JP2000108290A - Manufacture of laminates - Google Patents
Manufacture of laminatesInfo
- Publication number
- JP2000108290A JP2000108290A JP10279495A JP27949598A JP2000108290A JP 2000108290 A JP2000108290 A JP 2000108290A JP 10279495 A JP10279495 A JP 10279495A JP 27949598 A JP27949598 A JP 27949598A JP 2000108290 A JP2000108290 A JP 2000108290A
- Authority
- JP
- Japan
- Prior art keywords
- board
- sides
- manufacturing
- plate
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は，印刷回路等に用い
られる積層板の製造方法に関する。さらに詳細には，表
裏非対称な構造の積層板を，反りが生じないように製造
する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminate used for a printed circuit or the like. More specifically, the present invention relates to a method for manufacturing a laminated plate having an asymmetric structure on both sides so that warpage does not occur.
【０００２】[0002]
【従来の技術】従来，この種の積層板は，図７に示すよ
うにして製造されていた。すなわち，銅箔１と，エポキ
シプリプレグ２と，片面にパターン加工が施された両面
銅貼り板３とを重ね合わせて，中間板５，５を介して両
側からホットプレスするのである。このとき，両面銅貼
り板３と中間板５との間に離型フィルム４を挟み込んで
おく。これにより，エポキシプリプレグ２に含浸されて
いるエポキシ樹脂が溶融して，銅箔１と両面銅貼り板３
とが接着される。かくして，図５に示すような積層板６
が得られる。2. Description of the Related Art Conventionally, this kind of laminated board has been manufactured as shown in FIG. That is, the copper foil 1, the epoxy prepreg 2, and the double-sided copper-clad plate 3 having a pattern processed on one side are overlaid, and hot-pressed from both sides via the intermediate plates 5 and 5. At this time, the release film 4 is sandwiched between the double-sided copper-clad plate 3 and the intermediate plate 5. As a result, the epoxy resin impregnated in the epoxy prepreg 2 is melted, and the copper foil 1 and the double-sided copper
Are bonded. Thus, the laminate 6 shown in FIG.
Is obtained.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら，前述の
従来の製造方法には，次のような問題点があった。すな
わち，製造される積層板６が，図８に示すように反って
しまいがちなのである。この反りは，通常，銅箔１の面
が内側になるように起こる。積層板６が反る原因は，そ
の熱膨張率が両面で異なることにあると考えられる。However, the above-mentioned conventional manufacturing method has the following problems. That is, the manufactured laminated plate 6 tends to warp as shown in FIG. This warpage usually occurs such that the surface of the copper foil 1 is on the inside. It is considered that the cause of the warpage of the laminate 6 is that the thermal expansion coefficients thereof are different on both surfaces.
【０００４】本発明は，前記した従来の技術が有する問
題点の解決を目的としてなされたものである。すなわち
その課題とするところは，反りのない製品が得られる積
層板の製造方法を提供することにある。[0004] The present invention has been made to solve the above-mentioned problems of the prior art. That is, it is an object of the present invention to provide a method for manufacturing a laminated board from which a product without warpage can be obtained.
【０００５】[0005]
【課題を解決するための手段】この課題の解決のために
なされた本発明に係る積層板の製造方法は，基本的に
は，第１の板と，これと異なる第２の板とを，接着層を
挟んで積層して積層板を製造する方法である。ここにお
いて，２枚の第２の板を挟んで重ね合わせ，その両側に
それぞれ接着剤を含む層を重ね合わせ，その両側にそれ
ぞれ第１の板を重ね合わせ，その両側からプレスを行
い，第１の板と接着層と第２の板との積層板を２組得る
こととしている。なお，好ましくは２枚の第２の板の間
に離型フィルムを挟み込んでおくのがよい。Means for Solving the Problems A method for manufacturing a laminated board according to the present invention, which has been made to solve this problem, basically comprises a first plate and a second plate different from the first plate. This is a method of manufacturing a laminated board by laminating with an adhesive layer interposed therebetween. Here, two second plates are overlapped with each other, a layer containing an adhesive is overlapped on both sides thereof, a first plate is overlapped on both sides thereof, and pressing is performed from both sides thereof. In this case, two sets of laminated plates including the first plate, the adhesive layer, and the second plate can be obtained. Preferably, a release film is sandwiched between two second plates.
