JP2001200153A - Aromatic polycarbonate resin composition for conveying box - Google Patents
Aromatic polycarbonate resin composition for conveying boxInfo
- Publication number
- JP2001200153A JP2001200153A JP2000011911A JP2000011911A JP2001200153A JP 2001200153 A JP2001200153 A JP 2001200153A JP 2000011911 A JP2000011911 A JP 2000011911A JP 2000011911 A JP2000011911 A JP 2000011911A JP 2001200153 A JP2001200153 A JP 2001200153A
- Authority
- JP
- Japan
- Prior art keywords
- measurement point
- aromatic polycarbonate
- amount
- polycarbonate resin
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 37
- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 33
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 33
- 239000000203 mixture Substances 0.000 title claims abstract description 32
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000010439 graphite Substances 0.000 claims abstract description 33
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 22
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920000515 polycarbonate Polymers 0.000 abstract description 4
- 239000004417 polycarbonate Substances 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 72
- 238000000034 method Methods 0.000 description 26
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 20
- -1 cyclic carbonate compound Chemical class 0.000 description 18
- 229920000049 Carbon (fiber) Polymers 0.000 description 15
- 239000004917 carbon fiber Substances 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 238000002156 mixing Methods 0.000 description 12
- 150000002989 phenols Chemical class 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 9
- 238000005809 transesterification reaction Methods 0.000 description 9
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 239000001294 propane Substances 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 238000012696 Interfacial polycondensation Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 3
- WJZHBPSXJJQGJO-UHFFFAOYSA-N 4-[2,6-di(propan-2-yl)phenyl]phenol Chemical compound CC(C)C1=CC=CC(C(C)C)=C1C1=CC=C(O)C=C1 WJZHBPSXJJQGJO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CUAWUNQAIYJWQT-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxy-3,5-dimethylphenyl)ethyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C=2C=C(C)C(O)=C(C)C=2)C=2C=C(C)C(O)=C(C)C=2)=C1 CUAWUNQAIYJWQT-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 2
- VGFSOACUVJLBAA-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-3,3-dimethylbutan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C(C)(C)C)C1=CC=C(O)C=C1 VGFSOACUVJLBAA-UHFFFAOYSA-N 0.000 description 2
- KANXFMWQMYCHHH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-3-methylbutan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C(C)C)C1=CC=C(O)C=C1 KANXFMWQMYCHHH-UHFFFAOYSA-N 0.000 description 2
- VHLLJTHDWPAQEM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-4-methylpentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CC(C)C)C1=CC=C(O)C=C1 VHLLJTHDWPAQEM-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- MUCRFDZUHPMASM-UHFFFAOYSA-N bis(2-chlorophenyl) carbonate Chemical compound ClC1=CC=CC=C1OC(=O)OC1=CC=CC=C1Cl MUCRFDZUHPMASM-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- ZIRIVHVGOAIFRG-UHFFFAOYSA-N methyl 2-(2-carboxyoxyphenyl)benzoate Chemical compound COC(=O)C1=CC=CC=C1C1=CC=CC=C1OC(O)=O ZIRIVHVGOAIFRG-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- LKKLDKBWCWESPV-UHFFFAOYSA-N (2-phenylphenyl) hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC=C1C1=CC=CC=C1 LKKLDKBWCWESPV-UHFFFAOYSA-N 0.000 description 1
- OBMAJDVACJRVJY-UHFFFAOYSA-N (3-bromo-2-phenylphenyl) hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC(Br)=C1C1=CC=CC=C1 OBMAJDVACJRVJY-UHFFFAOYSA-N 0.000 description 1
- DQAROJXYWZUVDH-UHFFFAOYSA-N (3-chloro-2-phenylphenyl) hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC(Cl)=C1C1=CC=CC=C1 DQAROJXYWZUVDH-UHFFFAOYSA-N 0.000 description 1
- JOSARTKEJSZAIX-UHFFFAOYSA-N (3-nitro-2-phenylphenyl) hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC([N+]([O-])=O)=C1C1=CC=CC=C1 JOSARTKEJSZAIX-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- KICYRZIVKKYRFS-UHFFFAOYSA-N 2-(3,5-dihydroxyphenyl)benzene-1,3,5-triol Chemical compound OC1=CC(O)=CC(C=2C(=CC(O)=CC=2O)O)=C1 KICYRZIVKKYRFS-UHFFFAOYSA-N 0.000 description 1
- NFAOATPOYUWEHM-UHFFFAOYSA-N 2-(6-methylheptyl)phenol Chemical compound CC(C)CCCCCC1=CC=CC=C1O NFAOATPOYUWEHM-UHFFFAOYSA-N 0.000 description 1
- FDIPWBUDOCPIMH-UHFFFAOYSA-N 2-decylphenol Chemical compound CCCCCCCCCCC1=CC=CC=C1O FDIPWBUDOCPIMH-UHFFFAOYSA-N 0.000 description 1
- CYEJMVLDXAUOPN-UHFFFAOYSA-N 2-dodecylphenol Chemical compound CCCCCCCCCCCCC1=CC=CC=C1O CYEJMVLDXAUOPN-UHFFFAOYSA-N 0.000 description 1
- HMWIHOZPGQRZLR-UHFFFAOYSA-N 2-hexadecylphenol Chemical compound CCCCCCCCCCCCCCCCC1=CC=CC=C1O HMWIHOZPGQRZLR-UHFFFAOYSA-N 0.000 description 1
- QEMHBAGGYKJNSS-UHFFFAOYSA-N 2-icosylphenol Chemical compound CCCCCCCCCCCCCCCCCCCCC1=CC=CC=C1O QEMHBAGGYKJNSS-UHFFFAOYSA-N 0.000 description 1
- WCRKLZYTQVZTMM-UHFFFAOYSA-N 2-octadecylphenol Chemical compound CCCCCCCCCCCCCCCCCCC1=CC=CC=C1O WCRKLZYTQVZTMM-UHFFFAOYSA-N 0.000 description 1
- JOONSONEBWTBLT-UHFFFAOYSA-N 2-tetradecylphenol Chemical compound CCCCCCCCCCCCCCC1=CC=CC=C1O JOONSONEBWTBLT-UHFFFAOYSA-N 0.000 description 1
- OREKREJVUNVFJP-UHFFFAOYSA-N 2-triacontylphenol Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC1=CC=CC=C1O OREKREJVUNVFJP-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- UJCYBTZHUJWCMB-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-4-propan-2-ylcyclohexyl]phenol Chemical compound C1CC(C(C)C)CCC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UJCYBTZHUJWCMB-UHFFFAOYSA-N 0.000 description 1
- ZBMWIKZBITYTCF-UHFFFAOYSA-N 4-[2,3-di(propan-2-yl)phenyl]phenol Chemical compound CC(C)C1=CC=CC(C=2C=CC(O)=CC=2)=C1C(C)C ZBMWIKZBITYTCF-UHFFFAOYSA-N 0.000 description 1
- WCUDAIJOADOKAW-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)pentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCC)C1=CC=C(O)C=C1 WCUDAIJOADOKAW-UHFFFAOYSA-N 0.000 description 1
- RQTDWDATSAVLOR-UHFFFAOYSA-N 4-[3,5-bis(4-hydroxyphenyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC(C=2C=CC(O)=CC=2)=CC(C=2C=CC(O)=CC=2)=C1 RQTDWDATSAVLOR-UHFFFAOYSA-N 0.000 description 1
- NIRYBKWMEWFDPM-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-3-methylbutyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CCC1=CC=C(O)C=C1 NIRYBKWMEWFDPM-UHFFFAOYSA-N 0.000 description 1
- ZJNKCNFBTBFNMO-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-5,7-dimethyl-1-adamantyl]phenol Chemical compound C1C(C)(C2)CC(C3)(C)CC1(C=1C=CC(O)=CC=1)CC23C1=CC=C(O)C=C1 ZJNKCNFBTBFNMO-UHFFFAOYSA-N 0.000 description 1
- BOCLKUCIZOXUEY-UHFFFAOYSA-N 4-[tris(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 BOCLKUCIZOXUEY-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- KNDDEFBFJLKPFE-UHFFFAOYSA-N 4-n-Heptylphenol Chemical compound CCCCCCCC1=CC=C(O)C=C1 KNDDEFBFJLKPFE-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 101100160821 Bacillus subtilis (strain 168) yxdJ gene Proteins 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- BVMWIXWOIGJRGE-UHFFFAOYSA-N NP(O)=O Chemical compound NP(O)=O BVMWIXWOIGJRGE-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- DXIBCWGFAPSVRU-UHFFFAOYSA-N [2-(2-chlorophenyl)phenyl] hydrogen carbonate Chemical compound OC(=O)OC1=CC=CC=C1C1=CC=CC=C1Cl DXIBCWGFAPSVRU-UHFFFAOYSA-N 0.000 description 1
- 229920003232 aliphatic polyester Chemical group 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001341 alkaline earth metal compounds Chemical class 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical class ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical group C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- LUQQDEDMRRRWGN-UHFFFAOYSA-N bis(2-bromophenyl) carbonate Chemical compound BrC1=CC=CC=C1OC(=O)OC1=CC=CC=C1Br LUQQDEDMRRRWGN-UHFFFAOYSA-N 0.000 description 1
- DQPSUGZZTADITQ-UHFFFAOYSA-N bis(2-nitrophenyl) carbonate Chemical compound [O-][N+](=O)C1=CC=CC=C1OC(=O)OC1=CC=CC=C1[N+]([O-])=O DQPSUGZZTADITQ-UHFFFAOYSA-N 0.000 description 1
- LGXDMAUHWFVPKO-UHFFFAOYSA-N bis(2-phenylphenyl) carbonate Chemical compound C=1C=CC=C(C=2C=CC=CC=2)C=1OC(=O)OC1=CC=CC=C1C1=CC=CC=C1 LGXDMAUHWFVPKO-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- DEFZNQKDYOBMGU-UHFFFAOYSA-N decyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCOC(=O)C1=CC=CC=C1O DEFZNQKDYOBMGU-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QLVWOKQMDLQXNN-UHFFFAOYSA-N dibutyl carbonate Chemical compound CCCCOC(=O)OCCCC QLVWOKQMDLQXNN-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- ZOMIMPCSKRRCJI-UHFFFAOYSA-N docosyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O ZOMIMPCSKRRCJI-UHFFFAOYSA-N 0.000 description 1
- CJYBKFFVXWWBMY-UHFFFAOYSA-N dodecyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCOC(=O)C1=CC=CC=C1O CJYBKFFVXWWBMY-UHFFFAOYSA-N 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- BEGBSFPALGFMJI-UHFFFAOYSA-N ethene;sodium Chemical compound [Na].C=C BEGBSFPALGFMJI-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- TWNBPYIMMRIFEF-UHFFFAOYSA-N ethyl 2-(2-carboxyoxyphenyl)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1C1=CC=CC=C1OC(O)=O TWNBPYIMMRIFEF-UHFFFAOYSA-N 0.000 description 1
- ZQKQZBGDCHBTMC-UHFFFAOYSA-N ethyl 3-carboxyoxy-2-phenylbenzoate Chemical compound CCOC(=O)C1=CC=CC(OC(O)=O)=C1C1=CC=CC=C1 ZQKQZBGDCHBTMC-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 150000002291 germanium compounds Chemical class 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- NHLHASWXBVULGU-UHFFFAOYSA-N hexadecyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O NHLHASWXBVULGU-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000008235 industrial water Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- OMUKHBXIWYKOGL-UHFFFAOYSA-N methyl 3-carboxyoxy-2-phenylbenzoate Chemical compound COC(=O)C1=CC=CC(OC(O)=O)=C1C1=CC=CC=C1 OMUKHBXIWYKOGL-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 150000002908 osmium compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 150000004023 quaternary phosphonium compounds Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- IFYFNVDTVZKNBZ-UHFFFAOYSA-N tetradecyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O IFYFNVDTVZKNBZ-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- HTCCWYQPPPBLQT-UHFFFAOYSA-N triacontyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O HTCCWYQPPPBLQT-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004260 weight control Methods 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Containers Having Bodies Formed In One Piece (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気抵抗の制御さ
れた搬送箱用芳香族ポリカーボネート樹脂組成物に関す
る。更に詳しくは、耐衝撃性、剛性及び寸法精度に優
れ、かつ樹脂組成物の体積固有抵抗値がいわゆる制電領
域において一定の範囲に制御された搬送箱用芳香族ポリ
カーボネート樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aromatic polycarbonate resin composition for a transport box having a controlled electric resistance. More specifically, the present invention relates to an aromatic polycarbonate resin composition for a transport box, which is excellent in impact resistance, rigidity and dimensional accuracy, and in which the volume specific resistance value of the resin composition is controlled within a certain range in a so-called antistatic region.
