JPS63144954A - Plane polishing device - Google Patents
Plane polishing deviceInfo
- Publication number
- JPS63144954A JPS63144954A JP61292213A JP29221386A JPS63144954A JP S63144954 A JPS63144954 A JP S63144954A JP 61292213 A JP61292213 A JP 61292213A JP 29221386 A JP29221386 A JP 29221386A JP S63144954 A JPS63144954 A JP S63144954A
- Authority
- JP
- Japan
- Prior art keywords
- work
- workpiece
- pressure
- pressure fluid
- pressure head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 10
- 239000012530 fluid Substances 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 208000027418 Wounds and injury Diseases 0.000 abstract 1
- 230000006378 damage Effects 0.000 abstract 1
- 208000014674 injury Diseases 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 8
- 241000257465 Echinoidea Species 0.000 description 2
- 101100491149 Caenorhabditis elegans lem-3 gene Proteins 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229940035289 tobi Drugs 0.000 description 1
- NLVFBUXFDBBNBW-PBSUHMDJSA-N tobramycin Chemical compound N[C@@H]1C[C@H](O)[C@@H](CN)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O[C@@H]2[C@@H]([C@@H](N)[C@H](O)[C@@H](CO)O2)O)[C@H](N)C[C@@H]1N NLVFBUXFDBBNBW-PBSUHMDJSA-N 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ワークの片面研磨に使用される平面研客装２
に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a surface polishing equipment 2 used for single-sided polishing of a workpiece.
It is related to.
［従来の技術］
従来、平面研磨！１ｉＺｔによって半導体ウニ！・、や
ガラスウニハ等のワークの片面を研磨する場合には ：
Ｆ４６図に示すように、加圧へ・・ド１のワーク取付面
にポリウレタンなどのパッド２を貼り付け、このパッド
２にワーク３を密着させるか、あるいは、上記パッド２
を貼り付けることなく、直接ワークを３加圧へラド１の
ワーク取付面に密着させて定盤４に押しつけるようにし
ていた。[Conventional technology] Conventionally, surface polishing! Semiconductor sea urchin by 1iZt!・When polishing one side of a workpiece such as a grinder or glass urchin:
As shown in Fig. F46, a pad 2 made of polyurethane or the like is pasted on the work mounting surface of the pressure do 1, and the work 3 is brought into close contact with this pad 2, or the pad 2 is
The workpiece was directly pressed against the surface plate 4 by applying pressure 3 to the workpiece mounting surface of the rad 1 without pasting it.
しかしながら、このように加圧へラド１でワーク３を直
接定盤４に圧填する方法では、加圧へラド１のワーク取
付面及びワーク背面の平面度が精度的に均一である必要
があり、それらの平面度が５いと、ワーク３と加圧ヘン
ト１との各接点で０面圧が一様でなくなるため、一様な
研磨ができなくなり、加工精度に、き影響を及ぼすこと
になる。However, in this method of directly pressing the workpiece 3 onto the surface plate 4 with the pressure rod 1, the flatness of the work mounting surface of the pressure rod 1 and the back of the workpiece must be precisely uniform. If their flatness is 5, the zero surface pressure will not be uniform at each contact point between the workpiece 3 and the pressure hent 1, making it impossible to polish uniformly, which will have a negative impact on machining accuracy. .
このことは、加圧へラドｌとワーク３との間にごみなど
の異物が介在する場合にも同様である。This also applies when foreign matter such as dust is present between the pressurizing rod 1 and the workpiece 3.
また、加圧ヘッド１とワーク３とが接触しているため、
ワー゛りに汚れや傷が付き易かった。In addition, since the pressure head 1 and the workpiece 3 are in contact with each other,
The work easily got dirty and scratched.
［発明が解決しようとする間ｍ点］
本発明の課ｍは、ワークに７Ｍ ｒＬ代り傷を生じるこ
となく 該ワークを一様な面王で定５に圧填させること
ができる平面研磨装置を提供することにある。[Point m to be solved by the invention] The m aspect of the present invention is to provide a surface polishing device that can compress a workpiece to a uniform surface without causing scratches on the workpiece. It is about providing.
［問題点を解決するための手段］
上記課題を解決するため１本発明は、加圧ヘッドにより
ワークを回転する定盤に押しつけて研磨するようにした
ものにおいて、上記加圧ヘッドとワークとの間に、加圧
媒体として圧力流体を介在させたことを特徴とするもの
である。[Means for Solving the Problems] In order to solve the above-mentioned problems, one aspect of the present invention is to polish a workpiece by pressing it against a rotating surface plate using a pressure head, in which the pressure head and the workpiece are polished. This is characterized in that a pressure fluid is interposed as a pressurizing medium in between.
