IT1398280B1 - Dispositivo micromeccanico con caverne con pressione interna dell'atmosfera differente - Google Patents
Dispositivo micromeccanico con caverne con pressione interna dell'atmosfera differenteInfo
- Publication number
- IT1398280B1 IT1398280B1 ITMI2009A001373A ITMI20091373A IT1398280B1 IT 1398280 B1 IT1398280 B1 IT 1398280B1 IT MI2009A001373 A ITMI2009A001373 A IT MI2009A001373A IT MI20091373 A ITMI20091373 A IT MI20091373A IT 1398280 B1 IT1398280 B1 IT 1398280B1
- Authority
- IT
- Italy
- Prior art keywords
- caverns
- micro
- internal pressure
- mechanical device
- different atmosphere
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0136—Growing or depositing of a covering layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0145—Hermetically sealing an opening in the lid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24744—Longitudinal or transverse tubular cavity or cell
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008040970A DE102008040970A1 (de) | 2008-08-04 | 2008-08-04 | Mikromechanische Vorrichtung mit Kavernen mit unterschiedlichem atmosphärischen Innendruck |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20091373A1 ITMI20091373A1 (it) | 2010-02-05 |
IT1398280B1 true IT1398280B1 (it) | 2013-02-22 |
Family
ID=41501357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2009A001373A IT1398280B1 (it) | 2008-08-04 | 2009-07-30 | Dispositivo micromeccanico con caverne con pressione interna dell'atmosfera differente |
Country Status (4)
Country | Link |
---|---|
US (1) | US8035209B2 (it) |
CN (1) | CN101643193B (it) |
DE (1) | DE102008040970A1 (it) |
IT (1) | IT1398280B1 (it) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009002068A1 (de) * | 2009-04-01 | 2010-10-07 | Robert Bosch Gmbh | Dämpfungsvorrichtung |
US7997143B2 (en) | 2009-04-09 | 2011-08-16 | Kulite Semiconductor Products, Inc. | Internally switched multiple range transducer |
DE102009029180B4 (de) * | 2009-09-03 | 2017-07-20 | Robert Bosch Gmbh | Mikrosystem |
JP5298047B2 (ja) * | 2010-02-26 | 2013-09-25 | 日立オートモティブシステムズ株式会社 | 複合センサの製造方法 |
CN102320549B (zh) * | 2011-07-28 | 2014-05-28 | 北京大学 | 一种提高薄膜应变线性度的方法 |
DE102011081033B4 (de) * | 2011-08-16 | 2022-02-17 | Robert Bosch Gmbh | Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur |
DE102011085723A1 (de) * | 2011-11-03 | 2013-05-08 | Continental Teves Ag & Co. Ohg | Bauelement und Verfahren zur Herstellung eines Bauelements |
DE102011085727A1 (de) * | 2011-11-03 | 2013-05-08 | Continental Teves Ag & Co. Ohg | Mikromechanisches Element, Bauelement mit einem mikromechanischen Element und Verfahren zum Herstellen eines Bauelements |
SE537584C2 (sv) * | 2011-12-15 | 2015-06-30 | Silex Microsystems Ab | Tunnfilmskapsling |
JP2013232626A (ja) * | 2012-04-04 | 2013-11-14 | Seiko Epson Corp | 電子デバイス及びその製造方法、電子機器、並びに移動体 |
DE102012209973B4 (de) * | 2012-06-14 | 2024-03-07 | Robert Bosch Gmbh | Mikromechanische Vorrichtung und Verfahren zur Herstellung einer mikromechanischen Vorrichtung |
US8952465B2 (en) * | 2012-07-13 | 2015-02-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS devices, packaged MEMS devices, and methods of manufacture thereof |
DE102013014881B4 (de) * | 2012-09-12 | 2023-05-04 | Fairchild Semiconductor Corporation | Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien |
DE102012219605B4 (de) * | 2012-10-26 | 2021-09-23 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
