JP2001108325A - Thermoelectric cooler/heater and structure using the same - Google Patents
Thermoelectric cooler/heater and structure using the sameInfo
- Publication number
- JP2001108325A JP2001108325A JP28046299A JP28046299A JP2001108325A JP 2001108325 A JP2001108325 A JP 2001108325A JP 28046299 A JP28046299 A JP 28046299A JP 28046299 A JP28046299 A JP 28046299A JP 2001108325 A JP2001108325 A JP 2001108325A
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- Japan
- Prior art keywords
- thermoelectric
- cooling device
- thermoelectric cooling
- heat
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は熱エネルギーと電気
エネルギーとを相互に変換可能な熱電素子を用い、広い
面積に熱電素子を分散配置した、熱電冷却装置及びそれ
を用いた構造物に係り、特に、パネル状の空調システ
ム、保冷・保温システムに用いるのに適した熱電冷却加
熱装置の構造とそれを用いた構造体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric cooling device using thermoelectric elements capable of mutually converting thermal energy and electric energy and dispersing the thermoelectric elements over a wide area, and a structure using the same. In particular, the present invention relates to a structure of a thermoelectric cooling / heating device suitable for use in a panel-shaped air conditioning system and a cooling / heating system and a structure using the same.
【０００２】[0002]
【従来の技術】熱電冷却装置の従来技術としては、例え
ば、特開明６４−６３７３０号公報に記載の空調機器が
知られている。これはパーティションの一部に熱電素子
モジュールを埋め込み、素子が吸い込んだ熱をフィンに
よって放熱するものである。2. Description of the Related Art As a conventional technique of a thermoelectric cooling device, for example, an air conditioner described in Japanese Patent Application Laid-Open No. 64-63730 is known. In this method, a thermoelectric element module is embedded in a part of a partition, and heat absorbed by the element is radiated by fins.
【０００３】また、別の公知技術として、特開明６３−
７３０３７号公報に記載のものが知られている。これ
も、パーティションの一部に熱電素子モジュールを組み
込み、素子が吸い込んだ熱を多数の針状フィンを通して
放熱するものである。[0003] Another known technique is disclosed in
No. 73037 is known. In this method, a thermoelectric element module is incorporated in a part of a partition, and heat absorbed by the element is radiated through a large number of needle fins.
【０００４】また、断熱材を構成要素とした冷却パネル
として、特開平９−４２８０１号公報に記載のものがあ
る。As a cooling panel having a heat insulating material as a component, there is a cooling panel described in Japanese Patent Application Laid-Open No. 9-42801.
【０００５】[0005]
【発明が解決しようとする課題】上記特開昭６４−６３
７３０号公報や特開昭６３−７３０３７号公報に記載の
空調機器では、図９のように板材６２の上に電気絶縁層
１５を介して電極２１を設置し、その上に熱電素子４０
を密集させて実装する。熱電素子４０を密集させて実装
するため、放熱部の熱流束が大きく、パネル表面から自
然放熱できないので、図１０のように放熱板となる板材
６２の上に放熱フィン７４を設ける必要があった。この
フィンはかなりのスペースを必要とするので、パーティ
ッションの占有面積が広がる、重くなる等の課題があっ
た。SUMMARY OF THE INVENTION The above-mentioned JP-A-64-63
In the air conditioner described in Japanese Unexamined Patent Application Publication No. 730 and No. 63-73037, the electrode 21 is provided on the plate member 62 via the electric insulating layer 15 as shown in FIG.
Is implemented densely. Since the thermoelectric elements 40 are densely mounted, the heat radiating portion has a large heat flux and cannot radiate heat naturally from the panel surface. Therefore, it is necessary to provide the radiating fins 74 on the plate member 62 serving as the radiating plate as shown in FIG. . Since these fins require a considerable space, there are problems such as an increase in the area occupied by the partitions and an increase in the weight.
【０００６】また、上記公知例ではいずれも複雑な形状
をしており、部品点数が多いため、コスト高になる傾向
があった。さらに、部品点数が多いことから随所で熱抵
抗が存在し、パネルの吸熱面から放熱面までの熱損失が
大きく、システムのエネルギー効率が悪い。Further, in the above-mentioned known examples, all have complicated shapes and a large number of parts, so that the cost tends to be high. Furthermore, since the number of components is large, thermal resistance is present everywhere, the heat loss from the heat absorbing surface to the heat radiating surface of the panel is large, and the energy efficiency of the system is poor.
【０００７】一方、上記特開平９−４２８０１号公報に
記載冷却パネルは、断熱材を介在させることにより熱電
素子同士の間で起こる熱の流れに起因する熱損失や放熱
側から吸熱側への輻射による熱損失を低減でき、システ
ム効率を向上できる。On the other hand, the cooling panel described in Japanese Patent Application Laid-Open No. 9-42801 has a heat loss caused by the flow of heat between thermoelectric elements due to the interposition of a heat insulating material, and radiation from the heat radiating side to the heat absorbing side. Heat loss can be reduced, and system efficiency can be improved.
【０００８】しかし、例えば、断熱材を用いて熱の逆流
を１O％以内に抑えるためには、２０〜５０mm程度の厚
みの断熱材が必要になる。そのため、熱電素子の長さも
それと同じ程度必要になる。したがって、通常市販され
ている１〜２mm程度の熱電素子でパネルを構築しようと
する場合、断熱材の厚みを十分にとることができず、断
熱材の持つ本来の特徴を十分に発揮させることは難し
い。However, for example, in order to suppress the backflow of heat to within 10% by using a heat insulating material, a heat insulating material having a thickness of about 20 to 50 mm is required. Therefore, the length of the thermoelectric element is required to be approximately the same. Therefore, when trying to construct a panel with a thermoelectric element of about 1 to 2 mm which is usually commercially available, the thickness of the heat insulating material cannot be sufficiently obtained, and the original characteristics of the heat insulating material cannot be sufficiently exhibited. difficult.
【０００９】そこで、上記問題を解決するために、本出
願人は先に特願平１０−５８０５７号を出願した。この
発明は図１１に示すように、熱伝導性を有する熱伝導板
１の表面に電気絶縁層１０を介して形成した電極２０を
有する配線基板３０と配線基板３０に分散配置した複数
個の熱電素子４０と熱電素子４０を電気的に接続する電
極５０とこれらに対向する板材６０とを構成要素とし、
熱電素子４０の高さ方向の寸法より長い支柱材８０を板
材６０と熱電素子４０との間に少なくとも１つ以上設
け、電極５０と板材６０の間に電気絶縁層１５を設け、
かつ板材６０と配線基板３０に挟まれた空間に断熱材７
０が存在することを特徴とする熱電冷却装置９５とそれ
を用いた構造物に関する発明である。上記発明により、
従来技術に対して、熱電素子を用いた空調、保冷・保温
システムで、軽量かつコンパクト、コスト的に有利であ
り、エネルギー効率的に優れる熱電冷却装置及びそれを
用いた構造物を提供できるようになった。In order to solve the above problem, the present applicant has previously filed Japanese Patent Application No. 10-58057. As shown in FIG. 11, the present invention relates to a wiring board 30 having electrodes 20 formed on the surface of a heat conducting plate 1 having thermal conductivity via an electric insulating layer 10 and a plurality of thermoelectric boards distributed on the wiring board 30. An electrode 50 for electrically connecting the element 40 and the thermoelectric element 40 and a plate member 60 facing the electrode 50 as constituent elements;
At least one support member 80 longer than the height dimension of the thermoelectric element 40 is provided between the plate member 60 and the thermoelectric element 40, and the electric insulating layer 15 is provided between the electrode 50 and the plate member 60,
In addition, a heat insulating material 7 is provided in a space between the plate material 60 and the wiring board 30.
