JP2001105261A - Board holding device - Google Patents
Board holding deviceInfo
- Publication number
- JP2001105261A JP2001105261A JP27995499A JP27995499A JP2001105261A JP 2001105261 A JP2001105261 A JP 2001105261A JP 27995499 A JP27995499 A JP 27995499A JP 27995499 A JP27995499 A JP 27995499A JP 2001105261 A JP2001105261 A JP 2001105261A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- suction
- holding device
- suction groove
- substrate holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Jigs For Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、薄い基板を保持固
定する基板保持装置に関し、特に薄い基板自体がもって
いる皺および基板が保持部と接触しない部分での自重に
よるたわみや皺を低減する保持装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding device for holding and fixing a thin substrate, and more particularly to a holding device for reducing wrinkles of a thin substrate itself and bending and wrinkles due to its own weight in a portion where the substrate does not come into contact with a holding portion. It concerns the device.
【０００２】[0002]
【従来の技術】近年、回路基板や液晶パネル用ガラス基
板さらには半導体ウェハなど、薄い基板を位置精度良く
保持することが求められている。この場合、基板の中央
部を加工したり、他の基板と位置合わせするなどの必要
から、特に基板の周辺部のみで基板を保持したい例も多
い。その例として特開平−９２６６２４２号公報には図
３（ａ）および（ｂ）に示すように、半導体ウェハ１の
周辺部の周囲を基板保持部２によって保持し、基板保持
部に設けられた吸着溝３とそれに連結された気体吸引手
段によりウェハを吸着するとともに、中心部の設けられ
た凹部４に気体などを充満するようにして、基板の自重
によるたわみを補正するようにした構成が示されてい
る。2. Description of the Related Art In recent years, it has been required to hold a thin substrate such as a circuit substrate, a glass substrate for a liquid crystal panel, and a semiconductor wafer with high positional accuracy. In this case, since it is necessary to process the central portion of the substrate or align the substrate with another substrate, there are many cases in which the substrate is desired to be held only at the peripheral portion of the substrate. As an example, as shown in FIG. 3A and FIG. 3B, Japanese Patent Application Laid-Open No. 9-266242 shows that the periphery of the peripheral portion of the semiconductor wafer 1 is held by the substrate holding portion 2 and the suction provided on the substrate holding portion. A configuration is shown in which the wafer is sucked by the groove 3 and the gas suction means connected thereto, and the concave portion 4 provided at the center is filled with gas or the like to correct the deflection due to the weight of the substrate. ing.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
従来の構成では、基板の保持に気体吸引手段とともに気
体を凹部４に充満させるための手段や、図３（ａ）に示
すように、基板保持部３の周囲に設けられた吸着溝６と
それに連結された図示しない気体吸引手段により基板を
吸着保持する等、複雑な構造が必要になる。However, in the above-mentioned conventional structure, the means for filling the recess 4 with gas together with the gas suction means for holding the substrate, and the method for holding the substrate as shown in FIG. A complicated structure is required, for example, such that the substrate is sucked and held by the suction groove 6 provided around the portion 3 and gas suction means (not shown) connected thereto.
【０００４】また、基板がフィルムなどの薄板であった
場合は、基板自体に皺が生じていることがあるが、上記
の基板吸着手段ではこの皺を取ることができず、レ−ザ
孔開け加工形状の歪みやアライメント位置精度が悪くな
るという課題があった。In the case where the substrate is a thin plate such as a film, wrinkles may be formed on the substrate itself. There has been a problem that the processing shape is distorted and the alignment position accuracy is deteriorated.