【０００２】[0002]
【従来の技術】熱可塑性樹脂は、その製造、成形の容易
さのため、あらゆる産業において広く用いられている。
特に芳香族ポリカーボネート樹脂組成物は、一般に優れ
た電気絶縁性、耐熱性や耐衝撃性を示すことから、半導
体、電子回路基板等の電子部品や、各種エレクトロニク
ス機器、精密機器等の収納や搬送に用いられる容器等に
用いられることも多い。一般的に、芳香族ポリカーボネ
ート樹脂組成物の電子部品の用途に用いられる搬送箱に
対しては、より高い電気絶縁性が求められているのでは
あるが、実際に使われる際には、そのままでは搬送中に
帯電が起こり、塵埃の吸着のような不都合が生じる。ま
た環境によっては帯電がさらに進行し、静電気により電
子部品に対し電気的障害を与える場合すらある。2. Description of the Related Art Thermoplastic resins are widely used in all industries due to their ease of production and molding.
In particular, aromatic polycarbonate resin compositions generally exhibit excellent electrical insulation, heat resistance and impact resistance, and are therefore suitable for storing and transporting electronic components such as semiconductors and electronic circuit boards, various electronic devices, and precision devices. Often used for containers and the like used. In general, higher electrical insulation is required for a transport box used for electronic component applications of an aromatic polycarbonate resin composition, but when actually used, it is used as it is. Charging occurs during transport, causing inconvenience such as dust adsorption. Further, depending on the environment, the charging may further proceed, and the static electricity may even cause an electrical trouble to the electronic components.
【０００３】このような塵埃の吸着、電気的障害の防止
が特に必要とされる半導体部品製造等の分野において
は、通常は体積固有抵抗値で表わして１０13〜１０14Ω
・ｍ程度である熱可塑性樹脂を、何等かの手段を用いて
若干の導電性を付与し、いわゆる制電領域とされる１０
2〜１０9Ω・ｍ程度にする必要がある。かかる抵抗値の
樹脂組成物を得るために、有機系の帯電防止剤あるいは
導電性を有する樹脂を添加する方法、樹脂組成物にカー
ボンブラック、炭素繊維あるいは炭素フレーク、金属繊
維あるいは金属フレーク、導電性酸化チタン等の金属コ
ート繊維あるいは導電性マイカ等の金属コートフレーク
を添加する方法等が用いられてきた。[0003] In the field of manufacturing semiconductor components, which particularly require such adsorption of dust and prevention of electrical disturbance, usually 10 13 Ω to 10 14 Ω expressed as a volume resistivity.
The thermoplastic resin of about m is imparted with some conductivity by some means, and is used as a so-called antistatic region.
It needs to be about 2 to 10 9 Ω · m. In order to obtain a resin composition having such a resistance value, a method of adding an organic antistatic agent or a resin having conductivity, carbon black, carbon fiber or carbon flake, metal fiber or metal flake, conductive A method of adding a metal-coated fiber such as titanium oxide or a metal-coated flake such as conductive mica has been used.
【０００４】しかしながら、有機系の帯電防止剤や導電
性樹脂を用いた場合は、所望の抵抗値を得るために多量
の添加が必要となるため実用的でない。特に芳香族ポリ
カーボネート樹脂に代表される芳香族ポリエステル系樹
脂はイオン性の物質により分解されやすく、かつ高温の
加工温度が必要とされるため、更にかかる分解が促進さ
れやすいため好ましくない。However, when an organic antistatic agent or conductive resin is used, it is not practical because a large amount of addition is required to obtain a desired resistance value. Particularly, an aromatic polyester resin represented by an aromatic polycarbonate resin is not preferable because it is easily decomposed by an ionic substance and a high processing temperature is required.
【０００５】カーボンブラックの添加は熱可塑性樹脂に
対する導電性付与の一つの代表的な方法論であり、これ
については、例えば日本接着協会誌Ｖｏｌ．２３，Ｎ
ｏ．３，１０３〜１１１ページ（１９８７）の住田の総
説にこれまでの基礎研究の成果がまとめられている。確
かにカーボンブラックの添加によっても容易に導電性を
付与することはできるが、実際にはそれが強力な導電性
を有することと粉体であることから、分散性を高くする
と電気の導通状態を段階的に高くすることが難しく、添
加量がある程度を超えると急激に導電性が上昇する。そ
のため、カーボンブラックを用いることによっては、１
０2〜１０9Ω・ｍ程度の微弱な導電性を有する熱可塑性
樹脂組成物またはその成形体を高い生産性で製造するこ
とは極めて難しい。The addition of carbon black is one of the typical methodologies for imparting conductivity to a thermoplastic resin, and is described in, for example, Vol. 23, N
o. Sumida's review on pages 3, 103-111 (1987) summarizes the results of basic research so far. Certainly, conductivity can be easily imparted by adding carbon black, but in fact, since it has strong conductivity and is a powder, if the dispersibility is increased, the electrical conduction state will be increased. It is difficult to increase stepwise, and when the amount exceeds a certain amount, the conductivity sharply increases. Therefore, by using carbon black,
It is extremely difficult to produce a thermoplastic resin composition having a weak electrical conductivity of about 0 2 to 10 9 Ω · m or a molded article thereof with high productivity.
【０００６】また従来から機械的物性向上を考慮して使
用されてきた炭素繊維、金属繊維あるいは金属フレー
ク、導電性酸化チタン等の金属コート繊維あるいは導電
性マイカ等の金属コートフレーク、等の導電性フィラー
は、電気抵抗が低く、所望の抵抗値を得るために配合量
を少ない範囲としなければならず、わずかな配合量のズ
レによる抵抗値への影響が大きく、ロット間の抵抗値の
バラツキが大きくなり、実際的でない。In addition, conductive materials such as carbon fibers, metal fibers or metal flakes, metal-coated fibers such as conductive titanium oxide or metal-coated flakes such as conductive mica, which have been conventionally used in consideration of improving mechanical properties. The filler has a low electric resistance, and the compounding amount must be within a small range in order to obtain a desired resistance value.A slight deviation of the compounding amount has a large effect on the resistance value, and variation in the resistance value between lots. Large and impractical.
【０００７】かかる問題点の解決策として、特定の体積
固有抵抗値を有する炭素繊維を添加させる方法が複数提
案されている。特開平５−１１７４４６号公報では、体
積固有抵抗値が１０-5Ω・ｍオーダーである炭素繊維を
作成後、炭素繊維の表面を酸化させることにより、体積
固有抵抗値を高めた炭素繊維を作成し、かかる炭素繊維
を熱可塑性樹脂に配合する方法が具体的に開示されてい
る。また特開平７−２２８７０７号公報には、８００℃
未満の温度で短時間焼成することにより体積固有抵抗値
を高めた炭素繊維を作成し、かかる炭素繊維を樹脂に配
合する方法が具体的に開示されている。しかしながら、
炭素繊維は異方性が高いため成形品の形状によっては成
形品の反りや寸法精度が問題になる場合がある。搬送箱
に反り等が発生した場合、搬送中に部品の特定部位へ曲
げ、引張りや圧縮などの負荷がかかることになり特に精
密な部品については改良が求められている。As a solution to such a problem, there have been proposed a plurality of methods for adding carbon fibers having a specific volume resistivity. In Japanese Patent Application Laid-Open No. 5-117446, after a carbon fiber having a volume resistivity value of the order of 10 −5 Ω · m is produced, a carbon fiber having an increased volume resistivity value is produced by oxidizing the surface of the carbon fiber. A method of blending such a carbon fiber with a thermoplastic resin is specifically disclosed. Also, Japanese Patent Application Laid-Open No. 7-228707 discloses that 800 ° C.
There is specifically disclosed a method of producing carbon fibers having an increased volume specific resistance value by firing for a short time at a temperature lower than the above, and blending such carbon fibers with a resin. However,
Since carbon fibers have high anisotropy, warping and dimensional accuracy of the molded article may become a problem depending on the shape of the molded article. When a warp or the like occurs in a transport box, a load such as bending, tension, or compression is applied to a specific part of the component during transport, and improvement is required particularly for a precise component.
【０００８】反りを低減させる方法として、特開平１０
−２３７３１６号公報には炭素繊維の異方性改良を目的
として、炭素繊維とともに特定粒径の鱗状黒鉛を配合す
る方法が開示されているが、上記問題に対して十分対応
できているとはいえない。As a method for reducing the warpage, Japanese Patent Laid-Open No.
Japanese Unexamined Patent Publication No. 237316 discloses a method of blending scaly graphite having a specific particle size together with carbon fibers for the purpose of improving the anisotropy of carbon fibers. Absent.
【０００９】鱗状黒鉛を配合して組成物の導電性を制御
する試みが特開昭６０−１２４２４７号公報などに開示
されている。しかし、搬送箱は繰り返しの使用に耐え得
ることも必要とされるため、搬送中の落下や激突に対し
て十分な耐衝撃性も要求されている。かかる点でも芳香
族ポリカーボネート樹脂の使用が好ましく行われてい
る。しかしながら、鱗状黒鉛の配合は芳香族ポリカーボ
ネート樹脂の耐衝撃性を低下させる方向にあり、体積固
有抵抗値との両立を十分に図ることが求められている。
かかる点において特開昭６０−１２４２４７号公報に記
載された提案は、この種の考慮が十分とは言えなかっ
た。An attempt to control the conductivity of the composition by blending scaly graphite is disclosed in JP-A-60-124247. However, since the transport box is also required to be able to withstand repeated use, it is required to have sufficient impact resistance against a drop or collision during transport. In this respect, the use of an aromatic polycarbonate resin is preferably performed. However, the blending of the scale graphite tends to lower the impact resistance of the aromatic polycarbonate resin, and it is required to sufficiently achieve compatibility with the volume resistivity.
In this respect, the proposal described in Japanese Patent Application Laid-Open No. Sho 60-124247 does not sufficiently consider this kind of consideration.
【００１０】また、重量物を搬送する場合、搬送箱は適
度な剛性を有していなければ搬送箱は搬送物の重みによ
り撓みが生じ、搬送箱に変形が生じるので、搬送箱用組
成物には適度な剛性が要求されている。特開平１０−２
３７３１６号公報には鱗状黒鉛を添加することにより剛
性が向上することが開示されているが、その組成物が示
す電気抵抗は制電領域に制御されていない。In the case of transporting a heavy object, if the transport box does not have appropriate rigidity, the transport box is bent by the weight of the transported object, and the transport box is deformed. Requires moderate rigidity. JP-A-10-2
No. 37316 discloses that the addition of scaly graphite improves rigidity, but the electrical resistance of the composition is not controlled in the antistatic region.
【００１１】[0011]
【発明が解決しようとする課題】本発明は、鱗状黒鉛を
使用する組成物の体積固有抵抗値がいわゆる制電領域に
おいて一定の範囲に安定に制御され、良好な耐衝撃性、
剛性及び寸法精度を示す搬送箱用芳香族ポリカーボネー
ト樹脂組成物を提供することを目的とする。DISCLOSURE OF THE INVENTION The present invention provides a composition using scaly graphite in which the volume resistivity is stably controlled within a certain range in a so-called antistatic region, and the composition has good impact resistance,
An object of the present invention is to provide an aromatic polycarbonate resin composition for a transport box, which exhibits rigidity and dimensional accuracy.