US9174838B2 (en) * | 2012-12-10 | 2015-11-03 | MCube Inc. | Distributed MEMS devices time synchronization methods and system |
US8916943B2 (en) * | 2013-03-01 | 2014-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS devices having a plurality of cavities |
DE102013208814A1 (de) * | 2013-05-14 | 2014-11-20 | Robert Bosch Gmbh | Integrierter Drehraten- und Beschleunigungssensor und Verfahren zur Herstellung eines integrierten Drehraten- und Beschleunigungssensor |
ITTO20130651A1 (it) | 2013-07-31 | 2015-02-01 | St Microelectronics Srl | Procedimento di fabbricazione di un dispositivo incapsulato, in particolare un sensore micro-elettro-meccanico incapsulato, dotato di una struttura accessibile, quale un microfono mems e dispositivo incapsulato cosi' ottenuto |
US9090454B2 (en) | 2013-08-27 | 2015-07-28 | Freescale Semiconductor, Inc. | Sequential wafer bonding |
CN103434998B (zh) * | 2013-08-29 | 2016-04-20 | 上海华虹宏力半导体制造有限公司 | 晶圆级气密性的测试结构及测试方法 |
US9481564B2 (en) | 2013-08-29 | 2016-11-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of sealing and shielding for dual pressure MEMs devices |
US9102512B2 (en) | 2013-10-04 | 2015-08-11 | Analog Devices, Inc. | Sealed MEMS devices with multiple chamber pressures |
US9676611B2 (en) | 2013-10-18 | 2017-06-13 | Nxp Usa, Inc. | Sensor device packages and related fabrication methods |
DE102013222517A1 (de) * | 2013-11-06 | 2015-05-07 | Robert Bosch Gmbh | Mikromechanische Sensoreinheit und Verfahren zur Herstellung von mikromechanischen Sensoreinheiten |
US20150143926A1 (en) | 2013-11-23 | 2015-05-28 | Silicon Microstructures, Inc. | Area-efficient pressure sensing device |
US9908773B2 (en) * | 2013-12-06 | 2018-03-06 | Commissariat à l'énergie atomique et aux énergies alternatives | Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole |
US9018029B1 (en) | 2013-12-06 | 2015-04-28 | Freescale Semiconductor, Inc. | Vent hole sealing in multiple die sensor device |
US9352956B2 (en) | 2014-01-16 | 2016-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS devices and methods for forming same |
CN104803343B (zh) * | 2014-01-28 | 2016-09-14 | 立锜科技股份有限公司 | 复合微机电***芯片及其制作方法 |
DE102014202801B4 (de) * | 2014-02-17 | 2023-08-24 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Bauelements |
CN103818868B (zh) * | 2014-02-22 | 2015-10-28 | 安徽北方芯动联科微***技术有限公司 | 双压力mems芯片圆片级封装方法及其双压力mems芯片 |
US9108841B1 (en) | 2014-03-05 | 2015-08-18 | Freescale Semiconductor, Inc. | Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof |
DE102014204666A1 (de) | 2014-03-13 | 2015-09-17 | Robert Bosch Gmbh | Vorrichtung zum Reduzieren eines (Partial-)Drucks zumindest einer chemischen Spezies in einer abgeschlossenen Kavität, Bauelement und Verfahren zum Herstellen des Bauelements |
JP6314568B2 (ja) * | 2014-03-18 | 2018-04-25 | セイコーエプソン株式会社 | Memsデバイス及びその製造方法 |
US9499397B2 (en) | 2014-03-31 | 2016-11-22 | Freescale Semiconductor, Inc. | Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof |
US10442685B2 (en) | 2014-03-31 | 2019-10-15 | Nxp Usa, Inc. | Microelectronic packages having hermetic cavities and methods for the production thereof |
FR3021645B1 (fr) | 2014-06-03 | 2019-06-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Structure d'encapsulation a plusieurs cavites munies de canaux d'acces de hauteurs differentes |
GB2529134B (en) * | 2014-06-10 | 2017-09-13 | Cirrus Logic Int Semiconductor Ltd | Packaging for MEMS transducers |