【０００５】本発明は、上記の課題に鑑みてなされたも
のであり、単純な構成を有するとともに、薄板からなる
基板の皺を除去しつつ保持することのできる基板保持装
置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a substrate holding device which has a simple structure and is capable of holding a thin substrate while removing wrinkles. And
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに、第１の本発明（請求項１に対応）は、基板を載置
する載置面と、前記配置面内に形成された吸着溝と、前
記吸着溝内に配置された、前記吸着溝内の吸気を行う吸
気孔とを備えた、前記吸着溝に前記基板を真空吸着する
基板保持装置であって、前記基板の外周縁部に位置する
前記吸着溝から内側に位置する前記吸着溝へ向かって、
順次吸気が開始されるまたは強勢されることを特徴とす
る基板保持装置である。In order to achieve the above object, a first aspect of the present invention (corresponding to claim 1) is that a mounting surface on which a substrate is mounted and a mounting surface formed in the mounting surface are provided. What is claimed is: 1. A substrate holding device, comprising: a suction groove; and a suction hole disposed in the suction groove, for suctioning air in the suction groove. From the suction groove located in the part toward the suction groove located inside,
A substrate holding apparatus characterized in that suction is sequentially started or stressed.
【０００７】また、第２の本発明（請求項２に対応）
は、前記吸着溝は、少なくとも２本の、前記基板の外周
縁部と相似的な閉曲線として形成されていることを特徴
とする上記本発明である。Further, the second invention (corresponding to claim 2)
The present invention is characterized in that the suction groove is formed as a closed curve similar to at least two outer peripheral edges of the substrate.
【０００８】また、第３の本発明（請求項３に対応）
は、前記吸着溝は前記基板の外周縁部と相似的な曲線ま
たは折れ線、もしくは直線として形成されていることを
特徴とする上記本発明である。Further, the third invention (corresponding to claim 3)
The present invention is characterized in that the suction groove is formed as a curved line, a broken line, or a straight line similar to the outer peripheral edge portion of the substrate.
【０００９】また、第４の本発明（請求項４に対応）
は、前記吸気孔は、前記吸着溝の本数または位置に応じ
て複数設けられており、それぞれ独立に吸気を行うこと
を特徴とする上記本発明である。Further, a fourth aspect of the present invention (corresponding to claim 4)
The present invention is characterized in that a plurality of the suction holes are provided in accordance with the number or positions of the suction grooves, and the suction holes are independently performed.
【００１０】また、第５の本発明（請求項５に対応）
は、前記吸着溝の、前記載置面を含む平面上に展開する
形状は多角形状であり、前記吸着溝の幅は、前記多角形
の辺の中央部よりも頂点近傍のほうが狭く形成されてい
ることを特徴とする上記本発明である。A fifth invention (corresponding to claim 5)
The shape of the suction groove, which is developed on a plane including the mounting surface described above, is a polygonal shape, and the width of the suction groove is formed to be narrower near the apex than at the center of the side of the polygon. The present invention is characterized in that:
【００１１】また、第６の本発明（請求項６に対応）
は、前記頂点近傍は、丸みを持って形成されていること
を特徴とする上記本発明である。A sixth aspect of the present invention (corresponding to claim 6)
Is the present invention as described above, wherein the vicinity of the vertex is formed with roundness.
【００１２】また、第７の本発明（請求項７に対応）
は、前記吸着溝と前記載置面との境界の断面形状は、丸
みを持って形成されていることを特徴とする上記本発明
である。A seventh aspect of the present invention (corresponding to claim 7).
The present invention is characterized in that the cross-sectional shape of the boundary between the suction groove and the placement surface is formed with a roundness.
【００１３】また、第８の本発明（請求項８に対応）
は、前記載置面は、四角形状基板の周縁部を保持するた
めの四角枠状の形状を有することを特徴とする上記本発
明である。An eighth aspect of the present invention (corresponding to claim 8).
The present invention is characterized in that the mounting surface has a rectangular frame shape for holding a peripheral portion of a rectangular substrate.
【００１４】本発明の基板保持装置は、例えば四角状基
板の周辺部を保持する四角枠状の基板保持部と、前記基
板保持部上面に沿って設けられた複数の吸着溝の吸気を
個々または２系統以上の制御系により外側から内側に向
かって真空吸気することを特徴とする。前記吸着溝の幅
が辺の中央部で広く辺の隅部で狭く形成されていること
を特徴とする。A substrate holding apparatus according to the present invention includes, for example, a rectangular frame-shaped substrate holding portion for holding a peripheral portion of a rectangular substrate, and a plurality of suction grooves provided along the upper surface of the substrate holding portion, individually or individually. The vacuum suction is performed from the outside to the inside by two or more control systems. The width of the suction groove is wide at the center of the side and narrow at the corner of the side.
