JP2000086987A - Bonded structure of electronic component and its adhesive bonding - Google Patents
Bonded structure of electronic component and its adhesive bondingInfo
- Publication number
- JP2000086987A JP2000086987A JP10255465A JP25546598A JP2000086987A JP 2000086987 A JP2000086987 A JP 2000086987A JP 10255465 A JP10255465 A JP 10255465A JP 25546598 A JP25546598 A JP 25546598A JP 2000086987 A JP2000086987 A JP 2000086987A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive layer
- circuit board
- bonding
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板の回路パ
ターンと電子部品の電極との間に異方導電性を有する粘
着層を介した電子部品の接合構造体及び接合方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding structure and a bonding method for an electronic component via an adhesive layer having anisotropic conductivity between a circuit pattern on a circuit board and an electrode of the electronic component.
【０００２】[0002]
【従来の技術】従来より、回路基板の回路パターンにＩ
Ｃチップなどの電子部品を接合するための技術として、
例えば、図３の断面図で示すような特開平８−１３８７
７３号公報に記載の電極部構造がある。この電極部の接
続構造は、電子部品４と対向する回路基板２とを導電性
粒子６ａが分散された接着剤層６ｂからなる異方性導電
材料６を介して加熱圧着し、回路パターンの銅配線１と
電子部品４の電極５間を導電接続する方法で行われてい
た。しかし、上記公報に記載の方法によると、回路パタ
ーンの銅配線１と電子部品４の電極５との接続部分を加
熱圧着状態で固着するので、固着後に接続不良が発生し
た場合に電子部品４を剥離したり再接着することが困難
であり、このため不良品が増えて生産性を低下させる原
因となっていた。2. Description of the Related Art Conventionally, a circuit pattern on a circuit board has
As a technology for joining electronic components such as C chips,
For example, as shown in the cross-sectional view of FIG.
There is an electrode part structure described in JP-A-73-73. In the connection structure of the electrode portion, the electronic component 4 and the opposing circuit board 2 are heat-pressed through an anisotropic conductive material 6 composed of an adhesive layer 6b in which conductive particles 6a are dispersed, and the circuit pattern copper It has been performed by a method of conducting connection between the wiring 1 and the electrode 5 of the electronic component 4. However, according to the method described in the above publication, the connection portion between the copper wiring 1 of the circuit pattern and the electrode 5 of the electronic component 4 is fixed in a heat-pressed state. It was difficult to peel or re-adhere, and this resulted in an increase in defective products and a decrease in productivity.
【０００３】また、急速な加熱を行うと接着剤樹脂の粘
度が急激に低下して接合領域外へ流出して接合不良の原
因となり、また、電子部品と回路基板との熱膨張率の差
により、硬化後に電子部品と回路基板との間でそりが生
じ、冷熱サイクルで電極間の接合が破壊されて導電接続
の信頼性が失われるという結果になる。[0003] Further, if rapid heating is performed, the viscosity of the adhesive resin drops rapidly and flows out of the bonding area, causing poor bonding. In addition, the difference in the coefficient of thermal expansion between the electronic component and the circuit board causes After the curing, warping occurs between the electronic component and the circuit board, and the thermal cycle breaks the junction between the electrodes, resulting in a loss of reliability of the conductive connection.
【０００４】[0004]
【発明が解決しようとする課題】本発明は上記従来の問
題点を解消し、回路基板に接合された電子部品の再接合
が可能であり、信頼性の高い電子部品の接合構造体及び
接合方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and enables a re-joining of an electronic component joined to a circuit board, and a highly-reliable joining structure of an electronic component and a joining method. The purpose is to provide.
【０００５】[0005]
【課題を解決するための手段】本発明の電子部品の接合
構造体は、電極を有する電子部品と、該電極に対面する
回路基板が粘着層を介して接合された接合構造であっ
て、上記粘着層が、アクリル系ポリマー、カチオン重合
性化合物、光カチオン重合開始剤、及び導電性粒子から
なることを特徴とするものである。The bonding structure of an electronic component according to the present invention is a bonding structure in which an electronic component having an electrode and a circuit board facing the electrode are bonded via an adhesive layer. The adhesive layer comprises an acrylic polymer, a cationically polymerizable compound, a cationic photopolymerization initiator, and conductive particles.
【０００６】又、本発明の電子部品の接合方法は、電極
を有する電子部品と、該電極に対面する回路基板を接合
する際、電子部品又は回路基板のいずれか一方の面に請
求項１に記載の粘着層を積層し、その際、該粘着層に光
を照射することを特徴とする。According to the method for bonding electronic components of the present invention, when bonding an electronic component having an electrode to a circuit board facing the electrode, the electronic component or the circuit board is bonded to one of the surfaces. The adhesive layer described in the above is laminated, and at this time, the adhesive layer is irradiated with light.
