JP2000005713A - Treatment of work and apparatus therefor - Google Patents
Treatment of work and apparatus thereforInfo
- Publication number
- JP2000005713A JP2000005713A JP17500598A JP17500598A JP2000005713A JP 2000005713 A JP2000005713 A JP 2000005713A JP 17500598 A JP17500598 A JP 17500598A JP 17500598 A JP17500598 A JP 17500598A JP 2000005713 A JP2000005713 A JP 2000005713A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- valve
- liquid
- supply pipe
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は被処理体処理方法
およびその装置に関し、さらに詳細にいえば、1つの処
理槽内に被処理体を収容した状態で複数種類の処理液を
順次供給して被処理体を処理するための方法およびその
装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for treating an object to be treated, and more particularly, to a method for sequentially supplying a plurality of types of treatment liquids while accommodating the object to be treated in one treatment tank. The present invention relates to a method and an apparatus for processing an object.
【0002】[0002]
【従来の技術】従来から、1つの洗浄槽内に半導体ウエ
ハを収容した状態で複数種類の洗浄液を順次供給して半
導体ウエハを洗浄するための半導体ウエハ洗浄装置が提
案されている(特開平6−208984号公報参照)。2. Description of the Related Art Conventionally, there has been proposed a semiconductor wafer cleaning apparatus for sequentially supplying a plurality of types of cleaning liquids in a state where semiconductor wafers are accommodated in one cleaning tank to clean the semiconductor wafers (Japanese Patent Laid-Open Publication No. Hei 6 (1994)). -208984).
【0003】この半導体ウエハ洗浄装置は、下部に洗浄
液供給部材と整流部材とを設けて上部を半導体ウエハ収
容空間とした洗浄槽に対して、バルブを介在させた配管
を通して複数種類の洗浄液を順次供給するように構成し
ているとともに、バルブを介在させたドレン管を通して
洗浄槽内の洗浄液を排出するように構成している。In this semiconductor wafer cleaning apparatus, a plurality of cleaning liquids are sequentially supplied to a cleaning tank having a cleaning liquid supply member and a rectifying member at a lower portion and a semiconductor wafer accommodating space at an upper portion through a pipe having a valve interposed therebetween. The cleaning liquid in the cleaning tank is discharged through a drain pipe having a valve interposed therebetween.
【0004】したがって、1の洗浄液(例えば、洗浄用
薬剤)を洗浄槽内に供給することにより、半導体ウエハ
の洗浄を行い、次いで、他の洗浄液(例えば、純水)を
洗浄槽内に供給して前記1の洗浄液をこの他の洗浄液で
入れ替え、その後、前記他の洗浄液により半導体ウエハ
の洗浄を行うことができる。Accordingly, a semiconductor wafer is cleaned by supplying one cleaning liquid (eg, a cleaning agent) into the cleaning tank, and then another cleaning liquid (eg, pure water) is supplied into the cleaning tank. Then, the first cleaning liquid is replaced with the other cleaning liquid, and thereafter, the semiconductor wafer can be cleaned with the other cleaning liquid.
【0005】[0005]
【発明が解決しようとする課題】上記の構成の半導体ウ
エハ洗浄装置を採用した場合には、1の洗浄液を他の洗
浄液で入れ替える場合に、ドレン管のうち、バルブより
も上流側の部分における洗浄液の入れ替えがスムーズに
行われず、この結果、ドレン管の前記部分に前記1の洗
浄液がある程度残留してしまう。また、1の洗浄液を洗
浄槽に供給する配管と、他の洗浄液を洗浄槽に供給する
配管とは、共有部分と非共有部分とを有しているのであ
るから、非共有部分における洗浄液の入れ替えがスムー
ズに行われず、この結果、非共有部分に前記1の洗浄液
がある程度残留してしまう。When the semiconductor wafer cleaning apparatus having the above structure is adopted, when one cleaning liquid is replaced with another cleaning liquid, the cleaning liquid in a portion of the drain pipe upstream of the valve is removed. Is not smoothly replaced, and as a result, the first cleaning liquid remains to some extent in the portion of the drain pipe. Further, since the pipe for supplying one cleaning liquid to the cleaning tank and the pipe for supplying another cleaning liquid to the cleaning tank have a common part and a non-common part, the cleaning liquid is exchanged in the non-common part. Is not performed smoothly, and as a result, the first cleaning liquid remains in the non-shared portion to some extent.
【0006】そして、前記1の洗浄液がある程度残留し
たままで、前記他の洗浄液による半導体ウエハの洗浄を
行うと、前記他の洗浄液中に前記1の洗浄液が混入して
しまうことになる。したがって、このような不都合の発
生を防止しようとすれば、前記1の洗浄液の残留量が0
になるまで洗浄液の入れ替え処理を行わなければなら
ず、前記他の洗浄液の必要量が著しく多くなってしまう
とともに、洗浄液の入れ替え所要時間が著しく長くな
り、ひいては半導体ウエハの洗浄のための所要時間が著
しく長くなってしまう。If the semiconductor wafer is cleaned with the other cleaning liquid while the first cleaning liquid remains to some extent, the first cleaning liquid is mixed into the other cleaning liquid. Therefore, in order to prevent the occurrence of such an inconvenience, the residual amount of the cleaning liquid in the above item 1 is reduced to 0.