［作 用］
ワークは加圧ヘッドにより圧力流体を介して定盤に押し
つけられ、その加工が行われる。このとき、圧力流体に
よる加圧力が、加圧ヘッドのワーク取付面及びワーク背
面の平面度とは無関係にワークの背面に均等に作用する
ため１該ワークの面圧は一様となり、該ワークは高い平
面度に仕上げられることになる。[Operation] The workpiece is pressed against the surface plate by the pressure head via pressure fluid, and the workpiece is processed. At this time, the pressurizing force from the pressure fluid acts equally on the back surface of the workpiece regardless of the flatness of the workpiece mounting surface of the pressurizing head and the backside of the workpiece, so the surface pressure on the workpiece becomes uniform, and the workpiece It will be finished with high flatness.
また、ワークが圧力流体を介してＩＪＩ接的に加圧ヘッ
ドと接触するため、その汚れや傷が発生しにくい。In addition, since the workpiece comes into direct contact with the pressure head through the pressure fluid, it is less likely to get dirty or scratched.
［実施例］
以下、本発明の実施例を図面に基づいて詳細に説明する
。[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.
第１図において、１０は回転自在の定盤、１１は該定盤
にワーク１２１圧接する加圧ヘッドを示している。In FIG. 1, the reference numeral 10 indicates a rotatable surface plate, and the reference numeral 11 indicates a pressure head that presses a workpiece 121 against the surface plate.
上記定盤１０は、図示しない駆動軸を介してモータ等の
駆動源に接続されており、また、加圧へラド１１は１図
示しないシリンダに昇降自在に取付けられ、該シリンダ
の作用力により、加圧媒体としての圧力流体を介してワ
ーク１２を定盤ｌＯに押しつけるもので、具体的には次
のように構成されている・。The surface plate 10 is connected to a drive source such as a motor via a drive shaft (not shown), and the pressurizing rod 11 is attached to a cylinder (not shown) so as to be able to move up and down, and by the acting force of the cylinder, The workpiece 12 is pressed against the surface plate 10 via a pressure fluid as a pressurizing medium, and specifically, it is configured as follows.
即ち、第２図及び第３図に詳細に示すように、上記加圧
ヘッド１１の下面には、その中央部にエアや液体などの
圧力流体を供給するための供給ポート１４が設けられる
と共に、該供給ポート！４を囲むように環状の溝１５が
形成され、該溝１５内に、合成樹脂性のワークホルダ１
Ｂがダイヤフラム１７により変位可能に取付けられてお
り、該ワークホルダ１６の下面内側に形成されたワーク
取付は用の段部１６ａには、中央部にスリット１９を備
えたシール部材１８が取付けられ、該スリット１３内に
複数の吸引孔２０が開口している。That is, as shown in detail in FIGS. 2 and 3, a supply port 14 for supplying pressure fluid such as air or liquid is provided at the center of the lower surface of the pressure head 11, and The supply port! An annular groove 15 is formed to surround the work holder 1 made of synthetic resin.
B is displaceably mounted by a diaphragm 17, and a sealing member 18 with a slit 19 in the center is mounted on a stepped portion 16a formed on the inside of the lower surface of the work holder 16 for mounting the workpiece. A plurality of suction holes 20 are opened in the slit 13.
上記吸引孔２０は、ワークホルダ１６内の通孔２３、加
圧へッドｌｌ内に収納されたチューブ２４、ロータリー
ジヨイント２５を介して真空ポンプ２Ｇに接続され、一
方上記供給ポート１４は、加圧ヘッド１１内に収納され
た別のチューブ２７．上記ロータリージヨイント２５を
介して圧力流体源２８に接続され、ワーク１２の加工時
や搬入時等に、上記吸引孔２０を通じてスリ７） １９
内のエアが吸引されることによりワーク１２が加圧へラ
ド１１に吸着保持され、また。The suction hole 20 is connected to the vacuum pump 2G via a through hole 23 in the work holder 16, a tube 24 housed in the pressurizing head 11, and a rotary joint 25, while the supply port 14 is Another tube 27 housed within the pressure head 11. It is connected to a pressure fluid source 28 via the rotary joint 25, and the pickpocket 7) 19 is connected to the pressure fluid source 28 through the suction hole 20 when processing or transporting the workpiece 12.