【０００７】本発明でいう電極を有する電子部品とは、
半導体実装分野で用いられているＩＣチップに金、銀、
銅、ニッケル、鉛、錫あるいはこれらの合金からなる電
極が形成されたものである。また、回路基板とはＩＣチ
ップが接合される面に電極が設けられたものであり、ガ
ラスエポキシ基板等のリジッド回路基板、ポリイミドフ
ィルム基板等のフレキシブル回路基板を指す。The electronic component having an electrode according to the present invention is
Gold, silver, IC chips used in the semiconductor mounting field
An electrode made of copper, nickel, lead, tin or an alloy thereof is formed. The circuit board has electrodes provided on a surface to which an IC chip is bonded, and refers to a rigid circuit board such as a glass epoxy board or a flexible circuit board such as a polyimide film board.
【０００８】請求項１に記載の発明で、粘着層として耐
候性及び粘着性に優れるアクリル系ポリマーが用いられ
る。アクリル系ポリマーはカチオン重合性化合物、光カ
チオン重合開始剤及び導電性粒子と混合して粘着剤とし
た場合に十分な凝集力を示しかつ粘着性を発現し得るも
のであり、少なくとも（メタ）アクリル酸エステルから
なる単独重合体、２種以上の（メタ）アクリル酸エステ
ルからなる共重合体、（メタ）アクリル酸エステル及び
これに共重合可能な不飽和結合を有するビニルモノマー
との共重合体などを用いることができる。使用する光硬
化性樹脂、重合開始剤及び導電性粒子に応じて適宜選択
すればよく、これらを２種以上併用してもよい。ここ
で、（メタ）アクリルとは、アクリル及びメタアクリル
を総称する表現として用いることとする。In the invention according to the first aspect, an acrylic polymer having excellent weather resistance and adhesiveness is used as the adhesive layer. The acrylic polymer has sufficient cohesive force and can exhibit adhesiveness when mixed with a cationically polymerizable compound, a cationic photopolymerization initiator and conductive particles to form an adhesive, and at least (meth) acrylic Homopolymers of acid esters, copolymers of two or more (meth) acrylates, copolymers of (meth) acrylates and copolymers thereof with a vinyl monomer having an unsaturated bond copolymerizable therewith, etc. Can be used. What is necessary is just to select suitably according to the photocurable resin used, a polymerization initiator, and a conductive particle, and these may use 2 or more types together. Here, (meth) acryl is used as a generic term for acrylic and methacryl.
【０００９】アクリル系ポリマーはカチオン重合性化合
物と相溶性を有するものであってもよく、あるいは相溶
性を有しないものであってもよく、マクロ相分離を起さ
ないものである限りその分子量は大きいものほど好まし
い。ここでマクロ相分離とは、アクリル系ポリマーとカ
チオン重合性化合物とが完全に相分離する現象であっ
て、アクリル系ポリマーまたはカチオン重合性化合物の
いずれか一方または双方が透明性を有する状態で分離す
ることを指し、ミクロ相分離により単に白濁した状態と
は異なる状態である。The acrylic polymer may be compatible with the cationically polymerizable compound, or may be incompatible with the cationic polymerizable compound. The molecular weight of the acrylic polymer is as long as it does not cause macrophase separation. A larger one is more preferable. Here, the macro phase separation is a phenomenon in which an acrylic polymer and a cationic polymerizable compound are completely separated from each other, and the acrylic polymer and the cationic polymerizable compound are separated in a state where one or both of the acrylic polymer and the cationic polymerizable compound have transparency. This is a state that is different from a state that is simply clouded due to microphase separation.
【００１０】アクリル系ポリマーの分子量は大きい方が
好ましいが、特に、重量平均分子量が２０万〜５００万
程度のものが好ましい。重量平均分子量が２０万未満の
場合、粘着層の凝集力が不足して貼り付け時に糸引きを
生じ、剥離することがある。重量平均分子量が５００万
を超えると高分子と光硬化性樹脂とを含む組成物の粘度
が高くなり粘着層が成形され難くなる。The molecular weight of the acrylic polymer is preferably large, and particularly preferably the one having a weight average molecular weight of about 200,000 to 5,000,000. If the weight-average molecular weight is less than 200,000, the adhesive layer may have insufficient cohesive strength, cause stringing at the time of application, and peel off. When the weight average molecular weight exceeds 5,000,000, the viscosity of the composition containing the polymer and the photocurable resin becomes high, and it becomes difficult to form an adhesive layer.
