CN216650312U - Heat dissipation plate and electronic device - Google Patents
Heat dissipation plate and electronic device Download PDFInfo
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- CN216650312U CN216650312U CN202121985831.0U CN202121985831U CN216650312U CN 216650312 U CN216650312 U CN 216650312U CN 202121985831 U CN202121985831 U CN 202121985831U CN 216650312 U CN216650312 U CN 216650312U
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- heat dissipation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The application provides a heating panel and electronic equipment relates to heat dissipation technical field. The heat dissipation plate comprises a metal heat dissipation layer and a phase change material layer coated on at least one surface of the metal heat dissipation layer. The heating panel is close to and sets up at electronic equipment heating element, the heating panel includes metal heat dissipation layer and phase change material layer, the phase change material cladding is on at least one surface on metal heat dissipation layer, thereby the heat that heating element distributes in the electronic equipment is direct to be absorbed by metal heat dissipation layer, or transmit to phase change material layer earlier, give metal heat dissipation layer with heat transfer again, metal heat dissipation layer can absorb more heats for phase change material layer, heat diffusion's is faster, thereby the heating panel that this application provided, because the setting on metal heat dissipation layer, make the heat that the electronic equipment body distributes can distribute away in the short time, thereby the heating panel that this application provided, for prior art heat conduction effect is better, it is faster to dispel the heat.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation plate and electronic equipment.
Background
At present, as the heat productivity and the heat density of electronic components are increased, the heat generated by the electronic components in a short time is not absorbed or dissipated, the performance of a system is influenced, and even the electronic components are shut down,
in the prior art, microcapsules are usually used as heat-conducting films to be attached to the electronic components to absorb heat generated by the electronic components, so that the effect of reducing the temperature of the electronic components is achieved, the microcapsules are made of non-metal materials, but the non-metal materials are low in heat conductivity coefficient and high in heat resistance, and in addition, the specific heat capacity of the microcapsules is small, so that the absorbed heat is small, and the heat absorption effect of the microcapsules is not ideal.
Therefore, it is an urgent need to provide a heat dissipation device with better heat absorption effect without affecting the operation of the electronic device.
SUMMERY OF THE UTILITY MODEL
The purpose of the embodiment of the application is to provide a heating panel to can be better absorb heat and dispel the heat to heating element, thereby the heat dissipation is faster, more even.
In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:
a first aspect of the present application provides a heat dissipation plate, including:
the phase-change material comprises a metal heat dissipation layer and a phase-change material layer coated on at least one surface of the metal heat dissipation layer.
In some variations of the first aspect of the present application, the heat dissipation capability of the metal heat dissipation layer is greater than the heat dissipation capability of the phase change material layer.
In some modified embodiments of the first aspect of the present application, the metal heat sink layer is formed with a honeycomb structure, and at least a part of the phase change material layer is filled in the honeycomb structure.
In some variations of the first aspect of the present application, the phase change material layer comprises at least a plurality of phase change microcapsules, at least a portion of which are filled in the honeycomb structure.
In some variations of the first aspect of the present application, the phase change microcapsules have a size that is no greater than the size of the honeycomb structure.
In some variations of the first aspect of the present application, the phase change material layer further comprises a binder for providing adhesion between the phase change microcapsules and/or between the phase change microcapsules and the metallic heat sink layer.
In some variations of the first aspect of the present disclosure, the phase change material layer includes a liquid metal and/or heat dissipation graphite, and the liquid metal and/or heat dissipation graphite at least partially fills the honeycomb structure when the phase change material layer covers at least a surface of the metal heat dissipation layer.
In some variations of the first aspect of the present application, the phase change material layer further comprises a binder for providing adhesion between the liquid metal and/or heat dissipating graphite, and/or between the phase change material layer and the metal heat dissipating layer.
In some modified embodiments of the first aspect of the present application, the heat dissipation plate includes:
the phase-change heat dissipation structure comprises at least two metal heat dissipation layers and a plurality of phase-change material layers, wherein each metal heat dissipation layer is coated by the phase-change material layers.
