JP2002118356A - Solder jetting device - Google Patents
Solder jetting deviceInfo
- Publication number
- JP2002118356A JP2002118356A JP2000306911A JP2000306911A JP2002118356A JP 2002118356 A JP2002118356 A JP 2002118356A JP 2000306911 A JP2000306911 A JP 2000306911A JP 2000306911 A JP2000306911 A JP 2000306911A JP 2002118356 A JP2002118356 A JP 2002118356A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- liquid level
- molten solder
- float
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 73
- 239000007788 liquid Substances 0.000 claims abstract description 51
- 239000000428 dust Substances 0.000 claims abstract description 9
- 238000001514 detection method Methods 0.000 claims description 21
- 238000005476 soldering Methods 0.000 claims description 7
- 238000009825 accumulation Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 abstract description 6
- 238000002844 melting Methods 0.000 abstract description 6
- 230000035945 sensitivity Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 101001046677 Homo sapiens Integrin alpha-V Proteins 0.000 description 1
- 101000914514 Homo sapiens T-cell-specific surface glycoprotein CD28 Proteins 0.000 description 1
- 101000801109 Homo sapiens Transmembrane protein 131 Proteins 0.000 description 1
- 102100022337 Integrin alpha-V Human genes 0.000 description 1
- 102100027213 T-cell-specific surface glycoprotein CD28 Human genes 0.000 description 1
- 102100033700 Transmembrane protein 131 Human genes 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液面検出センサで
溶融半田の液面検出を行って、液量調節を行ない、通過
するプリント基板に半田付けする半田噴流装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder jet apparatus for detecting a liquid level of a molten solder by a liquid level detection sensor, adjusting a liquid amount, and soldering the solder to a printed circuit board passing therethrough.
【０００２】[0002]
【従来の技術】面実装部品やディスクリート部品（リー
ド足がある部品）を混載したプリント基板を搬送させな
がら、このプリント基板に対して半田付けを行う半田噴
流装置は既に知られている。2. Description of the Related Art A solder jet apparatus for soldering a printed circuit board on which a printed circuit board on which surface mount components and discrete components (components having lead legs) are mixed is already known.
【０００３】この種の半田噴流装置としては、図２，図
３に示すように、電子部品を載せたプリント基板Ｐに対
して良好に溶融半田Ｊを供給するための一次噴流ノズル
１と、半田供給済みのプリント基板Ｐから余分な溶融半
田Ｊを除去するための二次噴流ノズル２とを備えたもの
がある。As shown in FIGS. 2 and 3, this type of solder jet device includes a primary jet nozzle 1 for supplying molten solder J to a printed circuit board P on which electronic components are mounted, and a solder jet nozzle 1 for soldering. Some include a secondary jet nozzle 2 for removing excess molten solder J from the supplied printed circuit board P.
【０００４】一次噴流ノズル１には一次ノズル用ダクト
３が接続され、二次噴流ノズル２には二次ノズル用ダク
ト４が接続され、これらのダクト３，４は溶融半田Ｊが
溜められている半田溶融槽５内に浸けられている。そし
て、各ダクト３，４の一端の開口部に臨むように配置さ
れた噴流羽根車６，７を回転駆動させることにより、一
次噴流ノズル１および二次噴流ノズル２から溶融半田Ｊ
を搬送面１０に向けて噴出させるように構成されてい
る。一次噴流ノズル１の上端部には多数の噴出口８が開
口された半田ウエーブ形成板９が取り付けられている。A primary nozzle duct 3 is connected to the primary jet nozzle 1, and a secondary nozzle duct 4 is connected to the secondary jet nozzle 2, and these ducts 3 and 4 store molten solder J. It is immersed in the solder melting tank 5. Then, by rotating the jet impellers 6 and 7 arranged so as to face the openings at one ends of the ducts 3 and 4, the molten solder J from the primary jet nozzle 1 and the secondary jet nozzle 2 is rotated.
Is ejected toward the transport surface 10. At the upper end of the primary jet nozzle 1, a solder wave forming plate 9 having a large number of jet ports 8 opened is attached.
