JP2000198065A - Polishing method of thin disc-shaped work - Google Patents
Polishing method of thin disc-shaped workInfo
- Publication number
- JP2000198065A JP2000198065A JP382999A JP382999A JP2000198065A JP 2000198065 A JP2000198065 A JP 2000198065A JP 382999 A JP382999 A JP 382999A JP 382999 A JP382999 A JP 382999A JP 2000198065 A JP2000198065 A JP 2000198065A
- Authority
- JP
- Japan
- Prior art keywords
- work
- polishing
- carrier
- end surface
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】 本発明は、薄板円盤状ワー
クの研磨方法、詳しくは、薄板円盤状ワークの両面およ
び端面を同時に研磨する方法に関する。The present invention relates to a method for polishing a thin disk-shaped work, and more particularly, to a method for simultaneously polishing both surfaces and end faces of a thin disk-shaped work.
【０００２】[0002]
【従来の技術】 現在薄板円盤状ワークの両面および端
面の研磨には、薄板円盤状ワークの両面を先ず研磨し
て、両面の鏡面研磨終了後に端面を鏡面研磨する方法が
採用されている。薄板円盤状ワークの両面を研磨する方
法としては、平行する定盤の間にワーク保持用のキャリ
アとそのキャリアに保持されるワークを挿入し、研磨液
をその定盤の間に流し、圧力を付加しながら定盤を回転
させることにより、両面が鏡面なワークを製造する方法
が知られている。また、薄板円盤状ワークの端面の研磨
方法としては、研磨用パッドが貼られた高速回転するド
ラムに研磨剤を流しつつ、ワークの端面を押付け研磨す
ることにより、ワーク端面を鏡面に研磨する方法が知ら
れている。しかし、現在採用されている方法では、両面
の研磨と端面の研磨を別々の装置を用いて、それぞれ独
立した工程として行われているために、コストが高いと
いう問題がある。2. Description of the Related Art At present, for polishing both sides and end faces of a thin disk-shaped work, a method is employed in which both sides of a thin disk-shaped work are first polished, and after mirror polishing of both sides is completed, the end faces are mirror-polished. As a method of polishing both surfaces of a thin disk-shaped work, a carrier for holding a work and a work held by the carrier are inserted between parallel platens, a polishing liquid is flowed between the platens, and a pressure is applied. 2. Description of the Related Art There is known a method of manufacturing a work having mirror surfaces on both sides by rotating a surface plate while adding. Further, as a method of polishing the end surface of the thin disk-shaped work, a method of polishing the end surface of the work to a mirror surface by pressing and polishing the end surface of the work while flowing an abrasive to a high-speed rotating drum on which a polishing pad is stuck. It has been known. However, the currently employed method has a problem in that the polishing is expensive because the polishing of both surfaces and the polishing of the end surface are performed as independent processes using separate apparatuses.
【０００３】[0003]
【発明が解決しようとする課題】 本発明は、現在採用
されている研磨工程におけるコスト高に鑑みてなされた
ものであり、その目的とするところは、両面の研磨と端
面の研磨を同時に行うことにより、工程数を減少させ、
生産コストを低減させることができる研磨方法、および
同方法に使用するワーク保持用のキャリアを提供するこ
とにある。SUMMARY OF THE INVENTION The present invention has been made in view of the high cost of the currently employed polishing process, and has as its object to simultaneously perform polishing of both surfaces and polishing of end surfaces. Reduces the number of processes,
An object of the present invention is to provide a polishing method capable of reducing the production cost, and a work holding carrier used in the polishing method.