【００１１】請求項１に記載の発明におけるカチオン重
合性化合物は光を照射することにより硬化する樹脂であ
る。光照射後の硬化反応性に優れているために、１分子
中に少なくとも１つのカチオン重合性基を有する樹脂が
用いられる。１分子中に少なくとも１つのカチオン重合
性基を有する樹脂としては、例えば、ビニルエーテル系
樹脂やエポキシ系樹脂などを挙げることができるが、硬
化後の接着性、耐候性、耐薬品性及び耐熱性に優れてい
る点で、エポキシ樹脂が好ましい。The cationically polymerizable compound according to the first aspect of the present invention is a resin that cures when irradiated with light. A resin having at least one cationically polymerizable group in one molecule is used because of its excellent curing reactivity after light irradiation. Examples of the resin having at least one cationically polymerizable group in one molecule include a vinyl ether-based resin and an epoxy-based resin, and the adhesiveness after curing, weather resistance, chemical resistance, and heat resistance. Epoxy resins are preferred in that they are excellent.
【００１２】ビニルエーテル系樹脂としては、ウレタン
ビニルエーテル、ポリエステルビニルエーテル、多官能
性ビニルエーテルオリゴマーなどから選ばれる樹脂中に
ビニロキシ基を有するものが挙げられ、エポキシ樹脂と
しては、例えば、ビスフェノールＡ型エポキシ樹脂、水
添ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ
型エポキシ樹脂、ノボラック型エポキシ樹脂、脂肪族環
式エポキシ樹脂、臭素化エポキシ樹脂、ゴム変成エポキ
シ樹脂、ウレタン変成エポキシ樹脂、グリシジルエステ
ル系化合物、エポキシ化大豆油、エポキシ化エラストマ
ーなどを挙げることができ、これらは複数種併用しても
よい。Examples of the vinyl ether resin include those having a vinyloxy group in a resin selected from urethane vinyl ether, polyester vinyl ether, and polyfunctional vinyl ether oligomer. Epoxy resins include, for example, bisphenol A type epoxy resin, water Bisphenol A type epoxy resin, bisphenol F
Type epoxy resin, novolak type epoxy resin, aliphatic cyclic epoxy resin, brominated epoxy resin, rubber modified epoxy resin, urethane modified epoxy resin, glycidyl ester compound, epoxidized soybean oil, epoxidized elastomer, etc. These may be used in combination of two or more.
【００１３】光カチオン重合開始剤としては、光の照射
により活性化され、カチオン重合を誘発し得る化合物で
ある限り特に限定されるものではない。好ましくは、２
０〜１００℃付近では熱触媒活性の低い化合物が貯蔵安
定性を高める上で好ましい。このような好ましい光カチ
オン重合開始剤としては、例えば、鉄−アレン錯体化合
物、芳香族ジアゾニウム塩、芳香族ヨードニウム塩、芳
香族スルホニウム塩、ピリジニウム塩などが挙げられ
る。The cationic photopolymerization initiator is not particularly limited as long as it is a compound which can be activated by irradiation with light and induce cationic polymerization. Preferably, 2
At around 0 to 100 ° C., a compound having a low thermocatalytic activity is preferred for enhancing storage stability. Examples of such preferred cationic photopolymerization initiators include iron-allene complex compounds, aromatic diazonium salts, aromatic iodonium salts, aromatic sulfonium salts, and pyridinium salts.
【００１４】より具体的には、例えば、オプトマーＳＰ
−１５０（旭電化工業社製）、オプトマーＳＰ１５１
（旭電化工業社製）、オプトマーＳＰ１７１（旭電化工
業社製）、オプトマーＳＰ−１７０（旭電化工業社
製）、ＵＶＥ−１０１４（ゼネラルエレクトロニクス社
製）、ＣＤ−１０１２（サートマー社製）、サンエイド
ＳＩ−６０Ｌ（三新化学工業社製）、サンエイドＳＬ−
８０Ｌ（三新化学工業社製）、サンエイドＳＩ−１００
Ｌ（三新化学工業社製）、ＣＩ−２０６４（日本曹達社
製）、ＣＩ−２６３９（日本曹達社製）、ＣＩ−２６２
４（日本曹達社製）、ＣＩ−２４８１（日本曹達社
製）、 RHODORSIL PHOTOINITIATOR 2074（ローヌ・ロー
ラン社製）などの市販の化合物及びその溶液を用いるこ
とができる。More specifically, for example, Optomer SP
-150 (manufactured by Asahi Denka Kogyo), Optmer SP151
(Asahi Denka Kogyo), Optmer SP171 (Asahi Denka Kogyo), Optmer SP-170 (Asahi Denka Kogyo), UVE-1014 (General Electronics), CD-1012 (Sartomer), Sun Aid SI-60L (manufactured by Sanshin Chemical Industries), Sun Aid SL-
80L (manufactured by Sanshin Chemical Industry Co., Ltd.), Sun-Aid SI-100
L (manufactured by Sanshin Chemical Industry Co., Ltd.), CI-2064 (manufactured by Nippon Soda Co., Ltd.), CI-2639 (manufactured by Nippon Soda Co., Ltd.), CI-262
Commercially available compounds such as No. 4 (manufactured by Nippon Soda Co., Ltd.), CI-2481 (manufactured by Nippon Soda Co., Ltd.), and RHODORSIL PHOTOINITIATOR 2074 (manufactured by Rhone Laurent) and their solutions can be used.
