JP2002022987A - Optical wiring board and method for manufacturing the same - Google Patents
Optical wiring board and method for manufacturing the sameInfo
- Publication number
- JP2002022987A JP2002022987A JP2000208528A JP2000208528A JP2002022987A JP 2002022987 A JP2002022987 A JP 2002022987A JP 2000208528 A JP2000208528 A JP 2000208528A JP 2000208528 A JP2000208528 A JP 2000208528A JP 2002022987 A JP2002022987 A JP 2002022987A
- Authority
- JP
- Japan
- Prior art keywords
- optical wiring
- adhesive layer
- substrate
- optical
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Optical Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、凹凸を有する基板
上に１層もしくは多層の光配線層を有する、光配線基板
およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical wiring board having one or more optical wiring layers on a substrate having irregularities and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】基板上に光配線フィルムを積層させる方
法として、位置合わせマーカーもしくは雄雌接合部を用
いた位置合わせ技術が報告されている（特開平１１−１
８３７４７号公報参照）。2. Description of the Related Art As a method of laminating an optical wiring film on a substrate, there has been reported a positioning technique using a positioning marker or a male / female joint (Japanese Patent Laid-Open No. 11-1).
No. 83747).
【０００３】しかしながら、凹凸を有する基板上に光配
線フィルムを積層する場合、基板の凹凸により光配線フ
ィルムが歪んでしまい、光伝搬損失が悪化し、高精度な
位置合わせが不可能となる問題がある。However, when an optical wiring film is laminated on a substrate having unevenness, the optical wiring film is distorted due to the unevenness of the substrate, light transmission loss is deteriorated, and high-precision alignment becomes impossible. is there.
【０００４】また、基板および基板−光配線フィルムの
接着剤の耐熱性をあげることで光配線層の耐熱性を向上
させる技術が報告されている（特開平１１−３８２４１
号参照）。A technique has been reported for improving the heat resistance of an optical wiring layer by increasing the heat resistance of a substrate and an adhesive for a substrate-optical wiring film (Japanese Patent Laid-Open No. 11-38241).
No.).
【０００５】しかしながら、基板や接着剤が熱を有する
場合、該基板・該接着剤の耐熱性にかかわらず、光配線
フィルムの温度が上昇し、光配線フィルムの光特性が悪
化する問題がある。[0005] However, when the substrate or the adhesive has heat, there is a problem that the temperature of the optical wiring film rises and the optical characteristics of the optical wiring film deteriorate, regardless of the heat resistance of the substrate and the adhesive.
【０００６】[0006]
【発明が解決しようとする課題】本発明は係る従来技術
の欠点に鑑みてなされたもので、光配線の積層面を平坦
とし光伝搬損失を向上させ、しかも高精度のアライメン
トを可能とする。また、接着剤層の断熱特性を向上さ
せ、基板の熱量によらず、光配線の特性を向上させた光
配線基板とその製造法を提供することを課題とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has an object to improve the optical propagation loss by flattening the lamination surface of an optical wiring, and to enable highly accurate alignment. It is another object of the present invention to provide an optical wiring board in which the heat insulating property of the adhesive layer is improved and the characteristics of the optical wiring are improved irrespective of the amount of heat of the substrate, and a method of manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】本発明において上記の課
題を達成するために、まず請求項１の発明では、少なく
とも１層の光配線層を有する光配線基板において、該光
配線層と、該光配線層を支持する支持基板との間に接着
剤層を有することを特徴とする光配線基板である。請求
項２の発明では、接着剤層の層厚が、支持基板表面の凹
凸以上の厚みを持つことを特徴とする請求項１記載の光
配線基板である。請求項３の発明では、光配線層中の光
導波面が、実質上平坦であることを特徴とする請求項１
〜２の何れかに記載の光配線基板である。請求項４の発
明は、接着剤層が、断熱効果を有することを特徴とする
請求項１〜３の何れかに記載の光配線基板である。請求
項５の発明は、１層もしくは１層以上の光配線層からな
る光配線フィルムと、該光配線フィルムの一部もしくは
全面に塗布された接着層からなる転写媒体を支持基板上
に積層することを特徴とする光配線基板の製造方法であ
る。請求項６に記載の発明は、１層もしくは１層以上の
光配線層からなる光配線フィルムを、支持基板の一部も
しくは全面に塗布された接着層上に積層することを特徴
とする光配線基板の製造方法である。In order to achieve the above object in the present invention, according to the first aspect of the present invention, there is provided an optical wiring board having at least one optical wiring layer. An optical wiring board having an adhesive layer between the optical wiring layer and a support substrate that supports the optical wiring layer. According to a second aspect of the present invention, there is provided the optical wiring substrate according to the first aspect, wherein the thickness of the adhesive layer is equal to or greater than the unevenness of the surface of the support substrate. According to the third aspect of the present invention, the optical waveguide surface in the optical wiring layer is substantially flat.