【０００４】[0004]
【課題を解決するための手段】 本発明はかかる現状に
鑑みてなされたもので、上記の課題を解決すべく種々検
討の結果、ワークを保持するキャリアホール部の内周面
に装着された樹脂製リング状のワーク保護部のワークに
当接する部分の形状を研磨終了後のワークの端面と同一
の形状を有する窪み部を設けた形状としたワーク保持用
キャリアを用いて、薄板円盤状ワークの両面および端面
を同時に研磨することにより上記の課題を解決できるこ
とを見いだし本発明を完成させたものである。即ち、本
発明によれば、ワークを保持するキャリアのホール部の
内周面に装着された樹脂製リング状のワーク保護部のワ
ークに当接する部分の形状を研磨終了後のワークの端面
と同一の形状を有する窪み部を設けた形状としたワーク
保持用キャリア、およびワークを保持するキャリアに装
着された樹脂製のワーク保護部のワークに当接する部分
の形状を研磨終了後のワークの端面と同一の形状を有す
る窪み部を設けた形状としたワーク保持用キャリアを用
いて、薄板円盤状ワークの両面および端面を同時に研磨
する方法が提供される。Means for Solving the Problems The present invention has been made in view of such circumstances, and as a result of various studies to solve the above-mentioned problems, it has been found that a resin mounted on an inner peripheral surface of a carrier hole portion for holding a work is provided. Using a work holding carrier in which the shape of the portion of the ring-shaped work protection part that contacts the work is provided with a recess having the same shape as the end face of the work after polishing is completed, the thin disk-shaped work is formed. The inventors have found that the above problem can be solved by polishing both surfaces and end surfaces simultaneously, and have completed the present invention. That is, according to the present invention, the shape of the portion of the resin ring-shaped work protection portion abutting on the work, which is mounted on the inner peripheral surface of the hole portion of the carrier holding the work, is the same as the end surface of the work after polishing is completed. The work holding carrier having a shape having a recess having the shape of the above, and the shape of a portion of the resin work protection portion attached to the carrier that holds the work that comes into contact with the work is an end surface of the work after polishing is finished. Provided is a method for simultaneously polishing both surfaces and an end surface of a thin disk-shaped work by using a work holding carrier having a shape provided with a recess having the same shape.
【０００５】[0005]
【発明の実施の形態】 より詳しくは、本発明によれ
ば、平行する上下２枚の定盤の間にワーク保持用のキャ
リアのホール部にワークを挿入、保持したキャリアを保
持し、研磨液をその定盤の間に流しながら、ワークに圧
力を付加しながら両定盤を回転させる方法において、使
用されるワーク保持用キャリアホール部の内周部に装着
されるワーク保護用の樹脂製リングのワーク端面に当接
する部分の形状を鏡面研磨後のワークの端面の形状とす
ることにより、ワークの自転と研摩布からくる摩擦力の
反作用により、ワークの両面の研磨と端面の研磨を同時
に行う方法、および同方法に使用するワーク保持用のキ
ャリアが提供される。More specifically, according to the present invention, a work is inserted into a hole of a work holding carrier between two upper and lower platens in parallel, and the held carrier is held, and a polishing liquid In the method of rotating both the platens while applying pressure to the work while flowing the liquid between the platens, a resin ring for protecting the work mounted on the inner peripheral portion of the work holding carrier hole used. By making the shape of the part in contact with the end face of the workpiece the shape of the end face of the workpiece after mirror polishing, the two sides of the workpiece and the end face are simultaneously polished by the reaction of the rotation of the workpiece and the frictional force coming from the polishing cloth. A method and a carrier for holding a workpiece used in the method are provided.