DE102014214525B4 (de) * | 2014-07-24 | 2019-11-14 | Robert Bosch Gmbh | Mikro-elektromechanisches Bauteil und Herstellungsverfahren für mikro-elektromechanische Bauteile |
US9891244B2 (en) | 2014-08-15 | 2018-02-13 | Nxp Usa, Inc. | Microelectronic packages having split gyroscope structures and methods for the fabrication thereof |
US9656857B2 (en) | 2014-11-07 | 2017-05-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Microelectromechanical systems (MEMS) devices at different pressures |
TWI610406B (zh) * | 2015-02-09 | 2018-01-01 | 精材科技股份有限公司 | 晶片封裝體與其製備方法 |
US9567210B2 (en) | 2015-02-24 | 2017-02-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-pressure MEMS package |
TWI611569B (zh) * | 2015-09-29 | 2018-01-11 | 精材科技股份有限公司 | 電子裝置及其製造方法 |
DE102015220890A1 (de) * | 2015-10-26 | 2017-04-27 | Robert Bosch Gmbh | Strukturen und Prozess zur Vermeidung eines Überstandes der Laser-reseal-Struktur über die Waferoberfläche |
CN105424236B (zh) * | 2015-11-19 | 2017-08-25 | 南京信息工程大学 | 一种多量程阵列式压力传感芯片及其检测方法 |
DE102015224520A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Laserverschluss mit spezieller Membranstruktur |
DE102015224545A1 (de) | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanisches Bauelements |
DE102016200497A1 (de) * | 2016-01-15 | 2017-07-20 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Bauelements |
US20170240418A1 (en) * | 2016-02-18 | 2017-08-24 | Knowles Electronics, Llc | Low-cost miniature mems vibration sensor |
DE102016221055A1 (de) * | 2016-10-26 | 2018-04-26 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Bauelements |
DE102017213351A1 (de) * | 2017-08-02 | 2019-02-07 | Robert Bosch Gmbh | Sensorvorrichtung und Herstellungsverfahren für eine Sensorvorrichtung mit zumindest einer chemischen oder elektrochemischen Detektiereinrichtung |
DE102017218635B4 (de) * | 2017-10-18 | 2021-03-18 | Infineon Technologies Ag | Verfahren zum Verschließen einer Zugangsöffnung zu einer Kavität und MEMS-Bauelement mit einem Verschlusselement |
US10961114B2 (en) * | 2019-05-30 | 2021-03-30 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method for the same |
CN112265956B (zh) * | 2020-09-25 | 2023-07-28 | 华东光电集成器件研究所 | 一种不同真空度封装的mems圆片级真空封装方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69925837T2 (de) * | 1999-10-29 | 2005-10-27 | Sensonor Asa | Mikromechanischer Sensor |
JP3435665B2 (ja) * | 2000-06-23 | 2003-08-11 | 株式会社村田製作所 | 複合センサ素子およびその製造方法 |
DE102004027501A1 (de) * | 2004-06-04 | 2005-12-22 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren |
DE102006016260A1 (de) * | 2006-04-06 | 2007-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanische Gehäusung mit mindestens zwei Kavitäten mit unterschiedlichem Innendruck und/oder unterschiedlicher Gaszusammensetzung sowie Verfahren zu deren Herstellung |
-
2008
- 2008-08-04 DE DE102008040970A patent/DE102008040970A1/de not_active Ceased
-
2009
- 2009-07-30 IT ITMI2009A001373A patent/IT1398280B1/it active
- 2009-08-04 US US12/535,243 patent/US8035209B2/en not_active Expired - Fee Related
- 2009-08-04 CN CN200910161124.7A patent/CN101643193B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ITMI20091373A1 (it) | 2010-02-05 |
US8035209B2 (en) | 2011-10-11 |
DE102008040970A1 (de) | 2010-02-11 |
US20100028618A1 (en) | 2010-02-04 |
CN101643193B (zh) | 2014-12-31 |
CN101643193A (zh) | 2010-02-10 |
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