JP2002198496A5 - - Google Patents
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- JP2002198496A5 JP2002198496A5 JP2000394958A JP2000394958A JP2002198496A5 JP 2002198496 A5 JP2002198496 A5 JP 2002198496A5 JP 2000394958 A JP2000394958 A JP 2000394958A JP 2000394958 A JP2000394958 A JP 2000394958A JP 2002198496 A5 JP2002198496 A5 JP 2002198496A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- ferroelectric
- film
- functional thin
- ferroelectric capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010409 thin film Substances 0.000 description 22
- 239000003990 capacitor Substances 0.000 description 21
- 239000010408 film Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 238000001338 self-assembly Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
【特許請求の範囲】
【請求項1】 第1電極、強誘電体膜および第2電極が積層された強誘電体キャパシタの製造方法であって、
少なくとも前記強誘電体膜の材料が堆積される領域に、あらかじめ機能性薄膜が形成される工程を含み、
前記機能性薄膜の形成工程は、前記領域に、化学吸着により物質を自己集積的に堆積する成膜工程を有する、強誘電体キャパシタの製造方法。
【請求項2】 請求項1において、
前記機能性薄膜は、前記強誘電体膜の成膜においてシード層として機能する、強誘電体キャパシタの製造方法。
【請求項3】 請求項1または2において、
前記機能性薄膜は、その表面が前記強誘電体膜の材料に対して親和性を有する、強誘電体キャパシタの製造方法。
【請求項4】 請求項1において、
前記機能性薄膜はシード層の下地層として機能し、該機能性薄膜を形成した後、該機能性薄膜を化学的に活性化してシード層の材料を反応させる工程を有する、強誘電体キャパシタの製造方法。
【請求項5】 請求項1〜4のいずれかにおいて、
前記機能性薄膜は、無機物質からなる、強誘電体キャパシタの製造方法。
【請求項6】 請求項5において、
前記機能性薄膜は、有機物質からなる薄膜を自己集積によって形成した後、これを焼成することにより形成された無機物質からなる、強誘電体キャパシタの製造方法。
【請求項7】 請求項1〜4のいずれかにおいて、
前記機能性薄膜は、有機物質からなる、強誘電体キャパシタの製造方法。
【請求項8】 請求項7において、
前記強誘電体膜は、有機物質からなる、強誘電体キャパシタの製造方法。
【請求項9】 第1電極、機能性薄膜、強誘電体膜および第2電極を含み、
前記機能性薄膜は、少なくとも前記強誘電体膜が形成される領域に配置され、かつ、化学吸着により物質を自己集積的に堆積して形成された自己組織化膜である、強誘電体キャパシタ。
【請求項10】 請求項9において、
前記機能性薄膜は、前記強誘電体膜の成膜においてシード層として機能する、強誘電体キャパシタ。
【請求項11】 請求項9において、
前記機能性薄膜はシード層の下地層として機能し、該機能性薄膜上にシード層が配置された、強誘電体キャパシタ。
【請求項12】 請求項9〜11のいずれかにおいて、
前記機能性薄膜は、無機物質からなる、強誘電体キャパシタ。
【請求項13】 請求項12において、
前記機能性薄膜は、有機物質からなる薄膜を自己集積によって形成した後、これを焼成することにより形成された無機物質からなる、強誘電体キャパシタ。
【請求項14】 請求項9〜11のいずれかにおいて、
前記機能性薄膜は、有機物質からなる、強誘電体キャパシタ。
【請求項15】 請求項14において、
前記強誘電体膜は、有機物質からなる、強誘電体キャパシタ。
【請求項16】 請求項9〜請求項15のいずれかに記載の強誘電体キャパシタを含む、強誘電体メモリ装置。
【請求項17】 請求項16において、
トランジスタ形成領域を構成する基体を含み、該基体上に所定パターンで配置された前記強誘電体キャパシタを有する、蓄積容量型の強誘電体メモリ装置。
【請求項18】 請求項16において、
半導体基板上に形成されたゲート絶縁層に前記キャパシタ構造が接続された、MISトランジスタ型の強誘電体メモリ装置。
【請求項19】 請求項16において、
前記強誘電体キャパシタからなるメモリセルがマトリクス状に配列され、
前記強誘電体キャパシタは、第1信号電極と、該第1信号電極と交差する方向に配列された第2信号電極と、少なくとも前記第1信号電極と前記第2信号電極との交差領域に配置された強誘電体膜と、を含む、強誘電体メモリ装置。
[Claims]
1. A method for manufacturing a ferroelectric capacitor in which a first electrode, a ferroelectric film, and a second electrode are laminated.
At least in the region where the material of the ferroelectric film is deposited, a step of forming a functional thin film in advance is included.
The functional thin film forming step is a method for manufacturing a ferroelectric capacitor, which comprises a film forming step of self-integrating a substance in the region by chemisorption.
2. In claim 1,
The functional thin film is a method for manufacturing a ferroelectric capacitor, which functions as a seed layer in forming a ferroelectric film.
