JP2000007913A - Polyimide resin composition and prepreg - Google Patents
Polyimide resin composition and prepregInfo
- Publication number
- JP2000007913A JP2000007913A JP17906498A JP17906498A JP2000007913A JP 2000007913 A JP2000007913 A JP 2000007913A JP 17906498 A JP17906498 A JP 17906498A JP 17906498 A JP17906498 A JP 17906498A JP 2000007913 A JP2000007913 A JP 2000007913A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide resin
- surfactant
- prepreg
- resin composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気絶縁材料用積
層板またはプリプレグの製造に用いられるポリイミド樹
脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyimide resin composition used for producing a laminate or prepreg for an electrical insulating material.
【０００２】[0002]
【従来の技術】電子機器等で用いられるプリント配線板
の多くは、プリプレグ数枚と銅箔等の金属箔とを重ね、
加熱加圧により積層して作製される金属張り積層板を用
いて製造される。プリプレグは、一般にガラス布等の基
材に、樹脂を含浸させた後、乾燥工程を経て製造される
ものである。プリプレグの製造において、含浸される樹
脂としては、エポキシ樹脂、フェノール樹脂、ポリイミ
ド樹脂などが挙げられるが、特にポリイミド樹脂はガラ
ス転移温度が高く、耐熱性を求められるプリント配線板
用として広く用いられている。2. Description of the Related Art Many printed wiring boards used in electronic devices and the like often have a plurality of prepregs laminated with a metal foil such as a copper foil.
It is manufactured using a metal-clad laminate made by laminating by heating and pressing. A prepreg is generally manufactured by impregnating a base material such as a glass cloth with a resin and then performing a drying step. In the production of prepreg, the resin to be impregnated includes epoxy resin, phenol resin, polyimide resin, and the like.In particular, polyimide resin has a high glass transition temperature and is widely used for printed wiring boards requiring heat resistance. I have.
【０００３】プリプレグ含浸用ポリイミドの製造例とし
て、式（１）に示す不飽和ビスマレイミドと式（２）示
すジアミン等のポリアミンを溶剤中に混合後加熱反応さ
せて、含浸用のポリイミド樹脂ワニスを得るというもの
が挙げられる。As an example of the production of a prepreg-impregnated polyimide, an unsaturated bismaleimide represented by the formula (1) and a polyamine such as a diamine represented by the formula (2) are mixed in a solvent and then reacted by heating to obtain a polyimide resin varnish for impregnation. To gain.
【０００４】[0004]
【化１】 ここで、Ｒ1、Ｒ2、Ｒ4、及びＲ5は、Ｈ又はＣnＨ2n+1
で表される炭化水素基であり、ｎは１〜５の整数であ
る。そしてＲ3は、メチレン、エチレン、プロピレン、
イソプロピレン、フェニレン、又はこれらの基が有する
炭素原子に酸素原子が結合したものから選択される基で
ある。Embedded image Here, R 1 , R 2 , R 4 and R 5 are H or C n H 2n + 1
Wherein n is an integer of 1 to 5. And R 3 is methylene, ethylene, propylene,
It is a group selected from isopropylene, phenylene, or those in which an oxygen atom is bonded to a carbon atom of these groups.
【０００５】[0005]
【化２】 ここで、Ｒは、メチレン、エチレン、プロピレン、イソ
プロピレン、フェニレン、又はこれらの基が有する炭素
原子に酸素原子が結合したものから選択される基であ
る。Embedded image Here, R is a group selected from methylene, ethylene, propylene, isopropylene, phenylene, or those in which an oxygen atom is bonded to a carbon atom of these groups.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上記のような
ポリイミド樹脂ワニスをガラス布に含浸させてプリプレ
グを作製する場合、ポリイミド樹脂ワニスとガラス布と
の界面における濡れ性が良くないので、ハジキと言われ
る樹脂が均一に含浸されない現象が起こる。このハジキ
がプリプレグ上で５ｍｍを超えると、そのプリプレグを
積層板に成形した後ハジキの部分がボイドを形成するこ
ととなる。プリント配線板に加工されるこの積層板中に
ボイドが発生すると、回路パターンを形成する際に回路
切れが起こり、プリント配線板に設けられる貫通孔（ス
ルーホール）をメッキする際にメッキ液の染み込みなど
による絶縁不良を引き起こす原因となる。However, when a prepreg is prepared by impregnating a glass cloth with the above-described polyimide resin varnish, the wettability at the interface between the polyimide resin varnish and the glass cloth is not good. A phenomenon occurs in which the resin is not uniformly impregnated. If the cissing exceeds 5 mm on the prepreg, the cissing will form voids after the prepreg is formed into a laminate. If voids occur in this laminated board that is processed into a printed wiring board, a circuit break occurs when forming a circuit pattern, and a plating solution seeps when plating through holes (through holes) provided in the printed wiring board. It may cause insulation failure due to such factors.