【０００５】半田噴流装置５には、溶融半田Ｊの液面を
検出する液面検出センサ１２が設けられており、この検
出によって作業者が液量調節を行ないながら通過するプ
リント基板Ｐに対して半田付けしている。[0005] The solder jet device 5 is provided with a liquid level detection sensor 12 for detecting the liquid level of the molten solder J. With this detection, the operator adjusts the liquid amount and moves the printed circuit board P with respect to the printed circuit board P. Soldering.
【０００６】液面検出センサ１２には、例えば、図４
（ａ）のように、固定側から支持されたスタンド２１に
取付け金具で軸受１５ｂを固定し、この軸受１５ｂでシ
ャフト１４ｂを昇降自在に支持してシャフト１４ｂの下
端に連結されたフロート１３ｂを溶融半田Ｊの液面に浮
かばせて、溶融半田Ｊの液面検出を行なう液面検出セン
サ１２ｂがある。[0006] For example, FIG.
As shown in (a), the bearing 15b is fixed to the stand 21 supported from the fixed side with a mounting bracket, and the shaft 14b is supported by the bearing 15b so as to be able to move up and down, and the float 13b connected to the lower end of the shaft 14b is melted. There is a liquid level detection sensor 12b that floats on the liquid level of the solder J and detects the liquid level of the molten solder J.
【０００７】液面検出センサ１２ｂのシャフト１４ｂの
上端にはディスク１９が配置され、軸受１５ｂのディス
ク１９との対向面には、電極２０ａ，２０ｂが配置され
ている。A disk 19 is disposed at the upper end of the shaft 14b of the liquid level detection sensor 12b, and electrodes 20a and 20b are disposed on a surface of the bearing 15b facing the disk 19.
【０００８】溶融半田Ｊの液面レベルが低下すると、フ
ロート１３ｂおよびシャフト１４ｂが下降してディスク
１９が電極２０ａ，２０ｂと当接し、電極２０ａ，２０
ｂの間が導通されて電流が流れる。この検出信号により
作業者は半田溶融槽５に固体の半田を投入して半田付け
が実行される。When the liquid level of the molten solder J is lowered, the float 13b and the shaft 14b are lowered, and the disk 19 comes into contact with the electrodes 20a and 20b, and the electrodes 20a and 20b are moved.
b is conducted and a current flows. According to this detection signal, the operator puts solid solder into the solder melting tank 5 and soldering is performed.
【０００９】また、図４（ｂ）に示すように、熱電対セ
ンサ２２の感温部２３を溶融半田Ｊの液面に接触させて
温度検出を行ないながら液面レベルを検出する液面検出
センサ１２ｃも知られている。Further, as shown in FIG. 4B, a liquid level detecting sensor for detecting the liquid level while bringing the temperature sensing part 23 of the thermocouple sensor 22 into contact with the liquid level of the molten solder J to detect the temperature. 12c is also known.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら液面検出
センサ１２ｂでは、電極２０ａ，２０ｂやディスク１９
が汚れたり酸化して接触不良を生じることがあり、ま
た、シャフト１４ｂを支持する軸受１５ｂの長さが短い
ため、フロート１３ｂやディスク１９に傾きが生じ易
く、正確な液面検出が行なえない。However, in the liquid level detecting sensor 12b, the electrodes 20a and 20b and the disk 19 are not provided.
May become dirty or oxidized, resulting in poor contact. Further, since the length of the bearing 15b supporting the shaft 14b is short, the float 13b and the disk 19 are liable to be inclined, so that accurate liquid level detection cannot be performed.
【００１１】また、溶融半田Ｊの液面レベルの低下が検
出されると、溶融半田Ｊを補充するために半田溶融槽５
には固体の半田が供給されるが、液面検出センサ１２ｂ
では、半田供給時に溶融半田Ｊの液面が上昇したり、あ
るいは噴流ノズル１，２の溶融半田Ｊの吹出しにより溶
融半田Ｊの液面が上下すると、フロート１３ｂの上部に
溶融半田Ｊが付着して堆積する場合がある。また、フロ
ート１３ｂの上部には、前記のような溶融半田Ｊだけで
なく粉塵なども堆積しやすく、安定した液面制御を行な
えないという問題がある。When a decrease in the liquid level of the molten solder J is detected, the solder melting tank 5 is supplied to replenish the molten solder J.
