JP2001177240A - Multilayer printed wiring board and method of manufacturing the same - Google Patents
Multilayer printed wiring board and method of manufacturing the sameInfo
- Publication number
- JP2001177240A JP2001177240A JP36279399A JP36279399A JP2001177240A JP 2001177240 A JP2001177240 A JP 2001177240A JP 36279399 A JP36279399 A JP 36279399A JP 36279399 A JP36279399 A JP 36279399A JP 2001177240 A JP2001177240 A JP 2001177240A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- copper
- multilayer printed
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は多層プリント配線
板の構造、それに使用するクラッド板及び該構造を有す
る多層プリント配線板の製造方法に関し、特にコネクタ
ーピン等の電気回路コネクターに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a multilayer printed wiring board, a clad plate used therefor, and a method of manufacturing a multilayer printed wiring board having the structure, and more particularly to an electric circuit connector such as a connector pin.
【０００２】[0002]
【従来の技術】近年、電子機器の小型化、高性能化が進
んできた状況には、半導体デバイスの高集積化、高速化
によるところが大きい。この中でも特に電子機器の高速
化が今後とも急速に発展すると考えられるが、５０ＭＨ
ｚを超える高周波回路では、配線の電気的特性に起因す
る種々の問題が生じてきている。2. Description of the Related Art In recent years, miniaturization and high performance of electronic devices have been largely due to high integration and high speed of semiconductor devices. Among them, especially, it is considered that the speeding up of electronic equipment will continue to develop rapidly.
In a high-frequency circuit exceeding z, various problems have arisen due to the electrical characteristics of the wiring.
【０００３】例えば、高周波回路の配線構造として、従
来はマイクロストリップ構造が広く使用されてきた。し
かし、近年、電子機器の小型化、高性能化に伴い配線パ
ターン幅が減少し、マイクロストリップ構造では配線間
に発生するクロストークノイズの抑制が困難となりつつ
ある。また、信号の高速化がクロストークノイズ量の増
加を助長し、マイクロストリップ配線構造におけるクロ
ストークノイズの抑制はますます困難な方向へ向かいつ
つあった。For example, a microstrip structure has been widely used as a wiring structure of a high-frequency circuit. However, in recent years, the width of a wiring pattern has been reduced along with miniaturization and high performance of electronic devices, and it has become difficult to suppress crosstalk noise generated between wirings in a microstrip structure. In addition, the speeding up of signals has promoted an increase in the amount of crosstalk noise, and it has become increasingly difficult to suppress crosstalk noise in a microstrip wiring structure.
【０００４】このような問題の解決を目指すものして、
特開平９−２８３９３０号公報の提案がある。この提案
は、アース回路導体が形成された銅張積層板とアース回
路導体および信号回路導体が形成されたフィルム状銅張
積層板とが積層構成されたフィルム接着基材とスルーホ
ール穴とからなる多層プリント配線板であって、該配線
板上に同軸回路構造を形成するものである。このような
構成とすることにより、信号回路導体が完全にアース回
路導体で覆われたストリップ構造の同軸回路が形成で
き、放射ノイズ、クロストークノイズの影響がない、高
速信号伝送線路としての多層プリント配線板が得られる
というものである。In an attempt to solve such a problem,
There is a proposal in Japanese Patent Application Laid-Open No. 9-283930. This proposal consists of a film adhesive base material and a through-hole formed by laminating a copper-clad laminate having a ground circuit conductor formed thereon and a film-shaped copper-clad laminate having a ground circuit conductor and a signal circuit conductor formed thereon. A multilayer printed wiring board, wherein a coaxial circuit structure is formed on the wiring board. With such a configuration, a coaxial circuit having a strip structure in which the signal circuit conductor is completely covered with the earth circuit conductor can be formed, and there is no influence of radiation noise and crosstalk noise. A wiring board can be obtained.
【０００５】この特開平９−２８３９３０号公報の多層
プリント配線基板の製造にあたっては、まず、アース回
路導体が形成された銅張積層板と、アース回路導体およ
び信号回路導体が形成されたフィルム状銅張積層板とが
個別に作成される。これら２枚の積層板を仮積層し、一
体化して位置ずれ等を修正した上で、接着剤を使用して
本積層化して同軸構造の一体型回路構造体としたのち表
層に回路を形成して、多層プリント配線板が完成する。In manufacturing the multilayer printed wiring board disclosed in Japanese Patent Application Laid-Open No. 9-283930, first, a copper-clad laminate on which an earth circuit conductor is formed, and a film-like copper on which an earth circuit conductor and a signal circuit conductor are formed. The laminate and the laminated board are separately produced. The two laminated plates are temporarily laminated, integrated, corrected for misalignment, etc., and finally laminated using an adhesive to form an integrated circuit structure having a coaxial structure, and then a circuit is formed on the surface layer. Thus, a multilayer printed wiring board is completed.
【０００６】しかしながら、このように予め作成した２
枚の積層板を張り合わせて積層して製造する場合、積層
工程が複雑かつ煩雑であるという問題があり、製造原価
を押し上げる原因にもなっている。また、この従来技術
では分岐を多数有するような複雑な回路を形成すること
は困難であり、新たな方法の開発が待たれていた。[0006] However, the previously prepared 2
When manufacturing by laminating and laminating two laminated boards, there is a problem that the laminating process is complicated and complicated, which also causes an increase in manufacturing cost. Further, it is difficult to form a complicated circuit having a large number of branches in this prior art, and development of a new method has been awaited.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、上記従来技
術のように製造にあたり複雑かつ煩雑な工程を経ること
なく、経済的で量産に対応可能であり、しかもクロスト
ークノイズを効果的に抑制可能な多層プリント配線板を
提供するものである。SUMMARY OF THE INVENTION The present invention is economical and can be mass-produced without going through complicated and complicated steps in manufacturing as in the above-mentioned prior art, and effectively suppresses crosstalk noise. A possible multilayer printed wiring board is provided.