【００１５】また、前記構成においては、前記吸着溝の
断面は基板と接触する角部に丸みを形成されていること
が好ましい。[0015] In the above structure, it is preferable that a cross section of the suction groove has a rounded corner in contact with the substrate.
【００１６】また、前記構成においては、前記吸着溝の
四隅では丸みが形成されていることが好ましい。Further, in the above configuration, it is preferable that roundness is formed at four corners of the suction groove.
【００１７】[0017]
【発明の実施の形態】以下、本発明の実施の形態につい
て図１（ａ）から図２（ｅ）を用いて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS. 1 (a) to 2 (e).
【００１８】図１（ａ）は本発明の実施の形態による基
板保持装置の斜視図であり、図１（ｂ）は上面図であ
る。基板保持装置はアルミニウム枠で形成されている。
図１（ａ）および図１（ｂ）において、６は本発明の要
部をなす基板保持部上面に沿って設けられた３本の吸着
溝である。吸気孔７は吸着溝６の内部に設けられた吸気
孔である。複数の吸気孔６は、それぞれ独立して空気吸
引手段である真空ポンプ（図示せず）に連結されてお
り、個々に吸引動作を行うことができる。また８は基板
を載置するための基板載置面であり、９はその上に基板
が保持される、中空となった基板保持口である。FIG. 1A is a perspective view of a substrate holding device according to an embodiment of the present invention, and FIG. 1B is a top view. The substrate holding device is formed of an aluminum frame.
In FIG. 1A and FIG. 1B, reference numeral 6 denotes three suction grooves provided along the upper surface of the substrate holding unit which is a main part of the present invention. The intake hole 7 is an intake hole provided inside the suction groove 6. The plurality of intake holes 6 are independently connected to a vacuum pump (not shown), which is an air suction unit, and can individually perform a suction operation. Reference numeral 8 denotes a substrate mounting surface on which the substrate is mounted, and 9 denotes a hollow substrate holding port on which the substrate is held.
【００１９】以上のような構成を有する、本発明の実施
の形態による基板保持装置の動作について、以下、説明
を行う。The operation of the substrate holding apparatus having the above-described configuration according to the embodiment of the present invention will be described below.
【００２０】図２（ａ）は、基板保持装置において、保
持面８上に、例えばフィルム基板のような薄板から形成
された基板５を置いた状態を示す、図１（ｂ）のＡＡ直
線による断面図である。図に示すように、基板５は程々
の機能を付加させるために多層構造になっている場合が
多く、そのための加工応力等により皺が発生している場
合が多い。FIG. 2A shows a state in which the substrate 5 formed of a thin plate such as a film substrate is placed on the holding surface 8 in the substrate holding device, and is taken along the line AA in FIG. 1B. It is sectional drawing. As shown in the figure, the substrate 5 often has a multi-layer structure in order to add moderate functions, and often has wrinkles due to processing stress or the like.
【００２１】図２（ｂ）は基板５の最も外周縁側の吸着
溝６ａのみを使って、基板５を吸着した場合を示す図で
ある。この場合は、吸着溝６ａ内の吸気孔７ａの吸引力
によって、フィルム基板５が吸着溝６ａに引き込まれる
力が働くため、基板保持口９上に位置する基板５の皺を
若干量のばすことができる。しかしながら、この状態
は、従来例と同様に、単に吸着により基板を保持してい
るだけであり、フィルム基板５に入った皺を充分にのば
すことはできず、また皺が残っている。FIG. 2B is a diagram showing a case where the substrate 5 is sucked using only the suction groove 6a on the outermost peripheral side of the substrate 5. In this case, the suction force of the suction hole 7a in the suction groove 6a exerts a force to draw the film substrate 5 into the suction groove 6a, so that the wrinkles of the substrate 5 located on the substrate holding opening 9 can be slightly reduced. it can. However, in this state, as in the conventional example, the substrate is merely held by suction, and the wrinkles in the film substrate 5 cannot be sufficiently extended, and wrinkles remain.
