JP2007043075A - Thermoelectric conversion device - Google Patents

Thermoelectric conversion device Download PDF

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JP2007043075A
JP2007043075A JP2006092368A JP2006092368A JP2007043075A JP 2007043075 A JP2007043075 A JP 2007043075A JP 2006092368 A JP2006092368 A JP 2006092368A JP 2006092368 A JP2006092368 A JP 2006092368A JP 2007043075 A JP2007043075 A JP 2007043075A
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thermoelectric
conversion device
thermoelectric element
voltage
heat exchange
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Akio Matsuoka
彰夫 松岡
Yasuhiko Niimi
康彦 新美
Isao Azeyanagi
功 畔柳
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Denso Corp
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Denso Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device capable of miniaturizing the device, and improving productivity without degrading cooling capacity and the coefficient of performance. <P>SOLUTION: The thermoelectric conversion device comprises a pair of thermoelectric elements 12 and 13 composed of a p-type and an n-type, and one, two or more thermoelectric element substrates 10 for which two or more pairs of thermoelectric elements 12 and 13 are arrayed and the thermoelectric elements 12 and 13 are electrically connected, and a power supply voltage is directly applied to one, two or more thermoelectric element substrates 10. The thermoelectric element substrate 10 is formed such that an application voltage applied to the pair of thermoelectric elements 12 and 13 is ≥0.04 V and <0.08 V, when the output of the power supply voltage is used under a rated condition. Thus, the device is miniaturized. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、Ｎ型熱電素子、Ｐ型熱電素子からなる直列回路に直流電流を流通させることで吸熱、放熱が得られる熱電変換装置に関するものであり、特に、熱電素子モジュールに配設される複数対の熱電素子の最適形状および最適印加電圧に関する。   The present invention relates to a thermoelectric conversion device that can absorb heat and dissipate heat by passing a direct current through a series circuit composed of an N-type thermoelectric element and a P-type thermoelectric element. In particular, the present invention relates to a plurality of thermoelectric element modules. The present invention relates to the optimum shape and optimum applied voltage of a pair of thermoelectric elements.

従来、この種の熱電変換装置として、例えば、所定個数のＮ型熱電素子およびＰ型熱電素子を平面状に配設し、一対の各熱電素子の一方面に一方側電極素子を取付けるとともに、一対の各熱電素子の他方面に他方側電極素子を取付け、これらの熱電素子を電気的に直列接続してなる熱電素子モジュールを構成している。   Conventionally, as this type of thermoelectric conversion device, for example, a predetermined number of N-type thermoelectric elements and P-type thermoelectric elements are arranged in a planar shape, and one side electrode element is attached to one surface of each of the pair of thermoelectric elements. The other-side electrode element is attached to the other surface of each thermoelectric element, and a thermoelectric element module is formed by electrically connecting these thermoelectric elements in series.

さらに、その一方側電極素子および他方側電極素子の少なくとも一方に、各電極素子から伝熱される熱を吸熱、放熱するための熱交換部材を形成している（例えば、特許文献１参照）。
特開２００３−１２４５３１号公報 Furthermore, a heat exchange member for absorbing and radiating heat transferred from each electrode element is formed on at least one of the one side electrode element and the other side electrode element (see, for example, Patent Document 1).
JP 2003-124531 A

しかしながら、上記特許文献１のような装置では、全ての熱電素子が一方側電極素子もしくは他方側電極素子を介して電気的に直列接続されている。そのために、互いに隣り合う熱電素子、電極素子、および熱交換部材は、それぞれが電気的に絶縁された状態で配設されている。   However, in the apparatus as described in Patent Document 1, all thermoelectric elements are electrically connected in series via one side electrode element or the other side electrode element. Therefore, the thermoelectric element, the electrode element, and the heat exchange member that are adjacent to each other are arranged in an electrically insulated state.

言い換えれば、特許文献１では詳しくは記載されていないが、この種の装置では平面状に配設される複数対の熱電素子の平面面積に応じて装置の小型化が可能である。例えば、素子一対あたりの印加電圧を低減すれば熱電素子の素子対数を増加することができ、素子一対あたりの印加電圧を増加すれば熱電素子の素子対数を減少することができる。   In other words, although not described in detail in Patent Document 1, in this type of apparatus, the apparatus can be reduced in size according to the planar area of a plurality of pairs of thermoelectric elements arranged in a planar shape. For example, if the applied voltage per pair of elements is reduced, the number of element pairs of thermoelectric elements can be increased, and if the applied voltage per pair of elements is increased, the number of element pairs of thermoelectric elements can be reduced.

つまり、一対あたりの印加電圧を増加させて素子対数を減少すると設置面積が減少できるが冷却能力および成績係数が低下してしまう。   That is, when the applied voltage per pair is increased to reduce the number of element pairs, the installation area can be reduced, but the cooling capacity and the coefficient of performance are lowered.

さらに、この種の熱電素子モジュールは、小型の冷却装置や加熱装置に用いられるため、熱電素子、電極素子および熱交換部材などの構成部品は、複数個あり、かつ極小部品である。これにより、これらの構成部品を組み付けるときの製造工程における生産性が極めて低い問題がある。   Further, since this type of thermoelectric module is used in a small cooling device or heating device, there are a plurality of component parts such as a thermoelectric element, an electrode element, and a heat exchanging member, and they are extremely small parts. As a result, there is a problem that productivity in the manufacturing process when assembling these components is extremely low.

そこで、本発明の目的は、上記点を鑑みたものであり、冷却能力およびその成績係数を低下させることなく、装置の小型化が図れるとともに生産性の向上が図れる熱電変換装置を提供することにある。   Accordingly, an object of the present invention is to provide a thermoelectric conversion apparatus that can reduce the size of the apparatus and improve the productivity without reducing the cooling capacity and the coefficient of performance. is there.

上記目的を達成するために、請求項１ないし請求項１１に記載の技術的手段を採用する。すなわち、請求項１に記載の発明では、Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を一つまたは複数の熱電素子モジュール（１０）に直接印加する熱電変換装置であって、
熱電素子モジュール（１０）は、電源電圧の出力が定格条件で使用されたときに、一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴としている。 In order to achieve the above object, the technical means according to claims 1 to 11 are employed. That is, in the first aspect of the present invention, a plurality of pairs of thermoelectric elements (12, 13) composed of P-type and N-type are arranged and these thermoelectric elements (12, 13) are electrically connected. A thermoelectric conversion device comprising one or more thermoelectric element modules (10) and directly applying a power supply voltage to one or more thermoelectric element modules (10),
The thermoelectric element module (10) has an applied voltage applied to the pair of thermoelectric elements (12, 13) of 0.04 V or more and less than 0.08 V when the output of the power supply voltage is used under rated conditions. It is characterized by being formed.

この発明によれば、吸熱能力およびその成績係数は、最大となる最適な一対の熱電素子（１２、１３）あたりの印加電圧が存在する。これは発明者らが研究により見出したものであって、上記０．０４Ｖ以上〜０．０８Ｖ未満の最適電圧範囲内であれば吸熱能力およびその成績係数が良好となる使用範囲で使用することができる。   According to the present invention, there is an optimum applied voltage per pair of thermoelectric elements (12, 13) in which the heat absorption capacity and the coefficient of performance thereof are maximized. This has been found by the inventors through research, and if it is within the optimum voltage range of 0.04 V to less than 0.08 V, it can be used in a usage range where the endothermic capacity and coefficient of performance are good. it can.

しかも、これらの最適電圧範囲内のうち、その印加電圧を低減させると吸熱能力と成績係数とが最大となる。ところが、このようなときには素子対数が増加して装置の設置面積が増加するが、生産性の低下を防止できる範囲内で熱電素子（１２、１３）の体格を小さく形成することで、冷却能力およびその成績係数を低下させることことなく装置の小型化が図れる。   Moreover, the heat absorption capacity and the coefficient of performance are maximized when the applied voltage is reduced within the optimum voltage range. However, in such a case, the number of element pairs increases and the installation area of the apparatus increases. However, by reducing the physique of the thermoelectric elements (12, 13) within a range that can prevent a decrease in productivity, the cooling capacity and The size of the apparatus can be reduced without reducing the coefficient of performance.

また、上記最適電圧範囲を電源電圧の定格条件によって求めたことにより、車両に搭載する冷却装置もしくは加熱装置として好適である。   Further, since the optimum voltage range is obtained from the rated condition of the power supply voltage, it is suitable as a cooling device or a heating device mounted on a vehicle.

請求項２に記載の発明では、Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を所定電圧に調整する電圧調整手段（２）を有し、電圧調整手段（２）を介して一つまたは複数の熱電素子モジュール（１０）に印加する熱電変換装置であって、
熱電素子モジュール（１０）は、電圧調整手段（２）の出力電圧が定格条件で使用されたときに、一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴としている。 In the invention according to claim 2, a plurality of pairs of thermoelectric elements (12, 13) composed of P-type and N-type are arranged, and these thermoelectric elements (12, 13) are electrically connected. One or more modules (10) are provided, voltage adjusting means (2) for adjusting the power supply voltage to a predetermined voltage is provided, and one or more thermoelectric element modules (10) are provided via the voltage adjusting means (2). A thermoelectric conversion device to be applied,
In the thermoelectric module (10), when the output voltage of the voltage adjusting means (2) is used under rated conditions, the applied voltage applied to the pair of thermoelectric elements (12, 13) is 0.04V or more and 0.08V. It is characterized by being formed to be less.

この発明によれば、車両用電源では、車両用補機の負荷や環境条件により電源電圧が変動することで、その変動によって一対の熱電素子（１２、１３）に印加する印加電圧が変動するが、電圧調整手段（２）によって、常時最適な印加電圧を一対の熱電素子（１２、１３）に印加することができる。これにより、吸熱能力およびその成績係数が良好となる使用範囲で使用することができる。   According to the present invention, in the vehicular power supply, the power supply voltage fluctuates depending on the load of the vehicular auxiliary machine and environmental conditions, and the applied voltage applied to the pair of thermoelectric elements (12, 13) fluctuates due to the fluctuation. By means of the voltage adjusting means (2), the optimum applied voltage can be applied to the pair of thermoelectric elements (12, 13) at all times. Thereby, it can be used in the use range from which heat absorption capability and its coefficient of performance become favorable.