【００１２】本発明者は、上記の従来技術の問題点に鑑
み、鋭意検討した結果、特定範囲の鱗状黒鉛含有量の場
合には、特定の平均粒径の鱗状黒鉛を使用し、同時にト
リメチルホスフェートを含むと、組成物の体積固有抵抗
値を一定の範囲に制御しつつ、良好な耐衝撃性を達成し
得ることを見出し、更に検討を重ねた結果本発明に到達
した。The inventor of the present invention has conducted intensive studies in view of the above-mentioned problems of the prior art. As a result, in the case of a specific range of the content of flaky graphite, flaky graphite having a specific average particle size is used, and trimethyl phosphate is simultaneously used. It has been found that, when the composition contains, a good impact resistance can be achieved while controlling the volume specific resistance value of the composition within a certain range. As a result of further studies, the present invention has been achieved.
【００１３】本発明は、芳香族ポリカーボネート樹脂
（Ａ成分）６５〜８５重量部と平均粒径が２００〜４０
０μｍである鱗状黒鉛（Ｂ成分）１５〜３５重量部の合
計１００重量部、およびトリメチルホスフェート（Ｃ成
分）０．００１〜２重量部からなる、体積固有抵抗値が
１０2〜１０9Ω・ｍの電気抵抗に制御された搬送箱用芳
香族ポリカーボネート樹脂組成物に係るものである。According to the present invention, the aromatic polycarbonate resin (component A) has an average particle diameter of 65 to 85 parts by weight and an average particle diameter of 200 to 40.
A volume specific resistance value of 10 2 to 10 9 Ω · m, which is composed of a total of 100 parts by weight of 15 to 35 parts by weight of scale graphite (component B) of 0 μm and 0.001 to 2 parts by weight of trimethyl phosphate (component C). The present invention relates to an aromatic polycarbonate resin composition for a transport box controlled by the electric resistance of the present invention.
【００１４】[0014]
【課題を解決するための手段】本発明のＡ成分である芳
香族ポリカーボネート樹脂は、通常二価フェノールとカ
ーボネート前駆体とを界面重縮合法、溶融エステル交換
法で反応させて得られたものの他、カーボネートプレポ
リマーを固相エステル交換法により重合させたもの、ま
たは環状カーボネート化合物の開環重合法により重合さ
せて得られるものである。Means for Solving the Problems The aromatic polycarbonate resin which is the component A of the present invention is usually obtained by reacting a dihydric phenol with a carbonate precursor by an interfacial polycondensation method or a melt transesterification method. And those obtained by polymerizing a carbonate prepolymer by a solid-phase transesterification method or by polymerizing a cyclic carbonate compound by a ring-opening polymerization method.
【００１５】本発明で使用するＡ成分の芳香族ポリカー
ボネート樹脂とは、通常二価フェノールとカーボネート
前駆体とを界面重縮合法、溶融エステル交換法で反応さ
せて得られたものの他、カーボネートプレポリマーを固
相エステル交換法により重合させたもの、または環状カ
ーボネート化合物の開環重合法により重合させて得られ
るものである。The aromatic polycarbonate resin of the component A used in the present invention may be a resin obtained by reacting a dihydric phenol with a carbonate precursor by an interfacial polycondensation method or a melt transesterification method, or a carbonate prepolymer. Is obtained by polymerizing the compound by a solid phase transesterification method, or obtained by polymerizing the compound by a ring opening polymerization method of a cyclic carbonate compound.
【００１６】ここで使用される二価フェノールの代表的
な例としては、ハイドロキノン、レゾルシノール、４，
４’−ジヒドロキシジフェニル、ビス（４−ヒドロキシ
フェニル）メタン、ビス｛（４−ヒドロキシ−３，５−
ジメチル）フェニル｝メタン、１，１−ビス（４−ヒド
ロキシフェニル）エタン、１，１−ビス（４−ヒドロキ
シフェニル）−１−フェニルエタン、２，２−ビス（４
−ヒドロキシフェニル）プロパン（通称ビスフェノール
Ａ）、２，２−ビス｛（４−ヒドロキシ−３−メチル）
フェニル｝プロパン、２，２−ビス｛（４−ヒドロキシ
−３，５−ジメチル）フェニル｝プロパン、２，２−ビ
ス｛（３−イソプロピル−４−ヒドロキシ）フェニル｝
プロパン、２，２−ビス｛（４−ヒドロキシ−３−フェ
ニル）フェニル｝プロパン、２，２−ビス（４−ヒドロ
キシフェニル）ブタン、２，２−ビス（４−ヒドロキシ
フェニル）−３−メチルブタン、２，２−ビス（４−ヒ
ドロキシフェニル）−３，３−ジメチルブタン、２，４
−ビス（４−ヒドロキシフェニル）−２−メチルブタ
ン、２，２−ビス（４−ヒドロキシフェニル）ペンタ
ン、２，２−ビス（４−ヒドロキシフェニル）−４−メ
チルペンタン、１，１−ビス（４−ヒドロキシフェニ
ル）シクロヘキサン、１，１−ビス（４−ヒドロキシフ
ェニル）−４−イソプロピルシクロヘキサン、１，１−
ビス（４−ヒドロキシフェニル）−３，３，５−トリメ
チルシクロヘキサン、９，９−ビス（４−ヒドロキシフ
ェニル）フルオレン、９，９−ビス｛（４−ヒドロキシ
−３−メチル）フェニル｝フルオレン、α，α’−ビス
（４−ヒドロキシフェニル）−ｏ−ジイソプロピルベン
ゼン、α，α’−ビス（４−ヒドロキシフェニル）−ｍ
−ジイソプロピルベンゼン、α，α’−ビス（４−ヒド
ロキシフェニル）−ｐ−ジイソプロピルベンゼン、１，
３−ビス（４−ヒドロキシフェニル）−５，７−ジメチ
ルアダマンタン、４，４’−ジヒドロキシジフェニルス
ルホン、４，４’−ジヒドロキシジフェニルスルホキシ
ド、４，４’−ジヒドロキシジフェニルスルフィド、
４，４’−ジヒドロキシジフェニルケトン、４，４’−
ジヒドロキシジフェニルエーテルおよび４，４’−ジヒ
ドロキシジフェニルエステル等が挙げられ、これらは単
独または２種以上を混合して使用できる。Representative examples of the dihydric phenol used here include hydroquinone, resorcinol, 4,4
4'-dihydroxydiphenyl, bis (4-hydroxyphenyl) methane, bis {(4-hydroxy-3,5-
Dimethyl) phenyl @ methane, 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 2,2-bis (4
-Hydroxyphenyl) propane (commonly known as bisphenol A), 2,2-bis} (4-hydroxy-3-methyl)
Phenyl {propane, 2,2-bis {(4-hydroxy-3,5-dimethyl) phenyl} propane, 2,2-bis {(3-isopropyl-4-hydroxy) phenyl}
Propane, 2,2-bis {(4-hydroxy-3-phenyl) phenyl} propane, 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) -3-methylbutane, 2,2-bis (4-hydroxyphenyl) -3,3-dimethylbutane, 2,4
-Bis (4-hydroxyphenyl) -2-methylbutane, 2,2-bis (4-hydroxyphenyl) pentane, 2,2-bis (4-hydroxyphenyl) -4-methylpentane, 1,1-bis (4 -Hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -4-isopropylcyclohexane, 1,1-
Bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane, 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis {(4-hydroxy-3-methyl) phenyl} fluorene, α , Α'-bis (4-hydroxyphenyl) -o-diisopropylbenzene, α, α'-bis (4-hydroxyphenyl) -m
-Diisopropylbenzene, α, α'-bis (4-hydroxyphenyl) -p-diisopropylbenzene, 1,
3-bis (4-hydroxyphenyl) -5,7-dimethyladamantane, 4,4′-dihydroxydiphenylsulfone, 4,4′-dihydroxydiphenylsulfoxide, 4,4′-dihydroxydiphenylsulfide,
4,4'-dihydroxydiphenyl ketone, 4,4'-
Examples thereof include dihydroxydiphenyl ether and 4,4′-dihydroxydiphenyl ester, and these can be used alone or in combination of two or more.
【００１７】なかでもビスフェノールＡ、２，２−ビス
｛（４−ヒドロキシ−３−メチル）フェニル｝プロパ
ン、２，２−ビス（４−ヒドロキシフェニル）ブタン、
２，２−ビス（４−ヒドロキシフェニル）−３−メチル
ブタン、２，２−ビス（４−ヒドロキシフェニル）−
３，３−ジメチルブタン、２，２−ビス（４−ヒドロキ
シフェニル）−４−メチルペンタン、１，１−ビス（４
−ヒドロキシフェニル）−３，３，５−トリメチルシク
ロヘキサンおよびα，α’−ビス（４−ヒドロキシフェ
ニル）−ｍ−ジイソプロピルベンゼンからなる群より選
ばれた少なくとも１種のビスフェノールより得られる単
独重合体または共重合体が好ましく、更に、ビスフェノ
ールＡの単独重合体および１，１−ビス（４−ヒドロキ
シフェニル）−３，３，５−トリメチルシクロヘキサン
とビスフェノールＡ、２，２−ビス｛（４−ヒドロキシ
−３−メチル）フェニル｝プロパンまたはα，α’−ビ
ス（４−ヒドロキシフェニル）−ｍ−ジイソプロピルベ
ンゼンとの共重合体が好ましく使用される。特にビスフ
ェノールＡの単独重合体が好ましい。Bisphenol A, 2,2-bis {(4-hydroxy-3-methyl) phenyl} propane, 2,2-bis (4-hydroxyphenyl) butane,
2,2-bis (4-hydroxyphenyl) -3-methylbutane, 2,2-bis (4-hydroxyphenyl)-
3,3-dimethylbutane, 2,2-bis (4-hydroxyphenyl) -4-methylpentane, 1,1-bis (4
A homopolymer obtained from at least one bisphenol selected from the group consisting of -hydroxyphenyl) -3,3,5-trimethylcyclohexane and α, α'-bis (4-hydroxyphenyl) -m-diisopropylbenzene, or Copolymers are preferred, and furthermore, bisphenol A homopolymer and 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane and bisphenol A, 2,2-bis {(4-hydroxy- Copolymers with 3-methyl) phenyl} propane or α, α′-bis (4-hydroxyphenyl) -m-diisopropylbenzene are preferably used. In particular, a homopolymer of bisphenol A is preferred.
【００１８】カーボネート前駆体としてはカルボニルハ
ライド、カーボネートエステルまたはハロホルメート等
が使用され、具体的にはホスゲン、ジフェニルカーボネ
ートまたは二価フェノールのジハロホルメート等が挙げ
られる。As the carbonate precursor, carbonyl halide, carbonate ester, haloformate and the like are used, and specific examples include phosgene, diphenyl carbonate and dihaloformate of dihydric phenol.
【００１９】上記二価フェノールとカーボネート前駆体
を界面重縮合法または溶融エステル交換法によって反応
させて芳香族ポリカーボネート樹脂を製造するに当って
は、必要に応じて触媒、末端停止剤、二価フェノールの
酸化防止剤等を使用してもよい。また芳香族ポリカーボ
ネート樹脂は三官能以上の多官能性芳香族化合物を共重
合した分岐ポリカーボネート樹脂であっても、芳香族ま
たは脂肪族の二官能性カルボン酸を共重合したポリエス
テルカーボネート樹脂であってもよく、また、得られた
芳香族ポリカーボネート樹脂の２種以上を混合した混合
物であってもよい。In producing the aromatic polycarbonate resin by reacting the dihydric phenol with the carbonate precursor by an interfacial polycondensation method or a melt transesterification method, if necessary, a catalyst, a terminal stopper, a dihydric phenol, May be used. The aromatic polycarbonate resin may be a branched polycarbonate resin obtained by copolymerizing a trifunctional or higher polyfunctional aromatic compound, or a polyester carbonate resin obtained by copolymerizing an aromatic or aliphatic bifunctional carboxylic acid. Alternatively, a mixture of two or more of the obtained aromatic polycarbonate resins may be used.