【０００７】本発明は上記の点に鑑みてなされたもので
あり、ガラス布との濡れ性が良好なプリプレグ製造用の
ポリイミド樹脂組成物を提供することを目的とするもの
である。The present invention has been made in view of the above points, and has as its object to provide a polyimide resin composition for producing a prepreg having good wettability with a glass cloth.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１に係る
ポリイミド樹脂組成物は、ビスマレイミドと、ポリアミ
ンとを反応させて得られたポリイミド樹脂ワニスに界面
活性剤を添加してなることを特徴とするものである。The polyimide resin composition according to claim 1 of the present invention is characterized in that a surfactant is added to a polyimide resin varnish obtained by reacting bismaleimide and polyamine. It is a feature.
【０００９】本発明の請求項２に係るポリイミド樹脂組
成物は、上記の請求項１に記載の発明の特徴に加えて、
前記界面活性剤の量が添加されたポリイミド樹脂１００
重量部に対して0.01〜5.00重量部であることを特徴とす
るものである。[0009] The polyimide resin composition according to claim 2 of the present invention has, in addition to the features of the invention described in claim 1 above,
Polyimide resin 100 to which the amount of the surfactant is added
It is characterized by being 0.01 to 5.00 parts by weight with respect to parts by weight.
【００１０】本発明の請求項３に係るポリイミド樹脂組
成物は、上記の請求項１又は２に記載の発明の特徴に加
えて、前記界面活性剤がポリシロキサン系界面活性剤で
あることを特徴とするものである。The polyimide resin composition according to claim 3 of the present invention is characterized in that, in addition to the features of the invention described in claim 1 or 2, the surfactant is a polysiloxane-based surfactant. It is assumed that.
【００１１】本発明の請求項４に係るポリイミド樹脂組
成物は、上記の請求項１又は２に記載の発明の特徴に加
えて、前記界面活性剤がフッ素系界面活性剤であること
を特徴とするものである。A polyimide resin composition according to a fourth aspect of the present invention is characterized in that, in addition to the features of the first or second aspect, the surfactant is a fluorine-based surfactant. Is what you do.
【００１２】本発明の請求項５に係るプリプレグの製造
方法は、請求項１〜４のいずれかに記載のポリイミド樹
脂を基材に含浸乾燥させることを特徴とするものであ
る。According to a fifth aspect of the present invention, there is provided a method for producing a prepreg, comprising impregnating and drying the substrate with the polyimide resin according to any one of the first to fourth aspects.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。Embodiments of the present invention will be described below.
【００１４】本発明に係るポリイミド樹脂組成物は、ビ
スマレイミドと、ポリアミンとを反応させて得られたワ
ニスに界面活性剤を添加してなることを特徴とするもの
である。The polyimide resin composition according to the present invention is characterized in that a surfactant is added to a varnish obtained by reacting bismaleimide and a polyamine.
【００１５】本発明で用いられるビスマレイミドは一般
に下式（１）で示されるイミド化合物を例示することが
できる。The bismaleimide used in the present invention can generally be exemplified by the imide compound represented by the following formula (1).
