JP2000244024A - Thermoelectric element module - Google Patents
Thermoelectric element moduleInfo
- Publication number
- JP2000244024A JP2000244024A JP11045425A JP4542599A JP2000244024A JP 2000244024 A JP2000244024 A JP 2000244024A JP 11045425 A JP11045425 A JP 11045425A JP 4542599 A JP4542599 A JP 4542599A JP 2000244024 A JP2000244024 A JP 2000244024A
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric element
- thermoelectric
- small
- module
- element module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はｐ型とｎ型の熱電素
子を電気的に接続して構成した熱電素子モジュールに関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric element module in which p-type and n-type thermoelectric elements are electrically connected.
【０００２】[0002]
【従来の技術】熱電素子モジュールは、ｐ型とｎ型の熱
電素子を金属電極で順次接続するにあたり、π型直列回
路を構成するとともに、セラミック基板で挟んだものと
して構成されており、電流を流せばペルチェ効果によっ
て一方の電極側において吸熱、他方の電極側において放
熱がおこる。2. Description of the Related Art When a p-type and an n-type thermoelectric elements are sequentially connected by metal electrodes, a thermoelectric element module constitutes a π-type series circuit and is sandwiched between ceramic substrates. When flowing, heat is absorbed on one electrode side and heat is released on the other electrode side due to the Peltier effect.
【０００３】この熱電素子モジュールは、従来、π型直
列回路を保持するために、上下にセラミック基板を配し
たものとしており、また、保持のため、半田などにより
強力に接着する必要があった。上下のセラミック基板の
方向に温度勾配がかかるため、熱応力による破壊を防ぐ
意味で強固な保持部材が必要となっているわけである。Conventionally, this thermoelectric element module has a ceramic substrate disposed on the upper and lower sides in order to hold a π-type series circuit, and has to be strongly adhered by solder or the like for holding. Since a temperature gradient is applied in the direction of the upper and lower ceramic substrates, a strong holding member is required to prevent destruction due to thermal stress.
【０００４】一方、特開平１０−５１０３９号公報に
は、熱電素子の側部を柔軟で絶縁性を有する保持部材で
保持する構成が開示されている。この場合、電極が曲げ
可能な厚さ、あるいは可撓性を発揮する厚さであれば、
セラミック基板が不要で曲面型の熱電素子モジュールを
構成することができる。On the other hand, Japanese Patent Application Laid-Open No. H10-51039 discloses a configuration in which a side portion of a thermoelectric element is held by a flexible and insulating holding member. In this case, if the electrode can be bent or has a thickness that exhibits flexibility,
A ceramic substrate is not required, and a curved thermoelectric element module can be configured.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上記公報で示
された熱電素子モジュールは、電極厚さに制限があるう
え、熱電素子の両面がリジッドな電極で保持されている
ため、柔軟性という点で限界があり、また曲面に密着さ
せたとき、電極と熱電素子との接合部に大きな負荷が加
わるために、熱応力によって破壊しやすい。However, in the thermoelectric element module disclosed in the above publication, the thickness of the electrodes is limited, and both sides of the thermoelectric element are held by rigid electrodes. In addition, when the electrodes are in close contact with a curved surface, a large load is applied to the joint between the electrode and the thermoelectric element, so that they are easily broken by thermal stress.
【０００６】本発明はこのような点に鑑みなされたもの
であって、その目的とするところは曲面に対応すること
ができるとともに熱応力による破壊の少ない熱電素子モ
ジュールを提供するにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thermoelectric element module which can cope with a curved surface and is less likely to be damaged by thermal stress.
【０００７】[0007]
【課題を解決するための手段】しかして本発明は、複数
個の熱電素子を電気的に接続して構成した熱電素子モジ
ュールにおいて、複数の小型熱電素子小モジュールの熱
移送面の一方の面側だけを柔軟性を有する基材で保持す
るとともに、各熱電素子小モジュールを電気的に直列に
接続していることに特徴を有している。基材部分のみが
曲がって熱電素子の他方側には曲げ応力がかからない状
態を得ることができる。SUMMARY OF THE INVENTION According to the present invention, there is provided a thermoelectric element module comprising a plurality of thermoelectric elements electrically connected to one side of a heat transfer surface of a plurality of small thermoelectric element small modules. This is characterized in that only the thermoelectric element small modules are electrically connected in series while holding only the base material having flexibility. A state can be obtained in which only the base portion is bent and no bending stress is applied to the other side of the thermoelectric element.
【０００８】基材が電気的配線を備えており、該電気的
配線により複数の熱電素子小モジュールの電気的接続が
なされているものとしてもよい。The base may be provided with electric wiring, and the electric wiring may electrically connect a plurality of small thermoelectric element modules.
