US3602846A
(en)
|
1969-07-14 |
1971-08-31 |
Pulse Eng Inc |
Delay line
|
US3825876A
(en)
|
1971-08-12 |
1974-07-23 |
Augat Inc |
Electrical component mounting
|
US3762039A
(en)
|
1971-09-10 |
1973-10-02 |
Mos Technology Inc |
Plastic encapsulation of microcircuits
|
US3846734A
(en)
|
1973-02-06 |
1974-11-05 |
Amp Inc |
Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
|
US4391408A
(en)
*
|
1980-09-05 |
1983-07-05 |
Augat Inc. |
Low insertion force connector
|
JPS60239043A
(ja)
|
1984-05-14 |
1985-11-27 |
Oki Electric Ind Co Ltd |
半導体装置用パツケ−ジの製造方法
|
US4987474A
(en)
*
|
1987-09-18 |
1991-01-22 |
Hitachi, Ltd. |
Semiconductor device and method of manufacturing the same
|
US4916519A
(en)
|
1989-05-30 |
1990-04-10 |
International Business Machines Corporation |
Semiconductor package
|
US5557504A
(en)
|
1993-08-31 |
1996-09-17 |
Sgs-Thomson Microelectronics, Inc. |
Surface mountable integrated circuit package with detachable module
|
USD359028S
(en)
|
1993-09-02 |
1995-06-06 |
Sgs-Thomson Microelectronics, Inc. |
Socketed integrated circuit package
|
USD357462S
(en)
|
1993-09-16 |
1995-04-18 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control
|
USD360619S
(en)
*
|
1993-09-16 |
1995-07-25 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control
|
USD358806S
(en)
|
1993-09-24 |
1995-05-30 |
Sgs-Thomson Microelectronics, Inc. |
Socketed integrated circuit package
|
USD357901S
(en)
|
1993-09-27 |
1995-05-02 |
Telefonaktiebolaget Lm Ericsson |
Power supply unit
|
US5757070A
(en)
*
|
1995-10-24 |
1998-05-26 |
Altera Corporation |
Integrated circuit package
|
USD401912S
(en)
|
1995-11-27 |
1998-12-01 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
USD394244S
(en)
|
1995-11-27 |
1998-05-12 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
USD396211S
(en)
|
1996-09-09 |
1998-07-21 |
Fuji Electric Co., Ltd. |
Integrated circuit device
|
EP0884781A3
(en)
|
1997-06-12 |
1999-06-30 |
Hitachi, Ltd. |
Power semiconductor module
|
USD448739S1
(en)
|
2000-09-12 |
2001-10-02 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
USD466485S1
(en)
*
|
2001-05-23 |
2002-12-03 |
Shindengen Electric Manufactuturing Co., Ltd. |
Semiconductor package
|
JP2003077939A
(ja)
|
2001-09-05 |
2003-03-14 |
Mitsubishi Electric Corp |
半導体装置およびその製造方法
|
USD470825S1
(en)
*
|
2001-12-28 |
2003-02-25 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
JP2004063688A
(ja)
*
|
2002-07-26 |
2004-02-26 |
Mitsubishi Electric Corp |
半導体装置及び半導体アセンブリモジュール
|
USD505399S1
(en)
|
2003-03-14 |
2005-05-24 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
USD505400S1
(en)
|
2004-03-26 |
2005-05-24 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device
|
USD548202S1
(en)
|
2006-04-17 |
2007-08-07 |
Kabushiki Kaisha Toshiba |
Semiconductor
|
USD539761S1
(en)
|
2006-08-22 |
2007-04-03 |
Kabushiki Kaisha Toshiba |
Semiconductor
|
JP5041798B2
(ja)
|
2006-12-15 |
2012-10-03 |
三菱電機株式会社 |
半導体装置
|
USD874411S1
(en)
|
2008-04-13 |
2020-02-04 |
Rohm Co., Ltd. |
Semiconductor module
|
JP2010147116A
(ja)
|
2008-12-17 |
2010-07-01 |
Mitsubishi Electric Corp |
半導体装置
|
USD648682S1
(en)
*
|
2011-03-31 |
2011-11-15 |
Cheng Uei Precision Industry Co., Ltd. |
Double-card connector
|
USD674760S1
(en)
*
|
2011-04-01 |
2013-01-22 |
Fuji Electric Co., Ltd. |
Semiconductor device
|
USD717256S1
(en)
|
2012-09-20 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
USD719113S1
(en)
|
2012-09-20 |
2014-12-09 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
USD717255S1
(en)
|
2012-09-20 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
USD717253S1
(en)
|
2012-10-11 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
USD717254S1
(en)
|
2012-10-11 |
2014-11-11 |
Samsung Electro-Mechanics Co., Ltd. |
Semiconductor device
|
USD719537S1
(en)
*
|
2013-05-08 |
2014-12-16 |
Mitsubishi Electric Corporation |
Semiconductor device
|
USD705184S1
(en)
|
2013-07-11 |
2014-05-20 |
Fuji Electric Co., Ltd. |
Semiconductor module
|
USD754084S1
(en)
|
2013-08-21 |
2016-04-19 |
Mitsubishi Electric Corporation |
Semiconductor device
|
USD754083S1
(en)
*
|
2013-10-17 |
2016-04-19 |
Vlt, Inc. |
Electric terminal
|
USD772182S1
(en)
|
2014-04-02 |
2016-11-22 |
Mitsubishi Electric Corporation |
Power semiconductor device
|
JP1533793S
(ja)
|
2015-02-04 |
2015-09-28 |
|
|
USD767516S1
(en)
|
2015-02-04 |
2016-09-27 |
Mitsubishi Electric Corporation |
Semiconductor device
|
USD766851S1
(en)
|
2015-02-04 |
2016-09-20 |
Mitsubishi Electric Corporation |
Semiconductor device
|
JP6362560B2
(ja)
|
2015-03-24 |
2018-07-25 |
三菱電機株式会社 |
半導体モジュール、電力変換装置および半導体モジュールの製造方法
|
USD814431S1
(en)
|
2015-05-15 |
2018-04-03 |
Mitsubishi Electric Corporation |
Power semiconductor device
|
JP1551590S
(ja)
|
2015-11-30 |
2016-06-13 |
|
|
JP1565636S
(ja)
|
2016-03-11 |
2016-12-19 |
|
|
JP1578687S
(ja)
|
2016-11-08 |
2017-06-12 |
|
|
USD853342S1
(en)
|
2017-02-28 |
2019-07-09 |
Infineon Technologies Ag |
High-performance semiconductor module
|
JP1603359S
(ja)
*
|
2017-10-19 |
2018-05-07 |
|
|
USD864884S1
(en)
|
2017-10-23 |
2019-10-29 |
Mitsubishi Electric Corporation |
Semiconductor device
|
USD859334S1
(en)
|
2017-10-26 |
2019-09-10 |
Mitsubishi Electric Corporation |
Semiconductor device
|
USD877102S1
(en)
|
2017-12-28 |
2020-03-03 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor module
|
USD873226S1
(en)
|
2018-04-13 |
2020-01-21 |
Rohm Co., Ltd. |
Semiconductor module
|
USD874412S1
(en)
|
2018-04-13 |
2020-02-04 |
Rohm Co., Ltd. |
Semiconductor module
|
JP1632173S
(ja)
|
2018-06-01 |
2019-05-27 |
|
|
USD888673S1
(en)
*
|
2018-06-26 |
2020-06-30 |
Rohm Co., Ltd. |
Semiconductor module
|