IT8125474A0 - Procedimento per la fabbricazione di un dispositivo a circuito integrato. - Google Patents

Procedimento per la fabbricazione di un dispositivo a circuito integrato.

Info

Publication number
IT8125474A0
IT8125474A0 IT8125474A IT2547481A IT8125474A0 IT 8125474 A0 IT8125474 A0 IT 8125474A0 IT 8125474 A IT8125474 A IT 8125474A IT 2547481 A IT2547481 A IT 2547481A IT 8125474 A0 IT8125474 A0 IT 8125474A0
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
integrated circuit
circuit device
integrated
Prior art date
Application number
IT8125474A
Other languages
English (en)
Other versions
IT1139928B (it
Inventor
Eliezer Kinsbron
Frederick Vratny
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IT8125474A0 publication Critical patent/IT8125474A0/it
Application granted granted Critical
Publication of IT1139928B publication Critical patent/IT1139928B/it

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
IT25474/81A 1980-12-08 1981-12-04 Procedimento per la fabbricazione di un dispositivo a circuito integrato IT1139928B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/214,171 US4346125A (en) 1980-12-08 1980-12-08 Removing hardened organic materials during fabrication of integrated circuits using anhydrous hydrazine solvent

Publications (2)

Publication Number Publication Date
IT8125474A0 true IT8125474A0 (it) 1981-12-04
IT1139928B IT1139928B (it) 1986-09-24

Family

ID=22798048

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25474/81A IT1139928B (it) 1980-12-08 1981-12-04 Procedimento per la fabbricazione di un dispositivo a circuito integrato

Country Status (9)

Country Link
US (1) US4346125A (it)
EP (1) EP0065977A4 (it)
JP (1) JPS57501906A (it)
BE (1) BE891335A (it)
CA (1) CA1159577A (it)
GB (1) GB2089125B (it)
IE (1) IE52978B1 (it)
IT (1) IT1139928B (it)
WO (1) WO1982002116A1 (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514893A (en) * 1983-04-29 1985-05-07 At&T Bell Laboratories Fabrication of FETs
US4606931A (en) * 1983-06-27 1986-08-19 International Business Machines Corporation Lift-off masking method
US4639290A (en) * 1985-12-09 1987-01-27 Hughes Aircraft Company Methods for selectively removing adhesives from polyimide substrates
EP0540261B1 (en) * 1991-10-31 1997-05-28 STMicroelectronics, Inc. Process of removing polymers in semiconductor vias
US6326130B1 (en) 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
US5597983A (en) * 1994-02-03 1997-01-28 Sgs-Thomson Microelectronics, Inc. Process of removing polymers in semiconductor vias
US5472539A (en) * 1994-06-06 1995-12-05 General Electric Company Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components
US6103680A (en) * 1998-12-31 2000-08-15 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition and method for removing photoresist and/or plasma etching residues
KR101963926B1 (ko) * 2011-09-30 2019-03-29 다우 글로벌 테크놀로지스 엘엘씨 폴리염화비닐과 바이오-기반 가소제의 혼합 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE627626A (it) * 1962-01-26 1900-01-01
FR2072172A5 (it) * 1969-12-23 1971-09-24 Ibm
US3873361A (en) * 1973-11-29 1975-03-25 Ibm Method of depositing thin film utilizing a lift-off mask
US4218283A (en) * 1974-08-23 1980-08-19 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same

Also Published As

Publication number Publication date
IT1139928B (it) 1986-09-24
CA1159577A (en) 1983-12-27
IE812868L (en) 1982-06-08
EP0065977A1 (en) 1982-12-08
GB2089125A (en) 1982-06-16
GB2089125B (en) 1984-11-28
BE891335A (fr) 1982-03-31
JPS57501906A (it) 1982-10-21
US4346125A (en) 1982-08-24
EP0065977A4 (en) 1986-02-13
IE52978B1 (en) 1988-04-27
WO1982002116A1 (en) 1982-06-24

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961223