0 is an invention relating to a thermoelectric cooling device 95 characterized by the existence of a zero and a structure using the same. According to the above invention,
Compared with the prior art, an air-conditioning system using a thermoelectric element, a cooling and warming system, a lightweight, compact, cost-effective thermoelectric cooling device with excellent energy efficiency and a structure using the same can be provided. became.
【００１０】しかし、さらに以下に述べるように、熱電
冷却装置およびそれを用いた構造体の信頼性に関する３
つの課題と、熱電冷却装置及びそれを用いた構造物の冷
却性能改善に関する２つの課題があることがわかった。However, as will be described further below, the thermoelectric cooling device and the reliability of the structure using the same have to be considered.
It was found that there were two problems and two problems related to the improvement of the cooling performance of the thermoelectric cooling device and the structure using the same.
【００１１】信頼性に関する第１の課題は、配線基板３
０に複数個の熱電素子４０を配置し、熱電素子４０、電
極５０、電気絶縁層１５、支柱材８０と横み重ねた熱電
要素体９０を構成するとき、熱電要素体９０を構成する
の部材の高さ方向の寸法が必ずしも等しくないため、複
数の熱電要素体９０の高さ寸法は微妙に異なってくる。
そのため、電極２０を有する配線基板３０と板材６０の
間に複数の熱電要素体９０を固定すると、高さ寸法の微
妙な違いにより、高さ寸法の小さな熱電要素体９０で
は、電極２０と熱電素子４０、熱電素子４０と電極５
０、電極５０と電気絶縁層１５、電気絶縁層１５と支柱
材８０、支柱材８０と板材６０のそれぞれの接合部に引
っ張り応力がかかり、これらの接合部の弱い部分が剥が
れると言う問題が発生する。The first problem concerning reliability is that the wiring board 3
When a plurality of thermoelectric elements 40 are arranged on the thermoelectric element 40 to form a thermoelectric element body 90 laid sideways on the thermoelectric element 40, the electrode 50, the electric insulating layer 15, and the support member 80, the members constituting the thermoelectric element body 90 Are not necessarily equal to each other, so that the height dimensions of the plurality of thermoelectric element bodies 90 are slightly different.
Therefore, when a plurality of thermoelectric element bodies 90 are fixed between the wiring board 30 having the electrodes 20 and the plate member 60, the electrodes 20 and the thermoelectric elements are small in the thermoelectric element bodies 90 having a small height due to a slight difference in height. 40, thermoelectric element 40 and electrode 5
0, a tensile stress is applied to each joint between the electrode 50 and the electric insulating layer 15, the electric insulating layer 15 and the support member 80, and the joint between the support member 80 and the plate member 60, and a problem that a weak portion of the joint is peeled off occurs. I do.
【００１２】また、板材６０と配線基板３０に挟まれた
空間に断熱材としてウレタン等を発泡するとき、発泡型
に入れて発泡を行うにも係わらず発泡型が微妙に膨らむ
ために、上記それぞれの接合部に引っ張り応力がかか
り、これらの接合部の弱い部分が剥がれると言う問題も
発生する。Further, when urethane or the like is foamed as a heat insulating material in the space between the plate member 60 and the wiring board 30, the foaming mold slightly expands despite the foaming in the foaming mold. There is also a problem that a tensile stress is applied to the joints, and the weak portions of these joints are peeled off.
【００１３】信頼性に関する第２の課題は、例えば、配
線基板３０の空気に触れる面が放熱面２となり、板材６
０の空気に触れる面が冷却面３となるとき、放熱面２は
膨張し、冷却面３は収縮するため、熱電冷却装置全体が
たわむことになる。そのため、熱電要素体９０に曲げ応
力がかかり、電極２０と熱電素子４０、熱電素子４０と
電極５０、電極５０と電気絶縁層１５、電気絶縁層１５
と支柱材８０、支柱材８０と板材６０のそれぞれの接合
部の弱い部分が剥がれると言う問題が発生する。特に図
１２に示すように、熱電素子４０と電極５０、電極２０
の接合部がY方向の曲げ応力に対して弱い。A second problem with respect to reliability is that, for example, the surface of the wiring board 30 that contacts the air is the heat radiation surface 2 and the plate material 6
When the surface in contact with the zero air becomes the cooling surface 3, the heat radiation surface 2 expands and the cooling surface 3 contracts, so that the entire thermoelectric cooling device bends. Therefore, a bending stress is applied to the thermoelectric element body 90, and the electrode 20 and the thermoelectric element 40, the thermoelectric element 40 and the electrode 50, the electrode 50 and the electric insulating layer 15, the electric insulating layer 15
Then, a problem occurs that the weak portions of the respective joints between the support member 80 and the support member 80 and the plate member 60 are peeled off. In particular, as shown in FIG.
Are weak against bending stress in the Y direction.
【００１４】信頼性に関する第３の課題は、熱電冷却装
置９５を用いて、例えば恒温槽を構成するため、箱体１
００を構成し、その箱体を電源あるいは制御機器を収納
する制御ボックス１１０に取り付けるとき、熱電冷却装
置９５を構成する配線基板３０をアルミ材料として、制
御ボックス１１０を鉄系の材料として、両者を機械的に
締め付けて結合すると、両者の材質の違いによる熱膨張
係数の違いにより、配線基板３０が熱膨張により伸びよ
うとするのを鉄系の材料で構成される制御ボックス１１
０が延びを拘束するため、熱電冷却装置９５が歪み、電
極２０と熱電素子４０、熱電素子４０と電極５０、電極
５０と電気絶縁層１５、電気絶縁層１５と支柱材８０、
支柱材８０と板材６０のそれぞれの接合部の弱い部分が
剥がれるという問題が発生する。A third problem related to reliability is that, for example, a thermostat is used to form a thermostat using a thermoelectric cooling device 95.
When the box body is attached to the control box 110 containing a power supply or control equipment, the wiring board 30 constituting the thermoelectric cooling device 95 is made of aluminum material, the control box 110 is made of iron-based material, and both are formed. When mechanically tightened and joined, the control box 11 made of an iron-based material prevents the wiring board 30 from expanding due to thermal expansion due to a difference in thermal expansion coefficient due to a difference in both materials.
