JP2000348978A - Manufacture of electrode of electric double-layer capacitor - Google Patents
Manufacture of electrode of electric double-layer capacitorInfo
- Publication number
- JP2000348978A JP2000348978A JP11161976A JP16197699A JP2000348978A JP 2000348978 A JP2000348978 A JP 2000348978A JP 11161976 A JP11161976 A JP 11161976A JP 16197699 A JP16197699 A JP 16197699A JP 2000348978 A JP2000348978 A JP 2000348978A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- current collecting
- collecting lead
- electrode terminal
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気二重層コンデ
ンサの電極製造方法に関する。The present invention relates to a method for manufacturing an electrode of an electric double layer capacitor.
【０００２】[0002]
【従来の技術】この種の電気二重層コンデンサは、複数
の電極素子をセパレータを介して積層した積層体を形成
し、各電極素子から延出された集電リードを同極毎にま
とめて電極端子に接合した構成となっているものが知ら
れている。2. Description of the Related Art An electric double-layer capacitor of this type is formed by forming a laminated body in which a plurality of electrode elements are laminated with a separator interposed therebetween, and collecting current leads extending from each of the electrode elements for each electrode. A configuration in which the terminal is joined to a terminal is known.
【０００３】前記積層体を構成する電極素子は、集電部
材の表面に分極性電極を備え、該集電部材の片側から延
出されたアルミニウム箔からなる帯状の集電リードを備
えている。各電極素子は同一形状であるが、各電極素子
を積層するに先立って、陽極とする電極素子と陰極とす
る電極素子とを互いに表裏反転させておき、交互に積層
されたときに相隣接する電極素子同士では集電リードが
互いに異なる側に配置されるようにする。また、各電極
素子を積層するときには、各電極素子の分極性電極間に
電解質溶液が含浸されたセパレータが介在される。そし
て、同じ側に配置された集電リード同士が同極として積
層されてアルミニウム材によって形成された各極の電極
端子に接続される。[0003] The electrode element constituting the laminate has a polarizable electrode on the surface of the current collecting member, and a band-shaped current collecting lead made of aluminum foil extending from one side of the current collecting member. Each electrode element has the same shape, but before stacking each electrode element, the electrode element serving as an anode and the electrode element serving as a cathode are turned upside down to be adjacent to each other when they are alternately stacked. The current collecting leads are arranged on different sides of the electrode elements. When each electrode element is laminated, a separator impregnated with an electrolyte solution is interposed between the polarizable electrodes of each electrode element. Then, the current collecting leads arranged on the same side are stacked as the same pole and connected to the electrode terminals of the respective poles formed of an aluminum material.
【０００４】従来、集電リードと電極端子との接合は、
各電極素子をセパレータを介して積層した後に行われて
いた。即ち、陽極の電極素子とセパレータと陰極の電極
素子とを順次積層する積層工程では、例えば、積層ステ
ーションにおいて電極素子の形状に対応する集電リード
側が開放されたトレー状の位置決めケースに各電極素子
及びセパレータを積層順に供給する。これにより、位置
決めケース内には、各電極素子及びセパレータが位置ズ
レのない状態で積層された積層体が形成される。次いで
行われる集電リードと電極端子との接合工程では、例え
ば、積層ステーションの位置決めケースから積層体を取
り出し、端子接合ステーションに移送されて積層状態の
一対の集電リードを各極の電極端子に接合される。Conventionally, the joining between the current collecting lead and the electrode terminal is performed by
This is performed after each electrode element is laminated via a separator. That is, in the laminating step of sequentially laminating the anode electrode element, the separator, and the cathode electrode element, for example, in the lamination station, each electrode element is placed in a tray-shaped positioning case having an open collector lead corresponding to the shape of the electrode element. And the separator are supplied in the order of lamination. As a result, a laminated body in which the electrode elements and the separator are laminated without any displacement is formed in the positioning case. In the subsequent joining step of the current collecting lead and the electrode terminal, for example, the laminate is taken out of the positioning case of the laminating station, and is transferred to the terminal joining station, and the pair of current collecting leads in the laminated state are connected to the electrode terminals of each pole. Joined.
【０００５】しかし、積層ステーションから端子接合ス
テーションへ積層体を移送する際に該積層体の積層状態
が崩れ易く、前記接合工程による集電リードと電極端子
との接合に位置ズレが生じて接合が不充分となる不都合
があった。However, when the stack is transferred from the stacking station to the terminal joining station, the stacking state of the stack is liable to collapse, and the joining between the current collecting lead and the electrode terminal in the joining step is displaced, resulting in the joining. There was an inconvenience.
