JP2000086989A - Joint structure of display device and joining - Google Patents
Joint structure of display device and joiningInfo
- Publication number
- JP2000086989A JP2000086989A JP10260233A JP26023398A JP2000086989A JP 2000086989 A JP2000086989 A JP 2000086989A JP 10260233 A JP10260233 A JP 10260233A JP 26023398 A JP26023398 A JP 26023398A JP 2000086989 A JP2000086989 A JP 2000086989A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- anisotropic conductive
- conductive material
- substrate
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線基板（ＦＰＣ）やテープキャリア（ＴＡＢ）を
表示素子の液晶基板に導電接続するための接続構造体及
び接続方法に関する。The present invention relates to a connection structure and a connection method for conductively connecting a flexible printed circuit board (FPC) or a tape carrier (TAB) to a liquid crystal substrate of a display device.
【０００２】[0002]
【従来の技術】液晶パネルのガラス基板上に設けられた
ＩＴＯガラスなどの透明電極上に、例えば駆動用ＩＣを
導電接続する場合、異方性導電材料を用いてフィルムキ
ャリアによる接合方法が多く行われている。図１は従来
から行われているフィルムキャリア実装構造の断面図を
示し、フィルムキャリアである駆動回路基板１はポリイ
ミド等の可撓性絶縁フィルム１１上に形成された多数の
リード箔１２が集積回路素子１４の端子１３に接続され
たものである。２０は液晶セルであり、配向膜２３を有
する基板２と透明電極膜３１とがスペーサー５で一定の
間隔をあけて貼り合わされ、その間隔内に液晶層４が挟
持され、偏光子等（図示せず）が基板２の両側に貼り合
わされたものである。駆動回路基板１上に形成されたリ
ード箔１２と液晶セル２０の透明電極膜３１は、接着剤
６中に導電性粒子７が分散された異方性導電膜８を介し
て熱圧着されている。2. Description of the Related Art For example, when a driving IC is conductively connected to a transparent electrode such as ITO glass provided on a glass substrate of a liquid crystal panel, a bonding method using a film carrier using an anisotropic conductive material is often performed. Have been done. FIG. 1 is a cross-sectional view of a conventional film carrier mounting structure. A drive circuit board 1 as a film carrier has a large number of lead foils 12 formed on a flexible insulating film 11 of polyimide or the like. It is connected to the terminal 13 of the element 14. Reference numeral 20 denotes a liquid crystal cell, in which the substrate 2 having the alignment film 23 and the transparent electrode film 31 are adhered to each other with a spacer 5 at a fixed interval, and the liquid crystal layer 4 is sandwiched within the interval, and a polarizer or the like (not shown). ) Is bonded to both sides of the substrate 2. The lead foil 12 formed on the drive circuit board 1 and the transparent electrode film 31 of the liquid crystal cell 20 are thermocompression bonded via an anisotropic conductive film 8 in which conductive particles 7 are dispersed in an adhesive 6. .
【０００３】上記異方性導電膜は、例えば特開平８−２
７３４４２号公報や特開平９−６３３５５号公報に示さ
れているように、熱可塑性樹脂や熱硬化性樹脂をベース
とし、ニッケル、金、はんだ等の金属粒子あるいはスチ
レン樹脂等よりなる粒子表面をニッケル−金等の導電層
により被覆した粒子等の導電性粒子が分散されたもので
ある。The above-mentioned anisotropic conductive film is disclosed in, for example, JP-A-8-2
No. 73442 or JP-A-9-63355, based on a thermoplastic resin or a thermosetting resin, a metal particle such as nickel, gold, solder, or the like, or a particle surface made of styrene resin or the like. -Dispersion of conductive particles such as particles coated with a conductive layer of gold or the like.
【０００４】上記公報に記載の実装構造は、接続部を加
熱状態で固定するため、固定後に接着部分での残留応力
及び材料間の熱膨張係数の差により、接着強度の低下や
接続不良が発生し、長期間における信頼性に欠けるとい
う問題があった。また、従来の接合方法では加熱工程が
含まれているので、加熱装置を必要とし、接着樹脂を加
熱した状態で使用することが必要であった。[0004] In the mounting structure described in the above publication, since the connection portion is fixed in a heated state, a decrease in bonding strength or poor connection occurs due to a residual stress in the bonding portion and a difference in thermal expansion coefficient between materials after the fixing. However, there is a problem that reliability over a long period is lacking. In addition, since the conventional bonding method includes a heating step, a heating device is required, and it is necessary to use the adhesive resin in a heated state.