【００２２】続けて、吸着溝を複数使って吸着保持動作
を行う動作について説明を行う。Next, an operation of performing a suction holding operation using a plurality of suction grooves will be described.
【００２３】上述のように、本実施の形態による基板保
持装置は、３本の吸着溝６ａ、６ｂおよび６ｃを備えて
おり、それぞれの吸着溝は、独立した空気吸引手段に接
続した吸気孔７ａ、７ｂおよび７ｃを介して、各々に真
空吸気を制御できる構造にしている。As described above, the substrate holding device according to the present embodiment has three suction grooves 6a, 6b and 6c, and each of the suction grooves is provided with an intake hole 7a connected to independent air suction means. , 7b and 7c, the structure is such that the vacuum suction can be controlled respectively.
【００２４】そこで、図２（ｃ）に示すように、図２
（ｂ）の基板５を吸着溝６ａだけの吸着により保持する
状態に続けて、吸着溝６ｂ内の吸気孔７ｂからの吸気を
開始する。このとき、吸着溝６ａの吸引によりある程度
皺が伸びた基板５は、さらに吸着溝６ｂに引き込まれる
ため、基板保持口９上にある基板５は、さらに皺が伸び
ることになる。Therefore, as shown in FIG.
Subsequent to the state (b) in which the substrate 5 is held by only the suction groove 6a, suction from the suction hole 7b in the suction groove 6b is started. At this time, the wrinkles of the substrate 5 which have been stretched to some extent by the suction of the suction grooves 6a are further drawn into the suction grooves 6b, so that the wrinkles of the substrate 5 on the substrate holding opening 9 are further expanded.
【００２５】さらに上記と同様にして、図２（ｄ）に示
すように、図２（ｃ）の基板５を吸着溝６ａおよび６ｂ
の吸着により保持する状態に続けて、吸着溝６ｃ内の吸
気孔７ｃからの吸気を開始する。すると、吸着溝６ａお
よび６ｂの吸引によりある程度皺が伸びた基板５は、さ
らに吸着溝６ｃに引き込まれるため、基板保持口９上に
ある基板５の皺は、ほぼ完全に伸びることとなる。Further, in the same manner as described above, as shown in FIG. 2D, the substrate 5 of FIG.
Then, the suction from the suction hole 7c in the suction groove 6c is started. Then, the wrinkles of the substrate 5 on the substrate holding opening 9 are almost completely extended since the substrate 5 which has wrinkled to some extent due to the suction of the suction grooves 6a and 6b is further drawn into the suction groove 6c.
【００２６】ところで上記の本実施の形態の構成におい
ては、吸着溝８の幅を中心部では例えば５ｍｍ、端部の
幅で４ｍｍより広くとるようにした。この場合、基板に
隅部より強い張力が働くため、本実施の形態のように四
角枠状で吸着する場合には、基板中央部から放射状に引
っぱる力が働くため、均一な力を加えることができる。In the configuration of the present embodiment, the width of the suction groove 8 is set to, for example, 5 mm at the central portion, and wider than 4 mm at the end portion. In this case, since a stronger tension acts on the substrate than at the corners, in the case where the substrate is sucked in a rectangular frame shape as in this embodiment, a force radially pulled from the central portion of the substrate acts, so that a uniform force may be applied. it can.
【００２７】また、この際、図２（ｅ）に示すように基
板５と接する基板載置面９の断面は角部に例えば半径１
ｍｍの丸みをもって形成されている。こうすることによ
り、吸気の際に基板５を吸着溝６に引き込みやすくな
り、皺や撓みを除く効果を大きくすることができる。At this time, as shown in FIG. 2E, the cross section of the substrate mounting surface 9 in contact with the substrate 5 has a corner having a radius of, for example, 1 mm.
mm. By doing so, it becomes easier to draw the substrate 5 into the suction groove 6 at the time of suction, and the effect of removing wrinkles and bending can be increased.
【００２８】また、図１（ｂ）に示すように、吸着溝６
（６ａ、６ｂおよび６ｃ）は、それぞれ四隅に半径約２
０ｍｍの丸み１０ａ、１０ｂ、１０ｃおよび１０ｄが設
けるようにした。こうすることにより、基板５を引っぱ
る力を面内で均一に加えることができるため、基板の平
面精度を向上させることができる。Further, as shown in FIG.