【００１５】光カチオン重合開始剤は複数種併用しても
よく、さらに、重合を促進するために、光増感剤、例え
ばチオキサンソン誘導体化合物を適宜組み合わせて用い
てもよい。A plurality of photocationic polymerization initiators may be used in combination, and a photosensitizer, for example, a thioxanthone derivative compound may be used in an appropriate combination to promote polymerization.
【００１６】請求項１に記載の発明において、導電性粒
子はアクリル系ポリマー、カチオン重合性化合物及び光
カチオン重合開始剤からなる組成物中に分散されてい
る。この場合、分散の態様は電子部品電極と回路基板電
極との導通性、隣接電極間の絶縁性、即ち異方導電性を
発揮させ得るものである限り限定されない。通常、導電
性粒子の粒径をシートの厚みより大きくして異方導電性
を発揮させるので、この場合には隣接する導電性粒子が
直接接触しない限り、面方向において絶縁を確保し得
る。なお、粒径についても接続すべき回路パターンやピ
ッチに応じて適宜選択すればよい。In the first aspect of the present invention, the conductive particles are dispersed in a composition comprising an acrylic polymer, a cationically polymerizable compound, and a cationic photopolymerization initiator. In this case, the mode of dispersion is not limited as long as it can exhibit conductivity between the electronic component electrode and the circuit board electrode, insulation between adjacent electrodes, that is, anisotropic conductivity. Usually, the particle size of the conductive particles is made larger than the thickness of the sheet to exhibit anisotropic conductivity. In this case, as long as adjacent conductive particles do not directly contact, insulation can be ensured in the plane direction. The particle size may be appropriately selected according to the circuit pattern to be connected and the pitch.
【００１７】導電性粒子としては、例えば、金、銀、
銅、ニッケル、パラヂウム、白金、コバルト、ロジウ
ム、イリジウム、鉄、ルテニウム、オスミウム、アルミ
ニウム、亜鉛、錫、鉛などの適宜の金属を粒子状とした
もの、上記金属の合金を粒子状としたもの、酸化錫など
の金属酸化物を粒子状としたもの、カーボンなどの導電
性炭素同素体を粒子状としたもの、ガラス、カーボン、
マイカ、プラスチックなどの絶縁性粒子の表面に導電性
金属をコーティングしたものなどを挙げることができ、
特に限定されない。また、２種以上の導電性粒子を併用
してもよい。更に、粒子の分散性をよくするために、粒
子表面に適当な処理を施すことも可能である。As the conductive particles, for example, gold, silver,
Copper, nickel, palladium, platinum, cobalt, rhodium, iridium, iron, ruthenium, osmium, aluminum, zinc, tin, lead and other suitable metals in the form of particles, alloys of the above metals in the form of particles, Particles of metal oxides such as tin oxide, particles of conductive carbon allotropes such as carbon, glass, carbon,
Mica, such as those coated with conductive metal on the surface of insulating particles such as plastic,
There is no particular limitation. Further, two or more kinds of conductive particles may be used in combination. Further, in order to improve the dispersibility of the particles, it is possible to apply an appropriate treatment to the surface of the particles.
【００１８】導電性粒子の平均粒径は特に限定はされな
いが１〜２０μｍの範囲とすることが望ましい。１μｍ
未満では導電性粒子同士の凝集力が著しくなり、粘着層
の形成に際し導電性粒子を均一に分散させることが困難
となることがあり、２０μｍを超えると、微細な回路の
線間が狭くなった場合に短絡を引き起こす可能性が大き
くなる。The average particle size of the conductive particles is not particularly limited, but is preferably in the range of 1 to 20 μm. 1 μm
If it is less than 30, the cohesive force between the conductive particles becomes remarkable, and it may be difficult to uniformly disperse the conductive particles during the formation of the adhesive layer, and if it exceeds 20 μm, the distance between fine circuit lines becomes narrow. In that case, the possibility of causing a short circuit increases.
【００１９】粘着層の形成方法 本発明の電子部品の接合方法で粘着層を形成する方法
は、既知のキャスティング法、ホットメルト塗工法、Ｕ
Ｖ塗工重合法等を用いることができる。例えば、キャス
ティング法では、高分子、光硬化性樹脂、重合開始剤を
溶剤に溶解し、さらに、導電性粒子を分散させ、得られ
た溶液を離型処理したフィルム上にキャストし、乾燥す
ることにより形成することができる。 Method for Forming Adhesive Layer The method for forming an adhesive layer by the method for bonding electronic components of the present invention includes known casting methods, hot melt coating methods, and U.S. Pat.
A V coating polymerization method or the like can be used. For example, in the casting method, a polymer, a photocurable resin, and a polymerization initiator are dissolved in a solvent, and further, conductive particles are dispersed.The resulting solution is cast on a release-treated film and dried. Can be formed.