【０００８】[0008]
【課題を解決するための手段】本発明者らは、上記目的
を達成すべく鋭意検討の結果、予め作成した二層の基板
を積層するのではなく、連続したエッチング処理によっ
て全体の配線基板を製作する方法を採用することが最も
好ましいという結論に達して本発明に至った。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, the entire wiring board has been formed by a continuous etching process, instead of laminating two layers of boards prepared in advance. The present invention has been concluded that it is most preferable to adopt the manufacturing method.
【０００９】すなわち、請求項１記載の本発明は、内部
に信号回路導体を有し、該信号回路導体が完全にアース
回路で覆われたことを特徴とする多層プリント配線板を
提供するものである。請求項３記載の本発明は、銅箔材
とニッケル箔材とを０．１〜３％の圧下率で圧接して製
造された多層プリント配線板用クラッド板について、銅
の選択的エッチングにより内部に完全にアース回路で覆
われた信号回路導体を形成したことを特徴とする多層プ
リント配線板の製造方法を提供するものである。請求項
６記載の本発明は、銅箔材と銀箔材とを０．１〜３％の
圧下率で圧接して製造された多層プリント配線板用クラ
ッド板について、銅の選択的エッチングにより内部に完
全にアース回路で覆われた信号回路導体を形成したこと
を特徴とする多層プリント配線板の製造方法を提供する
ものである。本発明の方法によれば、仮積層品を必要
数、重ね合わせて本積層を行って一体化するという複雑
な処理を必要としないため大量の製品を寸法の再現性良
く、容易に処理することができる。That is, the first aspect of the present invention provides a multilayer printed wiring board having a signal circuit conductor therein, the signal circuit conductor being completely covered with a ground circuit. is there. According to a third aspect of the present invention, there is provided a multilayer printed wiring board clad plate manufactured by pressing a copper foil material and a nickel foil material at a rolling reduction of 0.1 to 3% by selectively etching copper. And forming a signal circuit conductor completely covered with a ground circuit. According to a sixth aspect of the present invention, a clad plate for a multilayer printed wiring board manufactured by pressing a copper foil material and a silver foil material at a rolling reduction of 0.1 to 3% is formed inside by selective etching of copper. It is an object of the present invention to provide a method of manufacturing a multilayer printed wiring board, wherein a signal circuit conductor completely covered with a ground circuit is formed. According to the method of the present invention, it is possible to easily process a large number of products with good dimensional reproducibility because the required number of temporary laminates is not required, and the complicated process of performing the main lamination and integrating them is not required. Can be.
【００１０】[0010]
【発明の実施の形態】本発明は、内部に信号回路導体を
有し、該信号回路導体が完全にアース回路で覆われたこ
とを特徴とする多層プリント配線板を提供するものであ
り、該配線板は以下のようにして製造することができ
る。本発明の多層プリント配線板の製造の材料として
は、プリント配線板用クラッド板が用いられる。プリン
ト配線板用クラッド板としては、銅（Ｃｕ）箔材とニッ
ケル（Ｎｉ）箔材との組合せからなるクラッド板があ
り、例えば、Ｃｕ／Ｎｉ／Ｃｕ／Ｎｉ／Ｃｕの５層から
なるものがあげられる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention provides a multilayer printed wiring board having a signal circuit conductor therein, the signal circuit conductor being completely covered with a ground circuit. The wiring board can be manufactured as follows. As a material for manufacturing the multilayer printed wiring board of the present invention, a clad board for a printed wiring board is used. As a clad plate for a printed wiring board, there is a clad plate made of a combination of a copper (Cu) foil material and a nickel (Ni) foil material. For example, a clad plate having five layers of Cu / Ni / Cu / Ni / Cu is used. can give.
【００１１】また、前記のほか、銅箔材と銀（Ａｇ）箔
材とからなるクラッド板もある。この組み合わせの例と
しては、例えば請求項５記載の本発明のごとく、Ｃｕ／
Ａｇ／Ｃｕからなるものがあげられる。前記銅箔材に
は、あらかじめ銀めっきを施したものも用いることがで
きる。この場合、Ｃｕ／Ａｇ／Ｃｕ／Ａｇ／Ｃｕの５層
になる。In addition to the above, there is a clad plate made of a copper foil material and a silver (Ag) foil material. As an example of this combination, for example, Cu /
Ag / Cu may be used. As the copper foil material, a material subjected to silver plating in advance can be used. In this case, there are five layers of Cu / Ag / Cu / Ag / Cu.
【００１２】なお、説明の便宜上、前者の銅箔材とニッ
ケル箔材との組合せからなるクラッド板を材料として製
造される多層プリント配線板を本発明の第一の形態、後
者の銅箔材と銀箔材とからなるクラッド板から構成され
る多層プリント配線板を本発明の第二の形態と呼ぶこと
にする。両者は製造方法の点では基本的に共通であるの
で、基本的には本発明の第一の態様について説明した上
で、本発明の第二の態様については相違点のみをあげる
ことにする。For convenience of explanation, a multilayer printed wiring board manufactured using a clad plate made of a combination of a copper foil material and a nickel foil material as a material is referred to as a first embodiment of the present invention, and a copper foil material of the latter type. A multilayer printed wiring board composed of a clad plate made of a silver foil material will be referred to as a second embodiment of the present invention. Since both are basically common in terms of the manufacturing method, the first embodiment of the present invention will be basically described, and only the differences will be given in the second embodiment of the present invention.