【０００６】また、従来、集電リードと電極端子との接
続は超音波拡散接合により行われることが知られてい
る。該超音波拡散接合によるときには、電極端子の一部
に形成された平坦面に積層された集電リードを当接して
おき、超音波振動を付与する圧接部材を各集電リードの
積層方向に圧接して各集電リード及び電極端子の相互の
接合面に溶融熱を発生させることにより、電極端子に複
数の集電リードを一挙に接合する。Conventionally, it is known that the connection between the current collecting lead and the electrode terminal is made by ultrasonic diffusion bonding. In the case of the ultrasonic diffusion bonding, a current collecting lead laminated on a flat surface formed on a part of the electrode terminal is abutted, and a pressure contact member for applying ultrasonic vibration is pressed in a direction in which the current collecting leads are laminated. Then, a plurality of current collecting leads are joined to the electrode terminals at once by generating heat of fusion at the mutual joining surface of each current collecting lead and the electrode terminal.
【０００７】しかし、この種の電気二重層コンデンサに
おいて、分極性電極の数を増やすことによりコンデンサ
容量を大きくしようとすると、前記集電リードの数もま
た増加することになる。そして、複数の前記集電リード
を電極端子に一挙に超音波拡散接合するときに集電リー
ドの積層枚数が多いと、超音波の伝達が不十分となり、
超音波振動を付与する圧接部材から遠い位置にある電極
端子側の集電リードが接合されずに剥離して、集電リー
ドと電極端子との導通が不完全になる不都合がある。However, in this type of electric double layer capacitor, if the capacitor capacity is increased by increasing the number of polarizable electrodes, the number of the current collecting leads also increases. And, when a plurality of the current collecting leads are stacked at a time when the plurality of the current collecting leads are ultrasonically diffused and bonded to the electrode terminals, the transmission of the ultrasonic wave becomes insufficient,
There is a disadvantage that the current collecting lead on the electrode terminal side located at a position far from the pressure contact member that applies the ultrasonic vibration is peeled off without being joined, and the conduction between the current collecting lead and the electrode terminal becomes incomplete.
【０００８】[0008]
【発明が解決しようとする課題】かかる不都合を解消し
て、本発明は、電極素子の集電リードと電極端子との接
合を確実に行い、集電リードと電極端子との導通を確実
に確保することができる電気二重層コンデンサの電極製
造方法を提供することを目的とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention reliably connects the current collecting lead of the electrode element and the electrode terminal, and ensures the conduction between the current collecting lead and the electrode terminal. It is an object of the present invention to provide a method for manufacturing an electrode of an electric double layer capacitor which can be performed.
【０００９】[0009]
【課題を解決するための手段】かかる目的を達成するた
めに、本発明は、複数の電極素子がセパレータを介して
積層され、各電極素子から延出された帯状の集電リード
が同極毎にまとめられて各極の電極端子に接合されてな
る電気二重層コンデンサの電極製造方法において、複数
の電極素子を位置決めしつつ前記セパレータを介して順
次重ねる毎に、該電極素子の集電リードを電極端子上に
順次重ねて積層する集電リード積層工程を設け、該集電
リード積層工程は、集電リードが電極端子上に重ねられ
る毎に、該集電リードと該電極端子とを接合する接合工
程を備えることを特徴とする。In order to achieve the above object, the present invention provides a method of manufacturing a battery comprising a plurality of electrode elements laminated with a separator interposed therebetween, and a strip-shaped current collecting lead extending from each electrode element having the same polarity. In the method of manufacturing an electrode of an electric double layer capacitor which is collectively joined to the electrode terminals of the respective electrodes, each time the plurality of electrode elements are positioned and sequentially stacked via the separator, the current collecting lead of the electrode element is changed. A current collecting lead laminating step of sequentially stacking and laminating on the electrode terminal is provided, and the current collecting lead laminating step joins the current collecting lead and the electrode terminal each time the current collecting lead is laminated on the electrode terminal. It is characterized by comprising a joining step.
【００１０】本発明によれば、前記集電リード積層工程
により、複数の電極素子をセパレータを介して積層する
際に、各電極素子から延出された集電リードを電極端子
上に重ねる。そして該集電リード積層工程が前記接合工
程を備えることにより、該接合工程によって、電極端子
上に集電リードが重ねられる毎に、電極端子と集電リー
ド、及び集電リード同士が接合される。こうすることに
より、電極素子が位置決めされた状態でセパレータを介
して積層される毎に、該電極素子の集電リードと電極端
子とが接合されるので、積層された集電リードに位置ズ
レが生じることなく確実に電極端子に接続され、集電リ
ードと電極端子との導通を確実に確保することができ
る。しかも、電極素子及びセパレータの積層が完了した
時点で集電リードと電極端子との接合が完了するので、
精度の高い積層電極の形成が迅速に行えて作業効率を向
上させることができる。According to the present invention, when a plurality of electrode elements are stacked via the separator in the current collecting lead laminating step, the current collecting leads extended from each electrode element are overlapped on the electrode terminals. The current collecting lead laminating step includes the joining step, whereby the electrode terminal, the current collecting lead, and the current collecting lead are joined each time the current collecting lead is stacked on the electrode terminal by the joining step. . By doing so, each time the electrode element is positioned and stacked via the separator, the current collecting lead of the electrode element and the electrode terminal are joined, so that the misalignment occurs in the stacked current collecting leads. The connection between the current collecting lead and the electrode terminal can be reliably ensured without being generated. Moreover, since the joining between the current collecting lead and the electrode terminal is completed when the lamination of the electrode element and the separator is completed,
A highly accurate laminated electrode can be formed quickly and the working efficiency can be improved.
