JP2002190661A - Package of electronic component and its repair method - Google Patents
Package of electronic component and its repair methodInfo
- Publication number
- JP2002190661A JP2002190661A JP2001209133A JP2001209133A JP2002190661A JP 2002190661 A JP2002190661 A JP 2002190661A JP 2001209133 A JP2001209133 A JP 2001209133A JP 2001209133 A JP2001209133 A JP 2001209133A JP 2002190661 A JP2002190661 A JP 2002190661A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- intermediate layer
- circuit board
- electronic component
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品の実装分
野において、導電性接着剤を介して電子部品と回路基板
とを接合した電子部品の実装体に関するものであって、
前記部品のリペアが改善された電子部品の実装体および
実装体のリペアー方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting part of an electronic component in which the electronic component and a circuit board are joined via a conductive adhesive in the field of mounting the electronic component.
The present invention relates to a package of an electronic component in which the component repair is improved and a method of repairing the package.
【０００２】[0002]
【従来の技術】最近の環境問題への認識の高まりから、
エレクトロニクス実装の分野では、はんだ合金中の鉛に
対する規制が行われようとしており、電子部品の実装に
鉛を用いない接合技術の確立が急務となっている。鉛フ
リー実装技術としては、主として鉛フリーはんだおよび
導電性接着剤が挙げられるが、接合部の柔軟性、実装温
度の低温化等のメリットが期待される導電性接着剤は、
より注目されている。2. Description of the Related Art Recently, awareness of environmental issues has increased,
In the field of electronics mounting, regulations on lead in solder alloys are about to be enforced, and there is an urgent need to establish a joining technology that does not use lead for mounting electronic components. Lead-free mounting technology mainly includes lead-free solder and conductive adhesives, but conductive adhesives that are expected to have advantages such as flexibility of joints and lower mounting temperature are
More attention.
【０００３】従来の導電性接着剤は一般的に、樹脂系接
着成分中に導電フィラを分散させたものであり、導電性
接着剤を介在して電子部品の接続端子と回路基板の接続
端子を接続した後に樹脂を硬化させ、導電フィラ同士の
接触により接続部分の導通を確保するものである。従っ
て、接続部分が樹脂で接着されているため、熱や外力に
よる変形に対して柔軟に対応でき、また接続部分が合金
であるはんだと比較して、接続部分に亀裂が発生しにく
いというメリットを有していることから、はんだの代替
材料として期待されている。Conventional conductive adhesives generally have a conductive filler dispersed in a resin-based adhesive component, and a connection terminal of an electronic component and a connection terminal of a circuit board are interposed through the conductive adhesive. After the connection, the resin is cured, and the conduction of the connection portion is ensured by the contact between the conductive fillers. Therefore, since the connection portion is bonded with resin, it can flexibly respond to deformation due to heat or external force, and has a merit that cracks are less likely to occur in the connection portion compared to solder in which the connection portion is an alloy. Therefore, it is expected as a substitute material for solder.
【０００４】しかしながら従来の電子部品の実装体で
は、導電性接着剤が電子部品の製造工程においていった
ん硬化してしまうと電子部品の除去、すなわちリペアが
困難であって、実際のアプリケーションとして用いるに
は支障を来す場合があった。具体的には前記部品の接続
強度を得るために導電性接着剤の樹脂バインダーには、
熱硬化性エポキシ樹脂バインダーが多用されているが、
この場合、電子部品の除去は前記部品を捻りとる等強制
的手段であって、部品は除去されても導電性接着剤が基
板電極上に残存する。あるいは、基板電極が基板母材か
ら剥離する、あるいは隣接の部品にダメージを与えるな
どの課題がある。However, in a conventional electronic component package, once the conductive adhesive is hardened in the process of manufacturing the electronic component, it is difficult to remove the electronic component, that is, to repair the electronic component. In some cases, it could cause trouble. Specifically, the resin binder of the conductive adhesive in order to obtain the connection strength of the component,
Although thermosetting epoxy resin binders are often used,
In this case, the removal of the electronic component is a forced means such as twisting the component, and the conductive adhesive remains on the substrate electrode even if the component is removed. Alternatively, there is a problem that the substrate electrode peels off from the substrate base material or damages adjacent components.
【０００５】また、最近ではリペア可能な導電性接着剤
として熱可塑性バインダー樹脂の導電性接着剤が一部市
販されつつある。しかしながらこのような導電性接着剤
は接続強度が十分ではなく、電子部品の実装用材料とし
ては十分とは言い難い。また熱可塑性と熱硬化性のバイ
ンダー樹脂を混合したものは前記熱可塑性のバインダー
樹脂のみの導電性接着剤と比較すると接続強度は改善さ
れるものの、バインダー樹脂が基板電極表面に塊として
残存するため、電子部品を除去した後の交換用電子部品
の搭載では作業が煩雑となってしまう。[0005] Recently, a conductive adhesive of a thermoplastic binder resin has been partly marketed as a repairable conductive adhesive. However, such a conductive adhesive does not have sufficient connection strength, and cannot be said to be sufficient as a mounting material for electronic components. In addition, although a mixture of a thermoplastic and a thermosetting binder resin has improved connection strength as compared with the conductive adhesive containing only the thermoplastic binder resin, the binder resin remains as a lump on the substrate electrode surface. In addition, when the replacement electronic component is mounted after the electronic component is removed, the operation becomes complicated.
【０００６】[0006]
【発明が解決しようとする課題】以上説明したように従
来の導電性接着剤を介した電子部品と回路基板との実装
体では、良好なリペア性の実現と、電子部品の接続強度
の確保との両立は困難であった。As described above, in the conventional mounting body of the electronic component and the circuit board via the conductive adhesive, it is possible to achieve good repairability and secure the connection strength of the electronic component. Was difficult to achieve.