【０００９】この場合、熱電素子小モジュールは、対の
熱電素子と対の熱電素子の一端側同士を接続する電極と
からなり、各熱電素子の他端が基材の電気的配線に機械
的電気的に接続されたものとしたり、少数の熱電素子
と、これら熱電素子の側面から保持する保持部材と、対
となる熱電素子の一端側同士を接続する電極とからなる
ブロック状のものとして形成されて、該熱電素子小モジ
ュールにおける各熱電素子の他端が基材の電気的配線に
機械的電気的に接続されているものとしたりすることが
できる。In this case, the thermoelectric element small module includes a pair of thermoelectric elements and an electrode for connecting one end of the pair of thermoelectric elements, and the other end of each thermoelectric element is electrically connected to the electric wiring of the base by mechanical electric. It is formed as a block-shaped member composed of a thermoelectric element, a small number of thermoelectric elements, a holding member that holds the thermoelectric elements from the side surfaces thereof, and an electrode that connects one end sides of the thermoelectric elements that form a pair. Thus, the other end of each thermoelectric element in the thermoelectric element small module may be mechanically and electrically connected to the electric wiring of the base material.
【００１０】熱電素子はその側面がポリイミド膜で覆わ
れているものが好ましく、熱電素子の基材と反対側にあ
って熱電素子間を電気的につないでいる電極は、湾曲部
を備えたものとしたり、板ばねとすることも好ましい。
また、電極が放熱部を備えたものとなっていることも好
ましい。The thermoelectric element preferably has a side surface covered with a polyimide film, and the electrode on the side opposite to the base of the thermoelectric element and electrically connecting the thermoelectric elements has a curved portion. Or a leaf spring.
It is also preferable that the electrode has a heat radiating portion.
【００１１】そして、熱電素子小モジュールの側方を柔
軟性を有する絶縁材料で埋めたり、熱電素子小モジュー
ルと基材との間にエポキシ系接着剤を充填したりするこ
とも好ましい。It is also preferable to fill the sides of the thermoelectric element small module with a flexible insulating material or to fill an epoxy adhesive between the thermoelectric element small module and the base material.
【００１２】放熱板を取り付けるにあたっては、各熱電
素子小モジュール毎にその基材と反対側の面に絶縁板を
介して放熱フィンを取りつけるとよい。In mounting the heat radiating plate, it is preferable to mount a heat radiating fin on an opposite surface of the thermoelectric element small module to the surface opposite to the base via an insulating plate.
【００１３】[0013]
【発明の実施の形態】以下本発明を実施の形態の一例に
基づいて詳述すると、図１に示す熱電素子モジュール
は、たとえばポリイミドからなる柔軟な絶縁フィルムで
ある基材２上に、熱電素子小モジュール１を多数（図示
例では３２個）配列して、エポキシ系の接着剤で熱電素
子小モジュール１と基材２とを接着したもので、各熱電
素子小モジュール１は、ｐ型とｎ型の複数個の熱電素子
１０を交互に銅製電極で直列接続したものをセラミック
基板１２，１２で挟んだもので、通常の熱電素子モジュ
ールと比較すれば、各熱電素子小モジュール１はたとえ
ばその大きさが５ｍｍ角で厚さ１ｍｍ程度のかなり小さ
いものとなっており、たとえば２５ｍｍｘ６０ｍｍｘ
０．１ｍｍ（厚さ）程度の大きさの柔軟な基材２上に接
着されたこれら熱電素子小モジュール１は、リード線３
１によって順次電気的に直列接続されている。図中３０
は終端部から引き出された電流入力用リード線である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to an embodiment. The thermoelectric element module shown in FIG. 1 has a thermoelectric element on a substrate 2 which is a flexible insulating film made of, for example, polyimide. A large number of small modules 1 (32 in the illustrated example) are arranged, and the thermoelectric element small modules 1 and the base material 2 are adhered to each other with an epoxy-based adhesive. A plurality of thermoelectric elements 10 are alternately connected in series with copper electrodes and sandwiched between ceramic substrates 12, and when compared with a normal thermoelectric element module, each thermoelectric element small module 1 has, for example, its size. Is about 5 mm square and about 1 mm thick, for example, 25 mm x 60 mm x
These thermoelectric element small modules 1 bonded on a flexible base material 2 having a size of about 0.1 mm (thickness)
1 are electrically connected in series. 30 in the figure
Is a current input lead wire drawn from the terminal end.
【００１４】熱電素子小モジュール１間の電気的接続
は、基材２に一体に設けた回路パターン２０によって行
ってもよい。図２及び図３にこの場合の一例を示す。た
とえばポリイミドからなる基材２には厚さ２５μｍ程度
の銅箔で回路パターン２０を形成し、その上から回路パ
ターン２０を保護するポリイミド膜２２をコートする。
この上に熱電素子小モジュール１を接着し、ポリイミド
膜２２に設けた開口部２３に半田３３を流し込むこと
で、熱電素子小モジュール１から引き出したリード線３
２と回路パターン２０とを接続する。The electrical connection between the thermoelectric element small modules 1 may be made by a circuit pattern 20 integrally provided on the base material 2. 2 and 3 show an example of this case. For example, a circuit pattern 20 is formed on a substrate 2 made of polyimide with a copper foil having a thickness of about 25 μm, and a polyimide film 22 for protecting the circuit pattern 20 is coated thereon.
The thermoelectric element small module 1 is adhered thereon, and the solder 33 is poured into the opening 23 provided in the polyimide film 22 so that the lead wire 3 drawn out of the thermoelectric element small module 1 is formed.
2 and the circuit pattern 20 are connected.
【００１５】図３に他例を示す。これはｐ型とｎ型の２
個（一対）熱電素子１０，１０と、この両者を片側で接
続する電極１１で熱電素子小モジュール１を構成し、熱
電素子小モジュール１間の電気的接続（本来は電極によ
って行う）は、基材１に設けた回路パターン（電極）２
１によって行うようにしたものである。熱電素子１０と
回路パターン２１との接続は、基材２のポリイミド膜２
２に設けた開口部において半田３３で行う。セラミック
基板がないために安価で製作することができる上に、外
部への熱伝導性が良く、効率が良い。FIG. 3 shows another example. This is the p-type and n-type
The thermoelectric element small module 1 is composed of thermoelectric elements 10 (one pair) and the electrodes 11 connecting the two at one side, and the electrical connection between the thermoelectric element small modules 1 (originally performed by electrodes) is based on Circuit pattern (electrode) 2 provided on material 1
1 is performed. The connection between the thermoelectric element 10 and the circuit pattern 21 is made by the polyimide film 2
2 with solder 33 in the opening provided. Since there is no ceramic substrate, it can be manufactured at low cost, and has good thermal conductivity to the outside and high efficiency.
【００１６】この時、熱電素子１０の側面にポリイミド
膜１６をたとえば蒸着によってコーティング（厚さ０．
１ｍｍ程度）しておけば、導電素子１０間の電気絶縁性
が向上するとともに導電素子１０の強度も向上する。At this time, a polyimide film 16 is coated on the side surface of the thermoelectric element 10 by, for example, vapor deposition (having a thickness of 0.1 mm).
If it is set to about 1 mm, the electrical insulation between the conductive elements 10 is improved and the strength of the conductive elements 10 is also improved.
【００１７】熱電素子小モジュール１は、図５及び図６
に示すように、一対もしくは複数対の熱電素子１０の周
囲を保持部材１３で保持したブロック状のものとし、片
側においてのみ電極１１で対の熱電素子１０間の電気的
接続を行ったものとしてもよい。ブロック状の熱電素子
小モジュール１のサイズは、たとえば５ｍｍ角で厚さ２
ｍｍ程度のものとする。そして、ブロック状熱電素子小
モジュール１を基材２に接着固定するとともに電極であ
る回路パターン２１に熱電素子１０を半田３３で接続す
るのである。保持部材１３としては、熱硬化性樹脂やシ
リコンからなる絶縁性を備えたものを用いる。電気絶縁
性が向上する上に、保持部材１３で保持されているため
に、熱電素子小モジュール１の強度（熱電素子１０の強
度）が向上する。この保持部材１３で保持する場合にお
いても、図１６に示すように、熱電素子１０の側面をポ
リイミド膜１６で覆っておけば、保持部材１３と熱電素
子１０との密着力が向上する。The thermoelectric element small module 1 is shown in FIGS.
As shown in the figure, a pair or a plurality of pairs of thermoelectric elements 10 may be formed in a block shape in which the periphery is held by a holding member 13, and only one side may be electrically connected between the pair of thermoelectric elements 10 by the electrodes 11. Good. The size of the block-shaped thermoelectric element small module 1 is, for example, 5 mm square and 2 mm thick.
mm. Then, the block-shaped thermoelectric element small module 1 is bonded and fixed to the base material 2 and the thermoelectric element 10 is connected to the circuit pattern 21 as an electrode by solder 33. As the holding member 13, a member having an insulating property made of a thermosetting resin or silicon is used. The strength of the thermoelectric element small module 1 (strength of the thermoelectric element 10) is improved because the electrical insulation is improved and the thermoelectric element small module 1 is held by the holding member 13. Also in the case of holding with the holding member 13, as shown in FIG. 16, if the side surface of the thermoelectric element 10 is covered with the polyimide film 16, the adhesion between the holding member 13 and the thermoelectric element 10 is improved.
【００１８】熱電素子小モジュール１における電極１１
には、図８に示すように、湾曲部を備えているもの、あ
るいは図９に示すように、板ばねとなっているものを好
適に用いることができる。材質としては、厚さ０．１ｍ
ｍ程度の銅板が好適である。熱電素子小モジュール１は
その両面において柔軟性を有することになり、従って、
熱電素子モジュール全体としての柔軟性も向上するほ
か、基材２及び電極１１と熱電素子１０との電気的接続
性も向上する。Electrode 11 in thermoelectric element small module 1
As shown in FIG. 8, one having a curved portion or one having a leaf spring as shown in FIG. 9 can be suitably used. The material is 0.1m thick
A copper plate of about m is suitable. The thermoelectric element small module 1 will have flexibility on both sides, and therefore
The flexibility of the thermoelectric element module as a whole is improved, and the electrical connectivity between the base material 2 and the electrodes 11 and the thermoelectric element 10 is also improved.
【００１９】また、電極１１としては、図１０あるいは
図１１に示すように、放熱フィン部１４を一体に備えた
ものを用いてもよい。電極１１の放熱フィン部１４によ
る放熱により、モジュール特性が向上するものであり、
また、後述する別部材としての放熱フィンを用いる場合
に比して、絶縁板を介在させる必要がないために、放熱
性も向上する。As the electrode 11, as shown in FIG. 10 or 11, an electrode integrally provided with a radiation fin portion 14 may be used. The heat radiation by the radiation fins 14 of the electrodes 11 improves the module characteristics.
In addition, compared with the case of using a radiation fin as a separate member described later, there is no need to interpose an insulating plate, so that heat radiation is also improved.
【００２０】図１２に示したものは、柔軟な基材２上に
熱電素子小モジュール１を配するとともに、熱電素子小
モジュール１の周囲をシリコーン系の樹脂のような柔軟
性を有する絶縁材４で埋めたものを示している。絶縁材
料４が基材２と熱電素子１０との応力を分散させること
になるために、基材２（の回路パターン２１）と熱電素
子１０のとの間の電機接続性が向上する。FIG. 12 shows a thermoelectric element small module 1 arranged on a flexible base material 2 and a flexible insulating material 4 such as a silicone resin around the thermoelectric element small module 1. Indicates what was filled in. Since the insulating material 4 disperses the stress between the substrate 2 and the thermoelectric element 10, the electrical connection between the substrate 2 (the circuit pattern 21) and the thermoelectric element 10 is improved.
【００２１】保持部材１３を備えたブロック状熱電素子
小モジュール１は、図１３に示すように、基材２との間
にエポキシ系接着剤３５を注入しておくと、半田３３と
接着剤３５とで保持がなされることになるために熱電素
子小モジュール１と基材２との密着力が向上する。As shown in FIG. 13, the block type thermoelectric element small module 1 having the holding member 13 is provided with an epoxy-based adhesive 35 between the substrate 2 and the solder 33 and the adhesive 35. Therefore, the adhesion between the small thermoelectric element module 1 and the base material 2 is improved.
【００２２】図１４に示すように、絶縁材料４とエポキ
シ系接着剤３５とを併用してもよいのはもちろんであ
る。As shown in FIG. 14, the insulating material 4 and the epoxy adhesive 35 may be used in combination.
【００２３】アルミニウム製などの別部材としての放熱
フィン１４を設ける場合は、図１５に示すように、放熱
フィン１４を熱電素子小モジュール１に合わせた大きさ
のものとして、各熱電素子小モジュール１毎に絶縁板で
あるセラミック板１２を介して放熱フィン１４を取り付
けるとよい。各熱電素子小モジュール１毎に放熱フィン
１４が取りつけられているために、放熱フィン１４が熱
電素子モジュールの柔軟性を大きく損なってしまうこと
がない。In the case where the heat radiation fins 14 as separate members made of aluminum or the like are provided, as shown in FIG. It is preferable to attach the radiation fins 14 via the ceramic plate 12 which is an insulating plate every time. Since the radiation fins 14 are attached to each thermoelectric element small module 1, the radiation fins 14 do not significantly impair the flexibility of the thermoelectric element module.
【００２４】[0024]
【発明の効果】以上のように本発明においては、複数個
の熱電素子を電気的に接続して構成した熱電素子モジュ
ールにおいて、複数の小型熱電素子小モジュールの熱移
送面の一方の面側だけを柔軟性を有する基材で保持する
とともに、各熱電素子小モジュールを電気的に直列に接
続しているために、基材部分のみが曲がって熱電素子の
他方側には曲げ応力がかからない状態を得ることができ
るものであり、このために曲率が大きい曲面へ密着化さ
せることができるとともに熱応力に対して強度アップを
図ることができる。As described above, according to the present invention, in a thermoelectric element module constituted by electrically connecting a plurality of thermoelectric elements, only one of the heat transfer surfaces of the plurality of small thermoelectric element small modules is provided. And the thermoelectric element small modules are electrically connected in series, so that only the base part is bent and no bending stress is applied to the other side of the thermoelectric element. Therefore, it can be brought into close contact with a curved surface having a large curvature, and the strength can be increased against thermal stress.
【００２５】基材が電気的配線を備えており、該電気的
配線により複数の熱電素子小モジュールの電気的接続が
なされているものとしておけば、配線が容易となるとと
もにモジュールの小型化が可能となる。If the substrate is provided with electric wiring, and the electric wiring is used to electrically connect a plurality of small thermoelectric element modules, the wiring becomes easy and the module can be downsized. Becomes
【００２６】この場合、熱電素子小モジュールは、対の
熱電素子と対の熱電素子の一端側同士を接続する電極と
からなり、各熱電素子の他端が基材の電気的配線に機械
的電気的に接続されたものとすれば、セラミック基板が
不要となって安価に提供できる上に、外部への熱伝導性
も向上させることができる。また、熱電素子小モジュー
ルを少数の熱電素子と、これら熱電素子の側面から保持
する保持部材と、対となる熱電素子の一端側同士を接続
する電極とからなるブロック状のものとして形成して、
該熱電素子小モジュールにおける各熱電素子の他端が基
材の電気的配線に機械的電気的に接続されているものと
することで、保持部材によって絶縁性の向上を図ること
ができるほか、熱電素子強度も向上する。In this case, the thermoelectric element small module comprises a pair of thermoelectric elements and an electrode for connecting one end of the pair of thermoelectric elements, and the other end of each thermoelectric element is electrically connected to the electric wiring of the substrate by mechanical electric. If they are electrically connected, a ceramic substrate is not required and can be provided at low cost, and the thermal conductivity to the outside can be improved. In addition, the thermoelectric element small module is formed as a block-shaped one including a small number of thermoelectric elements, a holding member that holds the thermoelectric elements from the side surfaces thereof, and an electrode that connects one end side of the thermoelectric elements that form a pair,
Since the other end of each thermoelectric element in the thermoelectric element small module is mechanically and electrically connected to the electric wiring of the base material, the insulation can be improved by the holding member, and the thermoelectric element can be improved. The element strength is also improved.