The replacement of the cleaning liquid must be performed until the required amount of the other cleaning liquid is significantly increased, and the required replacement time of the cleaning liquid is significantly increased. It becomes extremely long.
【0007】[0007]
【発明の目的】この発明は上記の問題点に鑑みてなされ
たものであり、処理液の必要量を減少できるとともに、
処理液の入れ替え所要時間を短縮でき、ひいては被処理
体の処理のための所要時間を短縮できる被処理体処理方
法およびその装置を提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and can reduce a required amount of a processing solution.
An object of the present invention is to provide a method and an apparatus for treating an object, which can reduce the time required for replacing the processing solution and, consequently, the time required for processing the object.
【0008】[0008]
【課題を解決するための手段】請求項1の被処理体処理
方法は、第1処理液を処理槽内に供給するための第1供
給配管の途中部に第1バルブを介在させて第1供給配管
を、第2バルブを介在させた第1排出配管と接続し、処
理槽の所定位置に設けたドレン管開口を、第3バルブと
接続し、他の処理液を処理槽内に供給するための第4バ
ルブを介在させた第2供給配管を第1供給配管の下流側
所定位置と接続し、第1処理液を処理槽に供給して被処
理体の処理を行った後に、第1の処理液を前記他の処理
液で入れ替えて被処理体の処理を行うに当って、第1バ
ルブを閉じるとともに第4バルブを開き、前記他の処理
液で第1供給配管の下流側のうち第2供給配管接続位置
よりも下流側を充填してから、第1バルブを操作して第
1供給配管の下流側のうち第2供給配管接続位置よりも
上流側と第1排出配管とを連通するとともに、第2バル
ブを開き、第1供給配管の下流側のうち第2供給配管接
続位置よりも上流側に存在する第1処理液の残液を前記
他の処理液で排除し、この残液を完全に排出した後に第
2バルブを閉じ、第1供給配管の下流側のうち第2供給
配管接続位置よりも下流側を経て処理槽内に流入する他
の処理液がドレン管開口の上方に溜まってから、第3バ
ルブを開いてドレン管にある第1処理液の残液を排出
し、この残液を完全に排出した後におよび第3バルブを
閉じ、その後に、処理槽内に前記他の処理液を連続的に
供給して被処理体の処理を行う方法である。According to a first aspect of the present invention, there is provided a method for processing an object to be processed, wherein a first valve is interposed in a middle of a first supply pipe for supplying a first processing solution into a processing tank. The supply pipe is connected to the first discharge pipe with the second valve interposed, the drain pipe opening provided at a predetermined position in the processing tank is connected to the third valve, and another processing liquid is supplied into the processing tank. Supply pipe with a fourth valve interposed therebetween is connected to a predetermined position on the downstream side of the first supply pipe, and the first processing liquid is supplied to the processing tank to process the object to be processed. In performing the processing of the object to be processed by replacing the processing liquid with the other processing liquid, the first valve is closed and the fourth valve is opened, and the other processing liquid is used for the downstream side of the first supply pipe. After filling the downstream side from the connection position of the second supply pipe, the first valve is operated to operate the downstream side of the first supply pipe. Of the first supply pipe is connected to the first discharge pipe at the upstream side of the second supply pipe connection position, the second valve is opened, and the downstream side of the first supply pipe is located upstream of the second supply pipe connection position. The remaining liquid of the first processing liquid is removed by the other processing liquid, and after completely discharging the remaining liquid, the second valve is closed, and the second supply pipe is located on the downstream side of the first supply pipe from the second supply pipe connection position. After the other processing liquid flowing into the processing tank via the downstream side accumulates above the opening of the drain pipe, the third valve is opened to discharge the remaining liquid of the first processing liquid in the drain pipe. This is a method in which, after completely draining and closing the third valve, the other processing liquid is continuously supplied into the processing tank to process the object to be processed.
【0009】請求項2の被処理体処理装置は、第1処理
液を処理槽内に供給するための第1供給配管の途中部に
第1バルブを介在させて第1供給配管を、第2バルブを
介在させた第1排出配管と接続してあり、処理槽の所定
位置に設けたドレン管開口を、第3バルブと接続してあ
り、他の処理液を処理槽内に供給するための第4バルブ
を介在させた第2供給配管を第1供給配管の下流側所定
位置と接続してあり、第1処理液を処理槽に供給して被
処理体の処理を行った後に、第1の処理液を前記他の処
理液で入れ替えて被処理体の処理を行うに当って、第1
バルブを閉じるとともに第4バルブを開き、前記他の処
理液で第1供給配管の下流側のうち第2供給配管接続位
置よりも下流側を充填してから、第1バルブを操作して
第1供給配管の下流側のうち第2供給配管接続位置より
も上流側と第1排出配管とを連通するとともに、第2バ
ルブを開き、第1供給配管の下流側のうち第2供給配管
接続位置よりも上流側に存在する第1処理液の残液を前
記他の処理液で排除し、この残液を完全に排出した後に
第2バルブを閉じる第1バルブ制御手段と、第1供給配
管の下流側のうち第2供給配管接続位置よりも下流側を
経て処理槽内に流入する他の処理液がドレン管開口の上
方に溜まってから、第3バルブを開いてドレン管にある
第1処理液の残液を排出し、この残液を完全に排出した
後におよび第3バルブを閉じ、処理槽内に前記他の処理
液を連続的に供給して被処理体の処理を行う第2バルブ
制御手段とを含むものである。According to a second aspect of the present invention, there is provided an apparatus for processing an object to be processed, wherein a first valve is interposed in the middle of a first supply pipe for supplying a first processing liquid into a processing tank, and the second supply pipe is connected to a second supply pipe. A drain pipe opening provided at a predetermined position in the processing tank connected to a first discharge pipe with a valve interposed is connected to a third valve to supply another processing liquid into the processing tank. A second supply pipe with a fourth valve interposed is connected to a predetermined position on the downstream side of the first supply pipe, and the first processing liquid is supplied to the processing tank to perform processing on the object to be processed. In performing the processing of the object to be processed by replacing the processing liquid with the other processing liquid, the first processing liquid is used.