【００２０】三官能以上の多官能性芳香族化合物として
は、フロログルシン、フロログルシド、または４，６−
ジメチル−２，４，６−トリス（４−ヒドロキジフェニ
ル）ヘプテン−２、２，４，６−トリメチル−２，４，
６−トリス（４−ヒドロキシフェニル）ヘプタン、１，
３，５−トリス（４−ヒドロキシフェニル）ベンゼン、
１，１，１−トリス（４−ヒドロキシフェニル）エタ
ン、１，１，１−トリス（３，５−ジメチル−４−ヒド
ロキシフェニル）エタン、２，６−ビス（２−ヒドロキ
シ−５−メチルベンジル）−４−メチルフェノール、４
−｛４−［１，１−ビス（４−ヒドロキシフェニル）エ
チル］ベンゼン｝−α，α−ジメチルベンジルフェノー
ル等のトリスフェノール、テトラ（４−ヒドロキシフェ
ニル）メタン、ビス（２，４−ジヒドロキシフェニル）
ケトン、１，４−ビス（４，４−ジヒドロキシトリフェ
ニルメチル）ベンゼン、またはトリメリット酸、ピロメ
リット酸、ベンゾフェノンテトラカルボン酸およびこれ
らの酸クロライド等が挙げられ、中でも１，１，１−ト
リス（４−ヒドロキシフェニル）エタン、１，１，１−
トリス（３，５−ジメチル−４−ヒドロキシフェニル）
エタンが好ましく、特に１，１，１−トリス（４−ヒド
ロキシフェニル）エタンが好ましい。Examples of the trifunctional or higher polyfunctional aromatic compound include phloroglucin, phloroglucid, and 4,6-
Dimethyl-2,4,6-tris (4-hydroxydiphenyl) heptene-2,2,4,6-trimethyl-2,4
6-tris (4-hydroxyphenyl) heptane, 1,
3,5-tris (4-hydroxyphenyl) benzene,
1,1,1-tris (4-hydroxyphenyl) ethane, 1,1,1-tris (3,5-dimethyl-4-hydroxyphenyl) ethane, 2,6-bis (2-hydroxy-5-methylbenzyl) ) -4-Methylphenol, 4
-{4- [1,1-bis (4-hydroxyphenyl) ethyl] benzene} -α, α-dimethylbenzylphenol and other trisphenols, tetra (4-hydroxyphenyl) methane, bis (2,4-dihydroxyphenyl) )
Examples thereof include ketone, 1,4-bis (4,4-dihydroxytriphenylmethyl) benzene, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, and acid chlorides thereof, among which 1,1,1-tris (4-hydroxyphenyl) ethane, 1,1,1-
Tris (3,5-dimethyl-4-hydroxyphenyl)
Ethane is preferred, and 1,1,1-tris (4-hydroxyphenyl) ethane is particularly preferred.
【００２１】かかる分岐ポリカーボネート樹脂を生ずる
多官能性化合物を含む場合、かかる割合は、芳香族ポリ
カーボネート全量中、０．００１〜１モル％、好ましく
は０．００５〜０．５モル％、特に好ましくは０．０１
〜０．３モル％である。また特に溶融エステル交換法の
場合、副反応として分岐構造が生ずる場合があるが、か
かる分岐構造量についても、芳香族ポリカーボネート全
量中、０．００１〜１モル％、好ましくは０．００５〜
０．５モル％、特に好ましくは０．０１〜０．３モル％
であるものが好ましい。尚、かかる割合については1Ｈ
−ＮＭＲ測定により算出することが可能である。When a polyfunctional compound which produces such a branched polycarbonate resin is contained, the proportion is 0.001 to 1 mol%, preferably 0.005 to 0.5 mol%, particularly preferably 0.001 mol%, based on the total amount of the aromatic polycarbonate. 0.01
~ 0.3 mol%. In addition, particularly in the case of the melt transesterification method, a branched structure may be generated as a side reaction, and the amount of such a branched structure is also 0.001 to 1 mol%, preferably 0.005 to 5 mol%, of the total amount of the aromatic polycarbonate.
0.5 mol%, particularly preferably 0.01 to 0.3 mol%
Is preferred. The ratio is 1 H
-It can be calculated by NMR measurement.
【００２２】界面重縮合法による反応は、通常二価フェ
ノールとホスゲンとの反応であり、酸結合剤および有機
溶媒の存在下に反応させる。酸結合剤としては、例えば
水酸化ナトリウム、水酸化カリウム等のアルカリ金属水
酸化物またはピリジン等のアミン化合物が用いられる。
有機溶媒としては、例えば塩化メチレン、クロロベンゼ
ン等のハロゲン化炭化水素が用いられる。また、反応促
進のために例えばトリエチルアミン、テトラ−ｎ−ブチ
ルアンモニウムブロマイド、テトラ−ｎ−ブチルホスホ
ニウムブロマイド等の第三級アミン、第四級アンモニウ
ム化合物、第四級ホスホニウム化合物等の触媒を用いる
こともできる。その際、反応温度は通常０〜４０℃、反
応時間は１０分〜５時間程度、反応中のｐＨは９以上に
保つのが好ましい。The reaction by the interfacial polycondensation method is usually a reaction between dihydric phenol and phosgene, and is carried out in the presence of an acid binder and an organic solvent. As the acid binder, for example, an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide or an amine compound such as pyridine is used.
As the organic solvent, for example, halogenated hydrocarbons such as methylene chloride and chlorobenzene are used. Further, for promoting the reaction, for example, a catalyst such as a tertiary amine such as triethylamine, tetra-n-butylammonium bromide, or tetra-n-butylphosphonium bromide, a quaternary ammonium compound, or a quaternary phosphonium compound may be used. it can. At that time, the reaction temperature is usually 0 to 40 ° C., the reaction time is preferably about 10 minutes to 5 hours, and the pH during the reaction is preferably maintained at 9 or more.
【００２３】また、かかる重合反応において、通常末端
停止剤が使用される。かかる末端停止剤として単官能フ
ェノール類を使用することができる。単官能フェノール
類は末端停止剤として分子量調節のために一般的に使用
され、また得られた芳香族ポリカーボネート樹脂は、末
端が単官能フェノール類に基づく基によって封鎖されて
いるので、そうでないものと比べて熱安定性に優れてい
る。かかる単官能フェノール類としては、一般にはフェ
ノールまたは低級アルキル置換フェノールであって、下
記一般式（１）で表される単官能フェノール類を示すこ
とができる。In such a polymerization reaction, a terminal stopper is usually used. Monofunctional phenols can be used as such a terminal stopper. Monofunctional phenols are commonly used as molecular terminators for molecular weight control, and the resulting aromatic polycarbonate resins are not terminated because the ends are blocked by groups based on monofunctional phenols. Excellent in thermal stability. Such a monofunctional phenol is generally a phenol or a lower alkyl-substituted phenol, and may be a monofunctional phenol represented by the following general formula (1).
【００２４】[0024]
【化１】 Embedded image
【００２５】（式中、Ａは水素原子または炭素数１〜９
の直鎖または分岐のアルキル基あるいはフェニル基置換
アルキル基であり、ｒは１〜５、好ましくは１〜３の整
数である。）(Wherein A is a hydrogen atom or a carbon number of 1 to 9)
Is a linear or branched alkyl group or a phenyl group-substituted alkyl group, and r is an integer of 1 to 5, preferably 1 to 3. )
【００２６】上記単官能フェノール類の具体例として
は、例えばフェノール、ｐ−ｔｅｒｔ−ブチルフェノー
ル、ｐ−クミルフェノールおよびイソオクチルフェノー
ルが挙げられる。Specific examples of the above monofunctional phenols include phenol, p-tert-butylphenol, p-cumylphenol and isooctylphenol.
【００２７】また、他の単官能フェノール類としては、
長鎖のアルキル基あるいは脂肪族ポリエステル基を置換
基として有するフェノール類または安息香酸クロライド
類、もしくは長鎖のアルキルカルボン酸クロライド類も
示すことができる。これらのなかでは、下記一般式
（２）および（３）で表される長鎖のアルキル基を置換
基として有するフェノール類が好ましく使用される。Further, other monofunctional phenols include:
Phenols or benzoic acid chlorides having a long-chain alkyl group or aliphatic polyester group as a substituent, or long-chain alkylcarboxylic acid chlorides can also be used. Among these, phenols having a long-chain alkyl group represented by the following general formulas (2) and (3) as a substituent are preferably used.
【００２８】[0028]
【化２】 Embedded image
【００２９】[0029]
【化３】 Embedded image
【００３０】（式中、Ｘは−Ｒ−Ｏ−、−Ｒ−ＣＯ−Ｏ
−または−Ｒ−Ｏ−ＣＯ−である、ここでＲは単結合ま
たは炭素数１〜１０、好ましくは１〜５の二価の脂肪族
炭化水素基を示し、ｎは１０〜５０の整数を示す。）(Wherein X is -RO-, -R-CO-O
— Or —RO—CO—, wherein R represents a single bond or a divalent aliphatic hydrocarbon group having 1 to 10, preferably 1 to 5 carbon atoms, and n represents an integer of 10 to 50. Show. )
【００３１】かかる一般式（２）の置換フェノール類と
してはｎが１０〜３０、特に１０〜２６のものが好まし
く、その具体例としては例えばデシルフェノール、ドデ
シルフェノール、テトラデシルフェノール、ヘキサデシ
ルフェノール、オクタデシルフェノール、エイコシルフ
ェノール、ドコシルフェノールおよびトリアコンチルフ
ェノール等を挙げることができる。As the substituted phenols of the general formula (2), those having n of 10 to 30, especially 10 to 26 are preferred. Specific examples thereof include, for example, decylphenol, dodecylphenol, tetradecylphenol, hexadecylphenol, Octadecylphenol, eicosylphenol, docosylphenol, triacontylphenol and the like can be mentioned.
【００３２】また、一般式（３）の置換フェノール類と
してはＸが−Ｒ−ＣＯ−Ｏ−であり、Ｒが単結合である
化合物が適当であり、ｎが１０〜３０、特に１０〜２６
のものが好適であって、その具体例としては例えばヒド
ロキシ安息香酸デシル、ヒドロキシ安息香酸ドデシル、
ヒドロキシ安息香酸テトラデシル、ヒドロキシ安息香酸
ヘキサデシル、ヒドロキシ安息香酸エイコシル、ヒドロ
キシ安息香酸ドコシルおよびヒドロキシ安息香酸トリア
コンチルが挙げられる。As the substituted phenols of the general formula (3), compounds wherein X is -R-CO-O- and R is a single bond are suitable, and n is 10-30, especially 10-26.
Are preferred, and specific examples thereof include, for example, decyl hydroxybenzoate, dodecyl hydroxybenzoate,
Examples include tetradecyl hydroxybenzoate, hexadecyl hydroxybenzoate, eicosyl hydroxybenzoate, docosyl hydroxybenzoate and triacontyl hydroxybenzoate.
【００３３】末端停止剤は、得られた芳香族ポリカーボ
ネート樹脂の全末端に対して少くとも５モル％、好まし
くは少くとも１０モル％末端に導入されることが望まし
い。より好ましくは全末端に対して末端停止剤が８０モ
ル％以上導入されること、すなわち二価フェノールに由
来する末端の水酸基（ＯＨ基）が２０モル％以下である
ことがより好ましく、特に好ましくは全末端に対して末
端停止剤が９０モル％以上導入されること、すなわちＯ
Ｈ基が１０モル％以下の場合である。また、末端停止剤
は単独でまたは２種以上混合して使用してもよい。It is desirable that the terminal terminator is introduced at least at 5 mol%, preferably at least 10 mol%, based on all terminals of the obtained aromatic polycarbonate resin. More preferably, the terminal terminator is introduced in an amount of 80 mol% or more with respect to all terminals, that is, the terminal hydroxyl group (OH group) derived from dihydric phenol is more preferably 20 mol% or less, and particularly preferably. 90 mol% or more of a terminator is introduced to all terminals, that is, O
This is the case when the H group is 10 mol% or less. Further, the terminal stoppers may be used alone or in combination of two or more.
【００３４】溶融エステル交換法による反応は、通常二
価フェノールとカーボネートエステルとのエステル交換
反応であり、不活性ガスの存在下に二価フェノールとカ
ーボネートエステルとを加熱しながら混合して、生成す
るアルコールまたはフェノールを留出させる方法により
行われる。反応温度は生成するアルコールまたはフェノ
ールの沸点等により異なるが、通常１２０〜３５０℃の
範囲である。反応後期には系を１．３３×１０3〜１
３．３Ｐａ程度に減圧して生成するアルコールまたはフ
ェノールの留出を容易にさせる。反応時間は通常１〜４
時間程度である。The reaction by the melt transesterification method is usually a transesterification reaction between a dihydric phenol and a carbonate ester, and is produced by mixing the dihydric phenol and the carbonate ester while heating in the presence of an inert gas. It is performed by a method of distilling alcohol or phenol. The reaction temperature varies depending on the boiling point of the produced alcohol or phenol, but is usually in the range of 120 to 350 ° C. In the late stage of the reaction, the system was adjusted to 1.33 × 10 3 -1.