請求項３に記載の発明では、熱電素子モジュール（１０）は、一対の熱電素子（１２、１３）に印加する印加電圧がより好ましくは０．０４Ｖ以上、０．０７Ｖ未満となるように形成されたことを特徴としている。この発明によれば、最適な印加電圧の上限を０．０７Ｖ未満とすることにより、上述した請求項１および請求項２よりも、より冷却能力およびその成績係数を向上させることができる。   In the invention according to claim 3, the thermoelectric element module (10) is formed such that the applied voltage applied to the pair of thermoelectric elements (12, 13) is more preferably 0.04V or more and less than 0.07V. It is characterized by that. According to the present invention, by setting the upper limit of the optimum applied voltage to less than 0.07 V, the cooling capacity and the coefficient of performance can be improved more than in the first and second aspects described above.

請求項４に記載の発明では、熱電素子モジュール（１０）は、一対の熱電素子（１２、１３）に印加する印加電圧が最も好ましくは０．０４Ｖ以上、０．０５Ｖ未満となるように形成されたことを特徴としている。この発明によれば、最適な印加電圧の上限を０．０５Ｖ未満とすることにより、上述した請求項３よりも、より冷却能力およびその成績係数を向上させることができる。   In the invention according to claim 4, the thermoelectric module (10) is formed such that the applied voltage applied to the pair of thermoelectric elements (12, 13) is most preferably 0.04V or more and less than 0.05V. It is characterized by that. According to the present invention, by setting the upper limit of the optimum applied voltage to less than 0.05 V, the cooling capacity and the coefficient of performance thereof can be improved more than the above-described third aspect.

請求項５に記載の発明では、Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を一つまたは複数の熱電素子モジュール（１０）に直接印加する熱電変換装置であって、
熱電素子モジュール（１０）は、熱電素子（１２、１３）をその熱電素子（１２、１３）に流れる電流の流れ方向に対して鉛直な断面積（ａ×ｂ）と、熱電素子（１２、１３）の高さ（ｈ）との比である素子形状指数（ａ×ｂ／ｈ）が１．５以上、２．５未満となるように形成されたことを特徴としている。 In the invention according to claim 5, a plurality of pairs of thermoelectric elements (12, 13) composed of P-type and N-type are arranged, and these thermoelectric elements (12, 13) are electrically connected. A thermoelectric conversion device comprising one or a plurality of modules (10) and directly applying a power supply voltage to one or a plurality of thermoelectric element modules (10),
The thermoelectric module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to the direction of current flow through the thermoelectric element (12, 13), and the thermoelectric element (12, 13). The element shape index (a × b / h), which is a ratio to the height (h), is 1.5 or more and less than 2.5.

この発明によれば、吸熱能力は、素子形状指数（ａ×ｂ／ｈ）が大きいほど吸熱能力が増加し、その成績係数は、素子形状指数（ａ×ｂ／ｈ）が小さいほど成績係数が増大する。そこで、本発明では素子形状指数（ａ×ｂ／ｈ）の最適範囲を１．５以上、２．５未満とすることにより、冷却能力およびその成績係数を低下させることはない。   According to the present invention, the endothermic capacity increases as the element shape index (a × b / h) increases, and the coefficient of performance increases as the element shape index (a × b / h) decreases. Increase. Therefore, in the present invention, by setting the optimum range of the element shape index (a × b / h) to 1.5 or more and less than 2.5, the cooling capacity and the coefficient of performance are not lowered.

また、素子形状指数（ａ×ｂ／ｈ）の上限を２．５未満とすることにより、熱電素子（１２、１３）の高さ（ｈ）を製造面からの制約となる１ｍｍ以上にして、生産性の低下を防止しつつ、高い吸熱能力と高い成績係数を実現できる。   Further, by setting the upper limit of the element shape index (a × b / h) to less than 2.5, the height (h) of the thermoelectric elements (12, 13) is set to 1 mm or more, which is a restriction from the manufacturing surface, High heat absorption capacity and high coefficient of performance can be realized while preventing a decrease in productivity.

請求項６に記載の発明では、Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を所定電圧に調整する電圧調整手段（２）を有し、この電圧調整手段（２）を介して一つまたは複数の熱電素子モジュール（１０）に印加する熱電変換装置であって、
熱電素子モジュール（１０）は、熱電素子（１２、１３）をその熱電素子（１２、１３）に流れる電流の流れ方向に対して鉛直な断面積（ａ×ｂ）と、熱電素子（１２、１３）の高さ（ｈ）との比である素子形状指数（ａ×ｂ／ｈ）が１．５以上、２．５未満となるように形成されたことを特徴としている。 In the invention described in claim 6, a plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and these thermoelectric elements (12, 13) are electrically connected. One or a plurality of modules (10) are provided, voltage adjusting means (2) for adjusting the power supply voltage to a predetermined voltage is provided, and one or a plurality of thermoelectric element modules (10) are provided via the voltage adjusting means (2). A thermoelectric conversion device applied to
The thermoelectric module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to the direction of current flow through the thermoelectric element (12, 13), and the thermoelectric element (12, 13). The element shape index (a × b / h), which is a ratio to the height (h), is 1.5 or more and less than 2.5.

この発明によれば、電圧調整手段（２）によって、常時最適な印加電圧を一対の熱電素子（１２、１３）に印加することができるため、より確実に冷却能力およびその成績係数を低下させることはない。さらに、より確実に生産性の低下を防止しつつ、高い吸熱能力と高い成績係数を実現できる。   According to the present invention, the voltage adjusting means (2) can always apply the optimum applied voltage to the pair of thermoelectric elements (12, 13), so that the cooling capacity and the coefficient of performance can be more reliably reduced. There is no. Furthermore, it is possible to realize a high heat absorption capability and a high coefficient of performance while more reliably preventing a decrease in productivity.

請求項７に記載の発明では、熱電素子モジュール（１０）は、熱電素子（１２、１３）を素子形状指数（ａ×ｂ／ｈ）がより好ましくは２．０以上、２．５未満となるように形成されたことを特徴としている。この発明によれば、素子形状指数（ａ×ｂ／ｈ）の下限を２．０以上とすることにより、上述した請求項５および請求項６より冷却能力の向上が図れる。   In the invention according to claim 7, in the thermoelectric element module (10), the element shape index (a × b / h) of the thermoelectric elements (12, 13) is more preferably 2.0 or more and less than 2.5. It is characterized by being formed as follows. According to the present invention, by setting the lower limit of the element shape index (a × b / h) to 2.0 or more, the cooling capacity can be improved from the above fifth and sixth aspects.

請求項８に記載の発明では、熱電素子モジュール（１０）は、電源電圧の出力が定格条件で使用されたときに、一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴としている。この発明によれば、冷却能力およびその成績係数を低下させることなく、装置の小型化が図れるとともに生産性の向上が図れることができる。   In the invention according to claim 8, in the thermoelectric element module (10), when the output of the power supply voltage is used under rated conditions, the applied voltage applied to the pair of thermoelectric elements (12, 13) is 0.04 V or more. , Less than 0.08V. According to the present invention, the apparatus can be reduced in size and productivity can be improved without reducing the cooling capacity and the coefficient of performance.

請求項９に記載の発明では、熱電素子モジュール（１０）は、電圧調整手段（２）の出力電圧が定格条件で使用されたときに、一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴としている。この発明によれば、より確実に冷却能力およびその成績係数を低下させることなく、より確実に装置の小型化が図れるとともに生産性の向上が図れることができる。   In the invention according to claim 9, when the output voltage of the voltage adjusting means (2) is used under rated conditions, the thermoelectric module (10) is applied voltage applied to the pair of thermoelectric elements (12, 13). Is 0.04V or more and less than 0.08V. According to the present invention, it is possible to more reliably reduce the size of the apparatus and improve the productivity without lowering the cooling capacity and the coefficient of performance more reliably.

請求項１０に記載の発明では、熱電素子モジュール（１０）の一方面に互いに絶縁空間（Ｌ１、Ｌ２）を隔てて配設され、一対の熱電素子（１２、１３）に伝熱可能に接続された複数の吸熱熱交換部材（２２）と、
熱電素子モジュール（１０）の他方面に互いに絶縁空間（Ｌ１、Ｌ２）を隔てて配設され、一対の熱電素子（１２、１３）に伝熱可能に接続された複数の放熱熱交換部材（３２）とを有し、複数の吸熱熱交換部材（２２）側、および複数の放熱熱交換部材（３２）側のそれぞれに熱交換媒体が流通するように構成されており、
複数の吸熱熱交換部材（２２）および複数の放熱熱交換部材（３２）は、熱交換媒体の流れ方向に沿って形成される絶縁空間（Ｌ２）よりも熱交換媒体の流れ方向に対して直交する方向に形成される絶縁空間（Ｌ１）の方が大きくなるように形成されたことを特徴としている。 In the invention according to claim 10, the thermoelectric element module (10) is disposed on one surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween, and is connected to the pair of thermoelectric elements (12, 13) so as to be capable of transferring heat. A plurality of endothermic heat exchange members (22),
A plurality of heat dissipation heat exchange members (32) disposed on the other surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween and connected to the pair of thermoelectric elements (12, 13) so as to be able to conduct heat. And the heat exchange medium is circulated to each of the plurality of endothermic heat exchange members (22) and the plurality of heat dissipation heat exchange members (32).
The plurality of endothermic heat exchange members (22) and the plurality of heat radiation heat exchange members (32) are more orthogonal to the flow direction of the heat exchange medium than the insulating space (L2) formed along the flow direction of the heat exchange medium. It is characterized in that the insulating space (L1) formed in the direction to be formed is larger.

この発明によれば、絶縁空間（Ｌ２）を小さくすることで素子対数を増加させることができる。これにより、装置の小型化が図れる。なお、直交する方向に形成される絶縁空間（Ｌ１）には、吸熱熱交換部材（２２）および放熱熱交換部材（３２）の熱交換部が形成できる。   According to the present invention, the number of element pairs can be increased by reducing the insulating space (L2). Thereby, size reduction of an apparatus can be achieved. In addition, the heat exchange part of the endothermic heat exchange member (22) and the radiant heat exchange member (32) can be formed in the insulation space (L1) formed in the orthogonal direction.

請求項１１に記載の発明では、熱電素子モジュール（１０）は、一対の熱電素子（１２、１３）を熱交換媒体の流れ方向に沿う奥行き方向に向けて電気的に直列接続するように配設しており、かつ熱交換媒体の流れ方向に沿う奥行き寸法（Ｗ２）よりも、熱交換媒体の流れ方向に対して直角方向となる幅寸法（Ｗ１）の方が大きくなるように形成されたことを特徴としている。   In the invention according to claim 11, the thermoelectric element module (10) is disposed so that the pair of thermoelectric elements (12, 13) are electrically connected in series in the depth direction along the flow direction of the heat exchange medium. The width dimension (W1) perpendicular to the flow direction of the heat exchange medium is larger than the depth dimension (W2) along the flow direction of the heat exchange medium. It is characterized by.