【００２７】熱電素子はその側面がポリイミド膜で覆わ
れていると、やはり絶縁性が向上する。保持部材でブロ
ック状熱電素子小モジュールを構成するものにおいて
は、保持部材と熱電素子との密着力が向上する。When the side surface of the thermoelectric element is covered with the polyimide film, the insulation is also improved. When the block-shaped thermoelectric element small module is constituted by the holding member, the adhesion between the holding member and the thermoelectric element is improved.
【００２８】熱電素子の基材と反対側にあって熱電素子
間を電気的につないでいる電極は、湾曲部を備えたもの
としたり、板ばねとしておくと、モジュールの柔軟性が
さらに向上するほか、基材及び電極と熱電素子との電気
的接続性が向上する。If the electrodes on the opposite side of the thermoelectric element from the base and electrically connecting the thermoelectric elements are provided with a curved portion or as leaf springs, the flexibility of the module is further improved. In addition, the electrical connectivity between the substrate and the electrode and the thermoelectric element is improved.
【００２９】また、電極が放熱部を備えたものとなって
おれば、モジュールの柔軟性を損なうことなく放熱によ
るモジュール特性の向上を得ることができる。Further, if the electrodes are provided with a heat radiating portion, the module characteristics can be improved by heat radiation without impairing the flexibility of the module.
【００３０】そして、熱電素子もしくはブロック状熱電
素子小モジュールの側方を柔軟性を有する絶縁材料で埋
めたり、ブロック状熱電素子小モジュールと基材との間
にエポキシ系接着剤を充填したりすれば、絶縁材料によ
る応力の分担で基材と熱電素子との電気接続性が向上
し、また接着剤の硬化時の凝縮で熱電素子小モジュール
と基材との密着力が向上する。Then, the side of the thermoelectric element or the block-shaped thermoelectric element small module is filled with an insulating material having flexibility, or an epoxy adhesive is filled between the block-shaped thermoelectric element small module and the base material. For example, the electrical connection between the base material and the thermoelectric element is improved by sharing the stress by the insulating material, and the adhesion between the small thermoelectric element module and the base material is improved by condensation during curing of the adhesive.
【００３１】放熱板を取り付けるにあたっては、各ブロ
ック状熱電素子小モジュール毎にその基材と反対側の面
に絶縁板を介して放熱フィンを取りつけることで、柔軟
性を損なうことなく放熱特性を向上させることができ
る。When attaching the heat radiating plate, a heat radiating fin is attached to the surface of the small thermoelectric element small module via the insulating plate on the surface opposite to the base material so that the heat radiating characteristics are improved without impairing the flexibility. Can be done.
【図１】本発明の実施の形態の一例を示すもので、(a)
は斜視図、(b)は部分平面図である。FIG. 1 shows an example of an embodiment of the present invention, in which (a)
Is a perspective view, and (b) is a partial plan view.
【図２】他例における基材を示すもので、(a)は平面
図、(b)は断面図である。FIGS. 2A and 2B show a substrate in another example, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view.
【図３】同上の断面図である。FIG. 3 is a sectional view of the above.
【図４】さらに他例を示すもので、(a)は斜視図、(b)は
断面図である。FIGS. 4A and 4B show still another example, wherein FIG. 4A is a perspective view and FIG. 4B is a sectional view.
【図５】別の例を示すもので、(a)は基材の平面図、(b)
はブロック状熱電素子小モジュールの斜視図である。5 shows another example, (a) is a plan view of a base material, (b)
FIG. 3 is a perspective view of a block-shaped thermoelectric element small module.
【図６】(a)は同上の斜視図、(b)は同上の断面図であ
る。6A is a perspective view of the same, and FIG. 6B is a cross-sectional view of the same.
【図７】さらに別の例を示すもので、(a)は部分斜視
図、(b)は熱電素子の水平断面図である。7A and 7B show still another example, in which FIG. 7A is a partial perspective view, and FIG. 7B is a horizontal sectional view of a thermoelectric element.
【図８】他例の部分斜視図である。FIG. 8 is a partial perspective view of another example.
【図９】さらに他例の部分斜視図である。FIG. 9 is a partial perspective view of still another example.
【図１０】異なる例を示すもので、(a)は斜視図、(b)は
断面図である。10A and 10B show different examples, in which FIG. 10A is a perspective view and FIG. 10B is a cross-sectional view.
【図１１】同上の他例を示すもので、(a)は斜視図、(b)
は断面図である。11 shows another example of the above, wherein (a) is a perspective view and (b)
Is a sectional view.
【図１２】別の例を示すもので、(a)は斜視図、(b)は断
面図である。FIGS. 12A and 12B show another example, in which FIG. 12A is a perspective view and FIG. 12B is a sectional view.
【図１３】さらに別の例を示すもので、(a)は斜視図、
(b)は断面図である。FIG. 13 shows still another example, in which (a) is a perspective view,
(b) is a sectional view.