【００１１】本発明においては、前記接合工程を、超音
波振動を付与する圧接部材を集電リードの積層方向に圧
接する超音波拡散接合によって行う場合に特に好適であ
る。即ち、本発明における接合工程では集電リード一枚
毎に超音波拡散接合が行われるので、電極端子と接する
最下層の集電リードが先ず該電極端子に接合され、順次
集電リードが重ね合わされる毎に隣接する集電リード同
士が接合される。In the present invention, it is particularly preferable that the bonding step is performed by ultrasonic diffusion bonding in which a pressing member for applying ultrasonic vibration is pressed in the stacking direction of the current collecting leads. That is, in the bonding step of the present invention, ultrasonic diffusion bonding is performed for each current collecting lead, so that the lowermost current collecting lead in contact with the electrode terminal is first bonded to the electrode terminal, and the current collecting leads are sequentially superimposed. Each time, the adjacent current collecting leads are joined to each other.
【００１２】これにより、従来のような集電リードの積
層が完了した後に電極端子への接合を超音波拡散接合に
よって一挙に行う場合に生じていた最下層の集電リード
と電極端子との接合不良を確実に防止することができ
る。[0012] Thus, the joining between the lowermost current collecting lead and the electrode terminal, which occurs when the bonding to the electrode terminal is performed at once by ultrasonic diffusion bonding after the stacking of the current collecting lead is completed as in the prior art. Defects can be reliably prevented.
【００１３】また、超音波拡散接合による接合工程にお
いては、集電リードが電極端子上に重ねられる毎に前記
圧接部材の該集電リードへの圧接位置を変えると共に、
集電リードの積層枚数の増加に応じて前記圧接部材から
付与する超音波出力を増加させて最下層の集電リードと
電極端子との接合面に超音波振動を到達させるようにす
ることが好ましい。これにより、集電リードが電極端子
上に重ねられる毎に、前記圧接部材から付与される超音
波振動が、最下層の集電リードと電極端子との既に接合
されている部分と異なる位置に到達して接合されるの
で、集電リードの積層枚数の増加に応じて最下層の集電
リードと電極端子との接合面積を広くすることができ
る。そしてこのように比較的接合面積が広く形成された
ことによって、集電リードと電極端子とが強固に接合さ
れると共に、集電リードと電極端子との導通を確実に確
保することができる。[0013] In the bonding step by ultrasonic diffusion bonding, each time the current collecting lead is superimposed on the electrode terminal, the pressure contact position of the pressing member against the current collecting lead is changed.
It is preferable that the ultrasonic output applied from the pressure contact member is increased in accordance with an increase in the number of stacked current collecting leads, so that ultrasonic vibration reaches the joining surface between the lowermost current collecting lead and the electrode terminal. . Accordingly, each time the current collecting lead is superimposed on the electrode terminal, the ultrasonic vibration applied from the pressure contact member reaches a position different from the position where the lowermost layer of the current collecting lead and the electrode terminal are already joined. Therefore, the bonding area between the lowermost current collecting lead and the electrode terminal can be increased as the number of stacked current collecting leads increases. Since the bonding area is formed relatively wide in this way, the current collecting lead and the electrode terminal are firmly bonded, and conduction between the current collecting lead and the electrode terminal can be reliably ensured.
【００１４】[0014]
【発明の実施の形態】本発明の一実施形態を図面に基づ
いて説明する。図１は本実施形態において採用する装置
を模式的に示す説明図、図２は接合装置の要部を模式的
に示す説明図、図３は集電リード積層工程における接合
工程を示す説明図、図４は電気二重層コンデンサの概略
構成を示す要部の説明的縦断面図である。なお、図２及
び図３においては、説明の便宜上、集電リードの厚みが
実際のものよりも誇張して示されている。An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view schematically showing an apparatus adopted in the present embodiment, FIG. 2 is an explanatory view schematically showing a main part of a joining apparatus, FIG. 3 is an explanatory view showing a joining step in a current collecting lead laminating step, FIG. 4 is an explanatory longitudinal sectional view of a main part showing a schematic configuration of the electric double layer capacitor. 2 and 3, the thickness of the current collecting lead is exaggerated from the actual thickness for convenience of explanation.
【００１５】図１において、１は陽極電極素子２、セパ
レータ３、及び陰極電極素子４を積層する積層ステーシ
ョンであり、５は該積層ステーション１に供給された電
極素子２，３の集電リード６を電極端子７（図２参照）
に接合する接合装置である。In FIG. 1, reference numeral 1 denotes a laminating station for laminating an anode electrode element 2, a separator 3, and a cathode electrode element 4, and 5 denotes a current collecting lead 6 for the electrode elements 2 and 3 supplied to the laminating station 1. To electrode terminal 7 (see FIG. 2)
It is a joining device for joining to.