【００１３】本発明の第一の実施形態に係る多層プリン
ト配線クラッド板の構造例について、図１を参照して説
明すると、銅箔からなる配線層（厚み１０〜１００μｍ
が好ましい ）となる銅層１４の両面には、ニッケルめ
っき（厚み０．５〜３μmが好ましい）若しくはニッケ
ル箔（厚さ５〜１０μm）からなるエッチングストッパ
ー層１１、１２が接合され、ベースのコアを形成してい
る。An example of the structure of the multilayer printed wiring clad board according to the first embodiment of the present invention will be described with reference to FIG. 1. A wiring layer made of copper foil (having a thickness of 10 to 100 μm)
The etching stopper layers 11 and 12 made of nickel plating (preferably 0.5 to 3 μm in thickness) or nickel foil (5 to 10 μm in thickness) are joined to both surfaces of the copper layer 14 to form a base core. Is formed.
【００１４】また、両エッチングストッパー層の外側に
は、さらに銅箔材（厚み１０〜１００μｍが好ましい
）層１０、１３が形成される。これらは、シールド壁
を形成するための層である。Further, copper foil material layers (preferably 10 to 100 μm thick) layers 10 and 13 are further formed outside the etching stopper layers. These are layers for forming a shield wall.
【００１５】この本発明の第一の実施形態に係る多層プ
リント配線板の製造方法について説明する。まず、多層
プリント配線板を製造した際に内部導体層となる銅層１
４の両面に、エッチングストッパー層１１、１２となる
ニッケルめっき層又はニッケル箔層を施してニッケル層
付銅箔材を製造する。なお、以下の記載では説明の便宜
上、ニッケルめっき層とした場合を挙げて説明するが、
代わりにニッケル箔を使用する場合も同様に行うことが
できる。A method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention will be described. First, a copper layer 1 serving as an internal conductor layer when a multilayer printed wiring board is manufactured.
A nickel plating layer or a nickel foil layer serving as the etching stopper layers 11 and 12 is applied to both surfaces of 4 to manufacture a copper foil material with a nickel layer. In the following description, a nickel plating layer will be described for convenience of explanation,
The same can be done when a nickel foil is used instead.
【００１６】本発明の第一の形態に係る多層プリント用
配線板は、基本的には、導体層等を形成する銅箔材とエ
ッチングストップ層を形成するニッケル箔材又はニッケ
ルめっき積層体と共に０．１〜３％の圧下率で冷間圧接
して作製することができる。The multilayer printed wiring board according to the first embodiment of the present invention basically has a copper foil material for forming a conductor layer and the like or a nickel foil material or a nickel plating laminate for forming an etching stop layer. It can be manufactured by cold pressing at a rolling reduction of 1 to 3%.
【００１７】圧接にあたっては、予め各材料につき活性
化処理を行う。活性化処理は、本出願人が先に特開平１
−２２４１８４号公報で開示したように、（１）１．３
３×１０〜１．３３×１０−２ Ｐａの極低圧不活性ガ
ス雰囲気中で、（２）接合面を有する前記銅箔と前記ニ
ッケル層又は前記銅箔と前記銀層をそれぞれアース接地
した一方の電極Ａとし、絶縁支持された他の電極Ｂとの
間に１〜５０ MHzの交流を印加してグロー放電を行わ
せ、（３）かつ、前記グロー放電によって生じたプラズ
マ中に露出される電極の面積が、電極Ｂの面積の１／３
以下で、（４）スパッタエッチング処理することによっ
て行うことができる。実際には例えば、ニッケルめっき
銅箔材を、図２０に示すクラッド板製造装置における巻
戻しリール２３に巻き付ける。また、柱状導体１７とな
る銅箔材１０を巻戻しリール２５に巻き付ける。巻戻し
リール２３、２５からニッケルめっき銅箔材１１、１２
と銅箔材１４を同時に巻戻し、その一部をエッチングチ
ャンバ２６内に突出した電極ロール２７、２８に巻付
け、エッチングチャンバ２６内において、スパッタエッ
チング処理して活性化する。Before pressing, an activation process is performed on each material in advance. The activation process is disclosed by the present applicant in
As disclosed in JP-A-224184, (1) 1.3.
(2) One of the copper foil and the nickel layer or the copper foil and the silver layer having a bonding surface, each of which is grounded in an extremely low pressure inert gas atmosphere of 3 × 10 to 1.33 × 10 −2 Pa. An AC of 1 to 50 MHz is applied between the electrode A and the other electrode B which is insulated and supported to cause a glow discharge, and (3) is exposed to the plasma generated by the glow discharge. The area of the electrode is １ ／ of the area of the electrode B
The following can be performed by (4) sputter etching. In practice, for example, a nickel-plated copper foil material is wound around a rewind reel 23 in the clad plate manufacturing apparatus shown in FIG. Further, the copper foil material 10 to be the columnar conductor 17 is wound around the rewind reel 25. Nickel-plated copper foil materials 11 and 12 from rewind reels 23 and 25
And the copper foil material 14 are simultaneously rewound, a part of which is wound around the electrode rolls 27 and 28 projecting into the etching chamber 26, and activated by sputter etching in the etching chamber 26.
【００１８】その後、真空槽２９内に設けた圧延ユニッ
ト３０によって冷間圧接し、３層構造を有する半導体パ
ッケージユニット用クラッド板３１を巻き取りロール３
２に巻き取る。次に、この３層構造を有する半導体パッ
ケージユニット用クラッド板３１を再度巻き戻しリール
２３に巻き付ける。また、シールド壁１８となる銅箔材
３３（図１参照）を巻戻しリール２５に巻き付ける。巻
き戻しリール２３、２５からクラッド板３１と銅箔材３
３をそれぞれ巻き戻し、その一部をエッチングチャンバ
２６内に突出した電極ロール２７、２８に巻き付け、エ
ッチングチャンバ２６内において、スパッタエッチング
処理され活性化する。After that, the semiconductor device is cold-pressed by a rolling unit 30 provided in a vacuum chamber 29 to take up a semiconductor package unit clad plate 31 having a three-layer structure.
