JP2001044646A - Casing for mounting printed wiring board - Google Patents

Casing for mounting printed wiring board

Info

Publication number
JP2001044646A
JP2001044646A JP11213671A JP21367199A JP2001044646A JP 2001044646 A JP2001044646 A JP 2001044646A JP 11213671 A JP11213671 A JP 11213671A JP 21367199 A JP21367199 A JP 21367199A JP 2001044646 A JP2001044646 A JP 2001044646A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
chassis
screws
rib
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11213671A
Other languages
Japanese (ja)
Inventor
Katsuki Obayashi
勝喜 大林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Denshi KK
Original Assignee
Hitachi Denshi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Denshi KK filed Critical Hitachi Denshi KK
Priority to JP11213671A priority Critical patent/JP2001044646A/en
Publication of JP2001044646A publication Critical patent/JP2001044646A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To take many grounds by raising up a part between screws in the rib of a chassis and making structure without an opening. SOLUTION: The warp of a printed wiring board 1 is previously assumed and a part between screws 3 in the rib of a chassis 2 is raised up. When the printed wiring board 1 is mounted, the occurrence of an opening is prevented. Thus, much ground can be taken and a circuit which requires many grounds such as a high frequency circuit can be stabilized. Since the chassis 2 is casting, cost is not increased and saves cost when a die is once formed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント配線基板
実装用筐体に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mounting case.

【0002】[0002]

【従来の技術】従来のプリント配線基板実装用筐体の構
造を図2を参照して説明する。図2は、従来のプリント
配線基板実装用筐体(以下、シャーシと省略する。)の
リブの構造を示す図である。プリント配線基板1がシャ
ーシ2のリブの上に実装されネジ3で固定される構造で
ある。シャーシ2のリブが平滑であるためプリント配線
基板1を実装してネジ3で固定した場合、プリント配線
基板1のネジとネジの間が反ってしまいプリント配線基
板1とシャーシ2との間に隙間ができる。この隙間は高
周波回路等アースを多く必要とする回路にとって、極め
て重要な問題である。
2. Description of the Related Art The structure of a conventional printed circuit board mounting case will be described with reference to FIG. FIG. 2 is a diagram showing a rib structure of a conventional printed wiring board mounting housing (hereinafter, abbreviated as a chassis). The printed wiring board 1 is mounted on ribs of a chassis 2 and fixed with screws 3. When the printed wiring board 1 is mounted and fixed with the screws 3 because the ribs of the chassis 2 are smooth, the gap between the screws of the printed wiring board 1 and the screws is warped, and a gap is formed between the printed wiring board 1 and the chassis 2. Can be. This gap is a very important problem for a circuit requiring a large amount of ground such as a high-frequency circuit.

【0003】[0003]

【発明が解決しようとする課題】前述の従来技術のプリ
ント配線基板実装用筐体ではリブが平滑であるため、プ
リント配線基板を実装してネジで固定した場合、プリン
ト配線基板のネジとネジの間が反ってしまいプリント配
線基板とシャーシの間に隙間ができてしまいアースが多
く取れないという欠点があった。
Since the ribs of the above-mentioned prior art printed wiring board mounting case have smooth ribs, when the printed wiring board is mounted and fixed with screws, the screws of the printed wiring board and the screws are not fixed. There is a drawback that the space is warped and a gap is formed between the printed wiring board and the chassis, so that a large amount of ground cannot be obtained.

【0004】そこで本発明ではこの欠点を除去し、隙間
のないプリント配線基板実装用筐体を提供することを目
的とする。
Accordingly, it is an object of the present invention to eliminate this drawback and to provide a printed wiring board mounting case having no gap.

【0005】[0005]

【課題を解決するための手段】前述の目的を達成するた
め、本発明ではプリント配線基板の反りをあらかじめ想
定してシャーシのリブのネジとネジの間を盛り上げてお
き隙間のないプリント配線基板実装用筐体を提供できる
ようにしたものである。
In order to achieve the above-mentioned object, according to the present invention, the warpage of the printed wiring board is assumed in advance, and the screws between the ribs of the chassis are raised to mount the printed wiring board without any gap. It is possible to provide a housing for use.

