JP2000124570A - Printed wiring board for bonding - Google Patents
Printed wiring board for bondingInfo
- Publication number
- JP2000124570A JP2000124570A JP29545398A JP29545398A JP2000124570A JP 2000124570 A JP2000124570 A JP 2000124570A JP 29545398 A JP29545398 A JP 29545398A JP 29545398 A JP29545398 A JP 29545398A JP 2000124570 A JP2000124570 A JP 2000124570A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- electroless
- layer
- plating layer
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気絶縁性基板の
表面に電気設計に基づく導体パターンを導電性材料で形
成し、固着したボンディング用プリント配線板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for bonding in which a conductive pattern based on electrical design is formed on a surface of an electrically insulating substrate with a conductive material and is fixed.
【０００２】[0002]
【従来の技術】プリント配線板は、プラスチック、ガラ
ス、金属などの電気絶縁膜でできた基板の上に、薄い銅
版に写真製板やスクリーン印刷で配線を印刷したプリン
ト回路を張り付け、不要の部分の銅をエッチングにより
取り除いたものである。半導体素子などの電子素子の製
作に当たり、局部的な溶接によって半導体部分から外部
電極へときわめて細かいリード線を取り付け配線される
が、これに供されるのがボンディング用プリント配線板
である。2. Description of the Related Art A printed circuit board is made by attaching a printed circuit in which wiring is printed on a thin copper plate by photolithography or screen printing on a substrate made of an electrically insulating film such as plastic, glass, or metal. Of copper is removed by etching. When manufacturing an electronic element such as a semiconductor element, very fine lead wires are attached and wired from a semiconductor portion to an external electrode by local welding, and a printed wiring board for bonding is provided for this.
【０００３】従来、ボンディング用プリント配線板は、
絶縁性基板に銅めっきでパターン形成後、下記の２通り
の方法でニッケルめっきと金めっきが施される。第１の
方法は、電気めっきによる方法である。この方法は純ニ
ッケルと純金をめっきするため、ボンディング性および
半田接合性が非常に良好である。しかし、めっきするた
めの給電用配線が必要であるために、配線回路の微細高
密度基板の製造ができないという欠点がある。Conventionally, printed wiring boards for bonding are:
After a pattern is formed on the insulating substrate by copper plating, nickel plating and gold plating are performed by the following two methods. The first method is a method using electroplating. In this method, pure nickel and pure gold are plated, so that the bonding property and the solder bonding property are very good. However, there is a disadvantage in that a fine and high-density substrate for a wiring circuit cannot be manufactured because a power supply wiring for plating is required.
【０００４】第２の方法は、無電解めっきによる配線で
ある。無電解めっきは給電用配線が不必要なため微細高
密度配線基板を製造できる。しかし、従来の無電解Ｎｉ
−Ｐめっきでは、ボンディング性は良好であるが、半田
接合性が悪く、特にボール半田接合では、ボール半田の
脱落不良が発生する。また無電解ニッケルめっき浴によ
る析出ニッケルめっき層は、ボンディング性や異常析出
の抑制は良好であるが、半田接合性が悪く、実用性が低
かった。The second method is wiring by electroless plating. Since electroless plating does not require power supply wiring, a fine high-density wiring board can be manufactured. However, conventional electroless Ni
In the -P plating, the bonding property is good, but the solder bonding property is poor. Particularly, in the ball solder bonding, a dropout failure of the ball solder occurs. Further, the deposited nickel plating layer formed by the electroless nickel plating bath had good bonding properties and suppression of abnormal deposition, but had poor solder bonding properties and low practicality.
【０００５】そこで、前述した第１の方法と第２の方法
の利点を活かした方法、すなわち無電解めっき方式で製
造した、ボンディング性と半田接合性の良好な半田接合
用パッドを有するプリント配線板の出現が望まれてい
る。なお、半田接合用パッドとは、半導体素子のチップ
表面に設けたワイヤボンディングのための金属薄膜部分
のことである。In view of the above, a printed wiring board having solder bonding pads having good bonding properties and good solder bonding properties manufactured by a method utilizing the advantages of the first and second methods described above, that is, an electroless plating method. The emergence of is desired. The solder bonding pad is a metal thin film portion provided on the chip surface of the semiconductor element for wire bonding.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、ボンディン
グ性と半田接合性に優れた半田接合用パッド部を有する
プリント配線板を提供することを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to provide a printed wiring board having a solder bonding pad portion having excellent bonding and solder bonding properties.