The valve is closed and the fourth valve is opened to fill the downstream side of the first supply pipe with the other processing liquid downstream of the second supply pipe connection position, and then the first valve is operated to operate the first supply pipe. In the downstream side of the supply pipe, the upstream side of the second supply pipe connection position is communicated with the first discharge pipe, the second valve is opened, and the second supply pipe connection position of the downstream side of the first supply pipe is opened. A first valve control means for closing the second valve after completely removing the remaining liquid of the first processing liquid existing on the upstream side with the other processing liquid and discharging the remaining liquid; and a downstream of the first supply pipe. After the other processing liquid flowing into the processing tank through the downstream side of the second supply pipe connection position on the side of the second processing pipe accumulates above the drain pipe opening, the third valve is opened to open the first processing liquid in the drain pipe. Is discharged, and after the remaining liquid is completely drained and after the third bath. Close Bed, in which the other processing liquid was continuously fed into the processing tank and a second valve control means for processing the object to be processed.
【0010】[0010]
【作用】請求項1の被処理体処理方法であれば、1つの
処理槽内に被処理体を収容した状態で複数種類の処理液
を順次供給して被処理体を処理するために、第1処理液
を処理槽内に供給するための第1供給配管の途中部に第
1バルブを介在させて第1供給配管を、第2バルブを介
在させた第1排出配管と接続し、処理槽の所定位置に設
けたドレン管開口を、第3バルブと接続し、他の処理液
を処理槽内に供給するための第4バルブを介在させた第
2供給配管を第1供給配管の下流側所定位置と接続して
おき、第1処理液を処理槽に供給して被処理体の処理を
行った後に、第1の処理液を前記他の処理液で入れ替え
て被処理体の処理を行うに当って、第1バルブを閉じる
とともに第4バルブを開き、前記他の処理液で第1供給
配管の下流側のうち第2供給配管接続位置よりも下流側
を充填してから、第1バルブを操作して第1供給配管の
下流側のうち第2供給配管接続位置よりも上流側と第1
排出配管とを連通するとともに、第2バルブを開き、第
1供給配管の下流側のうち第2供給配管接続位置よりも
上流側に存在する第1処理液の残液を前記他の処理液で
排除し、この残液を完全に排出した後に第2バルブを閉
じ、第1供給配管の下流側のうち第2供給配管接続位置
よりも下流側を経て処理槽内に流入する他の処理液がド
レン管開口の上方に溜まってから、第3バルブを開いて
ドレン管にある第1処理液の残液を排出し、この残液を
完全に排出した後におよび第3バルブを閉じ、その後
に、処理槽内に前記他の処理液を連続的に供給して被処
理体の処理を行うのであるから、上述のようにバルブ操
作を行うことにより、前記第1処理液を前記他の処理液
で完全に入れ替えるための処理をスムーズにすることが
でき、前記他の処理液の必要量を少なくすることができ
るとともに、入れ替えの所要時間を短縮することがで
き、ひいては全体としての処理所要時間を短縮すること
ができる。According to the object processing method of the first aspect, a plurality of types of processing liquids are sequentially supplied in a state where the object is accommodated in one processing tank to process the object. (1) connecting a first supply pipe to a first discharge pipe via a second valve via a first valve at an intermediate portion of a first supply pipe for supplying the processing liquid into the processing tank; The drain pipe opening provided at a predetermined position is connected to a third valve, and a second supply pipe interposed with a fourth valve for supplying another processing liquid into the processing tank is downstream of the first supply pipe. After being connected to a predetermined position, the first processing liquid is supplied to the processing tank to process the object, and then the first processing liquid is replaced with the other processing liquid to perform the processing of the object. At the same time, the first valve is closed and the fourth valve is opened, and the other processing liquid is used to seal the downstream side of the first supply pipe. After filling the downstream side of the second supply pipe connected position, the upstream side of the second supply pipe connecting position of the downstream side of the first supply pipe by operating the first valve first
While communicating with the discharge pipe, the second valve is opened, and the remaining liquid of the first processing liquid existing upstream of the second supply pipe connection position on the downstream side of the first supply pipe is replaced with the other processing liquid. After the remaining liquid is completely discharged, the second valve is closed after the remaining liquid is completely discharged, and another processing liquid flowing into the processing tank via the downstream side of the first supply pipe from the position where the second supply pipe is connected is located. After accumulating above the drain pipe opening, the third valve is opened to discharge the residual liquid of the first processing liquid in the drain pipe, and after the residual liquid is completely discharged and the third valve is closed, Since the processing of the object is performed by continuously supplying the other processing liquid into the processing tank, the first processing liquid is converted to the other processing liquid by performing the valve operation as described above. The process for completely replacing can be smoothed, and the other processes It is possible to reduce the required amount, it is possible to shorten the time required for replacement, it is possible to shorten the processing time required for the entire turn.