【０００７】本発明は、前記従来の問題を解決するた
め、はんだの代わりに導電性接着剤を介してなる電子部
品と回路基板との実装体において、高いリペア性を実現
し、さらには電子部品と回路基板との接続強度も向上し
た電子部品の実装体および実装体のリペアー方法を提供
することを目的とする。In order to solve the above-mentioned conventional problems, the present invention realizes a high repairability in a mounted body of an electronic component and a circuit board via a conductive adhesive instead of solder. It is an object of the present invention to provide a mounted body of an electronic component and a method of repairing the mounted body in which connection strength between the electronic component and a circuit board is improved.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
本発明の第１番目の電子部品の実装体は、導電性接着剤
を介して接続された電子部品と回路基板との実装体であ
って、導電性接着剤と回路基板電極との接合界面におい
て、１００℃以上３００℃以下の軟化温度の熱可塑性絶
縁性接着剤からなる中間層を前記接着剤と電極との間に
介在させ、かつ前記中間層中には部分的に前記導電性接
着剤中の導電性フィラーが存在し、導電性接着剤と回路
基板電極とは電気的に導通していることを特徴とする。In order to achieve the above object, a first electronic component mounted body of the present invention is a mounted body of an electronic component and a circuit board connected via a conductive adhesive. In the bonding interface between the conductive adhesive and the circuit board electrode, an intermediate layer made of a thermoplastic insulating adhesive having a softening temperature of 100 ° C. or more and 300 ° C. or less is interposed between the adhesive and the electrode, and The conductive filler in the conductive adhesive partially exists in the intermediate layer, and the conductive adhesive and the circuit board electrode are electrically connected.
【０００９】次に本発明の第２番目の電子部品の実装体
は、導電性接着剤を介して接続された電子部品と回路基
板との実装体であって、導電性接着剤と回路基板電極と
の接合界面において、１００℃以上３００℃以下の軟化
温度の熱可塑性絶縁性接着剤からなりかつ導電性発泡フ
ィラーを含有した中間層を前記接着剤と電極との間に介
在させ、導電性接着剤と回路基板電極とは前記導電性発
泡フィラーにより電気的に導通していることを特徴とす
る。Next, a second electronic component package of the present invention is a package of an electronic component and a circuit board connected via a conductive adhesive, wherein the conductive adhesive and the circuit board electrode are mounted. At an interface between the adhesive and the electrode, an intermediate layer made of a thermoplastic insulating adhesive having a softening temperature of 100 ° C. or more and 300 ° C. or less and containing a conductive foam filler is interposed between the adhesive and the electrode. The agent and the circuit board electrode are electrically connected by the conductive foam filler.
【００１０】次に本発明の実装体のリペアー方法は、前
記電子部品と回路基板との実装体を用い、リペアを必要
とした時に、該当する電子部品の前記中間層部分を加熱
し、前記熱可塑性絶縁性接着剤の融点以上に昇温して溶
融させ、この状態で電子部品を取り外すことを特徴とす
る。Next, a method of repairing a mounted body of the present invention uses a mounted body of the electronic component and a circuit board, and when the repair is required, heats the intermediate layer portion of the corresponding electronic component, It is characterized in that the temperature is raised above the melting point of the plastic insulating adhesive to be melted, and the electronic component is removed in this state.
【００１１】[0011]
【発明の実施の形態】本発明は、導電性接着剤と回路基
板の電極との間に、１００〜３００℃の範囲の特定の軟
化温度の絶縁性接着剤からなる中間層を形成した電子部
品の実装体およびこの実装体のリペア方法である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component having an intermediate layer formed of an insulating adhesive having a specific softening temperature in the range of 100 to 300.degree. C. between a conductive adhesive and an electrode of a circuit board. And a method for repairing this package.
【００１２】前記特定の軟化温度の中間層を導電性接着
剤と回路基板電極との間に介在させた電子部品の実装体
は、リペアを必要とした時に該当の電子部品部分をホッ
トエア、赤外線などのスポット加熱（リペアを必要とす
る部分のみの加熱）によって加熱し前記融点以上に昇温
すると、前記中間層が溶融する。この状態で電子部品を
把持して容易に取り外すことができる。[0012] In the electronic component mounting body in which the intermediate layer having the specific softening temperature is interposed between the conductive adhesive and the circuit board electrode, when the repair is required, the corresponding electronic component portion is hot air, infrared ray, or the like. When heating is performed by spot heating (heating only a portion requiring repair) and the temperature is raised to the melting point or more, the intermediate layer is melted. In this state, the electronic component can be easily removed by grasping it.
【００１３】本発明においては、中間層の形成面積は、
導電性接着剤の形成面積以上であることが好ましい。さ
らに中間層の形成面積は、導電性接着剤の形成面積の１
倍以上２倍以下が好ましく、とくに１．１倍以上１．５
倍以下が好ましい。In the present invention, the formation area of the intermediate layer is:
It is preferable that the area is equal to or larger than the formation area of the conductive adhesive. Furthermore, the formation area of the intermediate layer is one of the formation area of the conductive adhesive.
It is preferably at least 1.2 times and at most 1.5 times
It is preferably at most twice.
【００１４】本発明の前記中間層の厚みは、０．０５μ
ｍ以上、１０μｍ以下が好ましい。この範囲内であれ
ば、電子部品を実装させたとき、導電性接着剤に含有さ
れる金属製導電性フィラーから圧力を受けて中間層は部
分的に破壊され、導電性接着剤と回路基板電極は電気的
に導通する。前記中間層の厚みが０．０５μｍ未満では
前記中間層を接続部の全面に均一に形成することが困難
となる。一方、１０μｍを越えると、材料コスト、およ
び形成時間の面でのプロセスコストが高くなる傾向にあ
る。そのうえ、中間層の破壊がされにくくなり、導電性
接着剤と回路基板電極の電気的導通が低下する傾向とな
る。The thickness of the intermediate layer of the present invention is 0.05 μm.
m or more and 10 μm or less is preferable. Within this range, when the electronic component is mounted, the intermediate layer is partially destroyed by pressure from the metal conductive filler contained in the conductive adhesive, and the conductive adhesive and the circuit board electrode Are electrically conductive. If the thickness of the intermediate layer is less than 0.05 μm, it is difficult to form the intermediate layer uniformly on the entire surface of the connection. On the other hand, if it exceeds 10 μm, the process cost in terms of material cost and formation time tends to be high. In addition, the intermediate layer is less likely to be broken, and the electrical conduction between the conductive adhesive and the circuit board electrode tends to decrease.