【０００７】[0007]
【課題を解決するための手段】本発明は、下記の通りの
ものである。 （１）樹脂、セラミックまたは金属からなる電気絶縁板
の上に下地層として銅箔または銅めっき層を有し、その
上にＭｏ含有の無電解Ｎｉ−Ｐめっき層および無電解金
めっき層を順次設けたことを特徴とする、半田接合用パ
ッド部を有するボンディング用プリント配線板。 （２）無電解Ｎｉ−Ｐめっき層のＰ含有量が３〜１５重
量％、Ｍｏ含有量が０．０５〜１０．０重量％、厚さが
０．１〜２０μｍであり、無電解金めっき層の厚さが
０．０２〜１．５μｍである前記（１）に記載の半田接
合用パッド部を有するボンディング用プリント配線板。Means for Solving the Problems The present invention is as follows. (1) A copper foil or a copper plating layer is provided as an underlayer on an electric insulating plate made of resin, ceramic or metal, and a Mo-containing electroless Ni-P plating layer and an electroless gold plating layer are sequentially formed thereon. A printed wiring board for bonding having a pad portion for solder bonding, characterized by being provided. (2) The P content of the electroless Ni—P plating layer is 3 to 15% by weight, the Mo content is 0.05 to 10.0% by weight, the thickness is 0.1 to 20 μm, and the electroless gold plating is performed. The printed wiring board for bonding having the pad portion for solder bonding according to (1), wherein the thickness of the layer is 0.02 to 1.5 μm.
【０００８】以下に、本発明を詳細に説明する。集積回
路チップの高密度化に伴い、集積回路チップを搭載する
半田接合用パッド部を有するボンディング用基板も微細
かつ高密度配線となる。このため無電解めっき方法によ
るニッケルめっき、金めっき層構造が必要であり、かつ
その物性はボンディング性、半田接合性が良好でなけれ
ばならない。また配線間の短絡などの異常析出を抑える
ことも重要なことである。Hereinafter, the present invention will be described in detail. As the density of integrated circuit chips increases, the size of bonding substrates having solder bonding pads for mounting the integrated circuit chips also becomes finer and higher density wiring. Therefore, a nickel plating or gold plating layer structure by an electroless plating method is required, and its physical properties must be good in bonding property and solder bonding property. It is also important to suppress abnormal deposition such as a short circuit between wirings.
【０００９】本発明者らは、半田接合性の劣化を防止す
るための種々の化合物を研究したところ、無電解Ｎｉ−
Ｐめっき浴にモリブデン化合物を微量溶かすことによ
り、ボンディング性、半田接合性、異常析出の抑制に良
好な無電解Ｎｉ−Ｐめっき浴が得られることを知見し
た。本発明は、この知見に基づいて完成に至った。The inventors of the present invention have studied various compounds for preventing the deterioration of the solder bondability.
It has been found that by dissolving a trace amount of a molybdenum compound in a P plating bath, it is possible to obtain an electroless Ni-P plating bath which is excellent in bonding properties, solder bonding properties, and suppressing abnormal deposition. The present invention has been completed based on this finding.
【００１０】本発明のボンディング用プリント配線板
は、図１に示すように、絶縁材１からなるプリント配線
板素材上の銅層２上の全面または必要部分にＭｏ含有Ｎ
ｉ−Ｐ層３および無電解金めっき層４が順次形成されて
いることを特徴としている。プリント配線板素材として
は、常用されている樹脂、セラミックス、各種金属のい
ずれも用いられる。また銅層は、電解めっき法、無電解
めっき法および蒸着法のいずれの方法を採用してもよ
い。As shown in FIG. 1, the printed wiring board for bonding according to the present invention comprises Mo-containing N on the entire surface or a necessary portion of the copper layer 2 on the printed wiring board material made of the insulating material 1.
It is characterized in that the i-P layer 3 and the electroless gold plating layer 4 are sequentially formed. As the printed wiring board material, any of commonly used resins, ceramics and various metals is used. The copper layer may employ any of an electrolytic plating method, an electroless plating method, and a vapor deposition method.
【００１１】本発明において無電解Ｎｉ−Ｐめっき層の
組成は、Ｐ含有量が３〜１５重量％、Ｍｏ含有量が０．
０５〜１０．０重量％が適当である。また無電解Ｎｉ−
Ｐめっき層の厚さは０．１〜２０μｍ、無電解Ａｕめっ
き層の厚さは０．０２〜１．５μｍが適当である。In the present invention, the composition of the electroless Ni-P plating layer has a P content of 3 to 15% by weight and a Mo content of 0.1%.
It is suitably from 0.5 to 10.0% by weight. Electroless Ni-
It is appropriate that the thickness of the P plating layer is 0.1 to 20 μm, and the thickness of the electroless Au plating layer is 0.02 to 1.5 μm.
【００１２】［実施例］以下に、本発明を実施例と比較
例により更に説明する。実施例１〜２ 絶縁基板となる標準的なビスマレイドトリアミン樹脂プ
リント板に銅めっきまたはエッチングによりパターン形
成し、その上に、表１に示す、無電解Ｎｉ−Ｐ層を５μ
ｍ厚さでめっき後、ＩＭ−ＧＯＬＤ ＳＴおよびＩＭ−
ＧＯＬＤ Ｍ−２２（日本高純度化学株式会社製）とし
て一般に市販されている置換型無電解金めっきを用いて
厚み０．５０μｍの金めっきを施し、プリント配線板を
製作した。EXAMPLES The present invention will be further described below with reference to examples and comparative examples. Examples 1 and 2 A pattern was formed on a standard bismaleide triamine resin printed board serving as an insulating substrate by copper plating or etching, and an electroless Ni-P layer shown in Table 1 having a thickness of 5 μm was formed thereon.
After plating with a thickness of m, IM-GOLD ST and IM-
Gold plating having a thickness of 0.50 μm was applied using substitution type electroless gold plating generally commercially available as GOLD M-22 (manufactured by Nippon Kojunka Kagaku Co., Ltd.) to produce a printed wiring board.
【００１３】無電解Ｎｉ−Ｐめっき浴は、その基本組成
が、硫酸Ｎｉ・６Ｈ2Ｏ：２２．５ｇ／ｌ、クエン酸：
２５ｇ／ｌ、次亜リン酸Ｎａ：２０ｇ／ｌ、鉛：０．５
ｐｐｍであり、これに添加物としてＭｏおよびイオウ化
合物を選び添加物の量を変化させた。めっき浴の条件は
ｐＨ４．８、液温８５℃である。このようにプリント配
線板の製品を各々１０個製作し、各種試料についてワイ
ヤーボンディング性評価試験、半田ボール接合性評価試
験、および析出状態観察評価試験に供した。The basic composition of the electroless Ni-P plating bath is as follows: Ni · 6H 2 O sulfate: 22.5 g / l, citric acid:
25 g / l, sodium hypophosphite: 20 g / l, lead: 0.5
ppm, and Mo and sulfur compounds were selected as additives, and the amount of the additives was changed. The conditions of the plating bath are pH 4.8 and a liquid temperature of 85 ° C. As described above, ten products of the printed wiring board were manufactured, and various samples were subjected to a wire bonding property evaluation test, a solder ball bonding property evaluation test, and a deposition state observation evaluation test.
【００１４】ワイヤーボンディング性評価試験では、ワ
イヤーボンディングマシンにて直径２５μｍの金線ワイ
ヤーを用いてピール強度を測定した。半田ボール接合製
評価試験については、直径０．７６ｍｍのＳｎ−Ｐｂが
６３％：３７％のボール半田を用いて、２２０℃、５０
秒間の半田接合を２回繰り返しプッシュゲージにてボー
ル半田の接合強度を測定した。析出状態観察評価試験で
は、光学顕微鏡にて配線のハミ出しめっきなどの異常析
出を倍率２００倍にて観察した。各種評価試験結果を、
表１に示す。表１の評価についてＡ：優れている、Ｂ：
やや優れている、Ｃ：やや劣っている、Ｄ：劣っている
を示している。In the wire bonding evaluation test, the peel strength was measured using a gold wire having a diameter of 25 μm by a wire bonding machine. Regarding the evaluation test for solder ball bonding, Sn-Pb having a diameter of 0.76 mm and 63%: 37% ball solder was used at 220 ° C. and 50%.
The soldering for two seconds was repeated twice, and the bonding strength of the ball solder was measured with a push gauge. In the deposition state observation evaluation test, abnormal precipitation such as bleeding-out plating of wiring was observed at a magnification of 200 times with an optical microscope. Various evaluation test results
It is shown in Table 1. About the evaluation of Table 1, A: Excellent, B:
Somewhat superior, C: slightly inferior, D: inferior.