Take up to 2. Next, the semiconductor package unit clad plate 31 having the three-layer structure is wound around the rewind reel 23 again. In addition, a copper foil material 33 (see FIG. 1) serving as the shield wall 18 is wound around the rewind reel 25. Cladding plate 31 and copper foil material 3 from rewind reels 23 and 25
3 are rewound, respectively, and a part thereof is wound around electrode rolls 27 and 28 projecting into the etching chamber 26, and is sputter-etched and activated in the etching chamber 26.
【００１９】この場合も、活性化処理は、前記と同様の
条件下で行う。こうして図１に示すように、本発明の第
一の形態に係る５層構造を有するプリント配線板用クラ
ッド板３４が得られる。In this case, the activation process is performed under the same conditions as described above. Thus, as shown in FIG. 1, a clad plate 34 for a printed wiring board having a five-layer structure according to the first embodiment of the present invention is obtained.
【００２０】また、上記設備を使用して圧接を繰返し行
うことにより、銅／ニッケル／銅／ニッケル／銅という
順番で、銅層を表裏層に設け、中間層にニッケル層を介
した多層のクラッド板を製造することができる。さら
に、上記巻戻しリールを３台以上設け、これらのリール
に銅箔材やニッケル箔材などを設置し、３台以上のリー
ルから箔材の供給を同時に受けることにより、１回の圧
接で多層構造のクラッド板を製造することができる。Further, by repeatedly performing pressure welding using the above-mentioned equipment, a copper layer is provided on the front and back layers in the order of copper / nickel / copper / nickel / copper, and a multilayer cladding having a nickel layer interposed on the intermediate layer. Boards can be manufactured. Furthermore, three or more rewind reels are provided, and copper or nickel foil materials are installed on these reels, and the foil materials are simultaneously supplied from the three or more reels. A clad plate having a structure can be manufactured.
【００２１】また、本発明の第二の態様である銅箔材と
銀箔材からなるプリント配線板用クラッド板は、図１１
に銅／銀／銅の３層からなるものの例が示されている。
これも、導体層等を形成する銅箔材と銀箔材叉は銀めっ
き積層体と共に０．１〜３％の圧下率で冷間圧接して作
製したものであるが、前記第一の態様に係るクラッド板
と同様にして製造することができる。A clad plate for a printed wiring board comprising a copper foil material and a silver foil material according to a second embodiment of the present invention is shown in FIG.
3 shows an example of a three-layer structure of copper / silver / copper.
This is also produced by cold pressing with a reduction rate of 0.1 to 3% together with a copper foil material and a silver foil material or a silver-plated laminate for forming a conductor layer or the like. It can be manufactured in the same manner as the clad plate.
【００２２】このようにして作成した多層プリント配線
板用クラッド板は、所望の大きさに切断された後、銅の
選択的にエッチングされることにより、内部に完全にア
ース回路で覆われた信号回路導体を有する多層プリント
配線板とされる。選択的エッチングは、所望の回路が形
成されるように行うことができる。したがって、直線の
回路形成はもちろん、複雑な分岐を有する回路を形成し
たものとすることも可能である。The clad plate for a multilayer printed wiring board prepared as described above is cut into a desired size, and then selectively etched with copper, whereby a signal completely covered with a ground circuit is formed inside. It is a multilayer printed wiring board having circuit conductors. The selective etching can be performed so that a desired circuit is formed. Therefore, it is possible to form not only a straight circuit but also a circuit having complicated branches.
【００２３】本発明の第一の実施形態の多層プリント用
配線基板の場合、すなわち、図１の銅、ニッケル、銅、
ニッケル、銅材の５層のクラッド板を原料として使用す
る場合について説明する。In the case of the multilayer printed wiring board according to the first embodiment of the present invention, that is, copper, nickel, copper,
The case where a clad plate having five layers of nickel and copper materials is used as a raw material will be described.
【００２４】まず、銅箔材１０の選択エッチングを行
い、銅箔材１０を柱状導体１７を残して溶解、除去す
る。次いで、エッチング液をニッケルエッチング液に変
更してニッケル層１１を除去する。除去後の状態を図３
に示す。なお、この時点で残った柱状導体１７がアース
回路になる。銅箔材のエッチング液としては硫酸＋過酸
化水素水溶液又は過硫酸水素アンモニウム水溶液を使用
することが好ましく、また、ニッケルエッチング液とし
ては、例えば市販メルテックス社メルストリップＮ−９
５０等を使用することが好ましい。First, the copper foil material 10 is selectively etched, and the copper foil material 10 is dissolved and removed while leaving the columnar conductor 17. Next, the etching solution is changed to a nickel etching solution, and the nickel layer 11 is removed. Figure 3 shows the state after removal
Shown in In addition, the pillar-shaped conductor 17 remaining at this time becomes a ground circuit. It is preferable to use an aqueous solution of sulfuric acid + hydrogen peroxide or an aqueous solution of ammonium hydrogen persulfate as an etching solution for the copper foil material, and as a nickel etching solution, for example, commercially available Meltex N-9.
It is preferable to use 50 or the like.
【００２５】なお、エッチング処理はエッチング水溶液
中に被処理体を浸漬して行うが、エッチング水溶液をス
プレー噴霧、叉は被エッチング面上に滴下して行っても
良い。スプレー噴霧、滴下の場合にはレジスト処理は最
上層のみをスピナーコート等の方法で実施すれば十分で
ある。エッチング液中に浸漬してエッチング処理する場
合には５０℃のエッチング液浴中に１〜１０分間程度浸
漬エッチングするが、個々の浴温度、浸漬時間について
は作業量、時間等によって最適条件を定めることができ
る。Although the etching process is performed by immersing the object to be processed in an aqueous solution of etching, the aqueous solution of etching may be sprayed or dropped on the surface to be etched. In the case of spraying or dropping, it is sufficient that the resist treatment is performed only on the uppermost layer by a method such as spinner coating. When immersing in an etching solution to perform an etching treatment, immersion etching is performed in an etching solution bath at 50 ° C. for about 1 to 10 minutes. be able to.