3. The optical wiring board according to any one of 1. to 2., The invention according to claim 4 is the optical wiring board according to any one of claims 1 to 3, wherein the adhesive layer has a heat insulating effect. According to a fifth aspect of the present invention, an optical wiring film including one or more optical wiring layers and a transfer medium including an adhesive layer applied to a part or the entire surface of the optical wiring film are laminated on a support substrate. A method of manufacturing an optical wiring board, characterized in that: The optical wiring according to claim 6, wherein an optical wiring film comprising one or more optical wiring layers is laminated on an adhesive layer applied to a part or the whole surface of the support substrate. This is a method for manufacturing a substrate.
【０００８】[0008]
【発明の実施の形態】本発明の光配線基板において、そ
の断面図を図１に示す。FIG. 1 is a sectional view showing an optical wiring board according to the present invention.
【０００９】本発明の光配線基板は、凹凸を有する基板
１０上に接着剤層２０と光配線フィルム３０を積層する
構造をとる。The optical wiring board of the present invention has a structure in which an adhesive layer 20 and an optical wiring film 30 are laminated on a substrate 10 having irregularities.
【００１０】支持基板１０の表面は凹凸を有する。シリ
コン基板などの結晶基板を用いた場合、この凹凸の高さ
は数ｎｍとなる。電気プリント配線基板を用いた場合、
この凹凸の高さは数十μｍとなる。The surface of the support substrate 10 has irregularities. When a crystal substrate such as a silicon substrate is used, the height of the unevenness is several nm. When using an electric printed wiring board,
The height of the unevenness is several tens μm.
【００１１】接着剤層２０には、一般に用いられている
接着剤を用いることができる。ただし、接着剤層２０中
を光信号が透過する場合、屈折率を制御した光学接着剤
を用いることが望ましい。For the adhesive layer 20, a generally used adhesive can be used. However, when an optical signal is transmitted through the adhesive layer 20, it is desirable to use an optical adhesive whose refractive index is controlled.
【００１２】接着剤層２０に高い断熱性を有する材料を
用いることで、基板１０と光配線フィルム３０の熱伝導
を遮断することができる。ガラスウール、珪素土、石
綿、コルク等を混合した樹脂および発泡性樹脂を用いる
ことができるが、これに限定されるものではない。ま
た、接着剤中に中空フィラーなどの添加剤を混入するこ
とにより断熱性を向上させることもできる。By using a material having high heat insulating property for the adhesive layer 20, heat conduction between the substrate 10 and the optical wiring film 30 can be cut off. A resin mixed with glass wool, silicon earth, asbestos, cork and the like and a foamable resin can be used, but the present invention is not limited thereto. Further, by mixing an additive such as a hollow filler into the adhesive, the heat insulating property can be improved.
【００１３】接着剤層２０の層厚を、基板１０の凹凸以
上にすることで、該凹凸を解消し、接着剤層２０と光配
線フィルム３０の接着面を実質上平坦とすることができ
る。この場合、接着剤層２０が適当な流動性を有し、接
着剤層２０を硬化させた後この流動性を消滅させる。硬
化方法としては熱硬化型、光硬化型などの材料が存在す
るが、これに限定されるものではない。By setting the thickness of the adhesive layer 20 to be equal to or greater than the unevenness of the substrate 10, the unevenness can be eliminated and the adhesive surface between the adhesive layer 20 and the optical wiring film 30 can be made substantially flat. In this case, the adhesive layer 20 has an appropriate fluidity, and after the adhesive layer 20 is cured, the fluidity disappears. As the curing method, there are materials such as a thermosetting type and a photocuring type, but the present invention is not limited thereto.