【0011】請求項2の被処理体処理装置であれば、1
つの処理槽内に被処理体を収容した状態で複数種類の処
理液を順次供給して被処理体を処理するために、第1処
理液を処理槽内に供給するための第1供給配管の途中部
に第1バルブを介在させて第1供給配管を、第2バルブ
を介在させた第1排出配管と接続してあり、処理槽の所
定位置に設けたドレン管開口を、第3バルブと接続して
あり、他の処理液を処理槽内に供給するための第4バル
ブを介在させた第2供給配管を第1供給配管の下流側所
定位置と接続してある。In the object processing apparatus according to claim 2, 1
A first supply pipe for supplying a first processing liquid into the processing tanks in order to sequentially supply a plurality of types of processing liquids in a state where the processing objects are accommodated in one processing tank and to process the processing objects. The first supply pipe is connected to the first discharge pipe via the second valve with the first valve interposed therebetween, and the drain pipe opening provided at a predetermined position in the processing tank is connected to the third valve. A second supply pipe, which is connected and has a fourth valve for supplying another treatment liquid into the treatment tank, is connected to a predetermined position downstream of the first supply pipe.
【0012】そして、第1処理液を処理槽に供給して被
処理体の処理を行った後に、第1の処理液を前記他の処
理液で入れ替えて被処理体の処理を行うに当って、第1
バルブ制御手段によって、第1バルブを閉じるとともに
第4バルブを開き、前記他の処理液で第1供給配管の下
流側のうち第2供給配管接続位置よりも下流側を充填し
てから、第1バルブを操作して第1供給配管の下流側の
うち第2供給配管接続位置よりも上流側と第1排出配管
とを連通するとともに、第2バルブを開き、第1供給配
管の下流側のうち第2供給配管接続位置よりも上流側に
存在する第1処理液の残液を前記他の処理液で排除し、
この残液を完全に排出した後に第2バルブを閉じ、第2
バルブ制御手段によって、第1供給配管の下流側のうち
第2供給配管接続位置よりも下流側を経て処理槽内に流
入する他の処理液がドレン管開口の上方に溜まってか
ら、第3バルブを開いてドレン管にある第1処理液の残
液を排出し、この残液を完全に排出した後におよび第3
バルブを閉じ、処理槽内に前記他の処理液を連続的に供
給して被処理体の処理を行うことができる。Then, after the first processing liquid is supplied to the processing tank to process the object, the first processing liquid is replaced with the other processing liquid and the processing of the object is performed. , First
The valve control means closes the first valve and opens the fourth valve to fill the downstream side of the first supply pipe with the other processing liquid downstream of the second supply pipe connection position. By operating the valve, the upstream side of the second supply pipe connection position on the downstream side of the first supply pipe and the first discharge pipe are communicated, and the second valve is opened to open the second supply pipe on the downstream side of the first supply pipe. Removing the remaining liquid of the first processing liquid existing upstream from the second supply pipe connection position with the other processing liquid;
After completely draining this residual liquid, the second valve is closed and the second valve is closed.
After the other processing liquid flowing into the processing tank through the downstream side of the first supply pipe and downstream of the second supply pipe connection position by the valve control means accumulates above the drain pipe opening, the third valve To drain the residual liquid of the first processing liquid in the drain pipe, and after completely draining the residual liquid, and
The object can be processed by closing the valve and continuously supplying the other processing liquid into the processing tank.
【0013】したがって、上述のようにバルブ操作を行
うことにより、前記第1処理液を前記他の処理液で完全
に入れ替えるための処理をスムーズにすることができ、
前記他の処理液の必要量を少なくすることができるとと
もに、入れ替えの所要時間を短縮することができ、ひい
ては全体としての処理所要時間を短縮することができ
る。Therefore, by performing the valve operation as described above, the processing for completely replacing the first processing liquid with the other processing liquid can be smoothed,
The required amount of the other processing liquid can be reduced, and the time required for replacement can be reduced, and thus the processing time required as a whole can be reduced.
【0014】[0014]
【発明の実施の形態】以下、添付図面を参照して、この
発明の被処理体処理方法およびその装置の実施の態様を
詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method and an apparatus for treating an object according to the present invention will be described in detail with reference to the accompanying drawings.
【0015】図1はこの発明の被処理体処理装置の一実
施態様の半導体ウエハ洗浄装置を示す概略図である。FIG. 1 is a schematic view showing a semiconductor wafer cleaning apparatus according to an embodiment of the object processing apparatus of the present invention.
【0016】この半導体ウエハ洗浄装置は、底壁をテー
パ状に形成してなる洗浄槽1の底部所定位置に洗浄液供
給部材2を設け、洗浄液供給部材2よりも上方の所定位
置に整流部材3を設けて、半導体ウエハ収容空間を形成
している。そして、第1洗浄液タンク4から洗浄液供給
部材2に向かって第1洗浄液を供給する第1供給配管5
の所定位置に三方バルブ(第1バルブ)6を設け、この
三方バルブ6に対して、第2バルブ7を介在させた第1
排出配管8を接続している。また、第2洗浄液を収容す
る第2洗浄液タンク9と、第1供給配管5の三方バルブ
6よりも下流側の所定位置との間に、第4バルブ10を
介在させた第2供給配管11を接続している。さらに、
洗浄槽1の底壁の最も低い箇所に形成したドレン管開口
に対して、第3バルブ12を介在させたドレン管(第2
排出配管)13を接続している。In this semiconductor wafer cleaning apparatus, a cleaning liquid supply member 2 is provided at a predetermined position at the bottom of a cleaning tank 1 having a tapered bottom wall, and a rectifying member 3 is provided at a predetermined position above the cleaning liquid supply member 2. To form a semiconductor wafer accommodation space. Then, a first supply pipe 5 for supplying the first cleaning liquid from the first cleaning liquid tank 4 to the cleaning liquid supply member 2.