【００２６】次に、エッチング処理後の空隙に絶縁樹脂
を塗布して絶縁樹脂層１８を形成し、その表面を研磨し
柱状導体層１７の表面を露出させる（図４）。この場合
の絶縁樹脂としてはエポキシ樹脂、ポリイミド樹脂等が
使用できる。Next, an insulating resin is applied to the gap after the etching process to form an insulating resin layer 18, and the surface thereof is polished to expose the surface of the columnar conductor layer 17 (FIG. 4). In this case, an epoxy resin, a polyimide resin, or the like can be used as the insulating resin.
【００２７】一方、銅箔材１０があったのとは反対側の
片面の銅箔材１３の表面に前記と同様のフォトレジスト
を塗布して（図５）、銅箔材１３の選択エッチングを行
い、銅箔材を柱状導体層１７を残して溶解、除去し、さ
らにエッチング液を変更してニッケル層１２も除去する
（図６）。この場合の柱状導体１７も最終的にアース回
路を形成することになる（図１０の符号２０および２１
参照）。なお、エッチング液としては前回と同様のもの
が使用可能である。On the other hand, a photoresist similar to the above is applied to the surface of the copper foil material 13 on one side opposite to the side where the copper foil material 10 was present (FIG. 5), and the copper foil material 13 is selectively etched. Then, the copper foil material is dissolved and removed leaving the columnar conductor layer 17, and the nickel layer 12 is also removed by changing the etching solution (FIG. 6). The columnar conductor 17 in this case also finally forms an earth circuit (reference numerals 20 and 21 in FIG. 10).
reference). Note that the same etchant as the previous one can be used.
【００２８】次に図７に示すように、もう一度フォトレ
ジストを塗布して、露光、現像し、その後、図８に記す
ように中間銅層１４を選択エッチング除去し、信号回路
を形成する。この場合のエッチング液も前記と同様であ
る。Next, as shown in FIG. 7, a photoresist is applied once again, exposed and developed, and then, as shown in FIG. 8, the intermediate copper layer 14 is selectively etched and removed to form a signal circuit. The etching solution in this case is the same as described above.
【００２９】中間銅層の選択エッチングが終了したら、
エッチング後の空隙に、前回同様のエポキシ樹脂、ポリ
イミド樹脂等からなる絶縁樹脂を充填して、樹脂層１８
を形成し（図９）、ついで表面研磨を行って柱状導体１
７の表面を露出させる。After the selective etching of the intermediate copper layer is completed,
The space after the etching is filled with the same insulating resin made of epoxy resin, polyimide resin, etc.
Is formed (FIG. 9), and the surface is polished.
7 is exposed.
【００３０】次に、図１０に示すようにこの素子全体に
無電解銅めっきを施して全体を無電解銅めっき層１９で
被覆して、シールド壁とする。こうして、内部に完全に
アース回路で覆われた信号回路導体が形成された多層プ
リント配線板が完成する。Next, as shown in FIG. 10, the entire device is subjected to electroless copper plating, and the entire device is covered with an electroless copper plating layer 19 to form a shield wall. Thus, a multilayer printed wiring board having a signal circuit conductor completely covered with a ground circuit formed therein is completed.
【００３１】次に本発明の第二の実施形態に係る三層の
基板の場合について説明する。基本的には、クラッド板
が３層であることを除けば第一の実施形態の場合と同様
に銅の選択的エッチングを行うことにより、内部に完全
にアース回路で覆われた信号回路導体が形成された多層
プリント配線板を製造することができる。３層基板の処
理操作は、基本的には前記第一の実施形態の５層基板の
場合と同じであるが、エッチングストッパー層が存在し
ないために、エッチングストッパー層を除去する工程が
省ける。Next, the case of a three-layer substrate according to the second embodiment of the present invention will be described. Basically, by selectively etching copper in the same manner as in the first embodiment except that the cladding plate has three layers, the signal circuit conductor completely covered with the ground circuit is formed. The formed multilayer printed wiring board can be manufactured. The processing operation of the three-layer substrate is basically the same as that of the five-layer substrate of the first embodiment, but the step of removing the etching stopper layer can be omitted because there is no etching stopper layer.
【００３２】まず、図１１に示すような３層構造のクラ
ッド板を用意しておいて、図１２に示すように銅箔材１
０の表面にフォトレジスト膜１６を形成した後、露光、
現像する。First, a clad plate having a three-layer structure as shown in FIG. 11 is prepared, and as shown in FIG.
After forming a photoresist film 16 on the surface of
develop.
【００３３】次に、銅箔材１０の選択エッチングを行
い、銅箔材１０を柱状導体１７を残して溶解、除去す
る。次いで、エッチング処理後の空隙に絶縁樹脂を塗
布、充填して絶縁層１８を形成し、さらに表面を研磨し
て柱状導体１７の表面を露出させる。この状態を図１３
に示した。絶縁樹脂としては前回同様エポキシ樹脂、ポ
リイミド樹脂等を使用する。Next, the copper foil material 10 is selectively etched, and the copper foil material 10 is dissolved and removed while leaving the columnar conductor 17. Next, an insulating resin is applied to and filled in the voids after the etching process to form an insulating layer 18, and the surface is further polished to expose the surface of the columnar conductor 17. This state is shown in FIG.
It was shown to. As the insulating resin, an epoxy resin, a polyimide resin, or the like is used as in the previous case.
【００３４】その後、別の片面の銅箔材１３の表面に前
記と同様のフォトレジスト１６を塗布して（図１３）、
銅箔材１３の選択エッチングを行って柱状導体を形成
し、次いで銀箔材１５の選択エッチングを、エッチング
液に硝酸第二鉄水溶液を使用して行い、信号回路を形成
する（図１４）。Thereafter, a photoresist 16 similar to the above is applied to the surface of another copper foil material 13 on one side (FIG. 13).