【図１４】他例の断面図である。FIG. 14 is a sectional view of another example.
【図１５】別の例の分解斜視図である。FIG. 15 is an exploded perspective view of another example.
【図１６】さらに別の例を示すもので、(a)は斜視図、
(b)は熱電素子の斜視図である。FIG. 16 shows still another example, in which (a) is a perspective view,
(b) is a perspective view of the thermoelectric element.
１ 熱電素子小モジュール ２ 基材 １０ 熱電素子 DESCRIPTION OF SYMBOLS 1 Thermoelectric element small module 2 Substrate 10 Thermoelectric element
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１１年７月１９日（１９９９．７．１
９）[Submission date] July 19, 1999 (1999.7.1)
9)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項１１[Correction target item name] Claim 11
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２０[Correction target item name] 0020
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００２０】図１２に示したものは、柔軟な基材２上に
熱電素子小モジュール１を配するとともに、熱電素子小
モジュール１の周囲をシリコーン系の樹脂のような柔軟
性を有する絶縁材４で埋めたものを示している。絶縁材
料４が基材２と熱電素子１０との応力を分散させること
になるために、基材２（の回路パターン２１）と熱電素
子１０のとの間の電気接続性が向上する。FIG. 12 shows a thermoelectric element small module 1 arranged on a flexible base material 2 and a flexible insulating material 4 such as a silicone resin around the thermoelectric element small module 1. Indicates what was filled in. Since the insulating material 4 disperses the stress between the base 2 and the thermoelectric element 10, the electrical connectivity between the (the circuit pattern 21) of the base 2 and the thermoelectric element 10 is improved.
Claims (13)
成した熱電素子モジュールであって、複数の小型熱電素
子小モジュールの熱移送面の一方の面側だけを柔軟性を
有する基材で保持するとともに、各熱電素子小モジュー
ルを電気的に直列に接続していることを特徴とする熱電
素子モジュール。1. A thermoelectric element module configured by electrically connecting a plurality of thermoelectric elements, wherein only one surface of a heat transfer surface of the plurality of small thermoelectric element small modules has flexibility. And a thermoelectric element module, wherein each thermoelectric element small module is electrically connected in series.
的配線により複数の熱電素子小モジュールの電気的接続
がなされていることを特徴とする請求項１記載の熱電素
子モジュール。2. The thermoelectric element module according to claim 1, wherein the substrate has an electric wiring, and the electric wiring connects the plurality of thermoelectric element small modules electrically.
と対の熱電素子の一端側同士を接続する電極とからな
り、各熱電素子の他端が基材の電気的配線に機械的電気
的に接続されていることをことを特徴とする請求項２記
載の熱電素子モジュール。3. The thermoelectric element small module comprises a pair of thermoelectric elements and an electrode connecting one end sides of the pair of thermoelectric elements, and the other end of each thermoelectric element is connected to an electric wiring of a base member by mechanical electric connection. The thermoelectric element module according to claim 2, wherein the thermoelectric element module is connected to the thermoelectric element module.
子と、これら熱電素子の側面から保持する保持部材と、
対となる熱電素子の一端側同士を接続する電極とからな
るブロック状のものとして形成されて、該熱電素子小モ
ジュールにおける各熱電素子の他端が基材の電気的配線
に機械的電気的に接続されていることを特徴とする請求
項２記載の熱電素子モジュール。4. The thermoelectric element small module includes a small number of thermoelectric elements, a holding member that holds the thermoelectric elements from side surfaces thereof,
The thermoelectric element is formed as a block composed of an electrode connecting one end side of the thermoelectric element to be paired, and the other end of each thermoelectric element in the thermoelectric element small module is mechanically and electrically connected to the electric wiring of the base material. The thermoelectric element module according to claim 2, wherein the thermoelectric element module is connected.
われていることを特徴とする請求項３記載の熱電素子モ
ジュール。5. The thermoelectric element module according to claim 3, wherein a side surface of the thermoelectric element is covered with a polyimide film.
子間を電気的につないでいる電極が湾曲部を備えたもの
であることを特徴とする請求項３記載の熱電素子モジュ
ール。6. The thermoelectric element module according to claim 3, wherein the electrode on the opposite side of the thermoelectric element from the base and electrically connecting the thermoelectric elements has a curved portion.
子間を電気的につないでいる電極が板ばねであることを
特徴とする請求項３記載の熱電素子モジュール。7. The thermoelectric element module according to claim 3, wherein the electrode on the opposite side of the thermoelectric element from the base and electrically connecting the thermoelectric elements is a leaf spring.
子間を電気的につないでいる電極が放熱部を備えたもの
であることを特徴とする請求項３または４記載の熱電素
子モジュール。8. The thermoelectric element according to claim 3, wherein an electrode on a side opposite to the base of the thermoelectric element and electrically connecting the thermoelectric elements has a heat radiating portion. module.
有する絶縁材料で埋めていることを特徴とする請求項３
または４記載の熱電素子モジュール。9. The thermoelectric element small module is filled with a flexible insulating material on the sides.
Or the thermoelectric element module according to 4.
エポキシ系接着剤を充填していることを特徴とする請求
項４記載の熱電素子モジュール。10. The thermoelectric element module according to claim 4, wherein an epoxy adhesive is filled between the small thermoelectric element module and the base material.