【００１６】陽極電極素子２、セパレータ４、及び陰極
電極素子３は、図４に示すように、電気二重層コンデン
サ８の電極積層体９を構成するものである。一般に、固
体と溶液との異なる２つの相が接触する界面では、極め
て短い距離を隔てて正負の電荷が対向して配列して電気
二重層が形成される。そこで、前記固体を分極性電極と
し、電解質溶液を含浸させたセパレータ４を介して対向
する一対の分極性電極間に電界を印加することによりコ
ンデンサが形成される。As shown in FIG. 4, the anode electrode element 2, the separator 4, and the cathode electrode element 3 constitute an electrode laminate 9 of the electric double layer capacitor 8. Generally, at an interface where two different phases of a solid and a solution are in contact, positive and negative charges are arranged to face each other at an extremely short distance to form an electric double layer. Thus, a capacitor is formed by using the solid as a polarizable electrode and applying an electric field between a pair of opposing polarizable electrodes via a separator 4 impregnated with an electrolyte solution.
【００１７】電気二重層コンデンサ８は、電極積層体９
と電解液とを収容する外装ケース１０と該外装ケース１
０を閉塞する蓋体１１とを備え、該蓋体１１には電極端
子７が取り付けられている。The electric double layer capacitor 8 includes an electrode laminate 9
Case 10 for accommodating an electrolyte and an electrolyte, and the outer case 1
And a cover 11 for closing the cover 0, and the electrode terminal 7 is attached to the cover 11.
【００１８】前記陽極電極素子２は、詳しくは図示しな
いが、アルミニウム箔製の集電部材の表面に分極性電極
を備え、この集電部材の一側寄りの端縁には電極端子７
に接続するための帯状の集電リード６が一体に延設され
ている。前記陰極電極素子３は、図１に示すように、陽
極電極素子２と同一の構成であって陽極電極素子２を表
裏反転させたものである。これにより、陽極電極素子２
にセパレータ４を介して陰極電極素子３を重ねたとき
に、陽極電極素子２の集電リード６と陰極電極素子３の
集電リード６とが互いに離間して延出される。前記セパ
レータ４は、合成樹脂製フィルム或いは紙製シート等の
絶縁性シート材によって形成されている。また、前記電
極端子７はアルミニウム材によって形成されている。Although not shown in detail, the anode electrode element 2 is provided with a polarizable electrode on the surface of a current collecting member made of aluminum foil, and an electrode terminal 7 is provided at an edge near one side of the current collecting member.
A belt-like current collecting lead 6 for connecting to the power supply is integrally extended. As shown in FIG. 1, the cathode electrode element 3 has the same configuration as the anode electrode element 2 and is obtained by inverting the anode electrode element 2 upside down. Thereby, the anode electrode element 2
When the cathode electrode element 3 is placed on the cathode electrode element 3 via the separator 4, the current collecting lead 6 of the anode electrode element 2 and the current collecting lead 6 of the cathode electrode element 3 are extended apart from each other. The separator 4 is formed of an insulating sheet material such as a synthetic resin film or a paper sheet. The electrode terminals 7 are formed of an aluminum material.
【００１９】前記積層ステーション１には、図１中仮想
線示する位置決めケース１２が設けられており、図示し
ない供給装置によって、陽極電極素子２、セパレータ
４、及び陰極電極素子３が順次位置決めケース１２内に
供給されるようになっている。位置決めケース１２の周
囲には、複数の陽極電極素子２を貯留する陽極電極素子
貯留部１３と、複数のセパレータ４を貯留するセパレー
タ貯留部１４と、複数の陰極電極素子３を貯留する陰極
電極素子貯留部１５とが設けられている。前記供給装置
は、夫々の貯留部１３，１４，１５から所定の順番で、
陽極電極素子２、セパレータ４、及び陰極電極素子３を
取り出して位置決めケース１２に移送する。The laminating station 1 is provided with a positioning case 12 indicated by an imaginary line in FIG. 1, and the anode electrode element 2, the separator 4, and the cathode electrode element 3 are sequentially positioned by a supply device (not shown). It is supplied inside. Around the positioning case 12, an anode electrode element storage section 13 for storing a plurality of anode electrode elements 2, a separator storage section 14 for storing a plurality of separators 4, and a cathode electrode element for storing a plurality of cathode electrode elements 3 are provided. A storage unit 15 is provided. The supply device is provided in a predetermined order from each of the storage units 13, 14, and 15,
The anode electrode element 2, the separator 4, and the cathode electrode element 3 are taken out and transferred to the positioning case 12.
【００２０】前記接合装置５は、図１及び図２に示すよ
うに、一対の電極端子７を支持するベース１６と、該ベ
ース１６に支持された各電極端子７に対向して昇降する
保持部材１７に保持された一対のチップ（圧接部材）１
８とを備えている。該ベース１６は、前記位置決めケー
ス１２内に収容された各電極素子２，３から延出された
集電リード６の下方に各電極端子７が当接するように該
電極端子７を支持する。これによって、位置決めケース
１２内に供給される陽極電極素子２の集電リード６及び
陰極電極素子３の集電リード６は、図２に示すように、
ベース１６に支持された各電極端子７上に積層される。As shown in FIGS. 1 and 2, the joining device 5 includes a base 16 for supporting a pair of electrode terminals 7 and a holding member which moves up and down in opposition to each of the electrode terminals 7 supported by the base 16. A pair of chips (pressing members) 1 held at 17
8 is provided. The base 16 supports the electrode terminals 7 so that the electrode terminals 7 abut below the current collecting leads 6 extending from the electrode elements 2 and 3 housed in the positioning case 12. As a result, the current collecting lead 6 of the anode electrode element 2 and the current collecting lead 6 of the cathode electrode element 3 supplied into the positioning case 12, as shown in FIG.
It is laminated on each electrode terminal 7 supported on the base 16.
【００２１】前記チップ１８は、ベース１６に支持され
た電極端子７に向かって昇降して電極端子７上の集電リ
ード６に圧接する。また、該チップ１８は、集電リード
６の延出方向に沿って進退するように設けられている。
該チップ１８には図示しない超音波加振装置から超音波
振動が付与され、集電リード６に圧接したときには該集
電リード６に振動エネルギーを付与して集電リード６と
電極端子７、及び集電リード６同士の固相拡散接合を行
う。即ち、アルミニウム材における固相拡散接合は、超
音波による振動エネルギーによって、接合するアルミニ
ウム材の表面の酸化皮膜を消失させると共に相互の接合
面に溶融熱を発生させ、これによって露出する清浄面同
士において相互の接合を行うものである。なお、本実施
形態における前記超音波加振装置は、超音波の出力を可
変自在のものが採用されている。The chip 18 moves up and down toward the electrode terminal 7 supported on the base 16 and presses against the current collecting lead 6 on the electrode terminal 7. The chip 18 is provided so as to advance and retreat along the direction in which the current collecting lead 6 extends.
Ultrasonic vibration is applied to the chip 18 from an ultrasonic vibration device (not shown). When the chip 18 is pressed against the current collecting lead 6, vibration energy is applied to the current collecting lead 6 so that the current collecting lead 6 and the electrode terminal 7, and The solid-state diffusion bonding between the current collecting leads 6 is performed. In other words, solid-phase diffusion bonding of aluminum material uses an ultrasonic vibration energy to eliminate an oxide film on the surface of the aluminum material to be bonded and generate heat of fusion at the bonding surfaces of the aluminum materials. This is to join each other. It should be noted that the ultrasonic vibration device in the present embodiment employs a device capable of changing the output of ultrasonic waves.
【００２２】次に、本実施形態における電極製造方法を
説明する。先ず、図１に示すように、一枚目の陽極電極
素子２が位置決めケース１２に収容されたとき、図３
（ａ）に示すように、電極端子７上に重ねられた集電リ
ード６に向かって前記チップ１８が下降され、該チップ
１８が集電リード６に圧接される。これにより、該チッ
プ１８から超音波振動が付与され、集電リード６と電極
端子７との接合部ｘが形成される。このとき、陽極電極
素子２は、位置決めケース１２に収容されているので、
位置決めされた状態が維持されて集電リード６と電極端
子７との接合が行われる。そして、前記チップ１８が上
昇して、ベース１６の上方を開放する。Next, a method for manufacturing an electrode according to this embodiment will be described. First, as shown in FIG. 1, when the first anode electrode element 2 is accommodated in the positioning case 12, FIG.
As shown in (a), the chip 18 is lowered toward the current collecting lead 6 superimposed on the electrode terminal 7, and the chip 18 is pressed against the current collecting lead 6. As a result, ultrasonic vibration is applied from the chip 18 to form a joint x between the current collecting lead 6 and the electrode terminal 7. At this time, since the anode electrode element 2 is housed in the positioning case 12,
The current collecting lead 6 and the electrode terminal 7 are joined while the positioned state is maintained. Then, the tip 18 rises to open the upper portion of the base 16.
【００２３】次いで、図１に示すように、セパレータ４
が位置決めケース１２に収容され、陽極電極素子２上に
重ねられ、続いて、一枚目の陰極電極素子３が位置決め
ケース１２に収容され、セパレータ４を介して陽極電極
素子２上に重ねられる。このとき、上述の一枚目の陽極
電極素子２と同様にして、該集電リード６と電極端子７
との接合部ｘが形成される。Next, as shown in FIG.
Are accommodated in the positioning case 12 and overlapped on the anode electrode element 2. Subsequently, the first cathode electrode element 3 is accommodated in the positioning case 12 and overlapped on the anode electrode element 2 via the separator 4. At this time, the current collecting lead 6 and the electrode terminal 7 are formed in the same manner as the first anode electrode element 2 described above.
Is formed.
【００２４】次いで、セパレータ４が位置決めケース１
２に収容された後、二枚目の陽極電極素子２が位置決め
ケース１２に収容される。そして、図３（ｂ）に示すよ
うに、集電リード６同士が重ねられ、前記チップ１８が
下降されて集電リード６に圧接される。このとき、該チ
ップ１８は下降に先立って集電リード６の先端側に向か
って後退される。これによって、一枚目の陽極電極素子
２の集電リード６と電極端子７との間に形成された接合
部ｘの近傍或いは連続して該チップ１８が圧接されて接
合部ｘが形成される。更に、該二枚目の陽極電極素子２
の集電リード６の接合時には、該チップ１８に付与され
る超音波の出力が、前記一枚目の陽極電極素子２の集電
リード６の接合時よりも大とされる。これにより、二枚
目の陽極電極素子２の集電リード６が一枚目の陽極電極
素子２の集電リード６に接合された部分においても、一
枚目の陽極電極素子２の集電リード６（以下最下層の集
電リード６と言う）と電極端子７との接合部ｘが形成さ
れ、電極端子７への接続が一層確実となる。Next, the separator 4 is moved to the positioning case 1.
After that, the second anode electrode element 2 is accommodated in the positioning case 12. Then, as shown in FIG. 3B, the current collecting leads 6 are overlapped with each other, and the chip 18 is lowered and pressed against the current collecting leads 6. At this time, the chip 18 is retracted toward the tip end of the current collecting lead 6 before descending. As a result, the chip 18 is pressed into the vicinity of or continuously with the junction x formed between the current collecting lead 6 and the electrode terminal 7 of the first anode electrode element 2 to form the junction x. . Further, the second anode electrode element 2
When the current collecting lead 6 is joined, the output of the ultrasonic wave applied to the chip 18 is made larger than when the current collecting lead 6 of the first anode electrode element 2 is joined. As a result, the current collecting lead 6 of the first anode electrode element 2 is also connected to the portion where the current collecting lead 6 of the second anode electrode element 2 is joined to the current collecting lead 6 of the first anode electrode element 2. 6 (hereinafter referred to as the lowermost current collecting lead 6) and the electrode terminal 7 are formed in a joint portion x, and the connection to the electrode terminal 7 is further ensured.
【００２５】次いで、二枚目の陰極電極素子３が位置決
めケース１２に収容され、セパレータ４を介して陽極電
極素子２上に重ねられる。このとき、上述の二枚目の陽
極電極素子２と同様にして、該集電リード６と電極端子
７との接合部ｘが形成される。Next, the second cathode electrode element 3 is accommodated in the positioning case 12 and is stacked on the anode electrode element 2 via the separator 4. At this time, a joint x between the current collecting lead 6 and the electrode terminal 7 is formed in the same manner as in the second anode electrode element 2 described above.
【００２６】続いて、セパレータ４に次いで三枚目の陽
極電極素子２が位置決めケース１２に収容され、図３
（ｃ）に示すように、前記チップ１８により接合部ｘが
形成される。このときにも、該チップ１８が集電リード
６の先端側に向かって後退され、該チップ１８に付与さ
れる超音波の出力が更に増加される。これによって、三
枚目の陽極電極素子２の集電リード６から電極端子７に
亘る接合部ｘが前回形成された接合部ｘの近傍或いは連
続して形成される。Subsequently, the third anode electrode element 2 next to the separator 4 is accommodated in the positioning case 12, and
As shown in FIG. 3C, a junction x is formed by the chip 18. Also at this time, the chip 18 is retracted toward the tip end of the current collecting lead 6, and the output of the ultrasonic wave applied to the chip 18 is further increased. As a result, the joint x from the current collecting lead 6 of the third anode electrode element 2 to the electrode terminal 7 is formed near or continuously to the previously formed joint x.
【００２７】そして、以上のようにして、陽極電極素子
２とセパレータ４と陰極電極素子３との供給を積層枚数
分繰り返して行うことにより、位置決めケース１２内で
電極積層体を形成しつつ同時に集電リード６の接合を確
実に行うことができる。しかも、集電リード６が重ねら
れる毎にチップ１８の圧接位置が、集電リード６の先端
に向かって変えられると共に、該チップ１８の超音波出
力が増加されるので、最下層の集電リード６と電極端子
７との接合面積も積層枚数に応じて増加させることがで
きる。これによって、集電リード６と電極端子７との導
通を確実に確保することができると共に、集電リード６
と電極端子７との接合強度を大とすることができる。As described above, the supply of the anode electrode element 2, the separator 4, and the cathode electrode element 3 is repeated by the number of layers, so that the electrode stack is formed in the positioning case 12 at the same time. The joining of the electrical leads 6 can be performed reliably. In addition, each time the current collecting lead 6 is stacked, the pressure contact position of the chip 18 is changed toward the tip of the current collecting lead 6 and the ultrasonic output of the chip 18 is increased. The bonding area between the electrode 6 and the electrode terminal 7 can also be increased according to the number of layers. Thereby, conduction between the current collecting lead 6 and the electrode terminal 7 can be reliably ensured, and the current collecting lead 6
The bonding strength between the electrode and the electrode terminal 7 can be increased.
【００２８】なお、本実施形態においては、集電リード
６の積層枚数の増加に応じてチップ１８の圧接位置を変
えると共に、チップ１８の超音波出力を増加するように
したが、それ以外に、集電リード６の積層枚数にかかわ
らず、同一位置にチップ１８を圧接して各集電リード６
の接合を行ってもよい。この場合には、集電リード６の
積層枚数が増加しても集電リード６と電極端子７との接
合面積は増加しないが、その分、互いに隣接して重なる
集電リード６同士が接合されるのに必要な超音波出力を
チップ１８に付与すればよく、電力消費を抑えてコスト
を削減することができる。In the present embodiment, the press-contact position of the chip 18 is changed and the ultrasonic output of the chip 18 is increased in accordance with the increase in the number of stacked current collecting leads 6. Irrespective of the number of stacked current collecting leads 6, the chip 18 is pressed into the same position to press each current collecting lead 6.
May be joined. In this case, the junction area between the current collecting lead 6 and the electrode terminal 7 does not increase even if the number of stacked current collecting leads 6 increases, but the current collecting leads 6 that are adjacent to each other and overlap with each other are joined. What is necessary is just to give the ultrasonic output necessary for the chip 18 to the chip 18, and the power consumption can be suppressed and the cost can be reduced.
【図１】本発明の一実施形態において採用する装置を模
式的に示す説明図。FIG. 1 is an explanatory view schematically showing an apparatus employed in an embodiment of the present invention.
【図２】接合装置の要部を模式的に示す説明図。FIG. 2 is an explanatory view schematically showing a main part of the bonding apparatus.
【図３】集電リード積層工程における接合工程を示す説
明図。FIG. 3 is an explanatory view showing a joining step in a current collecting lead laminating step.
【図４】電気二重層コンデンサの概略構成を示す要部の
説明的縦断面図。FIG. 4 is an explanatory longitudinal sectional view of a main part showing a schematic configuration of an electric double layer capacitor.
【符号の説明】 ２…陽極電極素子（電極素子）、３…陰極電極素子（電
極素子）、４…セパレータ、６…集電リード、７…電極
端子、８…電気二重層コンデンサ、９…電極積層体（電
極）、１８…圧接部材。[Description of Signs] 2 ... Anode electrode element (electrode element), 3 ... Cathode electrode element (electrode element), 4 ... Separator, 6 ... Current collecting lead, 7 ... Electrode terminal, 8 ... Electric double layer capacitor, 9 ... Electrode Laminated body (electrode), 18 ... Press-contact member.
フロントページの続き (72)発明者 岩本 哲範 埼玉県狭山市新狭山１−10−１ ホンダエ ンジニアリング株式会社内 Ｆターム(参考） 5E082 AB03 AB09 BC40 EE03 EE24 GG08 GG11 HH03 HH14 JJ03 JJ25 KK01 LL29 MM02 MM13 MM21 MM22 5H022 AA00 BB03 BB17 CC05 CC08 CC13 CC19 CC22 Continued on the front page (72) Inventor Tetsunori Iwamoto 1-10-1 Shinsayama, Sayama-shi, Saitama F-term in Honda Engineering Co., Ltd. (Reference) 5E082 AB03 AB09 BC40 EE03 EE24 GG08 GG11 HH03 HH14 JJ03 JJ25 KK01 LL29 MM02 MM13 MM21 MM22 5H022 AA00 BB03 BB17 CC05 CC08 CC13 CC19 CC22
Claims (2)
され、各電極素子から延出された帯状の集電リードが同
極毎にまとめられて各極の電極端子に接合されてなる電
気二重層コンデンサの電極製造方法において、 複数の電極素子を位置決めしつつ前記セパレータを介し
て順次重ねる毎に、該電極素子の集電リードを電極端子
上に順次重ねて積層する集電リード積層工程を設け、 該集電リード積層工程は、集電リードが電極端子上に重
ねられる毎に、該集電リードと該電極端子とを接合する
接合工程を備えることを特徴とする電気二重層コンデン
サの電極製造方法。An electric device comprising: a plurality of electrode elements stacked with a separator interposed therebetween; and a strip-shaped current collecting lead extending from each electrode element is grouped for each pole and joined to an electrode terminal of each pole. In the method for manufacturing an electrode of a multilayer capacitor, a current-collecting lead laminating step of sequentially laminating current-collecting leads of the electrode element on the electrode terminal is provided each time a plurality of electrode elements are sequentially stacked via the separator while positioning. Wherein the current collecting lead laminating step includes a joining step of joining the current collecting lead and the electrode terminal each time the current collecting lead is stacked on the electrode terminal. Method.