【０００５】更に、液晶ディスプレイモジュール等の接
続のように、或る温度に達すると熱劣化が生じる場合に
は上記の方法を用いることができなかった。Further, when thermal deterioration occurs when a certain temperature is reached, such as in connection of a liquid crystal display module or the like, the above method cannot be used.
【０００６】近年、液晶表示装置の軽量化、薄型化が進
められており、基板としてガラス基板の代わりにポリエ
チレンテレフタレートやポリエーテルスルホン等の樹脂
よりなるフィルム基板を使用した液晶ディスプレイパネ
ルが実用化されつつある。このような基板は当然のこと
ながらガラス基板よりも耐熱性が低いため、加熱工程を
必要としない接続方法が望まれている。In recent years, the weight and thickness of liquid crystal display devices have been reduced, and liquid crystal display panels using a film substrate made of a resin such as polyethylene terephthalate or polyethersulfone instead of a glass substrate have been put to practical use. It is getting. Naturally, such a substrate has lower heat resistance than a glass substrate, and thus a connection method that does not require a heating step is desired.
【０００７】[0007]
【発明が解決しようとする課題】本発明は上記の問題点
に鑑み、表示素子の液晶基板上に形成された引き出し電
極端子と、駆動回路基板上に形成された接続端子とを異
方性導電材料を介して接続するに際し、加熱工程を必要
とせず、導電不良や表示品質が低下しない表示装置の接
続構造体及び接続方法を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, the present invention relates to a method of connecting an extraction electrode terminal formed on a liquid crystal substrate of a display element and a connection terminal formed on a drive circuit substrate to an anisotropic conductive material. It is an object of the present invention to provide a connection structure and a connection method of a display device which does not require a heating step when connecting via a material and does not cause poor conductivity or display quality.
【０００８】[0008]
【課題を解決するための手段】請求項１に記載の表示装
置の接続構造は、表示素子の液晶基板上に形成された引
き出し電極端子と、駆動回路基板の接続端子とが、異方
性導電材料を介して接合された表示装置の接続構造体で
あって、上記異方性導電材料が、カチオン重合性化合
物、光カチオン重合開始剤、及び導電性粒子からなるこ
とを特徴とするものである。According to a first aspect of the present invention, there is provided a connection structure for a display device, wherein a lead electrode terminal formed on a liquid crystal substrate of a display element and a connection terminal of a drive circuit board are connected to an anisotropic conductive material. A connection structure of a display device joined via a material, wherein the anisotropic conductive material includes a cationically polymerizable compound, a photo-cationic polymerization initiator, and conductive particles. .
【０００９】請求項２に記載の表示装置の接続方法は、
表示素子の液晶基板上に形成された引き出し電極端子
上、又は駆動回路基板の接続端子上に、請求項１記載の
異方性導電材料の層を形成する工程、異方性導電材料に
光を照射する工程、及び上記両端子を位置合わせした
後、圧着する工程とからなることを特徴とする。[0009] The method for connecting a display device according to claim 2 is
Forming a layer of the anisotropic conductive material according to claim 1 on a lead electrode terminal formed on a liquid crystal substrate of a display element or on a connection terminal of a drive circuit board; It is characterized by comprising a step of irradiating and a step of crimping after aligning the two terminals.
【００１０】本発明で表示素子の液晶基板とは、液晶デ
ィスプレイパネル、プラズマディスプレイパネル、プラ
ズマアドレスディスプレイパネル、エレクトロルミネッ
セントディスプレイパネルなどである。これら表示素子
基板には各表示セルに駆動回路からの情報を伝えるため
の引き出し電極が通常は端部に設けられている。液晶デ
ィスプレイなどの場合は引き出し電極は表示セルの電極
と同時に形成されるためＩＴＯガラスなどの透明電極で
あるが、本発明では基板自体は非透光性のものであって
も使用できるので引き出し電極は金や銅などであっても
よい。In the present invention, the liquid crystal substrate of the display element is a liquid crystal display panel, a plasma display panel, a plasma addressed display panel, an electroluminescent display panel, or the like. The display element substrate is usually provided with an extraction electrode for transmitting information from the drive circuit to each display cell at an end. In the case of a liquid crystal display or the like, the extraction electrode is formed at the same time as the electrode of the display cell, and thus is a transparent electrode such as ITO glass. May be gold or copper.
【００１１】駆動回路基板としてはＦＰＣやＴＡＢのよ
うなフィルムキャリアの場合に特に効果を発揮するが、
硬質プリント配線基板、透明電気配線ガラス基板などに
も使用することができる。The drive circuit board is particularly effective in the case of a film carrier such as FPC or TAB.