Is supplied with solid solder, the liquid level detection sensor 12b
Then, when the liquid level of the molten solder J rises at the time of supplying the solder, or when the liquid level of the molten solder J rises and falls due to the blowing of the molten solder J from the jet nozzles 1 and 2, the molten solder J adheres to the upper portion of the float 13b. May accumulate. In addition, not only the above-described molten solder J but also dust and the like are easily deposited on the upper portion of the float 13b, and there is a problem that stable liquid level control cannot be performed.
【００１２】一方、液面検出センサ１２ｃでは、時間の
経過に伴なって熱電対センサ２２の外装ケースに半田の
付着が発生して感温部２３の感度が劣化するため、正確
な温度検出を連続して行なえない。On the other hand, in the liquid level detection sensor 12c, as the time elapses, the adhesion of the solder to the outer case of the thermocouple sensor 22 occurs, and the sensitivity of the temperature sensing portion 23 is deteriorated. It cannot be done continuously.
【００１３】本発明は前記問題点を解決し、安定な液面
制御を行なえる半田噴流装置を提供することを目的とす
る。It is an object of the present invention to solve the above-mentioned problems and to provide a solder jet apparatus capable of performing stable liquid level control.
【００１４】[0014]
【課題を解決するための手段】本発明の半田噴流装置
は、溶融半田の液面検出センサの構成を特殊にしたこと
を特徴とする。The solder jetting apparatus according to the present invention is characterized in that the configuration of the sensor for detecting the liquid level of the molten solder is special.
【００１５】この本発明によると、液面検出センサへの
溶融半田や粉塵の堆積を低減して、安定した液面制御が
行なえる。According to the present invention, stable liquid level control can be performed by reducing the accumulation of molten solder and dust on the liquid level detection sensor.
【００１６】[0016]
【発明の実施の形態】本発明の請求項１記載の半田噴流
装置は、溶融半田面から上にウエーブ形成板によって半
田ウエーブを形成し、前記溶融半田の液面を検出する液
面検出センサを設けて液量調節を行ないながら通過する
プリント基板に対して半田付けする半田噴流装置におい
て、前記液面検出センサを、溶融半田の液面に浮かぶフ
ロートと、前記フロートに連結され軸受で昇降自在に支
持されたシャフトと、前記シャフトの移動を検出するセ
ンサとで構成し、前記フロートの上部に溶融半田や粉塵
の堆積を低減するよう先端部から下方へ裾拡がりの傾斜
面を形成したことを特徴とする。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A solder jet apparatus according to a first aspect of the present invention includes a liquid level detecting sensor for forming a solder wave by a wave forming plate above a molten solder surface and detecting a liquid level of the molten solder. In a solder jet device that is provided and solders to a printed circuit board that passes while performing liquid amount adjustment, the liquid level detection sensor is connected to the float floating on the liquid surface of the molten solder, and the float is connected to the float so as to be movable up and down by a bearing. It is composed of a supported shaft and a sensor for detecting the movement of the shaft, and has an inclined surface flared downward from the tip end to reduce the accumulation of molten solder and dust on the upper part of the float. And
【００１７】本発明の請求項２記載の半田噴流装置は、
請求項１において、センサは、前記シャフトの上端の位
置を検出する光電式スイッチで構成したことを特徴とす
る。以下、本発明の具体的な実施の形態を図１を用いて
説明する。According to a second aspect of the present invention, there is provided a solder jet device.
In claim 1, the sensor is constituted by a photoelectric switch for detecting a position of an upper end of the shaft. Hereinafter, a specific embodiment of the present invention will be described with reference to FIG.
【００１８】なお、上記従来例を示す図２〜図４と同様
の構成をなすものには同一の符号を付けて説明する。図
１（ａ），（ｂ）に示すように、液面検出センサ１２ａ
は、溶融半田Ｊの液面に浮かぶフロート１３ａと、フロ
ート１３ａに連結され軸受１５ａで昇降自在に支持され
たシャフト１４ａと、シャフト１４ａの移動を検出する
センサ１６とで構成されている。２１は軸受１５ａを固
定側から支持するスタンドである。The components having the same structure as in FIGS. 2 to 4 showing the above-described conventional example are denoted by the same reference numerals. As shown in FIGS. 1A and 1B, the liquid level detection sensor 12a
Is composed of a float 13a floating on the liquid surface of the molten solder J, a shaft 14a connected to the float 13a and supported by a bearing 15a so as to be able to move up and down, and a sensor 16 for detecting the movement of the shaft 14a. A stand 21 supports the bearing 15a from the fixed side.