この発明によれば、奥行き寸法（Ｗ２）の方が小さいことで、熱交換媒体の流れ方向に対して直角方向に隣り合う熱電素子（１２、１３）間の電位差が大きくなるのを防止することができる。また、幅寸法（Ｗ１）側に素子対数を増加することができる。つまり、通風抵抗が低下する方向に素子対数を増加することができる。   According to the present invention, since the depth dimension (W2) is smaller, the potential difference between the thermoelectric elements (12, 13) adjacent in the direction perpendicular to the flow direction of the heat exchange medium is prevented from increasing. Can do. Further, the number of element pairs can be increased on the width dimension (W1) side. That is, the number of element pairs can be increased in the direction in which the ventilation resistance decreases.

なお、上記各手段の括弧内の符号は、後述する実施形態の具体的手段との対応関係を示すものである。   In addition, the code | symbol in the bracket | parenthesis of each said means shows a corresponding relationship with the specific means of embodiment mentioned later.

（第１実施形態）
以下、本発明の第１実施形態における熱電変換装置を図１ないし図９に基づいて説明する。図１は本実施形態における熱電変換装置の外観形状を示す平面図であり、図２は熱電変換装置の全体構成を示す図１に示すＡ−Ａ断面図である。また、図３は図２に示すＣ−Ｃ断面図であり、図４は図１に示すＢ−Ｂ断面図である。 (First embodiment)
Hereinafter, a thermoelectric conversion device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 9. FIG. 1 is a plan view showing an external shape of a thermoelectric conversion device according to this embodiment, and FIG. 2 is a cross-sectional view taken along line AA shown in FIG. 1 showing the overall configuration of the thermoelectric conversion device. 3 is a cross-sectional view taken along the line CC shown in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line BB shown in FIG.

本実施形態の熱電変換装置は、車両に搭載される冷却装置もしくは加熱装置に適用させた熱電変換装置であり、例えば、車両用のシートの着座部内と背当部内とにそれぞれ熱電変換装置を配設し、その熱電変換装置により冷却された冷風をシート表面から吹き出すシート空調装置に適用させている。   The thermoelectric conversion device of the present embodiment is a thermoelectric conversion device applied to a cooling device or a heating device mounted on a vehicle.For example, a thermoelectric conversion device is arranged in each of a seating portion and a backrest portion of a vehicle seat. And is applied to a sheet air conditioner that blows out the cold air cooled by the thermoelectric converter from the sheet surface.

従って、本実施形態の熱電変換装置は、設置空間の狭い車両用のシート内に搭載できるように熱電変換装置の小型化を図っている。熱電変換装置は、図１ないし図４に示すように、熱電素子モジュールである熱電素子基板１０、吸熱側フィン基板２０、放熱側フィン基板３０、および一対のケース部材２８、３８から構成している。   Therefore, the thermoelectric conversion device of the present embodiment is miniaturized so that the thermoelectric conversion device can be mounted in a vehicle seat having a small installation space. As shown in FIGS. 1 to 4, the thermoelectric conversion device includes a thermoelectric element substrate 10 that is a thermoelectric element module, a heat absorption side fin substrate 20, a heat dissipation side fin substrate 30, and a pair of case members 28 and 38. .

熱電素子モジュールである熱電素子基板１０は、図２ないし図４に示すように、熱電素子の保持板である第１絶縁基板１１、Ｐ型、Ｎ型からなる熱電素子１２、１３、および電極部材１６から一体に構成している。   As shown in FIGS. 2 to 4, the thermoelectric element substrate 10 that is a thermoelectric element module includes a first insulating substrate 11 that is a thermoelectric element holding plate, P-type and N-type thermoelectric elements 12 and 13, and electrode members. 16 is integrally formed.

具体的には、平板状の絶縁材料（例えば、ガラスエポキシ、ＰＰＳ樹脂、ＬＣＰ樹脂もしくはＰＥＴ樹脂など）からなる第１絶縁基板１１に、一対のＰ型熱電素子１２とＮ型熱電素子１３とを交互に略碁盤目状に複数対配列してなる熱電素子群を列設し、隣接する一対の熱電素子１２、１３の両端面に電極部材１６を接合して一体に構成している。   Specifically, a pair of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 are provided on a first insulating substrate 11 made of a flat insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin). A plurality of thermoelectric element groups alternately arranged in a substantially grid pattern are arranged in a row, and electrode members 16 are joined to both end faces of a pair of adjacent thermoelectric elements 12 and 13 so as to be integrated.

Ｐ型熱電素子１２はＢｉ−Ｔｅ系化合物からなるＰ型半導体により構成され、Ｎ型熱電素子１２はＢｉ−Ｔｅ系化合物からなるＮ型半導体により構成された極小部品である。なお、Ｐ型熱電素子１２およびＮ型熱電素子１３は、その上端面、下端面が第１絶縁基板１１よりも突き出すように形成されている。   The P-type thermoelectric element 12 is composed of a P-type semiconductor made of a Bi—Te-based compound, and the N-type thermoelectric element 12 is a minimal component composed of an N-type semiconductor made of a Bi—Te-based compound. The P-type thermoelectric element 12 and the N-type thermoelectric element 13 are formed so that the upper end surface and the lower end surface protrude beyond the first insulating substrate 11.

電極部材１６は、平板状の銅材などの導電性金属から形成され、熱電素子基板１０に配列された熱電素子群のうち、隣接する一対のＰ型熱電素子１２およびＮ型熱電素子１３を電気的に直列接続する電極である。   The electrode member 16 is formed of a conductive metal such as a flat copper material, and electrically connects a pair of adjacent P-type thermoelectric elements 12 and N-type thermoelectric elements 13 among the thermoelectric element groups arranged on the thermoelectric element substrate 10. The electrodes are connected in series.

より具体的には、図２に示すように、上方に配置される電極部材１６は、隣接するＮ型熱電素子１３からＰ型熱電素子１２に向けて電流を流すための電極であり、下方に配置される電極部材１６は、隣接するＰ型熱電素子１２からＮ型熱電素子１３に電流を流すための電極である。なお、電極部材１６は、熱電素子１２、１３の端面に予めペーストハンダなどをスクリーン印刷で薄く均一に塗っておいてから半田付けで接合される。   More specifically, as shown in FIG. 2, the electrode member 16 disposed above is an electrode for allowing a current to flow from the adjacent N-type thermoelectric element 13 toward the P-type thermoelectric element 12, and below the electrode member 16. The arranged electrode member 16 is an electrode for causing a current to flow from the adjacent P-type thermoelectric element 12 to the N-type thermoelectric element 13. The electrode member 16 is bonded to the end faces of the thermoelectric elements 12 and 13 in advance by applying paste solder thinly and uniformly by screen printing and then soldering.

次に、吸熱側フィン基板２０は、複数個の吸熱熱交換部材２２を平板状の絶縁材料（例えば、ガラスエポキシ、ＰＰＳ樹脂、ＬＣＰ樹脂もしくはＰＥＴ樹脂など）からなる保持板である第２絶縁基板２１に一体構成しており、放熱側フィン基板３０は、複数個の放熱熱交換部材３２を平板状の絶縁材料（例えば、ガラスエポキシ、ＰＰＳ樹脂、ＬＣＰ樹脂もしくはＰＥＴ樹脂など）からなる保持板である第３絶縁基板３１に一体構成している。   Next, the endothermic fin substrate 20 is a second insulating substrate that is a holding plate made of a flat insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin) with the plurality of endothermic heat exchange members 22. The heat radiation side fin substrate 30 is a holding plate made of a flat insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin). A third insulating substrate 31 is integrally formed.

そして、吸熱熱交換部材２２および放熱熱交換部材３２は、銅材などの導電性金属からなる薄肉の板材を用いて、図４に示すように、断面が略Ｕ字状からなり底部に平面状の吸熱、放熱電極部２５、３５を形成し、その電極部２５、３５から外方に延出された平面にルーバー状の熱交換部２６、３６を形成している。   The endothermic heat exchanging member 22 and the radiating heat exchanging member 32 are made of a thin plate material made of a conductive metal such as a copper material. As shown in FIG. Heat-absorbing and radiating electrode portions 25 and 35 are formed, and louver-like heat exchanging portions 26 and 36 are formed on a plane extending outward from the electrode portions 25 and 35.

また、この熱交換部２６、３６は、吸熱、放熱電極部２５、３５から伝熱される熱を吸熱、放熱するためのフィンであり、切り起こしなどの成形加工により電極部２５、３５と一体に形成している。そして、その吸熱、放熱電極部２５、３５の一端面が電極部材１６に接合するように、第２もしくは第３絶縁基板２１、３１に一体で構成している。   The heat exchanging portions 26 and 36 are fins for absorbing and radiating heat transferred from the heat absorbing and radiating electrode portions 25 and 35, and are integrated with the electrode portions 25 and 35 by molding such as cutting and raising. Forming. And it is comprised integrally with the 2nd or 3rd insulated substrate 21 and 31 so that the end surface of the heat absorption and the thermal radiation electrode part 25 and 35 may join to the electrode member 16. FIG.

なお、吸熱熱交換部材２２および放熱熱交換部材３２は、第２もしくは第３絶縁基板２１、３１の一端面に、その吸熱、放熱電極部２５、３５の一端面が僅かに突き出す程度の位置に一体で構成している。つまり、電極部２５、３５の一端面が熱電素子基板１０に設けられた電極部材１６に接合したときに、その吸熱、放熱電極部２５、３５が電極部材１６側にはみ出さないように構成している。   Note that the endothermic heat exchange member 22 and the radiant heat exchange member 32 are positioned so that the endothermic surfaces of the second and third insulating substrates 21 and 31 protrude slightly from the one end surfaces of the radiating electrode portions 25 and 35. It is composed of one piece. That is, when one end surface of the electrode portions 25 and 35 is joined to the electrode member 16 provided on the thermoelectric element substrate 10, the heat absorption and heat dissipation electrode portions 25 and 35 are configured not to protrude to the electrode member 16 side. ing.