【００１５】このようにして除去された回路基板の電極
部分に再度導電性接着剤を形成し、代替の電子部品を搭
載し、導電性接着剤を硬化することによって良好な電子
部品の実装体を得ることが可能となる。[0015] A conductive adhesive is formed again on the electrode portion of the circuit board removed in this way, a substitute electronic component is mounted, and the conductive adhesive is cured to obtain a good electronic component package. It is possible to obtain.
【００１６】本発明の前記特定軟化温度の熱可塑性絶縁
性接着剤とは、導電性接着剤の硬化温度よりも高い融点
であって、かつ回路基板、およびリペア対象電子部品の
周辺に実装された電子部品にダメージを与えにくい程度
の温度の融点を持つ物質が好ましい。たとえば熱可塑性
エポキシ樹脂、アクリル樹脂、ビニル樹脂などがあげら
れる。なお、一般的にポリマーの軟化温度は融点よりわ
ずかに低い温度（具体的には数度の範囲内）であるので
軟化温度は融点と同じように扱うことができる。The thermoplastic insulating adhesive having the specific softening temperature of the present invention has a melting point higher than the curing temperature of the conductive adhesive, and is mounted around the circuit board and the electronic component to be repaired. A substance having a melting point at a temperature that does not easily damage electronic components is preferable. For example, thermoplastic epoxy resin, acrylic resin, vinyl resin and the like can be mentioned. In general, the softening temperature of a polymer is slightly lower than the melting point (specifically, within a range of several degrees), so that the softening temperature can be treated in the same manner as the melting point.
【００１７】本発明では、前記絶縁性接着剤中に特定温
度で発泡する導電性発泡性フィラーを混在させてもよ
い。導電性発泡性フィラーを混在させた絶縁性接着剤
は、この発泡性フィラーの発泡温度以上に加熱すること
によって絶縁性接着剤が膨張する。このような絶縁性接
着剤の層を導電性接着剤と回路基板の電極との間に介在
させた本発明の実装体は、前記のように発泡温度維持用
に加熱することによって絶縁性接着剤層が膨張し、容易
にリペアができる。前記導電性発泡性フィラーは各種の
ものが使用できるが、発泡温度として好ましいものは、
導電性接着剤の硬化、硬化した導電性接着剤の軟化温度
以上であって、リペア対象以外の部品、および回路基板
にダメージを与えにくい程度の温度以下の物質である。
前記導電性発泡フィラーの含有量は、２vol.%以上５０v
ol.%以下の範囲が好ましい。さらには５vol.%以上２０v
ol.%以下の範囲が好ましい。２vol.%未満では前記導電
性発泡フィラーを添加する効果が顕著には発揮できず、
また５０vol.%を越えると接着強度が低下して実用上好
ましくない。また、前記導電性発泡フィラーの平均粒子
直径は、１μｍ以上１０μｍ以下の範囲が好ましい。導
電性発泡性フィラーは、発泡性樹脂の表面に金などの金
属が被覆されており、それ自体でも導電性を有する。In the present invention, a conductive foaming filler which foams at a specific temperature may be mixed in the insulating adhesive. The insulating adhesive mixed with the conductive foamable filler expands when heated to a temperature equal to or higher than the foaming temperature of the foamable filler. The mounting body of the present invention in which such a layer of the insulating adhesive is interposed between the conductive adhesive and the electrode of the circuit board is heated as described above to maintain the foaming temperature. The layer expands and can be easily repaired. Various types of conductive foaming fillers can be used, but preferred as the foaming temperature are:
The substance is a substance which has a temperature higher than the curing temperature of the conductive adhesive and the softening temperature of the cured conductive adhesive, and lower than the temperature which does not easily damage components other than the repair target and the circuit board.
The content of the conductive foam filler is 2 vol.% Or more and 50 v
ol.% or less is preferable. Furthermore, more than 5vol.% 20v
ol.% or less is preferable. If less than 2 vol.%, The effect of adding the conductive foam filler cannot be remarkably exhibited,
On the other hand, if it exceeds 50 vol.%, The adhesive strength is lowered, which is not preferable for practical use. The average particle diameter of the conductive foamed filler is preferably in the range of 1 μm to 10 μm. The conductive foamable filler is formed by covering a surface of a foamable resin with a metal such as gold and has conductivity by itself.
【００１８】また、中間層の厚みは、導電性接着剤によ
る電子部品と回路基板の電極との電気接続に実用上、悪
影響を与えない程度の厚みであって、たとえば導電性接
着剤に含有される導電性フィラーの大きさ程度以下が好
ましい。特には０．０５μｍ以上１０μｍ以下が好まし
い。この厚みよりも薄い場合、導電性接着剤のバインダ
ー樹脂成分が回路基板の電極と直接接着し、良好なリペ
アが実現しにくくなる。一方、前記厚みよりも厚い場合
には、導電性フィラーと回路基板の電極とが良好な接触
をしにくくなり、接続抵抗が大きくなる。The thickness of the intermediate layer is such that it does not adversely affect the electrical connection between the electronic component and the electrodes of the circuit board by the conductive adhesive, and is included in the conductive adhesive, for example. The size is preferably about the size of the conductive filler or less. In particular, the thickness is preferably 0.05 μm or more and 10 μm or less. If the thickness is smaller than this thickness, the binder resin component of the conductive adhesive directly adheres to the electrodes of the circuit board, and it is difficult to realize a good repair. On the other hand, when the thickness is larger than the above-mentioned thickness, it is difficult to make good contact between the conductive filler and the electrode of the circuit board, and the connection resistance increases.