A three-way valve (first valve) 6 is provided at a predetermined position, and a first valve 6 having a second valve 7 interposed with respect to the three-way valve 6.
The discharge pipe 8 is connected. Further, a second supply pipe 11 having a fourth valve 10 interposed between a second cleaning liquid tank 9 containing the second cleaning liquid and a predetermined position downstream of the three-way valve 6 of the first supply pipe 5 is provided. Connected. further,
A drain pipe (second pipe) with a third valve 12 interposed between the drain pipe opening formed at the lowest point of the bottom wall of the cleaning tank 1.
(Discharge pipe) 13.
【0017】なお、第1排出配管8、ドレン管13は、
それぞれ廃液タンク14、15と接続されている。ま
た、洗浄槽1からオーバーフローした洗浄液を回収する
ための配管など(図示せず)を有している。そして、矢
印が洗浄液の流れを示している。The first discharge pipe 8 and the drain pipe 13 are
They are connected to waste liquid tanks 14 and 15, respectively. In addition, a pipe or the like (not shown) for collecting the cleaning liquid overflowing from the cleaning tank 1 is provided. Arrows indicate the flow of the cleaning liquid.
【0018】図2は図1の半導体ウエハ洗浄装置の処理
の要部(第1バルブ制御手段、及び第2バルブ制御手段
の処理を含む)を説明するフローチャートである。FIG. 2 is a flow chart for explaining the main part of the processing of the semiconductor wafer cleaning apparatus of FIG. 1 (including the processing of the first valve control means and the second valve control means).
【0019】ステップSP1において、三方バルブ6を
操作して、第1洗浄液タンク4から第1洗浄液を洗浄液
供給部材2に供給可能とし、しかも、第2バルブ7、第
3バルブ12および第4バルブ10を閉じて、第1洗浄
液を洗浄槽1に供給し、ステップSP2において、図示
しない半導体ウエハ搬入出装置(図示せず)を動作させ
て半導体ウエハ収容空間に半導体ウエハ16を搬入し、
ステップSP3において、第1洗浄液を洗浄槽1に供給
しつつ、洗浄槽1の上部からオーバーフローさせながら
半導体ウエハ16を洗浄する(オーバーフロー洗浄を行
う)。In step SP1, the three-way valve 6 is operated to enable the first cleaning liquid to be supplied from the first cleaning liquid tank 4 to the cleaning liquid supply member 2. Further, the second valve 7, the third valve 12, and the fourth valve 10 Is closed, the first cleaning liquid is supplied to the cleaning tank 1, and in step SP2, a semiconductor wafer loading / unloading device (not shown) is operated to load the semiconductor wafer 16 into the semiconductor wafer accommodating space.
In step SP3, the semiconductor wafer 16 is washed while overflowing from above the washing tank 1 while supplying the first washing liquid to the washing tank 1 (perform overflow washing).
【0020】次いで、ステップSP4において、三方バ
ルブ6を操作して、第1供給配管5の下流側と第1排出
配管8とを連通させるとともに、第4バルブ10を開い
て、第2洗浄液を洗浄槽1に供給し、第1洗浄液を洗浄
槽1から押し出す(オーバーフローさせる)ことにより
洗浄槽1内における洗浄液の入れ替えを行い、ステップ
SP5において、第2バルブ7、および第3バルブ12
を開くことにより、第1供給配管5の下流側のうち、第
2供給配管11の接続部よりも上流側における残液を廃
液タンク14に排出するとともに、ドレン管13におけ
る残液を廃液タンク15に排出し、残液の排出が完了し
た後に、ステップSP6において、第2バルブ7、およ
び第3バルブ12を閉じ、ステップSP7において、第
2洗浄液を洗浄槽1に供給しつつ、洗浄槽1の上部から
オーバーフローさせながら半導体ウエハ16を洗浄し
(オーバーフロー洗浄を行い)、そのまま一連の処理を
終了する。Next, in step SP4, the three-way valve 6 is operated to connect the downstream side of the first supply pipe 5 with the first discharge pipe 8, and the fourth valve 10 is opened to wash the second cleaning liquid. The first cleaning liquid is supplied to the tank 1 and the first cleaning liquid is pushed out of the cleaning tank 1 (overflow), thereby replacing the cleaning liquid in the cleaning tank 1. In step SP5, the second valve 7 and the third valve 12 are replaced.
To discharge the residual liquid upstream of the connection of the second supply pipe 11 to the waste liquid tank 14 and to discharge the residual liquid in the drain pipe 13 to the waste liquid tank 15 on the downstream side of the first supply pipe 5. After the discharge of the remaining liquid is completed, the second valve 7 and the third valve 12 are closed in step SP6, and the second cleaning liquid is supplied to the cleaning tank 1 while supplying the second cleaning liquid to the cleaning tank 1 in step SP7. The semiconductor wafer 16 is cleaned while overflowing from above (performs overflow cleaning), and a series of processing is terminated as it is.