【００１５】表１に示す評価試験結果から分るように、
Ｎｉ−Ｐめっき基本組成にＭｏを添加した浴（試料番号
１，２）を用いたものは、ワイヤーボンディング性、半
田ボール接合性、析出状態も良く、総合評価においても
優れている。しかし、イオウ化合物を添加した浴（試料
番号３）、およびＭｏもイオウ化合物も添加していない
浴（試料番号４）を用いたものは、総合評価においてや
や劣っている、あるいは劣っているとの評価しか得られ
ない。As can be seen from the evaluation test results shown in Table 1,
Those using baths (Sample Nos. 1 and 2) in which Mo was added to the basic composition of Ni-P plating had good wire bonding properties, solder ball bonding properties, and precipitation conditions, and were also excellent in overall evaluation. However, the bath using the sulfur compound-added bath (Sample No. 3) and the bath containing neither Mo nor the sulfur compound (Sample No. 4) are slightly inferior or inferior in the overall evaluation. Only evaluation can be obtained.
【００１６】[0016]
【表１】 [Table 1]
【００１７】実施例３〜５ 絶縁基板となる標準的なビスマレイドトリアミン樹脂プ
リント板に銅めっきまたはエッチングによりパターン形
成し、その上に、表２に示す、無電解Ｎｉ−Ｐ層を５μ
ｍ厚さでめっき後、ＩＭ−ＧＯＬＤ ＳＴおよびＩＭ−
ＧＯＬＤ Ｍ−２２（日本高純度化学株式会社製）とし
て一般に市販されている置換型無電解金めっき液を用い
て厚み０．５０μｍの金めっきを施し、プリント配線板
を製作した。 Examples 3 to 5 A pattern was formed on a standard bismaleide triamine resin printed board serving as an insulating substrate by copper plating or etching, and an electroless Ni-P layer shown in Table 2 having a thickness of 5 μm was formed thereon.
After plating with a thickness of m, IM-GOLD ST and IM-
Gold plating having a thickness of 0.50 μm was performed using a substitution type electroless gold plating solution generally commercially available as GOLD M-22 (manufactured by Nippon Kojunka Kagaku Co., Ltd.) to produce a printed wiring board.
【００１８】一般に市販されている無電解Ｎｉ−Ｐめっ
き浴（ファインニッケルＮ−７８：日本高純度化学社
製、ＩＰＣニコロンＵＳＤ：奥野製薬社製、ニムデンＳ
Ｘ：上村工業社製）にＭｏを添加した浴と添加しない浴
を用いて無電解Ｎｉ−Ｐめっき層を得た。このようにし
てプリント配線板の製品を各々１０個製作し、各種試料
についてワイヤーボンディング性評価試験、半田ボール
接合性評価試験、および析出状態観察評価試験に供し
た。A commercially available electroless Ni-P plating bath (Fine Nickel N-78: manufactured by Nippon Kojunka Kagaku, IPC Nicoron USD: manufactured by Okuno Pharmaceutical Co., Ltd., Nimden S)
X: manufactured by Uemura Kogyo Co., Ltd.) and a bath to which Mo was added and a bath to which Mo was not added, to obtain an electroless Ni-P plating layer. In this way, ten printed wiring board products were manufactured, and various samples were subjected to a wire bonding property evaluation test, a solder ball bonding property evaluation test, and a deposition state observation evaluation test.
【００１９】ワイヤーボンディング性評価試験ではワイ
ヤーボンディングマシンにて直径２５μｍの金線ワイヤ
ーを用いてピール強度を測定した。半田ボール接合性評
価試験については直径０．７６ｍｍのＳｎ−Ｐｂが６３
％：３７％のボール半田を用いて、２２０℃、５０秒間
の半田接合を２回繰り返し、プッシュゲージにてボール
半田の接合強度を測定した。析出状態観察評価試験では
光学顕微鏡にて配線のハミ出しめっきなどの異常析出を
倍率２００倍にて観察した。In the wire bonding evaluation test, the peel strength was measured using a gold wire having a diameter of 25 μm by a wire bonding machine. Regarding the solder ball bonding test, Sn-Pb having a diameter of 0.76 mm was 63.
%: Solder bonding at 220 ° C. for 50 seconds was repeated twice using 37% ball solder, and the bonding strength of the ball solder was measured with a push gauge. In the deposition state observation evaluation test, abnormal deposition such as bleeding-out plating of wiring was observed with an optical microscope at a magnification of 200 times.