【００１９】また、前記絶縁性接着性樹脂は、電子部品
と回路基板の電極との接合部分において、その形成面積
が導電性接着剤の形成面積よりも大きくした電子部品の
実装体は良好なリペアを実現しやすい。The insulating adhesive resin may have a good repair area at a joint portion between the electronic component and the electrode of the circuit board, and a mounting area of the electronic component is larger than that of the conductive adhesive. Easy to realize.
【００２０】以下、図面を用いて説明する。図１は電子
部品６の電極５と回路基板１の電極２とが導電性接着剤
４と中間層（絶縁性接着性樹脂）３を介して接続された
実装体の構造概略を示す。導電性接着剤４の形成面積が
中間層（絶縁性接着剤）３の形成面積より大きくなり、
回路基板１、または電極２と直接接続した場合は、導電
性接着剤４にリペア性が乏しいため、本発明の特徴であ
る中間層（絶縁性接着性樹脂層）３の作用が低減されて
しまう。また、リペアの際には導電性接着剤４のバイン
ダー樹脂成分が回路基板１または電極２に残存してしま
う。このため、本発明では導電性接着剤４の形成面積と
中間層（絶縁性接着性樹脂）３との形成面積を上記のよ
うにするのが好ましい。すなわち、端子電極５を有する
チップ抵抗６を、本発明のリペアに好適な導電性媒体の
中間層３を形成した回路基板１の電極２上に導電性接着
剤４を介して電気的に接続した状態を示している。Hereinafter, description will be made with reference to the drawings. FIG. 1 schematically shows the structure of a mounted body in which an electrode 5 of an electronic component 6 and an electrode 2 of a circuit board 1 are connected via a conductive adhesive 4 and an intermediate layer (insulating adhesive resin) 3. The formation area of the conductive adhesive 4 becomes larger than the formation area of the intermediate layer (insulating adhesive) 3,
When directly connected to the circuit board 1 or the electrode 2, the conductive adhesive 4 has poor repairability, so that the action of the intermediate layer (insulating adhesive resin layer) 3 which is a feature of the present invention is reduced. . Further, at the time of repair, the binder resin component of the conductive adhesive 4 remains on the circuit board 1 or the electrode 2. Therefore, in the present invention, it is preferable that the formation area of the conductive adhesive 4 and the formation area of the intermediate layer (insulating adhesive resin) 3 be as described above. That is, the chip resistor 6 having the terminal electrode 5 was electrically connected via the conductive adhesive 4 to the electrode 2 of the circuit board 1 on which the intermediate layer 3 of the conductive medium suitable for the repair of the present invention was formed. The state is shown.
【００２１】図６Ａ、図６Ｂは前記の電気的接続状態を
さらに詳しく説明する模式的断面図である。図６Ａにお
いて、回路基板の表面に形成されている電極２と、電子
部品の電極（図示せず）との間には導電性接着剤４と中
間層（絶縁性接着性樹脂）３が介在して接続され実装体
を形成している。図６Ａの電気的接続部を拡大すると図
６Ｂのようになり、中間層３において導電性接着剤４中
の導電性フィラー７が前記中間層３を貫通して基板電極
２と当接することで、電気的導通がなされる。このプロ
セスを説明すると、基板電極２の表面に中間層３を形成
後、導電性接着剤４を印刷形成し、その後、電子部品を
搭載するときに電子部品のマウンターで加圧されるた
め、導電性接着剤４中の導電性フィラー７が前記中間層
３に食い込み、その結果、基板電極２と導電性フィラー
７が当接する。この電気的導通を良好にするために前記
中間層の厚みと導電性フィラーの直径との関係を適正に
選択することが好ましい。FIGS. 6A and 6B are schematic sectional views for explaining the above-mentioned electrical connection state in more detail. In FIG. 6A, a conductive adhesive 4 and an intermediate layer (insulating adhesive resin) 3 are interposed between an electrode 2 formed on the surface of the circuit board and an electrode (not shown) of the electronic component. Connected to form a package. 6B is an enlarged view of the electrical connection portion in FIG. 6A. In the intermediate layer 3, the conductive filler 7 in the conductive adhesive 4 penetrates through the intermediate layer 3 and contacts the substrate electrode 2. Electrical continuity is established. This process will be described. After the intermediate layer 3 is formed on the surface of the substrate electrode 2, a conductive adhesive 4 is formed by printing, and then the electronic component is pressed by a mounter for mounting the electronic component. The conductive filler 7 in the conductive adhesive 4 bites into the intermediate layer 3, and as a result, the substrate electrode 2 and the conductive filler 7 come into contact with each other. In order to improve the electrical conduction, it is preferable to appropriately select the relationship between the thickness of the intermediate layer and the diameter of the conductive filler.
【００２２】また、本発明は前記のような特定軟化温度
の絶縁性接着性樹脂を回路基板の電極表面、および／ま
たは回路基板の表面に形成してもよい。このような構造
の回路基板は、前記のような本発明のリペア方法を実現
するのには好適な回路基板である。In the present invention, the insulating adhesive resin having the specific softening temperature as described above may be formed on the electrode surface of the circuit board and / or the surface of the circuit board. The circuit board having such a structure is a suitable circuit board for realizing the repair method of the present invention as described above.
【００２３】本発明の電子部品の実装体によれば、従来
の導電性接着剤を用いた電子部品の実装技術において課
題となつていたリペアが解決でき、はんだ接続を用いな
くても従来のはんだ接続と同程度のリペアが実現でき
る。According to the electronic component mounted body of the present invention, the repair which has been a problem in the electronic component mounting technology using the conventional conductive adhesive can be solved, and the conventional solder can be used without using the solder connection. The same level of repair as connection can be realized.