【0006】[0006]

【発明の実施の形態】本発明の一実施例であるプリント
配線基板実装用筐体の構造を図1を参照して説明する。
図1は、本実施例のプリント配線基板実装用筐体(以
下、シャーシと省略する。)のリブの構造を示す図であ
る。本実施例では、プリント配線基板1の反りをあらか
じめ想定してシャーシ2のリブのネジとネジの間を盛り
上げておき、プリント配線基板1を実装したとき、隙間
ができないようにしたものである。その結果、アースを
多くとることができ、高周波回路等アースを多く必要と
する回路の安定化に極めて顕著な効果がある。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a printed wiring board mounting case according to an embodiment of the present invention will be described with reference to FIG.
FIG. 1 is a diagram showing a structure of a rib of a printed wiring board mounting case (hereinafter abbreviated as a chassis) of the present embodiment. In the present embodiment, the warpage of the printed wiring board 1 is assumed in advance, and the gap between the screws of the ribs of the chassis 2 is raised so that no gap is formed when the printed wiring board 1 is mounted. As a result, a large number of grounds can be obtained, which has a remarkable effect on stabilization of a circuit requiring a large amount of ground such as a high-frequency circuit.

【0007】[0007]

【発明の効果】本発明によれば、プリント配線基板を実
装したときにシャーシとの間の隙間を除去することがで
きることにより、アースを多く取ることができるため、
高周波回路等アースを多く必要とする回路の安定化に極
めて顕著な効果がある。また、シャーシは鋳物であるた
め金型を一度作ってしまえばコストの増加にならず経済
的である。
According to the present invention, since a gap between the printed circuit board and the chassis can be removed when the printed circuit board is mounted, a large amount of ground can be obtained.
This has a remarkable effect on stabilization of a circuit requiring a large amount of ground such as a high-frequency circuit. Further, since the chassis is a casting, once the mold is made, the cost is not increased and the chassis is economical.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例であるプリント配線基板実装
用筐体のリブの構造を示す図
FIG. 1 is a diagram showing a structure of a rib of a printed wiring board mounting case according to an embodiment of the present invention;

【図2】従来のプリント配線基板実装用筐体のリブの構
造を示す図
FIG. 2 is a diagram showing a structure of a rib of a conventional housing for mounting a printed wiring board.

【符号の説明】[Explanation of symbols]

1:プリント配線基板 2:シャーシ 3:ネジ 1: Printed circuit board 2: Chassis 3: Screw

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ネジを用いてプリント配線基板を実装する
プリント配線基板実装用筐体において、 前記ネジとネジの間のリブの中央部分を盛り上げる構造
にしたことを特徴とするプリント配線基板実装用筐体。
1. A printed wiring board mounting housing for mounting a printed wiring board using screws, wherein a structure is provided in which a central portion of a rib between the screws is raised. Housing.
JP11213671A 1999-07-28 1999-07-28 Casing for mounting printed wiring board Pending JP2001044646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11213671A JP2001044646A (en) 1999-07-28 1999-07-28 Casing for mounting printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11213671A JP2001044646A (en) 1999-07-28 1999-07-28 Casing for mounting printed wiring board

Publications (1)

Publication Number Publication Date
JP2001044646A true JP2001044646A (en) 2001-02-16

Family

ID=16643049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11213671A Pending JP2001044646A (en) 1999-07-28 1999-07-28 Casing for mounting printed wiring board

Country Status (1)

Country Link
JP (1) JP2001044646A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009500A1 (en) * 2022-07-08 2024-01-11 日立Astemo株式会社 Electronic control device and method for manufacturing electronic control device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009500A1 (en) * 2022-07-08 2024-01-11 日立Astemo株式会社 Electronic control device and method for manufacturing electronic control device

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