IT8125264A0 - Struttura di capsula per unapiastrina a circuito integrato a semiconduttori. - Google Patents
Struttura di capsula per unapiastrina a circuito integrato a semiconduttori.Info
- Publication number
- IT8125264A0 IT8125264A0 IT8125264A IT2526481A IT8125264A0 IT 8125264 A0 IT8125264 A0 IT 8125264A0 IT 8125264 A IT8125264 A IT 8125264A IT 2526481 A IT2526481 A IT 2526481A IT 8125264 A0 IT8125264 A0 IT 8125264A0
- Authority
- IT
- Italy
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit die
- capsule structure
- capsule
- Prior art date
Links
- 239000002775 capsule Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/210,776 US4331831A (en) | 1980-11-28 | 1980-11-28 | Package for semiconductor integrated circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8125264A0 true IT8125264A0 (it) | 1981-11-24 |
IT1139839B IT1139839B (it) | 1986-09-24 |
Family
ID=22784223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT25264/81A IT1139839B (it) | 1980-11-28 | 1981-11-24 | Struttura di capsula per una piastrina a circuito integrato a semiconduttori |
Country Status (11)
Country | Link |
---|---|
US (1) | US4331831A (it) |
JP (1) | JPS57117264A (it) |
BE (1) | BE891258A (it) |
CA (1) | CA1168764A (it) |
DE (1) | DE3146796A1 (it) |
FR (1) | FR2495377A1 (it) |
GB (1) | GB2088635B (it) |
HK (1) | HK6886A (it) |
IT (1) | IT1139839B (it) |
NL (1) | NL8105387A (it) |
SE (1) | SE8106859L (it) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4616412A (en) * | 1981-01-13 | 1986-10-14 | Schroeder Jon M | Method for bonding electrical leads to electronic devices |
US4399610A (en) * | 1981-04-01 | 1983-08-23 | Western Electric Company, Inc. | Assembling an electronic device |
US4466183A (en) * | 1982-05-03 | 1984-08-21 | National Semiconductor Corporation | Integrated circuit packaging process |
US4750031A (en) * | 1982-06-25 | 1988-06-07 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Hermetically sealable package for hybrid solid-state electronic devices and the like |
US4563811A (en) * | 1983-10-28 | 1986-01-14 | At&T Technologies, Inc. | Method of making a dual-in-line package |
US4751199A (en) * | 1983-12-06 | 1988-06-14 | Fairchild Semiconductor Corporation | Process of forming a compliant lead frame for array-type semiconductor packages |
US4754912A (en) * | 1984-04-05 | 1988-07-05 | National Semiconductor Corporation | Controlled collapse thermocompression gang bonding |
EP0163856B1 (en) * | 1984-05-02 | 1989-08-23 | GTE Products Corporation | Method of making lead frame support for ic chip |
IT1213259B (it) * | 1984-12-18 | 1989-12-14 | Sgs Thomson Microelectronics | Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento. |
CA1238119A (en) * | 1985-04-18 | 1988-06-14 | Douglas W. Phelps, Jr. | Packaged semiconductor chip |
US4747017A (en) * | 1986-05-27 | 1988-05-24 | General Motors Corporation | Surface mountable integrated circuit package equipped with sockets |
US4740868A (en) * | 1986-08-22 | 1988-04-26 | Motorola Inc. | Rail bonded multi-chip leadframe, method and package |
US4747483A (en) * | 1986-10-08 | 1988-05-31 | Amp Incorporated | Protective chip carrier handler |
JPH07120743B2 (ja) * | 1988-07-07 | 1995-12-20 | 株式会社三井ハイテック | 半導体装置用リードフレーム |
US5084753A (en) * | 1989-01-23 | 1992-01-28 | Analog Devices, Inc. | Packaging for multiple chips on a single leadframe |
US5021864A (en) * | 1989-09-05 | 1991-06-04 | Micron Technology, Inc. | Die-mounting paddle for mechanical stress reduction in plastic IC packages |
JP2816244B2 (ja) * | 1990-07-11 | 1998-10-27 | 株式会社日立製作所 | 積層型マルチチップ半導体装置およびこれに用いる半導体装置 |
JP2744685B2 (ja) * | 1990-08-08 | 1998-04-28 | 三菱電機株式会社 | 半導体装置 |
JP2745933B2 (ja) * | 1992-02-17 | 1998-04-28 | 日本電気株式会社 | Tab−集積回路 |
US5210939A (en) * | 1992-04-17 | 1993-05-18 | Intel Corporation | Lead grid array integrated circuit |
US5396032A (en) * | 1993-05-04 | 1995-03-07 | Alcatel Network Systems, Inc. | Method and apparatus for providing electrical access to devices in a multi-chip module |
US5821457A (en) * | 1994-03-11 | 1998-10-13 | The Panda Project | Semiconductor die carrier having a dielectric epoxy between adjacent leads |
US5824950A (en) * | 1994-03-11 | 1998-10-20 | The Panda Project | Low profile semiconductor die carrier |
US6339191B1 (en) * | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
DE19530577B4 (de) * | 1995-08-19 | 2005-03-10 | Conti Temic Microelectronic | Gehäuse für mikroelektronische Bauelemente und Verfahren zu seiner Herstellung |