By suctioning the air inside, the workpiece 12 is suctioned and held by the pad 11 under pressure.
７−り１２の加工時に、加圧ヘンド１１とワーク１２と
の間に区画形成される空間３０内に供給ポート１４から
圧力流体が供給充填されることにより、該圧力流体を介
してワーク！２が定６＋ｏに圧接されるようになってい
乙。During machining of the 7-ri 12, pressure fluid is supplied and filled from the supply port 14 into the space 30 defined between the pressurizing hand 11 and the workpiece 12, so that the workpiece is removed via the pressure fluid. 2 is pressed against constant 6+o.
上記構成を有する本発明の平面研磨？を置において、ワ
ークホルダ１６の段部ｌｅａに嵌合されたワーク１２は
、吸引孔２０を通じて真空ポンプ２６で吸引されること
により該ワークホルダ１Ｂに吸着保持され、その状態の
まま回転する定ｍ１０に押しつけられ、その研磨加工が
行われる。このとき、加圧ヘッド＋１と７−りＩ２との
間の空ＭＩ３０には、圧力流体源２８から供給ポート１
４を通じて圧力流体が供給充填され、この圧力流体を加
圧媒体として該７−り１２が定盤１０に圧接される。従
って、ワーク１２の背面には、圧力流体による加圧力が
、加圧へ、ド１１のワーク取付面やワーク背面の平面度
とは無関係に均等に作用し、該ワーク１２の面圧は一様
となり、該ワーク１２は高い平面度に仕上げられること
になる。Surface polishing of the present invention having the above configuration? , the workpiece 12 fitted into the stepped portion lea of the workholder 16 is suctioned by the vacuum pump 26 through the suction hole 20 and held by the workpiece holder 1B, and rotates in that state at a constant m10. The polishing process is performed by pressing the At this time, the air MI30 between the pressure head +1 and the 7-way I2 is connected to the supply port 1 from the pressure fluid source 28.
Pressure fluid is supplied and filled through 4, and the 7-ri 12 is pressed against the surface plate 10 using this pressure fluid as a pressurizing medium. Therefore, the pressurizing force from the pressurized fluid acts uniformly on the back surface of the workpiece 12, regardless of the workpiece mounting surface of the door 11 and the flatness of the backside of the workpiece, and the surface pressure on the workpiece 12 is uniformly applied. Therefore, the workpiece 12 is finished with high flatness.
しかも、ワークホルダ１６がダイヤフラム１７により芝
土の自由度を持って支持されているため、ワーク１２と
加圧ヘッド１１とが正確に平行でない場合でも、それら
の誤差がワークホルダ１８の変位により吸収され、ワー
ク１２に偏った加圧力が作用することがなく、これと上
記圧力流体で加圧することとの相乗効果により、ワーク
が均一な加圧力で定盤に圧接されることになる。Moreover, since the work holder 16 is supported by the diaphragm 17 with a degree of freedom in the grass, even if the work 12 and the pressure head 11 are not exactly parallel, their errors are absorbed by the displacement of the work holder 18. Therefore, a biased pressing force is not applied to the workpiece 12, and due to the synergistic effect of this and pressurizing with the pressure fluid, the workpiece is pressed against the surface plate with a uniform pressing force.
また、上記の如く加工中にもエアチャックによりワーク
１２が吸着されているため、シール部材１８によるシー
ル効果が向上し、空間３０内の圧力流体の漏れが生じな
いばかりでなく、ワーク外周部分のばたつきが防止され
、加工精度が向上する。しかも、上記ダイヤプラム１７
により、加工中に該空間３０内あるいは溝１５内への砥
粒の侵入が防止される。In addition, since the workpiece 12 is adsorbed by the air chuck during processing as described above, the sealing effect of the sealing member 18 is improved, and not only does the leakage of the pressure fluid in the space 30 occur, but also the outer circumference of the workpiece Fluttering is prevented and machining accuracy is improved. Moreover, the above diaphragm 17
This prevents abrasive grains from entering into the space 30 or groove 15 during processing.
さらに、加圧ヘッド１とワーク１２の背面とが非接触で
あるため、該ワーク１２の背面に汚れや傷が付くことが
ない。Furthermore, since the pressure head 1 and the back surface of the workpiece 12 are not in contact with each other, the back surface of the workpiece 12 is not soiled or scratched.
