IT1218088B - Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi - Google Patents
Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridiInfo
- Publication number
- IT1218088B IT1218088B IT20991/88A IT2099188A IT1218088B IT 1218088 B IT1218088 B IT 1218088B IT 20991/88 A IT20991/88 A IT 20991/88A IT 2099188 A IT2099188 A IT 2099188A IT 1218088 B IT1218088 B IT 1218088B
- Authority
- IT
- Italy
- Prior art keywords
- equipment
- electronic circuits
- ceramic tiles
- hybrid electronic
- automatic separation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/329—Plural breakers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/371—Movable breaking tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT20991/88A IT1218088B (it) | 1988-06-16 | 1988-06-16 | Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi |
US07/365,458 US5069195A (en) | 1988-06-16 | 1989-06-13 | Apparatus for automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits |
EP19890201533 EP0346997B1 (en) | 1988-06-16 | 1989-06-14 | Apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits |
DE89201533T DE68909316T2 (de) | 1988-06-16 | 1989-06-14 | Vorrichtung zum automatischen Trennen entlang vorherbestimmter Biegebruchlinien in keramischen Grundplättchen von elektronischen Hybridschaltungen. |
JP1150650A JPH0278504A (ja) | 1988-06-16 | 1989-06-15 | セラミック基板自動分離装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT20991/88A IT1218088B (it) | 1988-06-16 | 1988-06-16 | Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8820991A0 IT8820991A0 (it) | 1988-06-16 |
IT1218088B true IT1218088B (it) | 1990-04-12 |
Family
ID=11175072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20991/88A IT1218088B (it) | 1988-06-16 | 1988-06-16 | Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi |
Country Status (5)
Country | Link |
---|---|
US (1) | US5069195A (it) |
EP (1) | EP0346997B1 (it) |
JP (1) | JPH0278504A (it) |
DE (1) | DE68909316T2 (it) |
IT (1) | IT1218088B (it) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1953886A2 (en) | 2007-02-05 | 2008-08-06 | Bticino S.P.A. | Box for wall mounting electrical apparatuses |
CN112008900A (zh) * | 2020-08-31 | 2020-12-01 | 广东东唯新材料有限公司 | 陶瓷岩板热加工弯曲成型装置及其成型方法 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0716282Y2 (ja) * | 1988-08-10 | 1995-04-12 | 自動車電機工業株式会社 | 継電器 |
NL9100658A (nl) * | 1991-04-15 | 1992-11-02 | Europ Patentverwertung | Opstelling van scheidingsinrichtingen. |
EP0547399B1 (en) * | 1991-12-06 | 1996-01-31 | James W. Loomis | Frangible semiconductor wafer dicing method which employs scribing and breaking |
JPH0553900U (ja) * | 1991-12-24 | 1993-07-20 | 富士通テン株式会社 | 基板分割機 |
US5927582A (en) * | 1997-08-05 | 1999-07-27 | Duecker; Peter | Separator for stacked corrugated board |
JP3326384B2 (ja) * | 1998-03-12 | 2002-09-24 | 古河電気工業株式会社 | 半導体ウエハーの劈開方法およびその装置 |
IL124199A (en) * | 1998-04-23 | 2001-03-19 | Sela Semiconductor Enginering | Apparatus for cleaving crystals |
US6267282B1 (en) * | 1999-04-01 | 2001-07-31 | Agere Systems Optoelectronics Guardian Corp. | Method and apparatus for handling laser bars |
US6655566B1 (en) | 2002-08-28 | 2003-12-02 | Martin Family Trust | Bundle breaker improvement |
TW565688B (en) * | 2002-09-25 | 2003-12-11 | Au Optronics Corp | Equal-arm linear glass breaker device |
DE10311693B3 (de) * | 2003-03-17 | 2004-12-02 | Baumann Gmbh | Brechvorrichtung für das Vereinzelnen von Keramikleiterplatten |
DE10314179A1 (de) * | 2003-03-17 | 2004-10-07 | Baumann Gmbh | Brechvorrichtung für das Vereinzeln von Keramikleiterplatten |
WO2004082911A1 (de) * | 2003-03-17 | 2004-09-30 | Baumann Gmbh | Brechvorrichtung für das vereinzeln von keramikleiterplatten |
DE102004022430A1 (de) * | 2004-05-06 | 2005-12-01 | Siemens Ag | Verfahren zum maschinellen Vereinzeln von Schaltungsträgern aus einem Leiterplattennutzen |
DE102004040671B4 (de) * | 2004-08-20 | 2006-05-11 | Sieghard Schiller Gmbh & Co. Kg | Verfahren und Vorrichtung zum Brechen eines dünnen, plattenförmigen Gegenstands |
US7262115B2 (en) * | 2005-08-26 | 2007-08-28 | Dynatex International | Method and apparatus for breaking semiconductor wafers |
US8220685B1 (en) * | 2005-09-08 | 2012-07-17 | Micro Processing Technology, Inc. | System for breaking a semiconductor wafer or other workpiece along a scribe line |