【００１６】[0016]
【化３】 ここで、Ｒ1、Ｒ2、Ｒ4、及びＲ5は、Ｈ又はＣnＨ2n+1
で表される炭化水素基であり、ｎは１〜５の整数であ
る。そしてＲ3は、メチレン、エチレン、プロピレン、
イソプロピレン、フェニレン、又はこれらの基が有する
炭素原子に酸素原子が結合したものから選択される基で
ある。Embedded image Here, R 1 , R 2 , R 4 and R 5 are H or C n H 2n + 1
Wherein n is an integer of 1 to 5. And R 3 is methylene, ethylene, propylene,
It is a group selected from isopropylene, phenylene, or those in which an oxygen atom is bonded to a carbon atom of these groups.
【００１７】本発明で用いられるポリアミンは一般に下
式（２）のジアミンまたは下式（３）のテトラミンなど
を例示することができる。The polyamine used in the present invention can be generally exemplified by a diamine of the following formula (2) or a tetramine of the following formula (3).
【００１８】[0018]
【化４】 Embedded image
【００１９】[0019]
【化５】 ここで、Ｒは、メチレン、エチレン、プロピレン、イソ
プロピレン、フェニレン、又はこれらの基が有する炭素
原子に酸素原子が結合したものから選択される基であ
る。Embedded image Here, R is a group selected from methylene, ethylene, propylene, isopropylene, phenylene, or those in which an oxygen atom is bonded to a carbon atom of these groups.
【００２０】本発明で用いられる界面活性剤は、ポリシ
ロキサン系界面活性剤又はフッ素系界面活性剤から選択
される。The surfactant used in the present invention is selected from polysiloxane-based surfactants and fluorine-based surfactants.
【００２１】ポリシロキサン系活性剤としては、ポリエ
ーテル変性ジメチルポリシロキサン共重合物（ビッグケ
ミー（株）、ＢＹＫ３０２）又はアラルキル変性メチル
アルキルポリシロキサン（ビッグケミー（株）、ＢＹＫ
３２２）などを例示することができる。Examples of the polysiloxane-based activator include polyether-modified dimethylpolysiloxane copolymer (Big Chemie Co., BYK302) or aralkyl-modified methyl alkyl polysiloxane (Big Chemie Co., BYK 302).
322) and the like.
【００２２】また、フッ素系界面活性剤としては、フッ
素化アルキルエステル（住友スリーエム（株）、ＦＣ４
３０）、パーフルオロアルキルアルコキシレート（住友
スリーエム（株）、ＦＣ１７１）、又はパーフルオロア
ルキルポリオキシエチレンエタノール（住友スリーエム
（株）、ＦＣ１７０Ｃ）などを例示することができる。Examples of the fluorinated surfactant include fluorinated alkyl esters (Sumitomo 3M Co., Ltd., FC4
30), perfluoroalkyl alkoxylate (Sumitomo 3M Ltd., FC171), or perfluoroalkylpolyoxyethylene ethanol (Sumitomo 3M Ltd., FC170C).
【００２３】以上に示したビスマレイミド、ポリアミ
ン、及び界面活性剤を用いて本発明のポリイミド樹脂組
成物を調製する方法について説明する。A method for preparing the polyimide resin composition of the present invention using the bismaleimide, polyamine, and surfactant described above will be described.
【００２４】ビスマレイミド及びポリアミンを適切な溶
媒（例えば、ジメチルアセトアミドなど）に添加する。
各成分の添加量は、ビスマレイミド３０〜８０重量部、
ポリアミン５〜２０重量部、溶媒２５〜５０重量部であ
ることが好ましい。The bismaleimide and polyamine are added to a suitable solvent, such as dimethylacetamide.
The amount of each component added is 30 to 80 parts by weight of bismaleimide,
Preferably, the polyamine is 5 to 20 parts by weight and the solvent is 25 to 50 parts by weight.
【００２５】この混合物を攪拌しながら適切な温度（例
えば、８０℃）で加熱し、ポリイミド樹脂のワニスを調
製する。そしてこのワニスに界面活性剤を添加すること
によって、本発明のポリイミド樹脂組成物が得られる。
界面活性剤の添加量は、ポリイミド樹脂１００重量部に
対して０．０１〜５．０重量部であることが好ましい。The mixture is heated at an appropriate temperature (for example, 80 ° C.) with stirring to prepare a varnish of a polyimide resin. Then, by adding a surfactant to the varnish, the polyimide resin composition of the present invention can be obtained.
The addition amount of the surfactant is preferably 0.01 to 5.0 parts by weight based on 100 parts by weight of the polyimide resin.
【００２６】界面活性剤の添加量がポリイミド樹脂１０
０重量部に対して０．０１未満の場合は本発明の目的で
あるガラス布等との濡れ性の改善の効果が十分に得られ
ない。また、界面活性剤の添加量がポリイミド樹脂１０
０重量部に対して５．０重量部を超える場合は、このワ
ニスを用いて調製したプリプレグで積層板を製造するに
あたって積層板の耐熱性が劣化することが考えられる。When the amount of the surfactant is 10
If the amount is less than 0.01 relative to 0 parts by weight, the effect of improving wettability with a glass cloth or the like, which is the object of the present invention, cannot be sufficiently obtained. Further, the amount of the surfactant added is 10%.
If the amount exceeds 5.0 parts by weight with respect to 0 parts by weight, the heat resistance of the laminate may be degraded when a laminate is manufactured using a prepreg prepared using this varnish.
【００２７】上記のようにして得られた各ポリイミド樹
脂ワニスを室温に冷却した後、これらのポリイミド樹脂
ワニスにガラス布を含浸させ、乾燥機にて乾燥温度１３
０℃〜１６０℃、乾燥時間２００秒〜２５０秒程度の条
件で乾燥を行い、プリプレグを得ることができる。レジ
ンコンテントは、５０〜５５重量％程度が好ましい。さ
らに、上記のプリプレグを複数枚重ね、その両面に銅箔
を載置し、このプリプレグと銅箔を重ね合わせたものを
温度１８０℃〜２２０℃、圧力１０Kg/cm2〜７０Kg/cm2
程度の条件で１〜４時間程度加熱加圧して積層成形する
ことによって、積層板を得ることができる。After cooling each polyimide resin varnish obtained as described above to room temperature, these polyimide resin varnishes are impregnated with a glass cloth and dried at a drying temperature of 13 ° C.
Drying is performed under the conditions of 0 ° C to 160 ° C and a drying time of about 200 seconds to 250 seconds to obtain a prepreg. The resin content is preferably about 50 to 55% by weight. Further, a plurality of the above prepregs are stacked, copper foils are placed on both sides thereof, and the prepreg and the copper foils are stacked and the temperature is 180 ° C. to 220 ° C., the pressure is 10 kg / cm 2 to 70 kg / cm 2.
A laminate can be obtained by heating and pressing under conditions of about 1 to 4 hours to form a laminate.
【００２８】[0028]
【実施例】以下本発明を実施例によって具体的に説明す
る。 （実施例１）ビスマレイミドとしてジメチルフェニルメ
タンビスマレイミドを１００重量部、ポリアミンとして
ジアミノジフェニルメタンを３０重量部、溶剤としてジ
メチルアセトアミドを７０重量部を混合し、攪拌しなが
ら８０℃で３時間加熱反応させて、ポリイミド樹脂ワニ
スを得た。このように調製したポリイミド樹脂ワニスに
ポリシロキサン系界面活性剤（ＢＹＫ３０２、ビッグケ
ミー製）を0.005重量部添加して、ポリイミド樹脂組成
物ワニスを得た。 （実施例２）上記ポリシロキサン系界面活性剤の代わり
にフッ素系界面活性剤（ＦＣ４３０、住友スリーエム
（株）製）を0.005重量部添加した以外は、実施例１と
同様にしてポリイミド樹脂組成物ワニスを得た。 （実施例３）上記ポリシロキサン系界面活性剤の添加量
を0.0１重量部とした以外は、実施例１と同様にしてポ
リイミド樹脂組成物ワニスを得た。 （実施例４）上記フッ素系界面活性剤の添加量を0.0１
重量部とした以外は、実施例２と同様にしてポリイミド
樹脂組成物ワニスを得た。 （実施例５）上記ポリシロキサン系界面活性剤の添加量
を0.0５重量部とした以外は、実施例１と同様にしてポ
リイミド樹脂組成物ワニスを得た。 （実施例６）上記フッ素系界面活性剤の添加量を0.0５
重量部とした以外は、実施例２と同様にしてポリイミド
樹脂組成物ワニスを得た。 （実施例７）上記ポリシロキサン系界面活性剤の添加量
を７．００重量部とした以外は、実施例１と同様にして
ポリイミド樹脂組成物ワニスを得た。 （比較例１）界面活性剤を添加しなかったこと以外は、
実施例１と同様にしてポリイミド樹脂ワニスを得た。The present invention will be described below in detail with reference to examples. (Example 1) 100 parts by weight of dimethylphenylmethanebismaleimide as bismaleimide, 30 parts by weight of diaminodiphenylmethane as polyamine, and 70 parts by weight of dimethylacetamide as a solvent were mixed and heated and reacted at 80 ° C. for 3 hours with stirring. Thus, a polyimide resin varnish was obtained. 0.005 parts by weight of a polysiloxane-based surfactant (BYK302, manufactured by Big Chemie) was added to the polyimide resin varnish thus prepared to obtain a polyimide resin composition varnish. Example 2 A polyimide resin composition was prepared in the same manner as in Example 1 except that 0.005 parts by weight of a fluorine-based surfactant (FC430, manufactured by Sumitomo 3M Limited) was added instead of the above-mentioned polysiloxane-based surfactant. I got a varnish. Example 3 A varnish of a polyimide resin composition was obtained in the same manner as in Example 1 except that the amount of the polysiloxane-based surfactant was changed to 0.01 part by weight. (Example 4) The addition amount of the above-mentioned fluorosurfactant was 0.01
A varnish of a polyimide resin composition was obtained in the same manner as in Example 2 except that the amount was changed to parts by weight. (Example 5) A polyimide resin composition varnish was obtained in the same manner as in Example 1 except that the amount of the polysiloxane-based surfactant was changed to 0.05 parts by weight. (Example 6) The addition amount of the fluorine-based surfactant was 0.05
A varnish of a polyimide resin composition was obtained in the same manner as in Example 2 except that the amount was changed to parts by weight. Example 7 A varnish of a polyimide resin composition was obtained in the same manner as in Example 1 except that the amount of the polysiloxane-based surfactant was changed to 7.00 parts by weight. (Comparative Example 1) Except that no surfactant was added,
A polyimide resin varnish was obtained in the same manner as in Example 1.
【００２９】上記のようにして得られた各ポリイミド樹
脂ワニスを室温に冷却した後、これらのポリイミド樹脂
ワニスにガラス布（日東紡２１１６）を含浸させ、乾燥
機にて乾燥（乾燥温度１４５℃、乾燥時間２２０秒）を
行い、レジンコンテントが５３重量％のプリプレグを得
た。After cooling each polyimide resin varnish obtained as described above to room temperature, these polyimide resin varnishes are impregnated with a glass cloth (Nitto Boseki 2116), and dried with a drier (drying temperature: 145 ° C., (Drying time: 220 seconds) to obtain a prepreg having a resin content of 53% by weight.
【００３０】このようにして得られたプリプレグに対し
て以下のような評価を行った。The prepregs thus obtained were evaluated as follows.
【００３１】まず、実施例１〜７及び比較例のプリプレ
グ（面積１ｍ×１ｍ）を１０枚ずつ用い、それらのプリ
プレグ上の直径５ｍｍ以上のハジキの個数を数えた。そ
して、各実施例及び比較例ごとについて１枚あたりのプ
リプレグのハジキの個数の平均値を求めた。First, ten prepregs (areas 1 m × 1 m) of Examples 1 to 7 and Comparative Example were used, and the number of cissing pieces having a diameter of 5 mm or more on those prepregs was counted. Then, the average value of the number of cissings per prepreg was determined for each of the examples and comparative examples.
【００３２】次に、上記でハジキの個数を調べたプリプ
レグ上のハジキの最大のものの直径を計測した。そし
て、各実施例及び比較例についてハジキの最大径の平均
値を求めた。Next, the diameter of the largest cissing on the prepreg whose number of cissing was checked was measured. Then, the average value of the maximum diameter of the cissing was determined for each of the examples and the comparative examples.
【００３３】さらに、上記のプリプレグを１０枚重ね、
その両面に銅箔（日鉱グールドフォイル（株）ＪＴＣ１
８μｍ）を載置した。そして、このプリプレグと銅箔を
重ね合わせたものを温度２００℃、圧力３０Kg/cm2の条
件で３時間加熱加圧し真空成形により積層板を得た。Further, ten prepregs are stacked,
Copper foil (Nikko Gould Foil Co., Ltd. JTC1)
8 μm). The prepreg and the copper foil were laminated and heated and pressed at a temperature of 200 ° C. and a pressure of 30 kg / cm 2 for 3 hours to obtain a laminate by vacuum forming.
【００３４】このようにして作製される積層板（面積１
ｍ×１ｍ）を各実施例及び比較例ごとに１０枚ずつ用意
し、それらの各１０枚の積層板中のボイド残りの個数を
数えた。そして、各実施例及び比較例について１枚あた
りの積層板のボイド残りの個数の平均値を求めた。The laminate thus manufactured (having an area of 1
m × 1 m) was prepared for each Example and Comparative Example, and the number of remaining voids in each of the ten laminated sheets was counted. Then, the average value of the remaining number of voids in one laminated plate was determined for each of the examples and comparative examples.
【００３５】また、上記の積層板をエッチングして銅箔
を除去した後、５０×５０ｍｍのサンプルにカットし、
２時間沸騰水中に浸漬し、さらに２６０±２℃の半田に
２０秒間に浸漬した。このときの積層板の層剥離を評価
して、煮沸耐熱性として表１に示した。After the copper foil is removed by etching the above laminate, the laminate is cut into a sample of 50 × 50 mm.
It was immersed in boiling water for 2 hours, and further immersed in solder at 260 ± 2 ° C. for 20 seconds. At this time, the delamination of the laminate was evaluated, and the results are shown in Table 1 as boiling heat resistance.
【００３６】[0036]
【表１】 表１より、ポリシロキサン系界面活性剤及びフッ素系界
面活性剤の２種類の界面活性剤がポリイミド樹脂ワニス
に添加されている各実施例のものは、添加されていない
比較例に比べてプリプレグのハジキ及び積層板のボイド
が減少していることが確認される。特に、実施例３〜７
のように上記の２種類の界面活性剤の添加量が0.01重量
部以上になるとプリプレグのハジキ及び積層板のボイド
が共に０個となり、本発明の目的が十分達成されている
ことが確認される。但し、ポリシロキサン系界面活性剤
が添加量の上限を超えた7.0重量部添加された実施例７
の場合、プリプレグのハジキ及び積層板のボイドは０個
であるが、煮沸耐熱性が低下するものであった。[Table 1] From Table 1, it can be seen that in each of the examples in which two kinds of surfactants, a polysiloxane-based surfactant and a fluorine-based surfactant, were added to the polyimide resin varnish, It is confirmed that repelling and voids in the laminate have been reduced. In particular, Examples 3-7
As described above, when the addition amount of the above two types of surfactants is 0.01 parts by weight or more, both the cissing of the prepreg and the voids of the laminate become zero, and it is confirmed that the object of the present invention is sufficiently achieved. . However, Example 7 in which the polysiloxane-based surfactant was added in an amount of 7.0 parts by weight exceeding the upper limit of the addition amount.
In the case of No. 1, the repelling of the prepreg and the voids of the laminate were zero, but the boiling heat resistance was reduced.
【００３７】[0037]
【発明の効果】上記のように本発明の請求項１に係るポ
リイミド樹脂組成物は、ビスマレイミドと、ポリアミン
とを反応させて得られたワニスに界面活性剤を添加する
ので、このポリイミド樹脂組成物にガラス布を含浸して
プリプレグを調製する際、界面活性剤の作用によりポリ
イミド樹脂組成物とガラス布との濡れ性が良好となり、
調製後のプリプレグのハジキを防止することができるも
のである。As described above, in the polyimide resin composition according to the first aspect of the present invention, a surfactant is added to a varnish obtained by reacting bismaleimide and a polyamine. When preparing a prepreg by impregnating a material with a glass cloth, the wettability between the polyimide resin composition and the glass cloth is improved by the action of a surfactant,
It can prevent cissing of the prepreg after preparation.
【００３８】本発明の請求項２に係るポリイミド樹脂組
成物は、上記の請求項１に記載の発明の特徴に加えて、
前記界面活性剤の量がポリイミド樹脂１００重量部に対
して0.01〜5.00重量部であるので、ポリイミド樹脂組成
物とガラス布との濡れ性が改良されて、調製後のプリプ
レグのハジキを防止する効果を有しつつ、界面活性剤の
過剰添加による上記プリプレグより成形される積層板の
耐熱性の劣化を防ぐことができるものである。[0038] The polyimide resin composition according to claim 2 of the present invention has, in addition to the features of the invention described in claim 1 above,
Since the amount of the surfactant is 0.01 to 5.00 parts by weight based on 100 parts by weight of the polyimide resin, the wettability between the polyimide resin composition and the glass cloth is improved, and the effect of preventing cissing of the prepared prepreg is improved. While preventing deterioration of heat resistance of a laminate formed from the prepreg due to excessive addition of a surfactant.
【００３９】本発明の請求項３に係るポリイミド樹脂組
成物は、上記の請求項１又は２に記載の発明の特徴に加
えて、前記界面活性剤がポリシロキサン系界面活性剤で
あるので、ポリイミド樹脂組成物とガラス布との濡れ性
が改良されて、調製後のプリプレグのハジキをさらに防
止することができるものである。The polyimide resin composition according to claim 3 of the present invention is characterized in that, in addition to the features of the invention described in claim 1 or 2, since the surfactant is a polysiloxane-based surfactant, The wettability between the resin composition and the glass cloth is improved, and cissing of the prepared prepreg can be further prevented.
【００４０】本発明の請求項４に係るポリイミド樹脂組
成物は、上記の請求項１又は２に記載の発明の特徴に加
えて、前記界面活性剤がフッ素系界面活性剤であるの
で、ポリイミド樹脂組成物とガラス布との濡れ性が改良
されて、調製後のプリプレグのハジキをさらに防止する
ことができるものである。The polyimide resin composition according to claim 4 of the present invention is characterized in that, in addition to the features of the invention described in claim 1 or 2, since the surfactant is a fluorinated surfactant, The wettability between the composition and the glass cloth is improved, and repelling of the prepreg after preparation can be further prevented.
【００４１】本発明の請求項５に係るプリプレグは、請
求項１〜４のいずれかに記載のポリイミド樹脂を基材に
含浸乾燥させて製造されるので、ハジキの発生が抑制さ
れ、さらにこのプリプレグを重ねて積層板したときのボ
イドの形成を防ぐことができるものである。The prepreg according to the fifth aspect of the present invention is produced by impregnating and drying the polyimide resin according to any one of the first to fourth aspects of the present invention. This can prevent the formation of voids when the sheets are laminated on each other.
Claims (5)
させて得られたポリイミド樹脂ワニスに界面活性剤を添
加してなることを特徴とするポリイミド樹脂組成物。1. A polyimide resin composition obtained by adding a surfactant to a polyimide resin varnish obtained by reacting bismaleimide and a polyamine.
００重量部に対して０．０１〜５．００重量部であるこ
とを特徴とする請求項１に記載のポリイミド樹脂組成
物。2. The method according to claim 1, wherein the amount of the surfactant is 1%.
The polyimide resin composition according to claim 1, wherein the amount is 0.01 to 5.00 parts by weight based on 00 parts by weight.
活性剤であることを特徴とする請求項１又は２に記載の
ポリイミド樹脂組成物。3. The polyimide resin composition according to claim 1, wherein the surfactant is a polysiloxane-based surfactant.
あることを特徴とする請求項１又は２に記載のポリイミ
ド樹脂組成物。4. The polyimide resin composition according to claim 1, wherein the surfactant is a fluorine-based surfactant.
ミド樹脂組成物を基材に含浸乾燥させることを特徴とす
るプリプレグ。5. A prepreg, wherein a substrate is impregnated with the polyimide resin composition according to claim 1 and dried.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17906498A JP2000007913A (en) | 1998-06-25 | 1998-06-25 | Polyimide resin composition and prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17906498A JP2000007913A (en) | 1998-06-25 | 1998-06-25 | Polyimide resin composition and prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000007913A true JP2000007913A (en) | 2000-01-11 |
Family
ID=16059484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17906498A Pending JP2000007913A (en) | 1998-06-25 | 1998-06-25 | Polyimide resin composition and prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000007913A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002105201A (en) * | 2000-10-02 | 2002-04-10 | Mitsui Chemicals Inc | Varnish and prepreg impregnated it |
| JP2016056225A (en) * | 2014-09-05 | 2016-04-21 | 東京応化工業株式会社 | Varnish for porous film production, method for producing porous film using the same, and polyamide-imide porous film |
| US11154246B2 (en) | 2016-06-24 | 2021-10-26 | Georgia Tech Research Corporation | Systems and methods of IV infiltration detection |
-
1998
- 1998-06-25 JP JP17906498A patent/JP2000007913A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002105201A (en) * | 2000-10-02 | 2002-04-10 | Mitsui Chemicals Inc | Varnish and prepreg impregnated it |
| JP2016056225A (en) * | 2014-09-05 | 2016-04-21 | 東京応化工業株式会社 | Varnish for porous film production, method for producing porous film using the same, and polyamide-imide porous film |
| US11154246B2 (en) | 2016-06-24 | 2021-10-26 | Georgia Tech Research Corporation | Systems and methods of IV infiltration detection |
| US11911182B2 (en) | 2016-06-24 | 2024-02-27 | Georgia Tech Research Corporation | Systems and methods of IV infiltration detection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107011512B (en) | Polyimide resin precursor | |
| CN109942815B (en) | Polyimide composite resin with low dielectric constant, preparation method and application | |
| KR101398342B1 (en) | Resin composition, prepreg, laminate, and wiring board | |
| KR101642518B1 (en) | Composition for forming Board and Printed Circuit Board using the same | |
| TW202142603A (en) | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | |
| KR20170104470A (en) | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | |
| KR20080077639A (en) | A curable epoxy resin composition and laminates made therefrom | |
| KR102054967B1 (en) | Insulation materials, insulation composition comprising the same, substrate using the same | |
| KR101397950B1 (en) | Composition for fpcb coverlay and method for producing the same | |
| KR20210137426A (en) | Liquid composition, powder, and method for preparing powder | |
| KR101574907B1 (en) | Prepreg, laminated plate, semiconductor package and method for manufacturing laminated plate | |
| KR102141432B1 (en) | Resin composition, prepreg, and laminate | |
| CN104119643A (en) | Insulating resin composition for printed circuit board, and prepreg, copper-clad laminate and printed circuit board using the same | |
| US6544652B2 (en) | Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film | |
| US20140187679A1 (en) | Resin composition with good workability, insulating film, and prepreg | |
| CN108026301B (en) | Prepreg, metal-clad laminate, wiring board, and method for measuring thermal stress of wiring board material | |
| JP2005112981A (en) | Low-permittivity resin composition, prepreg using the same, metal-clad laminate, and printed circuit board | |
| JP2000007913A (en) | Polyimide resin composition and prepreg | |
| JP5444825B2 (en) | Insulating resin composition, prepreg, metal foil-clad laminate, printed wiring board, and multilayer wiring board | |
| JP2842152B2 (en) | Thermosetting resin composition, method for producing prepreg, and method for producing laminate | |
| JP4192871B2 (en) | Laminated board and wiring board | |
| JPH0812744A (en) | Resin composition and prepreg | |
| JP2004083762A (en) | Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board and multi-layered printed wiring board | |
| JP3211608B2 (en) | Manufacturing method of copper-clad laminate | |
| KR20220144333A (en) | Porous polyimide film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050310 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20050315 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Effective date: 20050705 Free format text: JAPANESE INTERMEDIATE CODE: A02 |