【００２４】また、本発明は特定軟化点の中間層を電子
部品と回路基板との接合界面に形成したものであって、
導電性接着剤との接続において従来の課題であった電子
部品のリペア性が実用上、解決可能となるものである。
さらに、本発明においては電子部品および電子部品実装
体の鉛フリー化も実現でき、近年、注目を集めている環
境問題に対しても有用である。Further, the present invention provides an intermediate layer having a specific softening point formed at a bonding interface between an electronic component and a circuit board,
The repairability of an electronic component, which has been a conventional problem in connection with a conductive adhesive, can be practically solved.
Further, in the present invention, it is possible to realize lead-free electronic components and electronic component mounted bodies, which is useful for environmental problems that have recently been receiving attention.
【００２５】[0025]
【実施例】下記の実施例における評価方法は、下記のと
おりである。The evaluation method in the following examples is as follows.
【００２６】チップ抵抗６の上部５ｃｍから温度２２０
℃の温風ジェットをチップ抵抗に吹き付けた状態で、チ
ップ抵抗をロードセルに直結したペンチ形状のジグによ
って挟み込み、直上に引き上げ、チップ抵抗の除去時強
度と、除去できた場合の基板電極の表面状態を観察して
評価した。Temperature 220 from the upper 5 cm of chip resistor 6
With the hot air jet at ℃ sprayed on the chip resistor, the chip resistor is sandwiched by a pliers-shaped jig directly connected to the load cell, pulled up directly, and the strength when removing the chip resistor, and the surface condition of the substrate electrode when it can be removed Was observed and evaluated.
【００２７】（実施例１）図２は図１に示した本発明の
上記基本構成において、回路基板に、導電性接着剤４を
用いてチップ抵抗（図示せず）を接続した接続部分の概
略断面図である。すなわち、回路基板の電極２表面に軟
化点：１５０℃の熱可塑性絶縁性接着剤の中間層３を形
成した。中間層３は、アクリル樹脂（東洋紡社製、アク
リル系粘着剤）をアルコール溶剤（エタノール）に、樹
脂１０wt％−エタノール９０wt％の割合で溶解した溶液
をスプレーコーティングで形成した。乾燥後の厚みは表
１に示すとおりである。中間層形成面積は７．６ｍｍ2
（２．０ｍｍ×３．８ｍｍ）、導電性接着剤形成面積は
６．１２ｍｍ2（１．８ｍｍ×３．４ｍｍ）であった。(Embodiment 1) FIG. 2 is a schematic view showing a connection portion in which a chip resistor (not shown) is connected to a circuit board by using a conductive adhesive 4 in the basic structure of the present invention shown in FIG. It is sectional drawing. That is, the intermediate layer 3 of the thermoplastic insulating adhesive having a softening point of 150 ° C. was formed on the surface of the electrode 2 of the circuit board. The intermediate layer 3 was formed by spray coating a solution in which an acrylic resin (manufactured by Toyobo Co., acrylic adhesive) was dissolved in an alcohol solvent (ethanol) at a ratio of 10 wt% of the resin to 90 wt% of ethanol. The thickness after drying is as shown in Table 1. The intermediate layer formation area is 7.6 mm 2
(2.0mm × 3.8mm), conductive adhesive forming area was 6.12mm 2 (1.8mm × 3.4mm).
【００２８】導電性接着剤４は、導電フィラとして銀を
８０vol.％含む熱硬化性エポキシ樹脂系導電性接着剤を
用いた。回路基板の母材は、ガラスエポキシ基板を用い
た。As the conductive adhesive 4, a thermosetting epoxy resin-based conductive adhesive containing 80 vol.% Of silver as a conductive filler was used. A glass epoxy substrate was used as a base material of the circuit board.
【００２９】図２に示すように、準備したチップ抵抗を
導電性接着剤４を用いて回路基板１上に実装し、オーブ
ン中で１５０℃、１時間で硬化した。これらの実装体に
ついて中間層３の仕様を変えて、実装体のリペア性につ
いて評価した。As shown in FIG. 2, the prepared chip resistors were mounted on the circuit board 1 using the conductive adhesive 4 and cured in an oven at 150 ° C. for 1 hour. With respect to these mounted bodies, the repairability of the mounted bodies was evaluated by changing the specification of the intermediate layer 3.
【００３０】また参考例１として、中間層３を形成しな
い実装体も同様に作製し、そのリペア性を評価した。以
上の結果を表１に示す。Further, as Reference Example 1, a package without the intermediate layer 3 was prepared in the same manner, and its repairability was evaluated. Table 1 shows the above results.
【００３１】[0031]
【表１】 [Table 1]
【００３２】表１に示すように、本発明の実施例では良
好なリペアが可能となった。As shown in Table 1, in the embodiment of the present invention, good repair was possible.
【００３３】（実施例２）図３は、図１に示した本発明
の上記基本構成において、回路基板の電極２表面及び回
路基板１表面に、まずはんだメッキを厚み0.5μmで形成
し、その表面に中間層８として、実施例１と同様のアク
リル樹脂（軟化点１５０℃）をバインダー成分としたア
ルコール溶剤をスプレーコーティングで乾燥後の厚み0.
5μmで形成した。中間層８の形成面積は７．６ｍｍ
2（２．０ｍｍ×３．８ｍｍ）、導電性接着剤形成面積
は６．１２ｍｍ2（１．８ｍｍ×３．４ｍｍ）であっ
た。(Embodiment 2) FIG. 3 shows that, in the basic structure of the present invention shown in FIG. 1, solder plating is first formed to a thickness of 0.5 μm on the surface of the electrode 2 of the circuit board and the surface of the circuit board 1. As an intermediate layer 8 on the surface, an alcohol solvent having the same acrylic resin (softening point: 150 ° C.) as a binder component as in Example 1 was dried by spray coating with a thickness of 0.5.