【００２０】ホットメルト塗工法では、高分子、光硬化
性樹脂、重合開始剤を加熱混合し、さらに、導電性粒子
を分散させてなる組成物をホットメルト塗工すればよ
い。In the hot melt coating method, a polymer, a photocurable resin, and a polymerization initiator are mixed by heating, and a composition obtained by dispersing conductive particles may be hot melt coated.
【００２１】ＵＶ塗工重合法では、アクリル系ポリマー
を構成するためのアクリル系モノマーを含むモノマー成
分と、カチオン重合性化合物と、光カチオン重合開始剤
と、上記アクリル系モノマー成分を光ラジカル重合する
ためのラジカル重合触媒とを混合し、さらに導電性粒子
を分散する。上記組成物を接合部に塗工し、光カチオン
重合開始剤を活性化せずにラジカル重合触媒を活性化
し、アクリル系ポリマーを得て粘着層とする。この場
合、導電性粒子を均一に分散させ、且つ安定化するため
に、塗工前の組成物には重合で得られるアクリル系ポリ
マーの他に、他のポリマーを添加しておいてもよい。In the UV coating polymerization method, a monomer component containing an acrylic monomer for constituting an acrylic polymer, a cationically polymerizable compound, a photo-cationic polymerization initiator, and photo-radical polymerization of the acrylic monomer component are performed. With a radical polymerization catalyst, and further disperse the conductive particles. The above composition is applied to the joint, and the radical polymerization catalyst is activated without activating the photocationic polymerization initiator, thereby obtaining an acrylic polymer to form an adhesive layer. In this case, in addition to the acrylic polymer obtained by polymerization, another polymer may be added to the composition before coating in order to uniformly disperse and stabilize the conductive particles.
【００２２】接合方法 本発明による電子部品の接合方法は、まず、電極が形成
された回路基板の接合面に、予め貼り合わせる大きさに
合わせた粘着層を貼り付ける。次に、カチオン重合性化
合物が感光する波長を含む光を照射してカチオン重合性
化合物の重合を開始する。この後粘着性を保持した状態
で集積回路等の電子部品を貼り合わせ、室温下で所定の
時間養生することにより硬化を完了させる。しかし、貼
り合わせる際に作業性の簡便性からみて電子部品に粘着
層を貼り合わせることも可能である。 Bonding method In the bonding method of an electronic component according to the present invention, first, an adhesive layer having a size to be bonded in advance is bonded to a bonding surface of a circuit board on which electrodes are formed. Next, the polymerization of the cationically polymerizable compound is started by irradiation with light having a wavelength at which the cationically polymerizable compound is exposed. Thereafter, electronic components such as an integrated circuit are bonded together while maintaining the adhesiveness, and curing is completed by curing at room temperature for a predetermined time. However, it is also possible to attach an adhesive layer to an electronic component in view of the simplicity of workability when attaching.
【００２３】硬化に使用する光は使用する光カチオン重
合開始剤に応じて選ばれ、特に限定されるわけではない
が、好ましくは、２００〜８００ｎｍの波長の成分を含
む光が用いられる。２００ｎｍ未満の波長の光を照射し
た場合にはカチオン重合性化合物の表層のみが硬化して
貼り合わせ時に粘着力を発揮せず、電気部品同士を接合
できないことがある。８００ｎｍを超える光を照射した
場合には十分なエネルギーを重合開始剤に与え難く、カ
チオン重合性化合物を硬化させることが困難となること
がある。より好ましくは、光源の取り扱いが容易である
ため３００〜５００ｎｍの範囲の波長の光が用いられ
る。The light used for curing is selected according to the photo-cationic polymerization initiator used, and is not particularly limited. Preferably, light containing a component having a wavelength of 200 to 800 nm is used. When light having a wavelength of less than 200 nm is irradiated, only the surface layer of the cationically polymerizable compound is cured and does not exhibit an adhesive force at the time of bonding, so that electrical components may not be joined together. When light exceeding 800 nm is irradiated, it is difficult to give sufficient energy to the polymerization initiator, and it may be difficult to cure the cationically polymerizable compound. More preferably, light having a wavelength in the range of 300 to 500 nm is used because the handling of the light source is easy.
【００２４】（作用）本発明の電子部品の接合構造によ
ると、接合のためにアクリル系ポリマーと、カチオン重
合性化合物と、光カチオン重合開始剤からなる粘着層を
用いるので、接続不良時に剥離し、再接合することがで
きる。これにより不良品の発生を抑えることができる。(Function) According to the joint structure of the electronic component of the present invention, since an adhesive layer composed of an acrylic polymer, a cationically polymerizable compound, and a cationic photopolymerization initiator is used for joining, it is peeled off at the time of poor connection. Can be rejoined. As a result, generation of defective products can be suppressed.
【００２５】又、本発明の接合方法によると、請求項１
記載の粘着層を使用した光硬化による接合であるから電
子部品と回路基板との熱膨張率の差によるそりが起こら
ず、硬化後は界面で強く接着され接合の信頼性が高くな
る。更に、急速な加熱を行わないので初期接合時に接合
部以外へ粘着層が流出することなく硬化させることがで
きる。Further, according to the joining method of the present invention, claim 1
Since the bonding is performed by photo-curing using the adhesive layer described above, no warping occurs due to the difference in the coefficient of thermal expansion between the electronic component and the circuit board. Furthermore, since rapid heating is not performed, the adhesive layer can be cured without flowing out of the adhesive layer to portions other than the joint at the time of the initial joining.
【００２６】[0026]
【発明の実施の形態】以下、本発明の実施例を説明す
る。 （実施例１）２Ｌセパラブルフラスコ中で、高分子とし
てエチルアクリレート（ＥＡ）とグリシジルメタクリレ
ート（ＧＭＡ）との共重合体（重量平均分子量７０万、
組成比：ＥＡ／ＧＭＡ＝８／２（重量比））１００ｇ
と、光硬化性樹脂としてエポキシ樹脂（油化シェルエポ
キシ社製、商品名：エピコート８２８）１００ｇと、光
カチオン重合開始剤（旭電化工業社製、商品名：オプト
マーＳＰ−１７０）１．０ｇと、導電性粒子としてニッ
ケル粉（平均粒径１５μｍ）４０ｇとを酢酸エチル３０
０ｇ中で均一となるまで攪拌溶解して粘着層を得た。Embodiments of the present invention will be described below. (Example 1) In a 2 L separable flask, a copolymer of ethyl acrylate (EA) and glycidyl methacrylate (GMA) (polymer having a weight average molecular weight of 700,000,
Composition ratio: EA / GMA = 8/2 (weight ratio)) 100 g
100 g of an epoxy resin (trade name: Epicoat 828, manufactured by Yuka Shell Epoxy Co., Ltd.) as a photocurable resin, and 1.0 g of a cationic photopolymerization initiator (trade name: Optomer SP-170, manufactured by Asahi Denka Kogyo Co., Ltd.) 40 g of nickel powder (average particle size 15 μm) as conductive particles and ethyl acetate 30
The mixture was stirred and dissolved until it became uniform in 0 g to obtain an adhesive layer.
【００２７】得られた粘着層を、表面が離型処理された
ポリエチレンテレフタレート（ＰＥＴ）フィルムに乾燥
後の厚みが２０μｍとなるように塗工して粘着シートを
作製した。The obtained pressure-sensitive adhesive layer was coated on a polyethylene terephthalate (PET) film having a surface subjected to a release treatment so that the thickness after drying became 20 μm to prepare a pressure-sensitive adhesive sheet.
【００２８】性能評価 （１）再接着性 厚み５０μｍのポリイミドフィルム上に２００μｍのピ
ッチで銅配線パターンが形成されているフレキシブルプ
リント基板（ＦＰＣ）に、上記粘着シートの粘着層を転
写して該粘着層面にＩＣチップを接着した。その後ＩＣ
チップを剥離したところ、ＩＣチップは完全に界面剥離
し再接着可能な状態であった。Performance Evaluation (1) Re-adhesiveness The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet was transferred to a flexible printed circuit board (FPC) in which a copper wiring pattern was formed at a pitch of 200 μm on a polyimide film having a thickness of 50 μm. An IC chip was bonded to the layer surface. Then IC
When the chip was peeled off, the IC chip was completely peeled off at the interface and was in a re-attachable state.
【００２９】（２）接着力 上記ＦＰＣに粘着シートを貼り合わせ、ＰＥＴフィルム
側から高圧水銀灯で７５０ｍｊ／ｃｍ2 の強度で紫外線
を照射した。その後ＰＥＴフィルムを剥離し、ＩＣチッ
プを３０ｋｇｆ／ｃｍ2 の圧力で圧着することにより接
合し、紫外線照射から７日間２５℃の温度で養生した。
この接合体をＦＰＣの幅１０ｍｍにつき剥離速度５０ｍ
ｍ／分で１８０度剥離したときの剥離強度を測定して接
着力とした。この結果、接着力は１．３１ｋｇｆ／１０
ｍｍであり、充分な接着力であることが判った。(2) Adhesive Strength An adhesive sheet was stuck to the FPC, and ultraviolet light was irradiated from the PET film side with a high-pressure mercury lamp at an intensity of 750 mj / cm 2 . Thereafter, the PET film was peeled off, and the IC chip was bonded by pressure bonding at a pressure of 30 kgf / cm 2 , and cured at a temperature of 25 ° C. for 7 days from irradiation with ultraviolet rays.
This bonded body is peeled at a speed of 50 m per 10 mm width of the FPC.
The peel strength at the time of 180 ° peeling at m / min was measured and defined as the adhesive strength. As a result, the adhesive strength was 1.31 kgf / 10
mm, which proved to be sufficient adhesive strength.
