IT7926067A0 - Unita' integrata comprendente un dispositivo optoelettronico a semiconduttore. - Google Patents
Unita' integrata comprendente un dispositivo optoelettronico a semiconduttore.Info
- Publication number
- IT7926067A0 IT7926067A0 IT7926067A IT2606779A IT7926067A0 IT 7926067 A0 IT7926067 A0 IT 7926067A0 IT 7926067 A IT7926067 A IT 7926067A IT 2606779 A IT2606779 A IT 2606779A IT 7926067 A0 IT7926067 A0 IT 7926067A0
- Authority
- IT
- Italy
- Prior art keywords
- unit including
- optoelectronic device
- integrated unit
- semiconductor optoelectronic
- semiconductor
- Prior art date
Links
- 230000005693 optoelectronics Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/946,592 US4240098A (en) | 1978-09-28 | 1978-09-28 | Semiconductor optoelectronic device package |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7926067A0 true IT7926067A0 (it) | 1979-09-27 |
IT1123356B IT1123356B (it) | 1986-04-30 |
Family
ID=25484703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT26067/79A IT1123356B (it) | 1978-09-28 | 1979-09-27 | Unita'integrata comprendente un dispositivo optoelettronico a semiconduttore |
Country Status (11)
Country | Link |
---|---|
US (1) | US4240098A (it) |
JP (1) | JPS5546599A (it) |
BE (1) | BE879033A (it) |
CA (1) | CA1142252A (it) |
DE (1) | DE2939497A1 (it) |
FR (1) | FR2437696A1 (it) |
GB (1) | GB2032688B (it) |
IL (1) | IL58313A0 (it) |
IT (1) | IT1123356B (it) |
NL (1) | NL7907254A (it) |
SE (1) | SE7908022L (it) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4544989A (en) * | 1980-06-30 | 1985-10-01 | Sharp Kabushiki Kaisha | Thin assembly for wiring substrate |
JPS5717167U (it) * | 1980-07-03 | 1982-01-28 | ||
JPS5759468U (it) * | 1980-09-27 | 1982-04-08 | ||
JPS5821193A (ja) * | 1981-07-31 | 1983-02-07 | 三菱原子力工業株式会社 | 原子燃料集合体 |
JPS58145169A (ja) * | 1982-02-23 | 1983-08-29 | Nec Corp | 光半導体装置 |
JPS58168289A (ja) * | 1982-03-30 | 1983-10-04 | Mitsubishi Electric Corp | レ−ザダイオ−ドパツケ−ジ |
US4490694A (en) * | 1982-07-28 | 1984-12-25 | Eaton Corporation | Microwave switch wherein PIN diode is mounted orthogonal to microstrip substrate |
US4726507A (en) * | 1984-08-29 | 1988-02-23 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
US4820659A (en) * | 1986-07-16 | 1989-04-11 | General Electric Company | Method of making a semiconductor device assembly |
US4797728A (en) * | 1986-07-16 | 1989-01-10 | General Electric Company | Semiconductor device assembly and method of making same |
US5252856A (en) * | 1990-09-26 | 1993-10-12 | Nec Corporation | Optical semiconductor device |
EP0533110B1 (en) * | 1991-09-19 | 1995-03-15 | Eastman Kodak Company | Laser diode with card-edge connector |
US5347247A (en) * | 1993-06-02 | 1994-09-13 | The United States Of America As Represented By The United States Department Of Energy | Electro-optic component mounting device |
US6375365B1 (en) * | 2000-02-28 | 2002-04-23 | Onix Microsystems, Inc. | Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs |
US20030058650A1 (en) * | 2001-09-25 | 2003-03-27 | Kelvin Shih | Light emitting diode with integrated heat dissipater |
US20040240188A1 (en) * | 2003-05-28 | 2004-12-02 | Cromwell Stephen Daniel | Protective coating for attach hardware for circuits |
CN101997066A (zh) * | 2009-08-26 | 2011-03-30 | 李东明 | 大功率led封装结构 |
DE102019202902A1 (de) * | 2019-03-04 | 2020-09-10 | Abb Schweiz Ag | Direkte Kühlung eines Stromrichters durch Verwendung einer geprägten Platte |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3577181A (en) * | 1969-02-13 | 1971-05-04 | Rca Corp | Transistor package for microwave stripline circuits |
GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
US3857115A (en) * | 1972-05-30 | 1974-12-24 | Marconi Co Ltd | Semiconductor device mounting arrangements |
US3946416A (en) * | 1973-04-24 | 1976-03-23 | The United States Of America As Represented By The Secretary Of The Army | Low impedance diode mounting structure and housing |
US3946428A (en) * | 1973-09-19 | 1976-03-23 | Nippon Electric Company, Limited | Encapsulation package for a semiconductor element |
US3913040A (en) * | 1974-05-03 | 1975-10-14 | Rca Corp | Microstrip carrier for high frequency semiconductor devices |
US3908188A (en) * | 1974-08-14 | 1975-09-23 | Us Air Force | Heat sink for microstrip circuit |
GB1487010A (en) * | 1975-04-01 | 1977-09-28 | Standard Telephones Cables Ltd | Laser stud mounts |
US4150393A (en) * | 1975-09-29 | 1979-04-17 | Motorola, Inc. | High frequency semiconductor package |
GB1544241A (en) * | 1976-05-11 | 1979-04-19 | Standard Telephones Cables Ltd | Injection laser mount |
-
1978
- 1978-09-28 US US05/946,592 patent/US4240098A/en not_active Expired - Lifetime
-
1979
- 1979-08-29 CA CA000334664A patent/CA1142252A/en not_active Expired
- 1979-09-25 IL IL58313A patent/IL58313A0/xx unknown
- 1979-09-27 SE SE7908022A patent/SE7908022L/xx not_active Application Discontinuation
- 1979-09-27 IT IT26067/79A patent/IT1123356B/it active
- 1979-09-27 BE BE0/197345A patent/BE879033A/fr unknown
- 1979-09-27 FR FR7924090A patent/FR2437696A1/fr active Pending
- 1979-09-28 NL NL7907254A patent/NL7907254A/nl not_active Application Discontinuation
- 1979-09-28 GB GB7933821A patent/GB2032688B/en not_active Expired
- 1979-09-28 DE DE19792939497 patent/DE2939497A1/de not_active Withdrawn
- 1979-09-28 JP JP12525279A patent/JPS5546599A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US4240098A (en) | 1980-12-16 |
JPS5546599A (en) | 1980-04-01 |
IL58313A0 (en) | 1979-12-30 |
DE2939497A1 (de) | 1980-04-10 |
NL7907254A (nl) | 1980-04-01 |
BE879033A (fr) | 1980-03-27 |
SE7908022L (sv) | 1980-03-29 |
CA1142252A (en) | 1983-03-01 |
GB2032688B (en) | 1983-07-27 |
FR2437696A1 (fr) | 1980-04-25 |
IT1123356B (it) | 1986-04-30 |
GB2032688A (en) | 1980-05-08 |
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