さらに、互いに隣り合う吸熱熱交換部材２２、放熱熱交換部材３２同士は、互いに電気的に絶縁するように、所定の空間を設けて複数個略碁盤目状に第２、第３絶縁基板２１、３１に配設している。そして、上方に配置された電極部材１６に吸熱熱交換部材２２の吸熱電極部２５を接合するように配置し、下方に配置された電極部材１６に放熱熱交換部材３２の放熱電極部３５を接合するように配置している。   Further, the adjacent endothermic heat exchange members 22 and radiant heat exchange members 32 are provided with a predetermined space so as to be electrically insulated from each other, and a plurality of second and third insulating substrates 21 in a substantially grid pattern are provided. 31. And it arrange | positions so that the endothermic electrode part 25 of the endothermic heat exchange member 22 may be joined to the electrode member 16 arrange | positioned upward, and the radiation electrode part 35 of the thermal radiation heat exchange member 32 is joined to the electrode member 16 arrange | positioned below It is arranged to do.

なお、図１および図２中に示す左右端に配設される熱電素子１２、１３の末端には、それぞれ端子２４ａ、２４ｂが設けられ、その端子２４ａ、２４ｂには、図示しない直流電源の正側端子を端子２４ａに接続し、負側端子を端子２４ｂに接続するようにしている。   1 and 2, terminals 24a and 24b are provided at the ends of the thermoelectric elements 12 and 13 disposed at the left and right ends, respectively, and the terminals 24a and 24b are connected to a positive power source (not shown). The side terminal is connected to the terminal 24a, and the negative side terminal is connected to the terminal 24b.

これにより、上方側に配設される電極部材１６および吸熱熱交換部材２２は、隣接するＮ型熱電素子１３からＰ型熱電素子１２に電気的に接続するように複数個配設され、下方側に配設される電極部材１６および放熱熱交換部材３２は、隣接するＰ型熱電素子１２からＮ型熱電素子１３に電気的に接続するように複数個配設されている。   As a result, a plurality of electrode members 16 and endothermic heat exchange members 22 disposed on the upper side are disposed so as to be electrically connected from the adjacent N-type thermoelectric element 13 to the P-type thermoelectric element 12, and the lower side. A plurality of the electrode members 16 and the radiant heat exchange members 32 arranged in are arranged so as to be electrically connected from the adjacent P-type thermoelectric element 12 to the N-type thermoelectric element 13.

因みに、端子２４ａから入力された直流電源は、図１中に示す左端のＰ型熱電素子１２から下方に配設された電極部材１６を介してＮ型熱電素子１３に直列的に流れ、次に、このＮ型熱電素子１３から上方に配設された電極部材１６を介してＰ型熱電素子１２に直列的に流れる。   Incidentally, the DC power input from the terminal 24a flows in series from the leftmost P-type thermoelectric element 12 shown in FIG. 1 to the N-type thermoelectric element 13 via the electrode member 16 disposed below, Then, it flows in series from the N-type thermoelectric element 13 to the P-type thermoelectric element 12 through the electrode member 16 disposed upward.

このときに、ＰＮ接合部を構成する下方に配設された電極部材１６は、ペルチェ効果によって高温の状態となり、ＮＰ接合部を構成する上方に配設された電極部材１６は低温の状態となる。つまり、上方側に配置された熱交換部２６は吸熱熱交換部を形成して低温状態の熱が伝熱されて被冷却流体に接触され、下方側に設置された熱交換部３６は放熱熱交換部を形成して高温状態の熱が伝熱されて冷却流体に接触される。   At this time, the electrode member 16 disposed below the PN junction portion is in a high temperature state due to the Peltier effect, and the electrode member 16 disposed above the NP junction portion is in a low temperature state. . That is, the heat exchanging part 26 arranged on the upper side forms an endothermic heat exchanging part, heat in a low temperature state is transferred to contact with the fluid to be cooled, and the heat exchanging part 36 installed on the lower side is radiated heat. An exchange part is formed and heat in a high temperature state is transferred to contact the cooling fluid.

言い換えると、図２に示すように、熱電素子基板１０を区画壁として、ケース部材２８、３８により、熱電素子基板１０の両側に送風通路を形成し、その送風通路に熱交換媒体である空気を流通することで、熱交換部２６，３６と空気とが熱交換され、熱電素子基板１０を区画壁として、上側の熱交換部２６で空気を冷却することができ、下側の熱交換部３６で空気を加熱することができる。   In other words, as shown in FIG. 2, the thermoelectric element substrate 10 is used as a partition wall, the case members 28 and 38 form air passages on both sides of the thermoelectric element substrate 10, and air as a heat exchange medium is introduced into the air passages. By circulating, the heat exchanging units 26 and 36 and the air are heat-exchanged, the air can be cooled by the upper heat exchanging unit 26 using the thermoelectric element substrate 10 as a partition wall, and the lower heat exchanging unit 36. The air can be heated.

なお、本実施形態では、直流電源の正側端子を端子２４ａ側に接続し、負側端子を端子２４ｂ側に接続して端子２４ａに直流電源を入力させたが、これに限らず、直流電源の正側端子を端子２４ｂ側に接続し、負側端子を端子２４ａ側に接続して端子２４ｂに直流電源を入力させても良い。ただし、このときには、上方の吸熱熱交換部材２２が放熱熱交換部を形成し、下方の放熱熱交換部材３２が吸熱熱交換部を形成する。   In the present embodiment, the positive terminal of the DC power source is connected to the terminal 24a side, the negative terminal is connected to the terminal 24b side, and the DC power source is input to the terminal 24a. The positive terminal may be connected to the terminal 24b side, the negative terminal may be connected to the terminal 24a side, and a DC power supply may be input to the terminal 24b. However, at this time, the upper endothermic heat exchange member 22 forms a heat dissipation heat exchange portion, and the lower endothermic heat exchange member 32 forms an endothermic heat exchange portion.

ところで、以上の構成による熱電変換装置において、装置全体の小型化を図るために、特に、熱電素子基板１０に配設する複数対の熱電素子１２、１３の素子の形状、素子対数、熱電素子一対あたりの印加電圧を最適化させている。言い換えれば、車両用のシートのように、狭い設置空間に搭載できるように熱電変換装置の小型化を図るとともに、冷却能力およびその成績係数ＣＯＰの向上を図るようにしている。   By the way, in the thermoelectric conversion device having the above configuration, in order to reduce the size of the entire device, in particular, the shape of the plural pairs of thermoelectric elements 12 and 13 arranged on the thermoelectric element substrate 10, the number of element pairs, and the thermoelectric element pair. The applied voltage is optimized. In other words, the thermoelectric converter is reduced in size so that it can be mounted in a narrow installation space like a vehicle seat, and the cooling capacity and the coefficient of performance COP are improved.

ここで、上述した熱電素子１２、１３の素子の形状、素子対数、熱電素子一対あたりの印加電圧の最適化については発明者らの研究によって見出したので以下図５ないし図９に基づいて説明する。熱電変換装置の冷却能力は、ＮＰ接合部を構成する上方に配設された電極部材１６で発生する低温の状態の熱、つまり、吸熱量Ｑｃを求めることで良い。   Here, optimization of the shape of the thermoelectric elements 12 and 13, the number of element pairs, and the applied voltage per thermoelectric element pair has been found by the inventors' research, and will be described below with reference to FIGS. 5 to 9. . The cooling capacity of the thermoelectric conversion device may be obtained by obtaining the low-temperature heat generated by the electrode member 16 disposed above that constitutes the NP junction, that is, the endothermic amount Qc.

この吸熱量Ｑｃは、具体的には、Ｑｃ＝（ペルチェ吸熱）−（ジュール熱損失）−（戻り熱損失）により求めることができる。より具体的には、ペルチェ吸熱＝ｎ・α・Ｉ・Ｔｃ、ジュール熱損失＝１／２・Ｉ２・（ｎ・ｈ／（ａ・ｂ）・ρ）、戻り熱損失＝ｎ・（ａ・ｂ）／ｈ・λ・ΔＴであって、これらから算出することができる。 Specifically, the endothermic amount Qc can be obtained by Qc = (Peltier endothermic) − (Joule heat loss) − (return heat loss). More specifically, Peltier endotherm = n · α · I · Tc, Joule heat loss = 1/2 · I 2 · (n · h / (a · b) · ρ), Return heat loss = n · (a B) / h · λ · ΔT, which can be calculated from these.

ここで、ｎ：素子対数、α：素子材料のゼーベック係数、Ｉ：電流、Ｔｃ：吸熱面の温度、ｈ：素子の高さ、ａ：素子の幅寸法、ｂ：素子の奥行寸法、ρ：素子材料の抵抗係数、λ：素子材料の熱伝導率、ΔＴ：吸放熱面の温度差である。   Here, n: element logarithm, α: Seebeck coefficient of element material, I: current, Tc: temperature of endothermic surface, h: element height, a: element width dimension, b: element depth dimension, ρ: The resistance coefficient of the element material, λ: the thermal conductivity of the element material, ΔT: the temperature difference between the heat absorbing and radiating surfaces.

そして、図５は熱電素子一対あたりの印加電圧と吸熱能力比との関係を示す特性図であり、図６は熱電素子一対あたりの印加電圧と成績係数ＣＯＰとの関係を示す特性図である。また、図７は熱電素子一対あたりの印加電圧と素子対数との関係を示す特性図である。さらに、図８は熱電素子一対あたりの印加電圧と素子の最大許容寸法との関係を示す特性図である。   FIG. 5 is a characteristic diagram showing the relationship between the applied voltage per thermoelectric element pair and the endothermic capacity ratio, and FIG. 6 is a characteristic diagram showing the relationship between the applied voltage per thermoelectric element pair and the coefficient of performance COP. FIG. 7 is a characteristic diagram showing the relationship between the applied voltage per thermoelectric element pair and the number of element pairs. Further, FIG. 8 is a characteristic diagram showing the relationship between the applied voltage per pair of thermoelectric elements and the maximum allowable dimension of the element.

因みに、図５に示す吸熱能力比は上記吸熱量Ｑｃより求め、図６に示す成績係数ＣＯＰはＣＯＰ＝吸熱量Ｑｃ／消費電力によって求めている。また、この図５および図６に示す吸熱能力比、成績係数ＣＯＰは、熱電素子１２、１３をＢｉ−Ｔｅ系化合物の材料からなり、かつ、その素子の寸法（図１１参照）をａ＝１．５ｍｍ、ｂ＝１．５ｍｍ、ｈ＝１ｍｍとする形状のものを用いる。   Incidentally, the endothermic capacity ratio shown in FIG. 5 is obtained from the endothermic amount Qc, and the coefficient of performance COP shown in FIG. 6 is obtained by COP = endothermic amount Qc / power consumption. Further, the endothermic capacity ratio and the coefficient of performance COP shown in FIGS. 5 and 6 are such that the thermoelectric elements 12 and 13 are made of a Bi-Te compound material, and the dimensions of the elements (see FIG. 11) are a = 1. A shape of 0.5 mm, b = 1.5 mm, and h = 1 mm is used.