Formed at 5 μm. The formation area of the mid layer 8 is 7.6 mm.
2 (2.0 mm × 3.8 mm) and the conductive adhesive forming area was 6.12 mm 2 (1.8 mm × 3.4 mm).
【００３４】次に、回路基板に導電性接着剤４と補強用
の電気絶縁性接着剤９とを用いてチップ抵抗６を接続し
た。導電性接着剤は電気的接続と接着の作用を発現し、
また絶縁性接着剤９は前記接着力を補強する作用を発現
する。電気絶縁性接着剤９はエポキシ系接着剤（EMERSO
N & CUMING社製、Amicon C-990J ＃330）を用いた。Next, the chip resistor 6 was connected to the circuit board by using the conductive adhesive 4 and the reinforcing electric insulating adhesive 9. The conductive adhesive expresses the action of electrical connection and adhesion,
The insulating adhesive 9 has a function of reinforcing the adhesive force. The electrical insulating adhesive 9 is an epoxy adhesive (EMERSO)
Amicon C-990J # 330 manufactured by N & CUMING) was used.
【００３５】導電性接着剤４は、上記実施例１と同じも
のを用いた。図３に示すように準備したチップ抵抗６を
導電性接着剤４を用いて回路基板１上に実装し、オーブ
ン中で１５０℃、１時間で硬化した。この実装体につい
てリペア性について評価した。The conductive adhesive 4 used was the same as that used in the first embodiment. The chip resistor 6 prepared as shown in FIG. 3 was mounted on the circuit board 1 using the conductive adhesive 4 and cured in an oven at 150 ° C. for 1 hour. This package was evaluated for repairability.
【００３６】また参考例２として、中間層３としてはん
だメッキを厚み0.5μmで形成し、中間層形成面積＜導電
性接着剤形成面積とした。中間層形成面積は７．６ｍｍ
2（２．０ｍｍ×３．８ｍｍ）、導電性接着剤形成面積
は９．６６ｍｍ2（２．３ｍｍ×４．２ｍｍ）であっ
た。その結果を表２に示す。As Reference Example 2, solder plating was formed as the intermediate layer 3 to a thickness of 0.5 μm, and the area of the intermediate layer was smaller than the area of the conductive adhesive. The intermediate layer formation area is 7.6 mm
2 (2.0 mm × 3.8 mm), and the conductive adhesive forming area was 9.66 mm 2 (2.3 mm × 4.2 mm). Table 2 shows the results.
【００３７】[0037]
【表２】 [Table 2]
【００３８】表２に示すように、本発明の実施例は良好
なリペアとともに、通常時、すなわち、実装基板として
完成した形態での部品の接続強度が大幅に向上すること
が可能となった。As shown in Table 2, in the embodiment of the present invention, it is possible to greatly improve the connection strength of components at the time of normal operation, that is, in a completed form as a mounting board, together with good repair.
【００３９】（実施例３）図４は、図１に示した本発明
の上記基本構成において、回路基板の電極２表面に導電
性発泡性フィラーを含有した特定融点の熱可塑性絶縁性
接着剤からなる中間層１０としては、発泡性フィラーと
して松本油脂製薬（株）製のＦ−８０ＶＳ（粒子径：６
〜１０μｍ）を用いて、その表面に無電解メッキによっ
て金皮膜を約０．０５μｍ形成して導電性を付与し、こ
のフィラー（配合量：１５vol.%）を含有させた実施例
１と同様のアクリル樹脂（固形分配合量：１０wt%）を
アルコール溶剤に溶かした溶液をスプレーコーティング
で形成した回路基板に、導電性接着剤４を用いてチップ
抵抗を接続した接続部分の概略断面図である。(Embodiment 3) FIG. 4 is a cross-sectional view of the above-described basic structure of the present invention shown in FIG. 1 using a thermoplastic insulating adhesive having a specific melting point containing a conductive foaming filler on the surface of the electrode 2 of the circuit board. The intermediate layer 10 is made of Matsumoto Yushi Pharmaceutical Co., Ltd. F-80VS (particle diameter: 6) as a foaming filler.
A gold film was formed on the surface by electroless plating to a thickness of about 0.05 μm to impart electrical conductivity, and the filler (compounding amount: 15 vol.%) Was used. FIG. 2 is a schematic cross-sectional view of a connection portion in which a chip resistor is connected using a conductive adhesive 4 to a circuit board formed by spray coating a solution in which an acrylic resin (solid content: 10 wt%) is dissolved in an alcohol solvent.
【００４０】導電性接着剤４は上記実施例１と同じもの
を用いた。図５に示すように、準備したチップ抵抗６を
導電性接着剤４を用いて回路基板１上に実装し、オーブ
ン中で１５０℃、１時間で硬化した。この実装体につい
てリペア性について評価した。The same conductive adhesive 4 as used in Example 1 was used. As shown in FIG. 5, the prepared chip resistor 6 was mounted on the circuit board 1 using the conductive adhesive 4 and cured in an oven at 150 ° C. for 1 hour. This package was evaluated for repairability.
【００４１】また参考例３として、実施例１の中間層３
を比較のために用いた。評価方法については、上記実施
例１の評価内容に加えて、本発明で期待される接続抵抗
の低減効果を示す。評価サンプルの接続抵抗も測定し
た。その結果を表３に示す。As Reference Example 3, the intermediate layer 3 of Example 1 was used.
Was used for comparison. The evaluation method shows the effect of reducing the connection resistance expected in the present invention in addition to the evaluation contents of the first embodiment. The connection resistance of the evaluation sample was also measured. Table 3 shows the results.
【００４２】[0042]
【表３】 [Table 3]
【００４３】表３に示すように、本発明の実施例は良好
なリペアとともに、通常時、すなわち、実装基板として
完成した形態での部品の接続抵抗の低減が可能となっ
た。As shown in Table 3, in the embodiment of the present invention, it was possible to reduce the connection resistance of the components in the normal state, that is, in the completed form as the mounting board, in addition to the excellent repair.