The copper foil material 13 is selectively etched to form a columnar conductor, and then the silver foil material 15 is selectively etched using an aqueous ferric nitrate solution as an etchant to form a signal circuit (FIG. 14).
【００３５】最後に、図７に示すようにエッチング後の
空隙に、前回同様のエポキシ樹脂又はポリイミド樹脂か
らなる絶縁樹脂を充填して、絶縁樹脂層１８を形成し
（図１５）、この素子全体に無電解銅めっきを施して信
号回路形成部分を残して全体を銅材で被覆して、シール
ド壁とする（図１５）。このようにして本発明の多層プ
リント用配線板が製造される。なお、分岐形状の信号配
線用としたい場合は、所望の配線形状に合わせて上記製
造工程中のレジストパターンを描くこととなる。例え
ば、Ｔ字型の配線用としたい場合は、銅箔材上に図１６
のようなレジストパターンを描いた後、選択的エッチン
グを行うことにより、図１７のごときシールド壁が得ら
れる。そして順次工程を進めていくと、所望のＴ字型の
信号回路が形成される（図１８、１９）。この原理によ
り、Ｔ字型回路のみならず複雑な回路であっても容易に
形成することができることになる。Finally, as shown in FIG. 7, the space after the etching is filled with an insulating resin made of the same epoxy resin or polyimide resin as the previous time to form an insulating resin layer 18 (FIG. 15). Is subjected to electroless copper plating, and the entire surface is covered with a copper material except for a signal circuit forming portion to form a shield wall (FIG. 15). Thus, the multilayer printed wiring board of the present invention is manufactured. In the case where it is desired to use a branched signal wiring, a resist pattern in the above manufacturing process is drawn according to a desired wiring shape. For example, if it is desired to use a T-shaped wiring, a copper foil material as shown in FIG.
After a resist pattern as described above is drawn, selective etching is performed to obtain a shield wall as shown in FIG. Then, by sequentially proceeding with the steps, a desired T-shaped signal circuit is formed (FIGS. 18 and 19). By this principle, not only a T-shaped circuit but also a complicated circuit can be easily formed.
【００３６】[0036]
【発明の効果】以上、説明したようにこの発明の特徴は
加圧接合して得た複数層のクラッド板を使用してエッチ
ング処理の繰り返しという単純な方法で多層プリント用
配線板を容易に作製することができるので、大量の製品
を寸法の再現性良く、容易に処理することができる。特
に、複雑な回路構造を有する多層プリント用配線板であ
っても容易に製造することができることから、産業上有
用である。As described above, the feature of the present invention is that a multilayer printed wiring board can be easily manufactured by a simple method of repeating etching processing using a plurality of clad plates obtained by pressure bonding. Therefore, a large number of products can be easily processed with good dimensional reproducibility. In particular, it is industrially useful because even a wiring board for multilayer printing having a complicated circuit structure can be easily manufactured.
【図１】本発明の第一の実施形態に係る多層プリント配
線板の製造方法の工程説明図である（配線板用クラッド
材の断面図）。FIG. 1 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention (cross-sectional view of a clad material for a wiring board).
【図２】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（レジスト塗布時
の断面図）。FIG. 2 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention (cross-sectional view at the time of resist application).
【図３】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（エッチング後の
断面図）。FIG. 3 is a process explanatory view (cross-sectional view after etching) of the method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention.
【図４】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（絶縁樹脂塗布後
の断面図）。FIG. 4 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention (cross-sectional view after application of an insulating resin).
【図５】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（レジスト塗布時
の断面図）。FIG. 5 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention (cross-sectional view at the time of resist application).
【図６】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（エッチング後の
断面図）。FIG. 6 is a process explanatory view (cross-sectional view after etching) of the method for manufacturing the multilayer printed wiring board according to the first embodiment of the present invention.
【図７】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（レジスト塗布時
の断面図）。FIG. 7 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention (cross-sectional view at the time of resist application).
【図８】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（エッチング後の
断面図）。FIG. 8 is a process explanatory view (cross-sectional view after etching) of the method for manufacturing the multilayer printed wiring board according to the first embodiment of the present invention.
【図９】本発明の第一の実施形態に係る多層プリント配
線基板の製造方法の工程説明図である（絶縁樹脂塗布後
の断面図）。FIG. 9 is a process explanatory view of the method for manufacturing the multilayer printed wiring board according to the first embodiment of the present invention (cross-sectional view after application of an insulating resin).
【図１０】本発明の第一の実施形態に係る多層プリント
配線基板の製造方法の工程説明図である（無電解銅めっ
き後の断面図）。FIG. 10 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the first embodiment of the present invention (cross-sectional view after electroless copper plating).
【図１１】本発明の第二の実施形態に係る多層プリント
配線基板の製造方法の工程説明図である（配線板用クラ
ッド材の断面図）。FIG. 11 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the second embodiment of the present invention (cross-sectional view of a clad material for a wiring board).
【図１２】本発明の第二の実施形態に係る多層プリント
配線基板の製造方法の工程説明図である（レジスト塗布
後の断面図）。FIG. 12 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the second embodiment of the present invention (cross-sectional view after resist application).
【図１３】本発明の第二の実施形態に係る多層プリント
配線基板の製造方法の工程説明図である（エッチングお
よび絶縁樹脂塗布後の断面図））。FIG. 13 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the second embodiment of the present invention (cross-sectional view after etching and application of insulating resin)).
【図１４】本発明の第二の実施形態に係る多層プリント
配線基板の製造方法の工程説明図である（エッチング後
の断面図）。FIG. 14 is a process explanatory view (cross-sectional view after etching) of a method for manufacturing a multilayer printed wiring board according to the second embodiment of the present invention.