なお、熱電素子基板１０の端子２４ａ、２４ｂ間に印加する電圧は、車両用電源から出力される定格条件で使用されるＤＣ１２Ｖの駆動電圧を印加し、その定格条件の駆動電圧による熱電素子一対あたりの印加電圧を求めている。   Note that the voltage applied between the terminals 24a and 24b of the thermoelectric element substrate 10 is a DC12V drive voltage used under the rated conditions output from the vehicle power supply, and the thermoelectric element pair per drive voltage under the rated conditions is applied. The applied voltage is obtained.

これにより、図５および図６に示す結果から、吸熱量Ｑｃおよび成績係数ＣＯＰがともに、最大になる最適電圧範囲の印加電圧が存在することを見出した。つまり、吸熱量Ｑｃと成績係数ＣＯＰを向上させるには、熱電素子一対あたりの印加電圧が好ましくは０．０１Ｖ以上、０．０８Ｖ未満の最適電圧範囲であれば良いことが分った。   Accordingly, it was found from the results shown in FIGS. 5 and 6 that there is an applied voltage in the optimum voltage range in which both the endothermic amount Qc and the coefficient of performance COP are maximized. That is, it has been found that in order to improve the endothermic amount Qc and the coefficient of performance COP, the applied voltage per pair of thermoelectric elements is preferably within the optimum voltage range of preferably 0.01 V or more and less than 0.08 V.

また、特に、その印加電圧が下限である０．０１Ｖ近傍であれば吸熱量Ｑｃおよび成績係数ＣＯＰが最大値となることが分った。従って、最適印加電圧を最良の０．０１Ｖ程度とすると、吸熱量Ｑｃおよび成績係数ＣＯＰが高能力、高効率となる。   In particular, it was found that the endothermic amount Qc and the coefficient of performance COP are maximum when the applied voltage is in the vicinity of the lower limit of 0.01 V. Therefore, when the optimum applied voltage is the best of about 0.01 V, the heat absorption amount Qc and the coefficient of performance COP are high capacity and high efficiency.

ところが、端子２４ａ、２４ｂ間に印加する定格条件の駆動電圧に対して、熱電素子一対あたりの印加電圧を０．０１Ｖ程度とすると、熱電素子基板１０内に配設する素子対数は、図７に示すように、１３００対数程度が必要となる。   However, when the applied voltage per pair of thermoelectric elements is about 0.01 V with respect to the drive voltage of the rated condition applied between the terminals 24a and 24b, the number of elements arranged in the thermoelectric element substrate 10 is as shown in FIG. As shown, about 1300 logarithms are required.

これでは、熱電素子基板１０の体格が極めて大となる問題があった。つまり、限られた設置空間を有するシート内に搭載するためには、上記素子対数の熱電素子基板１０では、体格が大きすぎて搭載できないことが分った。   This has a problem that the size of the thermoelectric element substrate 10 becomes extremely large. That is, it has been found that the thermoelectric element substrate 10 having the number of element pairs is too large to be mounted in a sheet having a limited installation space.

そこで、本発明では、シート内に搭載できる熱電素子基板１０の体格を予め一般的な所定（例えば、４０ｍｍ角程度）形状と設定して、この所定（例えば、４０ｍｍ角程度）の形状内に配設可能な熱電素子１２、１３の素子寸法とその素子対数を求めた。   Therefore, in the present invention, the physique of the thermoelectric element substrate 10 that can be mounted in the sheet is set in advance to a general predetermined (for example, about 40 mm square) shape, and the thermoelectric element substrate 10 is arranged in this predetermined (for example, about 40 mm square) shape. The element dimensions of the thermoelectric elements 12 and 13 that can be provided and the number of element pairs were determined.

具体的には、素子寸法を、第１絶縁基板１１内に組み付けるための組付性を低下させることのない大きさとして、１．０〜１．５ｍｍ程度以上とし、さらに、素子間の隙間を考慮して４０ｍｍ角の第１絶縁基板１１内に配設可能な素子対数は１３０対程度とした。   Specifically, the element size is set to about 1.0 to 1.5 mm or more as a size that does not deteriorate the assembling property for assembling in the first insulating substrate 11, and the gap between the elements is further set. In consideration of this, the number of element pairs that can be arranged in the 40 mm square first insulating substrate 11 is about 130 pairs.

ところが、この１３０対程度の素子対数によると、図７および図８に示すように、熱電素子一対あたりの印加電圧が０．０９Ｖとなる。これは、上述したように、図５および図６に示す最適電圧範囲を外れてしまうことになる。   However, according to the number of element pairs of about 130 pairs, as shown in FIGS. 7 and 8, the applied voltage per thermoelectric element pair is 0.09V. As described above, this is outside the optimum voltage range shown in FIGS.

そこで、本実施形態では、端子２４ａ、２４ｂ間に印加する駆動電圧を、例えばＤＣ６Ｖに半減させることで、図８に示すように、熱電素子一対あたりの印加電圧が０．０５Ｖ以下となる。   Therefore, in the present embodiment, the drive voltage applied between the terminals 24a and 24b is halved to, for example, DC 6V, so that the applied voltage per thermoelectric element pair is 0.05V or less as shown in FIG.

この印加電圧であれば、図５および図６に示す最適電圧範囲内に収めることが可能である。従って、本実施形態では、素子寸法が１．５ｍｍ×１．５ｍｍ程度の熱電素子１２、１３を用いて、１３０対程度の素子対数を配設して熱電素子基板１０を構成する。そして、端子２４ａ、２４ｂ間にＤＣ６Ｖの駆動電圧を印加させることで、熱電素子一対あたりの印加電圧が０．０４Ｖ以上、０．０５Ｖ未満で印加することができる。   With this applied voltage, it can be within the optimum voltage range shown in FIGS. Therefore, in the present embodiment, the thermoelectric element substrate 10 is configured by disposing about 130 pairs of element pairs using the thermoelectric elements 12 and 13 having element dimensions of about 1.5 mm × 1.5 mm. Then, by applying a driving voltage of DC6V between the terminals 24a and 24b, the applied voltage per pair of thermoelectric elements can be applied at 0.04V or more and less than 0.05V.

従って、熱電素子基板１０は、図８に示すように、熱電素子一対あたりの印加電圧が好ましくは０．０４Ｖ以上、０．０８Ｖ未満となるように形成すれば良い。また、これよりも、高能力、高効率を高めるためには、熱電素子一対あたりの印加電圧がより好ましくは０．０４Ｖ以上、０．０７Ｖ未満、および熱電素子一対あたりの印加電圧が最も好ましくは０．０４Ｖ以上、０．０５Ｖ未満となるように形成すれば良い。   Therefore, the thermoelectric element substrate 10 may be formed so that the applied voltage per pair of thermoelectric elements is preferably 0.04 V or more and less than 0.08 V, as shown in FIG. In addition, in order to improve the high capacity and high efficiency, the applied voltage per thermoelectric element pair is more preferably 0.04 V or more and less than 0.07 V, and the applied voltage per thermoelectric element pair is most preferably What is necessary is just to form so that it may become 0.04V or more and less than 0.05V.

なお、本実施形態では、熱電素子基板１０の端子２４ａ、２４ｂ間にＤＣ６Ｖの駆動電圧を印加させるように構成したが、これに限らず、図９に示すように、二つの熱電素子基板１０を電気的に直列接続させて、その端子２４ａ、２４ｂ間にＤＣ１２Ｖの駆動電圧を印加するように構成しても良い。これによれば、一つの熱電素子基板１０には、それぞれＤＣ６Ｖの駆動電圧が印加される。   In the present embodiment, the driving voltage of DC 6V is applied between the terminals 24a and 24b of the thermoelectric element substrate 10. However, the present invention is not limited to this, and two thermoelectric element substrates 10 are provided as shown in FIG. A drive voltage of DC 12V may be applied between the terminals 24a and 24b by being electrically connected in series. According to this, a driving voltage of DC 6 V is applied to each thermoelectric element substrate 10.

また、以上の構成では、熱電素子基板１０の素子対数を１３０程度に配設したが、これに限らず、熱電素子基板１０の端子２４ａ、２４ｂ間に印加する駆動電圧をＤＣ４Ｖにして素子対数を少なくしても良い。ただし、この場合には３個の熱電素子基板１０を電気的に直列接続してその端子２４ａ、２４ｂ間にＤＣ１２Ｖの駆動電圧を印加するように構成しても良い。   In the above configuration, the number of element pairs of the thermoelectric element substrate 10 is about 130. However, the number of element pairs is not limited to this, and the drive voltage applied between the terminals 24a and 24b of the thermoelectric element substrate 10 is DC4V. It may be less. However, in this case, the three thermoelectric element substrates 10 may be electrically connected in series, and a drive voltage of DC 12 V may be applied between the terminals 24a and 24b.

なお、車両用電源には、上記ＤＣ１２Ｖ仕様の他にＤＣ２４Ｖ仕様もあるため、この場合には、一つの熱電素子基板１０の端子２４ａ、２４ｂ間に、例えば、定格条件のＤＣ１２Ｖの約数となる駆動電圧を印加するように複数（例えば、２個〜４個）の熱電素子基板１０を配設するようにしても良い。   In addition, since the vehicle power supply also has a DC24V specification in addition to the DC12V specification, in this case, for example, a divisor of DC12V of rated conditions is provided between the terminals 24a and 24b of one thermoelectric element substrate 10. A plurality of (for example, two to four) thermoelectric element substrates 10 may be disposed so as to apply a driving voltage.

次に、以上の構成による熱電素子基板１０の組み付け方法について説明する。まず、熱電素子１２、１３は、図３および図４に示すように、第１絶縁基板１１に設けられた基板穴にＰ型とＮ型を交互に略碁盤目状に複数個配列して熱電素子基板１０を一体に構成する。そして、熱電素子基板１０に隣接して配列された熱電素子１２、１３の両端面に電気的に直列接続するように複数個の電極部材１６を半田付けにより接合する。   Next, a method for assembling the thermoelectric element substrate 10 having the above configuration will be described. First, as shown in FIGS. 3 and 4, the thermoelectric elements 12, 13 are arranged in a plurality of P-type and N-type alternately in a substantially grid pattern in a substrate hole provided in the first insulating substrate 11. The element substrate 10 is integrally formed. A plurality of electrode members 16 are joined by soldering so as to be electrically connected in series to both end surfaces of the thermoelectric elements 12 and 13 arranged adjacent to the thermoelectric element substrate 10.

