JP2888204B2 - Electronic components - Google Patents

Electronic components

Info

Publication number
JP2888204B2
JP2888204B2 JP8219569A JP21956996A JP2888204B2 JP 2888204 B2 JP2888204 B2 JP 2888204B2 JP 8219569 A JP8219569 A JP 8219569A JP 21956996 A JP21956996 A JP 21956996A JP 2888204 B2 JP2888204 B2 JP 2888204B2
Authority
JP
Japan
Prior art keywords
circuit
electrode
electronic component
electrodes
mounting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8219569A
Other languages
Japanese (ja)
Other versions
JPH1065416A (en
Inventor
康志 永田
英樹 難波
都朗 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8219569A priority Critical patent/JP2888204B2/en
Publication of JPH1065416A publication Critical patent/JPH1065416A/en
Application granted granted Critical
Publication of JP2888204B2 publication Critical patent/JP2888204B2/en
Anticipated expiration legal-status Critical
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Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、リフロー等の加熱
処理により組み立てられる表面実装型の電子部品に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type electronic component assembled by a heat treatment such as reflow.

【０００２】[0002]

【従来の技術】電子部品の面実装化が進むにともない、
セット側に実装する電子部品の底面に高い平面精度が要
望されるようになってきている。2. Description of the Related Art As surface mounting of electronic components progresses,
There has been an increasing demand for high flatness of the bottom surface of the electronic component mounted on the set side.

【０００３】従来、電子部品は、実装基板の表面に複数
の回路電極が設けられており、この回路電極間を接続す
るチップコンデンサ等の回路部品がリフローハンダ付け
により実装されることにより構成されている。Conventionally, electronic components are provided with a plurality of circuit electrodes on the surface of a mounting board, and circuit components such as chip capacitors connecting the circuit electrodes are mounted by reflow soldering. I have.

【０００４】また、このような電子部品は、実装基板の
裏面側が、電子部品のシールド性を高めるため、略全面
にアース電極が設けられている。In such an electronic component, a ground electrode is provided on substantially the entire back surface of the mounting substrate in order to enhance the shielding property of the electronic component.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、実装基
板の表裏面に於いて、回路電極とアース電極の面積に差
があるため、回路部品をリフロー実装する際、その熱に
より表裏面の電極に膨張差が生じ、実装基板が回路電極
側に反ってしまい、その状態で回路部品がハンダ付けさ
れるため、出来上がった電子部品の底面が反ってしまう
という問題があった。However, since there is a difference between the area of the circuit electrode and the area of the ground electrode on the front and back surfaces of the mounting board, when the circuit components are reflow mounted, the heat expands to the electrodes on the front and back surfaces. A difference is generated, and the mounting substrate warps toward the circuit electrode side, and the circuit components are soldered in that state, so that there is a problem that the bottom surface of the completed electronic component warps.

【０００６】そこで本発明は、このような問題を解決
し、面精度が高い表面実装型の電子部品を提供すること
を目的とするものである。Accordingly, an object of the present invention is to solve such a problem and to provide a surface mounting type electronic component having high surface accuracy.

【０００７】[0007]

【課題を解決するための手段】この目的を達成するため
に本発明は、実装基板の裏面に設けられたアース電極内
で回路部品により接続される回路電極間の少なくとも一
つに対応する位置に配置したものである。 In order to achieve this object, the present invention relates to a method for forming a ground electrode on a back surface of a mounting substrate.
At least one between circuit electrodes connected by circuit components at
These are arranged at the positions corresponding to the two.

【０００８】[0008]

【発明の実施の形態】本発明の請求項１に記載の発明
は、表面に複数の回路電極、裏面にアース電極を備えた
実装基板と、前記回路電極間を接続する回路部品を備え
た電子部品に於いて、前記アース電極内で前記回路部品
により接続される前記回路電極間の少なくとも一つに対
応する位置に非電極形成部を設けたことを特徴とする電
子部品であって、非電極形成部が、実装基板の表裏面に
於ける膨張差を効率よく吸収するという作用を有する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to an electronic device having a mounting substrate having a plurality of circuit electrodes on a front surface and a ground electrode on a back surface, and a circuit component for connecting the circuit electrodes. The circuit component within the ground electrode
At least one between the circuit electrodes connected by
An electronic component having a non-electrode forming portion provided at a corresponding position, wherein the non -electrode forming portion has an effect of efficiently absorbing a difference in expansion between the front and back surfaces of a mounting substrate.

