JP2000513446A - プリント配線板の実装表面に組み付け可能な圧力センサ構成素子 - Google Patents
プリント配線板の実装表面に組み付け可能な圧力センサ構成素子Info
- Publication number
- JP2000513446A JP2000513446A JP10503723A JP50372398A JP2000513446A JP 2000513446 A JP2000513446 A JP 2000513446A JP 10503723 A JP10503723 A JP 10503723A JP 50372398 A JP50372398 A JP 50372398A JP 2000513446 A JP2000513446 A JP 2000513446A
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- chip carrier
- sensor component
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. プリント配線板(3)の実装表面(2)に組み付け可能な圧力センサ構成素 子(1)であって、圧力センサを有した半導体チップ(6)が固定されているほ ぼ扁平なチップ担体面(4)を備えたチップ担体(5)と、該チップ担体(5) を貫通し半導体チップ(6)に電気的に接続されて表面実装可能に配置された電 極端子(7)とを有している形式のものにおいて、 チップ担体(5)が、半導体チップ(6)を完全に覆う流動性の充填材(3 2)によって充填されていることを特徴とする、プリント配線板(3)の実装表 面(2)に組み付け可能な圧力センサ構成素子。 2. チップ担体(5)の、プリント配線板(3)の実装表面(2)とは反対の側 (22)が片側で開かれているように形成されていて、チップ担体(5)の側壁 に、内面で連続的に配置された流出防止エッジ(36)が設けられている、請求 項1記載の圧力センサ構成素子。 3. 流動性の充填材(32)がさらに、圧力センサ構成素子(1)の、腐食しや すい、特に金属製の構成部分、特に接続ワイヤ及び、半導体チップ(6)のため の支持担体等のような構成部分を取り囲んでい る、請求項1又は2記載の圧力センサ構成素子。 4. 流動性の充填材(32)がゲルを成している、請求項1から3までのいずれ か1項記載の圧力センサ構成素子。 5. チップ担体(5)を貫通し、半導体チップ(6)に電気的に接続された電極 端子(7)が、チップ担体(5)の少なくとも1つの面に向かって導出される端 子脚片として形成されていて、該端子脚片が、ロッカ形の短い端子スタブ(17 )を形成するように屈曲かつ切断されている、請求項1から4までのいずれか1 項記載の圧力センサ構成素子。 6. 電気絶縁性の材料から成る、特に一体に製造されたチップ担体(5)が、プ リント配線板(3)の実装表面(2)よりも持ち上げられた下方部分(9)と、 該下方部分の両側面に配置された側方部分(10,10a,11,11a)とを 有している、請求項1から5までのいずれか1項記載の圧力センサ構成素子。 7. 端子脚片の屈曲部が、チップ担体(5)の側方部分(10,10a,11, 11a)の内側に収容されている、請求項1から6までのいずれか1項記載の圧 力センサ構成素子。 8. チップ担体(5)の側方部分(10,10a,11,11a)から突出する 、端子脚片の端部が、プリント配線板(3)の実装表面(2)に対して僅か な傾斜を有している、請求項6又は7記載の圧力センサ構成素子。 9. チップ担体(5)の、プリント配線板(3)の実装表面(2)に面した外側 の制限面(12,13)が、チップ担体(5)の横断面で見て、ほぼ逆V字形の 延びを有している、請求項1から8までのいずれか1項記載の圧力センサ構成素 子。 10.プリント配線板(3)と、実装表面(2)に面したチップ担体(5)の外側 の制限面(12,13)との最大距離が、約0.1〜0.5mmの値を有してい る、請求項1から9までのいずれか1項記載の圧力センサ構成素子。 11.チップ担体(5)が、熱可塑性プラスチック材料から製造されている、請求 項1から10までのいずれか1項記載の圧力センサ構成素子。 12.圧力センサが、圧電抵抗式の圧力センサ又は容量式の圧力センサを成してい る、請求項1から11までのいずれか1項記載の圧力センサ構成素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19626086.8 | 1996-06-28 | ||
DE19626086A DE19626086A1 (de) | 1996-06-28 | 1996-06-28 | Auf der Bestückungsoberfläche einer Leiterplatte montierbares Drucksensor-Bauelement |
PCT/DE1997/001232 WO1998000690A1 (de) | 1996-06-28 | 1997-06-17 | Auf der bestückungsoberfläche einer leiterplatte montierbares drucksensor-bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000513446A true JP2000513446A (ja) | 2000-10-10 |
JP3546059B2 JP3546059B2 (ja) | 2004-07-21 |
Family
ID=7798366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50372398A Expired - Fee Related JP3546059B2 (ja) | 1996-06-28 | 1997-06-17 | プリント配線板の実装表面に組み付け可能な圧力センサ構成素子 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6047604A (ja) |
EP (1) | EP0907880B1 (ja) |
JP (1) | JP3546059B2 (ja) |
KR (1) | KR20000022326A (ja) |
CN (1) | CN1217059A (ja) |
DE (2) | DE19626086A1 (ja) |
WO (1) | WO1998000690A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007199049A (ja) * | 2005-12-27 | 2007-08-09 | Yamaha Corp | 半導体装置 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19703206C2 (de) * | 1997-01-29 | 2002-01-24 | Infineon Technologies Ag | Drucksensor-Bauteil mit Schlauchanschluß |
DE19834442C2 (de) * | 1998-07-30 | 2001-01-18 | Motoren Ventilatoren Gmbh | Rohrelement mit einer integrierten Druckmeßeinheit |
US6453749B1 (en) * | 1999-10-28 | 2002-09-24 | Motorola, Inc. | Physical sensor component |
US6769319B2 (en) | 2001-07-09 | 2004-08-03 | Freescale Semiconductor, Inc. | Component having a filter |
JP2003031579A (ja) * | 2001-07-18 | 2003-01-31 | Denso Corp | センサ及びその製造方法 |