3. In claim 1 or 2,
The functional thin film is a method for producing a ferroelectric capacitor, the surface of which has an affinity for the material of the ferroelectric film.
4. In claim 1,
The functional thin film functions as a base layer of a seed layer, and after forming the functional thin film, the ferroelectric capacitor has a step of chemically activating the functional thin film to react the material of the seed layer. Production method.
5. In any of claims 1 to 4,
The functional thin film is a method for manufacturing a ferroelectric capacitor made of an inorganic substance.
6. In claim 5,
The functional thin film is a method for producing a ferroelectric capacitor, which is made of an inorganic substance formed by forming a thin film made of an organic substance by self-assembly and then firing the thin film.
7. In any of claims 1 to 4,
The functional thin film is a method for manufacturing a ferroelectric capacitor made of an organic substance.
8. In claim 7,
The ferroelectric film is a method for manufacturing a ferroelectric capacitor made of an organic substance.
9. A first electrode, a functional thin film, a ferroelectric film, and a second electrode are included.
A ferroelectric capacitor, wherein the functional thin film is a self-assembled film that is arranged at least in a region where the ferroelectric film is formed and is formed by self-assembling substances by chemisorption.
10. In claim 9,
The functional thin film is a ferroelectric capacitor that functions as a seed layer in the film formation of the ferroelectric film.
11. In claim 9,
The functional thin film functions as a base layer of a seed layer, and a ferroelectric capacitor in which a seed layer is arranged on the functional thin film.
12. In any of claims 9 to 11,
The functional thin film is a ferroelectric capacitor made of an inorganic substance.
13. In claim 12,
The functional thin film is a ferroelectric capacitor made of an inorganic substance formed by forming a thin film made of an organic substance by self-assembly and then firing the thin film.
14. In any of claims 9 to 11,
The functional thin film is a ferroelectric capacitor made of an organic substance.
15. In claim 14,
The ferroelectric film is a ferroelectric capacitor made of an organic substance.
16. A ferroelectric memory device comprising the ferroelectric capacitor according to any one of claims 9 to 15.
17. In claim 16,
A storage capacity type ferroelectric memory device including a substrate constituting a transistor forming region and having the ferroelectric capacitor arranged in a predetermined pattern on the substrate.
18. In claim 16,
A MIS transistor type ferroelectric memory device in which the capacitor structure is connected to a gate insulating layer formed on a semiconductor substrate.
19. In claim 16,
Memory cells composed of the ferroelectric capacitors are arranged in a matrix.
The strong dielectric capacitor is arranged in an intersection region of a first signal electrode, a second signal electrode arranged in a direction intersecting the first signal electrode, and at least the first signal electrode and the second signal electrode. A strong dielectric memory device, including a hard dielectric film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000394958A JP2002198496A (en) | 2000-12-26 | 2000-12-26 | Ferroelectric capacitor, manufacturing method therefor and ferroelectric memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000394958A JP2002198496A (en) | 2000-12-26 | 2000-12-26 | Ferroelectric capacitor, manufacturing method therefor and ferroelectric memory device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006341826A Division JP2007096346A (en) | 2006-12-19 | 2006-12-19 | Ferroelectric capacitor and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002198496A JP2002198496A (en) | 2002-07-12 |
JP2002198496A5 true JP2002198496A5 (en) | 2006-10-19 |
Family
ID=18860505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000394958A Withdrawn JP2002198496A (en) | 2000-12-26 | 2000-12-26 | Ferroelectric capacitor, manufacturing method therefor and ferroelectric memory device |
Country Status (1)
Country | Link |
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JP (1) | JP2002198496A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7031138B2 (en) * | 2002-12-09 | 2006-04-18 | Infineon Technologies Ag | Ferroelectric capacitor and process for its manufacture |
JP2005327919A (en) * | 2004-05-14 | 2005-11-24 | Seiko Epson Corp | Method for manufacturing device and device, electrooptic element and printer |
US8030643B2 (en) | 2005-03-28 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and manufacturing method the same |
JP5008323B2 (en) * | 2005-03-28 | 2012-08-22 | 株式会社半導体エネルギー研究所 | Memory device |
KR100751882B1 (en) | 2006-01-06 | 2007-08-23 | 박철민 | Method of modifying the surface property of PFRAM's bottom electrode and the PFRAM made by the method |
JP4973502B2 (en) | 2006-01-26 | 2012-07-11 | 富士通セミコンダクター株式会社 | Ferroelectric memory device and method for manufacturing the same, and method for manufacturing a semiconductor device |
WO2013018842A1 (en) * | 2011-08-02 | 2013-02-07 | 日本電気株式会社 | Semiconductor device and method for manufacturing same |
KR102433290B1 (en) * | 2018-02-08 | 2022-08-17 | 에스케이하이닉스 주식회사 | Method of Fabricating Ferroelectric Device |
-
2000
- 2000-12-26 JP JP2000394958A patent/JP2002198496A/en not_active Withdrawn
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