性を有する絶縁材料で埋めていることを特徴とする請求
項１０記載の熱電素子モジュール。11. The thermoelectric element module according to claim 10, wherein sides of the small thermoelectric element module are filled with a flexible insulating material.
と反対側の面に絶縁板を介して放熱フィンを取りつけて
いることを特徴とする請求項４記載の熱電素子モジュー
ル。12. The thermoelectric element module according to claim 4, wherein a radiation fin is attached to a surface of each small thermoelectric element module opposite to the base material via an insulating plate.
覆われていることを特徴とする請求項４記載の熱電素子
モジュール。13. The thermoelectric element module according to claim 4, wherein a side surface of the thermoelectric element is covered with a polyimide film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11045425A JP2000244024A (en) | 1999-02-23 | 1999-02-23 | Thermoelectric element module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11045425A JP2000244024A (en) | 1999-02-23 | 1999-02-23 | Thermoelectric element module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000244024A true JP2000244024A (en) | 2000-09-08 |
Family
ID=12718936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11045425A Pending JP2000244024A (en) | 1999-02-23 | 1999-02-23 | Thermoelectric element module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000244024A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003124531A (en) * | 2001-10-11 | 2003-04-25 | Komatsu Ltd | Thermoelectric module |
| WO2005117153A1 (en) * | 2004-05-31 | 2005-12-08 | Denso Corporation | Thermoelectric converter and its manufacturing method |
| WO2009093653A1 (en) * | 2008-01-24 | 2009-07-30 | Aruze Corp. | Thermoelectric conversion module and connector for thermoelectric conversion element |
| JP2010135643A (en) * | 2008-12-05 | 2010-06-17 | Toshiba Corp | Thermoelectric conversion device, thermoelectric power generation system, and thermoelectric power generation method |
| JP2014135455A (en) * | 2013-01-11 | 2014-07-24 | Fujitsu Ltd | Thermoelectric conversion element, electronic device, and method of manufacturing thermoelectric conversion element |
| US20150013740A1 (en) * | 2012-02-27 | 2015-01-15 | Kelk, Ltd. | Thermoelectric module, thermoelectric power generating apparatus, and thermoelectric generator |
| KR20150116187A (en) * | 2014-04-07 | 2015-10-15 | 홍익대학교 산학협력단 | Stretchable Thermoelectric Module |
| CN105406769A (en) * | 2015-12-11 | 2016-03-16 | 浙江大学 | Wearable type flexible temperature-difference power generation structure with stretchable wire |
| JP2016092017A (en) * | 2014-10-29 | 2016-05-23 | アイシン高丘株式会社 | Thermoelectric module |
| JP2017162862A (en) * | 2016-03-07 | 2017-09-14 | 古河機械金属株式会社 | Thermoelectric conversion device |
| US20200035898A1 (en) * | 2018-07-30 | 2020-01-30 | Gentherm Incorporated | Thermoelectric device having circuitry that facilitates manufacture |
| US11033058B2 (en) | 2014-11-14 | 2021-06-15 | Gentherm Incorporated | Heating and cooling technologies |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
| US11240883B2 (en) | 2014-02-14 | 2022-02-01 | Gentherm Incorporated | Conductive convective climate controlled seat |
| TWI790933B (en) * | 2022-03-02 | 2023-01-21 | 宏碁股份有限公司 | Thermoelectric cooling module |
| US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
| US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0529667A (en) * | 1991-07-19 | 1993-02-05 | Hitachi Ltd | Thermoelectric conversion module |
| JPH0621518A (en) * | 1991-08-02 | 1994-01-28 | Saamobonitsuku:Kk | Thermoelectric conversion element |
| JPH08228027A (en) * | 1994-12-22 | 1996-09-03 | Union Material Kk | Thermoelectric semiconductor element and manufacturing method thereof |
| JPH09181362A (en) * | 1995-12-26 | 1997-07-11 | Union Material Kk | Flexible thermoelectric device and cooler/heater employing it |
| JPH1168174A (en) * | 1997-08-13 | 1999-03-09 | Seru Appl Kk | Thermoelectric semiconductor chip and manufacturing thermoelectric module |
| JPH1187786A (en) * | 1997-09-08 | 1999-03-30 | Seru Appl Kk | Electron cooling/heating apparatus |
-
1999
- 1999-02-23 JP JP11045425A patent/JP2000244024A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0529667A (en) * | 1991-07-19 | 1993-02-05 | Hitachi Ltd | Thermoelectric conversion module |
| JPH0621518A (en) * | 1991-08-02 | 1994-01-28 | Saamobonitsuku:Kk | Thermoelectric conversion element |
| JPH08228027A (en) * | 1994-12-22 | 1996-09-03 | Union Material Kk | Thermoelectric semiconductor element and manufacturing method thereof |
| JPH09181362A (en) * | 1995-12-26 | 1997-07-11 | Union Material Kk | Flexible thermoelectric device and cooler/heater employing it |
| JPH1168174A (en) * | 1997-08-13 | 1999-03-09 | Seru Appl Kk | Thermoelectric semiconductor chip and manufacturing thermoelectric module |
| JPH1187786A (en) * | 1997-09-08 | 1999-03-30 | Seru Appl Kk | Electron cooling/heating apparatus |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003124531A (en) * | 2001-10-11 | 2003-04-25 | Komatsu Ltd | Thermoelectric module |