加工が終了すると、空間３０への圧力流体の供給が停止
されると共に、ワーク１２がワークホルタ１８から開放
されて取り出される。When the machining is completed, the supply of pressure fluid to the space 30 is stopped, and the workpiece 12 is released from the workpiece holder 18 and taken out.
上記実施例では、加工中にもエアチャックによりワーク
１２を吸着させているが、ワークの形状やその運動軌跡
のとりがた等によっては、加工中にエアチャックしなく
ても、均一な平面加工精度が得られる。In the above embodiment, the workpiece 12 is adsorbed by the air chuck even during machining, but depending on the shape of the workpiece and the trajectory of its movement, uniform flat surface machining may be possible even without the air chuck during machining. Accuracy is obtained.
これを第４図ａ、ｂと第５３ａ、ｂとによって説明する
と、ワーク１２が、加工時に加圧ヘッド！１により第４
図ａ、ｂに示すような軌跡をとる場合、該ワーク１２は
、定ａ＋ｏからオーバーハングしながら回転し研老され
るので、加工中に該ワーク１２をエアチャックにより吸
着保持する必要があるが、第５図ａ、ｂに示すような軌
跡をとる場合には、該ワーク１２は常に定５ｉ１０上に
あるので、その外周部がばたつくことはなく、従って、
加工中に該ワーク！２をエアチャックにより加圧へラド
１１に吸着保持させておく必要がない。To explain this with reference to FIGS. 4a and 53b and 53a and 53b, when the workpiece 12 is processed by the pressure head! 1 by 4th
When the trajectory shown in Figures a and b is taken, the workpiece 12 rotates and grinds while overhanging from a constant a+o, so it is necessary to hold the workpiece 12 by suction with an air chuck during machining. , when taking a trajectory as shown in FIG.
The workpiece is being processed! 2 is not required to be suctioned and held by the Rad 11 under pressure using an air chuck.
こ発明の効果コ
このように１本発明によれば、加圧ヘッドとワークとの
間に加圧媒体として圧力流体を介在させ、この圧力流体
を介してワークを定盤に押しつけるようにしたので、ワ
ークを直接加圧ヘッドに取付ける場合と違い、該加圧ヘ
ッドのワーク取付面やワーク背面等の平面度とは無関係
に加圧力をワークの背面に均等に作用させることができ
、該ワークの面圧が一様となるため、該ワークを高い平
面度に仕上げることができる。Effects of the Invention As described above, according to the present invention, a pressure fluid is interposed as a pressurizing medium between the pressure head and the workpiece, and the workpiece is pressed against the surface plate via this pressure fluid. , unlike the case where the workpiece is directly attached to the pressure head, the pressure force can be applied evenly to the back surface of the workpiece regardless of the flatness of the workpiece mounting surface of the pressure head or the back surface of the workpiece. Since the surface pressure is uniform, the workpiece can be finished with high flatness.
また、加圧ヘッドとワークの背面とが非接触であるため
、該ワークの背面に汚れや傷が付くおそれがない。Furthermore, since the pressure head and the back surface of the workpiece are not in contact with each other, there is no risk of dirt or scratches on the back surface of the workpiece.
第１図は本発明の一実施例の要部断面図、第２図はその
部分拡大断面図、第３図はその下面図、第４図ａ、ｂは
加工時におけるワークの運動軌跡のとりがたについてＴ
＜’ を平面図及び部分平面図。
第５図ａ、ｂは他の運動軌跡のとりがたについて示す平
面図及び部分平面図、第６図は従来例の部分断面図であ
る。
１０・・定盤、 １１・・加圧ヘッダ。
１２・・ワーク。
特許出願人 スピードファム株式会社第１図
節６図
鳶
詔４図
（ａ）
（ｂ）
第５図
（Ｇ ）
（ｂ）
手続有ｎ正書（自発）
昭和８２年 １月１４日
特許庁長官 黒 １）明 雄 殿
２、発明の名称
平面研磨装置
３、補正をする者
事件との関係 特許出願人
住 所 東京都大田区西六郷４丁目３０番３号名 称
スピードファム株式会社
代表取締役 小 原 博
４、代 理 人 〒１６０ 電話（３４３） ８７５
５住 所 東京都新宿区西新宿１丁目９ ＠ １２号（
１）第２図を別紙の通り補正します。Fig. 1 is a sectional view of a main part of an embodiment of the present invention, Fig. 2 is a partially enlarged sectional view, Fig. 3 is a bottom view, and Figs. About rattle T
<' is a plan view and a partial plan view. FIGS. 5a and 5b are a plan view and a partial plan view showing other types of motion loci, and FIG. 6 is a partial sectional view of a conventional example. 10...Surface plate, 11...Pressure header. 12. Work. Patent applicant Speedfam Co., Ltd. Figure 1, Section 6, Tobi Edict, Figure 4 (a) (b) Figure 5 (G) (b) Procedural formal document (spontaneous) January 14, 1982 Commissioner of the Japan Patent Office Black 1) Akio Tono 2, Name of the invention Surface polishing device 3, Relationship to the case of the person making the amendment Patent applicant address 4-30-3 Nishirokugo, Ota-ku, Tokyo Name
Speedfam Co., Ltd. Representative Director Hiroshi Ohara 4, Agent 160 Telephone (343) 875
5 Address: 1-9 Nishi-Shinjuku, Shinjuku-ku, Tokyo @ No. 12 (
1) Correct Figure 2 as shown in the attached sheet.