【００４４】本発明の実施例において、電子部品として
チップ抵抗の場合を説明したが、半導体パッケージ、お
よびコネクターなど一般的に電子部品として用いられて
いるものであれば、その種類は限定されない。In the embodiments of the present invention, the case where a chip resistor is used as an electronic component has been described. However, the type is not limited as long as it is generally used as an electronic component such as a semiconductor package and a connector.
【００４５】また、以上記した実施例では回路基板電極
の表面に中間層を形成したものに関して説明したが、本
発明では電子部品の表面に前記中間層を形成しても良
い。また、異方性導電フィルム（ＡＣＦ）の表面に前記
中間層を形成して、電子部品の接続に用いても良い。In the embodiments described above, the description has been given of the case where the intermediate layer is formed on the surface of the circuit board electrode. However, in the present invention, the intermediate layer may be formed on the surface of the electronic component. Further, the intermediate layer may be formed on the surface of an anisotropic conductive film (ACF) and used for connecting electronic components.
【００４６】[0046]
【発明の効果】以上のように、本発明は特定融点の中間
層を電子部品と回路基板との接合界面に形成したもので
あって、導電性接着剤との接続において従来の課題であ
った電子部品のリペア性が実用上、解決可能となるもの
である。As described above, the present invention has an intermediate layer having a specific melting point formed at the joint interface between an electronic component and a circuit board, and has been a conventional problem in connection with a conductive adhesive. The repairability of electronic components can be practically solved.
【００４７】さらに、本発明においては電子部品および
電子部品実装体の鉛フリー化も実現でき、近年、注目を
集めている環境問題に対しても有用である。Further, according to the present invention, it is possible to realize lead-free electronic components and electronic component mounted bodies, which is also useful for environmental problems that have recently attracted attention.
【図１】本発明の一実施例の電子部品を実装した実装体
を示す断面図である。FIG. 1 is a cross-sectional view illustrating a mounted body on which an electronic component according to an embodiment of the present invention is mounted.
【図２】本発明の実施例１の中間層にアクリル樹脂を用
いた電子部品の実装体の接続部分を示す断面図である。FIG. 2 is a cross-sectional view illustrating a connection portion of a mounted body of an electronic component using an acrylic resin for an intermediate layer according to the first embodiment of the present invention.
【図３】本発明の実施例２の中間層にアクリル樹脂を用
いて、かつ絶縁性接着剤によって電子部品の接着補強を
した実装体の接続部分を示す断面図である。FIG. 3 is a cross-sectional view showing a connection portion of a mounted body in which an electronic component is bonded and reinforced by an insulating adhesive using an acrylic resin for an intermediate layer according to a second embodiment of the present invention.
【図４】本発明の実施例３の中間層に金メッキした発泡
性フィラーを含有したアクリル樹脂層を用いた電子部品
の実装体の接続部分を示す断面図である。FIG. 4 is a cross-sectional view showing a connection part of a mounted part of an electronic component using an acrylic resin layer containing a foamable filler in which an intermediate layer is gold-plated in Example 3 of the present invention.
【図５】同実施例３の電子部品を実装した実装体を示す
断面図である。FIG. 5 is a sectional view showing a mounted body on which the electronic component of the third embodiment is mounted.
【図６】Ａは本発明の一実施例の電気的接続状態をさら
に詳しく説明する模式的断面図であり、ＢはＡの電気的
接続部を拡大した模式的断面図である。6A is a schematic cross-sectional view for explaining the electrical connection state of one embodiment of the present invention in more detail, and FIG. 6B is a schematic cross-sectional view in which the electrical connection portion of A is enlarged.
１ 回路基板 ２ 基板の電極 ３，８，１０ 中間層 ４ 導電性接着剤 ５ 部品電極 ６ 電子部品 ７ 金メッキ層 ９ 絶縁性接着剤層 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Board electrode 3,8,10 Intermediate layer 4 Conductive adhesive 5 Component electrode 6 Electronic component 7 Gold plating layer 9 Insulating adhesive layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 石丸 幸宏 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 北江 孝史 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 鈴木 康寛 神奈川県横浜市港北区綱島東４丁目３番１ 号 松下通信工業株式会社内 Ｆターム(参考） 5E319 AA03 AC01 AC13 BB12 CC61 CD26 CD57 GG15 5E336 AA04 CC31 EE08 GG23 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yukihiro Ishimaru 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Takashi Kitae 1006 Kadoma Kazuma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 72) Inventor Yasuhiro Suzuki 4-3-1 Tsunashimahigashi, Kohoku-ku, Yokohama-shi, Kanagawa Prefecture F-term in Matsushita Communication Industrial Co., Ltd. (reference) 5E319 AA03 AC01 AC13 BB12 CC61 CD26 CD57 GG15 5E336 AA04 CC31 EE08 GG23
Claims (14)
品と回路基板との実装体であって、導電性接着剤と回路
基板電極との接合界面において、１００℃以上３００℃
以下の軟化温度の熱可塑性絶縁性接着剤からなる中間層
を前記接着剤と電極との間に介在させ、かつ前記中間層
中には部分的に前記導電性接着剤中の導電性フィラーが
存在し、導電性接着剤と回路基板電極とは電気的に導通
していることを特徴とする電子部品の実装体。1. A mounted body of an electronic component and a circuit board connected via a conductive adhesive, wherein the bonding interface between the conductive adhesive and the circuit board electrode is 100 ° C. or higher and 300 ° C.
An intermediate layer made of a thermoplastic insulating adhesive having the following softening temperature is interposed between the adhesive and the electrode, and a conductive filler in the conductive adhesive partially exists in the intermediate layer. An electronic component package, wherein the conductive adhesive and the circuit board electrode are electrically conductive.