【０００９】本発明の請求項２記載の発明は、表面に複
数の回路電極、裏面にアース電極を備えた実装基板と、
前記回路電極間を接続する回路部品を備えた電子部品に
於いて、前記実装基板の中央部を囲むよう断続的に非電
極形成部を設けたことを特徴とする電子部品であって、
非電極形成部が、実装基板の表裏面に於ける膨張差を効
率よく吸収するとともに、アース電極を一体の状態に保
つことが出来るという作用を有する。 According to a second aspect of the present invention, there is provided a mounting substrate having a plurality of circuit electrodes on a front surface and a ground electrode on a rear surface;
In an electronic component having a circuit component for connecting between the circuit electrodes, the electronic component is intermittently turned off so as to surround a central portion of the mounting substrate.
An electronic component having a pole forming portion ,
The non-electrode formation part makes the difference in expansion between the front and back of the mounting board effective.
Absorbs efficiently and keeps the ground electrode
It has the effect that it can be used.

【００１０】本発明の請求項３記載の発明は、非電極形
成部の幅を、実装基板の厚みより狭くしたことを特徴と
する請求項１または請求項２に記載の電子部品であっ
て、電子部品のシールド性を損なうことなく電子部品の
面精度を向上できるという作用を有する。According to a third aspect of the present invention, there is provided the electronic component according to the first or second aspect, wherein a width of the non-electrode forming portion is smaller than a thickness of the mounting substrate. This has the effect that the surface accuracy of the electronic component can be improved without impairing the shielding properties of the electronic component.

【００１１】以下本発明の一実施形態を図を用いて説明
する。図１は、携帯電話などに用いられる電子部品の一
つである誘電体フィルタの分解斜視図である。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of a dielectric filter which is one of electronic components used for a mobile phone and the like.

【００１２】１は実装基板であり、ガラスエポキシ系樹
脂等から構成されており、表面には回路電極２，３，４
が設けられている。裏面には、図２に示される如くアー
ス電極５及び入出力電極６が設けられている。また、前
記回路電極２は入出力電極６と、回路電極４はアース電
極５と実装基板１の側面に於いて接続されている。Reference numeral 1 denotes a mounting substrate, which is made of glass epoxy resin or the like, and has circuit electrodes 2, 3, 4 on its surface.
Is provided. On the back surface, an earth electrode 5 and an input / output electrode 6 are provided as shown in FIG. The circuit electrode 2 is connected to the input / output electrode 6, and the circuit electrode 4 is connected to the ground electrode 5 on the side surface of the mounting board 1.

【００１３】これらの回路電極２、回路電極３、回路電
極４、アース電極５、入出力電極６は、電気導通性や浸
食性等を考慮し一般に金や銅が用いられているととも
に、電極形成はエッチング等により行われている。The circuit electrode 2, the circuit electrode 3, the circuit electrode 4, the ground electrode 5, and the input / output electrode 6 are generally made of gold or copper in consideration of electric conductivity, erosion, etc. Is performed by etching or the like.

【００１４】図１に戻り、７は回路部品の一つとして用
いられる誘電体共振器であり、開放端面７ａを除く外周
面に外周電極７ｂ、貫通孔７ｃの内周面には内周電極７
ｄが設けられている。このような誘電体共振器７は、実
装基板１の破線で示す部分にリフロー実装されるととも
に、内周電極７ｄの開放端面７ａ側は信号端子８により
回路電極３に接続されている。Referring back to FIG. 1, reference numeral 7 denotes a dielectric resonator used as one of the circuit components. An outer peripheral electrode 7b is provided on an outer peripheral surface excluding the open end surface 7a, and an inner peripheral electrode 7 is provided on an inner peripheral surface of the through hole 7c.
d is provided. Such a dielectric resonator 7 is reflow-mounted on a portion indicated by a broken line of the mounting substrate 1, and the open end face 7 a side of the inner peripheral electrode 7 d is connected to the circuit electrode 3 by a signal terminal 8.

【００１５】９は回路部品の一つとして用いられるチッ
プコンデンサであり、実装基板１の破線で示す如く実装
され、回路電極２と３、及び回路電極３と３とを接続し
ている。Reference numeral 9 denotes a chip capacitor used as one of circuit components, which is mounted as indicated by a broken line on the mounting board 1 and connects the circuit electrodes 2 and 3 and the circuit electrodes 3 and 3.