【０００６】この製造方法では，プレスされる対象物
は，２枚の第２の板を重ね合わせ，その両側にそれぞれ
接着剤を含む層を重ね合わせ，その両側にそれぞれ第１
の板を重ね合わせたものである。この対象物は，２枚の
第２の板が向き合う面を中心に対称な構造であるので，
プレスにより反りが生じることはない。したがって，プ
レス後の反りのない積層物を，２枚の第２の板の間を境
に分離すると，反りがほとんどない積層板が２枚得られ
る。なお，ここにいう「板」は，箔と呼ばれるような薄
いものでもよい。In this manufacturing method, the object to be pressed is such that two second plates are superimposed, a layer containing an adhesive is superposed on both sides thereof, and the first layer is superposed on both sides thereof.
Are stacked. Since this object has a symmetrical structure about the surface where the two second plates face each other,
The press does not cause warpage. Therefore, if the laminate without warpage after pressing is separated at the boundary between the two second plates, two laminates with almost no warpage can be obtained. The “plate” here may be a thin one called a foil.
【０００７】この製造方法における第２の板として，一
方の面がパターン面であり，その裏面が非パターン面で
ある片面パターン板が用いられることがある。その場合
における第２の板の重ね合わせ方は，非パターン面同士
を向き合わせて重ね合わせ，その裏面すなわちパターン
面に接着剤を含む層を重ね合わせることが望ましい。こ
のようにすると，中心にパターン層が埋め込まれ，両面
に非パターン面がある積層板が得られる。また，第１の
板に由来する非パターン面に，パターン面と対向した状
態でプレスされることにより凹凸痕が残ることもない。
なお，離型フィルムを挟み込む場合には，非パターン面
と非パターン面との間に挟み込まれることとなるAs a second plate in this manufacturing method, a single-sided pattern plate whose one surface is a pattern surface and whose back surface is a non-pattern surface is sometimes used. In such a case, it is preferable that the second plate is overlapped with the non-patterned surfaces facing each other, and that the back surface, that is, the pattern surface is overlapped with a layer containing an adhesive. In this way, a laminate is obtained in which the pattern layer is buried in the center and the non-patterned surface is provided on both sides. In addition, since the non-patterned surface derived from the first plate is pressed in a state facing the pattern surface, no uneven mark remains.
When the release film is inserted, it is inserted between the non-patterned surface and the non-patterned surface.
【０００８】この種のプレスによる積層板の製造方法で
は通常，加熱された状態でプレスが行われる。その場合
には，温度が常温に下がってからプレスの圧力を解除す
ることが好ましい。単独の積層板の構造は対称ではない
ので，圧力解除後の温度変化とともに反りが生じるのを
防ぐためである。[0008] In this type of manufacturing method of a laminate by a press, the press is usually performed in a heated state. In that case, it is preferable to release the pressure of the press after the temperature has dropped to room temperature. This is because the structure of a single laminated plate is not symmetrical, so that warpage occurs with a temperature change after the pressure is released.
【０００９】[0009]
【発明の実施の形態】以下，本発明を具体化した実施の
形態について，図面を参照しつつ詳細に説明する。ま
ず，本実施の形態に係る積層板の製造方法において使用
するものについて簡単に説明する。本製造方法では，厚
さ１２〜１８μｍの銅箔と，厚さ６０μｍ程度のエポキ
シプリプレグと，図１に示す構造の両面銅貼り板３と
を，積層板の出発材料として使用する。図１の両面銅貼
り板３は，ガラエポ基板３１の両面に厚さ１８μｍの銅
箔３２，３３を貼着してなるものであって，片方の銅箔
３２にはパターン加工が施されている。ガラエポ基板３
１の厚さは，約１００μｍである。そして本製造方法で
は，これら以外に，フッ素樹脂製の離型フィルムと，ス
テンレス鋼製の中間板とを使用する。Embodiments of the present invention will be described below in detail with reference to the drawings. First, what is used in the method for manufacturing a laminated board according to the present embodiment will be briefly described. In this manufacturing method, a copper foil having a thickness of 12 to 18 μm, an epoxy prepreg having a thickness of about 60 μm, and a double-sided copper-clad plate 3 having the structure shown in FIG. 1 are used as starting materials for a laminate. The double-sided copper-clad board 3 of FIG. 1 is formed by bonding copper foils 32 and 33 each having a thickness of 18 μm to both sides of a glass epoxy substrate 31, and one copper foil 32 is subjected to pattern processing. . Glass epoxy substrate 3
1 has a thickness of about 100 μm. In addition, in this manufacturing method, in addition to these, a release film made of a fluororesin and an intermediate plate made of stainless steel are used.
【００１０】本製造方法では，上記の各種材料を図２に
示すように重ね合わせる。すなわち，離型フィルム４を
中心に，その両側にそれぞれ両面銅貼り板３，３を重ね
合わせる。このとき，２枚の両面銅貼り板３，３はとも
に，パターン加工が施されていない銅箔３３，３３が離
型フィルム４に面するようにする。そしてその両側にそ
れぞれ，エポキシプリプレグ２，２を重ね合わせる。し
たがって，２枚の両面銅貼り板３，３とも，パターン加
工が施されている銅箔３２，３２がエポキシプリプレグ
２，２に面する。そして，両側のエポキシプリプレグ
２，２の外側にそれぞれ，銅箔１，１を重ね合わせる。
さらに，両側の銅箔１，１の外側にそれぞれ，中間板
５，５を重ね合わせる。In this manufacturing method, the above-mentioned various materials are superposed as shown in FIG. That is, the double-sided copper-clad plates 3 and 3 are superposed on both sides of the release film 4 at the center. At this time, both of the two double-sided copper-clad plates 3, 3 are set so that the copper foils 33, 33 that have not been subjected to pattern processing face the release film 4. Then, epoxy prepregs 2 and 2 are overlapped on both sides thereof, respectively. Therefore, the copper foils 32, 32 on which the pattern processing is performed face the epoxy prepregs 2, 2 in both of the two double-sided copper-clad boards 3, 3. Then, copper foils 1 and 1 are superposed on the outside of the epoxy prepregs 2 and 2 on both sides, respectively.
Further, intermediate plates 5 and 5 are superposed on the outer sides of the copper foils 1 and 1 on both sides, respectively.
【００１１】図２に示す状態では，中間板５，５のすぐ
内側の銅箔１から銅箔１までがプレスの対象物７であ
る。この対象物７は，離型フィルム４を中心に対称な構
造である。また，対象物７において，離型フィルム４の
上側の銅箔１から両面銅貼り板３までと，離型フィルム
４の下側の両面銅貼り板３から銅箔１までとの，計２組
が製品である積層板６となる部分である。In the state shown in FIG. 2, the copper foil 1 to the copper foil 1 immediately inside the intermediate plates 5 and 5 are the objects 7 to be pressed. The object 7 has a symmetrical structure about the release film 4. Further, in the object 7, a total of two sets of the copper foil 1 on the upper side of the release film 4 to the double-sided copper-clad plate 3 and the double-sided copper-plated board 3 on the lower side of the release film 4 to the copper foil 1. Is a portion to be a laminated plate 6 as a product.
【００１２】そして，図２に示す中間板５から中間板５
までのものをホットプレス機にセットして熱間プレスす
る。そのときの温度および圧力は，図３に示すパターン
とする。すなわち，始めのうちはプレス圧は軽めの１０
ｋｇｆ／ｃｍ2程度とし，３.２℃／分程度の昇温速度で
昇温する。そして，約３０分経過したら，３０ｋｇｆ／
ｃｍ2 のプレス圧を印加する。この時点での温度は約１
２０℃である。そして，温度が約１８０℃になったら
（昇温開始から約５０分後），そのままの温度および圧
力を９０分程度保持する。そして，４℃／分程度の冷却
速度で冷却し，常温まで下がってからプレス圧を解除す
る。昇温開始からここまでの所要時間は約３時間であ
る。The intermediate plate 5 shown in FIG.