これにより、熱電素子１２、１３および電極部材１６が一体に構成される。また、上方側に配設される電極部材１６がＮＰ接合部を形成し、隣接する熱電素子１２、１３を直列的に接続されるとともに、下方側に配設される電極部材１６がＰＮ接合部を形成し、隣接する熱電素子１２、１３を電気的に直列接続される。   Thereby, the thermoelectric elements 12 and 13 and the electrode member 16 are comprised integrally. The electrode member 16 disposed on the upper side forms an NP junction, and the adjacent thermoelectric elements 12 and 13 are connected in series, and the electrode member 16 disposed on the lower side is a PN junction. The adjacent thermoelectric elements 12 and 13 are electrically connected in series.

なお、熱電素子１２、１３および電極部材１６は、半導体、電子部品などを制御基板に組み付けるための製造装置であるマウンター装置を用いて組み付けても良い。これによれば、熱電素子１２、１３の素子寸法が１．５ｍｍ×１．５ｍｍ程度以上であれば、容易に摘むことができるので生産性が低下することなく組付けができる。   The thermoelectric elements 12 and 13 and the electrode member 16 may be assembled using a mounter device which is a manufacturing apparatus for assembling semiconductors, electronic components, and the like to the control board. According to this, if the element dimensions of the thermoelectric elements 12 and 13 are about 1.5 mm × 1.5 mm or more, the thermoelectric elements 12 and 13 can be easily picked up and can be assembled without lowering the productivity.

以上の第１実施形態による熱電変換装置によれば、熱電素子基板１０は、電源電圧の出力が定格条件で使用されたときに、一対の熱電素子１２、１３に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成している。   According to the thermoelectric conversion device according to the first embodiment described above, the thermoelectric element substrate 10 has an applied voltage of 0.04 V applied to the pair of thermoelectric elements 12 and 13 when the output of the power supply voltage is used under rated conditions. As mentioned above, it forms so that it may become less than 0.08V.

これによれば、吸熱能力およびその成績係数ＣＯＰは、最大となる最適な一対の熱電素子１２、１３あたりの印加電圧が存在する。これは発明者らが研究により見出したものであって、上記０．０４Ｖ以上〜０．０８Ｖ未満の最適電圧範囲内であれば吸熱能力およびその成績係数が良好となる使用範囲で使用することができる。   According to this, there is an optimum applied voltage per pair of thermoelectric elements 12 and 13 that maximizes the heat absorption capability and the coefficient of performance COP. This has been found by the inventors through research, and if it is within the optimum voltage range of 0.04 V to less than 0.08 V, it can be used in a usage range where the endothermic capacity and coefficient of performance are good. it can.

しかも、これらの最適電圧範囲内のうち、その印加電圧を低減させると吸熱能力と成績係数とが最大となる。ところが、このようなときには素子対数が増加して装置の設置面積が増加する。   Moreover, the heat absorption capacity and the coefficient of performance are maximized when the applied voltage is reduced within the optimum voltage range. However, in such a case, the number of device pairs increases and the installation area of the apparatus increases.

ところが、生産性の低下を防止できる範囲内で熱電素子１２、１３の体格を小さく形成することで、冷却能力およびその成績係数を低下させることことなく装置の小型化が図れる。また、上記最適電圧範囲を電源電圧の定格条件によって求めたことにより、車両に搭載する冷却装置もしくは加熱装置として好適である。   However, by reducing the size of the thermoelectric elements 12 and 13 within a range that can prevent a decrease in productivity, the apparatus can be downsized without reducing the cooling capacity and the coefficient of performance. Further, since the optimum voltage range is obtained from the rated condition of the power supply voltage, it is suitable as a cooling device or a heating device mounted on a vehicle.

また、熱電素子基板１０が一対の熱電素子１２、１３に印加する印加電圧がより好ましくは０．０４Ｖ以上、０．０７Ｖ未満となるように形成されたことにより、印加電圧の上限を０．０７Ｖ未満とすることで、上述したよりもより冷却能力およびその成績係数を向上させることができる。   Further, since the thermoelectric element substrate 10 is formed so that the applied voltage applied to the pair of thermoelectric elements 12 and 13 is more preferably 0.04 V or more and less than 0.07 V, the upper limit of the applied voltage is set to 0.07 V. By setting it to less than the above, the cooling capacity and the coefficient of performance can be improved more than those described above.

さらに、熱電素子基板１０が一対の熱電素子１２、１３に印加する印加電圧が最も好ましくは０．０４以上、０．０５Ｖ未満となるように形成されたことにより、印加電圧の上限を０．０５Ｖ未満とすることで最も冷却能力およびその成績係数を向上させることができる。   Further, since the thermoelectric element substrate 10 is formed so that the applied voltage applied to the pair of thermoelectric elements 12 and 13 is most preferably 0.04 or more and less than 0.05 V, the upper limit of the applied voltage is 0.05 V. By making it less than, the cooling capacity and the coefficient of performance can be improved most.

（第２実施形態）
以上の第１実施形態では、熱電素子基板１０を素子の形状、素子対数、熱電素子一対あたりの印加電圧を最適化して形成したが、これに限らず、熱電素子１２、１３の素子形状を最適化して形成しても良い。 (Second Embodiment)
In the first embodiment described above, the thermoelectric element substrate 10 is formed by optimizing the element shape, the number of element pairs, and the applied voltage per thermoelectric element pair, but not limited to this, the element shape of the thermoelectric elements 12 and 13 is optimized. May be formed.

具体的には、図１０に示すように、吸熱量Ｑｃは、素子の断面積（ａ×ｂ）／高さ（ｈ）が大きいほど増加する関係があり、その成績係数ＣＯＰは、素子の断面積（ａ×ｂ）／高さ（ｈ）が小さいほど増加する関係がある。なお、このときには、熱電素子基板１０の端子２４ａ、２４ｂ間にＤＣ６Ｖの駆動電圧を印加している。   Specifically, as shown in FIG. 10, the endothermic amount Qc increases as the cross-sectional area (a × b) / height (h) of the element increases, and the coefficient of performance COP There is a relationship that increases as the area (a × b) / height (h) decreases. At this time, a driving voltage of DC 6 V is applied between the terminals 24 a and 24 b of the thermoelectric element substrate 10.

本実施形態では、図１０に基づいて、熱電素子１２、１３の形状をその熱電素子１２、１３に流れる駆動電流の流れ方向に対して鉛直な断面積（ａ×ｂ）と、熱電素子１２、１３の高さ（ｈ）との比である素子形状指数（ａ×ｂ／ｈ）を最適化して熱電変換装置の小型化を図るようにしている。なお、素子形状指数（ａ×ｂ／ｈ）のうち、ａは、図１１に示すように、熱電素子１２、１３の幅寸法であり、ｂは奥行寸法である。   In the present embodiment, based on FIG. 10, the shape of the thermoelectric elements 12 and 13 is perpendicular to the flow direction of the drive current flowing through the thermoelectric elements 12 and 13, and the thermoelectric elements 12 and 13 The element shape index (a × b / h), which is a ratio to the height (h) of 13, is optimized to reduce the size of the thermoelectric conversion device. In the element shape index (a × b / h), a is the width dimension of the thermoelectric elements 12 and 13 and b is the depth dimension, as shown in FIG.

そして、より具体的には、（１）吸熱量比が最大吸熱量Ｑｃの６５％以上を確保できること。（２）成績係数ＣＯＰが１以上確保できること。（３）素子の高さ（ｈ）が１ｍｍ以上確保できること。の３つの条件を満足する素子形状指数（ａ×ｂ／ｈ）の最適範囲を求めている。ここで、（３）素子の高さ（ｈ）は、製造面における制約であり、高さ（ｈ）を１ｍｍ以上とすることで組付性が低下することはない。   More specifically, (1) the endothermic amount ratio can secure 65% or more of the maximum endothermic amount Qc. (2) A coefficient of performance COP of 1 or more can be secured. (3) The height (h) of the element should be 1 mm or more. The optimum range of the element shape index (a × b / h) satisfying these three conditions is obtained. Here, (3) The height (h) of the element is a restriction in terms of manufacturing, and the assemblability is not lowered by setting the height (h) to 1 mm or more.

これにより、（１）は素子形状指数（ａ×ｂ／ｈ）が１．５以上であれば良い。（２）は素子形状指数（ａ×ｂ／ｈ）が３．２未満であれば良い。（３）は素子形状指数（ａ×ｂ／ｈ）が２．５以下であれば、吸熱量比が最大吸熱量Ｑｃの６５％以上を確保でき、かつ、成績係数ＣＯＰが１以上確保できる。   Thereby, (1) should just have an element shape index | exponent (axb / h) 1.5 or more. (2) is sufficient if the element shape index (a × b / h) is less than 3.2. In (3), when the element shape index (a × b / h) is 2.5 or less, the endothermic amount ratio can ensure 65% or more of the maximum endothermic amount Qc, and the coefficient of performance COP can be 1 or more.

つまり、素子形状指数（ａ×ｂ／ｈ）が好ましくは１．５以上、２．５未満であり、より好ましくは２以上、２．５未満であると良い。これによって、冷却能力およびその成績係数をともに高い領域で実現できる。   That is, the element shape index (a × b / h) is preferably 1.5 or more and less than 2.5, and more preferably 2 or more and less than 2.5. As a result, both the cooling capacity and the coefficient of performance can be realized in a high region.

また、素子形状指数（ａ×ｂ／ｈ）の上限を２．５未満とすることで、熱電素子１２、１３の高さ（ｈ）を製造面からの制約となる所定の高さ（例えば、１ｍｍ）以上にして、生産性の低下を防止しつつ、高い吸熱能力と高い成績係数を実現できる。さらに、素子形状指数（ａ×ｂ／ｈ）の下限を２．０以上とすることで吸熱量比が最大吸熱量Ｑｃの８０％以上を確保できる。   Further, by setting the upper limit of the element shape index (a × b / h) to less than 2.5, the height (h) of the thermoelectric elements 12 and 13 is set to a predetermined height that is a restriction from the manufacturing surface (for example, 1 mm) or more, a high heat absorption capability and a high coefficient of performance can be realized while preventing a decrease in productivity. Furthermore, by setting the lower limit of the element shape index (a × b / h) to 2.0 or more, the endothermic ratio can ensure 80% or more of the maximum endothermic amount Qc.