US5585670A (en) * | 1995-09-05 | 1996-12-17 | Mitsubishi Electric Semiconductor Software Co. | Semiconductor device package |
JPH11145364A (ja) * | 1997-11-12 | 1999-05-28 | Denso Corp | 樹脂封止型半導体装置及びその製造方法 |
US6141869A (en) * | 1998-10-26 | 2000-11-07 | Silicon Bandwidth, Inc. | Apparatus for and method of manufacturing a semiconductor die carrier |
US6307258B1 (en) | 1998-12-22 | 2001-10-23 | Silicon Bandwidth, Inc. | Open-cavity semiconductor die package |
US6437464B1 (en) | 1999-07-29 | 2002-08-20 | Encap Motor Corporation | Motor and disc assembly for computer hard drive |
US6501616B1 (en) | 1999-07-29 | 2002-12-31 | Encap Motor Corporation | Hard disc drive with base incorporating a spindle motor stator |
US6362554B1 (en) | 1999-07-29 | 2002-03-26 | Encap Motor Corporation | Stator assembly |
US6617721B1 (en) | 1999-07-29 | 2003-09-09 | Encap Motor Corporation | High speed spindle motor |
US6753628B1 (en) | 1999-07-29 | 2004-06-22 | Encap Motor Corporation | High speed spindle motor for disc drive |
US6300695B1 (en) | 1999-07-29 | 2001-10-09 | Encap Motor Corporation | High speed spindle motor with hydrodynamic bearings |
AU2580301A (en) | 1999-12-17 | 2001-06-25 | Encap Motor Corporation | Spindle motor with encapsulated stator and method of making same |
US6892439B1 (en) | 2001-02-01 | 2005-05-17 | Encap Motor Corporation | Motor with stator made from linear core preform |
US7036207B2 (en) | 2001-03-02 | 2006-05-02 | Encap Motor Corporation | Stator assembly made from a plurality of toroidal core segments and motor using same |
DE10139001A1 (de) * | 2001-08-15 | 2003-03-13 | Siemens Ag | Zeigerinstrument |
FR3020186A1 (fr) * | 2014-08-08 | 2015-10-23 | Commissariat Energie Atomique | Connecteur pour la connexion entre un composant et un support, comportant une embase munie d'un relief |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2328798A1 (de) * | 1972-06-23 | 1974-01-17 | Philips Nv | Halbleiteranordnung |
US3872583A (en) * | 1972-07-10 | 1975-03-25 | Amdahl Corp | LSI chip package and method |
DE2253295A1 (de) * | 1972-10-31 | 1974-05-16 | Licentia Gmbh | Halbleiteranordnung |
US3859718A (en) * | 1973-01-02 | 1975-01-14 | Texas Instruments Inc | Method and apparatus for the assembly of semiconductor devices |
US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
US3968563A (en) * | 1975-03-27 | 1976-07-13 | E. I. Du Pont De Nemours And Company | Precision registration system for leads |
US4132856A (en) * | 1977-11-28 | 1979-01-02 | Burroughs Corporation | Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby |
US4210926A (en) * | 1977-12-07 | 1980-07-01 | Siemens Aktiengesellschaft | Intermediate member for mounting and contacting a semiconductor body |
US4214120A (en) * | 1978-10-27 | 1980-07-22 | Western Electric Company, Inc. | Electronic device package having solder leads and methods of assembling the package |
JPS55103753A (en) * | 1979-02-05 | 1980-08-08 | Hitachi Ltd | Electronic component |
FR2456390A1 (fr) * | 1979-05-11 | 1980-12-05 | Thomson Csf | Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier |
DE2931339A1 (de) * | 1979-08-02 | 1981-02-19 | Barth | Sicherheitsgurt-ergaenzung in kraftfahrzeugen |
JPS5694762A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Plug-in type package |
-
1980
- 1980-11-28 US US06/210,776 patent/US4331831A/en not_active Expired - Lifetime
-
1981
- 1981-11-12 CA CA000389899A patent/CA1168764A/en not_active Expired
- 1981-11-18 SE SE8106859A patent/SE8106859L/ not_active Application Discontinuation
- 1981-11-23 FR FR8121866A patent/FR2495377A1/fr active Granted
- 1981-11-24 IT IT25264/81A patent/IT1139839B/it active
- 1981-11-26 BE BE0/206661A patent/BE891258A/fr unknown
- 1981-11-26 GB GB8135721A patent/GB2088635B/en not_active Expired
- 1981-11-26 DE DE19813146796 patent/DE3146796A1/de not_active Withdrawn
- 1981-11-27 NL NL8105387A patent/NL8105387A/nl not_active Application Discontinuation
- 1981-11-28 JP JP56189917A patent/JPS57117264A/ja active Pending
-
1986
- 1986-01-30 HK HK68/86A patent/HK6886A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB2088635B (en) | 1984-08-15 |
FR2495377B1 (it) | 1984-11-16 |
FR2495377A1 (fr) | 1982-06-04 |
US4331831A (en) | 1982-05-25 |
DE3146796A1 (de) | 1982-06-16 |
JPS57117264A (en) | 1982-07-21 |
HK6886A (en) | 1986-02-07 |
GB2088635A (en) | 1982-06-09 |
CA1168764A (en) | 1984-06-05 |
BE891258A (fr) | 1982-03-16 |
IT1139839B (it) | 1986-09-24 |
SE8106859L (sv) | 1982-05-29 |
NL8105387A (nl) | 1982-06-16 |
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