Since 0 restricts the elongation, the thermoelectric cooling device 95 is distorted, and the electrode 20 and the thermoelectric element 40, the thermoelectric element 40 and the electrode 50, the electrode 50 and the electric insulating layer 15, the electric insulating layer 15 and the support member 80,
A problem arises in that the weak portions of the joints between the support member 80 and the plate member 60 are peeled off.
【００１５】また、熱電冷却装置の冷却性能の改善に関
する第１の課題は、熱電素子４０の吸熱面４１での吸熱
量Ｑｃが支柱材８０を通して板材６０からＱｃ吸熱する
のが理想であるが、実際には支柱材８０の側面から吸熱
するため、板材６０から吸熱できる熱量はＱｃより小さ
くなる問題がある。The first problem with respect to the improvement of the cooling performance of the thermoelectric cooling device is that it is ideal that the heat absorption amount Qc of the heat absorbing surface 41 of the thermoelectric element 40 absorbs Qc from the plate member 60 through the support member 80. Actually, since heat is absorbed from the side surface of the support member 80, there is a problem that the amount of heat that can be absorbed from the plate member 60 becomes smaller than Qc.
【００１６】熱電冷却装置の冷却性能の改善に関する第
２の課題は、熱電素子を分散配置し、放熱面の熱密度を
下げたと言っても、自然対流に頼っているのみでは十分
な放熱を行い難く、必要な冷却特性を維持するために強
制対流で放熱させることが必要な場合もある。その時、
熱電冷却装置用いて構造物にした状態でどのような構造
で放熱面に送風するかが課題となる。The second problem with respect to the improvement of the cooling performance of the thermoelectric cooling device is that even if it is said that the thermoelectric elements are arranged in a dispersed manner and the heat density on the heat radiating surface is lowered, sufficient heat radiation can be achieved only by relying on natural convection. In some cases, it is difficult to dissipate heat by forced convection to maintain the required cooling characteristics. At that time,
The problem is how to blow air to the heat radiating surface in a state where the structure is formed using the thermoelectric cooling device.
【００１７】本発明の目的は、上記問題を解決し、熱電
素子を用いた空調、保冷・保温システムで、軽量かつコ
ンパクト、コスト的に有利であり、信頼性に優れ、エネ
ルギー効率的に優れる熱電冷却装置及びそれを用いた構
造物を提供することにある。An object of the present invention is to solve the above-mentioned problems, and to provide an air conditioning, cooling and heat retaining system using a thermoelectric element, which is lightweight, compact, advantageous in cost, has excellent reliability, and is excellent in energy efficiency. An object of the present invention is to provide a cooling device and a structure using the same.
【００１８】[0018]
【課題を解決するための手段】上記の目的を達成する第
１の発明は、熱電要素体９０の高さ寸法の変化を吸収で
きる熱伝導性のクッション材１２０を熱電要素体９０の
要素の中に加えることである。According to a first aspect of the present invention, a thermoconductive cushion member 120 capable of absorbing a change in the height of the thermoelectric element body 90 is provided in the thermoelectric element body 90. It is to add to.
【００１９】上記の目的を達成する第２の発明は、熱電
要素体９０に曲げ応力が作用したとき１対の熱電素子で
は曲げ応力に弱いので、少なくとも２対以上の複数対の
熱電素子を熱電要素体９０に構成することである。According to a second aspect of the present invention for achieving the above object, when a bending stress is applied to the thermoelectric element body 90, a pair of thermoelectric elements is weak to bending stress. This is to configure the element body 90.
【００２０】上記の目的を達成する第３の発明は、熱電
冷却装置を用いて、例えば恒温槽を構成するため、箱体
１００を構成し、その箱体を電源あるいは制御機器を収
納する制御ボックス１１０に取り付けるとき、熱膨張の
違いを吸収できる緩衝材を用いて両者を結合することで
ある。According to a third aspect of the present invention, a box 100 is formed by using a thermoelectric cooling device to form, for example, a thermostat, and the box is used for storing a power supply or a control device. When it is attached to 110, the two are joined using a cushioning material that can absorb the difference in thermal expansion.
【００２１】上記の目的を達成する第４の発明は、支柱
材８０の側面に熱電導率の小さな真空断熱材を部分的に
設けることである。A fourth aspect of the present invention for achieving the above object is to partially provide a vacuum heat insulating material having a small thermal conductivity on the side surface of the support member 80.
【００２２】上記の目的を達成する第５の発明は、熱電
冷却装置を用いて、例えば恒温槽を構成するため、箱体
１００を構成し、その箱体を電源あるいは制御機器を収
納する制御ボックス１１０に取り付けるとき、制御ボッ
クス１１０から熱電冷却装置放熱面に沿って空気流を送
ることのできる送風スリットを制御ボックス１１０に設
けることである。According to a fifth aspect of the present invention which achieves the above object, a box 100 is formed by using a thermoelectric cooling device, for example, to form a thermostat, and the box is provided with a control box for storing a power supply or a control device. When it is attached to the control box 110, the control box 110 is provided with a ventilation slit through which air can be sent from the control box 110 along the heat radiation surface of the thermoelectric cooling device.
【００２３】[0023]
【発明の実施の形態】以下に、本発明の１実施例を示
す。図１は本発明の第１実施例を示す断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. FIG. 1 is a sectional view showing a first embodiment of the present invention.
【００２４】熱伝導性を有する熱伝導板１の表面に電気
絶縁層１０を介して電極２０を形成し、電極パターンを
作成する。この基板を配線基板３０とする。熱伝導性を
有する熱伝導板１の材質はアルミニウム、銅、ステンレ
ス、セラミクス等が良い。電気絶縁層１０の材質は例え
ば熱伝導性を有する熱伝導板１が金属であれば、その材
質の酸化物が挙げられる。また、電気絶縁層の変わりに
電気絶縁性を有する接着剤でエポキシ系樹脂、ビニル系
樹脂、イミド系樹脂、フッ素系樹脂、シリコーン系樹
脂、フェノール系樹脂、ゴム系等を主成分とするもので
も良い。なお、接着剤を使用する場合は熱抵抗を小さく
するためにアルミナ、シリカ、酸化亜鉛、窒化はう素、
中空状のガラス等の無機化合物や銀、銅、アルミニウム
等の金属を微細状にしたフィラーを入れたものが良い。An electrode 20 is formed on the surface of a heat conductive plate 1 having heat conductivity via an electric insulating layer 10 to form an electrode pattern. This substrate is referred to as a wiring substrate 30. Aluminum, copper, stainless steel, ceramics, and the like are preferable as the material of the heat conductive plate 1 having heat conductivity. If the heat conductive plate 1 having heat conductivity is a metal, the material of the electric insulating layer 10 is, for example, an oxide of the material. In addition, instead of the electric insulating layer, an adhesive having an electric insulating property and having epoxy-based resin, vinyl-based resin, imide-based resin, fluorine-based resin, silicone-based resin, phenol-based resin, rubber-based as a main component, etc. good. If an adhesive is used, alumina, silica, zinc oxide, silicon nitride,
It is preferable to use an inorganic compound such as a hollow glass or a filler in which a metal such as silver, copper, or aluminum is finely filled.