【００１９】フロート１３ａの上部には、溶融半田Ｊや
粉塵の堆積を低減するよう先端部から下方へ裾拡がりの
傾斜面１８が形成されている。センサ１６は、シャフト
１４ａの上端の位置を検出する光電式スイッチで構成さ
れており、光源１６ａから受光器１６ｂに向かって光が
照射され、図１（ａ）のように溶融半田Ｊの液面レベル
が高い場合には、シャフト１４ａによって光の照射が遮
られ、図１（ｂ）のように液面レベルが低下してシャフ
ト１４ａの位置が下がり受光器１６ｂによって光源１６
ａからの光が検出されると、検出信号が検知器２４に送
られてランプ２５が点灯して、作業者に液面レベルの低
下を知らせるように構成されている。At the upper part of the float 13a, an inclined surface 18 is formed which spreads downward from the front end so as to reduce the accumulation of the molten solder J and dust. The sensor 16 is composed of a photoelectric switch that detects the position of the upper end of the shaft 14a. Light is emitted from the light source 16a toward the light receiver 16b, and the liquid level of the molten solder J as shown in FIG. When the level is high, the irradiation of light is blocked by the shaft 14a, and the liquid level is lowered as shown in FIG. 1B, the position of the shaft 14a is lowered, and the light
When the light from “a” is detected, a detection signal is sent to the detector 24 and the lamp 25 is turned on to notify the worker of a decrease in the liquid level.
【００２０】また、シャフト１４ａを支持する軸受１５
ａは、図４（ａ）に示す液面検出センサ１２ｂの軸受１
５ｂよりも十分長く形成されている。上記のように構成
された液面検出センサ１２ａでは、フロート１３ａの上
端に傾斜面１８が形成されているため、溶融半田Ｊの不
足が検出され半田溶融槽５に固体の半田が供給された場
合でも、フロート１３ａの上部に付着した溶融半田Ｊは
傾斜面１８を伝わって流れ落ち、溶融半田Ｊの堆積が低
減される。また、粉塵の堆積も低減でき、センサ感度の
劣化を低減できる。A bearing 15 for supporting the shaft 14a
a is the bearing 1 of the liquid level detection sensor 12b shown in FIG.
It is formed sufficiently longer than 5b. In the liquid level detection sensor 12a configured as described above, since the inclined surface 18 is formed at the upper end of the float 13a, when the shortage of the molten solder J is detected and solid solder is supplied to the solder melting tank 5, However, the molten solder J attached to the upper portion of the float 13a flows down the inclined surface 18 and falls, and the deposition of the molten solder J is reduced. Further, the accumulation of dust can be reduced, and the deterioration of the sensor sensitivity can be reduced.
【００２１】また、光電式スイッチで構成されたセンサ
１６を用いることで、確実な液面レベルの検出が実現で
きる。さらに、軸受１５ａの長さを十分長くとること
で、シャフト１４ａのがたつきを低減してシャフト１４
ａの垂直度を確保でき、スムーズな支持が実現できる。Further, by using the sensor 16 constituted by a photoelectric switch, it is possible to realize a reliable liquid level detection. Further, by making the length of the bearing 15a sufficiently long, the backlash of the shaft 14a is reduced,
The verticality of a can be secured, and smooth support can be realized.
【００２２】[0022]
【発明の効果】以上のように本発明の半田噴流装置によ
れば、液面検出センサを、溶融半田の液面に浮かぶフロ
ートと、フロートに連結され軸受で昇降自在に支持され
たシャフトと、前記シャフトの移動を検出するセンサと
で構成し、前記フロートの上部に溶融半田や粉塵の堆積
を低減するよう先端部から下方へ裾拡がりの傾斜面を形
成することで、溶融半田や粉塵の堆積によるセンサ感度
の劣化を低減でき、良好な半田付けが行なえる。As described above, according to the solder jet apparatus of the present invention, the liquid level detection sensor is provided with a float floating on the liquid level of the molten solder, a shaft connected to the float and supported by a bearing so as to be movable up and down. A sensor for detecting the movement of the shaft, and forming an inclined surface that spreads downward from the tip to reduce the accumulation of molten solder and dust at the upper part of the float, thereby accumulating molten solder and dust. Therefore, deterioration of the sensor sensitivity due to the above can be reduced, and good soldering can be performed.
