USD981356S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD981356S1 USD981356S1 US29/743,421 US202029743421F USD981356S US D981356 S1 USD981356 S1 US D981356S1 US 202029743421 F US202029743421 F US 202029743421F US D981356 S USD981356 S US D981356S
- Authority
- US
- United States
- Prior art keywords
- semiconductor module
- view
- side perspective
- design
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The oblique line shading shown in the drawings indicates transparent parts.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-001385D | 2020-01-28 | ||
JPD2020-1388F JP1684232S (en) | 2020-01-28 | 2020-01-28 | |
JP2020-001382D | 2020-01-28 | ||
JPD2020-1385F JP1672263S (en) | 2020-01-28 | 2020-01-28 | |
JPD2020-1389F JP1684233S (en) | 2020-01-28 | 2020-01-28 | |
JP2020-001388D | 2020-01-28 | ||
JP2020-001389D | 2020-01-28 | ||
JP2020001382F JP1705786S (en) | 2020-01-28 | 2020-01-28 | Semiconductor module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD981356S1 true USD981356S1 (en) | 2023-03-21 |
Family
ID=85557232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/743,421 Active USD981356S1 (en) | 2020-01-28 | 2020-07-21 | Semiconductor module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD981356S1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
Citations (39)
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US4028722A (en) * | 1970-10-13 | 1977-06-07 | Motorola, Inc. | Contact bonded packaged integrated circuit |
USD357462S (en) * | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD360619S (en) * | 1993-09-16 | 1995-07-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
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USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
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USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
JP1615884S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615979S (en) | 2018-04-13 | 2018-10-15 | ||
JP1630154S (en) | 2018-06-26 | 2019-04-22 | ||
JP1629924S (en) | 2018-06-26 | 2019-04-22 | ||
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
JP1641098S (en) | 2018-06-26 | 2019-09-09 | ||
USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
US20200388580A1 (en) * | 2018-03-12 | 2020-12-10 | Rohm Co., Ltd. | Semiconductor device, and mounting structure for semiconductor device |
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
US20210036700A1 (en) * | 2018-06-04 | 2021-02-04 | Rohm Co., Ltd. | Semiconductor device |
US20210217741A1 (en) * | 2018-06-20 | 2021-07-15 | Rohm Co., Ltd. | Semiconductor device |
US20220246507A1 (en) * | 2018-06-11 | 2022-08-04 | Rohm Co., Ltd. | Semiconductor module |
US20220301966A1 (en) * | 2021-03-17 | 2022-09-22 | Rohm Co., Ltd. | Semiconductor device |
-
2020
- 2020-07-21 US US29/743,421 patent/USD981356S1/en active Active
Patent Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4028722A (en) * | 1970-10-13 | 1977-06-07 | Motorola, Inc. | Contact bonded packaged integrated circuit |
USD357462S (en) * | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD357671S (en) * | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD360619S (en) * | 1993-09-16 | 1995-07-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD401912S (en) * | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470825S1 (en) * | 2001-12-28 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
US20200388580A1 (en) * | 2018-03-12 | 2020-12-10 | Rohm Co., Ltd. | Semiconductor device, and mounting structure for semiconductor device |
JP1615979S (en) | 2018-04-13 | 2018-10-15 | ||
JP1615884S (en) | 2018-04-13 | 2018-10-15 | ||
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
US20210036700A1 (en) * | 2018-06-04 | 2021-02-04 | Rohm Co., Ltd. | Semiconductor device |
US20220246507A1 (en) * | 2018-06-11 | 2022-08-04 | Rohm Co., Ltd. | Semiconductor module |
US20210217741A1 (en) * | 2018-06-20 | 2021-07-15 | Rohm Co., Ltd. | Semiconductor device |
JP1629924S (en) | 2018-06-26 | 2019-04-22 | ||
USD903613S1 (en) * | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
JP1641098S (en) | 2018-06-26 | 2019-09-09 | ||
JP1630154S (en) | 2018-06-26 | 2019-04-22 | ||
US20220301966A1 (en) * | 2021-03-17 | 2022-09-22 | Rohm Co., Ltd. | Semiconductor device |
Non-Patent Citations (1)
Title |
---|
Office Action issued for Japanese Patent Application No. 2020-001382, dated Oct. 2, 2020, 2 pages. |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |