IT8806627A0 - Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti - Google Patents

Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti

Info

Publication number
IT8806627A0
IT8806627A0 IT8806627A IT662788A IT8806627A0 IT 8806627 A0 IT8806627 A0 IT 8806627A0 IT 8806627 A IT8806627 A IT 8806627A IT 662788 A IT662788 A IT 662788A IT 8806627 A0 IT8806627 A0 IT 8806627A0
Authority
IT
Italy
Prior art keywords
semiconductor devices
mos semiconductor
gettering
procedure
treatment
Prior art date
Application number
IT8806627A
Other languages
English (en)
Other versions
IT1230028B (it
Inventor
Magro Carmelo
Barbarino Eleonora
Pulvirenti Antonino
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT8806627A priority Critical patent/IT1230028B/it
Publication of IT8806627A0 publication Critical patent/IT8806627A0/it
Priority to EP89203161A priority patent/EP0373723A1/en
Priority to JP1324913A priority patent/JPH02218136A/ja
Application granted granted Critical
Publication of IT1230028B publication Critical patent/IT1230028B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66674DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/66712Vertical DMOS transistors, i.e. VDMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • H01L21/823828Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
IT8806627A 1988-12-16 1988-12-16 Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti IT1230028B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT8806627A IT1230028B (it) 1988-12-16 1988-12-16 Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti
EP89203161A EP0373723A1 (en) 1988-12-16 1989-12-12 Method for manufacturing a MOS semiconductor device making use of a "gettering" treatment with improved characteristics, and MOS semiconductor devices obtained thereby
JP1324913A JPH02218136A (ja) 1988-12-16 1989-12-16 Mos半導体デバイス製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8806627A IT1230028B (it) 1988-12-16 1988-12-16 Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti

Publications (2)

Publication Number Publication Date
IT8806627A0 true IT8806627A0 (it) 1988-12-16
IT1230028B IT1230028B (it) 1991-09-24

Family

ID=11121592

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8806627A IT1230028B (it) 1988-12-16 1988-12-16 Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti

Country Status (3)

Country Link
EP (1) EP0373723A1 (it)
JP (1) JPH02218136A (it)
IT (1) IT1230028B (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897163A (ja) 1994-07-28 1996-04-12 Hitachi Ltd 半導体ウエハの製造方法、半導体ウエハ、半導体集積回路装置の製造方法および半導体集積回路装置
JP3498431B2 (ja) * 1995-07-04 2004-02-16 株式会社デンソー 半導体装置の製造方法
JPH09120965A (ja) * 1995-10-25 1997-05-06 Toshiba Corp 半導体装置の製造方法
GB2368464B (en) * 1999-02-02 2002-10-16 Nec Corp Semiconductor device and fabrication process therefor
US6309929B1 (en) * 2000-09-22 2001-10-30 Industrial Technology Research Institute And Genetal Semiconductor Of Taiwan, Ltd. Method of forming trench MOS device and termination structure
WO2007007480A1 (ja) * 2005-07-14 2007-01-18 Autoliv Development Ab シートベルト装置
CN101385130B (zh) * 2006-02-24 2010-12-22 三菱电机株式会社 半导体装置及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0018737B1 (en) * 1979-04-11 1983-11-09 Mitsui Petrochemical Industries, Ltd. Process for producing spherical carrier particles for olefin polymerisation catalyst, catalyst comprising such carrier particles, and use of such catalyst in olefin polymerisation
AT380974B (de) * 1982-04-06 1986-08-11 Shell Austria Verfahren zum gettern von halbleiterbauelementen
KR870000315B1 (ko) * 1983-02-14 1987-02-26 몬산토 캄파니 반도체 기판재료 및 전자디바이스의 제조방법
JPS61159741A (ja) * 1984-12-31 1986-07-19 Sony Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
IT1230028B (it) 1991-09-24
EP0373723A1 (en) 1990-06-20
JPH02218136A (ja) 1990-08-30

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