【図１】本発明の実施の形態における液面検出センサの
動作を説明する模式図FIG. 1 is a schematic diagram illustrating an operation of a liquid level detection sensor according to an embodiment of the present invention.
【図２】半田噴流装置の全体斜視図FIG. 2 is an overall perspective view of a solder jet device.
【図３】図２の半田噴流装置の正面断面図FIG. 3 is a front sectional view of the solder jet device of FIG. 2;
【図４】従来の液面検出センサの構成を説明する側面図FIG. 4 is a side view illustrating the configuration of a conventional liquid level detection sensor.
５ 半田溶融槽 １２ａ 液面検出センサ １３ａ フロート １４ａ シャフト １５ａ 軸受 １６ センサ １７ 表示機 １８ 傾斜面 Ｊ 溶融半田 Ｐ プリント基板 5 Solder melting tank 12a Liquid level detection sensor 13a Float 14a Shaft 15a Bearing 16 Sensor 17 Display 18 Inclined surface J Melted solder P Printed circuit board
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中島 憲一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 杉本 忠彦 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4E080 AA01 AB03 CB02 5E319 AB01 AC01 BB01 CC24 CC28 CD28 CD51 GG03 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kenichi Nakajima 1006 Kadoma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. Terms (reference) 4E080 AA01 AB03 CB02 5E319 AB01 AC01 BB01 CC24 CC28 CD28 CD51 GG03
Claims (2)
て半田ウエーブを形成し、前記溶融半田の液面を検出す
る液面検出センサを設けて液量調節を行ないながら通過
するプリント基板に対して半田付けする半田噴流装置に
おいて、 前記液面検出センサを、 溶融半田の液面に浮かぶフロートと、 前記フロートに連結され軸受で昇降自在に支持されたシ
ャフトと、 前記シャフトの移動を検出するセンサとで構成し、 前記フロートの上部に溶融半田や粉塵の堆積を低減する
よう先端部から下方へ裾拡がりの傾斜面を形成した半田
噴流装置。A solder wave is formed by a wave forming plate above a surface of a molten solder, and a liquid level detecting sensor for detecting a liquid level of the molten solder is provided. In a solder jet device for soldering, the liquid level detection sensor includes: a float floating on a liquid level of the molten solder; a shaft connected to the float and supported by a bearing so as to be movable up and down; and a sensor for detecting movement of the shaft. A solder jet device having a slope extending downward from the tip end so as to reduce the accumulation of molten solder and dust on the float.
出する光電式スイッチで構成した請求項１記載の半田噴
流装置。2. A solder jet apparatus according to claim 1, wherein said sensor comprises a photoelectric switch for detecting a position of an upper end of said shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000306911A JP2002118356A (en) | 2000-10-06 | 2000-10-06 | Solder jetting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000306911A JP2002118356A (en) | 2000-10-06 | 2000-10-06 | Solder jetting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002118356A true JP2002118356A (en) | 2002-04-19 |
Family
ID=18787514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000306911A Pending JP2002118356A (en) | 2000-10-06 | 2000-10-06 | Solder jetting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002118356A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016124642A1 (en) * | 2016-12-16 | 2018-06-21 | Seho Systemtechnik Gmbh | Method and device for soldering assemblies |
| US10413986B2 (en) | 2015-06-23 | 2019-09-17 | Fuji Corporation | Estimation device |
-
2000
- 2000-10-06 JP JP2000306911A patent/JP2002118356A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10413986B2 (en) | 2015-06-23 | 2019-09-17 | Fuji Corporation | Estimation device |
| DE102016124642A1 (en) * | 2016-12-16 | 2018-06-21 | Seho Systemtechnik Gmbh | Method and device for soldering assemblies |
| DE102016124642B4 (en) | 2016-12-16 | 2023-10-05 | Seho Vermögensverwaltungs Gmbh & Co. Kg | Method and device for soldering assemblies |
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