It can also be used for rigid printed wiring boards, transparent electric wiring glass substrates, and the like.
【００１２】本発明で使用するカチオン重合性化合物
は、カチオン重合により高分子量化する部分、例えば、
ビニルエーテル基、エピスルフィド基、エチレンイミン
基を有する化合物、環状エーテル化合物（エポキシ化合
物、オキセタン化合物、オキソラン化合物）が用いられ
る。カチオン重合により高分子量化し得る部分は、分子
骨格の末端であっても、側鎖であっても、分子骨格内で
あってもよい。用いられる化合物の分子量は制限がな
く、モノマー、オリゴマー、ポリマーのいずれでも使用
可能である。また、これらのカチオン性化合物を２種類
以上併用してもよい。The cationically polymerizable compound used in the present invention may be a portion which has a high molecular weight by cationic polymerization, for example,
Compounds having a vinyl ether group, episulfide group, ethyleneimine group, and cyclic ether compounds (epoxy compounds, oxetane compounds, oxolane compounds) are used. The portion that can be increased in molecular weight by cationic polymerization may be at the end of the molecular skeleton, a side chain, or within the molecular skeleton. The molecular weight of the compound used is not limited, and any of monomers, oligomers and polymers can be used. Further, two or more of these cationic compounds may be used in combination.
【００１３】本発明ではカチオン重合性化合物としてエ
ポキシ基を有する化合物が特に好ましい。この理由はエ
ポキシ基の開環重合は反応性が高く、且つ硬化時間が短
いため接着工程を短縮することができ、凝集力及び弾性
率も高いため耐熱性及び接着強度に優れた接着硬化物が
得られるからである。In the present invention, a compound having an epoxy group is particularly preferred as the cationically polymerizable compound. The reason for this is that ring-opening polymerization of epoxy groups is highly reactive, and the curing time is short, so that the bonding process can be shortened, and since the cohesion and elasticity are high, an adhesive cured product having excellent heat resistance and adhesive strength can be obtained. Because it is obtained.
【００１４】エポキシ基を有する化合物としては、エポ
キシ樹脂が好適に用いられる。エポキシ樹脂としては、
ビスフェノールＡ型、ビスフェノールＦ型、フェノール
ノボラック型、グリシジルエーテル型、グリシジルアミ
ン型、脂環式のもの、グリシジルメタクリレートが挙げ
られる。As the compound having an epoxy group, an epoxy resin is preferably used. As epoxy resin,
Examples include bisphenol A type, bisphenol F type, phenol novolak type, glycidyl ether type, glycidylamine type, alicyclic type, and glycidyl methacrylate.
【００１５】カチオン重合性化合物は他の樹脂成分を配
合もしくは付加して可撓性を高めたり、接着力や屈曲力
の向上を図ってもよい。このような変性物としては末端
カルボキシル基含有ブタジエンアクリロニトリルゴム
（ＣＴＢＮ）変性エポキシ樹脂、アクリルゴム、ブタジ
エン−アクリロニトリルゴム（ＮＢＲ）、スチレン−ブ
タジエンゴム（ＳＢＲ）、ブチルゴム、ニトリルゴム、
イソプレンゴム、またはこれらの微粒子などを添加して
なるエポキシ樹脂、キレート変性エポキシ樹脂、ポリオ
ール変性エポキシ樹脂、アエロジル、シリカ、アルミナ
等の無機物を用いることができる。The cationically polymerizable compound may be blended or added with another resin component to increase flexibility or to improve adhesive strength and bending strength. Such modified products include terminal carboxyl group-containing butadiene acrylonitrile rubber (CTBN) -modified epoxy resin, acrylic rubber, butadiene-acrylonitrile rubber (NBR), styrene-butadiene rubber (SBR), butyl rubber, nitrile rubber,
Inorganic substances such as isoprene rubber, epoxy resin to which fine particles of these are added, chelate-modified epoxy resin, polyol-modified epoxy resin, Aerosil, silica, and alumina can be used.
【００１６】粘着剤組成物中に含まれるカチオン重合性
官能基当量は５０００ｇ ｒｅｓｉｎ／ｍｏｌ以下であ
ることが好ましい。これよりも当量が大きくなると組成
物中の官能基濃度が低下してカチオン重合が不充分とな
り接着力が低下する。The equivalent of the cationically polymerizable functional group contained in the pressure-sensitive adhesive composition is preferably not more than 5000 g resin / mol. If the equivalent weight is larger than this, the concentration of the functional group in the composition will decrease, and the cationic polymerization will be insufficient, and the adhesive strength will decrease.