(6a, 6b and 6c) have a radius of about 2 at each of the four corners.
0 mm roundnesses 10a, 10b, 10c and 10d were provided. By doing so, a force for pulling the substrate 5 can be applied uniformly in the plane, so that the planar accuracy of the substrate can be improved.
【００２９】上記のようにして位置精度および平面精度
良く保持された（回路）基板５は、顕微鏡を使った位置
合わせや、レ−ザを用いた穴加工やアライメントなどの
作業に用いられ、その作業を精度良く行うことができ
る。The (circuit) substrate 5 held with good positional accuracy and planar accuracy as described above is used for operations such as alignment using a microscope, drilling and alignment using a laser, and the like. Work can be performed with high accuracy.
【００３０】このように、本実施の形態による基板保持
装置によれば、複数の吸着溝を用いて、基板の外側に位
置する吸着溝から順次吸着を行うようにしたことによ
り、基板にテンションを十分に付加することができるた
め、保持しようとする基板上の皺を完全に取り除いた状
態を得ることができる。これにより、基板全体のたわみ
や皺を無くした状態で孔開け加工ができ、穴加工形状の
歪みや位置精度良く、基板を保持することができる。ま
た、本実施の形態は、従来例と異なり、吸気溝や吸気手
段だけを用いて基板を保持できるため、装置自体の構成
が簡略化できるいう効果がある。As described above, according to the substrate holding apparatus of the present embodiment, a plurality of suction grooves are used to sequentially perform suction from the suction grooves located outside the substrate, so that tension is applied to the substrate. Since it can be sufficiently added, it is possible to obtain a state in which wrinkles on the substrate to be held are completely removed. Accordingly, it is possible to perform drilling in a state in which the entire substrate is free from bending and wrinkles, and it is possible to hold the substrate with good distortion of the drilled shape and high positional accuracy. Also, in the present embodiment, unlike the conventional example, since the substrate can be held using only the suction groove and the suction means, there is an effect that the configuration of the apparatus itself can be simplified.
【００３１】なお、本実施の形態においては、吸着溝６
は、四角形状の輪を同心円的に３組み合わせたものとし
て説明を行ったが、これに限定せず、さらに数を増やし
てもよい。また、吸着溝６の形状も、載置される基板の
形状に応じて、四角形のみならず、多角形としてもよ
い。さらに、基板５に生じた皺の方向に応じて上下、ま
たは左右の方向にのみ設けた、直線または曲線、もしく
は折れ線の形状としてもよく、一本の渦巻きのように成
形してもよい。つまり、本発明の吸着溝は、順次吸着動
作が行われるように、基板の該周縁部から内側に向かっ
て、多段的に成形されていれば、どのような形態をとっ
てもよい。In this embodiment, the suction grooves 6 are used.
Has been described as a combination of three square rings concentrically, but the present invention is not limited to this, and the number may be further increased. Further, the shape of the suction groove 6 may be not only a quadrangle but also a polygon depending on the shape of the substrate to be placed. Furthermore, the shape may be a straight line, a curved line, or a broken line provided only in the vertical direction or the horizontal direction according to the direction of the wrinkles generated on the substrate 5, or may be formed as a single spiral. That is, the suction groove of the present invention may take any form as long as the suction groove is formed in multiple stages from the peripheral edge of the substrate toward the inside so that the suction operation is performed sequentially.
【００３２】また、本発明の吸気孔は、実施の形態にお
いては個々の吸着溝につき一つずつ儲けられたものとし
て説明を行ったが、これに限定する必要はなく、吸着溝
の形状に応じて、一本の吸着溝につき複数設けるように
してもよい。つまり、本発明の吸気孔は、載置された基
板の外周縁部に位置する吸着溝から内側に位置する吸着
溝へ向かって順次吸着動作が行われるように配置されて
いればよい。Further, in the embodiment, the suction holes of the present invention have been described as being formed one by one for each suction groove. However, the present invention is not limited to this. Thus, a plurality of suction grooves may be provided. That is, the suction holes of the present invention may be arranged so that the suction operation is sequentially performed from the suction groove located on the outer peripheral edge of the placed substrate to the suction groove located inside.