EP2008782B1 (en) * | 2007-06-29 | 2012-04-25 | J&L Group International, LLC (JLGI) | An apparatus and method for separating a stack of sheets from a pile of sheets |
KR100959104B1 (ko) * | 2008-07-16 | 2010-05-25 | 삼성모바일디스플레이주식회사 | 평판 디스플레이 패널 절단 장치 |
WO2010040069A1 (en) * | 2008-10-03 | 2010-04-08 | J & L Group International, Llc | Bundle breaker |
KR20120107722A (ko) * | 2011-03-22 | 2012-10-04 | 삼성디스플레이 주식회사 | 기판 절단 장치 및 그것을 이용한 기판 절단 방법 |
US10773420B2 (en) | 2011-11-10 | 2020-09-15 | LatticeGear, LLC | Device and method for cleaving a substrate |
US10065340B2 (en) * | 2011-11-10 | 2018-09-04 | LatticeGear, LLC | Device and method for cleaving |
US8747589B2 (en) * | 2011-11-11 | 2014-06-10 | Maruwa Co. Ltd. | Cut-out sintered ceramic sheet and method of manufacturing the same |
FR2986175A1 (fr) * | 2012-01-31 | 2013-08-02 | St Microelectronics Tours Sas | Procede et dispositif de decoupe d'une plaquette |
KR102048921B1 (ko) * | 2012-06-20 | 2019-11-27 | 삼성디스플레이 주식회사 | 셀 절단 장치 및 셀 절단 방법 |
CN104396127B (zh) * | 2012-07-02 | 2016-10-12 | 日产自动车株式会社 | 构成场磁极用磁体的磁体片的制造装置及其制造方法 |
US20140103088A1 (en) * | 2012-10-16 | 2014-04-17 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Breaker and breaking method for liquid crystal panel |
WO2015098595A1 (ja) * | 2013-12-27 | 2015-07-02 | 旭硝子株式会社 | 脆性板の加工方法、および脆性板の加工装置 |
JP2015191993A (ja) * | 2014-03-28 | 2015-11-02 | 株式会社東京精密 | 半導体製造装置及び半導体の製造方法 |
US9685579B2 (en) | 2014-12-05 | 2017-06-20 | Solarcity Corporation | Photovoltaic structure cleaving system |
US9899546B2 (en) | 2014-12-05 | 2018-02-20 | Tesla, Inc. | Photovoltaic cells with electrodes adapted to house conductive paste |
DE102016205902A1 (de) * | 2015-04-29 | 2016-11-03 | Tridonic Jennersdorf Gmbh | Trennvorrichtung für Leiterplatten |
CN105058609B (zh) * | 2015-07-29 | 2017-07-25 | 高佳太阳能股份有限公司 | 硅锭切割用定位工装 |
CN107032114B (zh) * | 2016-02-04 | 2023-04-14 | 苏州沃特维自动化***有限公司 | 一种掰片装置 |
JP7098173B2 (ja) * | 2020-02-12 | 2022-07-11 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断機構 |
WO2023136103A1 (ja) * | 2022-01-11 | 2023-07-20 | 三菱電機株式会社 | 基板分割治具 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL284964A (it) * | 1961-11-10 | 1900-01-01 | ||
DE2945682C2 (de) * | 1979-11-13 | 1982-06-24 | Vereinigte Glaswerke Gmbh, 5100 Aachen | Verfahren und Vorrichtung zum Abbrechen des Randstreifens einer nach einem vorgegebenen Umriß innerhalb eines Glasscheibenrohlings eingeritzten Glasscheibe |
US4410168A (en) * | 1980-07-11 | 1983-10-18 | Asta, Ltd. | Apparatus for manipulating a stretched resilient diaphragm |
FR2516848A1 (fr) * | 1981-11-25 | 1983-05-27 | Radiotechnique Compelec | Procede et machine pour subdiviser une plaque de ceramiquea |
GB2132937B (en) * | 1982-12-31 | 1986-04-03 | Leslie Albert Whalley | Tile holder for tile trimming |
US4646955A (en) * | 1985-01-14 | 1987-03-03 | Armstrong World Industries, Inc. | Method for segmenting building boards and apparatus therefor |
DE3621640C1 (de) * | 1986-06-27 | 1988-02-11 | Ver Glaswerke Gmbh | Einrichtung zum Aufbringen von lokal einwirkenden Druckkraeften auf eine Glasscheibe innerhalb einer Fertigungslinie fuer Autoglasscheiben |
-
1988
- 1988-06-16 IT IT20991/88A patent/IT1218088B/it active
-
1989
- 1989-06-13 US US07/365,458 patent/US5069195A/en not_active Expired - Fee Related
- 1989-06-14 DE DE89201533T patent/DE68909316T2/de not_active Expired - Fee Related
- 1989-06-14 EP EP19890201533 patent/EP0346997B1/en not_active Expired - Lifetime
- 1989-06-15 JP JP1150650A patent/JPH0278504A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1953886A2 (en) | 2007-02-05 | 2008-08-06 | Bticino S.P.A. | Box for wall mounting electrical apparatuses |
CN112008900A (zh) * | 2020-08-31 | 2020-12-01 | 广东东唯新材料有限公司 | 陶瓷岩板热加工弯曲成型装置及其成型方法 |
Also Published As
Publication number | Publication date |
---|---|
DE68909316D1 (de) | 1993-10-28 |
EP0346997A3 (en) | 1990-12-12 |
DE68909316T2 (de) | 1994-04-28 |
EP0346997A2 (en) | 1989-12-20 |
JPH0278504A (ja) | 1990-03-19 |
EP0346997B1 (en) | 1993-09-22 |
US5069195A (en) | 1991-12-03 |
IT8820991A0 (it) | 1988-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970628 |