JP3888228B2 (ja) | 2002-05-17 | 2007-02-28 | 株式会社デンソー | センサ装置 |
DE10224790B4 (de) * | 2002-06-04 | 2004-10-21 | Infineon Technologies Ag | Beschleunigungssensor und Verfahren zum Herstellen eines Beschleunigungssensors |
JP2004251742A (ja) * | 2003-02-20 | 2004-09-09 | Denso Corp | センサ装置 |
JP2004309212A (ja) * | 2003-04-03 | 2004-11-04 | Denso Corp | 圧力センサ及び吸気系圧力測定装置 |
DE102004044982A1 (de) * | 2004-09-16 | 2006-04-06 | Infineon Technologies Ag | Drucksensorvorrichtung und Verfahren zum Herstellen derselben |
JP2007114001A (ja) * | 2005-10-19 | 2007-05-10 | Denso Corp | 圧力センサ |
US20110004124A1 (en) * | 2009-07-01 | 2011-01-06 | Medtronic, Inc. | Implantable medical device including mechanical stress sensor |
FR2950691B1 (fr) * | 2009-09-30 | 2012-05-04 | Michelin Soc Tech | Organe de mesure de pression etanche |
CN102494832B (zh) * | 2011-11-25 | 2014-01-15 | 李策 | 基于转印技术的微纳薄膜压力传感器及其制备方法 |
KR101469604B1 (ko) * | 2013-03-06 | 2014-12-05 | (주)파트론 | 압력센서 패키지 |
DE102013217349B4 (de) * | 2013-08-30 | 2024-06-13 | Robert Bosch Gmbh | Mikromechanische Sensoranordnung und entsprechendes Herstellungsverfahren |
US20150090030A1 (en) * | 2013-09-27 | 2015-04-02 | Infineon Technologies Ag | Transducer arrangement comprising a transducer die and method of covering a transducer die |
KR102063318B1 (ko) * | 2013-10-10 | 2020-01-07 | 재단법인대구경북과학기술원 | 초음파 프로브의 유연성 어레이 및 그의 제조 방법 |
EP3211394B1 (en) * | 2016-02-29 | 2021-03-31 | Melexis Technologies NV | Semiconductor pressure sensor for harsh media application |
DE102016214940A1 (de) * | 2016-08-11 | 2018-02-15 | Robert Bosch Gmbh | Druckmesszelle und Verfahren zum Aufbringen einer Messstruktur |
US10684184B2 (en) * | 2017-04-20 | 2020-06-16 | Honeywell International Inc. | Pressure sensor assembly having a cavity filled with gel or fluid |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63238535A (ja) * | 1987-03-27 | 1988-10-04 | Fujikura Ltd | 圧力センサとその製造方法 |
JPH04125438A (ja) * | 1990-09-17 | 1992-04-24 | Hitachi Ltd | 半導体式圧力センサ |
JPH04230056A (ja) * | 1990-06-01 | 1992-08-19 | Robert Bosch Gmbh | 電子構成素子およびこの電子構成素子を製造するための方法 |
JPH04113045U (ja) * | 1991-03-15 | 1992-10-01 | 北陸電気工業株式会社 | 表面実装型圧力センサー |
JPH04323909A (ja) * | 1991-04-23 | 1992-11-13 | Toyo Commun Equip Co Ltd | 圧電デバイス・チップのサポート |
JP3003212U (ja) * | 1994-01-28 | 1994-10-18 | 日本精機株式会社 | 圧力検出器 |
JPH07113706A (ja) * | 1993-10-14 | 1995-05-02 | Fuji Electric Co Ltd | 半導体圧力センサのパッケージ構造 |
JPH07159263A (ja) * | 1993-10-07 | 1995-06-23 | Robert Bosch Gmbh | 圧力センサ |
JPH0817870A (ja) * | 1994-07-05 | 1996-01-19 | Hitachi Ltd | 半導体装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5243217A (en) * | 1990-11-03 | 1993-09-07 | Fuji Electric Co., Ltd. | Sealed semiconductor device with protruding portion |
-
1996
- 1996-06-28 DE DE19626086A patent/DE19626086A1/de not_active Ceased
-
1997
- 1997-06-17 KR KR1019980710749A patent/KR20000022326A/ko not_active Application Discontinuation
- 1997-06-17 EP EP97930331A patent/EP0907880B1/de not_active Expired - Lifetime
- 1997-06-17 DE DE59706777T patent/DE59706777D1/de not_active Expired - Lifetime
- 1997-06-17 CN CN97194181A patent/CN1217059A/zh active Pending
- 1997-06-17 JP JP50372398A patent/JP3546059B2/ja not_active Expired - Fee Related
- 1997-06-17 WO PCT/DE1997/001232 patent/WO1998000690A1/de not_active Application Discontinuation
-
1998
- 1998-12-28 US US09/221,784 patent/US6047604A/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63238535A (ja) * | 1987-03-27 | 1988-10-04 | Fujikura Ltd | 圧力センサとその製造方法 |