【００３３】また、本発明の実施の形態では、吸気動作
自体は積算的に行われるものとして説明を行ったが、こ
れに限定する必要はない。つまり、図２（ａ）〜（ｄ）
に示す動作において、吸気孔７ａ、７ｂおよび７ｃは開
始動作において連続するようになっているが、例えば図
２（ｃ）に示す状態で、吸着溝６ｂによる吸着保持が十
分確保されている場合は、吸着溝６ａの吸着保持を解除
するように、吸気孔７ａの吸気動作を停止してもよく、
また、図２（ｄ）に示す状態で、吸着溝６ｃによる吸着
保持が十分確保されている場合は、吸着溝６ａおよび６
ｂの吸着保持を解除するように、吸気孔７ａおよび７ｂ
の吸気動作を停止してもよい。つまり、本発明の吸気孔
における吸気動作は、載置された基板の外周縁部から内
側へ向かう順次吸着動作により、基板保持口６の上で基
板が皺を伸ばすように保持されるならば、はじめの動作
開始以後の制御はどのような形態をとってもよい。Further, in the embodiment of the present invention, the intake operation itself is described as being performed in an integrated manner. However, the present invention is not limited to this. That is, FIGS. 2A to 2D
In the operation shown in (2), the suction holes 7a, 7b, and 7c are configured to be continuous at the start operation. For example, in the state shown in FIG. 2C, when the suction holding by the suction groove 6b is sufficiently ensured. The suction operation of the suction hole 7a may be stopped so as to release the suction holding of the suction groove 6a,
In the state shown in FIG. 2D, when the suction holding by the suction groove 6c is sufficiently ensured, the suction grooves 6a and 6
so that the suction holes 7a and 7b are released.
May be stopped. In other words, if the suction operation of the suction hole of the present invention is performed in such a manner that the substrate is held on the substrate holding opening 6 so as to extend wrinkles by a sequential suction operation inward from the outer peripheral edge of the mounted substrate, The control after the start of the first operation may take any form.
【００３４】また、本発明の実施の形態では、基板がフ
ィルムなどの薄板の保持について述べたが、液晶パネル
用のガラス基板や半導体ウェハなどの薄板状の基板であ
ればこれに限ることなく本発明は適用される。In the embodiment of the present invention, the description has been given of the case where the substrate is a thin plate such as a film. The invention applies.
【００３５】[0035]
【発明の効果】以上説明したところから明らかなよう
に、本発明によれば、従来例より単純な構成で、従来例
では取りきれなかった基板上の皺を除去することがで
き、位置精度、平面度良く保持された回路基板は、顕微
鏡を使った位置合わせや、レ−ザを用いた穴加工やアラ
イメントなどの作業に用いられ、その作業を精度良く行
うことができるという効果がある。As is apparent from the above description, according to the present invention, wrinkles on the substrate which could not be removed in the conventional example can be removed with a simpler structure than in the conventional example. The circuit board held with good flatness is used for operations such as alignment using a microscope, drilling and alignment using a laser, and has the effect that the operation can be performed with high accuracy.
【図１】（ａ）本発明の一実施形態による基板保持装置
の斜視図 （ｂ）本発明の一実施形態による基板保持装置の上面図FIG. 1A is a perspective view of a substrate holding device according to an embodiment of the present invention. FIG. 1B is a top view of the substrate holding device according to an embodiment of the present invention.
【図２】本実施の形態の基板保持装置の図１（ａ）に示
すＡＡ直線断面図 （ｂ）本実施の形態の基板保持装置において図２（ａ）
における吸着溝６ａを真空吸気した状態図 （ｃ）本実施の形態の基板保持装置において図２（ａ）
における吸着溝６ａおよび６ｂを順次真空吸気した状態
図 （ｄ）本実施の形態の基板保持装置において図２（ａ）
における吸着溝６ａ、６ｂおよび６ｃを順次に真空吸気
した状態図 （ｅ）本実施の形態の基板保持装置において図２（ａ）
における基板５と基板載置面８との拡大断面図FIG. 2 is a cross-sectional view of the substrate holding apparatus according to the embodiment taken along the line AA shown in FIG. 1A. FIG. 2B is a sectional view of the substrate holding apparatus according to the embodiment.
FIG. 2C is a diagram showing a state in which the suction groove 6a in FIG.
FIG. 2D is a diagram showing a state in which the suction grooves 6a and 6b in FIG.
(E) In the substrate holding device of the present embodiment, FIG. 2 (a)
Enlarged sectional view of the substrate 5 and the substrate mounting surface 8 in FIG.
【図３】（ａ）従来の基板保持装置の斜視図 （ｂ）従来の基板保持装置の基板を乗せた状態の図３
（ａ）に示すＢＢ直線断面図3A is a perspective view of a conventional substrate holding device. FIG. 3B is a perspective view of the conventional substrate holding device with a substrate mounted thereon.
BB linear sectional view shown in (a)
１ 半導体ウェハ ２ 基板保持部 ３ 吸着溝 ４ 凹部 ５ 基板 ６、６ａ、６ｂ、６ｃ 吸着溝 ７、７ａ、７ｂ、７ｃ 吸気孔 ８ 基板載置面 ９ 基板保持口 １０ａ、１０ｂ、１０ｃ、１０ｄ 吸着溝６隅部の丸み DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Substrate holding part 3 Suction groove 4 Depression 5 Substrate 6, 6a, 6b, 6c Suction groove 7, 7a, 7b, 7c Suction hole 8 Substrate mounting surface 9 Substrate holding port 10a, 10b, 10c, 10d Suction groove 6 corner roundness
フロントページの続き (72)発明者 福田 丁丈 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 仲谷 安広 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 安原 和則 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 3C016 AA01 DA03 DA11 5F031 CA02 CA05 HA02 HA13 PA13Continuing on the front page (72) Inventor Tokatsu Fukuda 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Inventor Kazunori Yasuhara 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. (reference) 3C016 AA01 DA03 DA11 5F031 CA02 CA05 HA02 HA13 PA13
Claims (8)
吸気孔とを備えた、前記吸着溝に前記基板を真空吸着す
る基板保持装置であって、 前記基板の外周縁部に位置する前記吸着溝から内側に位
置する前記吸着溝へ向かって、順次吸気が開始されるま
たは強勢されることを特徴とする基板保持装置。1. A mounting surface on which a substrate is mounted, a suction groove formed in the placement surface, and a suction hole arranged in the suction groove and configured to suction air in the suction groove. A substrate holding device for vacuum-sucking the substrate in the suction groove, wherein suction is sequentially started or stressed from the suction groove located at an outer peripheral edge of the substrate toward the suction groove located inside. A substrate holding device characterized by being performed.
基板の外周縁部と相似的な閉曲線として形成されている
ことを特徴とする請求項１に記載の基板保持装置。2. The substrate holding apparatus according to claim 1, wherein the at least one suction groove is formed as a closed curve similar to at least two outer peripheral edges of the substrate.
似的な曲線または折れ線、もしくは直線として形成され
ていることを特徴とする請求項１に記載の基板保持装
置。3. The substrate holding device according to claim 1, wherein the suction groove is formed as a curve, a broken line, or a straight line similar to the outer peripheral edge of the substrate.
位置に応じて複数設けられており、それぞれ独立に吸気
を行うことを特徴とする請求項１ないし３のいずれかに
記載の基板保持装置。4. The substrate holding device according to claim 1, wherein a plurality of the suction holes are provided in accordance with the number or positions of the suction grooves, and the suction holes are independently performed. apparatus.
に展開する形状は多角形状であり、 前記吸着溝の幅は、前記多角形の辺の中央部よりも頂点
近傍のほうが狭く形成されていることを特徴とする請求
項４に記載の基板保持装置。5. A shape of the suction groove, which is developed on a plane including the placement surface, is a polygonal shape, and a width of the suction groove is smaller near a vertex than at a center of a side of the polygon. The substrate holding device according to claim 4, wherein the substrate holding device is formed.
ていることを特徴とする請求項５に記載の基板保持装
置。6. The substrate holding device according to claim 5, wherein the vicinity of the apex is formed with roundness.
