JP2000502516A - 均一な圧力降下および均一な流量を有するコールド・プレート - Google Patents
均一な圧力降下および均一な流量を有するコールド・プレートInfo
- Publication number
- JP2000502516A JP2000502516A JP10518517A JP51851798A JP2000502516A JP 2000502516 A JP2000502516 A JP 2000502516A JP 10518517 A JP10518517 A JP 10518517A JP 51851798 A JP51851798 A JP 51851798A JP 2000502516 A JP2000502516 A JP 2000502516A
- Authority
- JP
- Japan
- Prior art keywords
- fin structure
- fin
- channel
- cold plate
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.流体冷却剤を搬送するチャネルを画定するチャネル部分を有し、かつ各々が 発熱部品を受ける複数のボスを有するコールド・プレートと、 コールド・プレート上に順次的な順序で隣接配置された複数のフィン構造であ って、各々がボスに接触し、流体冷却剤を非順次的な順序でフィン構造に搬送す るチャネルの部分と流体連通しているフィン入口およびフィン出口を含んでいる フィン構造と を備えている電子部品の冷却システム。 2.発熱部品が電子部品である、請求の範囲第1項に記載のシステム。 3.第1のフィン構造と流体連通しており、第2のフィン構造と流体連通した第 2のチャネル部分に隣接配置された第1のチャネル部分を更に含んでおり、第1 のチャネル部分が流体冷却剤を第1の方向へ搬送し、第2のチャネル部分が流体 冷却剤を第1の方向と逆の方向へ搬送する、請求の範囲第1項に記載のシステム 。 4.各ボスがチャネルに隣接配置されている、請求の範囲第1項に記載のシステ ム。 5.順次的な順序で隣接配置された複数のフィン構造が整合して配置されている 、請求の範囲第1項に記載のシステム。 6.流体冷却剤をコールド・プレートへ送るマニフォルドを更に含んでいる、請 求の範囲第1項に記載のシステム。 7.チャネルが屈曲路をさらに画定している、請求の範囲第1 項に記載のシステム。 8.前記複数のフィン構造が少なくとも3つのフィン構造を含んでいる、請求の 範囲第1項に記載のシステム。 9.少なくとも3つのフィン構造が、第1のフィン構造が第2のフィン構造に隣 接して配置され、第2のフィン構造が第3のフィン構造に隣接して配置されるよ うに順次配置されている、請求の範囲第8項に記載のシステム。 10.チャネルが流体冷却剤を第1のフィン構造から第3のフィン構造へ、次い で第2のフィン構造へさらに搬送する、請求の範囲第9項に記載のシステム。 11.流体冷却剤を送るマニフォルドと、 垂直スタックに配置された複数のコールド・プレートであって、各コールド・ プレートが流体冷却剤をマニフォルドから受け取り、搬送するチャネルを画定す るチャネル部分を有しており、かつ各々が電子部品を受け、各々がチャネルに隣 接して配置されている複数のボスを有しているコールド・プレートと、 コールド・プレート上に順次的な順序で隣接配置された複数のフィン構造であ って、各々のフィン構造がボスを包囲し、流体冷却剤を非順次的な順序でフィン 構造に搬送するチャネルの部分と流体連通しているフィン入口およびフィン出口 を含んでいるフィン構造とを備えており、 第1のチャネル部分が第1のフィン構造と流体連通しており、第2のフィン構 造と流体連通した第2のチャネル部分に隣接配置されており、第1のチャネル部 分が流体冷却剤を第1の方向へ搬送し、第2のチャネル部分が流体冷却剤を第1 の方向と逆の方向へ搬送する 電子部品の冷却システム。 12.コールド・プレートの各々がオリフィスを有する流体入口を更に含んでお り、各オリフィスの直径がほぼ等しい、請求の範囲第11項に記載のシステム。 13.チャネルが屈曲路を画定している、請求の範囲第11項に記載のシステム 。 14.複数のフィン構造が少なくとも3つのフィン構造を含んでいる、請求の範 囲第11項に記載のシステム。 15.少なくとも3つのフィン構造が、第1のフィン構造が第2のフィン構造に 隣接して配置され、第2のフィン構造が第3のフィン構造に隣接して配置される ように順次配置されている、請求の範囲第14項に記載のシステム。 16.チャネルが流体冷却剤を第1のフィン構造から第3のフィン構造へ、次い で第2のフィン構造へさらに搬送する、請求の範囲第15項に記載のシステム。 17.マニフォルドによって複数のコールド・プレートへ送られる流体冷却剤の 流量が各コールド・プレートの両側でほぼ等しい、請求の範囲第16項に記載の システム。 18.各コールド・プレートの両側での圧力降下がほぼ等しい、請求の範囲第1 7項に記載のシステム。 19.スタック構成で配置された複数のコールド・プレートであって、各コール ド・プレートが流体冷却剤を受け取り、搬送するチャネルを画定しているコール ド・プレートと、各々が電子部品を受け、各々がチャネルに隣接して配置されて いる複数のボスと、コールド・プレート上に順次的な順序で隣接配置された複数 のフィン構造であって、各々のフィン構造がボスを包 囲し、チャネルの部分と流体連通しているフィン入口およびフィン出口を含んで いるフィン構造とを設け、 流体冷却剤をマニフォルドを介してコールド・プレートの各々のチャネルに送 り、 各チャネルを通して流体冷却剤を送って、流体冷却剤を非順次的順序でフィン 構造に送り、流体冷却剤の流量を各コールド・プレートの両側でほぼ等しくする ようにする 電子部品の冷却方法。 