【図１５】本発明の第二の実施形態に係る多層プリント
配線基板の製造方法の工程説明図である（エッチング及
び信号回路形成後の断面図）。FIG. 15 is a process explanatory view of a method for manufacturing a multilayer printed wiring board according to the second embodiment of the present invention (cross-sectional view after etching and signal circuit formation).
【図１６】本発明の多層プリント配線基板において分岐
した配線基板を形成したい場合のレジストパターンを示
す平面図である。FIG. 16 is a plan view showing a resist pattern when a branched wiring board is to be formed in the multilayer printed wiring board of the present invention.
【図１７】本発明の多層プリント配線基板において分岐
した配線基板を形成したい場合のエッチング後の状態を
示す立体図である。FIG. 17 is a three-dimensional view showing a state after etching when it is desired to form a branched wiring board in the multilayer printed wiring board of the present invention.
【図１８】本発明の多層プリント配線基板における分岐
した配線基板の信号回路の一例を示す立体図である。FIG. 18 is a three-dimensional view showing an example of a signal circuit of a branched wiring board in the multilayer printed wiring board of the present invention.
【図１９】本発明の多層プリント配線基板における分岐
した配線基板の信号回路の一例を示す平面図である。FIG. 19 is a plan view showing an example of a signal circuit of a branched wiring board in the multilayer printed wiring board of the present invention.
【図２０】本発明のクラッド金属板の製造装置の正面断
面図である。FIG. 20 is a front sectional view of the apparatus for manufacturing a clad metal sheet of the present invention.
１０、１３、１４ 銅箔材 １１、１２ ニッケル箔材又はニッケルめっき層 １５ 銀箔材又は銀めっき層 １６ フォトレジスト １７ 柱状導体 １８ 絶縁樹脂層 １９ 無電解銅めっき層（シールド層） ２０ 信号回路 ２１ アース回路 ２２ シールド壁 ２３、２５ 巻戻しリール ２４ 柱状導体となる銅箔材 ２６ エッチングチャンバー ２７、２８ 電極ロール ２９ 真空槽 ３０ 圧延ユニット ３１、３４ クラッド板 ３２ 巻取りロール 10, 13, 14 Copper foil material 11, 12 Nickel foil material or nickel plating layer 15 Silver foil material or silver plating layer 16 Photoresist 17 Columnar conductor 18 Insulating resin layer 19 Electroless copper plating layer (shield layer) 20 Signal circuit 21 Ground Circuit 22 Shield wall 23, 25 Rewind reel 24 Copper foil material to be a columnar conductor 26 Etching chamber 27, 28 Electrode roll 29 Vacuum tank 30 Rolling unit 31, 34 Cladding plate 32 Winding roll
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡本 浩明 山口県下松市東豊井1296番地の１ 東洋鋼 鈑株式会社技術研究所内 (72)発明者 吉田 一雄 山口県下松市東豊井1296番地の１ 東洋鋼 鈑株式会社技術研究所内 Ｆターム(参考） 5E346 CC32 CC37 CC39 DD12 GG22 HH32 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroaki Okamoto 1296, Higashi-Toyoi, Higashi-Toyoi, Kudamatsu City, Yamaguchi Prefecture (72) Inventor Kazuo Yoshida 1, 1296, Higashi-Toyoi, Kudamatsu City, Yamaguchi Prefecture F-term in Technical Research Institute Co., Ltd. (reference) 5E346 CC32 CC37 CC39 DD12 GG22 HH32
Claims (11)
導体が完全にアース回路で覆われたことを特徴とする多
層プリント配線板。1. A multilayer printed wiring board having a signal circuit conductor therein, wherein the signal circuit conductor is completely covered by a ground circuit.
記載の多層プリント配線板。2. The signal circuit conductor according to claim 1, wherein said signal circuit conductor has a branch shape.
The multilayer printed wiring board according to the above.
の圧下率で圧接して製造された多層プリント配線板用ク
ラッド板について、銅の選択的エッチングにより内部に
完全にアース回路で覆われた信号回路導体を形成したこ
とを特徴とする多層プリント配線板の製造方法。3. A copper foil material and a nickel foil material having a content of 0.1 to 3%.
A multilayer printed wiring board characterized in that a signal circuit conductor completely covered with a ground circuit is formed inside by selective etching of copper in a clad plate for a multilayer printed wiring board manufactured by pressing with a rolling reduction of Manufacturing method.
ニッケル／銅／ニッケル／銅の５層からなる請求項３記
載の多層プリント配線板の製造方法。4. A clad plate for a multilayer printed wiring board comprising copper /
4. The method for manufacturing a multilayer printed wiring board according to claim 3, comprising five layers of nickel / copper / nickel / copper.
又は両面にニッケルめっきを具備する銅箔材と他の銅箔
材又は片面にニッケルめっきを具備する銅箔材とを０．
１〜３％の圧下率で圧接して製造されたものである請求
項３または４記載の多層プリント配線板の製造方法。5. A clad plate for a multilayer printed wiring board comprising a copper foil material having nickel plating on one or both surfaces and another copper foil material or a copper foil material having nickel plating on one surface.
The method for manufacturing a multilayer printed wiring board according to claim 3 or 4, wherein the method is manufactured by pressing with a rolling reduction of 1 to 3%.
率で圧接して製造された多層プリント配線板用クラッド
板について、銅の選択的エッチングにより内部に完全に
アース回路で覆われた信号回路導体を形成したことを特
徴とする多層プリント配線板の製造方法。6. A multilayered printed wiring board clad plate manufactured by pressing a copper foil material and a silver foil material at a rolling reduction of 0.1 to 3%, and a complete ground circuit is formed inside the clad plate by selective etching of copper. A method for manufacturing a multilayer printed wiring board, comprising forming a signal circuit conductor covered with a.
銀／銅の３層からなる請求項６記載の多層プリント配線
板の製造方法。7. A clad plate for a multilayer printed wiring board comprising copper /
7. The method for producing a multilayer printed wiring board according to claim 6, comprising three layers of silver / copper.
に銀めっきを具備する銅箔材と他の銅箔材とを０．１〜
３％の圧下率で圧接して製造されたものである請求項６
又は７記載の多層プリント配線板の製造方法。8. A clad plate for a multilayer printed wiring board, wherein a copper foil material having silver plating on one side and another copper foil material are 0.1 to 0.1%.
7. It is manufactured by pressing at a rolling reduction of 3%.
Or a method for producing a multilayer printed wiring board according to claim 7.
ント配線板用クラッド板の片面の銅層に回路シールド壁
形成用のレジストパターンを形成した後、銅の選択的エ
ッチングを行い回路シールド壁を形成し、ニッケル層を
除去し、続いてエッチング面に絶縁樹脂を塗布後、クラ
ッド板の裏面の銅層に回路シールド壁形成用のレジスト
パターンを形成した後、銅の選択的エッチングを行い回
路シールド壁を形成し、次に回路をエッチングで形成
し、エッチング面に絶縁樹脂を塗布後、両面に銅めっき
を施すことによりシールド壁を形成することを特徴とす
る多層プリント配線板の製造方法。9. A circuit shield formed by forming a resist pattern for forming a circuit shield wall on a copper layer on one surface of a clad plate for a multilayer printed wiring board according to any one of claims 3 to 5, and selectively etching copper. After forming the wall, removing the nickel layer, applying insulating resin on the etched surface, forming a resist pattern for forming the circuit shield wall on the copper layer on the back surface of the clad plate, and selectively etching copper Forming a circuit shield wall, then forming a circuit by etching, applying an insulating resin to the etched surface, and forming a shield wall by applying copper plating to both surfaces. .
プリント配線板用クラッド板について、該クラッド板の
片面の銅層に回路シールド壁形成用のレジストパターン
を形成した後、銅の選択的エッチングを行い回路シール
ド壁を形成し、続いてエッチング面に絶縁樹脂を塗布
後、クラッド板の裏面の銅層に回路シールド壁形成用の
レジストパターンを形成した後、銅の選択的エッチング
を行い回路シールド壁を形成し、中間層の銀のエッチン
グを行い回路を形成し、エッチング面に絶縁樹脂を塗布
後、両面に銅めっきを施すことによりシールド壁を形成
することを特徴とする請求項６〜８記載のいずれかの多
層プリント配線板の製造方法。10. The copper clad plate for a multilayer printed wiring board according to claim 6, after a resist pattern for forming a circuit shield wall is formed on a copper layer on one surface of the clad plate, and then copper is selected. After performing a selective etching to form a circuit shield wall, then applying an insulating resin on the etched surface, forming a resist pattern for forming a circuit shield wall on a copper layer on the back surface of the clad plate, and selectively etching copper. 7. The shield wall is formed by forming a circuit shield wall, etching a silver layer in the intermediate layer to form a circuit, applying an insulating resin on the etched surface, and then plating copper on both surfaces. 9. The method for manufacturing a multilayer printed wiring board according to any one of items 8 to 8.
なるようにする請求項９または１０記載の多層プリント
配線板の製造方法。11. The method for manufacturing a multilayer printed wiring board according to claim 9, wherein the signal circuit conductor has a shape including a branch shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36279399A JP4195162B2 (en) | 1999-12-21 | 1999-12-21 | Multilayer printed wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36279399A JP4195162B2 (en) | 1999-12-21 | 1999-12-21 | Multilayer printed wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001177240A true JP2001177240A (en) | 2001-06-29 |
| JP4195162B2 JP4195162B2 (en) | 2008-12-10 |
Family
ID=18477746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36279399A Expired - Fee Related JP4195162B2 (en) | 1999-12-21 | 1999-12-21 | Multilayer printed wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4195162B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100722741B1 (en) | 2005-12-07 | 2007-05-30 | 삼성전기주식회사 | Multilayer printed circuit board and fabricating method therefore |
| WO2012087058A3 (en) * | 2010-12-24 | 2012-10-04 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| WO2012087059A3 (en) * | 2010-12-24 | 2012-10-04 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| KR101231273B1 (en) * | 2010-12-24 | 2013-02-07 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| KR101231525B1 (en) * | 2010-12-24 | 2013-02-07 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| KR101251749B1 (en) | 2010-12-24 | 2013-04-05 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| KR101262513B1 (en) | 2010-12-24 | 2013-05-08 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| US9497853B2 (en) | 2010-12-24 | 2016-11-15 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100722741B1 (en) | 2005-12-07 | 2007-05-30 | 삼성전기주식회사 | Multilayer printed circuit board and fabricating method therefore |
| WO2012087058A3 (en) * | 2010-12-24 | 2012-10-04 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| WO2012087059A3 (en) * | 2010-12-24 | 2012-10-04 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| KR101231273B1 (en) * | 2010-12-24 | 2013-02-07 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| KR101231525B1 (en) * | 2010-12-24 | 2013-02-07 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| KR101251749B1 (en) | 2010-12-24 | 2013-04-05 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| KR101262513B1 (en) | 2010-12-24 | 2013-05-08 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| CN103416110A (en) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing the same |
| US20140060893A1 (en) * | 2010-12-24 | 2014-03-06 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| US9497853B2 (en) | 2010-12-24 | 2016-11-15 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| US9572250B2 (en) | 2010-12-24 | 2017-02-14 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| EP2644010A4 (en) * | 2010-12-24 | 2017-09-27 | LG Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
| US9907164B2 (en) | 2010-12-24 | 2018-02-27 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
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|---|---|
| JP4195162B2 (en) | 2008-12-10 |
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