【００２５】電極２０の材質はアルミニウムや鋼等が挙
げられる。熱電素子４０は配線基板３０の電極２０土に
配置する。熱電素子４０と電極２０との接合には半田や
導電性接着剤を用いる。The material of the electrode 20 includes aluminum and steel. The thermoelectric element 40 is disposed on the soil of the electrode 20 of the wiring board 30. Solder or conductive adhesive is used for joining the thermoelectric element 40 and the electrode 20.
【００２６】次に、電極５０で熱電素子４０を電気的に
接続する。接続に関しては、用途に応じて直列接続また
は並列接続、またはその両方を組み合わせ、所定の電圧
−電流特性になるようにする。電極５０の材質も前述同
様にアルミニウムや銅等であり、接合には半田や導電性
接着剤を用いる。Next, the thermoelectric element 40 is electrically connected to the electrode 50. Regarding the connection, series connection or parallel connection, or a combination of both, depending on the application, is made to have a predetermined voltage-current characteristic. The material of the electrode 50 is also aluminum or copper as described above, and solder or a conductive adhesive is used for bonding.
【００２７】電極５０の上に電気絶縁層１５を設け、電
気絶縁層１５の上に熱伝導性のクッション材１２０を設
けさらに、１つの熱電素子の高さ方向の寸法より長い支
柱材８０を配置する。支柱材８０の材質は金属や熱伝導
性の良いセラミクスであり、接合は前述と同様に半田や
導電性接着剤を用いる。また、支柱の形状は角柱や円柱
等が挙げられる。An electric insulating layer 15 is provided on the electrode 50, a thermally conductive cushioning material 120 is provided on the electric insulating layer 15, and a column material 80 longer than the height of one thermoelectric element is arranged. I do. The material of the support member 80 is a metal or a ceramic having good thermal conductivity, and soldering or a conductive adhesive is used for the joining as described above. Further, the shape of the support may be a prism, a cylinder, or the like.
【００２８】次に、支柱材８０の上に板材６０を配置す
る。板材の材質は金属やセラミクス等の熱伝導率の良い
ものである。また、板材と支柱材との接続に使用する接
着剤の種類も接着する対象物の材質により選定する。以
上の構成物の板材６０と配線基板３０との間に断熱材７
０を介在させ、熱電冷却装置とする。断熱材７０として
は、ポリウレタンや発泡材等が良い。Next, the plate member 60 is disposed on the column member 80. The material of the plate material is a material having good thermal conductivity such as metal and ceramics. Further, the type of the adhesive used for connecting the plate material and the pillar material is also selected according to the material of the object to be bonded. The heat insulating material 7 is provided between the plate member 60 and the wiring board 30 having the above-described structure.
0 is interposed to make a thermoelectric cooling device. As the heat insulating material 70, polyurethane, a foam material, or the like is preferable.
【００２９】以上に述べたように熱電要素体９０の高さ
寸法の変化を吸収できる熱伝導性のクッション材１２０
を熱電要素体９０の要素の中に加えることにより、複数
の熱電要素体９０を固定するとき高さ寸法の微妙な違い
があっても、それぞ.れの接合部に作用する引っ張り応
力が緩和され、さらに曲げ応力も緩和され、これらの接
合部の弱い部分が剥がれると言う問題がなくなる。As described above, the thermally conductive cushion member 120 capable of absorbing a change in the height of the thermoelectric element body 90 is provided.
Is added to the elements of the thermoelectric element body 90, even if there is a slight difference in the height dimension when fixing the plurality of thermoelectric element bodies 90, the tensile stress acting on each joint is reduced. In addition, the bending stress is alleviated, and the problem that the weak portions of these joints are peeled off is eliminated.
【００３０】図２は、本発明の第２の実施例を示す断面
図であり、図１に示した第１の実施例との違いは、クッ
ション材１２０を支柱材８０と板材６０との間に設けた
点である。この場合も第１の実施例と同様に、それぞれ
の接合部に作用する引っ張り応力が緩利され、さら.に
曲げ応力も緩和され、これらの接合部の弱い部分が剥が
れると言う問題がなくなる。FIG. 2 is a sectional view showing a second embodiment of the present invention. The difference from the first embodiment shown in FIG. 1 is that the cushion member 120 is provided between the support member 80 and the plate member 60. It is the point provided in. Also in this case, similarly to the first embodiment, the tensile stress acting on each joint is reduced, and the bending stress is further alleviated, so that there is no problem that the weak portions of these joints are peeled off.
【００３１】図３は、第１の実施例および第２の実施例
に使用されるクッション材１２０の具体的実施例を示す
断面図である。図３において（ａ）はクッション材１２
０として伸縮自在なベローズ１２１を使用した場合であ
る。その材質は熱伝導率の高い銅等の金属が適してい
る。（ｂ）はクッション材１２０として伸縮自在なコイ
ルばね１２４を使用した場合である。その材質は熱伝導
率の高い銅、鉄系等の金属が適している。（ｃ）はクッ
ション材１２０として伸縮自在な皿ばね１２６を使用し
た場合である。その材質は熱伝導率の高い銅、鉄系等の
金属が適している。（ｄ）はクッション材１２０として
弾力性のある発泡金属１２５を使用した場合である。そ
の材質は熱伝導率の高い銅、アルミ系等の金属が適して
いる。FIG. 3 is a sectional view showing a specific embodiment of the cushion member 120 used in the first embodiment and the second embodiment. In FIG. 3, (a) shows the cushion material 12.
This is a case where the bellows 121 which can be extended and contracted is used as 0. The material is suitably a metal such as copper having a high thermal conductivity. (B) shows a case in which a telescopic coil spring 124 is used as the cushion material 120. Suitable materials are metals having high thermal conductivity, such as copper and iron. (C) shows a case where a retractable disc spring 126 is used as the cushion material 120. Suitable materials are metals having high thermal conductivity, such as copper and iron. (D) is a case where an elastic foam metal 125 is used as the cushion material 120. Suitable materials are metals having high thermal conductivity, such as copper and aluminum.
【００３２】これらの何れのクッション材の場合にも、
その両端面に他の部材が接合可能な用に端面材１２２、
１２３が取り付けられている。In the case of any of these cushioning materials,
An end face material 122 so that other members can be joined to both end faces thereof,
123 is attached.
【００３３】図４は本発明の第３の実施例を示す熱電要
素体９０の構成図であり、（ａ）は熱電要素体９０の部
分図、（ｂ）は熱電要素体９０を下から見た図、（ｃ）
は熱電要素体９０の電極２０に対する取付状態を示す図
である。この様に熱電要素体９０に２対の熱電素子４０
ａ、４０ｂを構成することにより、熱電要素体９０に
Ｘ、Ｙ何れの方向から曲げ応力が作用しても、熱電素子
４０と電極２０および電極５０との接合部に対する強度
が増し、接合部が壊れ難くなる。FIG. 4 is a structural view of a thermoelectric element body 90 showing a third embodiment of the present invention. FIG. 4A is a partial view of the thermoelectric element body 90, and FIG. (C)
FIG. 4 is a view showing a state of attachment of the thermoelectric element body 90 to the electrode 20. In this way, two pairs of thermoelectric elements 40 are attached to thermoelectric element body 90.
By configuring a and 40b, even if bending stress acts on the thermoelectric element body 90 in any of the X and Y directions, the strength of the junction between the thermoelectric element 40 and the electrode 20 and the electrode 50 increases, and the junction is reduced. It is hard to break.
【００３４】なお、ここで１対の熱電素子とはp型半導
体とn型半導体の組合せを意味している。図５は本発明
の第４の実施例を示す構成図であり、熱電冷却装置９５
を用いて、例えば恒温槽を構成するため、箱体１００を
構成し、その箱体を電源あるいは制御機器を収納する制
御ボックス１１０に取り付けた状態を示している。箱体
１００は３枚の熱電冷却装置９５ａ、９５ｂ、９５・と
ドア１０１、天井パネルl０２、底パネル１０３により
構成され、制御ボックス１１０に緩衝材１１１を介し
て、箱体取付具１１２により制御ボックス１１０の仕切
板１１３に取付られている。箱体１００を構成している
熱電冷却装置９５ａ、９５ｂ、９５ｃと緩衝材１１１と
の接続、緩衝材１１１と箱体取付具１１２との接続およ
び箱体取付具１１２と仕切板１１３とはそれぞれネジ１
１４等により接続されている。制御ボックス１１０の中
にはファン１１５、電源１１６、制御機器１１７が設置
されている。Here, a pair of thermoelectric elements means a combination of a p-type semiconductor and an n-type semiconductor. FIG. 5 is a block diagram showing a fourth embodiment of the present invention, in which a thermoelectric cooling device 95 is provided.
, A box 100 is formed in order to form a thermostat, for example, and the box is attached to a control box 110 that houses a power supply or a control device. The box 100 is composed of three thermoelectric cooling devices 95a, 95b, 95, a door 101, a ceiling panel 102, and a bottom panel 103. 110 is attached to the partition plate 113. The connection between the thermoelectric cooling devices 95a, 95b, 95c and the cushioning member 111 constituting the box 100, the connection between the cushioning member 111 and the box body attachment 112, and the connection between the box body attachment 112 and the partition plate 113 are screws. 1
14 and so on. In the control box 110, a fan 115, a power supply 116, and a control device 117 are installed.
【００３５】以上の構成において、緩衝材１１１の詳細
構成例を図６により説明する。図６は図５のＣ部拡大図
である。緩衝材１１１はその立ち上がり部１２７が撓む
ことのできる構造になっている。したがって、図５
（ｃ）に示すように複数の箱体取付具１１２が仕切板１
１３にしっかりと取付られ、熱電冷却装置９５ｂが左右
方向に熱膨張しても、緩衝材１１１はその立ち上がり部
１２１が撓むことにより熱電冷却装置９５ｂの変形を吸
収し、熱電冷却装置の接合部の弱い部分が剥がれるとい
う問題を解決できる。In the above configuration, a detailed configuration example of the cushioning member 111 will be described with reference to FIG. FIG. 6 is an enlarged view of a portion C in FIG. The cushioning member 111 has a structure in which the rising portion 127 can bend. Therefore, FIG.
(C) As shown in FIG.
13, even if the thermoelectric cooling device 95b thermally expands in the left-right direction, the cushioning material 111 absorbs the deformation of the thermoelectric cooling device 95b by bending the rising portion 121, and the joining portion of the thermoelectric cooling device The problem that the weak portion of the film peels can be solved.
【００３６】以上に述べたように、信頼性を確保するた
めの上記発明により熱電冷却装置自体で発生する熱応力
および外部から力が加わった場合に熱電冷却装置を保護
する効果がある。As described above, the above-described invention for securing reliability has an effect of protecting the thermoelectric cooling device when a thermal stress generated in the thermoelectric cooling device itself and an external force are applied.
【００３７】次に熱電冷却装置の性能改善およびそれを
利用した構造体の性能改善の課題に対する発明の実施例
を述べる。Next, embodiments of the present invention for improving the performance of a thermoelectric cooling device and improving the performance of a structure using the same will be described.
【００３８】図７は、本発明の第５の実施例を示す熱電
冷却装置断面図である。熱電冷却装置の基本的構成は図
１と同じであり、本実施例では熱電要素体９０の支柱材
８０の側面に熱電導率の小さな真空断熱材１３０を部分
的に設けている。この真空断熱材１３０の形状は例えば
その中に熱電要素体９０の支柱材８０を通すことができ
る中空円筒形をしている。FIG. 7 is a sectional view of a thermoelectric cooling device according to a fifth embodiment of the present invention. The basic configuration of the thermoelectric cooling device is the same as that of FIG. 1, and in this embodiment, a vacuum heat insulating material 130 having a small thermal conductivity is partially provided on the side surface of the support member 80 of the thermoelectric element body 90. The shape of the vacuum heat insulating material 130 is, for example, a hollow cylindrical shape through which the support member 80 of the thermoelectric element body 90 can pass.
【００３９】真空断熱材１３０は真空保持フィルム１３
１とコア材１３２よりなり、その材質は真空保持フィル
ムの場合、例えば、アルミ又はステイシレス箔とプラス
テイク材料のラミーネートフィルム、コア材は連続気泡
の発泡ウレタン等がよい。The vacuum heat insulating material 130 is a vacuum holding film 13
In the case of a vacuum holding film, the material is, for example, aluminum or a laminate film of a stayless foil and a plastic material, and the core material is urethane foam having open cells.
【００４０】以上の構成において、真空断熱材１３０は
通常のウレタン発泡断熱材７０より大幅に熱伝導率が低
いため、支柱材８０の側面からの吸熱量が減少し熱電素
子４０の吸熱面４１での吸熱量Ｑｃのうち、支柱材８０
を通して板材６０から吸熱できる熱量が増加し、熱電冷
却装置９５の冷却性能を向上できる。図５により、熱電
冷却装置を利用した構造体の性能改善の課題に対する本
発明の第６の実施例を述べる。In the above configuration, since the vacuum heat insulating material 130 has a significantly lower thermal conductivity than the ordinary urethane foam heat insulating material 70, the amount of heat absorbed from the side surfaces of the column members 80 is reduced, and the heat absorbing surface 41 of the thermoelectric element 40 is reduced. Of the heat absorption amount Qc of the support member 80
The amount of heat that can be absorbed from the plate member 60 through the heat pump increases, and the cooling performance of the thermoelectric cooling device 95 can be improved. Referring to FIG. 5, a sixth embodiment of the present invention for solving the problem of improving the performance of a structure using a thermoelectric cooling device will be described.