20.各コールド・プレートの両側での圧力降下がほぼ等しい、請求の範囲第1 9項に記載の方法。 21.流体冷却剤が屈曲路内のチャネルを通って流れる、請求の範囲第19項に 記載の方法。 22.各コールド・プレート上に順次的に隣接配置された少なくとも3つのフィ ン構造を設け、第1のフィン構造が第2のフィン構造に隣接配置され、第2のフ ィン構造が第3のフィン構造に隣接配置されようにし、 流体冷却剤をチャネルを通して非順次的に送り、流体冷却剤が第1のフィン構 造へ、次いで第3のフィン構造へ送られ、次いで第2のフィン構造へ戻されるよ うにする ことをさらに含んでいる請求の範囲第19項に記載の方法。 23.流体冷却剤を第3のフィン構造から複数のフィン構造の他のものへ順次的 に送る ことをさらに含んでいる請求の範囲第22項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/733,615 | 1996-10-17 | ||
US08/733,615 US5983997A (en) | 1996-10-17 | 1996-10-17 | Cold plate having uniform pressure drop and uniform flow rate |
PCT/US1997/018506 WO1998017089A1 (en) | 1996-10-17 | 1997-10-14 | Cold plate having uniform pressure drop and uniform flow rate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000502516A true JP2000502516A (ja) | 2000-02-29 |
Family
ID=24948389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10518517A Ceased JP2000502516A (ja) | 1996-10-17 | 1997-10-14 | 均一な圧力降下および均一な流量を有するコールド・プレート |
Country Status (5)
Country | Link |
---|---|
US (1) | US5983997A (ja) |
JP (1) | JP2000502516A (ja) |
KR (1) | KR19990072203A (ja) |
CN (1) | CN1209943A (ja) |
WO (1) | WO1998017089A1 (ja) |
Cited By (3)
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JP2003060145A (ja) * | 2001-08-16 | 2003-02-28 | Nippon Alum Co Ltd | 冷却プレート |
US7538426B2 (en) | 2004-11-30 | 2009-05-26 | Mitsubishi Denki Kabushiki Kaisha | Cooling system of power semiconductor module |
JP2011228566A (ja) * | 2010-04-22 | 2011-11-10 | Denso Corp | 冷却器 |
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- 1997-10-14 KR KR1019980704576A patent/KR19990072203A/ko not_active Application Discontinuation
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JP2003060145A (ja) * | 2001-08-16 | 2003-02-28 | Nippon Alum Co Ltd | 冷却プレート |
US7538426B2 (en) | 2004-11-30 | 2009-05-26 | Mitsubishi Denki Kabushiki Kaisha | Cooling system of power semiconductor module |
JP2011228566A (ja) * | 2010-04-22 | 2011-11-10 | Denso Corp | 冷却器 |
Also Published As
Publication number | Publication date |
---|---|
CN1209943A (zh) | 1999-03-03 |
KR19990072203A (ko) | 1999-09-27 |
US5983997A (en) | 1999-11-16 |
WO1998017089A1 (en) | 1998-04-23 |
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