Are set in a hot press and hot pressed. The temperature and pressure at that time have the pattern shown in FIG. In other words, at the beginning, press pressure should be 10
The temperature is raised to about kgf / cm 2 and at a rate of about 3.2 ° C./min. And after about 30 minutes, 30kgf /
A press pressure of cm 2 is applied. The temperature at this point is about 1
20 ° C. When the temperature reaches about 180 ° C. (about 50 minutes after the start of heating), the temperature and the pressure are maintained for about 90 minutes. Then, cooling is performed at a cooling rate of about 4 ° C./min, and after the temperature is lowered to room temperature, the press pressure is released. The time required from the start of heating up to this point is about 3 hours.
【００１３】なお，この熱間プレスは，図４に示すよう
に，多数の対象物７と中間板５とを交互に重ね合わせて
全体を一度に行ってもよい。As shown in FIG. 4, the hot press may be performed at a time by alternately superimposing a large number of objects 7 and intermediate plates 5 on each other.
【００１４】この熱間プレスにより，離型フィルム４の
上下でそれぞれ，エポキシプリプレグ２に含浸されてい
るエポキシ樹脂が溶融して，銅箔１と両面銅貼り板３と
が接着される。これにより，図５に示すような積層板６
が２枚得られる。このようにして得られた積層板６は，
従来の製造方法で製造したものと異なり，反りがほとん
どなく平板状である。By this hot pressing, the epoxy resin impregnated in the epoxy prepreg 2 is melted above and below the release film 4, respectively, and the copper foil 1 and the double-sided copper-clad board 3 are bonded. Thereby, the laminated plate 6 shown in FIG.
Are obtained. The laminate 6 thus obtained is
Unlike the one manufactured by the conventional manufacturing method, it has a flat shape with almost no warpage.
【００１５】反りのない積層板６得られる理由の１つ
は，プレスの対象物７が離型フィルム４を中心に対称な
構造であることである。このため，対象物７としては上
下どちらにも反る理由がないのである。また，もう１つ
の理由は，溶融後に温度が常温にまで下がってからプレ
ス圧を解除することにある。すなわち，１枚の積層板６
に着目すればその構造は対称ではないが，熱膨張率の両
面での差異に基づく応力が掛かる高温時にはプレス圧に
より反りが抑えられている。そして，プレス圧が解除さ
れるときにはすでに常温でありそれ以後の温度変化は問
題にならないのである。One of the reasons for obtaining a laminated plate 6 without warpage is that the object 7 to be pressed has a symmetrical structure with respect to the release film 4. For this reason, there is no reason for the object 7 to bend up or down. Another reason is that the pressing pressure is released after the temperature is lowered to room temperature after melting. That is, one laminated plate 6
The structure is not symmetrical, but the warpage is suppressed by the press pressure at high temperatures where stress is applied based on the difference between the two coefficients of thermal expansion. When the press pressure is released, the temperature is already normal, and the temperature change thereafter does not matter.
【００１６】以上詳細に説明したように本実施の形態で
は，２枚分の積層板６の材料を，離型フィルム４を中心
に対称に重ね合わせて熱間プレスするので，プレスの対
象物の構造が対称であり，熱膨張率の表裏面間の差異に
より反りが生じることがない。また，温度が常温まで下
がってからプレス圧を解除して積層板６を取り出すの
で，それ以後の温度変化による反りもほとんど生じな
い。かくして，反りのない平板状の積層板６が得られる
積層板の製造方法が実現されている。As described above in detail, in the present embodiment, the materials of the two laminated plates 6 are symmetrically overlapped around the release film 4 and hot-pressed. The structure is symmetric, and there is no warpage due to the difference in thermal expansion coefficient between the front and back surfaces. In addition, since the laminated plate 6 is taken out after the press pressure is released after the temperature has dropped to room temperature, warpage due to a temperature change thereafter hardly occurs. Thus, a method of manufacturing a laminated plate having a flat laminated plate 6 having no warp has been realized.
【００１７】また，離型フィルム４を挟んで２枚の両面
銅貼り板３，３の非パターン面３３，３３同士を向き合
わせてプレスを行うので，図６のようにパターン面３
２，３２同士を向き合わせる場合と異なり，銅箔１，１
に反対側のパターン面３２，３２の形状が影響して凹凸
痕が残ることもない。さらに，２枚分の積層板６の材料
を１組のプレスの対象物７とするので，１枚の積層板６
あたりに必要な中間板５の枚数が，従来の製造方法の場
合の約半分で済む。Further, since the non-patterned surfaces 33 of the two double-sided copper-clad plates 3 and 3 are pressed with the release film 4 interposed therebetween, pressing is performed as shown in FIG.
Unlike the case where two and 32 face each other, copper foil 1,1
The shape of the pattern surfaces 32, 32 on the opposite side does not affect the shape, and no uneven marks remain. Further, since the material of the two laminated plates 6 is used as a set of objects 7 to be pressed, one laminated plate 6
The number of intermediate plates 5 required per unit is about half that of the conventional manufacturing method.
【００１８】なお，前記実施の形態は単なる例示にすぎ
ず，本発明を何ら限定するものではない。したがって本
発明は当然に，その要旨を逸脱しない範囲内で種々の改
良，変形が可能である。例えば，製造される積層板６
は，図６のような導体層を３層有するものに限らず，も
っと層の数が多いものでも適用できる。The above embodiment is merely an example, and does not limit the present invention. Therefore, naturally, the present invention can be variously modified and modified without departing from the gist thereof. For example, the laminate 6 to be manufactured
Is not limited to the one having three conductor layers as shown in FIG. 6, but can be applied to those having a larger number of layers.
【００１９】[0019]
【発明の効果】以上の説明から明らかなように本発明に
係る積層板の製造方法によれば，反りのない平板状の積
層板が製造される。As is clear from the above description, according to the method for manufacturing a laminated board according to the present invention, a flat laminated board without warpage is manufactured.
【図１】本発明に係る積層板の製造方法において出発材
料の１つとして用いられる両面銅貼り板（片面パター
ン）を示す図である。FIG. 1 is a view showing a double-sided copper-clad plate (one-sided pattern) used as one of starting materials in the method for producing a laminate according to the present invention.
【図２】本発明に係る積層板の製造方法における各材料
の重ね合わせ方を説明する図である。FIG. 2 is a diagram for explaining a method of superposing each material in the method for manufacturing a laminated board according to the present invention.
【図３】熱間プレスの温度および圧力の履歴を示すグラ
フである。FIG. 3 is a graph showing a history of temperature and pressure of a hot press.
【図４】多数組を一度にプレスする場合を示す図であ
る。FIG. 4 is a diagram showing a case where a large number of sets are pressed at one time.
【図５】積層板の構造を示す断面図である。FIG. 5 is a cross-sectional view showing a structure of a laminate.
【図６】逆向きに重ね合わせた状態を示す図である。FIG. 6 is a diagram showing a state in which the sheets are overlapped in the opposite direction.
【図７】従来の積層板の製造方法を示す図である。FIG. 7 is a view showing a conventional method for manufacturing a laminated board.
【図８】従来の製造方法により製造された積層板の反り
を示す図である。FIG. 8 is a view showing warpage of a laminate manufactured by a conventional manufacturing method.