【0021】以上の一連の処理を行えば、洗浄槽1内に
おける洗浄液の入れ替えを行った後に、または同時に、
第2バルブ7、および第3バルブ12を開いて残液を排
出するのであるから、短時間で洗浄液の完全な入れ替え
を達成することができ、第2洗浄液の必要量を少なくす
ることができる。この結果、半導体ウエハ16を洗浄す
るための所要時間を短縮することができる。By performing the above series of processes, after replacing the cleaning liquid in the cleaning tank 1 or simultaneously,
Since the remaining liquid is discharged by opening the second valve 7 and the third valve 12, it is possible to achieve a complete replacement of the cleaning liquid in a short time, and to reduce the required amount of the second cleaning liquid. As a result, the time required for cleaning the semiconductor wafer 16 can be reduced.
【0022】図3はこの発明の被処理体処理装置の他の
実施態様の半導体ウエハ洗浄装置を示す概略図である。FIG. 3 is a schematic view showing a semiconductor wafer cleaning apparatus according to another embodiment of the object processing apparatus of the present invention.
【0023】この半導体ウエハ洗浄装置が図1の半導体
ウエハ洗浄装置と異なる点は、洗浄槽1の側壁の最下端
部にドレン管開口を形成し、このドレン管開口に対し
て、第3バルブ12を介在させたドレン管13を接続し
た点のみである。This semiconductor wafer cleaning apparatus is different from the semiconductor wafer cleaning apparatus shown in FIG. 1 in that a drain pipe opening is formed at the lowermost end of the side wall of the cleaning tank 1, and a third valve 12 is provided for the drain pipe opening. Only at the point where the drain pipe 13 is connected.
【0024】したがって、この実施態様を採用した場合
にも、上記の実施態様と同様の作用を達成することがで
きる。Therefore, even when this embodiment is adopted, the same operation as that of the above embodiment can be achieved.
【0025】図4はこの発明の被処理体処理装置のさら
に他の実施態様の半導体ウエハ洗浄装置を示す概略図で
ある。FIG. 4 is a schematic view showing a semiconductor wafer cleaning apparatus according to still another embodiment of the object processing apparatus of the present invention.
【0026】この半導体ウエハ洗浄装置が図1の半導体
ウエハ洗浄装置と異なる点は、洗浄槽1の側壁の最下端
部にドレン管開口を形成し、このドレン管開口に対し
て、直接に第3バルブ12を接続した点のみである。This semiconductor wafer cleaning apparatus is different from the semiconductor wafer cleaning apparatus of FIG. 1 in that a drain pipe opening is formed at the lowermost end of the side wall of the cleaning tank 1, and a third pipe is formed directly on the drain pipe opening. It is only the point where the valve 12 is connected.
【0027】したがって、この実施態様を採用した場合
にも、ドレン管開口、第3バルブ12に残液が生じるの
であるから、上記の実施態様と同様の作用を達成するこ
とができる。Therefore, even when this embodiment is adopted, since the residual liquid is generated at the drain pipe opening and the third valve 12, the same operation as the above-mentioned embodiment can be achieved.
【0028】なお、以上には、半導体ウエハ洗浄方法お
よびその装置についてのみ説明したが、半導体ウエハ以
外の被洗浄体に適用することが可能であるほか、複数種
類の処理液を順次処理槽に供給して被処理体の処理を行
うことも可能であり、その他、この発明の要旨を変更し
ない範囲内において種々の設計変更を施すことが可能で
ある。Although only the semiconductor wafer cleaning method and its apparatus have been described above, the present invention can be applied to an object to be cleaned other than a semiconductor wafer, and a plurality of types of processing liquids are sequentially supplied to a processing tank. It is also possible to perform processing on the object to be processed, and it is also possible to make various design changes within a range that does not change the gist of the present invention.
【0029】[0029]
【発明の効果】請求項1の発明は、第1処理液を前記他
の処理液で完全に入れ替えるための処理をスムーズにす
ることができ、前記他の処理液の必要量を少なくするこ
とができるとともに、入れ替えの所要時間を短縮するこ
とができ、ひいては全体としての処理所要時間を短縮す
ることができるという特有の効果を奏する。According to the first aspect of the present invention, the processing for completely replacing the first processing liquid with the other processing liquid can be performed smoothly, and the required amount of the other processing liquid can be reduced. As a result, it is possible to reduce the time required for the replacement, and thereby to shorten the time required for the processing as a whole.
【0030】請求項2の発明も、第1処理液を前記他の
処理液で完全に入れ替えるための処理をスムーズにする
ことができ、前記他の処理液の必要量を少なくすること
ができるとともに、入れ替えの所要時間を短縮すること
ができ、ひいては全体としての処理所要時間を短縮する
ことができるという特有の効果を奏する。According to the second aspect of the present invention, the process for completely replacing the first processing solution with the other processing solution can be smoothly performed, and the required amount of the other processing solution can be reduced. In addition, it is possible to shorten the time required for the replacement, and thus to shorten the time required for the processing as a whole.
【図1】この発明の被処理体処理装置の一実施態様の半
導体ウエハ洗浄装置を示す概略図である。FIG. 1 is a schematic view showing a semiconductor wafer cleaning apparatus according to one embodiment of an object processing apparatus of the present invention.