【０００６】 以下、本発明の第１の側面である薄板円
盤状ワークの両面と端面とを同時に研磨する研磨方法に
ついて詳述する。研磨用パッドを貼り付けした平行する
定盤の間に以下に詳述する形状を有するワーク保持用の
キャリアとそのキャリアのホール部に保持されたワーク
を同時に挿入し、研磨液を両定盤の間に流しながら、ワ
ークに圧力を付加しながら両定盤を回転させながら研磨
する。研磨に際しては、先ずワークをワーク保持用のキ
ャリアに予め設けられたワークの外径より若干大きい直
径を有するキャリアホール部に収納する。ワークの端面
に当接するキャリアホール部の内周部の壁面には、ワー
ク端面に当接する部分の形状が鏡面研磨後のワーク端面
の形状と同一に加工成形された樹脂製のワーク保護用の
リングが嵌め込まれている。また、樹脂製リングの内
径、即ち、ワークと当接する側の直径はワークの直径よ
り若干大きく、ワークと樹脂製リングの内周面との間に
は＋０，１ｍｍから＋６ｍｍの範囲の遊びがあることが
好ましい。この遊びがないと研磨中にワ−クがこの樹脂
製のリングと激しく衝突しあい、ワークが破損すること
となるので充分注意することが必要である。研磨操作の
条件は、ワークを両面研磨する際の条件と基本的には同
じである。Hereinafter, a polishing method for simultaneously polishing both surfaces and an end surface of a thin disk-shaped work according to a first aspect of the present invention will be described in detail. A work holding carrier having a shape described in detail below and a work held in a hole portion of the carrier are simultaneously inserted between parallel surface plates to which a polishing pad is attached, and a polishing liquid is applied to both surface plates. Polishing while rotating both platens while applying pressure to the work while flowing in between. At the time of polishing, the work is first stored in a carrier hole having a diameter slightly larger than the outer diameter of the work provided in advance in the work holding carrier. On the inner peripheral wall surface of the carrier hole that abuts the end surface of the work, a resin work protection ring made by processing and shaping the shape of the part that abuts the work end surface to be the same as the shape of the work end surface after mirror polishing Is fitted. Also, the inner diameter of the resin ring, that is, the diameter of the side in contact with the work, is slightly larger than the diameter of the work, and there is a play in the range of +0.1 mm to +6 mm between the work and the inner peripheral surface of the resin ring. Is preferred. If there is no play, the work violently collides with the resin ring during polishing, and the work will be damaged. The conditions for the polishing operation are basically the same as the conditions for polishing the work on both sides.
【０００７】 本発明の第２の側面にかかるワーク保持
用のキャリアについて説明する。本発明の第２の側面に
かかるワーク保持用のキャリアは、ワーク収納用のワー
クの外径より若干大きい直径を有するキャリアホール部
と、ワークの端面に当接するキャリアホール部の内周部
の壁面に装着された樹脂製のワーク保護用のリングであ
って、同リングは鏡面研磨後のワーク端面の形状と同一
に加工成形された形状を有するワーク端面に当接する部
分を備え、その内周面はワークの直径より若干大きく、
両者の間には＋０．１ｍｍから＋６ｍｍの範囲の遊びが
できる程度の差異を有する樹脂製リングから構成され
る。通常、このワーク保護用の樹脂製リングの材質は、
剛性およびリングの窪み部の成形の面からガラス繊維、
炭素繊維、アラミド繊維等を複合したエポキシ樹脂が好
ましく、研磨効率の点からは、ポリウレタン樹脂を含侵
させた不織布が好ましい。A carrier for holding a work according to a second aspect of the present invention will be described. According to a second aspect of the present invention, a carrier for holding a work includes a carrier hole having a diameter slightly larger than an outer diameter of the work for storing the work, and a wall surface of an inner peripheral portion of the carrier hole abutting on an end surface of the work. A ring for protecting a work made of resin, which is provided with a portion abutting on a work end surface having the same shape as that of the work end surface after mirror polishing, and an inner peripheral surface thereof. Is slightly larger than the diameter of the workpiece,
The two are made of a resin ring having such a difference that a play in the range of +0.1 mm to +6 mm is possible. Normally, the material of the resin ring for protecting the work is
Glass fiber, in terms of rigidity and molding of the recess of the ring,
An epoxy resin in which carbon fibers, aramid fibers and the like are composited is preferable, and a nonwoven fabric impregnated with a polyurethane resin is preferable in terms of polishing efficiency.