接部材を集電リードの積層方向に圧接する超音波拡散接
合によって行われ、 該接合工程においては、集電リードが電極端子上に重ね
られる毎に前記圧接部材の該集電リードへの圧接位置を
変えると共に、集電リードの積層枚数の増加に応じて前
記圧接部材から付与する超音波出力を増加させて最下層
の集電リードと電極端子との接合面に超音波振動を到達
させることを特徴とする請求項１記載の電気二重層コン
デンサの電極製造方法。2. The bonding step is performed by ultrasonic diffusion bonding in which a pressing member for applying ultrasonic vibration is pressed in the direction of lamination of the current collecting leads, and in the bonding step, the current collecting leads are placed on the electrode terminals. Each time the pressure contact member is pressed against the current collecting lead, the position of the pressure contact member is changed, and the ultrasonic output applied from the pressure contact member is increased in accordance with an increase in the number of stacked current collecting leads. 2. The method for manufacturing an electrode of an electric double layer capacitor according to claim 1, wherein ultrasonic vibration is caused to reach a joint surface between the electrode and the electrode terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11161976A JP2000348978A (en) | 1999-06-09 | 1999-06-09 | Manufacture of electrode of electric double-layer capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11161976A JP2000348978A (en) | 1999-06-09 | 1999-06-09 | Manufacture of electrode of electric double-layer capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000348978A true JP2000348978A (en) | 2000-12-15 |
Family
ID=15745670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11161976A Pending JP2000348978A (en) | 1999-06-09 | 1999-06-09 | Manufacture of electrode of electric double-layer capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000348978A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006294567A (en) * | 2005-04-14 | 2006-10-26 | Toyota Motor Corp | Electric storage device and its manufacturing device |
| JP2008034356A (en) * | 2006-07-06 | 2008-02-14 | Enax Inc | Sheet-shaped secondary battery and its manufacturing method |
| JP2012209269A (en) * | 2006-07-06 | 2012-10-25 | Enax Inc | Method for manufacturing sheet-like secondary battery |
| JP2014011040A (en) * | 2012-06-29 | 2014-01-20 | Toyota Industries Corp | Power storage device and manufacturing method of electrode assembly |
| JP2015115115A (en) * | 2013-12-09 | 2015-06-22 | 株式会社豊田自動織機 | Device and method for manufacturing electricity storage device |
| JP2016001561A (en) * | 2014-06-12 | 2016-01-07 | 株式会社豊田自動織機 | Method and device for manufacturing power storage device |
| JP2016115908A (en) * | 2014-12-18 | 2016-06-23 | アイシン精機株式会社 | Method for manufacturing electrode and method for manufacturing electrode structure |
| JP2017092037A (en) * | 2012-08-28 | 2017-05-25 | 株式会社豊田自動織機 | Electricity storage device and method of manufacturing electricity storage device |
| JP2020129491A (en) * | 2019-02-08 | 2020-08-27 | 三洋電機株式会社 | Power storage element manufacturing method, power storage element, joining method, and conjugant |
-
1999
- 1999-06-09 JP JP11161976A patent/JP2000348978A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006294567A (en) * | 2005-04-14 | 2006-10-26 | Toyota Motor Corp | Electric storage device and its manufacturing device |
| JP2008034356A (en) * | 2006-07-06 | 2008-02-14 | Enax Inc | Sheet-shaped secondary battery and its manufacturing method |
| JP2012209269A (en) * | 2006-07-06 | 2012-10-25 | Enax Inc | Method for manufacturing sheet-like secondary battery |
| JP2014011040A (en) * | 2012-06-29 | 2014-01-20 | Toyota Industries Corp | Power storage device and manufacturing method of electrode assembly |
| JP2017092037A (en) * | 2012-08-28 | 2017-05-25 | 株式会社豊田自動織機 | Electricity storage device and method of manufacturing electricity storage device |
| JP2015115115A (en) * | 2013-12-09 | 2015-06-22 | 株式会社豊田自動織機 | Device and method for manufacturing electricity storage device |
| JP2016001561A (en) * | 2014-06-12 | 2016-01-07 | 株式会社豊田自動織機 | Method and device for manufacturing power storage device |
| JP2016115908A (en) * | 2014-12-18 | 2016-06-23 | アイシン精機株式会社 | Method for manufacturing electrode and method for manufacturing electrode structure |
| JP2020129491A (en) * | 2019-02-08 | 2020-08-27 | 三洋電機株式会社 | Power storage element manufacturing method, power storage element, joining method, and conjugant |
| JP7305367B2 (en) | 2019-02-08 | 2023-07-10 | 三洋電機株式会社 | Electric storage element manufacturing method, electric storage element, joining method, and joined body |
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