【図2】図1の半導体ウエハ洗浄装置の処理の要部を説
明するフローチャートである。FIG. 2 is a flowchart illustrating a main part of a process of the semiconductor wafer cleaning apparatus of FIG. 1;
【図3】この発明の被処理体処理装置の他の実施態様の
半導体ウエハ洗浄装置を示す概略図である。FIG. 3 is a schematic diagram showing a semiconductor wafer cleaning apparatus according to another embodiment of the object processing apparatus of the present invention.
【図4】この発明の被処理体処理装置のさらに他の実施
態様の半導体ウエハ洗浄装置を示す概略図である。FIG. 4 is a schematic view showing a semiconductor wafer cleaning apparatus according to still another embodiment of the object processing apparatus of the present invention.
1 洗浄槽 5 第1供給配管 6 三方バルブ 7 第2バルブ 8 第1排出配管 10 第4バルブ 11 第2供給配管 12 第3バルブ 16 半導体ウエハ DESCRIPTION OF SYMBOLS 1 Cleaning tank 5 1st supply pipe 6 3 way valve 7 2nd valve 8 1st discharge pipe 10 4th valve 11 2nd supply pipe 12 3rd valve 16 Semiconductor wafer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 喜 冠南 大阪府堺市金岡町1304番地 ダイキン工業 株式会社金岡工場内 (72)発明者 大野 正雄 大阪府堺市金岡町1304番地 ダイキン工業 株式会社金岡工場内 Fターム(参考) 3B201 AA03 BB03 BB22 BB95 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ki Kanan 1304, Kanaokacho, Sakai City, Osaka Prefecture Daikin Industries, Ltd.Kanaoka Plant (72) Inventor Masao Ono 1304, Kanaokacho, Sakai City, Osaka Daikin Industries Kanaoka Co., Ltd. F-term in the factory (reference) 3B201 AA03 BB03 BB22 BB95
Claims (2)
6)を収容した状態で複数種類の処理液を順次供給して
被処理体(16)を処理する被処理体処理方法であっ
て、 第1処理液を処理槽(1)内に供給するための第1供給
配管(5)の途中部に第1バルブ(6)を介在させて第
1供給配管(5)を、第2バルブ(7)を介在させた第
1排出配管(8)と接続し、 処理槽(1)の所定位置に設けたドレン管開口を、第3
バルブ(12)と接続し、 他の処理液を処理槽(1)内に供給するための第4バル
ブ(10)を介在させた第2供給配管(11)を第1供
給配管(5)の下流側所定位置と接続し、 第1処理液を処理槽(1)に供給して被処理体(16)
の処理を行った後に、第1の処理液を前記他の処理液で
入れ替えて被処理体(16)の処理を行うに当って、第
1バルブ(6)を閉じるとともに第4バルブ(10)を
開き、前記他の処理液で第1供給配管(5)の下流側の
うち第2供給配管(11)接続位置よりも下流側を充填
してから、第1バルブ(6)を操作して第1供給配管
(5)の下流側のうち第2供給配管(11)接続位置よ
りも上流側と第1排出配管(8)とを連通するととも
に、第2バルブ(7)を開き、第1供給配管(5)の下
流側のうち第2供給配管(11)接続位置よりも上流側
に存在する第1処理液の残液を前記他の処理液で排除
し、この残液を完全に排出した後に第2バルブ(7)を
閉じ、 第1供給配管(5)の下流側のうち第2供給配管(1
1)接続位置よりも下流側を経て処理槽(1)内に流入
する他の処理液がドレン管開口の上方に溜まってから、
第3バルブ(12)を開いてドレン管(13)にある第
1処理液の残液を排出し、この残液を完全に排出した後
におよび第3バルブ(12)を閉じ、 その後に、処理槽(1)内に前記他の処理液を連続的に
供給して被処理体(16)の処理を行うことを特徴とす
る被処理体処理方法。1. An object to be processed (1) is placed in one processing tank (1).
6) A method for processing a target object (16) by sequentially supplying a plurality of types of processing liquids in a state in which the first processing liquid is stored in the processing tank (1). The first supply pipe (5) is connected to the first discharge pipe (8) via the second valve (7) via a first valve (6) in the middle of the first supply pipe (5). The drain pipe opening provided at a predetermined position in the processing tank (1) is
A second supply pipe (11) connected to a valve (12) and interposing a fourth valve (10) for supplying another treatment liquid into the treatment tank (1) is connected to the first supply pipe (5). A first processing liquid is connected to a predetermined position on the downstream side, and the first processing liquid is supplied to the processing tank (1) to be processed (16).
After performing the process (1), the first valve (6) is closed and the fourth valve (10) is replaced in replacing the first processing solution with the other processing solution and processing the object (16). And filling the downstream side of the first supply pipe (5) from the connection position of the second supply pipe (11) with the other processing liquid, and then operating the first valve (6). In the downstream side of the first supply pipe (5), the first discharge pipe (8) communicates with the upstream side of the connection position of the second supply pipe (11), and the second valve (7) is opened. Of the downstream side of the supply pipe (5), the remaining liquid of the first processing liquid existing upstream of the connection position of the second supply pipe (11) is eliminated by the other processing liquid, and the remaining liquid is completely discharged. After that, the second valve (7) is closed, and the second supply pipe (1) on the downstream side of the first supply pipe (5) is closed.
1) After other processing liquid flowing into the processing tank (1) via the downstream side from the connection position accumulates above the drain pipe opening,
The third valve (12) is opened to discharge the residual liquid of the first processing liquid in the drain pipe (13), and after the residual liquid is completely discharged and the third valve (12) is closed, the processing is continued. A method for treating an object to be processed, characterized in that the object to be processed (16) is processed by continuously supplying the other processing liquid into the tank (1).
6)を収容した状態で複数種類の処理液を順次供給して
被処理体(16)を処理する被処理体処理装置であっ
て、 第1処理液を処理槽(1)内に供給するための第1供給
配管(5)の途中部に第1バルブ(6)を介在させて第
1供給配管(5)を、第2バルブ(7)を介在させた第
1排出配管(8)と接続してあり、 処理槽(1)の所定位置に設けたドレン管開口を、第3
バルブ(12)と接続してあり、 他の処理液を処理槽(1)内に供給するための第4バル
ブ(10)を介在させた第2供給配管(11)を第1供
給配管(5)の下流側所定位置と接続してあり、 第1処理液を処理槽(1)に供給して被処理体(16)
の処理を行った後に、第1の処理液を前記他の処理液で
入れ替えて被処理体(16)の処理を行うに当って、第
1バルブ(6)を閉じるとともに第4バルブ(10)を
開き、前記他の処理液で第1供給配管(5)の下流側の
うち第2供給配管(11)接続位置よりも下流側を充填
してから、第1バルブ(6)を操作して第1供給配管
(5)の下流側のうち第2供給配管(11)接続位置よ
りも上流側と第1排出配管(8)とを連通するととも
に、第2バルブ(7)を開き、第1供給配管(5)の下
流側のうち第2供給配管(11)接続位置よりも上流側
に存在する第1処理液の残液を前記他の処理液で排除
し、この残液を完全に排出した後に第2バルブ(7)を
閉じる第1バルブ制御手段と、 第1供給配管(5)の下流側のうち第2供給配管(1
1)接続位置よりも下流側を経て処理槽(1)内に流入
する他の処理液がドレン管開口の上方に溜まってから、
第3バルブ(12)を開いてドレン管(13)にある第
1処理液の残液を排出し、この残液を完全に排出した後
におよび第3バルブ(12)を閉じ、処理槽(1)内に
前記他の処理液を連続的に供給して被処理体(16)の
処理を行う第2バルブ制御手段とを含むことを特徴とす
る被処理体処理装置。2. An object to be processed (1) is placed in one processing tank (1).
An object processing apparatus for processing an object to be processed by sequentially supplying a plurality of types of processing liquids in a state in which the first processing liquid is supplied into the processing tank. The first supply pipe (5) is connected to the first discharge pipe (8) via the second valve (7) via a first valve (6) in the middle of the first supply pipe (5). The drain pipe opening provided at a predetermined position of the processing tank (1) is
The second supply pipe (11) connected to the valve (12) and interposing a fourth valve (10) for supplying another processing liquid into the processing tank (1) is connected to the first supply pipe (5). ), Is connected to a predetermined position on the downstream side, and supplies the first processing liquid to the processing tank (1) to supply the first processing liquid to the processing object (16).
After performing the process (1), the first valve (6) is closed and the fourth valve (10) is replaced when the first processing solution is replaced with the other processing solution and the object (16) is processed. And filling the downstream side of the first supply pipe (5) with the other processing liquid downstream of the connection position of the second supply pipe (11), and then operating the first valve (6). In the downstream side of the first supply pipe (5), the first discharge pipe (8) communicates with the upstream side of the second supply pipe (11) connection position, and the second valve (7) is opened to open the first supply pipe. Of the downstream side of the supply pipe (5), the remaining liquid of the first processing liquid existing upstream of the connection position of the second supply pipe (11) is eliminated by the other processing liquid, and the remaining liquid is completely discharged. A first valve control means for closing the second valve (7) after the operation, and a second supply pipe on the downstream side of the first supply pipe (5). (1
1) After other processing liquid flowing into the processing tank (1) via the downstream side from the connection position accumulates above the drain pipe opening,
The third valve (12) is opened to discharge the residual liquid of the first processing liquid in the drain pipe (13), and after the residual liquid is completely discharged and the third valve (12) is closed, the processing tank (1) is closed. And a second valve control unit for continuously supplying the other processing liquid into the processing unit to process the processing target.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17500598A JP2000005713A (en) | 1998-06-22 | 1998-06-22 | Treatment of work and apparatus therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17500598A JP2000005713A (en) | 1998-06-22 | 1998-06-22 | Treatment of work and apparatus therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000005713A true JP2000005713A (en) | 2000-01-11 |
Family
ID=15988557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17500598A Pending JP2000005713A (en) | 1998-06-22 | 1998-06-22 | Treatment of work and apparatus therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000005713A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135519A (en) * | 2009-02-23 | 2009-06-18 | Seiko Epson Corp | Semiconductor manufacturing system, control device, method for controlling semiconductor manufacturing system, and treated liquid recovery method |
-
1998
- 1998-06-22 JP JP17500598A patent/JP2000005713A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135519A (en) * | 2009-02-23 | 2009-06-18 | Seiko Epson Corp | Semiconductor manufacturing system, control device, method for controlling semiconductor manufacturing system, and treated liquid recovery method |
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