【００１４】接着剤層２０は基板１０に塗工しても、光
配線フィルム３０に塗工してもよい。The adhesive layer 20 may be applied to the substrate 10 or the optical wiring film 30.
【００１５】光配線フィルム３０の端面を研磨すること
で、光接続部分の光損失を減少させることができる。ま
た、基板１０と光配線フィルム３０の接着工程は、光配
線フィルム３０の端面加工の後でもよいし、接着工程を
行った後、端面加工を行ってもよい。By polishing the end surface of the optical wiring film 30, light loss at the optical connection portion can be reduced. In addition, the bonding step between the substrate 10 and the optical wiring film 30 may be performed after the end face processing of the optical wiring film 30 or may be performed after the bonding step.
【００１６】同様の工程を繰り返すことにより、２層以
上の光配線フィルムの積層を行うことができる。By repeating the same steps, two or more optical wiring films can be laminated.
【００１７】[0017]
【実施例】以下に本発明を実施例をもって説明するが、
本発明がそれらに限定解釈されるものではない。また、
以下の記載では、光配線フィルムの積層数を１層として
説明するが、必ずしも１層である必要はない。また、以
下の記載では光配線をシングルモードとして説明する
が、必ずしもシングルモードである必要はない。EXAMPLES The present invention will be described below with reference to examples.
The present invention should not be construed as being limited thereto. Also,
In the following description, the number of laminations of the optical wiring film is described as one layer, but it is not necessarily required to be one layer. In the following description, the optical wiring is described as a single mode, but it is not necessarily required to be a single mode.
【００１８】＜実施例１＞まず、主材としてエピコート
828 （油化シェルエポキシ（株））を、硬化材としては
トリエチレンテトラミン(TETA)（和光純薬工業( 株) ）
を使用し、それらを重量比10：1 で混合することで接着
剤を調製した。Example 1 First, epicoat was used as the main material.
828 (Yukaka Epoxy Co., Ltd.), and triethylenetetramine (TETA) (Wako Pure Chemical Industries, Ltd.) as the curing agent
Was used to prepare an adhesive by mixing them in a weight ratio of 10: 1.
【００１９】図２の（ａ）に示すように、１５μm の表
面凹凸を有する電気基板４０上に、接着剤を、ドクター
ブレードを用いて塗工し、接着剤層５０を作成した。こ
のときの接着剤層５０の膜厚は２０μｍである。As shown in FIG. 2A, an adhesive was applied on an electric substrate 40 having a surface irregularity of 15 μm using a doctor blade to form an adhesive layer 50. At this time, the thickness of the adhesive layer 50 is 20 μm.
【００２０】図２の（ｂ）に示すように、接着剤層５０
上に、光配線フィルム６０（ＮＴＴアドバンステクノロ
ジ（株））を転写・積層した。As shown in FIG. 2B, the adhesive layer 50
The optical wiring film 60 (NTT Advanced Technology Co., Ltd.) was transferred and laminated thereon.
【００２１】基板全体を１００℃、１時間加熱し、接着
剤層５０を硬化させた。The entire substrate was heated at 100 ° C. for one hour to cure the adhesive layer 50.
【００２２】光配線フィルム６０の表面荒さを測定し、
平均表面荒さＲａが１μｍ以下であることを確認した。The surface roughness of the optical wiring film 60 is measured,
It was confirmed that the average surface roughness Ra was 1 μm or less.
【００２３】光配線フィルム６０に光信号を入光し、光
配線フィルム６０の光損失が、転写前後で変化しないこ
とを確認した。An optical signal was incident on the optical wiring film 60, and it was confirmed that the optical loss of the optical wiring film 60 did not change before and after the transfer.
【００２４】＜実施例２＞実施例１と同様の工程によ
り、接着剤を調製した。Example 2 An adhesive was prepared in the same manner as in Example 1.
【００２５】図３（ａ）に示すように、光配線フィルム
９０（ＮＴＴアドバンステクノロジ（株））に、接着剤
を、ドクターブレードを用いて塗工し、接着剤層８０を
作成した。このときの接着剤層８０の膜厚は２０μｍで
ある。As shown in FIG. 3A, an adhesive was applied to an optical wiring film 90 (NTT Advanced Technology Co., Ltd.) using a doctor blade to form an adhesive layer 80. At this time, the thickness of the adhesive layer 80 is 20 μm.
【００２６】図３（ｂ）に示すように、１５μm の表面
凹凸を有する電気基板７０上に、光配線フィルム９０
（ＮＴＴアドバンステクノロジ（株））と接着剤層８０
を、転写・積層した。As shown in FIG. 3B, an optical wiring film 90 is placed on an electric substrate 70 having a surface irregularity of 15 μm.
(NTT Advanced Technology Co., Ltd.) and adhesive layer 80
Was transferred and laminated.
【００２７】基板全体を１００℃、１時間加熱し、接着
剤層８０を硬化させた。The entire substrate was heated at 100 ° C. for one hour to cure the adhesive layer 80.
【００２８】光配線フィルム９０の表面荒さを測定し、
平均表面荒さＲａが１μｍ以下であることを確認した。The surface roughness of the optical wiring film 90 is measured,
It was confirmed that the average surface roughness Ra was 1 μm or less.
【００２９】光配線フィルム９０に光信号を入光し、光
配線フィルム９０の光損失が、転写前後で変化しないこ
とを確認した。An optical signal was incident on the optical wiring film 90, and it was confirmed that the optical loss of the optical wiring film 90 did not change before and after the transfer.
【００３０】＜実施例３＞まず、主材としてエピコート
828 （油化シェルエポキシ（株））を、硬化材としては
トリエチレンテトラミン(TETA)（和光純薬工業( 株) ）
を使用し、それらを重量比10：1 で混合し、フィラーと
してSUNSPHERE H-32（旭硝子（株））を３重量％添加す
ることで接着剤を調製した。<Embodiment 3> First, epicoat was used as the main material.
828 (Yukaka Epoxy Co., Ltd.), and triethylenetetramine (TETA) (Wako Pure Chemical Industries, Ltd.) as the curing agent
The mixture was mixed at a weight ratio of 10: 1, and 3% by weight of SUNSPHERE H-32 (Asahi Glass Co., Ltd.) was added as a filler to prepare an adhesive.
【００３１】図４（ａ）に示すように、光配線フィルム
１２０（ＮＴＴアドバンステクノロジ（株））に、接着
剤を、ドクターブレードを用いて塗工し、接着剤層１１
０を作成した。このときの接着剤層１１０の膜厚は２０
μｍである。As shown in FIG. 4A, an adhesive is applied to the optical wiring film 120 (NTT Advanced Technology Co., Ltd.) using a doctor blade, and an adhesive layer 11 is formed.
0 was created. At this time, the thickness of the adhesive layer 110 is 20
μm.
【００３２】図４（ｂ）に示すように、１５μm の表面
凹凸を有する電気基板１００上に、光配線フィルム１２
０（ＮＴＴアドバンステクノロジ（株））と接着剤層１
１０を、転写・積層した。As shown in FIG. 4B, an optical wiring film 12 is placed on an electric substrate 100 having a surface irregularity of 15 μm.
0 (NTT Advanced Technology Co., Ltd.) and adhesive layer 1
10 was transferred and laminated.
【００３３】基板全体を１００℃、１時間加熱し、接着
剤層１１０を硬化させた。The entire substrate was heated at 100 ° C. for 1 hour to cure the adhesive layer 110.
【００３４】光配線フィルム１２０の表面荒さを測定
し、平均表面荒さＲａが１μｍ以下であることを確認し
た。The surface roughness of the optical wiring film 120 was measured, and it was confirmed that the average surface roughness Ra was 1 μm or less.
【００３５】光配線フィルム１２０に光信号を入光し、
光配線フィルム１２０の光損失が、転写前後で変化しな
いことを確認した。An optical signal enters the optical wiring film 120,
It was confirmed that the light loss of the optical wiring film 120 did not change before and after the transfer.
【００３６】電気基板１００下面を１００℃に加熱した
際、光配線フィルム１２０の表面温度は５０℃であるこ
とを確認した。When the lower surface of the electric board 100 was heated to 100 ° C., it was confirmed that the surface temperature of the optical wiring film 120 was 50 ° C.
【００３７】[0037]
【発明の効果】本発明は、次のような効果がある。第１
に、下地となる基板の表面凹凸に関係なく、積層した光
配線フィルムが実質上平坦となる効果がある。これによ
り、光配線フィルムの光特性が向上し、下地となる支持
基板の選択範囲が広がる。The present invention has the following effects. First
In addition, there is an effect that the laminated optical wiring film becomes substantially flat regardless of the surface unevenness of the base substrate. As a result, the optical characteristics of the optical wiring film are improved, and the range of selection of the supporting substrate serving as the base is expanded.
【００３８】第２に、下地となる基板の温度を接着剤層
が遮断することで、光配線フィルムの温度が低温に保た
れる効果がある。これにより、光配線フィルムの光特性
が向上し、下地となる支持基板の使用温度範囲が広が
る。Second, there is an effect that the temperature of the optical wiring film is kept low by blocking the temperature of the substrate serving as a base with the adhesive layer. As a result, the optical characteristics of the optical wiring film are improved, and the operating temperature range of the supporting substrate serving as the base is widened.
【００３９】[0039]
【図１】本発明の光配線基板を垂直方向に切断する断面
図。FIG. 1 is a sectional view of an optical wiring board of the present invention cut in a vertical direction.
【図２】実施例１に係わる光配線基板の製造方法の説明
図。FIG. 2 is an explanatory diagram of the method for manufacturing the optical wiring board according to the first embodiment.
【図３】実施例２に係わる光配線基板の製造方法の説明
図。FIG. 3 is an explanatory diagram of a method for manufacturing an optical wiring board according to a second embodiment.
【図４】実施例３に係わる光配線基板の製造方法の説明
図。FIG. 4 is an explanatory diagram of a method for manufacturing an optical wiring board according to a third embodiment.
【符号の説明】 １０ 基板 ２０ 接着剤層 ３０ 光配線フィルム ４０ 電気基板 ５０ 接着剤層 ６０ 光配線フィルム ７０ 電気基板 ８０ 接着剤層 ９０ 光配線フィルム １００ 電気基板 １１０ 接着剤層 １２０ 光配線フィルムDESCRIPTION OF SYMBOLS 10 Substrate 20 Adhesive layer 30 Optical wiring film 40 Electric substrate 50 Adhesive layer 60 Optical wiring film 70 Electric substrate 80 Adhesive layer 90 Optical wiring film 100 Electric substrate 110 Adhesive layer 120 Optical wiring film
Claims (6)
基板において、該光配線層と、該光配線層を支持する支
持基板との間に接着剤層を有することを特徴とする光配
線基板。1. An optical wiring board having at least one optical wiring layer, comprising an adhesive layer between the optical wiring layer and a support substrate supporting the optical wiring layer. substrate.
上の厚みを持つことを特徴とする請求項１記載の光配線
基板。2. The optical wiring board according to claim 1, wherein the thickness of the adhesive layer is equal to or greater than the unevenness of the surface of the support substrate.
ることを特徴とする請求項１〜２の何れかに記載の光配
線基板。3. The optical wiring board according to claim 1, wherein an optical waveguide surface in the optical wiring layer is substantially flat.
する請求項１〜３の何れかに記載の光配線基板。4. The optical wiring board according to claim 1, wherein the adhesive layer has a heat insulating property.
光配線フィルムと、該光配線フィルムの一部もしくは全
面に塗布された接着層からなる転写媒体を支持基板上に
積層することを特徴とする光配線基板の製造方法。5. A method of laminating an optical wiring film comprising one or more optical wiring layers and a transfer medium comprising an adhesive layer applied to a part or the whole surface of the optical wiring film on a support substrate. A method for manufacturing an optical wiring board, which is characterized by the following.
光配線フィルムを、支持基板の一部もしくは全面に塗布
された接着層上に積層することを特徴とする光配線基板
の製造方法。6. A method for manufacturing an optical wiring board, comprising: laminating an optical wiring film comprising one or more optical wiring layers on an adhesive layer applied to a part or the whole surface of a support substrate. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2000208528A JP4691758B2 (en) | 2000-07-10 | 2000-07-10 | Optical wiring board and manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000208528A JP4691758B2 (en) | 2000-07-10 | 2000-07-10 | Optical wiring board and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002022987A true JP2002022987A (en) | 2002-01-23 |
| JP4691758B2 JP4691758B2 (en) | 2011-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000208528A Expired - Fee Related JP4691758B2 (en) | 2000-07-10 | 2000-07-10 | Optical wiring board and manufacturing method |
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| JP (1) | JP4691758B2 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4691758B2 (en) | 2011-06-01 |
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