JPH04230056A (ja) * | 1990-06-01 | 1992-08-19 | Robert Bosch Gmbh | 電子構成素子およびこの電子構成素子を製造するための方法 |
JPH04125438A (ja) * | 1990-09-17 | 1992-04-24 | Hitachi Ltd | 半導体式圧力センサ |
JPH04113045U (ja) * | 1991-03-15 | 1992-10-01 | 北陸電気工業株式会社 | 表面実装型圧力センサー |
JPH04323909A (ja) * | 1991-04-23 | 1992-11-13 | Toyo Commun Equip Co Ltd | 圧電デバイス・チップのサポート |
JPH07159263A (ja) * | 1993-10-07 | 1995-06-23 | Robert Bosch Gmbh | 圧力センサ |
JPH07113706A (ja) * | 1993-10-14 | 1995-05-02 | Fuji Electric Co Ltd | 半導体圧力センサのパッケージ構造 |
JP3003212U (ja) * | 1994-01-28 | 1994-10-18 | 日本精機株式会社 | 圧力検出器 |
JPH0817870A (ja) * | 1994-07-05 | 1996-01-19 | Hitachi Ltd | 半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007199049A (ja) * | 2005-12-27 | 2007-08-09 | Yamaha Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
DE19626086A1 (de) | 1998-01-02 |
EP0907880B1 (de) | 2002-03-27 |
DE59706777D1 (de) | 2002-05-02 |
WO1998000690A1 (de) | 1998-01-08 |
US6047604A (en) | 2000-04-11 |
KR20000022326A (ko) | 2000-04-25 |
CN1217059A (zh) | 1999-05-19 |
JP3546059B2 (ja) | 2004-07-21 |
EP0907880A1 (de) | 1999-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000513446A (ja) | プリント配線板の実装表面に組み付け可能な圧力センサ構成素子 | |
US5948991A (en) | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip | |
US6058020A (en) | Component housing for surface mounting of a semiconductor component | |
US6201467B1 (en) | Pressure sensor component and production method | |
EP0372773B2 (en) | Pressure sensor with flexible printed circuit | |
RU2279650C2 (ru) | Модуль с датчиком давления | |
US7176541B2 (en) | Pressure sensor | |
EP0831315A2 (en) | Pressure sensor | |
EP2273247A2 (en) | Pressure sensor package assembly having an unconstrained sense die | |
JPH02503356A (ja) | 圧力測定装置 | |
US7004033B2 (en) | Pressure sensor contained in casing | |
US6313729B1 (en) | Semiconductor device | |
KR20000022327A (ko) | 프린트 회로 기판의 장착 표면에 장착하기 위한 압력 센서 장치 | |
US7168326B2 (en) | Compact pressure sensor with high corrosion resistance and high accuracy | |
US6313514B1 (en) | Pressure sensor component | |
JP2004020216A (ja) | 圧力センサ装置 | |
US7388287B2 (en) | Semiconductor package | |
JPH1038730A (ja) | 圧力センサ並びに圧力センサを用いた圧力検出装置 | |
JP3700944B2 (ja) | 圧力センサ | |
CN215222600U (zh) | 能耦接到印刷电路板的环境温度传感器及电子*** | |
JP3042344B2 (ja) | 半導体圧力センサ | |
WO2021131615A1 (ja) | 半導体力センサ | |
KR20110076539A (ko) | 압력 센서 및 그 제조 방법 | |
JPH0734356Y2 (ja) | 表面実装型圧力センサー | |
JPH10170371A (ja) | 圧力センサとその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20031222 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040130 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20040316 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040412 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080416 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090416 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100416 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100416 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110416 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120416 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120416 Year of fee payment: 8 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120416 Year of fee payment: 8 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120416 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130416 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130416 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140416 Year of fee payment: 10 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |