US7075774B2 (en) | 2002-09-10 | 2006-07-11 | Tdk Corporation | Multilayer capacitor |
| US7196897B2 (en) | 2002-09-10 | 2007-03-27 | Tdk Corporation | Multilayer capacitor |
| US7224569B2 (en) | 2002-09-10 | 2007-05-29 | Tdk Corporation | Multilayer capacitor |
| US7224572B2 (en) | 2002-09-10 | 2007-05-29 | Tdk Corporation | Multilayer capacitor |
| US6914767B2 (en) | 2003-03-12 | 2005-07-05 | Tdk Corporation | Multilayer capacitor |
| US7019958B2 (en) | 2003-03-12 | 2006-03-28 | Tdk Corporation | Multilayer capacitor |
| US7019957B2 (en) | 2003-03-12 | 2006-03-28 | Tdk Corporation | Multilayer capacitor |
| US6922329B2 (en) | 2003-08-21 | 2005-07-26 | Tdk Corporation | Multilayer capacitor |
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| Publication number | Publication date |
|---|---|
| JP3727542B2 (en) | 2005-12-14 |
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