A second aspect of the present application provides an electronic device, which includes the heat dissipation plate as described above, and thus includes all the technical features and advantageous effects of the heat dissipation plate as described above, which are not described herein again.
Compared with the prior art, the heating panel that this application first aspect provided, the heating panel is close to and sets up at the electronic equipment heating element, the heating panel includes metal heat dissipation layer and phase change material layer, the phase change material cladding is on at least one surface on metal heat dissipation layer, thereby the heat that heating element gived off is directly absorbed by metal heat dissipation layer among the electronic equipment, or transmit earlier to phase change material layer, give metal heat dissipation layer with heat transfer again, metal heat dissipation layer can absorb more heat for phase change material layer, the faster of heat diffusion, thereby the heating panel that this application provided, because the setting on metal heat dissipation layer, make the heat that the electronic equipment body gived off can distribute away in the short time, thereby the heating panel that this application provided, it is better for prior art heat conduction effect, the heat dissipation is faster.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 schematically shows a structural view of a heat sink plate;
fig. 2 schematically shows a structural view of another heat dissipation plate;
the reference numbers illustrate:
the heat dissipation plate comprises a heat dissipation plate 1, a metal heat dissipation layer 12 and a phase change material layer 14.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1 and 2, the present application provides a heat radiating plate 1 including:
the heat-dissipating structure comprises a metal heat-dissipating layer 12 and a phase-change material layer 14 coated on at least one surface of the metal heat-dissipating layer 12.
In the application provides a heating panel 1, heating panel 1 is close to and sets up at the electronic equipment heating element, heating panel 1 includes metal heat dissipation layer 12 and phase change material layer 14, the phase change material cladding is on at least one surface of metal heat dissipation layer 12, thereby the heat that heating element gived off in the electronic equipment is directly absorbed by metal heat dissipation layer 12, or transmit to phase change material layer 14 earlier, give metal heat dissipation layer 12 with heat transfer, metal heat dissipation layer 12 can absorb more heat for phase change material layer 14, heat diffusion's is faster, thereby the heating panel 1 that this application provided, because the setting on metal heat dissipation layer 12, the heat that makes heating element gived off in the electronic equipment can distribute away in the short time, thereby this application provides heating panel 1, effect is better for prior art heat conduction, it is faster to dispel the heat.
In the embodiment of the present application, the heat dissipation capability of the metal heat dissipation layer 12 is greater than that of the phase change material layer 14.
In this embodiment, the heat-sinking capability of metal heat dissipation layer 12 is greater than the heat-sinking capability of phase change material layer 14 to the setting of the metal heat dissipation layer 12 of heating panel 1 increase makes the heat-sinking capability of heating panel 1 increase, makes the heat that heating element distributes among the electronic equipment can distribute away in the short time, thereby the heating panel 1 that this application provided, it is better for prior art heat conduction effect, and the heat dissipation is faster.
Wherein, the heat dissipation capacity is realized by heat conductivity coefficient, specific heat capacity, density and the like.
In the embodiment of the present application, the metal heat dissipation layer 12 is formed with a honeycomb structure, and at least a portion of the phase change material layer 14 is filled in the honeycomb structure.
In this embodiment, the metal heat dissipation layer 12 is formed with a honeycomb structure, and the arrangement of the honeycomb structure makes the heat absorption capacity and the heat dissipation capacity of the metal heat dissipation layer 12 better, and is more favorable for absorbing and dissipating heat of the heating element.
Preferably, at least part of the phase-change material in the honeycomb structure formed by the metal heat dissipation layer 12 is filled in the honeycomb structure and the phase-change material layer 14 of the honeycomb structure, so that heat absorption and heat dissipation are facilitated, further, the heat absorption and dissipation of the heating element are ensured, and the heat dissipation effect is better.
As shown in fig. 1, in the embodiment of the present application, the phase-change material layer 14 at least includes a plurality of phase-change microcapsules, and at least a portion of the plurality of phase-change microcapsules is filled in the honeycomb structure.