なお、以上の素子形状指数（ａ×ｂ／ｈ）に基づいて形成した熱電素子基板１０に第１実施形態で求めた熱電素子一対あたりの印加電圧の最適電圧範囲を組み合わせることで、より確実に冷却能力およびその成績係数を低下させることなく、装置の小型化が図れるとともに生産性の向上が図れることができる。   In addition, it is more reliable by combining the optimum voltage range of the applied voltage per pair of thermoelectric elements obtained in the first embodiment with the thermoelectric element substrate 10 formed based on the above element shape index (a × b / h). The apparatus can be reduced in size and productivity can be improved without lowering the cooling capacity and the coefficient of performance.

（第３実施形態）
以上の実施形態では、熱電素子基板１０の小型化について説明したが、これに限らず、熱電素子基板１０の上下に積層する吸熱側フィン基板２０および放熱側フィン基板３０においても、複数の吸熱熱交換部材２２および放熱熱交換部材３２を小型化となるように配設することが望ましい。 (Third embodiment)
In the above embodiment, the downsizing of the thermoelectric element substrate 10 has been described. However, the present invention is not limited to this, and the heat absorption side fin substrate 20 and the heat dissipation side fin substrate 30 stacked above and below the thermoelectric element substrate 10 also have a plurality of endothermic heat. It is desirable to arrange the exchange member 22 and the radiant heat exchange member 32 to be miniaturized.

具体的には、図１２に示すように、吸熱側フィン基板２０および放熱側フィン基板３０には、熱交換媒体である空気の流れ方向に沿って形成される絶縁空間Ｌ２と熱交換媒体の流れ方向に対して直交する方向に形成される絶縁空間Ｌ１を設けて、それぞれ吸熱熱交換部材２２、放熱熱交換部材３２が複数個配設される。   Specifically, as shown in FIG. 12, the heat absorption side fin substrate 20 and the heat dissipation side fin substrate 30 have the insulating space L <b> 2 formed along the flow direction of air as the heat exchange medium and the flow of the heat exchange medium. An insulating space L1 formed in a direction orthogonal to the direction is provided, and a plurality of endothermic heat exchange members 22 and a plurality of radiant heat exchange members 32 are provided.

従って、絶縁空間Ｌ２よりも絶縁空間Ｌ１の方が大きくなるように、吸熱側フィン基板２０および放熱側フィン基板３０を形成することにより、絶縁空間Ｌ２を小さくすることで熱電素子対数を増加させることができる。これにより、装置の小型化が図れる。なお、直交する方向に形成される絶縁空間Ｌ１には、吸熱熱交換部材２２、放熱熱交換部材３２の熱交換部が形成できる。   Therefore, by forming the heat absorption side fin substrate 20 and the heat radiation side fin substrate 30 so that the insulation space L1 is larger than the insulation space L2, the number of thermoelectric elements can be increased by reducing the insulation space L2. Can do. Thereby, size reduction of an apparatus can be achieved. In addition, the heat exchange part of the endothermic heat exchange member 22 and the heat radiation heat exchange member 32 can be formed in the insulation space L1 formed in the orthogonal direction.

（第４実施形態）
以上の第３実施形態では、吸熱側フィン基板２０および放熱側フィン基板３０を互いに隣り合う吸熱熱交換部材２２、放熱熱交換部材３２の間に形成される絶縁空間Ｌ１、Ｌ２を異なるように形成したが、これに限らず、熱電素子基板１０の外形が空気の流れ方向に沿う奥行き寸法Ｗ２よりも、空気の流れ方向に対して直角方向となる幅寸法Ｗ１の方が大きくなるように形成されていても良い。 (Fourth embodiment)
In the third embodiment described above, the heat absorption side fin substrate 20 and the heat radiation side fin substrate 30 are formed so that the insulating spaces L1 and L2 formed between the heat absorption heat exchange members 22 and the heat radiation heat exchange members 32 adjacent to each other are different. However, the present invention is not limited to this, and the outer shape of the thermoelectric element substrate 10 is formed such that the width dimension W1 perpendicular to the air flow direction is larger than the depth dimension W2 along the air flow direction. May be.

具体的には、図１３に示すように、熱電素子１２、１３を空気の流れ方向に沿う奥行き方向に向けて電気的に直列接続するように第１絶縁基板１１に配設している。そして、熱電素子基板１０の外形を奥行き寸法Ｗ２よりも幅寸法Ｗ１の方が大きくなるように形成する。   Specifically, as shown in FIG. 13, the thermoelectric elements 12 and 13 are arranged on the first insulating substrate 11 so as to be electrically connected in series in the depth direction along the air flow direction. Then, the outer shape of the thermoelectric element substrate 10 is formed so that the width dimension W1 is larger than the depth dimension W2.

これによれば、奥行き寸法Ｗ２の方が小さいことで、空気の流れ方向に対して直角方向に隣り合う熱電素子１２、１３間の電位差が大きくなるのを防止することができる。また、幅寸法Ｗ１側に素子対数を増加することができる。つまり、通風抵抗が低下する方向に素子対数を増加することができる。   According to this, since the depth dimension W2 is smaller, it is possible to prevent the potential difference between the thermoelectric elements 12 and 13 adjacent in the direction perpendicular to the air flow direction from increasing. Further, the number of element pairs can be increased on the width dimension W1 side. That is, the number of element pairs can be increased in the direction in which the ventilation resistance decreases.

（第５実施形態）
以上の実施形態では、一つまたは複数の熱電素子基板１０を電気的に直列接続させて、その端子２４ａ、２４ｂ間に車両用電源を直接印加するように構成したが、これに限らず、電源電圧を所定電圧に調整する 電圧調整手段であるＤＣ−ＤＣコンバータ２を有し、そのＤＣ−ＤＣコンバータ２を介して熱電素子基板１０印加するように構成しても良い。 (Fifth embodiment)
In the above embodiment, one or a plurality of thermoelectric element substrates 10 are electrically connected in series, and the vehicle power supply is directly applied between the terminals 24a and 24b. The DC-DC converter 2 that is a voltage adjusting unit that adjusts the voltage to a predetermined voltage may be included, and the thermoelectric element substrate 10 may be applied via the DC-DC converter 2.

具体的には、図１４に示すように、車両用電源であるバッテリ１と熱電素子基板１０との間にＤＣ−ＤＣコンバータ２を設ける。そして、バッテリ１から出力される電源電圧をＤＣ−ＤＣコンバータ２で所定電圧（例えば、ＤＣ６Ｖ）に調整して熱電素子基板１０の端子２４ａ、２４ｂ間に接続している。なお、このときの所定電圧が定格条件である。   Specifically, as shown in FIG. 14, a DC-DC converter 2 is provided between a battery 1 that is a vehicle power source and a thermoelectric element substrate 10. The power supply voltage output from the battery 1 is adjusted to a predetermined voltage (for example, DC 6 V) by the DC-DC converter 2 and connected between the terminals 24 a and 24 b of the thermoelectric element substrate 10. The predetermined voltage at this time is the rated condition.

以上の構成によれば、例えば、車両用電源は、車両用補機の負荷や環境条件により電源電圧が変動することで、その変動によって一対の熱電素子１２、１３に印加する印加電圧が変動するが、ＤＣ−ＤＣコンバータ２によって、常時最適な印加電圧を一対の熱電素子１２、１３に印加することができる。従って、吸熱能力およびその成績係数が良好となる使用範囲で使用することができる。   According to the above configuration, for example, in the vehicular power supply, the power supply voltage fluctuates depending on the load of the vehicular auxiliary machine and the environmental conditions, and the applied voltage applied to the pair of thermoelectric elements 12 and 13 fluctuates due to the fluctuation. However, the DC-DC converter 2 can always apply the optimum applied voltage to the pair of thermoelectric elements 12 and 13. Therefore, it can be used in a usage range where the endothermic ability and the coefficient of performance are good.

（他の実施形態）
以上の実施形態では、本発明を車両に搭載されるシート空調装置に適用させたが、車両とは限らず、ペルチェ素子５２により送風空気を冷却もしくは加熱する冷却装置もしくは加熱装置に適用させても良い。 (Other embodiments)
In the above embodiment, the present invention is applied to a seat air conditioner mounted on a vehicle. However, the present invention is not limited to a vehicle, and may be applied to a cooling device or a heating device that cools or heats blown air using a Peltier element 52. good.

本発明の第１実施形態における熱電変換装置の外観形状を示す平面図である。It is a top view which shows the external appearance shape of the thermoelectric conversion apparatus in 1st Embodiment of this invention. 図１に示すＡ−Ａ断面図である。It is AA sectional drawing shown in FIG. 図２に示すＣ−Ｃ断面図である。It is CC sectional drawing shown in FIG. 図１に示すＢ−Ｂ断面図である。It is BB sectional drawing shown in FIG. 熱電素子一対あたりの印加電圧と吸熱能力比との関係を示す特性図である。It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair, and a heat absorption capability ratio. 熱電素子一対あたりの印加電圧と成績係数ＣＯＰとの関係を示す特性図である。It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair, and a coefficient of performance COP. 熱電素子一対あたりの印加電圧と素子対数との関係を示す特性図である。It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair and the number of element pairs. 熱電素子一対あたりの印加電圧と素子の最大許容寸法との関係を示す特性図である。It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair, and the maximum permissible dimension of an element. 本発明の第１実施形態の変形例における熱電素子基板１０の外観形状を示す平面図である。It is a top view which shows the external appearance shape of the thermoelectric element board | substrate 10 in the modification of 1st Embodiment of this invention. 本発明の第２実施形態における素子形状指数と吸熱能力比、成績係数ＣＯＰとの関係を示す特性図である。It is a characteristic view which shows the relationship between the element shape index | exponent, heat absorption capability ratio, and coefficient of performance COP in 2nd Embodiment of this invention. 熱電素子１２、１３の素子形状を説明する斜視図である。It is a perspective view explaining the element shape of the thermoelectric elements 12 and 13. FIG. 本発明の第３実施形態における吸熱側フィン基板２０、放熱側フィン基板３０の外観形状を示す模式図である。It is a schematic diagram which shows the external shape of the heat sink side fin board | substrate 20 in the 3rd Embodiment of this invention, and the heat radiation side fin board | substrate 30. FIG. 本発明の第４実施形態における熱電素子基板１０の形状を示す模式図である。It is a schematic diagram which shows the shape of the thermoelectric element board | substrate 10 in 4th Embodiment of this invention. 本発明の第５実施形態における熱電素子基板１０の電気配線を示すブロック図である。It is a block diagram which shows the electrical wiring of the thermoelectric element board | substrate 10 in 5th Embodiment of this invention.