The alcohol or phenol produced by reducing the pressure to about 3.3 Pa is easily distilled. Reaction time is usually 1-4
About an hour.
【００３５】カーボネートエステルとしては、置換され
ていてもよい炭素数６〜１０のアリール基、アラルキル
基あるいは炭素数１〜４のアルキル基などのエステルが
挙げられる。具体的にはジフェニルカーボネート、ビス
（クロロフェニル）カーボネート、ジナフチルカーボネ
ート、ビス（ジフェニル）カーボネート、ジメチルカー
ボネート、ジエチルカーボネート、ジブチルカーボネー
トなどが挙げられ、なかでもジフェニルカーボネートが
好ましい。Examples of the carbonate ester include an optionally substituted ester such as an aryl group having 6 to 10 carbon atoms, an aralkyl group or an alkyl group having 1 to 4 carbon atoms. Specifically, diphenyl carbonate, bis (chlorophenyl) carbonate, dinaphthyl carbonate, bis (diphenyl) carbonate, dimethyl carbonate, diethyl carbonate, dibutyl carbonate and the like can be mentioned, with diphenyl carbonate being preferred.
【００３６】また、重合速度を速めるために重合触媒を
用いることができ、かかる重合触媒としては、例えば水
酸化ナトリウム、水酸化カリウム、二価フェノールのナ
トリウム塩、カリウム塩等のアルカリ金属化合物、水酸
化カルシウム、水酸化バリウム、水酸化マグネシウム等
のアルカリ土類金属化合物、テトラメチルアンモニウム
ヒドロキシド、テトラエチルアンモニウムヒドロキシ
ド、トリメチルアミン、トリエチルアミン等の含窒素塩
基性化合物、アルカリ金属やアルカリ土類金属のアルコ
キシド類、アルカリ金属やアルカリ土類金属の有機酸塩
類、亜鉛化合物類、ホウ素化合物類、アルミニウム化合
物類、珪素化合物類、ゲルマニウム化合物類、有機スズ
化合物類、鉛化合物類、オスミウム化合物類、アンチモ
ン化合物類マンガン化合物類、チタン化合物類、ジルコ
ニウム化合物類などの通常エステル化反応、エステル交
換反応に使用される触媒を用いることができる。触媒は
単独で使用してもよいし、２種以上を組み合わせて使用
してもよい。これらの重合触媒の使用量は、原料の二価
フェノール１モルに対し、好ましくは１×１０-8〜１×
１０-3当量、より好ましくは１×１０-7〜５×１０-4当
量の範囲で選ばれる。A polymerization catalyst can be used to increase the polymerization rate. Examples of the polymerization catalyst include sodium hydroxide, potassium hydroxide, alkali metal compounds such as sodium and potassium salts of dihydric phenol, and water. Alkaline earth metal compounds such as calcium oxide, barium hydroxide and magnesium hydroxide; nitrogen-containing basic compounds such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylamine and triethylamine; alkoxides of alkali metals and alkaline earth metals Manganese, organic acid salts of alkali metals and alkaline earth metals, zinc compounds, boron compounds, aluminum compounds, silicon compounds, germanium compounds, organic tin compounds, lead compounds, osmium compounds, antimony compounds Compounds, titanium compounds, usually the esterification reaction, such as zirconium compounds, there can be used a catalyst used in the transesterification reaction. The catalyst may be used alone or in combination of two or more. The amount of the polymerization catalyst used is preferably 1 × 10 −8 to 1 ×, based on 1 mol of the dihydric phenol used as the raw material.
It is selected in the range of 10 −3 equivalents, more preferably 1 × 10 −7 to 5 × 10 −4 equivalents.
【００３７】また、かかる重合反応において、フェノー
ル性の末端基を減少するために、重縮反応の後期あるい
は終了後に、例えばビス（クロロフェニル）カーボネー
ト、ビス（ブロモフェニル）カーボネート、ビス（ニト
ロフェニル）カーボネート、ビス（フェニルフェニル）
カーボネート、クロロフェニルフェニルカーボネート、
ブロモフェニルフェニルカーボネート、ニトロフェニル
フェニルカーボネート、フェニルフェニルカーボネー
ト、メトキシカルボニルフェニルフェニルカーボネート
およびエトキシカルボニルフェニルフェニルカーボネー
ト等の化合物を加えることが好ましい。なかでも２−ク
ロロフェニルフェニルカーボネート、２−メトキシカル
ボニルフェニルフェニルカーボネートおよび２−エトキ
シカルボニルフェニルフェニルカーボネートが好まし
く、特に２−メトキシカルボニルフェニルフェニルカー
ボネートが好ましく使用される。In such a polymerization reaction, to reduce the number of phenolic terminal groups, for example, bis (chlorophenyl) carbonate, bis (bromophenyl) carbonate, bis (nitrophenyl) carbonate is used later or after completion of the polycondensation reaction. , Bis (phenylphenyl)
Carbonate, chlorophenylphenyl carbonate,
It is preferable to add compounds such as bromophenylphenyl carbonate, nitrophenylphenyl carbonate, phenylphenyl carbonate, methoxycarbonylphenylphenyl carbonate, and ethoxycarbonylphenylphenyl carbonate. Of these, 2-chlorophenylphenyl carbonate, 2-methoxycarbonylphenylphenyl carbonate and 2-ethoxycarbonylphenylphenyl carbonate are preferred, and 2-methoxycarbonylphenylphenyl carbonate is particularly preferred.
【００３８】芳香族ポリカーボネート樹脂の分子量は特
定されないが、分子量が１０，０００未満であると高温
特性等が低下し、４０，０００を超えると成形加工性が
低下するようになるので、粘度平均分子量で表して１
０，０００〜４０，０００のものが好ましく、１４，０
００〜３０，０００のものが更に好ましく、特に好まし
くは２０，０００〜３０，０００のものである。また、
芳香族ポリカーボネート樹脂の２種以上を混合しても差
し支えない。本発明でいう粘度平均分子量は塩化メチレ
ン１００ｍｌに芳香族ポリカーボネート樹脂０．７ｇを
２０℃で溶解した溶液から求めた比粘度（ηSP）を次式
に挿入して求める。 ηSP／ｃ＝［η］＋０．４５×［η］2ｃ（但し［η］
は極限粘度） ［η］＝１．２３×１０-4Ｍ0.83 ｃ＝０．７Although the molecular weight of the aromatic polycarbonate resin is not specified, if the molecular weight is less than 10,000, the high-temperature properties and the like will be reduced, and if it exceeds 40,000, the moldability will be reduced. 1
It is preferably from 4,000 to 40,000,
More preferably, the number is from 0.000 to 30,000, particularly preferably from 20,000 to 30,000. Also,
Two or more aromatic polycarbonate resins may be mixed. The viscosity average molecular weight referred to in the present invention is determined by inserting the specific viscosity (η SP ) obtained from a solution obtained by dissolving 0.7 g of an aromatic polycarbonate resin in 100 ml of methylene chloride at 20 ° C. into the following equation. η SP /c=[η]+0.45×[η] 2 c (where [η]
Is the intrinsic viscosity) [η] = 1.23 × 10 −4 M 0.83 c = 0.7
【００３９】本発明でＢ成分として使用される鱗状黒鉛
は、鉱物名で石墨とされる天然黒鉛、または無定形炭素
を３０００℃前後で熱処理し、不規則な配列の微小黒鉛
結晶の配向を人工的に行わせた人造黒鉛のいずれか一方
または双方を混合して使用することができる。鱗片形状
を有する黒鉛の平均粒径は、２００〜４００μｍの範囲
である。制電領域を維持するために必要な含有量の範囲
では、平均粒径が２００μｍ未満であると耐衝撃性が低
下し、また寸法精度改良効果が低下する。平均粒径が４
００μｍを超えると、耐衝撃性も若干低下すると共に、
成形品表面にいわゆる鱗状黒鉛の浮きが目立つようにな
り好ましくない。かかる表面の浮きは成形品表面から鱗
状黒鉛が脱落し、電子部品等と導通して部品を損傷する
可能性を有するためである。更に本発明で好ましくは、
固定炭素量が９０重量％以上であり、また揮発分が２重
量％以下のものである。The scale-like graphite used as the component B in the present invention is obtained by heat-treating natural graphite, which is referred to as graphite by a mineral name, or amorphous carbon at about 3000 ° C. to artificially orient microcrystalline graphite having an irregular arrangement. Either one or both of the artificial graphites which have been made to be used can be mixed and used. The average particle size of the flake-shaped graphite is in the range of 200 to 400 μm. In the range of the content necessary to maintain the antistatic region, if the average particle size is less than 200 μm, the impact resistance is reduced, and the effect of improving the dimensional accuracy is reduced. Average particle size is 4
If it exceeds 00 μm, the impact resistance is slightly reduced,
Undesirably, the so-called scale-like graphite floats on the surface of the molded product. This floating of the surface is due to the possibility that scale-like graphite falls off from the surface of the molded product and conducts with electronic components and the like to damage the components. Further preferably in the present invention,
The amount of fixed carbon is 90% by weight or more, and the volatile matter is 2% by weight or less.
【００４０】本発明における鱗状黒鉛の平均粒径は、組
成物となる以前のＢ成分自体の粒径をいい、またかかる
粒径はレーザー回折法によって求められたものをいう。
また鱗状黒鉛の表面は、本発明の組成物の特性を損なわ
ない限りにおいて芳香族ポリカーボネート樹脂との親和
性を増すために、表面処理、例えばエポキシ処理、ウレ
タン処理、シランカップリング処理、酸化処理等が施さ
れていてもよい。Ｂ成分の配合量としては１５〜３５重
量部であり、特に１５〜３０重量部が好ましい。１５重
量部未満では体積固有抵抗が請求の範囲より大きくなる
うえ剛性に劣り、３５重量部を超えると耐衝撃性が低下
する。The average particle size of the flake graphite in the present invention refers to the particle size of the B component itself before it becomes a composition, and the particle size is determined by a laser diffraction method.
In addition, the surface of the flaky graphite is a surface treatment, for example, an epoxy treatment, a urethane treatment, a silane coupling treatment, an oxidation treatment, etc., in order to increase the affinity with the aromatic polycarbonate resin as long as the properties of the composition of the present invention are not impaired. May be applied. The amount of the component B is 15 to 35 parts by weight, and particularly preferably 15 to 30 parts by weight. If the amount is less than 15 parts by weight, the volume resistivity is larger than the claimed range, and the rigidity is poor. If the amount exceeds 35 parts by weight, the impact resistance is reduced.
【００４１】本発明のＣ成分であるトリメチルホスフェ
ートは、芳香族ポリカーボネート樹脂組成物の熱安定性
改良よる耐衝撃性の向上を目的に配合した化合物であ
る。Ｃ成分の配合量としては、０．００１〜２重量部で
あり、より好ましくは０．０１〜１重量部であり、特に
０．０５〜０．５重量部が好ましい。０．００１重量部
未満では耐衝撃性向上効果が得られず、２重量部を超え
ても耐衝撃性の向上は認められないかまたは成形条件等
によっては逆に耐衝撃性が低下する。The trimethyl phosphate which is the component C of the present invention is a compound formulated for the purpose of improving the impact resistance by improving the thermal stability of the aromatic polycarbonate resin composition. The amount of the component C is 0.001 to 2 parts by weight, more preferably 0.01 to 1 part by weight, and particularly preferably 0.05 to 0.5 part by weight. If the amount is less than 0.001 part by weight, the effect of improving the impact resistance is not obtained, and if the amount exceeds 2 parts by weight, no improvement in the impact resistance is observed, or the impact resistance is reduced depending on the molding conditions.