In this embodiment, the phase change material layer 14 at least includes a plurality of phase change microcapsules and a portion covering at least one surface of the metal heat dissipation layer 12, the plurality of phase change microcapsules are filled in the metal heat dissipation layer 12 formed with the honeycomb structure, and the other portion of the phase change material layer 14 covers at least one surface of the metal heat dissipation layer 12, so as to facilitate the arrangement of the heat dissipation plate 1, and the phase change microcapsules filled in the metal heat dissipation layer 12 can improve the heat absorption capacity and the heat dissipation capacity of the honeycomb structure, thereby effectively improving the heat absorption effect and the heat dissipation effect of the heat dissipation plate 1.
In an embodiment of the present application, the size of the phase change microcapsules is not larger than the size of the honeycomb structure.
In this embodiment, the size of the phase change microcapsule is not greater than the size of the honeycomb structure, that is, the size of the phase change microcapsule is smaller than or equal to the size of the honeycomb hole in the honeycomb structure, so that the phase change microcapsule is conveniently filled in the honeycomb structure, thereby being beneficial to the arrangement of the heat dissipation plate 1, and the phase change microcapsule filled in the metal heat dissipation layer 12 can improve the heat absorption capacity and the heat dissipation capacity of the honeycomb structure, thereby effectively improving the heat absorption effect and the heat dissipation effect of the heat dissipation plate 1.
In the present embodiment, the phase change material layer 14 further includes an adhesive for providing adhesion between the phase change microcapsules and/or between the phase change microcapsules and the metallic heat dissipation layer 12.
In this embodiment, the phase change material layer 14 further includes a binder for providing adhesion between two or more phase change microcapsules, securing two or more adjacent phase change microcapsules by adhesion, the binder further being disposed between the phase change microcapsules and the metallic heat spreading layer 12, so that the phase change material layer 14 at least covering at least one surface of the metal heat dissipation layer 12 is bonded and fixed with the metal heat dissipation layer 12 through an adhesive, the adhesive can also bond the phase change microcapsules in the metal heat dissipation layer 12 formed with the honeycomb structure, thereby realizing the bonding of the phase-change microcapsule in the honeycomb structure, ensuring the formation of the heat dissipation plate 1, thereby being beneficial to the arrangement of the heat dissipation plate 1, and the phase change microcapsules filled in the metal heat dissipation layer 12 can improve the heat absorption capacity and the heat dissipation capacity of the honeycomb structure, thereby effectively improving the heat absorption effect and the heat dissipation effect of the heat dissipation plate 1.
In the embodiment of the present application, the phase-change material layer 14 includes a liquid metal and/or heat dissipation graphite, and when the phase-change material layer 14 covers at least one surface of the metal heat dissipation layer 12, the liquid metal and/or the heat dissipation graphite at least partially fills the honeycomb structure.
In this embodiment, the phase-change material layer 14 includes liquid metal and/or heat dissipation graphite and/or other heat conducting media, the heat dissipation plate 1 may be a metal heat dissipation layer 12 and a phase-change material layer 14, at least one of the phase-change material layers 14, at least one of which covers the metal heat dissipation layer 12, is a phase-change microcapsule or a phase-change material layer 14 with a common layered structure, the metal heat dissipation layer 12 at this time is a honeycomb structure, a part of the phase-change material layer 14 is filled in the metal heat dissipation layer 12 with the honeycomb structure, the phase-change material layer 14 filled in the metal heat dissipation layer 12 is liquid metal, and the liquid metal is filled in the metal heat dissipation layer 12 with the honeycomb structure or is cooled for a certain time to become solid, so that the entire heat dissipation plate 1 is formed; in addition, heat dissipation graphite can be filled in the metal heat dissipation layer 12 of the honeycomb structure to form the heat dissipation plate 1, the formation of the heat dissipation plate 1 is guaranteed through the arrangement, the arrangement of the heat dissipation plate 1 is facilitated, and the phase change microcapsules filled in the metal heat dissipation layer 12 can improve the heat absorption capacity and the heat dissipation capacity of the honeycomb structure, so that the heat absorption effect and the heat dissipation effect of the heat dissipation plate 1 are effectively improved.