ラーを含む請求項１に記載の実装体。2. The package according to claim 1, wherein the intermediate layer further includes a conductive foam filler.
電極以外の部分においてさらに絶縁性接着剤で接着され
ており、かつ前記絶縁性接着剤と回路基板との間にも中
間層が存在する請求項１または２に記載の実装体。3. The electronic component and the circuit board are further bonded with an insulating adhesive at portions other than the circuit board electrodes, and an intermediate layer exists between the insulating adhesive and the circuit board. The package according to claim 1, wherein
の形成面積以上である請求項１〜３のいずれかに記載の
実装体。4. The mounting body according to claim 1, wherein the formation area of the intermediate layer is equal to or larger than the formation area of the conductive adhesive.
の形成面積の１倍以上２倍以下である請求項１〜４のい
ずれかに記載の実装体。5. The mounting body according to claim 1, wherein the formation area of the intermediate layer is not less than one time and not more than twice the formation area of the conductive adhesive.
の形成面積の１．１倍以上１．５倍以下である請求項１
〜５のいずれかに記載の実装体。6. The formation area of the intermediate layer is 1.1 to 1.5 times the formation area of the conductive adhesive.
6. The mounted body according to any one of items 5 to 5.
２５０℃以下である請求項１〜６のいずれかに記載の実
装体。7. The mounting body according to claim 1, wherein a softening temperature of the thermoplastic insulating adhesive is 250 ° C. or less.
路基板の電極との接合部において、０．０５μｍ以上１
０μｍ以下である請求項１〜７のいずれかに記載の実装
体。8. The intermediate layer has a thickness of not less than 0.05 μm and 1 μm at a joint between the conductive adhesive and the electrode of the circuit board.
The package according to claim 1, wherein the thickness is 0 μm or less.
%以上５０vol.%以下である請求項２に記載の実装体。9. The conductive foam filler content is 2 vol.
The mounting body according to claim 2, wherein the mounting amount is 50 vol.% Or more and 50 vol.% Or less.
が、１μｍ以上１０μｍ以下である請求項２または９に
記載の実装体。10. The mounting body according to claim 2, wherein the conductive foamed filler has an average particle diameter of 1 μm or more and 10 μm or less.
樹脂粒子の表面に導電性金属被膜を形成したフィラーで
ある請求項２，９または１０に記載の実装体。11. The mounting body according to claim 2, wherein the conductive foamable filler is a filler having a conductive metal film formed on the surface of foamable resin particles.
が、１００℃以上３００℃以下の範囲である請求項２，
９，１０または１１に記載の実装体。12. The foaming temperature of the conductive foamable filler is in a range from 100 ° C. to 300 ° C.
12. The mounting body according to 9, 10, or 11.
子部品の実装体を用い、リペアを必要とした時に、該当
する電子部品の中間層部分を加熱し、熱可塑性絶縁性接
着剤の融点以上に昇温して溶融させ、この状態で電子部
品を取り外すことを特徴とする実装体のリペアー方法。13. When the electronic component mounting body according to claim 1 is used and repair is required, an intermediate layer portion of the electronic component is heated to form a thermoplastic insulating adhesive. A method for repairing a mounted body, characterized in that the temperature is raised to a temperature equal to or higher than the melting point and the electronic component is removed in this state.
び赤外線から選ばれる少なくとも一つのスポット加熱で
ある請求項１３に記載の方法。14. The method according to claim 13, wherein the heating of the intermediate layer portion is at least one spot heating selected from hot air and infrared rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001209133A JP2002190661A (en) | 2000-10-10 | 2001-07-10 | Package of electronic component and its repair method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-309693 | 2000-10-10 | ||
| JP2000309693 | 2000-10-10 | ||
| JP2001209133A JP2002190661A (en) | 2000-10-10 | 2001-07-10 | Package of electronic component and its repair method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002190661A true JP2002190661A (en) | 2002-07-05 |
Family
ID=26601812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001209133A Withdrawn JP2002190661A (en) | 2000-10-10 | 2001-07-10 | Package of electronic component and its repair method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002190661A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012132175A1 (en) * | 2011-03-29 | 2012-10-04 | パナソニック株式会社 | Solder transfer base, method for producing solder transfer base, and method for transferring solder |
| JPWO2014041602A1 (en) * | 2012-09-11 | 2016-08-12 | 株式会社メイコー | Manufacturing method of component-embedded substrate and component-embedded substrate using the same |
| JP2017143257A (en) * | 2016-02-05 | 2017-08-17 | 日本メクトロン株式会社 | Expandable substrate module, flexible wiring board, and method for manufacturing the same |
-
2001
- 2001-07-10 JP JP2001209133A patent/JP2002190661A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012132175A1 (en) * | 2011-03-29 | 2012-10-04 | パナソニック株式会社 | Solder transfer base, method for producing solder transfer base, and method for transferring solder |
| JPWO2012132175A1 (en) * | 2011-03-29 | 2014-07-24 | パナソニック株式会社 | Solder transfer substrate, method for manufacturing solder transfer substrate, and solder transfer method |
| JP5647335B2 (en) * | 2011-03-29 | 2014-12-24 | パナソニックＩｐマネジメント株式会社 | Solder transfer substrate, method for manufacturing solder transfer substrate, and solder transfer method |
| US9238278B2 (en) | 2011-03-29 | 2016-01-19 | Panasonic Intellectual Property Management Co., Ltd. | Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method |
| JPWO2014041602A1 (en) * | 2012-09-11 | 2016-08-12 | 株式会社メイコー | Manufacturing method of component-embedded substrate and component-embedded substrate using the same |
| JP2017143257A (en) * | 2016-02-05 | 2017-08-17 | 日本メクトロン株式会社 | Expandable substrate module, flexible wiring board, and method for manufacturing the same |
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| A300 | Withdrawal of application because of no request for examination |
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