【００４１】図５の構成において、ファン１１５は吸込
口１１８から空気を吸い込み、スリット１１９ａ、１１
９ｂ、１１９ｃから熱電冷却装置９５ａ、９５ｂ、９５
ｃの放熱而に沿って空気を吹き出し、熱電冷却装置９５
ａ、９５ｂ、９５ｃの放熱性能を向上させている。した
がって、必要な冷却特性を維持するために強制対流で放
熱させることが必要な場合、複数の熱電冷却装置に簡単
な構造で放熱面に送風することが可能となる。In the configuration shown in FIG. 5, the fan 115 sucks air from the suction port 118, and the slits 119a, 119
9b, 119c to thermoelectric cooling devices 95a, 95b, 95
air is blown out along the heat radiation of the
a, 95b, and 95c are improved in heat radiation performance. Therefore, when it is necessary to radiate heat by forced convection in order to maintain required cooling characteristics, it is possible to blow air to the heat radiation surface with a simple structure to a plurality of thermoelectric cooling devices.
【００４２】図８に、熱電冷却装置を利用した構造体の
性能改善の課題に対する本発明の第７の実施例を述べ
る。図８に示した熱電冷却装置を利用した構造体の基本
的な構成は図５の構成と同じであるが、スリットを構成
する制御ボックス１１０の壁面を箱体上面まで延長し、
ダクト１４０を構成している点が異なっている。この様
に、ダクト１４０を構成することにより、箱体１００の
高さ寸法が大きい場合には下方から上昇する空気流が箱
体を構成する熱電冷却装置の放熱面から離れることな
く、一定の流速を保って放熱面を流れ、効果的に放熱で
きる。FIG. 8 shows a seventh embodiment of the present invention for solving the problem of improving the performance of a structure using a thermoelectric cooling device. The basic structure of the structure using the thermoelectric cooling device shown in FIG. 8 is the same as the structure of FIG. 5, but the wall of the control box 110 forming the slit is extended to the upper surface of the box,
The difference is that the duct 140 is configured. By forming the duct 140 in this manner, when the height of the box 100 is large, the airflow that rises from below does not separate from the heat radiation surface of the thermoelectric cooling device that forms the box, and has a constant flow rate. In this way, the heat can be dissipated on the heat radiating surface and heat can be dissipated effectively.
【００４３】なお、ダクト１４０の高さが高くなると、
その圧力損失により空気流量が減少し、放熱性能が低下
する場合もあるが、そのような場合には、箱体１００の
高さ寸法と送風ファン特性の関係を考慮し、ダクト高さ
位置を箱体の途中の高さにしてもよい。When the height of the duct 140 is increased,
In some cases, the flow rate of air decreases due to the pressure loss, and the heat radiation performance decreases. In such a case, the height of the duct is set to It may be at a mid-body level.
【００４４】従来の熱電冷却装置では放熱部の熱流束が
大きく効率良く放熱できないため、放熱フィンが必要で
あったが、熱伝素子を分散配置した本発明による熱伝冷
却装置では放熱面に沿って空気を流すことによりフィン
を用いずに放熱でき、シンプルな構成となる。In the conventional thermoelectric cooling device, heat radiating fins are necessary because the heat flux in the heat radiating portion is large and the heat cannot be efficiently radiated. By flowing air, heat can be dissipated without using fins, resulting in a simple configuration.
【００４５】以上述べたとおり、本発明の熱電冷却装置
によれば、熱電要素体９０の高さ寸法の変化を吸収でき
る熱伝導性のクッション材１２０を熱電要素体９０の要
素の中に加えることにより、複数の熱電要素体９０を固
定するとき高さ寸法の微妙な違いがあっても、それぞれ
の接合部に作用する引っ張り応力が緩和され、さらに曲
げ応力も緩和され、これらの接合部の弱い部分が剥がれ
るという問題がなくなる。As described above, according to the thermoelectric cooling device of the present invention, the heat conductive cushion member 120 capable of absorbing a change in the height dimension of the thermoelectric element body 90 is added to the elements of the thermoelectric element body 90. Thereby, even if there is a slight difference in height when fixing the plurality of thermoelectric element bodies 90, the tensile stress acting on each joint is reduced, and the bending stress is also reduced, and these joints are weak. The problem that the part is peeled off is eliminated.
【００４６】本発明の熱電冷却装置によれば、熱電要素
体９０に２対の熱電素子４０ａ、４０ｂを構成すること
により、熱電要素体９０にX、Y何れの方向から曲げ応力
が作用しても、熱電素子４０と電極２０および電極５０
との接合部に対する強度が増し、接合部が壊れ難くな
る。According to the thermoelectric cooling device of the present invention, by forming the thermoelectric element body 90 with the two pairs of thermoelectric elements 40a and 40b, the bending stress acts on the thermoelectric element body 90 in either the X or Y direction. Also, the thermoelectric element 40 and the electrode 20 and the electrode 50
This increases the strength at the joint, and makes the joint less likely to break.
【００４７】本発明の熱電冷却装置を用いた構造体によ
れば、熱電冷却装置を用い箱体１００を構成し、その箱
体を電源あるいは制御機器を収納する制御ボックス１１
０に取り付けるとき、熱膨張の違いを吸収できる緩衝材
を用いて両者を結合することにより、複数の箱体取付具
１１２によりしっかりと取付られていても、熱電冷却装
置が熱膨張したとき緩衝材１１１はその立ち上がり部１
２７が撓むことにより熱電冷却装置９５ｂの変形を吸収
し、熱電冷却装置の接合部の弱い部分が剥がれるという
問題を解決できる。According to the structure using the thermoelectric cooling device of the present invention, the box 100 is formed using the thermoelectric cooling device, and the box is used as the control box 11 for storing a power supply or a control device.
When the thermoelectric cooling device expands thermally even when the thermoelectric cooling device is thermally expanded even if it is firmly attached by a plurality of box body attachments 112, the two are connected by using a cushioning material that can absorb the difference in thermal expansion when the thermoelectric cooling device is attached to the thermoelectric cooling device. 111 is the rising part 1
The deformation of the thermoelectric cooling device 95b is absorbed by the flexure of the thermoelectric cooling device 95, and the problem that the weak portion of the junction of the thermoelectric cooling device peels off can be solved.