【００４２】本発明はかかるＡ成分〜Ｃ成分からなり搬
送箱を形成するに適した芳香族ポリカーボネート樹脂組
成物である。本発明で搬送箱とは、静電気発生によって
破壊や誤作動を引き起こす可能性のある半導体、電子回
路基板等の電子部品や、各種エレクトロニクス機器、精
密機器等を搬送するために使用される搬送箱を指す。具
体的には液晶ガラスコンテナ、液晶フィルター搬送ケー
ス、ＩＣチップトレイ等が挙げられる。本発明の樹脂組
成物からなる搬送箱は、制電領域の体積固有抵抗値を十
分に満足するものであると共に、低反りであるため多様
な電子機器部品等に対応可能であり、耐衝撃性に優れる
ため繰り返しの使用に対しても十分な特性を有する。The present invention is an aromatic polycarbonate resin composition comprising the components A to C and suitable for forming a transport box. In the present invention, the transport box refers to a transport box used for transporting electronic components such as semiconductors, electronic circuit boards and the like, which may cause destruction or malfunction due to generation of static electricity, various electronic devices, precision instruments, and the like. Point. Specific examples include a liquid crystal glass container, a liquid crystal filter transport case, and an IC chip tray. The transport box made of the resin composition of the present invention sufficiently satisfies the volume resistivity of the antistatic region and has a low warpage, so that it can be used for various electronic device parts and the like, and has a high impact resistance. Because of its excellent properties, it has sufficient properties for repeated use.
【００４３】尚、本発明の目的を損なわない範囲で、難
燃剤（例えば、臭素化ビスフェノール、臭素化ポリエチ
レン、臭素化ポリカーボネート、トリフェニルホスフェ
ート、縮合リン酸エステル、ホスホン酸アミド）、難燃
助剤（アンチモン酸ナトリウム、三酸化アンチモン
等）、滴下防止剤（フィブリル形成能を有するポリテト
ラフルオロエチレン等）、核剤（例えば、ステアリン酸
ナトリウム、エチレン−アクリル酸ナトリウム等）、酸
化防止剤（例えば、ヒンダ−トフェノ−ル系化合物
系）、紫外線吸収剤、光安定剤、離型剤、滑剤、着色剤
等を配合してもよい。As long as the object of the present invention is not impaired, a flame retardant (eg, brominated bisphenol, brominated polyethylene, brominated polycarbonate, triphenyl phosphate, condensed phosphoric ester, phosphonic amide), flame retardant auxiliary (Such as sodium antimonate and antimony trioxide), an anti-drip agent (such as polytetrafluoroethylene having a fibril-forming ability), a nucleating agent (such as sodium stearate and ethylene-sodium acrylate), and an antioxidant (such as (A hindered phenolic compound), an ultraviolet absorber, a light stabilizer, a release agent, a lubricant, a colorant, and the like.
【００４４】また樹脂組成物の体積固有抵抗値が本特許
の請求の範囲内であれば、使用目的に応じて、更にガラ
ス繊維あるいはガラスフレーク、ワラストナイト、カオ
リンクレー、マイカ、タルク、等といった一般に知られ
ている各種フィラーを用いることができる。またフィラ
ーの形状は繊維状、フレーク状、粒状、中空状を自由に
選択できる。好ましくは低反り性に影響を与えない、ガ
ラスフレーク、ワラストナイト、カオリン、マイカ、タ
ルク等のフレーク状、粒状、または繊維長が５０μｍと
なるような微小な繊維状充填材が好ましい。If the specific volume resistivity of the resin composition is within the scope of the claims of the present invention, glass fibers or glass flakes, wollastonite, kaolin clay, mica, talc, etc. may be further used depending on the purpose of use. Various generally known fillers can be used. The shape of the filler can be freely selected from fibrous, flake, granular, and hollow shapes. A flake, such as glass flake, wollastonite, kaolin, mica, and talc, or a fine fibrous filler having a fiber length of 50 μm, which does not affect low warpage, is preferable.
【００４５】上記各成分を押出機、タンブラ−、Ｖ型ブ
レンダ−、ナウタ−ミキサ−、バンバリ−ミキサ−、混
練ロ−ル等の混合機により混合して製造することができ
る。かくして得られた電気抵抗の制御された搬送箱用芳
香族ポリカーボネート樹脂組成物は通常の成形方法によ
って成形品を製造することができる。The above components can be produced by mixing them with a mixer such as an extruder, a tumbler, a V-type blender, a Nauta mixer, a Banbury mixer, and a kneading roll. The thus obtained aromatic polycarbonate resin composition for a transport box with controlled electric resistance can be used to produce a molded article by a usual molding method.
【００４６】[0046]
【発明の実施の形態】以下に実施例を示し本発明を具体
的に説明する。本発明はこれに限定されるものではな
い。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to examples. The present invention is not limited to this.
【００４７】（１）体積固有抵抗値の測定 体積固有抵抗の測定は平板のほぼ中央部から試験片（長
さ４０ｍｍ×幅４０ｍｍ×厚み２ｍｍ）を切り出し、東
亜電波工業（株）製ＳＭ−１０Ｅ型超絶縁計、東亜電波
工業（株）製ＤＳＭ−８１０３型超絶縁計（プローブ：
ＳＭＥ−８３１１）およびＫＥＮＷＯＯＤ製ＤＬ−７１
２を用いて行った。測定する体積固有抵抗値のレベルが
１０3Ω・ｍ未満のときＤＬ−７１２を用い、測定する
体積固有抵抗値のレベルが１０3〜１０7Ω・ｍの範囲の
ときＤＳＭ−８１０３（プローブ：ＳＭＥ−８３１１）
を用い、測定する体積固有抵抗値のレベルが１０7Ω・
ｍ以上のときＳＭ−１０Ｅ型超絶縁計を用いた。(1) Measurement of Volume Specific Resistance In the measurement of volume specific resistance, a test piece (length 40 mm × width 40 mm × thickness 2 mm) was cut out from a substantially central portion of a flat plate, and SM-10E manufactured by Toa Denpa Kogyo KK Type super insulation tester, DSM-8103 type super insulation tester (probe:
SME-8311) and DL-71 manufactured by KENWOOD
2 was performed. When the volume resistivity level to be measured is less than 10 3 Ω · m, use DL-712. When the volume resistivity value to be measured is in the range of 10 3 to 10 7 Ω · m, DSM-8103 (probe: SME-8311)
The volume resistivity level to be measured is 10 7 Ω ·
m or more, an SM-10E type super insulation meter was used.
【００４８】（２）衝撃値：ＡＳＴＭ Ｄ−２５６によ
り厚み３．２ｍｍのアイゾットノッチ付衝撃値［Ｊ／
ｍ］を測定した。(2) Impact value: According to ASTM D-256, a 3.2 mm thick Izod notched impact value [J /
m] was measured.
【００４９】（３）曲げ弾性率：ＡＳＴＭ Ｄ−７９０
により曲げ弾性率［ＭＰａ］を測定した。(3) Flexural modulus: ASTM D-790
Was used to measure the flexural modulus [MPa].
【００５０】（４）成形品の反り量：箱型平面度評価用
金型を用いて射出成形により成形し、２３℃、５０％Ｒ
Ｈ雰囲気にて２４時間放置した後に箱型成形品底面の３
２点を測定点とし、その３２点を最小二乗法により平均
化して求めた架空平面を基準面とし、その基準面からの
各測定点の高さを三次元測定機（ミツトヨ（株）製）に
より測定し、その高さの最大幅を反り量［μｍ］とし
た。この評価方法によれば、反り量が小さいほど良好な
寸法精度を示すことになる。以上の評価方法の要領を図
３に示す。(4) Amount of warpage of molded product: molded by injection molding using a box-shaped flatness evaluation mold, at 23 ° C. and 50% R
After standing in an H atmosphere for 24 hours, 3
Two points are measured points, and an imaginary plane obtained by averaging the 32 points by the least squares method is used as a reference plane, and the height of each measurement point from the reference plane is measured by a three-dimensional measuring machine (Mitutoyo Corporation) The maximum width of the height was defined as the amount of warpage [μm]. According to this evaluation method, the smaller the amount of warpage, the better the dimensional accuracy. The outline of the above evaluation method is shown in FIG.
【００５１】（５）外観評価：上記試験片の表面外観を
目視評価した。表面にザラツキが無い場合を◎、若干ザ
ラツキがあるがフィラーの脱落が見られない場合を○、
ザラツキが見られかつフィラーの脱落が多少見られる場
合を△、ザラツキが激しくフィラーの脱落が見られる場
合を×として評価した。(5) Appearance evaluation: The surface appearance of the test piece was visually evaluated. ◎ when there is no roughness on the surface, ○ when there is some roughness but no filler dropout is seen,
A case where roughness was observed and some filler detachment was observed was evaluated as △, and a case where roughness was severe and filler was observed was evaluated as x.
【００５２】［実施例１〜４、および比較例１〜８］表
１および表２記載の各成分を表１および表２記載の配合
割合でドライブレンドした後、径３０ｍｍφのダルメー
ジ２段のスクリューを装備したベント付き単軸押出機
［ナカタニ機械（株）製：ＶＳＫ−３０］を用い、ベン
トの真空度を１．３３×１０3Ｐａとなるようにしてス
レッドを押出し、通常の工業用水を流水した冷却バスで
スレッドを冷却の後ペレット化した。このペレットをス
テンレス製バットに厚み２ｃｍ以下のとなるように入
れ、真空乾燥機で１．３×１０2Ｐａ以下の吸引した状
態で、このペレットを１２０℃で５時間乾燥した。その
後射出成形機［住友重機械工業（株）製ＳＧ−１５０
Ｕ］を用いて長さ９０ｍｍ×幅５０ｍｍ×厚み２ｍｍの
平板を成形し、評価に用いた。評価結果を表１および表
２に示す。[Examples 1 to 4 and Comparative Examples 1 to 8] Each of the components shown in Tables 1 and 2 was dry-blended in the mixing ratio shown in Tables 1 and 2, and then a screw having a diameter of 30 mmφ and a double-stage screw was used. The thread was extruded using a vented single-screw extruder [VSK-30 manufactured by Nakatani Machinery Co., Ltd.] with the vent at a degree of vacuum of 1.33 × 10 3 Pa, and ordinary industrial water was discharged. The sled was cooled in a flowing cooling bath and pelletized after cooling. The pellet was placed in a stainless steel vat so as to have a thickness of 2 cm or less, and the pellet was dried at 120 ° C. for 5 hours in a vacuum drier with suction of 1.3 × 10 2 Pa or less. After that, an injection molding machine [SG-150 manufactured by Sumitomo Heavy Industries, Ltd.]
U], a flat plate having a length of 90 mm × a width of 50 mm × a thickness of 2 mm was formed and used for evaluation. The evaluation results are shown in Tables 1 and 2.
【００５３】表１および表２記載の各成分を示す記号は
下記の通りである。 （Ａ成分） Ａ：粘度平均分子量２２，５００の芳香族ポリカ−ボネ
−ト樹脂［帝人化成（株）製 パンライトＬ−１２２
５］ （Ｂ成分） Ｂ−１：鱗状黒鉛（平均粒径２５０μｍ、固定炭素量９
４．０％、揮発分１．５％、灰分４．５％）［日本板硝
子（株）製 ８０９４］ Ｂ−２：鱗状黒鉛（平均粒径３５０μｍ、固定炭素量９
８．０％、揮発分０．５％、灰分１．５％）［日本板硝
子（株）製 ５０９８］ （Ｂ成分以外） Ｂ−３：鱗状黒鉛（平均粒径６０μｍ、固定炭素量８
５．０％、揮発分２．５％、灰分１２．５％）［日本板
硝子（株）製 ＦＭ−２］ Ｂ−４：鱗状黒鉛（平均粒径６００μｍ、固定炭素量８
５．０％、揮発分２．５％、灰分１２．５％）［日本板
硝子（株）製 ３２８５］ Ｂ−５：炭素繊維（繊維径１２μｍ、カット長６ｍｍ、
体積固有抵抗値１０-3〜１０-2Ω・ｍ）［三菱化学
（株）製 Ｋ２２３Ｇ１］ （Ｃ成分） Ｃ−１：トリメチルホスフェート （Ｃ成分以外） Ｃ−２：トリス（ノニルフェニル）ホスファイトThe symbols indicating the components shown in Tables 1 and 2 are as follows. (A component) A: Aromatic polycarbonate resin having viscosity average molecular weight of 22,500 [Panlite L-122 manufactured by Teijin Chemicals Ltd.]