【００１７】光カチオン重合開始剤はイオン性光酸発生
タイプ及び非イオン性光酸発生タイプのいずれでもよ
い。イオン性光酸発生タイプとしては芳香族ジアゾニウ
ム塩、芳香族ハロニウム塩、芳香族スルホニウム塩のオ
ニウム塩や、鉄−アレン錯体化合物、チタセノン錯体化
合物、アリールシラノール−アルミニウム錯体化合物な
どの有機金属錯体化合物などが挙げられる。The cationic photopolymerization initiator may be either an ionic photoacid generating type or a nonionic photoacid generating type. Examples of the ionic photoacid generating type include aromatic diazonium salts, aromatic halonium salts, onium salts of aromatic sulfonium salts, and organometallic complex compounds such as iron-allene complex compounds, titasenone complex compounds, and arylsilanol-aluminum complex compounds. Is mentioned.
【００１８】より具体的には、例えば、オプトマーＳＰ
−１５０（旭電化工業社製）、オプトマーＳＰ−１７０
（旭電化工業社製）、ＵＶＥ−１０１４（ゼネラルエレ
クトロニクス社製）、ＣＰ−１０１２（サートマー社
製）などの市販の化合物を用いることができる。また、
非イオン性光酸発生タイプとしては、ニトロベンジルエ
ステル、スルホン酸誘導体、リン酸エステル、フェノー
ルスルホン酸エステル、ジアゾナフトキノン、Ｎ−ヒド
ロキシイミドスルホナートなどを用いることができる。More specifically, for example, Optomer SP
-150 (manufactured by Asahi Denka Kogyo KK), Optmer SP-170
Commercially available compounds such as (Asahi Denka Kogyo), UVE-1014 (General Electronics), and CP-1012 (Sartomer) can be used. Also,
As the nonionic photoacid generating type, nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenolsulfonic acid ester, diazonaphthoquinone, N-hydroxyimidesulfonate and the like can be used.
【００１９】光カチオン重合開始剤は単独で用いてもよ
く、２種以上を併用してもよい。また、有効活性波長の
異なる複数の光カチオン重合開始剤を用いて２段階硬化
させてもよい。The cationic photopolymerization initiator may be used alone or in combination of two or more. Further, two-stage curing may be performed using a plurality of cationic photopolymerization initiators having different effective active wavelengths.
【００２０】光カチオン重合開始剤の配合量は、エポキ
シ基１ｍｏｌに対してカチオンが０．０００１ｍｏｌ％
以上発生するようにするのが好ましい。カチオンがこれ
よりも少ないとカチオン重合が充分に進行せず、硬化速
度が遅くなる。The amount of the cationic photopolymerization initiator is 0.0001 mol% of cation to 1 mol of epoxy group.
It is preferable that this occurs. If the number of cations is less than this, the cationic polymerization does not proceed sufficiently, and the curing rate becomes slow.
【００２１】導電性粒子としては、ニッケル、黒鉛、
銅、金、はんだ等の金属導電粒子と、硬化エポキシ樹
脂、フェノール樹脂、ポリスチレン樹脂等を核とし、こ
の表面に金属薄膜メッキを施した金属薄膜メッキ樹脂粒
子が挙げられる。The conductive particles include nickel, graphite,
Metal conductive particles of copper, gold, solder, etc., and metal thin film-plated resin particles having a hardened epoxy resin, a phenol resin, a polystyrene resin or the like as a nucleus and a metal thin film plated on the surface thereof.
【００２２】上記組成物からなる異方性導電材料はその
まま液状の接着剤として用いてもよく、薄いシート状と
して用いてもよい。シート状とするには離型処理された
支持体上にロールコート法、グラビアコート法、押出し
法などの各種手段で塗工し、乾燥させればよい。シート
化された異方性導電材料は取扱い易いように剥離シート
で表面を被覆してもよい。支持体、剥離シートにはポリ
エチレンテレフタレート、ポリエチレン、ポリプロピレ
ン、ナイロン、セルロース等のシートを用いることがで
きる。The anisotropic conductive material comprising the above composition may be used as it is as a liquid adhesive, or may be used as a thin sheet. In order to form a sheet, the support which has been subjected to the release treatment may be applied by various means such as a roll coating method, a gravure coating method, and an extrusion method, and dried. The surface of the anisotropic conductive material formed into a sheet may be covered with a release sheet for easy handling. A sheet of polyethylene terephthalate, polyethylene, polypropylene, nylon, cellulose, or the like can be used for the support and the release sheet.
【００２３】特にシート状とする場合には粘着性を調整
するために、一般的なゴム、アクリル型、シリコーン
型、ポリウレタン型、ポリエステル型、ポリエーテル型
の粘着ポリマーを添加してもよい。特にアクリル型ポリ
マーは単独で粘着性を有するので好ましい。アクリル型
粘着ポリマーでは、アルキル（メタ）アクリレートを主
成分とする（共）重合体で、そのうちアルキル基として
メチル、エチル、ｎ−ブチル、ｉ−ブチル、ヘキシル、
オクチル、１−オクチル、２−エチルヘキシル、ノニル
等のものが好適である。In particular, in the case of forming a sheet, a general rubber, acrylic type, silicone type, polyurethane type, polyester type or polyether type adhesive polymer may be added in order to adjust the adhesiveness. In particular, an acrylic polymer is preferable because it alone has tackiness. The acrylic adhesive polymer is a (co) polymer having an alkyl (meth) acrylate as a main component, of which methyl, ethyl, n-butyl, i-butyl, hexyl,
Those such as octyl, 1-octyl, 2-ethylhexyl and nonyl are preferred.
【００２４】次に、本発明の表示装置の接続方法を説明
する。まず液晶基板と駆動回路基板との少なくとも一方
の面に請求項１記載の異方性導電材料を積層する。異方
性導電材料を液状で用いる場合は、接続する両者を圧着
した後、所定の厚みとなるように必要量を適宜の手段で
塗布する。シート状で使用する場合は、離型シート上に
形成した粘着層を離型シートとともに所定の形状に切り
取って一方の面に貼り合わせる。その後、異方性導電材
料を積層した部分に活性エネルギー光線を照射し、他方
の材料の電極との位置合わせをして圧着する。圧着後は
カチオン重合による硬化が進行し、短時間で充分な接着
強度が得られる。Next, a method of connecting the display device of the present invention will be described. First, the anisotropic conductive material according to claim 1 is laminated on at least one surface of the liquid crystal substrate and the drive circuit substrate. In the case where the anisotropic conductive material is used in a liquid state, a necessary amount is applied by an appropriate means so as to have a predetermined thickness after the two to be connected are pressed. When used in the form of a sheet, the pressure-sensitive adhesive layer formed on the release sheet is cut into a predetermined shape together with the release sheet and bonded to one surface. Thereafter, a portion where the anisotropic conductive material is laminated is irradiated with an active energy ray, and is aligned with the electrode of the other material and pressed. After pressure bonding, curing by cationic polymerization proceeds, and sufficient adhesive strength can be obtained in a short time.
【００２５】いずれかの基板が光透過性の場合は、被着
体を貼り合わせた後に光透過性側より光を照射して硬化
させることも可能であるが、表示素子として液晶を用い
ている場合などは液晶面に活性エネルギーが照射される
と液晶の異常配向が生じて表示品質が低下するので好ま
しくない。When any one of the substrates is light-transmitting, it is possible to cure by irradiating light from the light-transmitting side after attaching the adherend, but liquid crystal is used as a display element. In such a case, when the liquid crystal surface is irradiated with active energy, abnormal orientation of the liquid crystal is caused to deteriorate the display quality, which is not preferable.
【００２６】活性エネルギー光線は使用する硬化触媒に
応じて選ばれるが、２００〜８００ｎｍの波長を含む光
が好ましい。２００ｎｍ未満の波長の光を照射すると異
方性導電材料の表層だけが硬化し、貼り合わせ時に粘着
力が発揮されず接続不良となることがある。８００ｎｍ
を超える波長の光を照射すると、硬化に必要なエネルギ
ーが硬化触媒に与えられず、硬化させることが困難とな
ることがある。特に、３００〜５００ｎｍの範囲の波長
の光を発生する光源を用いると、光源を取扱い易いので
より好ましい。The active energy ray is selected according to the curing catalyst used, but light having a wavelength of 200 to 800 nm is preferred. When light having a wavelength of less than 200 nm is irradiated, only the surface layer of the anisotropic conductive material is hardened, and adhesiveness may not be exhibited at the time of bonding, resulting in poor connection. 800 nm
When light having a wavelength exceeding the above range is used, energy required for curing is not given to the curing catalyst, and curing may be difficult. In particular, it is more preferable to use a light source that generates light having a wavelength in the range of 300 to 500 nm because the light source is easy to handle.