【０００８】 上記のように、ワークをそのホール部に
保持したキャリアは研磨用パッドを貼り付した平行する
上下２枚の定盤の間に挟まれ、キャリア外周部に設けら
れた溝と研磨装置の内周部および外周部に設けられた駆
動装置により両定盤間で回転させられる。その時、両定
盤には予め設けられた研磨液用の通路から研磨液が供給
される。キャリアホール部内に保持されたワークは、定
盤の回転とキャリアの回転により自転しつつ、両面に当
接する研摩布とワーク間で発生する摩擦力により、ワー
クの端面がキャリアホール部の内周面に取り付けられた
樹脂製リングの鏡面研磨後のワークの端面部の形状を有
する当接部に押付けられ、これにより鏡面研磨されるこ
ととなる。かくして、研摩布又は樹脂に当接するワーク
の両面および端面は介在する研磨液により同時に鏡面に
されることとなる。As described above, the carrier holding the work in its hole is sandwiched between two parallel upper and lower platens to which the polishing pad is attached, and the groove provided on the outer periphery of the carrier and the polishing device Are rotated between both surface plates by driving devices provided on the inner and outer peripheral portions of the plate. At this time, the polishing liquid is supplied to both the platens from a polishing liquid passage provided in advance. The work held in the carrier hole rotates by the rotation of the platen and the carrier, and the frictional force generated between the abrasive cloth and the work that abuts on both sides causes the end face of the work to be in the inner peripheral surface of the carrier hole. The workpiece is pressed against a contact portion having the shape of the end face of the work after the mirror polishing of the resin ring attached to the resin ring, whereby the mirror polishing is performed. Thus, both surfaces and the end surface of the work which comes into contact with the polishing cloth or the resin are mirror-finished simultaneously by the intervening polishing liquid.
【０００９】 以下実施例を挙げて、更に本発明を説明
するが、本発明はこの実施例により何ら制限されるもの
ではないことはいうまでもない。Hereinafter, the present invention will be further described with reference to examples. However, it is needless to say that the present invention is not limited by these examples.
【実施例】 本発明の第２の側面に係るワーク収納用の
ワークの外径より若干大きい直径を有するキャリアホー
ル部と、ワークの端面に当接するキャリアホール部の内
周部の壁面に装着された樹脂製のワーク保護用のリング
であって、同リングは鏡面研磨後のワーク端面の形状と
同一に加工成形された形状を有するワーク端面に当接す
る部分を備え、その内周面はワークの直径より若干大き
く、両者の間には＋０．１ｍｍ程度の遊びを有する樹脂
製リングであるワーク保持用のキャリアを、同キャリア
のキャリアホール部に収納したワークと同時に研磨用パ
ッドを貼り付けした平行する定盤の間に挿入して、研磨
装置の準備をした。この様にして準備した研磨装置に研
磨液を常法に従い両定盤の間に流しながら、ワークに圧
力を付加しながら両定盤を回転させながらワークを研磨
した。ワークの端面に当接するキャリアホール部の内周
部の壁面には、ワーク端面に当接する部分の形状が鏡面
研磨後のワーク端面の形状と同一に加工成形された樹脂
製のワーク保護用のリングが嵌め込まれているので、ワ
ークの両面研磨とワークの端面の研磨が同時に行われる
こととなる。研磨終了後、ワークの端面とワークの両表
面の研磨状況を検査したが、端面と両表面を別々に研磨
したものと差異がない研磨状態であった。[Embodiment] A carrier hole having a diameter slightly larger than the outer diameter of a workpiece for accommodating a workpiece according to a second aspect of the present invention, and a wall mounted on an inner peripheral wall of the carrier hole abutting on an end face of the workpiece. A ring for protecting a workpiece made of a resin, the ring having a portion abutting on a workpiece end face having a shape processed and formed to be the same as the shape of the workpiece end face after mirror polishing, and an inner peripheral surface of the ring. A workpiece holding carrier, which is a resin ring slightly larger than the diameter and having a play of about +0.1 mm between the two, is accommodated in the carrier hole of the carrier. The polishing apparatus was prepared by inserting between polishing plates. The work was polished while applying a pressure to the work and rotating both the work tables while flowing the polishing liquid between the work tables in the polishing apparatus thus prepared in a conventional manner. On the inner peripheral wall surface of the carrier hole that abuts the end surface of the work, a resin work protection ring made by processing and shaping the shape of the part that abuts the work end surface to be the same as the shape of the work end surface after mirror polishing Is fitted, so that both-side polishing of the work and polishing of the end face of the work are performed simultaneously. After the completion of the polishing, the polishing condition of the end face of the work and both surfaces of the work was inspected.