5] (Component B) B-1: Scale graphite (average particle size 250 μm, fixed carbon amount 9)
(4.0%, volatile content 1.5%, ash content 4.5%) [8094 manufactured by Nippon Sheet Glass Co., Ltd.] B-2: Scale graphite (average particle size 350 μm, fixed carbon amount 9)
8.0%, volatile matter 0.5%, ash 1.5%) [5098, manufactured by Nippon Sheet Glass Co., Ltd.] (other than the B component) B-3: Scale graphite (average particle size 60 μm, fixed carbon amount 8)
5.0%, volatile content 2.5%, ash content 12.5%) [FM-2, manufactured by Nippon Sheet Glass Co., Ltd.] B-4: Scale-like graphite (average particle size 600 μm, fixed carbon amount 8)
5.0%, volatile content 2.5%, ash content 12.5%) [3285 manufactured by Nippon Sheet Glass Co., Ltd.] B-5: carbon fiber (fiber diameter 12 μm, cut length 6 mm,
(Volume specific resistance 10 -3 to 10 -2 Ω · m) [K223G1 manufactured by Mitsubishi Chemical Corporation] (C component) C-1: Trimethyl phosphate (other than C component) C-2: Tris (nonylphenyl) phosphite
【００５４】[0054]
【表１】 [Table 1]
【００５５】[0055]
【表２】 [Table 2]
【００５６】表１および表２で明らかなように、実施例
１〜４から、特定の平均粒径を有する鱗状黒鉛とトリメ
チルホスフェートを請求項の範囲内で配合することによ
り、該樹脂組成物の体積固有抵抗は特定の範囲で制御さ
れ、かつ優れた耐衝撃性、剛性及び寸法精度を示す。さ
らに実施例は比較例に比べ表面外観に優れることがわか
る。As is clear from Tables 1 and 2, from Examples 1 to 4, by blending scaly graphite having a specific average particle size and trimethyl phosphate within the scope of the claims, the resin composition was obtained. The volume resistivity is controlled in a specific range and exhibits excellent impact resistance, rigidity and dimensional accuracy. Further, it can be seen that the examples have better surface appearance than the comparative examples.
【００５７】比較例１はＢ成分である鱗状黒鉛の配合量
が少ない場合であり、その組成物が示す体積固有抵抗値
のレベルは十分とはいえない。Comparative Example 1 is a case where the blending amount of the scale graphite as the component B is small, and the level of the volume resistivity value of the composition is not sufficient.
【００５８】比較例２はＣ成分が本発明のトリメチルホ
スフェート以外のリン系安定剤であるトリス（ノニルフ
ェニル）ホスファイトを配合したものであるが、その組
成物が示す衝撃値は実施例４に比べて低く、耐衝撃性に
劣ることがわかる。Comparative Example 2 was prepared by blending tris (nonylphenyl) phosphite, which is a phosphorus-based stabilizer other than trimethyl phosphate of the present invention, with the C component being the same as that of Example 4. This is lower than that, indicating that the impact resistance is poor.
【００５９】比較例３はＣ成分の配合量が極めて少ない
ものであるが、その組成物が示す衝撃値は実施例４に比
べて低く、耐衝撃性において十分とはいえない。In Comparative Example 3, the amount of the component C was extremely small, but the impact value of the composition was lower than that of Example 4, and the impact resistance was not sufficient.
【００６０】比較例４はＢ成分である鱗状黒鉛の配合量
が必要以上に多い場合であり、その組成物が示す体積固
有抵抗値が極めて低く、必要とされる制電領域を満足せ
ず、また衝撃値が小さく耐衝撃性に劣り、そのうえ表面
外観が劣ることがわかる。Comparative Example 4 is a case where the blending amount of the flake graphite as the B component is more than necessary. The volume resistivity of the composition is extremely low, and the composition does not satisfy the required antistatic region. Further, it can be seen that the impact value is small, the impact resistance is poor, and the surface appearance is poor.
【００６１】比較例５はＢ成分である鱗状黒鉛の平均粒
径が小さすぎる場合であるが、その組成物が示す耐衝撃
性は実施例に比べて劣り、さらに寸法精度改良効果が低
いことがわかる。Comparative Example 5 is a case where the average particle size of the flake graphite as the B component is too small. However, the impact resistance of the composition is inferior to that of the example, and the effect of improving the dimensional accuracy is low. Understand.
【００６２】比較例６は平均粒径の小さい鱗状黒鉛を使
用し、またその配合量が少ない場合であるが、配合量が
少ない場合には逆に本願発明の鱗状黒鉛を使用するより
も高い衝撃値を示しており、特定範囲の配合量において
は特定の粒径の鱗状黒鉛を使用した場合により良好な耐
衝撃性を達成可能であることがわかる。Comparative Example 6 uses a scale graphite having a small average particle size and a small amount of the scale graphite. When the content is small, the impact strength is higher than when the scale graphite of the present invention is used. This indicates that better impact resistance can be achieved when scale graphite having a specific particle size is used in a specific range of the compounding amount.
【００６３】比較例７はＢ成分である鱗状黒鉛の平均粒
径が本願発明の特定範囲より大きい場合であるが、その
組成物は特に表面外観が劣ることがわかる。Comparative Example 7 is a case where the average particle size of the flake graphite as the B component is larger than the specific range of the present invention. It can be seen that the composition has particularly poor surface appearance.
【００６４】比較例８はＢ成分が特定の体積固有抵抗値
に制御された炭素繊維を使用した場合であり、その組成
物が示す体積固有抵抗値のレベルは十分に制電領域とな
るものの、炭素繊維のみでは異方性が高いため実施例に
比べ寸法精度に劣り、また表面外観も十分とはいえない
ことがわかる。Comparative Example 8 is a case where a carbon fiber in which the component B is controlled to a specific volume specific resistance value is used. Although the level of the volume specific resistance value indicated by the composition is sufficiently in the antistatic region, It can be seen that the carbon fiber alone has a high anisotropy and thus is inferior in dimensional accuracy as compared to the examples, and the surface appearance is not sufficient.
【００６５】[0065]
【発明の効果】本発明の搬送箱用芳香族ポリカーボネー
ト樹脂組成物は、特定の平均粒径を有する鱗状黒鉛とト
リメチルホスフェートを使用することにより、体積固有
抵抗値が一定の範囲に制御されるうえ、優れた耐衝撃
性、剛性及び寸法精度を有するものであり、半導体、電
子回路基板等の電子部品、各種エレクトロニクス機器、
精密機器等の搬送箱として、特に液晶ガラスコンテナ、
液晶フィルター搬送ケース、ＩＣチップトレイ等に要求
される各種の特性を高度なレベルで満足し、繰り返しの
使用にも十分に耐えうる経済性を有し、その奏する工業
的効果は格別なものである。According to the aromatic polycarbonate resin composition for a transport box of the present invention, the volume resistivity is controlled within a certain range by using flaky graphite having a specific average particle size and trimethyl phosphate. It has excellent impact resistance, rigidity and dimensional accuracy, and is used for semiconductors, electronic parts such as electronic circuit boards, various electronic devices,
As a transport box for precision equipment, especially liquid crystal glass containers,
Satisfies various characteristics required for liquid crystal filter transport case, IC chip tray, etc. at a high level, has economical efficiency enough to withstand repeated use, and its industrial effect is exceptional. .
【図１】箱型平面度評価用金型の箱型成形品底面部を示
す正面図である。反り量測定用の測定点は対称軸に対し
てそれぞれ対象に位置している。FIG. 1 is a front view showing a bottom of a box-shaped molded product of a box-shaped flatness evaluation mold. The measurement points for measuring the amount of warpage are located symmetrically with respect to the axis of symmetry.
【図２】箱型平面度評価用金型の箱型成形品の側面図
（寸法は金型寸法）である。FIG. 2 is a side view (dimensions are dimensions) of a box-shaped molded product of a box-type flatness evaluation mold.
【図３】成形品反り量の算出に対する概念図である。FIG. 3 is a conceptual diagram for calculating a molded product warpage amount;
１ 成形品反り量算出時の測定点１である（金型におい
ては直径５ｍｍ、高さ０．２ｍｍの円形凸部、成形品に
おいては直径約５ｍｍ、深さ約０．２ｍｍの円形凹部。
また一点鎖線は対称軸、交点は円中心） ２ 成形品反り量算出時の測定点２である（寸法等は測
定点１と同様） ３ 成形品反り量算出時の測定点３である（寸法等は測
定点１と同様） ４ 成形品反り量算出時の測定点４である（寸法等は測
定点１と同様） ５ 成形品反り量算出時の測定点５である（寸法等は測
定点１と同様） ６ 成形品反り量算出時の測定点６である（寸法等は測
定点１と同様） ７ 成形品反り量算出時の測定点７である（寸法等は測
定点１と同様） ８ 成形品反り量算出時の測定点８である（寸法等は測
定点１と同様） ９ 成形品反り量算出時の測定点９である（寸法等は測
定点１と同様） １０ 成形品反り量算出時の測定点１０である（寸法等
は測定点１と同様） １１ 成形品反り量算出時の測定点１１である（寸法等
は測定点１と同様） １２ 成形品反り量算出時の測定点１２である（寸法等
は測定点１と同様） １３ 成形品反り量算出時の測定点１３である（寸法等
は測定点１と同様） １４ 成形品反り量算出時の測定点１４である（寸法等
は測定点１と同様） １５ 成形品反り量算出時の測定点１５である（寸法等
は測定点１と同様） １６ 成形品反り量算出時の測定点１６である（寸法等
は測定点１と同様） １７ 成形品反り量算出時の測定点１７である（寸法等
は測定点１と同様） １８ 成形品反り量算出時の測定点１８である（寸法等
は測定点１と同様） １９ 成形品反り量算出時の測定点１９である（寸法等
は測定点１と同様） ２０ 成形品反り量算出時の測定点２０である（寸法等
は測定点１と同様） ２１ 成形品反り量算出時の測定点２１である（寸法等
は測定点１と同様） ２２ 成形品反り量算出時の測定点２２である（寸法等
は測定点１と同様） ２３ 成形品反り量算出時の測定点２３である（寸法等
は測定点１と同様） ２４ 成形品反り量算出時の測定点２４である（寸法等
は測定点１と同様） ２５ 成形品反り量算出時の測定点２５である（寸法等
は測定点１と同様） ２６ 成形品反り量算出時の測定点２６である（寸法等
は測定点１と同様） ２７ 成形品反り量算出時の測定点２７である（寸法等
は測定点１と同様） ２８ 成形品反り量算出時の測定点２８である（寸法等
は測定点１と同様） ２９ 成形品反り量算出時の測定点２９である（寸法等
は測定点１と同様） ３０ 成形品反り量算出時の測定点３０である（寸法等
は測定点１と同様） ３１ 成形品反り量算出時の測定点３１である（寸法等
は測定点１と同様） ３２ 成形品反り量算出時の測定点３２である（寸法等
は測定点１と同様） ３３ 箱型成形品の長さ（金型寸法２００ｍｍ） ３４ 箱型成形品の幅（金型寸法１００ｍｍ） ３５ 箱型成形品幅方向の対称軸 ３６ 箱型成形品長さ方向の対称軸 ３７ 測定点２０および３０の円中心の位置（対称軸
（３６）からの長さであり、金型寸法において１６ｍｍ
である） ３８ 測定点２５の円中心の位置（対称軸（３６）から
の長さであり、金型寸法において２５ｍｍである） ３９ 測定点３１の円中心の位置（対称軸（３６）から
の長さであり、金型寸法において４５ｍｍである） ４０ 測定点２１の円中心の位置（対称軸（３６）から
の長さであり、金型寸法において５５ｍｍである） ４１ 測定点２６の円中心の位置（対称軸（３６）から
の長さであり、金型寸法において７５ｍｍである） ４２ 測定点２２および３２の円中心の位置（対称軸
（３６）からの長さであり、金型寸法において８４ｍｍ
である） ４３ 測定点２０、２１および２２の円中心の位置（対
称軸（３５）からの長さであり、金型寸法において１０
ｍｍである） ４４ 測定点２５よび２６の円中心の位置（対称軸（３
５）からの長さであり、金型寸法において２７ｍｍであ
る） ４５ 測定点３０、３１および３２の円中心の位置（対
称軸（３５）からの長さであり、金型寸法において４６
ｍｍである） ４６ 箱型成形品のゲート（４点、直径０．８ｍｍφピ
ンゲート、それぞれ対称軸（３５）および対称軸（３
６）に対して対称） ４７ 箱型成形品のゲートの位置（対称軸（３５）から
の長さであり、金型寸法において３５ｍｍである） ４８ 箱型成形品のゲートの位置（対称軸（３６）から
の長さであり、金型寸法において６０ｍｍである） ４９ 箱型成形品の高さ（金型寸法において２０ｍｍで
ある） ５０ 箱型成形品底面部の厚み（金型寸法において１．
５ｍｍである） ５１ 箱型成形品側面部の厚み（長さ方向、幅方向とも
に金型寸法において１．５ｍｍである） ５２ 横軸（各測定点を示し、かっこ内の数値はそれぞ
れの測定点を示す（測定点１〜３２） ５３ 縦軸（３２点の測定点の高さから最小二乗法によ
り求められた架空平面からの各測定点の高さを示す） ５４ ３２点の測定点の高さから最小二乗法により求め
られた架空平面の基準線を示す ５５ 基準線からの最も低い測定点を示す ５６ 基準線からの最も高い測定点を示す ５７ 高さの最大幅、すなわち反り量を示す1 Measurement point 1 when calculating the amount of warpage of a molded product (a circular convex portion having a diameter of 5 mm and a height of 0.2 mm in a mold, and a circular concave portion having a diameter of approximately 5 mm and a depth of approximately 0.2 mm in a molded product.