【００２７】上記光源としては、紫外線や可視光線とし
て低圧水銀灯、中圧水銀灯、高圧水銀灯、超高圧水銀
灯、ケミカルハライドランプ、ブラックライトランプ、
マイクロウエーブ励起水銀灯、メタルハライドランプ、
蛍光灯、太陽光などを挙げることができる。表層だけの
硬化を防止し、内部硬化を実現するには２００ｎｍ未満
の光をカットして照射することが好ましい。The light source may be a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a chemical halide lamp, a black light lamp,
Microwave excited mercury lamp, metal halide lamp,
Fluorescent lamps and sunlight can be mentioned. In order to prevent curing of only the surface layer and realize internal curing, it is preferable to cut and irradiate light of less than 200 nm.
【００２８】本発明で使用する異方性導電材料は硬化さ
せるために加熱工程を必要としないので、特に熱による
表示品質の劣化が問題となる液晶ディスプレイパネルや
プラズマアドレスディスプレイパネルに対して効果が大
きい。しかし、硬化時間を短くするために、表示素子に
影響を及ぼさない範囲で接合部に熱を加えることもでき
る。Since the anisotropic conductive material used in the present invention does not require a heating step for curing, it is particularly effective for a liquid crystal display panel or a plasma addressed display panel in which display quality is degraded by heat. large. However, in order to shorten the curing time, heat may be applied to the joint within a range that does not affect the display element.
【００２９】（作用）本発明の表示装置の接続構造体に
よると、表示素子の液晶基板上に形成された引き出し電
極端子と、駆動回路基板上の接続端子とを、異方性導電
材料を介して接続するに際し、異方性導電材料が、カチ
オン重合性化合物、光カチオン重合開始剤、及び導電性
粒子を含有する光硬化型接着材料であり、加熱されるこ
となく光照射により硬化して接合されたものであるから
導電不良や表示品質の低下がない。(Operation) According to the connection structure of the display device of the present invention, the extraction electrode terminal formed on the liquid crystal substrate of the display element and the connection terminal on the drive circuit board are connected via the anisotropic conductive material. When connecting, the anisotropic conductive material is a photo-curable adhesive material containing a cationically polymerizable compound, a photo-cationic polymerization initiator, and conductive particles, and is cured by light irradiation without heating and joined. As a result, there is no conduction failure or deterioration of display quality.
【００３０】また、本発明の表示装置の接続方法による
と、請求項１に記載の異方性導電材料を用いて光照射に
より光カチオン反応が徐々に進行して硬化する。従っ
て、加熱工程を必要とせず、導電不良を生じたりするこ
となく、また、表示品質のよい接続構造体が得られる。According to the method for connecting a display device of the present invention, the photocationic reaction gradually progresses and cures by light irradiation using the anisotropic conductive material according to the first aspect. Therefore, a connection structure with good display quality can be obtained without the need for a heating step, without causing poor conduction.
【００３１】[0031]
【発明の実施の形態】以下に本発明の実施例を説明す
る。 異方性導電材料の組成物として次のものを使用した。 絶縁性液状エポキシ樹脂(1) ：油化シェルエポキシ社
製，「ＥＰ８２８」 絶縁性液状エポキシ樹脂(2) ：旭電化社製，「ＥＰ４０
８０」 絶縁性固形樹脂：油化シェルエポキシ社製，「ＥＰ１０
０９」 アクリル系共重合体樹脂（ＥＧＡ）：エチルアクリレー
ト（ＥＡ）とグリシジルメタクリレート（ＧＭＡ）との
共重合体（重量平均分子量７０万，組成比ＥＡ／ＧＭＡ
＝８／２） 硬化剤(1) ：味の素社製，「ＰＮ−２３」 硬化剤(2) ：四国化成社製，「２Ｅ４ＭＺ」 光カチオン重合開始剤：旭電化社製，「ＳＰ−１７０」Embodiments of the present invention will be described below. The following was used as the composition of the anisotropic conductive material. Insulating liquid epoxy resin (1): made by Yuka Shell Epoxy, "EP828" Insulating liquid epoxy resin (2): made by Asahi Denka, "EP40"
80 "Insulating solid resin: Yuka Shell Epoxy," EP10
09 "Acrylic copolymer resin (EGA): a copolymer of ethyl acrylate (EA) and glycidyl methacrylate (GMA) (weight average molecular weight 700,000, composition ratio EA / GMA
= 8/2) Curing agent (1): Ajinomoto Co., "PN-23" Curing agent (2): Shikoku Chemicals, "2E4MZ" Photocationic polymerization initiator: Asahi Denka Co., "SP-170"
【００３２】（実施例１〜３）表１に示す配合物を酢酸
エチルに混合して固形分６０重量％に調製し、５％架橋
のポリスチレンからなる粒子の表面にニッケル、金メッ
キを施した導電性粒子（平均粒径８μｍ）をそれぞれ５
重量部配合し、これを離型シートの離型処理面に塗布し
て厚み２０μｍの異方性導電膜を作製した。上記異方性
導電膜を用いてＴＡＢ端子とガラス基板上に形成された
ＩＴＯよりなる０．２ｍｍピッチの端子間の接合を次の
条件で行った。(Embodiments 1 to 3) Conductivities in which the formulations shown in Table 1 were mixed with ethyl acetate to a solid content of 60% by weight, and particles of 5% cross-linked polystyrene were plated with nickel and gold. Particles (average particle size: 8 μm)
By weight, this was applied to the release-treated surface of the release sheet to produce a 20 μm-thick anisotropic conductive film. Using the above-described anisotropic conductive film, bonding between a TAB terminal and a 0.2 mm pitch terminal made of ITO formed on a glass substrate was performed under the following conditions.