【００３０】（３）接続抵抗 図１及び図２に示すように、一方の面に接続部分が２０
０μｍピッチで互いに平行な銅配線１，１の配線パター
ンが形成されているフレキシブルプリント回路基板（Ｆ
ＰＣ）２を２枚用意し、ＦＰＣ２，２の互いの配線パタ
ーンが形成されている面同士を対向させ、上記粘着シー
トに形成した粘着層３を用いて貼り合わせた。なお、破
線で示す銅配線１は下面に形成されていることを示す。
この場合、貼り合わせにより得られた接合体の端部間の
抵抗値ａ、すなわち一方のＦＰＣ上の銅配線パターンの
接合部分とは反対側の端部と、他方のＦＰＣ２における
銅配線パターンの接合部分と反対側の端部との間の抵抗
値と、隣合っている配線パターン間の抵抗値ｂとを測定
した。(3) Connection Resistance As shown in FIG. 1 and FIG.
A flexible printed circuit board (F) on which wiring patterns of copper wirings 1 and 1 parallel to each other are formed at a pitch of 0 μm.
Two PCs) 2 were prepared, the surfaces of the FPCs 2 and 2 on which the wiring patterns were formed faced each other, and were bonded together using the adhesive layer 3 formed on the adhesive sheet. Note that the copper wiring 1 indicated by a broken line indicates that it is formed on the lower surface.
In this case, the resistance a between the ends of the joined body obtained by bonding, that is, the joining of the copper wiring pattern on the other FPC2 to the end opposite to the joining part of the copper wiring pattern on one FPC. The resistance value between the portion and the opposite end and the resistance value b between adjacent wiring patterns were measured.
【００３１】その結果、この接合体は、対向する配線間
の抵抗値は３．２Ω、隣接配線間の抵抗値は１０００Ω
以上であり、通常の異方性導電膜として用いられている
異方導電性を有するものであった。As a result, in this joined body, the resistance between the opposing wirings was 3.2Ω, and the resistance between the adjacent wirings was 1000Ω.
This is the one having anisotropic conductivity used as a normal anisotropic conductive film.
【００３２】（比較例１）市販の異方性導電膜（ソニー
ケミカル社製，商品名「ＣＰ７６２１」）を使用して実
施例１で用いたものと同じＦＰＣとＩＣチップを接合し
た。接合は１６０℃の温度と２５０ｋｇｆ／ｃｍ2 の圧
力で行った。その結果、両者は完全に接合され、剥離し
て再接合することは不可能であった。Comparative Example 1 A commercially available anisotropic conductive film (trade name “CP7621”, manufactured by Sony Chemical Co., Ltd.) was used to bond the same FPC as that used in Example 1 to an IC chip. The joining was performed at a temperature of 160 ° C. and a pressure of 250 kgf / cm 2 . As a result, the two were completely joined, and it was impossible to peel and rejoin.
【００３３】[0033]
【発明の効果】本発明の電子部品の接合構造体による
と、回路基板に接合された電子部品の接合不良時に剥離
でき、再接着することができる。これにより不良品の発
生を抑えることができる。また、通常の異方性導電膜と
して用いられている異方導電性を有するものであり、半
導体の実装に用いられる電子部品の接合構造として好適
に用いられる。また、本発明の電子部品の接合方法によ
ると、光硬化による接合であるから電子部品と回路基板
との熱膨張率の差によるそりが起こらず、硬化後は界面
で強く接着されるので信頼性の高い接合構造体が得られ
る。According to the electronic component bonding structure of the present invention, the electronic component bonded to the circuit board can be peeled off and re-attached when the bonding is defective. As a result, generation of defective products can be suppressed. Further, it has anisotropic conductivity used as a normal anisotropic conductive film, and is suitably used as a bonding structure of an electronic component used for mounting a semiconductor. In addition, according to the method for bonding electronic components of the present invention, since the bonding is performed by photo-curing, no warping occurs due to the difference in the coefficient of thermal expansion between the electronic component and the circuit board. High joining structure can be obtained.
【図１】実施例１で得た粘着剤の接着力評価で用いた２
枚のＦＰＣの接合体を説明するための平面図。FIG. 1 shows 2 used in the evaluation of the adhesive strength of the pressure-sensitive adhesive obtained in Example 1.
FIG. 4 is a plan view for explaining a joined body of FPCs.
【図２】図１の側面図。FIG. 2 is a side view of FIG. 1;
【図３】従来の接合構造の例を示す断面図。FIG. 3 is a cross-sectional view showing an example of a conventional bonding structure.