符号の説明Explanation of symbols

２…ＤＣ−ＤＣコンバータ（電圧調整手段）
１０…熱電素子基板（熱電素子モジュール）
１２…Ｐ型熱電素子、熱電素子
１３…Ｎ型熱電素子、熱電素子
２２…吸熱熱交換部材
３２…吸熱熱交換部材 2 ... DC-DC converter (voltage adjusting means)
10 ... Thermoelectric element substrate (thermoelectric element module)
DESCRIPTION OF SYMBOLS 12 ... P-type thermoelectric element, thermoelectric element 13 ... N-type thermoelectric element, thermoelectric element 22 ... Endothermic heat exchange member 32 ... Endothermic heat exchange member

Claims (11)

Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの前記熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を一つまたは複数の前記熱電素子モジュール（１０）に直接印加する熱電変換装置であって、
前記熱電素子モジュール（１０）は、前記電源電圧の出力が定格条件で使用されたときに、前記一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴とする熱電変換装置。 A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of power supply voltages directly applied to one or a plurality of the thermoelectric element modules (10),
The thermoelectric element module (10) has an applied voltage applied to the pair of thermoelectric elements (12, 13) of 0.04 V or more and less than 0.08 V when the output of the power supply voltage is used under rated conditions. A thermoelectric conversion device formed so as to become. Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの前記熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を所定電圧に調整する電圧調整手段（２）を有し、前記電圧調整手段（２）を介して一つまたは複数の前記熱電素子モジュール（１０）に印加する熱電変換装置であって、
前記熱電素子モジュール（１０）は、前記電圧調整手段（２）の出力電圧が定格条件で使用されたときに、前記一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴とする熱電変換装置。 A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of voltage adjustment means (2) for adjusting a power supply voltage to a predetermined voltage, and applying to one or a plurality of the thermoelectric element modules (10) via the voltage adjustment means (2). There,
The thermoelectric module (10) has an applied voltage of 0.04 V or more applied to the pair of thermoelectric elements (12, 13) when the output voltage of the voltage adjusting means (2) is used under rated conditions. A thermoelectric conversion device formed to be less than 0.08V. 前記熱電素子モジュール（１０）は、前記一対の熱電素子（１２、１３）に印加する印加電圧がより好ましくは０．０４Ｖ以上、０．０７Ｖ未満となるように形成されたことを特徴とする請求項１または請求項２に記載の熱電変換装置。   The thermoelectric element module (10) is formed such that an applied voltage applied to the pair of thermoelectric elements (12, 13) is more preferably 0.04V or more and less than 0.07V. Item 3. The thermoelectric conversion device according to item 1 or 2. 前記熱電素子モジュール（１０）は、前記一対の熱電素子（１２、１３）に印加する印加電圧が最も好ましくは０．０４Ｖ以上、０．０５Ｖ未満となるように形成されたことを特徴とする請求項１または請求項２に記載の熱電変換装置。   The thermoelectric element module (10) is formed so that an applied voltage applied to the pair of thermoelectric elements (12, 13) is most preferably 0.04V or more and less than 0.05V. Item 3. The thermoelectric conversion device according to item 1 or 2. Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの前記熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を一つまたは複数の前記熱電素子モジュール（１０）に直接印加する熱電変換装置であって、
前記熱電素子モジュール（１０）は、前記熱電素子（１２、１３）をその熱電素子（１２、１３）に流れる電流の流れ方向に対して鉛直な断面積（ａ×ｂ）と、前記熱電素子（１２、１３）の高さ（ｈ）との比である素子形状指数（ａ×ｂ／ｈ）が１．５以上、２．５未満となるように形成されたことを特徴とする熱電変換装置。 A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of power supply voltages directly applied to one or a plurality of the thermoelectric element modules (10),
The thermoelectric element module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to a flow direction of a current flowing through the thermoelectric element (12, 13), the thermoelectric element ( 12. A thermoelectric conversion device formed so that an element shape index (a × b / h) which is a ratio to a height (h) of 12, 13) is 1.5 or more and less than 2.5 . Ｐ型とＮ型とからなる一対の熱電素子（１２、１３）を複数対配列し、これらの前記熱電素子（１２、１３）が電気的に接続される熱電素子モジュール（１０）を一つまたは複数備え、電源電圧を所定電圧に調整する電圧調整手段（２）を有し、前記電圧調整手段（２）を介して一つまたは複数の前記熱電素子モジュール（１０）に印加する熱電変換装置であって、
前記熱電素子モジュール（１０）は、前記熱電素子（１２、１３）をその熱電素子（１２、１３）に流れる電流の流れ方向に対して鉛直な断面積（ａ×ｂ）と、前記熱電素子（１２、１３）の高さ（ｈ）との比である素子形状指数（ａ×ｂ／ｈ）が１．５以上、２．５未満となるように形成されたことを特徴とする熱電変換装置。 A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of voltage adjustment means (2) for adjusting a power supply voltage to a predetermined voltage, and applying to one or a plurality of the thermoelectric element modules (10) via the voltage adjustment means (2). There,
The thermoelectric element module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to a flow direction of a current flowing through the thermoelectric element (12, 13), the thermoelectric element ( 12. A thermoelectric conversion device formed so that an element shape index (a × b / h) which is a ratio to a height (h) of 12, 13) is 1.5 or more and less than 2.5 . 前記熱電素子モジュール（１０）は、前記熱電素子（１２、１３）を前記素子形状指数（ａ×ｂ／ｈ）がより好ましくは２．０以上、２．５未満となるように形成されたことを特徴とする請求項５または請求項６に記載の熱電変換装置。   The thermoelectric element module (10) is formed such that the element shape index (a × b / h) is more preferably 2.0 or more and less than 2.5 for the thermoelectric element (12, 13). The thermoelectric conversion device according to claim 5 or 6, characterized in that. 前記熱電素子モジュール（１０）は、前記電源電圧の出力が定格条件で使用されたときに、前記一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴とする請求項５または請求項７に記載の熱電変換装置。   The thermoelectric element module (10) has an applied voltage applied to the pair of thermoelectric elements (12, 13) of 0.04 V or more and less than 0.08 V when the output of the power supply voltage is used under rated conditions. The thermoelectric conversion device according to claim 5 or 7, wherein the thermoelectric conversion device is formed as described above. 前記熱電素子モジュール（１０）は、前記電圧調整手段（２）の出力電圧が定格条件で使用されたときに、前記一対の熱電素子（１２、１３）に印加する印加電圧が０．０４Ｖ以上、０．０８Ｖ未満となるように形成されたことを特徴とする請求項６または請求項７に記載の熱電変換装置。   The thermoelectric module (10) has an applied voltage of 0.04 V or more applied to the pair of thermoelectric elements (12, 13) when the output voltage of the voltage adjusting means (2) is used under rated conditions. The thermoelectric conversion device according to claim 6 or 7, wherein the thermoelectric conversion device is formed to be less than 0.08V. 前記熱電素子モジュール（１０）の一方面に互いに絶縁空間（Ｌ１、Ｌ２）を隔てて配設され、前記一対の熱電素子（１２、１３）に伝熱可能に接続された複数の吸熱熱交換部材（２２）と、
前記熱電素子モジュール（１０）の他方面に互いに絶縁空間（Ｌ１、Ｌ２）を隔てて配設され、前記一対の熱電素子（１２、１３）に伝熱可能に接続された複数の放熱熱交換部材（３２）とを有し、前記複数の吸熱熱交換部材（２２）側、および前記複数の放熱熱交換部材（３２）側のそれぞれに熱交換媒体が流通するように構成されており、
前記複数の吸熱熱交換部材（２２）および前記複数の放熱熱交換部材（３２）は、熱交換媒体の流れ方向に沿って形成される前記絶縁空間（Ｌ２）よりも熱交換媒体の流れ方向に対して直交する方向に形成される前記絶縁空間（Ｌ１）の方が大きくなるように形成されたことを特徴とする請求項１ないし請求項９のいずれか一項に記載の熱電変換装置。 A plurality of endothermic heat exchange members disposed on one surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween and connected to the pair of thermoelectric elements (12, 13) so as to conduct heat. (22)
A plurality of heat-dissipating heat exchange members disposed on the other surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween and connected to the pair of thermoelectric elements (12, 13) so as to conduct heat. (32), and is configured such that a heat exchange medium flows through each of the plurality of endothermic heat exchange members (22) and the plurality of heat dissipation heat exchange members (32).
The plurality of endothermic heat exchange members (22) and the plurality of radiant heat exchange members (32) are more in the flow direction of the heat exchange medium than the insulating space (L2) formed along the flow direction of the heat exchange medium. The thermoelectric conversion device according to any one of claims 1 to 9, wherein the insulating space (L1) formed in a direction orthogonal to the direction is formed to be larger. 前記熱電素子モジュール（１０）は、前記一対の熱電素子（１２、１３）を熱交換媒体の流れ方向に沿う奥行き方向に向けて電気的に直列接続するように配設しており、かつ熱交換媒体の流れ方向に沿う奥行き寸法（Ｗ２）よりも、熱交換媒体の流れ方向に対して直角方向となる幅寸法（Ｗ１）の方が大きくなるように形成されたことを特徴とする請求項１０に記載の熱電変換装置。   The thermoelectric element module (10) is arranged so that the pair of thermoelectric elements (12, 13) are electrically connected in series in the depth direction along the flow direction of the heat exchange medium, and heat exchange is performed. The width dimension (W1) perpendicular to the flow direction of the heat exchange medium is formed to be larger than the depth dimension (W2) along the flow direction of the medium. The thermoelectric conversion device according to 1.
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JP2010223497A (en) * 2009-03-24 2010-10-07 Nitto Electric Works Ltd Peltier type cooling unit
JP2018528565A (en) * 2015-06-10 2018-09-27 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ Low temperature plate assembly integrated vehicle battery thermoelectric element and method of assembling thermoelectric element

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JP2002329897A (en) * 2001-05-01 2002-11-15 Eco Twenty One:Kk Thermoelectric conversion element and optical communication module using the same
JP2004071969A (en) * 2002-08-08 2004-03-04 Okano Electric Wire Co Ltd Thermoelectric cooling apparatus

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JP2010223497A (en) * 2009-03-24 2010-10-07 Nitto Electric Works Ltd Peltier type cooling unit
JP2018528565A (en) * 2015-06-10 2018-09-27 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ Low temperature plate assembly integrated vehicle battery thermoelectric element and method of assembling thermoelectric element

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