【００４８】本発明の熱電冷却装置によれば、熱電要素
体９０の支柱材８０の側面に熱電導率の小さな真空断熱
材１３０を部分的に設けることにより、支柱材８０の側
面からの吸熱量が減少し熱電素子４０の吸熱面４１での
吸熱量Ｑｃのうち、支柱材８０を通して板材６０から吸
熱できる熱量が増加し、熱電冷却装置９５の冷却性能を
向上できる。According to the thermoelectric cooling device of the present invention, the vacuum heat insulating material 130 having a small thermal conductivity is partially provided on the side surface of the column member 80 of the thermoelectric element body 90, so that the heat absorption from the side surface of the column member 80 is achieved. Of the heat absorption Qc on the heat absorption surface 41 of the thermoelectric element 40, the amount of heat that can be absorbed from the plate member 60 through the support member 80 increases, and the cooling performance of the thermoelectric cooling device 95 can be improved.
【００４９】本発明の熱電冷却装置を用いた構造体によ
れば、熱電冷却装置の放熱面に沿って空気を流すことに
より熱電冷却装置にフィンを用いずに放熱でき、シンプ
ルな構成となる。According to the structure using the thermoelectric cooling device of the present invention, heat can be radiated without using fins in the thermoelectric cooling device by flowing air along the heat radiation surface of the thermoelectric cooling device, resulting in a simple configuration.
【００５０】[0050]
【発明の効果】本発明によれば、熱電素子を用いた空
調、保冷・保温システムで、軽量かつコンパクト、コス
ト的に有利であり、信頼性に優れ、かつ、エネルギー効
率的に優れる熱電冷却装置及びそれを用いた構造物を提
供することができる。According to the present invention, a thermoelectric cooling device using a thermoelectric element, which is lightweight, compact, cost-effective, highly reliable, and energy-efficient, is provided. And a structure using the same.
【図１】本発明の第１実施例を示す熱電冷却装置の断面
図である。FIG. 1 is a sectional view of a thermoelectric cooling device showing a first embodiment of the present invention.
【図２】本発明の第２の実施例を示す熱電冷却装置の断
面図である。FIG. 2 is a sectional view of a thermoelectric cooling device showing a second embodiment of the present invention.
【図３】本発明の第１の実施例および第２の実施例に使
用されるクッション材の具体的実施例を示す断面図であ
る。FIG. 3 is a sectional view showing a specific example of a cushion material used in the first and second embodiments of the present invention.
【図４】本発明の第３の実施例を示す熱電要素体の構成
図である。FIG. 4 is a configuration diagram of a thermoelectric element showing a third embodiment of the present invention.
【図５】本発明の第４および第６の実施例を示す熱電冷
却装置を用いた構造体の構成図である。FIG. 5 is a configuration diagram of a structure using a thermoelectric cooling device showing a fourth and a sixth embodiment of the present invention.
【図６】本発明の第４の実施例を示す図５のＣ部拡大図
であり、緩衝材の詳細構成図である。FIG. 6 is an enlarged view of a part C in FIG. 5 showing a fourth embodiment of the present invention, and is a detailed configuration diagram of a cushioning material.
【図７】本発明の第５の実施例を示す熱電冷却装置断面
図である。FIG. 7 is a sectional view of a thermoelectric cooling device according to a fifth embodiment of the present invention.
【図８】本発明の第６の実施例を示す熱電冷却装置断面
図である。FIG. 8 is a sectional view of a thermoelectric cooling device showing a sixth embodiment of the present invention.
【図９】従来の熱電冷却装置の外観図である。FIG. 9 is an external view of a conventional thermoelectric cooling device.
【図１０】従来の熱電冷却装置の断面図である。FIG. 10 is a sectional view of a conventional thermoelectric cooling device.
【図１１】本出願人が先に出願した熱伝冷却装置の断面
図である。FIG. 11 is a cross-sectional view of a heat transfer cooling device previously filed by the present applicant.
【図１２】本出願人が先に出願した熱伝冷却装置の熱電
素子配置図である。FIG. 12 is a layout diagram of thermoelectric elements of a heat transfer cooling device previously applied by the present applicant.
１…熱伝導板、２…放熱面、３…冷却面、１０、１５…
電気絶縁層、２０、２１、５０…電極、３０…配線基
板、４０…熱電素子、４１…熱電素子の吸熱面、６０、
６２…板材、７０…断熱材、７４…放熱フィン、８０…
支柱材、９０…熱電要素体、９５…熱電冷却装置、１０
０…箱体、１０１…ドア、１０２…天井パネル、１１０
…制御ボックス、１１１…緩衝材、１１２…箱体取付
具、１１３…仕切板、１１４…ネジ、１１５…ファン、
１１６…電源、１１７…制御機器、１１９…スリット、
１２０…クッション材、１２１…ベローズ、１２５…発
泡金属、１２４…コイルばね、１２７…立ち上がり部、
１２２、１２３…端面材、１２６…皿ばね、１３０…真
空断熱材、１３１…真空保持フィルム、１３２…コア
材、１４０…ダクト。DESCRIPTION OF SYMBOLS 1 ... Heat conduction plate, 2 ... Heat dissipation surface, 3 ... Cooling surface, 10, 15 ...
Electric insulating layer, 20, 21, 50 ... electrode, 30 ... wiring board, 40 ... thermoelectric element, 41 ... heat absorbing surface of thermoelectric element, 60,
62: plate material, 70: heat insulating material, 74: heat radiation fin, 80:
Support material, 90: thermoelectric element body, 95: thermoelectric cooling device, 10
0: box, 101: door, 102: ceiling panel, 110
… Control box, 111… cushioning material, 112… box fitting, 113… partition plate, 114… screw, 115… fan
116: power supply, 117: control device, 119: slit,
120: cushion material, 121: bellows, 125: foam metal, 124: coil spring, 127: rising part,
122, 123: End face material, 126: Belleville spring, 130: Vacuum heat insulating material, 131: Vacuum holding film, 132: Core material, 140: Duct.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 荒木 邦成 栃木県下都賀郡大平町大字富田800番地 株式会社日立製作所冷熱事業部内 (72)発明者 青木 義久 栃木県下都賀郡大平町富田709番地の２ 株式会社日立栃木エレクトロニクス内 (72)発明者 店網 太一 栃木県下都賀郡大平町大字富田800番地 株式会社日立製作所冷熱事業部内 (72)発明者 高木 恒雄 広島県東広島市鏡山三丁目９番１号 中国 電力株式会社技術研究センター内 (72)発明者 磯兼 誠司 広島県東広島市鏡山三丁目９番１号 中国 電力株式会社技術研究センター内 (72)発明者 信岡 義弘 広島県東広島市鏡山三丁目９番１号 中国 電力株式会社技術研究センター内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kunari Araki 800, Tomita, Odai-cho, Ohira-machi, Shimotsuga-gun, Tochigi Prefecture Within the Cooling and Refrigerating Business Division, Hitachi, Ltd. (72) Inventor Yoshihisa Aoki 709 Tomita, Ohira-cho, Shimotsuga-gun, Tochigi Prefecture Hitachi, Tochigi Electronics Co., Ltd. (72) Taichi, Inventor Store Network 800, Tomita, Odai-cho, Ohira-cho, Shimotsuga-gun, Tochigi Prefecture, Japan Inside the Cooling and Heating Division, Hitachi, Ltd. (72) Inventor Tsuneo Takagi 3-9-1 Kagamiyama, Higashihiroshima-shi, Hiroshima, China Power Technology Research Center (72) Inventor Seiji Isokane 3-9-1 Kagamiyama, Higashihiroshima City, Hiroshima Prefecture Power Technology Research Center (72) Yoshihiro Nobuoka 3-9 Kagamiyama, Higashihiroshima City, Hiroshima Prefecture No. 1 China Electric Power Company Technology Research Center
Claims (5)
電気絶縁層を介して形成した第１の電極を有する配線基
板と該配線基板に配置した複数個の熱電素子と該熱電素
子を電気的に接続する第２の電極とこれらに対向する板
材との間に第２の電気絶縁層と熱電素子の高さ方向の寸
法より長い支柱材とを板材と第２の電極との間に少なく
とも１つ以上設け、かつ板材と配線基板に挟まれた空間
に、断熱材が存在することを構成要素とし、支柱材のい
ずれかの端面にクッション材を設けたことを特徴とする
熱電冷却装置および該熱電冷却装置を使用した構造体。A wiring board having a first electrode formed on a surface of a heat conductive material having thermal conductivity via a first electrical insulating layer; a plurality of thermoelectric elements arranged on the wiring board; A second electrically insulating layer and a post longer than the height dimension of the thermoelectric element are provided between the second electrode for electrically connecting the elements and the plate facing the second electrode. A thermoelectric element, wherein a heat insulating material is present in a space interposed between the plate material and the wiring board, and a cushion material is provided on one end surface of the support member. A cooling device and a structure using the thermoelectric cooling device.