【符号の説明】 １：銅配線 ２：回路基板 ３：粘着層 ４：電子部品 ５：電極 ６：異方性導電材料[Explanation of Signs] 1: Copper wiring 2: Circuit board 3: Adhesive layer 4: Electronic component 5: Electrode 6: Anisotropic conductive material
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4J004 AA08 AA10 AA13 AA17 AA18 AA19 AB07 BA02 DB03 FA05 4J040 DF041 DF051 EC061 EC071 EC151 EC211 EC241 EC261 EC281 EC371 EC401 FA271 FA291 HA026 HA066 HA076 HA136 HA346 HA356 HB06 HC14 HC22 HD18 HD43 JA09 JB09 KA03 KA07 KA13 KA32 LA01 MB05 NA20 PA32 5E051 CA03 5E319 BB13 BB16 CC61 CD57 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4J004 AA08 AA10 AA13 AA17 AA18 AA19 AB07 BA02 DB03 FA05 4J040 DF041 DF051 EC061 EC071 EC151 EC211 EC241 EC261 EC281 EC371 EC401 FA271 FA291 HA026 HA066 HA076 HA136 HA346 HA356 HB06 HD14 HC22 KA03 KA07 KA13 KA32 LA01 MB05 NA20 PA32 5E051 CA03 5E319 BB13 BB16 CC61 CD57
Claims (3)
する回路基板が粘着層を介して接合された接合構造であ
って、上記粘着層が、アクリル系ポリマー、カチオン重
合性化合物、光カチオン重合開始剤、及び導電性粒子か
らなることを特徴とする電子部品の接合構造体。1. A bonding structure in which an electronic component having an electrode and a circuit board facing the electrode are bonded via an adhesive layer, wherein the adhesive layer is formed of an acrylic polymer, a cation polymerizable compound, and a photo cation. What is claimed is: 1. A joint structure for an electronic component, comprising: a polymerization initiator; and conductive particles.
する回路基板を接合する際、電子部品又は回路基板のい
ずれか一方の面に請求項１に記載の粘着層を積層し、そ
の際、該粘着層に光を照射することを特徴とする電子部
品の接合方法。2. When bonding an electronic component having an electrode to a circuit board facing the electrode, the adhesive layer according to claim 1 is laminated on either one of the electronic component or the circuit board. And irradiating the adhesive layer with light.
の接合方法。3. The bonding method according to claim 2, wherein the adhesive layer is a sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10255465A JP2000086987A (en) | 1998-09-09 | 1998-09-09 | Bonded structure of electronic component and its adhesive bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10255465A JP2000086987A (en) | 1998-09-09 | 1998-09-09 | Bonded structure of electronic component and its adhesive bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000086987A true JP2000086987A (en) | 2000-03-28 |
Family
ID=17279151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10255465A Withdrawn JP2000086987A (en) | 1998-09-09 | 1998-09-09 | Bonded structure of electronic component and its adhesive bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000086987A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326281A (en) * | 2001-04-27 | 2002-11-12 | Sekisui Chem Co Ltd | Method for manufacturing substrate for mounting electronic parts |
| US6921782B2 (en) | 2001-01-24 | 2005-07-26 | Sony Chemicals Corp. | Adhesive and electric device |
| JP2005276873A (en) * | 2004-03-23 | 2005-10-06 | Tatsuta System Electronics Kk | Shielding film for printed wiring board and its manufacturing method |
| US7419387B2 (en) | 2003-09-30 | 2008-09-02 | J.S.T. Mfg. Co., Ltd. | Electric connection member utilizing ansiotropically conductive sheets |
| JP2010239141A (en) * | 2010-05-31 | 2010-10-21 | Tatsuta Electric Wire & Cable Co Ltd | Shielding film for printed wiring board and method for manufacturing the same |
| US8205327B2 (en) | 2005-11-21 | 2012-06-26 | Panasonic Corporation | Method for manufacturing circuit board on which electronic component is mounted |
-
1998
- 1998-09-09 JP JP10255465A patent/JP2000086987A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6921782B2 (en) | 2001-01-24 | 2005-07-26 | Sony Chemicals Corp. | Adhesive and electric device |
| JP2002326281A (en) * | 2001-04-27 | 2002-11-12 | Sekisui Chem Co Ltd | Method for manufacturing substrate for mounting electronic parts |
| US7419387B2 (en) | 2003-09-30 | 2008-09-02 | J.S.T. Mfg. Co., Ltd. | Electric connection member utilizing ansiotropically conductive sheets |
| JP2005276873A (en) * | 2004-03-23 | 2005-10-06 | Tatsuta System Electronics Kk | Shielding film for printed wiring board and its manufacturing method |
| JP4647924B2 (en) * | 2004-03-23 | 2011-03-09 | タツタ電線株式会社 | Shield film for printed wiring board and method for producing the same |
| US8205327B2 (en) | 2005-11-21 | 2012-06-26 | Panasonic Corporation | Method for manufacturing circuit board on which electronic component is mounted |
| JP2010239141A (en) * | 2010-05-31 | 2010-10-21 | Tatsuta Electric Wire & Cable Co Ltd | Shielding film for printed wiring board and method for manufacturing the same |
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