【００３３】表１に示した組成の異方性導電膜をＴＡＢ
端子に圧着した後、高圧水銀灯により２５ｍＷ／ｃｍ2
で３０秒間紫外線を照射した。その後、該異方性導電膜
にガラス基板を１０ｋｇｆ／ｃｍ2 の圧力で２０秒間圧
着し、この接合体を２３℃で２４時間養生した。An anisotropic conductive film having the composition shown in Table 1 was prepared using TAB
After crimping to the terminal, 25 mW / cm 2 by high pressure mercury lamp
For 30 seconds. Thereafter, a glass substrate was pressed against the anisotropic conductive film at a pressure of 10 kgf / cm 2 for 20 seconds, and the joined body was cured at 23 ° C. for 24 hours.
【００３４】（比較例１〜４）酢酸エチルの代わりにト
ルエン／酢酸エチル（重量比１／１）を用いたこと以外
は実施例１と同様にして厚み２０μｍの異方性導電膜を
作製し、比較例１、３では１８０℃で熱圧着したこと以
外は実施例と同様にしてＴＡＢ端子とガラス基板上に形
成されたＩＴＯよりなる端子間の接合体を得た。(Comparative Examples 1 to 4) An anisotropic conductive film having a thickness of 20 μm was prepared in the same manner as in Example 1 except that toluene / ethyl acetate (weight ratio 1/1) was used instead of ethyl acetate. In Comparative Examples 1 and 3, a joined body between a TAB terminal and a terminal made of ITO formed on a glass substrate was obtained in the same manner as in Example except that thermocompression bonding was performed at 180 ° C.
【００３５】性能評価 以上実施例１〜３及び比較例１〜４で得た接合体につ
き、下記の方法で性能評価し、その結果を表２に示し
た。 （１）剥離強度 ガラス基板からＴＡＢ端子を５０ｍｍ／分の速度で９０
度剥離したときの剥離力を測定した。判定は５００ｇｆ
／ｃｍ以上を○とし、５００ｇｆ／ｃｍ未満を×とし
た。 （２）接続信頼性 厚さ７５μｍのポリイミド（宇部興産社製）よりなる可
撓性絶縁フィルムに厚さ３５μｍの銅箔を接着し、エッ
チングにより２００μｍピッチの電極を１００本形成し
たフィルム電極と、ガラス基板上に同ピッチで形成され
たＩＴＯ電極とを異方性導電膜で接合した。同条件で作
製した各１０個ずつの試料について、対応する電極間の
導電抵抗がすべて５０Ω以下のものを○、それ以外のも
のを×とした。 （３）導電信頼性 初期導電特性が２０Ω以下で、−２０℃（２時間保持）
から２時間かけて７０℃，９０％ＲＨまで昇温し、この
状態で２時間保持した後、２時間かけて−２０℃まで降
温させることを１サイクルとして１０００時間経過した
後の抵抗上昇が３倍以下のものを○とした。Performance evaluation The performances of the joined bodies obtained in Examples 1 to 3 and Comparative Examples 1 to 4 were evaluated by the following methods, and the results are shown in Table 2. (1) Peel strength The TAB terminal is separated from the glass substrate by 90 at a speed of 50 mm / min.
The peeling force at the time of peeling was measured. Judgment is 500gf
/ Cm or more was evaluated as ○, and less than 500 gf / cm was evaluated as ×. (2) Connection reliability A film electrode in which a 35-μm-thick copper foil is bonded to a 75-μm-thick polyimide (manufactured by Ube Industries, Ltd.) flexible insulating film, and 100 electrodes having a 200-μm pitch are formed by etching; An ITO electrode formed at the same pitch on a glass substrate was joined with an anisotropic conductive film. With respect to ten samples each manufactured under the same conditions, those in which the conductive resistance between the corresponding electrodes were all 50 Ω or less were evaluated as ○, and those other than those were evaluated as ×. (3) Conductive reliability Initial conductive characteristics are 20Ω or less and -20 ° C (hold for 2 hours)
After 2 hours, the temperature was raised to 70 ° C. and 90% RH, and maintained in this state for 2 hours.以下 or less was marked as ○.