１ 銅箔（第１の板） ２ エポキシプリプレグ ３ 両面銅貼り板（第２の板） ３２ 銅箔（パターン面） ３３ 銅箔（非パターン面） DESCRIPTION OF SYMBOLS 1 Copper foil (1st board) 2 Epoxy prepreg 3 Double-sided copper-clad board (2nd board) 32 Copper foil (pattern side) 33 Copper foil (non-pattern side)
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F100 AB17A AB17C AB17E AB33A AB33C AB33E AG00B AG00D AK53B AK53D BA05 BA07 BA10A BA10E BA13 DG01B DG01D DH01D DH02B DH02D EC051 EJ15C EJ202 EJ422 GB43 JL04 5E346 CC09 CC32 EE09 EE13 GG08 GG28 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4F100 AB17A AB17C AB17E AB33A AB33C AB33E AG00B AG00D AK53B AK53D BA05 BA07 BA10A BA10E BA13 DG01B DG01D DH01D DH02B DH02D EC051 EJ15C EJ202 EJ422 GB09J08 EJ422 GB346 J09
Claims (3)
を，接着層を挟んで積層する積層板の製造方法におい
て，２枚の第２の板を重ね合わせ，その両側にそれぞれ
接着剤を含む層を重ね合わせ，その両側にそれぞれ第１
の板を重ね合わせ，その両側からプレスを行い，第１の
板と接着層と第２の板との積層板を２組得ることを特徴
とする積層板の製造方法。1. A method of manufacturing a laminated board in which a first board and a second board different from the first board are laminated with an adhesive layer interposed therebetween. The layers containing the adhesive are overlapped, and the first
A method for manufacturing a laminated board, comprising: laminating the above-mentioned boards and pressing from both sides thereof to obtain two sets of a laminated board of a first board, an adhesive layer and a second board.
おいて，前記第２の板の，前記接着剤を含む層と重ね合
わせられる面がパターン面であり，互いに向き合う面が
非パターン面であることを特徴とする積層板の製造方
法。2. The method according to claim 1, wherein a surface of the second plate that overlaps with the layer containing the adhesive is a pattern surface, and surfaces facing each other are non-pattern surfaces. A method for manufacturing a laminate, comprising:
板の製造方法において，前記プレスを加熱状態で行い，
温度が常温に下がってからプレスの圧力を解除すること
を特徴とする積層板の製造方法。3. The method for producing a laminate according to claim 1, wherein the pressing is performed in a heated state.
A method for producing a laminate, wherein the pressure of the press is released after the temperature has dropped to room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27949598A JP4201893B2 (en) | 1998-10-01 | 1998-10-01 | Laminate production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27949598A JP4201893B2 (en) | 1998-10-01 | 1998-10-01 | Laminate production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000108290A true JP2000108290A (en) | 2000-04-18 |
| JP4201893B2 JP4201893B2 (en) | 2008-12-24 |
Family
ID=17611853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27949598A Expired - Lifetime JP4201893B2 (en) | 1998-10-01 | 1998-10-01 | Laminate production method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4201893B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101299140B1 (en) | 2012-01-16 | 2013-08-21 | 어드벤스 머티리얼스 코포레이션 | Method of manufacturing a package substrate |
| CN108990319A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of stepped plate pressing stack and preparation method thereof |
| CN113635649A (en) * | 2021-08-17 | 2021-11-12 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
| CN114980580A (en) * | 2022-06-24 | 2022-08-30 | 湖北金禄科技有限公司 | 5G communication circuit board and back-to-back stacked circuit board production and processing method |
-
1998
- 1998-10-01 JP JP27949598A patent/JP4201893B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101299140B1 (en) | 2012-01-16 | 2013-08-21 | 어드벤스 머티리얼스 코포레이션 | Method of manufacturing a package substrate |
| CN108990319A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of stepped plate pressing stack and preparation method thereof |
| CN108990319B (en) * | 2018-08-01 | 2023-12-05 | 广州美维电子有限公司 | Stepped plate pressing and stacking structure and manufacturing method thereof |
| CN113635649A (en) * | 2021-08-17 | 2021-11-12 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
| CN113635649B (en) * | 2021-08-17 | 2023-09-22 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
| CN114980580A (en) * | 2022-06-24 | 2022-08-30 | 湖北金禄科技有限公司 | 5G communication circuit board and back-to-back stacked circuit board production and processing method |
| CN114980580B (en) * | 2022-06-24 | 2023-12-19 | 湖北金禄科技有限公司 | Production and processing method of 5G communication circuit board and back-to-back stacked circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4201893B2 (en) | 2008-12-24 |
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