【００１０】[0010]
【発明の効果】 以上の説明からも明らかなように、上
述のように構成されたキャリアを用いて研磨することに
より、ワークの両面の研磨と端面の研磨を単一の工程に
て同時に行うことができる。As is clear from the above description, by polishing using the carrier configured as described above, both sides of the work and polishing of the end face can be simultaneously performed in a single step. Can be.
【図１】 この発明に用いられる研磨装置の正面概略図
である。FIG. 1 is a schematic front view of a polishing apparatus used in the present invention.
【図２】 この発明に用いられるワーク保持用キャリア
の概略図である。FIG. 2 is a schematic view of a work holding carrier used in the present invention.
【図３】 ワーク保持用キャリアのワークに当接する部
分の断面概略図である。FIG. 3 is a schematic cross-sectional view of a portion of a work holding carrier that contacts a work.
１…上側定盤、２…ワーク保持用キャリア、３…下側定
盤、４…ワーク、５…樹脂製リング、６…ワーク端面
部。DESCRIPTION OF SYMBOLS 1 ... Upper surface plate, 2 ... Work holding carrier, 3 ... Lower surface plate, 4 ... Work, 5 ... Resin ring, 6 ... Work end surface part.
Claims (2)
内周面に装着された樹脂製リング状のワーク保護部のワ
ークに当接する部分の形状を研磨終了後のワークの端面
と同一の形状を有する窪み部を設けた形状としたワーク
保持用キャリア。1. A shape of a portion of a resin ring-shaped work protection portion mounted on an inner peripheral surface of a hole portion of a carrier for holding a work, the portion being in contact with the work, having the same shape as an end surface of the work after polishing is completed. A work holding carrier having a shape provided with a concave portion.
樹脂製のワーク保護部のワークに当接する部分の形状を
研磨終了後のワークの端面と同一の形状を有する窪み部
を設けた形状としたワーク保持用キャリアを用いて、薄
板円盤状ワークの両面および端面を同時に研磨する方
法。2. A shape of a portion of a resin work protection portion, which is mounted on a carrier for holding the work, which comes into contact with the work, is provided with a recess having the same shape as the end surface of the work after polishing. A method of simultaneously polishing both surfaces and end surfaces of a thin disk-shaped work using a work holding carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP382999A JP2000198065A (en) | 1999-01-11 | 1999-01-11 | Polishing method of thin disc-shaped work |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP382999A JP2000198065A (en) | 1999-01-11 | 1999-01-11 | Polishing method of thin disc-shaped work |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000198065A true JP2000198065A (en) | 2000-07-18 |
Family
ID=11568103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP382999A Withdrawn JP2000198065A (en) | 1999-01-11 | 1999-01-11 | Polishing method of thin disc-shaped work |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000198065A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010021086A1 (en) * | 2008-08-20 | 2010-02-25 | 信越半導体株式会社 | Carrier for dual-surface polishing device, and dual-surface polishing device and dual-surface polishing method using the same |
| JP2010280026A (en) * | 2009-06-03 | 2010-12-16 | Fujikoshi Mach Corp | Apparatus and method of double-side grinding |
-
1999
- 1999-01-11 JP JP382999A patent/JP2000198065A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010021086A1 (en) * | 2008-08-20 | 2010-02-25 | 信越半導体株式会社 | Carrier for dual-surface polishing device, and dual-surface polishing device and dual-surface polishing method using the same |
| JP2010050193A (en) * | 2008-08-20 | 2010-03-04 | Shin Etsu Handotai Co Ltd | Carrier for dual surface polishing device, dual surface polishing device and dual surface polishing method using the same |
| US8118646B2 (en) | 2008-08-20 | 2012-02-21 | Shin-Etsu Handotai Co., Ltd. | Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method |
| CN102124546B (en) * | 2008-08-20 | 2013-07-24 | 信越半导体股份有限公司 | Carrier for dual-surface polishing device, and dual-surface polishing device and dual-surface polishing method using the same |
| JP2010280026A (en) * | 2009-06-03 | 2010-12-16 | Fujikoshi Mach Corp | Apparatus and method of double-side grinding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20060404 |