Optionally, the phase change material layer 14 is a paraffin layer, the paraffin layer is two layers, and the two paraffin layers are respectively attached to the upper side and the lower side of the metal heat dissipation layer 12.
In the present embodiment, the phase change material layer 14 further includes an adhesive for providing adhesion between the liquid metal and/or the heat dissipating graphite, and/or between the phase change material layer 14 and the metal heat dissipating layer 12.
In this embodiment, the phase change material layer 14 further includes an adhesive, the adhesive is used for heat dissipation graphite and a honeycomb structure, the heat dissipation graphite is filled in honeycomb holes in the honeycomb structure, the heat dissipation graphite is bonded with the metal heat dissipation layer 12 of the honeycomb structure through the adhesive, so as to form the heat dissipation plate 1, in addition, the adhesive is further arranged between the phase change material layer 14 and the metal heat dissipation layer 12, so that the phase change material layer 14 at least coated on at least one surface of the metal heat dissipation layer 12 is bonded and fixed with the metal heat dissipation layer 12 through the adhesive, the formation of the heat dissipation plate 1 is ensured through the above arrangement, so as to be beneficial to the arrangement of the heat dissipation plate 1, and the heat dissipation graphite filled in the metal heat dissipation layer 12 can improve the heat absorption capacity and the heat dissipation capacity of the honeycomb structure, so as to effectively improve the heat absorption effect and the heat dissipation effect of the heat dissipation plate 1.
In the embodiment of the present application, the heat dissipation plate 1 includes at least two metal heat dissipation layers 12 and a plurality of phase change material layers 14, and each of the metal heat dissipation layers 12 is covered by the plurality of phase change material layers 14.
In this embodiment, the heat dissipation plate 1 includes at least two metal heat dissipation layers 12 and a plurality of phase change material layers 14, one phase change material layer 14 is disposed between two adjacent metal heat dissipation layers 12, and the upper and lower surfaces of each metal heat dissipation layer 12 are covered by the phase change material layer 14, so as to be more favorable for heat dissipation.
As shown in fig. 1, preferably, the heat dissipation plate 1 includes two phase change material layers 14 and one metal heat dissipation layer 12, where the phase change material layer 14 is a phase change microcapsule formed by mixing a phase change material, a polymer shell and glue according to a certain proportion, the metal heat dissipation layer 12 is a honeycomb structure formed by corroding a metal block, the honeycomb structure is filled with liquid metal and/or heat dissipation graphite and/or other heat conducting media, the two phase change material layers 14 are respectively attached to two sides of the metal heat dissipation layer 12 to form the heat dissipation plate 1 disposed near a heating element, heat dissipated by the heating element in an electronic device is firstly transmitted to the phase change material layer 14 and then transmitted to the metal heat dissipation layer 12, and since the heat dissipation capability of the metal heat dissipation layer 12 is greater than that of the phase change material layer 14, the metal heat dissipation layer 12 can absorb more heat in the same time relative to the phase change material layer 14, the heat diffusion is faster and more even, and the phase change material layer 14 of rethread opposite side dispels the heat with the heat to the heating panel 1 that this application provided, because the setting of metal heat dissipation layer 12, make the heat that heating element distributes among the electronic equipment can distribute away in the short time, thereby the heating panel 1 that this application provided, it is better for prior art heat conduction effect, the heat dissipation is faster.
In addition, the total heat absorption of the heat dissipation plate is Q, which is mp×Δhs-1+mcu×cpcu×(Tc-To)；
Wherein m isp-the mass of the phase change material layer in Kg; Δ hs-l-the latent heat of phase change of the phase change material layer is in units of J/Kg;
mcuthe unit of the mass of the metal heat dissipation layer is Kg; cp (p)cuThe specific heat capacity J/(Kg.K) of the metal heat dissipation layer;
Tc-the phase change temperature of the phase change material layer in units of; t isoTemperature at the initial moment in units of ℃.
