IT8020023A0 - COMPOSITE PASSIVATION MATERIAL FOR A SEMICONDUCTOR DEVICE INCLUDING A LAYER OF SILICON NITRIDE (SI THIRD N FOURTH) AND A LAYER OF PHOSPHOSILICATE GLASS (PSG) AND METHOD OF MANUFACTURE THEREOF. - Google Patents
COMPOSITE PASSIVATION MATERIAL FOR A SEMICONDUCTOR DEVICE INCLUDING A LAYER OF SILICON NITRIDE (SI THIRD N FOURTH) AND A LAYER OF PHOSPHOSILICATE GLASS (PSG) AND METHOD OF MANUFACTURE THEREOF.Info
- Publication number
- IT8020023A0 IT8020023A0 IT8020023A IT2002380A IT8020023A0 IT 8020023 A0 IT8020023 A0 IT 8020023A0 IT 8020023 A IT8020023 A IT 8020023A IT 2002380 A IT2002380 A IT 2002380A IT 8020023 A0 IT8020023 A0 IT 8020023A0
- Authority
- IT
- Italy
- Prior art keywords
- layer
- psg
- manufacture
- semiconductor device
- silicon nitride
- Prior art date
Links
- 239000005360 phosphosilicate glass Substances 0.000 title 2
- 229910052581 Si3N4 Inorganic materials 0.000 title 1
- 239000002131 composite material Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000002161 passivation Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02129—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76819—Smoothing of the dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1710079A | 1979-03-05 | 1979-03-05 |
Publications (3)
Publication Number | Publication Date |
---|---|
IT8020023A0 true IT8020023A0 (en) | 1980-02-19 |
IT8020023A1 IT8020023A1 (en) | 1981-08-19 |
IT1140645B IT1140645B (en) | 1986-10-01 |
Family
ID=21780714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20023/80A IT1140645B (en) | 1979-03-05 | 1980-02-19 | PASSIVATION COMPOSITE MATERIAL FOR A SEMICONDUCTIVE DEVICE INCLUDING A LAYER OF SILICON NITRIDE (YES TO THIRD IN FOURTH) AND A LAYER OF PHOSPHOSILICATE (PSG) GLASS AND MANUFACTURING METHOD |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS55121669A (en) |
DE (1) | DE3007500A1 (en) |
FR (1) | FR2451103A1 (en) |
GB (1) | GB2044533B (en) |
IT (1) | IT1140645B (en) |
NL (1) | NL8001310A (en) |
YU (1) | YU61180A (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4542037A (en) * | 1980-04-28 | 1985-09-17 | Fairchild Camera And Instrument Corporation | Laser induced flow of glass bonded materials |
CA1174285A (en) * | 1980-04-28 | 1984-09-11 | Michelangelo Delfino | Laser induced flow of integrated circuit structure materials |
JPS581878A (en) * | 1981-06-26 | 1983-01-07 | Fujitsu Ltd | Production of bubble memory device |
DE3130666A1 (en) * | 1981-08-03 | 1983-02-17 | Siemens AG, 1000 Berlin und 8000 München | Method for fabricating integrated MOS field effect transistors having a phosphosilicate glass layer as an intermediary oxide layer |
DE3131050A1 (en) * | 1981-08-05 | 1983-02-24 | Siemens AG, 1000 Berlin und 8000 München | Process for fabricating integrated MOS field effect transistors, employing a surface layer consisting of phosphosilicate glass on the intermediary oxide between polysilicon plane and metal conductor track plane |
DE3133516A1 (en) * | 1981-08-25 | 1983-03-17 | Siemens AG, 1000 Berlin und 8000 München | Process for rounding the intermediary oxide between the polysilicon plane and metal conductor track plane when fabricating integrated n-type channel MOS field-effect transistors |
JPS5898934A (en) * | 1981-12-08 | 1983-06-13 | Matsushita Electronics Corp | Manufacture of semiconductor device |
US4686000A (en) * | 1985-04-02 | 1987-08-11 | Heath Barbara A | Self-aligned contact process |
JPH088246A (en) * | 1994-06-21 | 1996-01-12 | Nippon Motorola Ltd | Method for forming metal wiring of semiconductor device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3627598A (en) * | 1970-02-05 | 1971-12-14 | Fairchild Camera Instr Co | Nitride passivation of mesa transistors by phosphovapox lifting |
US3917495A (en) * | 1970-06-01 | 1975-11-04 | Gen Electric | Method of making improved planar devices including oxide-nitride composite layer |
US3943621A (en) * | 1974-03-25 | 1976-03-16 | General Electric Company | Semiconductor device and method of manufacture therefor |
US4005240A (en) * | 1975-03-10 | 1977-01-25 | Aeronutronic Ford Corporation | Germanium device passivation |
US4273805A (en) * | 1978-06-19 | 1981-06-16 | Rca Corporation | Passivating composite for a semiconductor device comprising a silicon nitride (Si1 3N4) layer and phosphosilicate glass (PSG) layer |
-
1980
- 1980-02-19 IT IT20023/80A patent/IT1140645B/en active
- 1980-02-28 DE DE19803007500 patent/DE3007500A1/en not_active Withdrawn
- 1980-02-29 GB GB8007004A patent/GB2044533B/en not_active Expired
- 1980-03-04 NL NL8001310A patent/NL8001310A/en not_active Application Discontinuation
- 1980-03-04 JP JP2787680A patent/JPS55121669A/en active Pending
- 1980-03-04 FR FR8004843A patent/FR2451103A1/en not_active Withdrawn
- 1980-03-05 YU YU00611/80A patent/YU61180A/en unknown
Also Published As
Publication number | Publication date |
---|---|
NL8001310A (en) | 1980-09-09 |
GB2044533B (en) | 1983-12-14 |
JPS55121669A (en) | 1980-09-18 |
DE3007500A1 (en) | 1980-09-18 |
YU61180A (en) | 1983-02-28 |
IT8020023A1 (en) | 1981-08-19 |
IT1140645B (en) | 1986-10-01 |
GB2044533A (en) | 1980-10-15 |
FR2451103A1 (en) | 1980-10-03 |
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