| WO2005117153A1 (en) * | 2004-05-31 | 2005-12-08 | Denso Corporation | Thermoelectric converter and its manufacturing method |
| WO2009093653A1 (en) * | 2008-01-24 | 2009-07-30 | Aruze Corp. | Thermoelectric conversion module and connector for thermoelectric conversion element |
| JP2009176919A (en) * | 2008-01-24 | 2009-08-06 | Aruze Corp | Thermoelectric conversion module, and connector for thermoelectric conversion element |
| JP2010135643A (en) * | 2008-12-05 | 2010-06-17 | Toshiba Corp | Thermoelectric conversion device, thermoelectric power generation system, and thermoelectric power generation method |
| US9793462B2 (en) * | 2012-02-27 | 2017-10-17 | Kelk Ltd. | Thermoelectric module, thermoelectric power generating apparatus, and thermoelectric generator |
| US20150013740A1 (en) * | 2012-02-27 | 2015-01-15 | Kelk, Ltd. | Thermoelectric module, thermoelectric power generating apparatus, and thermoelectric generator |
| JP2014135455A (en) * | 2013-01-11 | 2014-07-24 | Fujitsu Ltd | Thermoelectric conversion element, electronic device, and method of manufacturing thermoelectric conversion element |
| US11240882B2 (en) | 2014-02-14 | 2022-02-01 | Gentherm Incorporated | Conductive convective climate controlled seat |
| US11240883B2 (en) | 2014-02-14 | 2022-02-01 | Gentherm Incorporated | Conductive convective climate controlled seat |
| KR20150116187A (en) * | 2014-04-07 | 2015-10-15 | 홍익대학교 산학협력단 | Stretchable Thermoelectric Module |
| KR101580041B1 (en) | 2014-04-07 | 2015-12-23 | 홍익대학교 산학협력단 | Stretchable Thermoelectric Module |
| JP2016092017A (en) * | 2014-10-29 | 2016-05-23 | アイシン高丘株式会社 | Thermoelectric module |
| US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
| US11033058B2 (en) | 2014-11-14 | 2021-06-15 | Gentherm Incorporated | Heating and cooling technologies |
| US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
| CN105406769B (en) * | 2015-12-11 | 2017-11-24 | 浙江大学 | Wearable flexible thermo-electric generation structure with extending wire |
| CN105406769A (en) * | 2015-12-11 | 2016-03-16 | 浙江大学 | Wearable type flexible temperature-difference power generation structure with stretchable wire |
| JP2017162862A (en) * | 2016-03-07 | 2017-09-14 | 古河機械金属株式会社 | Thermoelectric conversion device |
| US20200035898A1 (en) * | 2018-07-30 | 2020-01-30 | Gentherm Incorporated | Thermoelectric device having circuitry that facilitates manufacture |
| US11223004B2 (en) | 2018-07-30 | 2022-01-11 | Gentherm Incorporated | Thermoelectric device having a polymeric coating |
| US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
| US10991869B2 (en) | 2018-07-30 | 2021-04-27 | Gentherm Incorporated | Thermoelectric device having a plurality of sealing materials |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
| TWI790933B (en) * | 2022-03-02 | 2023-01-21 | 宏碁股份有限公司 | Thermoelectric cooling module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000244024A (en) | Thermoelectric element module | |
| KR0145275B1 (en) | Repairable electronic circuit package | |
| KR100343386B1 (en) | Thermoelectric module with improved heat-transfer efficiency and method of manufacturing the same | |
| US5386341A (en) | Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape | |
| US6881071B2 (en) | Power semiconductor module with pressure contact means | |
| JPH09306954A (en) | Semiconductor device, mounting thereof and mounting structure | |
| CN104066290A (en) | Housing And Power Module Having The Same | |
| WO2011043493A1 (en) | Semiconductor device | |
| JP2003142739A (en) | Thermoelectric device | |
| KR100990527B1 (en) | Power semiconductor module with base plate resistant to bending | |
| JP2001007411A (en) | Thermoelectric element module | |
| JPH05259334A (en) | Semiconductor device | |
| USRE37416E1 (en) | Method for manufacturing a modular semiconductor power device | |
| JP4238700B2 (en) | Method for manufacturing circuit structure | |
| JPH0834278B2 (en) | Semiconductor chip carrier device | |
| JP2005101489A (en) | Press contact type semiconductor device | |
| KR101388492B1 (en) | Skeleton type thermoelectric module manufacture method and thermoelectric unit having skeleton type thermoelectric module and manufacture method thereof | |
| US7719095B2 (en) | Lead frame and semiconductor device provided with lead frame | |
| US6198161B1 (en) | Semiconductor device | |
| JP3404841B2 (en) | Thermoelectric converter | |
| JP3813180B2 (en) | Current connections for power semiconductor devices | |
| JP2588502B2 (en) | Thermo module | |
| JP2003318455A (en) | Peltier element and its manufacturing method | |
| JPH11251186A (en) | Stacked ceramic capacitor | |
| JP2002344177A (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040601 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040802 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050816 |