The dashed line is the axis of symmetry, and the intersection is the center of the circle. 2 Measurement point 2 when calculating the amount of warpage of the molded product (dimensions and the like are the same as measurement point 1) 3 Measurement point 3 when calculating the amount of warpage of the molded product (dimensions) Etc. are the same as the measuring point 1) 4 The measuring point 4 when calculating the warpage of the molded article (the dimensions are the same as the measuring point 1) 5 The measuring point 5 when calculating the warping the molded article (the measuring points are the measuring points 6 Same as measurement point 6 when calculating the amount of warpage of molded article (dimensions and the like are the same as measurement point 1) 7 Measurement point 7 when calculating the amount of warpage of the molded article (dimensions and the like are the same as measurement point 1) 8 Measurement point 8 when calculating the amount of warpage of the molded article (dimensions and the like are the same as measurement point 1) 9 Measurement point 9 when calculating the amount of warpage of the molded article (dimensions and the like are the same as measurement point 1) 10 Warpage of the molded article 10 Measurement point 10 when calculating the amount (dimensions and the like are the same as measurement point 1) 11 Measurement point 11 when calculating the amount of warpage of the molded article (the dimensions and the like are measured 12 Same as measurement point 12 when calculating the amount of warpage of the molded article (dimensions, etc. are the same as measurement point 1) 13 Measurement point 13 when calculating the amount of warpage of the molded article (dimensions, etc. are the same as measurement point 1) 14 Measurement point 14 when calculating the warpage of the molded article (dimensions and the like are the same as measurement point 1) 15 Measurement point 15 when calculating the warpage of the molded article (dimensions and the like are the same as measurement point 1) 16 Warpage of the molded article Measurement point 16 when calculating the amount (dimensions and the like are the same as measurement point 1) 17 Measurement point 17 when calculating the amount of warpage of the molded product (dimensions and the like are the same as measurement point 1) 18 Measurement point 18 (dimensions and the like are the same as measurement point 1) 19 Measurement point 19 when calculating the amount of warpage of the molded product (dimensions and the like are the same as measurement point 1) 20 Measurement point 20 when calculating the amount of warpage of the molded product Certain (dimensions etc. are the same as measurement point 1) 21 Measurement point 21 when calculating the amount of warpage of the molded product (dimensions etc.) 22 Same as the measuring point 1 22 The measuring point 22 at the time of calculating the warpage of the molded article (dimensions and the like are the same as at the measuring point 1) 23 The measuring point 23 at the time of calculating the warping amount of the molded article (the dimensions and the like are the same as the measuring point 1) 24) Measurement point 24 when calculating the amount of warpage of the molded product (dimensions and the like are the same as measurement point 1) 25 Measurement point 25 when calculating the amount of warpage of the molded product (dimensions and the like are the same as measurement point 1) 26 Molding Measurement point 26 at the time of calculating product warpage (dimensions and the like are the same as at measurement point 1) 27 Measurement point 27 at calculation of molded product warpage (the dimensions and the like are the same as at measurement point 1) 28 Calculation of molded product warpage Is the measurement point 28 at the time (dimensions and the like are the same as the measurement point 1) 29 is the measurement point 29 at the time of calculating the molded product warpage amount (the dimensions and the like are the same as the measurement point 1) 30 is the measurement point at the time of calculating the molded product warpage amount 30 (dimensions and the like are the same as measurement point 1) 31 Measurement point 31 when calculating the amount of warpage of the molded article ( 32 Same as measurement point 1) 32 Measurement point 32 when calculating the amount of warpage of molded product (dimensions etc. are the same as measurement point 1) 33 Length of box-shaped molded product (die size 200 mm) 34 Box-shaped molding Width of the product (mold size 100 mm) 35 Symmetry axis in the width direction of the box-shaped product 36 Symmetry axis in the length direction of the box-shaped product 37 Position of the circle center of the measurement points 20 and 30 (length from the symmetry axis (36)) It is 16mm in the mold size
38) Position of the circle center of the measurement point 25 (the length from the symmetry axis (36) and 25 mm in the mold dimensions) 39 Position of the circle center of the measurement point 31 (from the symmetry axis (36)) 40 The position of the center of the circle of the measurement point 21 (the length from the symmetry axis (36) and 55 mm in the mold size) 41 The center of the circle of the measurement point 26 (Length from the symmetry axis (36) and 75 mm in the mold dimension) 42 Position of the circle center of the measurement points 22 and 32 (Length from the symmetry axis (36) and the mold dimension) At 84mm
43) The position of the center of the circle of the measuring points 20, 21 and 22 (the length from the symmetry axis (35), and 10
44) The position of the center of the circle of the measurement points 25 and 26 (the axis of symmetry (3
45) The position from the center of the circle of the measurement points 30, 31 and 32 (the length from the axis of symmetry (35) and 46 in the mold size).
46) Gate of box-shaped molded product (4 points, 0.8 mm diameter pin gate, respectively, axis of symmetry (35) and axis of symmetry (3
47) Position of the gate of the box-shaped product (length from the symmetry axis (35) and 35 mm in the mold dimensions) 48 Position of the gate of the box-shaped product (axis of symmetry ( 36) The length from the mold is 60 mm in the mold size. 49 The height of the box-shaped molded product (20 mm in the mold size) 50 The thickness of the bottom of the box-shaped molded product (1.
5 The thickness of the side surface of the box-shaped molded product (1.5 mm in the mold dimension in both the length direction and the width direction) 52 Horizontal axis (each measurement point is shown, the numerical value in parentheses is each measurement point) 53 (Measurement points 1 to 32) 53 Vertical axis (Indicates the height of each measurement point from an imaginary plane obtained from the height of 32 measurement points by the least squares method) 54 Height of 32 measurement points Indicates the reference line of the imaginary plane obtained by the least square method from the above 55 Indicates the lowest measurement point from the reference line 56 Indicates the highest measurement point from the reference line 57 Indicates the maximum width of the height, ie, the amount of warpage
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｋ 7/00 Ｂ６５Ｄ 1/00 Ａ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08K 7/00 B65D 1/00 A
Claims (1)
６５〜８５重量部と平均粒径が２００〜４００μｍであ
る鱗状黒鉛（Ｂ成分）１５〜３５重量部の合計１００重
量部、およびトリメチルホスフェート（Ｃ成分）０．０
０１〜２重量部からなる、体積固有抵抗値が１０2〜１
０9Ω・ｍの電気抵抗に制御された搬送箱用芳香族ポリ
カーボネート樹脂組成物。1. An aromatic polycarbonate resin (A component)
A total of 100 parts by weight of 65 to 85 parts by weight, 15 to 35 parts by weight of flaky graphite (component B) having an average particle size of 200 to 400 μm, and 0.0 of trimethyl phosphate (component C)
Consisting 01-2 parts by weight, volume resistivity 10 2-1
An aromatic polycarbonate resin composition for a transport box controlled to an electrical resistance of 09 Ω · m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000011911A JP4330744B2 (en) | 2000-01-20 | 2000-01-20 | Aromatic polycarbonate resin composition for transport box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000011911A JP4330744B2 (en) | 2000-01-20 | 2000-01-20 | Aromatic polycarbonate resin composition for transport box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001200153A true JP2001200153A (en) | 2001-07-24 |
| JP4330744B2 JP4330744B2 (en) | 2009-09-16 |
Family
ID=18539707
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000011911A Expired - Lifetime JP4330744B2 (en) | 2000-01-20 | 2000-01-20 | Aromatic polycarbonate resin composition for transport box |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4330744B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281466A (en) * | 2004-03-29 | 2005-10-13 | Idemitsu Kosan Co Ltd | Carbon fiber-containing fiber-reinforced resin composition with small warpage distortion and its molded article |
| JP2006273931A (en) * | 2005-03-28 | 2006-10-12 | Teijin Chem Ltd | Flame-retardant resin composition |
| JP2007332386A (en) * | 2007-08-24 | 2007-12-27 | Teijin Chem Ltd | Highly heat resisting electroconductive polycarbonate resin composition |
| CN103314055A (en) * | 2011-01-14 | 2013-09-18 | 帝人株式会社 | Aromatic polycarbonate resin composition and molded article thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0391556A (en) * | 1989-09-04 | 1991-04-17 | Lion Corp | Conductive resin composition |
| JPH08277342A (en) * | 1995-04-05 | 1996-10-22 | Mitsubishi Rayon Co Ltd | Vibration damping thermoplastic resin composition and molding obtained from the same |
| JPH10237316A (en) * | 1997-02-27 | 1998-09-08 | Mitsubishi Eng Plast Kk | Conductive resin composition |
| JPH1135815A (en) * | 1997-07-15 | 1999-02-09 | Teijin Chem Ltd | Polycarbonate composition |
-
2000
- 2000-01-20 JP JP2000011911A patent/JP4330744B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0391556A (en) * | 1989-09-04 | 1991-04-17 | Lion Corp | Conductive resin composition |
| JPH08277342A (en) * | 1995-04-05 | 1996-10-22 | Mitsubishi Rayon Co Ltd | Vibration damping thermoplastic resin composition and molding obtained from the same |
| JPH10237316A (en) * | 1997-02-27 | 1998-09-08 | Mitsubishi Eng Plast Kk | Conductive resin composition |
| JPH1135815A (en) * | 1997-07-15 | 1999-02-09 | Teijin Chem Ltd | Polycarbonate composition |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281466A (en) * | 2004-03-29 | 2005-10-13 | Idemitsu Kosan Co Ltd | Carbon fiber-containing fiber-reinforced resin composition with small warpage distortion and its molded article |
| JP2006273931A (en) * | 2005-03-28 | 2006-10-12 | Teijin Chem Ltd | Flame-retardant resin composition |
| JP4705392B2 (en) * | 2005-03-28 | 2011-06-22 | 帝人化成株式会社 | Flame retardant resin composition |
| JP2007332386A (en) * | 2007-08-24 | 2007-12-27 | Teijin Chem Ltd | Highly heat resisting electroconductive polycarbonate resin composition |
| CN103314055A (en) * | 2011-01-14 | 2013-09-18 | 帝人株式会社 | Aromatic polycarbonate resin composition and molded article thereof |
| US9646736B2 (en) | 2011-01-14 | 2017-05-09 | Teijin Limited | Aromatic polycarbonate resin composition and molded article thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4330744B2 (en) | 2009-09-16 |
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