形状は、丸みを持って形成されていることを特徴とする
請求項１ないし６のいずれかに記載の基板保持装置。7. The substrate holding device according to claim 1, wherein a cross-sectional shape of a boundary between the suction groove and the placement surface is formed to have a rounded shape.
保持するための四角枠状の形状を有することを特徴とす
る請求項１ないし７のいずれかに記載の基板保持装置。8. The substrate holding device according to claim 1, wherein the mounting surface has a square frame shape for holding a peripheral portion of the square substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27995499A JP2001105261A (en) | 1999-09-30 | 1999-09-30 | Board holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27995499A JP2001105261A (en) | 1999-09-30 | 1999-09-30 | Board holding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001105261A true JP2001105261A (en) | 2001-04-17 |
Family
ID=17618249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27995499A Withdrawn JP2001105261A (en) | 1999-09-30 | 1999-09-30 | Board holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001105261A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007079103A (en) * | 2005-09-14 | 2007-03-29 | Ono Sokki Co Ltd | Film holding plate, film holding mechanism and registering device of exposure machine |
| KR100858180B1 (en) * | 2002-03-19 | 2008-09-10 | 후지쯔 가부시끼가이샤 | Apparatus for fabricating bonded substrate |
| JP2008270580A (en) * | 2007-04-23 | 2008-11-06 | Nachi Fujikoshi Corp | Method of carrying thin wafer |
| JP2008270579A (en) * | 2007-04-23 | 2008-11-06 | Nachi Fujikoshi Corp | Sucking hand for carrying thin wafer |
| JP2008311428A (en) * | 2007-06-14 | 2008-12-25 | Mitsumi Electric Co Ltd | Substrate sucking support member and substrate supporting method |
| JP2011042130A (en) * | 2009-08-21 | 2011-03-03 | Konica Minolta Ij Technologies Inc | Method for manufacturing inkjet head |
| CN115101468A (en) * | 2022-07-06 | 2022-09-23 | 蓝泽半导体科技(芜湖)有限公司 | Wafer adsorption method |
| CN115128434A (en) * | 2022-07-06 | 2022-09-30 | 蓝泽半导体科技(芜湖)有限公司 | Adjustable wafer adsorption table |
-
1999
- 1999-09-30 JP JP27995499A patent/JP2001105261A/en not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100858180B1 (en) * | 2002-03-19 | 2008-09-10 | 후지쯔 가부시끼가이샤 | Apparatus for fabricating bonded substrate |
| JP2007079103A (en) * | 2005-09-14 | 2007-03-29 | Ono Sokki Co Ltd | Film holding plate, film holding mechanism and registering device of exposure machine |
| JP2008270580A (en) * | 2007-04-23 | 2008-11-06 | Nachi Fujikoshi Corp | Method of carrying thin wafer |
| JP2008270579A (en) * | 2007-04-23 | 2008-11-06 | Nachi Fujikoshi Corp | Sucking hand for carrying thin wafer |
| JP4678787B2 (en) * | 2007-04-23 | 2011-04-27 | 株式会社不二越 | Suction hand for thin wafer transfer |
| JP4678788B2 (en) * | 2007-04-23 | 2011-04-27 | 株式会社不二越 | Thin wafer transfer method |
| JP2008311428A (en) * | 2007-06-14 | 2008-12-25 | Mitsumi Electric Co Ltd | Substrate sucking support member and substrate supporting method |
| JP2011042130A (en) * | 2009-08-21 | 2011-03-03 | Konica Minolta Ij Technologies Inc | Method for manufacturing inkjet head |
| CN115101468A (en) * | 2022-07-06 | 2022-09-23 | 蓝泽半导体科技(芜湖)有限公司 | Wafer adsorption method |
| CN115128434A (en) * | 2022-07-06 | 2022-09-30 | 蓝泽半导体科技(芜湖)有限公司 | Adjustable wafer adsorption table |
| CN115128434B (en) * | 2022-07-06 | 2023-08-11 | 蓝泽半导体科技(芜湖)有限公司 | Adjustable wafer adsorption table |
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