電気絶縁層を介して形成した第１の電極を有する配線基
板と該配線基板に配置した複数個の熱電素子と該熱電素
子を電気的に接続する第２の電極とこれらに対向する板
材との間に第２の電気絶縁層と熱電素子の高さ方向の寸
法より長い支柱材とを板材と第２の電極との間に少なく
とも１つ以上設けた熱電要素体を複数個配置した構成要
素として、一つの熱電要素体に２対以上の複数の半導体
対を配置し配線基板に配置したことを特徴とする熱電冷
却装置および該熱電冷却装置を使用した構造体。2. A wiring board having a first electrode formed on a surface of a heat conductive material having thermal conductivity via a first electrical insulating layer, a plurality of thermoelectric elements arranged on the wiring board, and the thermoelectric element. A second electrically insulating layer and a post longer than the height dimension of the thermoelectric element are provided between the second electrode for electrically connecting the elements and the plate facing the second electrode. A thermoelectric cooling device characterized in that two or more pairs of semiconductors are arranged in one thermoelectric element and arranged on a wiring board as constituent elements in which a plurality of thermoelectric elements provided at least one or more are arranged therebetween. And a structure using the thermoelectric cooling device.
いて、支柱材の側面に真空断熱材を設けたことを特徴と
する熱電冷却装置および該熱電冷却装置を使用した構造
体。3. The thermoelectric cooling device according to claim 1, wherein a vacuum heat insulating material is provided on a side surface of the support member, and a structure using the thermoelectric cooling device.
を少なくとも１つ以上用い箱体を構成し、その箱体を電
源あるいは制御機器等を収納する他の構造体に取り付け
る該熱電冷却装置を使用した構造体において、該熱電冷
却装置と他の構造体の熱膨張の違いによる変位差を吸収
できる緩衝材を用いて両者を結合することを特徴とする
該熱電冷却装置を使用した構造体。4. A thermoelectric cooling device comprising a box using at least one thermoelectric cooling device according to claim 1, 2 or 3, and attaching the box to another structure accommodating a power supply or a control device. A structure using the thermoelectric cooling device, wherein the thermoelectric cooling device and the other structure are combined using a buffer material capable of absorbing a displacement difference due to a difference in thermal expansion between the two structures. body.
を少なくとも１つ以上用い箱体を構成し、その箱体を電
源あるいは制御機器等を収納する他の構造体に取り付け
る該熱電冷却装置を使用した構造体において、該他の構
造体の中に送風機を設け、該他の構造体から該熱電冷却
装置の放熱面に沿って空気流を送ることのできる送風ス
リットを設けることを特徴とする該熱電冷却装置を使用
した構造体。5. A thermoelectric cooling device comprising at least one thermoelectric cooling device according to claim 1, 2 or 3, wherein said thermoelectric cooling device is mounted on another structure accommodating a power source or a control device. In the structure using the device, a blower is provided in the other structure, and a blow slit capable of sending an air flow from the other structure along a heat radiation surface of the thermoelectric cooling device is provided. A structure using the thermoelectric cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28046299A JP2001108325A (en) | 1999-09-30 | 1999-09-30 | Thermoelectric cooler/heater and structure using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28046299A JP2001108325A (en) | 1999-09-30 | 1999-09-30 | Thermoelectric cooler/heater and structure using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001108325A true JP2001108325A (en) | 2001-04-20 |
Family
ID=17625412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28046299A Pending JP2001108325A (en) | 1999-09-30 | 1999-09-30 | Thermoelectric cooler/heater and structure using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001108325A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07310968A (en) * | 1994-05-19 | 1995-11-28 | Hitachi Ltd | Electronic refrigerator |
| JPH0864877A (en) * | 1994-08-23 | 1996-03-08 | Mitsubishi Materials Corp | Thermoelectric module |
| JPH1012934A (en) * | 1996-06-25 | 1998-01-16 | Technova:Kk | Thermoelectric converter |
| JPH1068568A (en) * | 1996-08-27 | 1998-03-10 | Matsushita Electric Works Ltd | Electronic refrigerator |
| JPH1120535A (en) * | 1997-06-30 | 1999-01-26 | S I Electron:Kk | Cooling or warming device for automobile |
| JPH11257789A (en) * | 1998-03-10 | 1999-09-24 | Hitachi Ltd | Thermoelectric cooler and structure using it |
-
1999
- 1999-09-30 JP JP28046299A patent/JP2001108325A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07310968A (en) * | 1994-05-19 | 1995-11-28 | Hitachi Ltd | Electronic refrigerator |
| JPH0864877A (en) * | 1994-08-23 | 1996-03-08 | Mitsubishi Materials Corp | Thermoelectric module |
| JPH1012934A (en) * | 1996-06-25 | 1998-01-16 | Technova:Kk | Thermoelectric converter |
| JPH1068568A (en) * | 1996-08-27 | 1998-03-10 | Matsushita Electric Works Ltd | Electronic refrigerator |
| JPH1120535A (en) * | 1997-06-30 | 1999-01-26 | S I Electron:Kk | Cooling or warming device for automobile |
| JPH11257789A (en) * | 1998-03-10 | 1999-09-24 | Hitachi Ltd | Thermoelectric cooler and structure using it |
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