【００２０】各種評価試験の結果を、表２に示す。表２
の評価基準は、前述した表１のものと同様である。表２
に示す評価試験結果から分るように、市販Ｎｉ−Ｐめっ
き浴にＭｏを添加した浴（試料番号５〜７）を用いたも
のはワイヤーボンディング性、半田ボール接合性、析出
状態も良く、総合評価においても優れている。しかし、
Ｍｏを添加しない浴（試料番号８〜１０）を用いたもの
は、総合評価においてやや劣っている、あるいは劣って
いるとの評価しか得られない。Table 2 shows the results of the various evaluation tests. Table 2
Are the same as those in Table 1 described above. Table 2
As can be seen from the evaluation test results shown in Tables 1, those using a commercial Ni-P plating bath with Mo added (sample Nos. 5 to 7) have good wire bonding properties, solder ball bonding properties, and precipitation states, and Excellent in evaluation. But,
In the case of using a bath to which Mo was not added (sample numbers 8 to 10), the overall evaluation was slightly poor or only poor.
【００２１】[0021]
【表２】 [Table 2]
【００２２】[0022]
【発明の効果】本発明によれば、下地無電解Ｎｉ−Ｐめ
っき浴にＭｏ化合物を添加することにより優れたワイヤ
ーボンディング性、ボール半田接合性及び異常析出の抑
制効果を得られるので微細高密度配線の半田接合パッド
部を有するボンディング用プリント配線板を製作するこ
とができる。According to the present invention, by adding an Mo compound to a base electroless Ni-P plating bath, excellent wire bonding properties, ball solder bonding properties, and an effect of suppressing abnormal deposition can be obtained, so that fine and high density can be obtained. A printed wiring board for bonding having a solder joint pad portion of wiring can be manufactured.
【図１】本発明に係る半田接合用パッド部を有するボン
ディング用プリント配線板の構造断面図である。FIG. 1 is a structural sectional view of a printed wiring board for bonding having a pad portion for solder bonding according to the present invention.
【図２】本発明に係る半田接合用パッド部を有する他の
ボンディング用プリント配線板の構造断面図である。FIG. 2 is a structural sectional view of another printed wiring board for bonding having a pad portion for solder bonding according to the present invention.
１ 絶縁材 ２ 銅層 ３ Ｍｏ含有無電解Ｎｉ−Ｐめっき層 ４ 無電解金めっき層 ５ 金ワイヤーボンディング ６ 半田ボール DESCRIPTION OF SYMBOLS 1 Insulation material 2 Copper layer 3 Mo containing electroless Ni-P plating layer 4 Electroless gold plating layer 5 Gold wire bonding 6 Solder ball
Claims (3)
気絶縁基板の上に下地層として銅箔または銅めっき層を
有し、その上にＭｏ含有の無電解Ｎｉ−Ｐめっき層およ
び無電解Ａｕめっき層を順次設けたことを特徴とする、
半田接合用パッド部を有するボンディング用プリント配
線板。1. A copper foil or copper plating layer as a base layer on an electric insulating substrate made of resin, ceramics or metal, and a Mo-containing electroless Ni-P plating layer and an electroless Au plating layer thereon Are sequentially provided,
A printed wiring board for bonding having a pad part for solder bonding.
０．０５〜１０．０重量％である請求項１に記載の半田
接合用パッド部を有するボンディング用プリント配線
板。2. The Mo content of an electroless Ni—P plating layer is as follows:
The printed wiring board for bonding having a pad portion for soldering according to claim 1, wherein the content is 0.05 to 10.0% by weight.
１５重量％、Ｍｏ含有量が０．０５〜１０．０重量％、
厚さが０．１〜２０μｍであり、無電解Ａｕめっき層の
厚さが０．０２〜１．５μｍである請求項１に記載の半
田接合用パッド部を有するボンディング用プリント配線
板。3. The P content of the electroless Ni—P plating layer is 3 to 3.
15% by weight, Mo content is 0.05 to 10.0% by weight,
The printed wiring board for bonding having a pad portion for solder bonding according to claim 1, wherein the thickness is 0.1 to 20 μm, and the thickness of the electroless Au plating layer is 0.02 to 1.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29545398A JP2000124570A (en) | 1998-10-16 | 1998-10-16 | Printed wiring board for bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29545398A JP2000124570A (en) | 1998-10-16 | 1998-10-16 | Printed wiring board for bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000124570A true JP2000124570A (en) | 2000-04-28 |
Family
ID=17820789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29545398A Pending JP2000124570A (en) | 1998-10-16 | 1998-10-16 | Printed wiring board for bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000124570A (en) |
-
1998
- 1998-10-16 JP JP29545398A patent/JP2000124570A/en active Pending
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