Thereby obtain the total heat that absorbs of heating panel and the heat that can give off through above relational expression, be favorable to setting up the heating panel according to above public notice to guaranteed the thermal absorption of heating element and give off.
In another aspect, the present application further provides an electronic device including the heat dissipation plate as described above.
Another aspect of the embodiments of the present application provides an electronic device including the heat dissipation plate as described above, and therefore includes all the technical features and advantageous effects of the heat dissipation plate as described above, which are not described herein again.
The application provides a pair of heating panel and electronic equipment, the heating panel is close to the heating element setting that sets up at electronic equipment, the heating panel includes metal heat dissipation layer and phase change material layer, the phase change material cladding is on at least one surface on metal heat dissipation layer, thereby the heat that heating element gived off in the electronic equipment is directly absorbed by metal heat dissipation layer, or transmit earlier to phase change material layer, give metal heat dissipation layer with heat transfer again, metal heat dissipation layer can absorb more heat for phase change material layer, heat diffusion's is faster, thereby the heating panel that this application provided, because the setting on metal heat dissipation layer, make the heat that heating element gived off can distribute away in the short time among the electronic equipment, thereby the heating panel that this application provided, it is better for prior art heat conduction effect, it is faster to dispel the heat.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. A heat dissipating plate, comprising:
the phase change material layer is coated on at least one surface of the metal heat dissipation layer;
the metal heat dissipation layer is provided with a honeycomb structure, and at least part of the phase change material layer is filled in the honeycomb structure.
2. Heat sink according to claim 1,
the heat dissipation capacity of the metal heat dissipation layer is larger than that of the phase change material layer.
3. Heat sink according to claim 1,
the phase change material layer at least comprises a plurality of phase change microcapsules, and at least part of the phase change microcapsules is filled in the honeycomb structure.
4. Heat-dissipating plate according to claim 3,
the size of the phase change microcapsule is not larger than that of the honeycomb structure.
5. Heat-dissipating plate according to claim 3,
the phase change material layer further comprises a binder for providing adhesion between the phase change microcapsules and/or between the phase change microcapsules and the metallic heat dissipation layer.
6. Heat sink according to claim 1,
the phase-change material layer comprises liquid metal and/or heat dissipation graphite, and when the phase-change material layer is coated on at least one surface of the metal heat dissipation layer, the honeycomb structure is at least partially filled with the liquid metal and/or the heat dissipation graphite.
7. Heat sink according to claim 6,
the phase change material layer further comprises an adhesive for providing adhesion between the liquid metal and/or the heat dissipation graphite, and/or between the phase change material layer and the metal heat dissipation layer.
8. The heat dissipating plate of claim 1, wherein the heat dissipating plate comprises:
the phase-change heat dissipation structure comprises at least two metal heat dissipation layers and a plurality of phase-change material layers, wherein each metal heat dissipation layer is coated by the phase-change material layers.
9. An electronic apparatus, characterized by comprising the heat dissipation plate as recited in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121985831.0U CN216650312U (en) | 2021-08-23 | 2021-08-23 | Heat dissipation plate and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121985831.0U CN216650312U (en) | 2021-08-23 | 2021-08-23 | Heat dissipation plate and electronic device |
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| Publication Number | Publication Date |
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| CN216650312U true CN216650312U (en) | 2022-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121985831.0U Active CN216650312U (en) | 2021-08-23 | 2021-08-23 | Heat dissipation plate and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117320416A (en) * | 2023-11-27 | 2023-12-29 | 西安中核核仪器股份有限公司 | Heat radiation structure for nuclear radiation detector |
-
2021
- 2021-08-23 CN CN202121985831.0U patent/CN216650312U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117320416A (en) * | 2023-11-27 | 2023-12-29 | 西安中核核仪器股份有限公司 | Heat radiation structure for nuclear radiation detector |
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