【００３６】[0036]
【表１】 [Table 1]
【００３７】表１から明らかな通り、本発明における異
方性導電材料を用いた接続方法によると、加熱工程を必
要とせずに非常に高強度の接続構造体と信頼性の高い導
電接続を得ることが可能である。As is clear from Table 1, according to the connection method using the anisotropic conductive material of the present invention, a connection structure having extremely high strength and a highly reliable conductive connection can be obtained without requiring a heating step. It is possible.
【００３８】[0038]
【発明の効果】本発明の表示装置の接続構造体による
と、接続部が加熱されることなく光照射により硬化して
接合されたものであるから導電不良や表示品質の低下が
なく、フレキシブルプリント配線基板（ＦＰＣ）やテー
プキャリア（ＴＡＢ）を表示素子の液晶基板に導電接続
するために好適に使用できる。また、本発明の表示装置
の接続方法によると、請求項１の発明における異方性導
電材料を用いるので、該異方性導電材料は光照射により
光カチオン反応が徐々に進行して硬化する。従って加熱
工程を必要としないので、導電不良を生じたりすること
なく、また、表示品質のよい接続構造体が得られる。According to the connection structure of the display device of the present invention, the connection portion is cured by light irradiation without being heated and joined, so that there is no poor conduction or deterioration in display quality, and flexible printing. It can be suitably used for conductively connecting a wiring substrate (FPC) or a tape carrier (TAB) to a liquid crystal substrate of a display element. Further, according to the connection method of the display device of the present invention, since the anisotropic conductive material according to the first aspect of the present invention is used, the anisotropic conductive material is cured by the light cation reaction which gradually proceeds by light irradiation. Therefore, since a heating step is not required, a connection structure with good display quality can be obtained without causing poor conductivity.
【図面の簡単な説明】[Brief description of the drawings]
【図１】従来から行われているフィルムキャリア実装構
造の例を示す断面図。FIG. 1 is a cross-sectional view showing an example of a conventional film carrier mounting structure.
１ ：駆動回路基板 ２ ：基板 ３ ：ガラス基板 ４ ：液晶層 ５ ：スペーサー ６ ：接着剤 ７ ：導電性粒子 ８ ：異方性導電膜 １１：絶縁フィルム １２：リード箔 １３：端子 １４：集積回路素子 ２０：液晶セル 1: drive circuit board 2: substrate 3: glass substrate 4: liquid crystal layer 5: spacer 6: adhesive 7: conductive particles 8: anisotropic conductive film 11: insulating film 12: lead foil 13: terminal 14: integrated circuit Element 20: Liquid crystal cell
Claims (2)
出し電極端子と、駆動回路基板の接続端子とが、異方性
導電材料を介して接合された表示装置の接続構造体であ
って、上記異方性導電材料が、カチオン重合性化合物、
光カチオン重合開始剤、及び導電性粒子からなることを
特徴とする表示装置の接続構造体。1. A connection structure of a display device in which a lead electrode terminal formed on a liquid crystal substrate of a display element and a connection terminal of a drive circuit board are joined via an anisotropic conductive material, The anisotropic conductive material is a cationically polymerizable compound,
A connection structure for a display device comprising a cationic photopolymerization initiator and conductive particles.
出し電極端子上、又は駆動回路基板の接続端子上に、請
求項１記載の異方性導電材料の層を形成する工程、異方
性導電材料に光を照射する工程、及び上記両端子を位置
合わせした後、圧着する工程とからなることを特徴とす
る表示装置の接続方法。2. The step of forming a layer of the anisotropic conductive material according to claim 1, on a lead electrode terminal formed on a liquid crystal substrate of a display element or on a connection terminal of a drive circuit board. A method for connecting a display device, comprising: a step of irradiating light to a conductive material; and a step of crimping after positioning the two terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10260233A JP2000086989A (en) | 1998-09-14 | 1998-09-14 | Joint structure of display device and joining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10260233A JP2000086989A (en) | 1998-09-14 | 1998-09-14 | Joint structure of display device and joining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000086989A true JP2000086989A (en) | 2000-03-28 |
Family
ID=17345212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10260233A Withdrawn JP2000086989A (en) | 1998-09-14 | 1998-09-14 | Joint structure of display device and joining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000086989A (en) |
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