Claims (1)
て研磨するようにしたものにおいて、上記加圧ヘッドと
ワークとの間に、加圧媒体として圧力流体を介在させた
ことを特徴とする平面研磨装置。1. A flat surface in which a workpiece is polished by being pressed against a rotating surface plate by a pressure head, characterized in that a pressure fluid is interposed as a pressure medium between the pressure head and the workpiece. Polishing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61292213A JPH0767665B2 (en) | 1986-12-08 | 1986-12-08 | Flat polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61292213A JPH0767665B2 (en) | 1986-12-08 | 1986-12-08 | Flat polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63144954A true JPS63144954A (en) | 1988-06-17 |
| JPH0767665B2 JPH0767665B2 (en) | 1995-07-26 |
Family
ID=17778979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61292213A Expired - Fee Related JPH0767665B2 (en) | 1986-12-08 | 1986-12-08 | Flat polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0767665B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02232159A (en) * | 1989-03-03 | 1990-09-14 | Speedfam Co Ltd | Method and device for surface polishing |
| JPH02243263A (en) * | 1989-03-16 | 1990-09-27 | Hitachi Ltd | Polishing device |
| JPH08267357A (en) * | 1995-03-31 | 1996-10-15 | Nec Corp | Abrasive device of substrate and abrasive method thereof |
| JPH08339979A (en) * | 1995-04-10 | 1996-12-24 | Matsushita Electric Ind Co Ltd | Holder for substrate to be polished and polishing method for substrate |
| US5791973A (en) * | 1995-04-10 | 1998-08-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus for holding substrate to be polished and apparatus and method for polishing substrate |
| GB2336555B (en) * | 1998-04-20 | 2000-08-30 | Nec Corp | Polishing apparatus |
| US7101261B2 (en) | 1995-06-09 | 2006-09-05 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5444299A (en) * | 1977-09-13 | 1979-04-07 | Uingoo Kk | Grinding method and apparatus |
-
1986
- 1986-12-08 JP JP61292213A patent/JPH0767665B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5444299A (en) * | 1977-09-13 | 1979-04-07 | Uingoo Kk | Grinding method and apparatus |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02232159A (en) * | 1989-03-03 | 1990-09-14 | Speedfam Co Ltd | Method and device for surface polishing |
| JPH02243263A (en) * | 1989-03-16 | 1990-09-27 | Hitachi Ltd | Polishing device |
| JPH08267357A (en) * | 1995-03-31 | 1996-10-15 | Nec Corp | Abrasive device of substrate and abrasive method thereof |
| JPH08339979A (en) * | 1995-04-10 | 1996-12-24 | Matsushita Electric Ind Co Ltd | Holder for substrate to be polished and polishing method for substrate |
| US5791973A (en) * | 1995-04-10 | 1998-08-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus for holding substrate to be polished and apparatus and method for polishing substrate |
| US5921853A (en) * | 1995-04-10 | 1999-07-13 | Matsushita Electric Industrial Co., Ltd. | Apparatus for polishing substrate using resin film or multilayer polishing pad |
| US7101261B2 (en) | 1995-06-09 | 2006-09-05 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
| GB2336555B (en) * | 1998-04-20 | 2000-08-30 | Nec Corp | Polishing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0767665B2 (en) | 1995-07-26 |
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