【００１６】図２に示す如く実装基板１のアース電極５
内には、非電極形成部１０が設けられている。この非電
極形成部１０がアース電極５内に設けられることで、図
３に示す如くリフロー実装などによる実装基板１の表裏
面に於ける電極との熱膨張の差を軽減でき、電子部品の
底面に於ける面積精度が向上できるのである。As shown in FIG. 2, the ground electrode 5 of the mounting substrate 1
Inside, a non-electrode forming portion 10 is provided. Since the non-electrode forming portion 10 is provided in the ground electrode 5, the difference in thermal expansion between the electrodes on the front and back surfaces of the mounting board 1 due to reflow mounting or the like can be reduced as shown in FIG. The area accuracy in the above can be improved.

【００１７】また、非電極形成部１０は、破線で示され
る回路部品９で接続される回路電極２及び３の間に対応
する位置に設けられている。これは、回路電極２及び３
とアース電極５の端部の位置を積極的に合わせることに
より、回路部品９をリフロー実装する際に発生する前記
各電極の熱膨張差を抑えることができ、その結果、回路
部品９がリフローハンダ付けされても、出来上がった電
子部品の底面が反ってしまうことを抑えることが出来る
ものである。The non-electrode forming portion 10 is provided at a position corresponding to between the circuit electrodes 2 and 3 connected by the circuit component 9 shown by a broken line. This is the circuit electrodes 2 and 3
By positively adjusting the position of the end of the ground electrode 5 to the ground, it is possible to suppress the difference in thermal expansion between the electrodes when the circuit component 9 is mounted by reflow soldering. Even if it is attached, it is possible to prevent the bottom surface of the completed electronic component from warping.

【００１８】以下、他の実施形態について説明する。但
し、上述した一実施形態と同様の構成のものについて
は、同じ符号を付して説明を簡略化するものとする。Hereinafter, another embodiment will be described. However, the same components as those in the above-described embodiment will be denoted by the same reference numerals and the description will be simplified.

【００１９】実装基板１上に回路部品９が無作為に多数
配置された場合、上述した一実施形態の如く非電極形成
部１０を回路部品９に対応するように配置すれば、回路
部品９の数に応じて非電極形成部１０が増えてしまう。
つまり、電子部品の底面に於けるシールド性が低下して
しまうのである。このような場合図４に示す如く、実装
基板１の裏面に設けられる非電極形成部１０は、実装基
板１の中央部を囲むように断続的に設けられている。When a large number of circuit components 9 are arranged at random on the mounting board 1, if the non-electrode forming portions 10 are arranged so as to correspond to the circuit components 9 as in the above-described embodiment, the circuit components 9 The number of non-electrode formation parts 10 increases according to the number.
That is, the shielding property on the bottom surface of the electronic component is reduced. In such a case, as shown in FIG. 4, the non-electrode forming portion 10 provided on the back surface of the mounting substrate 1 is provided intermittently so as to surround the central portion of the mounting substrate 1.

【００２０】このように非電極形成部１０を配置した場
合、実装される回路部品９に対応する位置とならないも
のの、実装基板１の中央部を囲むように配置されている
ので、熱によりアース電極５が外方に向かい膨張するこ
とを抑えられるとともに、非電極形成部１０が断続的に
配置されているので、電子部品の底面に於いて独立した
アース電極５が多数出来ることがなく、電子部品を外部
の回路と接続するに際して接続箇所を不用意に増やさず
とも安定した特性を確保出来るのである。When the non-electrode forming portion 10 is disposed as described above, the non-electrode forming portion 10 does not correspond to the circuit component 9 to be mounted, but is disposed so as to surround the central portion of the mounting substrate 1. 5 is prevented from expanding outward, and since the non-electrode forming portions 10 are intermittently arranged, a large number of independent earth electrodes 5 cannot be formed on the bottom surface of the electronic component. When connecting to the external circuit, stable characteristics can be ensured without inadvertently increasing the number of connection points.

【００２１】また、図３に示す如く、非電極形成部１０
の幅が実装基板１の厚みより狭く設定されているので、
表面の回路電極２及び３間を流れる信号が、非電極形成
部１０より外部に放出することを極力防止し、つまり電
子部品のシールド性を損なわず底面に於ける面精度を向
上できるのである。Further, as shown in FIG.
Is set smaller than the thickness of the mounting substrate 1,
It is possible to prevent a signal flowing between the circuit electrodes 2 and 3 on the front surface from being emitted to the outside from the non-electrode forming portion 10 as much as possible.

【００２２】[0022]

【発明の効果】以上のように本発明によれば、実装基板
の裏面に設けられたアース電極内で回路部品により接続
される前記回路電極間の少なくとも一つに対応する位置
に配置したことにより、電子部品のシールド性を損なわ
ず底面精度が高い表面実装型の電子部品を提供できるの
である。As described above, according to the present invention, connection is made by circuit components within the ground electrode provided on the back surface of the mounting board.
Position corresponding to at least one of the circuit electrodes
, The shielding of electronic components is impaired.
Bottom accuracy not is able to provide high surface mount electronic component.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の電子部品の一実施形態として用いた誘
電体フィルタの分解斜視図FIG. 1 is an exploded perspective view of a dielectric filter used as one embodiment of an electronic component of the present invention.

【図２】同誘電体フィルタの下面図FIG. 2 is a bottom view of the dielectric filter.

【図３】同誘電体フィルタに於ける実装基板の部分断面
図FIG. 3 is a partial sectional view of a mounting substrate in the dielectric filter.

【図４】本発明の他の実施形態に於ける誘電体フィルタ
の下面図FIG. 4 is a bottom view of a dielectric filter according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１ 実装基板 ２ 回路電極 ３ 回路電極 ４ 回路電極 ５ アース電極 ７ 回路部品（誘電体共振器） ９ 回路部品（チップコンデンサ） １０ 非電極形成部 REFERENCE SIGNS LIST 1 mounting board 2 circuit electrode 3 circuit electrode 4 circuit electrode 5 ground electrode 7 circuit component (dielectric resonator) 9 circuit component (chip capacitor) 10 non-electrode forming part

フロントページの続き (56)参考文献 特開 昭61−26284（ＪＰ，Ａ) 特開 平９−260795（ＪＰ，Ａ) 特開 平９−283867（ＪＰ，Ａ) 実開 平７−43018（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/02,1/18 Continuation of the front page (56) References JP-A-61-26284 (JP, A) JP-A-9-260795 (JP, A) JP-A-9-283867 (JP, A) JP-A-7-43018 (JP, A) , U) (58) Fields surveyed (Int. Cl. 6 , DB name) H05K 1 / 02,1 / 18

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 表面に複数の回路電極、裏面にアース電
極を備えた実装基板と、前記回路電極間を接続する回路
部品を備えた電子部品に於いて、前記アース電極内で前
記回路部品により接続される前記回路電極間の少なくと
も一つに対応する位置に非電極形成部を設けたことを特
徴とする電子部品。1. A plurality in the surface circuit electrodes, and the mounting substrate having a ground electrode on the rear surface, in the electronic component including a circuit component for connecting the circuit electrodes, before within the earth electrode
At least between the circuit electrodes connected by the circuit components;
An electronic component , wherein a non-electrode forming portion is provided at a position corresponding to one of the electronic components. 【請求項２】 表面に複数の回路電極、裏面にアース電
極を備えた実装基板と、前記回路電極間を接続する回路
部品を備えた電子部品に於いて、前記実装基板の中央部
を囲むよう断続的に非電極形成部を設けたことを特徴と
する電子部品。2. A central portion of a mounting board of an electronic component including a plurality of circuit electrodes on a front surface and a ground electrode on a rear surface and a circuit component for connecting the circuit electrodes.
An electronic component , wherein a non-electrode forming portion is provided intermittently so as to surround the electronic component. 【請求項３】 非電極形成部の幅を、実装基板の厚みよ
り狭くしたことを特徴とする請求項１または請求項２に
記載の電子部品。3. The electronic component according to claim 1 , wherein a width of the non-electrode forming portion is smaller than a thickness of the mounting substrate.
JP8219569A 1996-08-21 1996-08-21 Electronic components Expired - Fee Related JP2888204B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8219569A JP2888204B2 (en) 1996-08-21 1996-08-21 Electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8219569A JP2888204B2 (en) 1996-08-21 1996-08-21 Electronic components

Publications (2)

Publication Number Publication Date
JPH1065416A JPH1065416A (en) 1998-03-06
JP2888204B2 true JP2888204B2 (en) 1999-05-10

Family

ID=16737573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8219569A Expired - Fee Related JP2888204B2 (en) 1996-08-21 1996-08-21 Electronic components

Country Status (1)

Country Link
JP (1) JP2888204B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2373588A (en) * 2001-03-19 2002-09-25 Marconi Applied Techn Ltd Active optical device

Also Published As

Publication number Publication date
JPH1065416A (en) 1998-03-06

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