IT1161868B - Dispositivo a semicondutturi e procedimento per la sua fabbricazione - Google Patents
Dispositivo a semicondutturi e procedimento per la sua fabbricazioneInfo
- Publication number
- IT1161868B IT1161868B IT19413/83A IT1941383A IT1161868B IT 1161868 B IT1161868 B IT 1161868B IT 19413/83 A IT19413/83 A IT 19413/83A IT 1941383 A IT1941383 A IT 1941383A IT 1161868 B IT1161868 B IT 1161868B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- manufacture
- semiconductive device
- semiconductive
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57016231A JPS58134451A (ja) | 1982-02-05 | 1982-02-05 | 多連フレ−ム |
JP57016230A JPS58134450A (ja) | 1982-02-05 | 1982-02-05 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8319413A0 IT8319413A0 (it) | 1983-02-03 |
IT1161868B true IT1161868B (it) | 1987-03-18 |
Family
ID=26352511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT19413/83A IT1161868B (it) | 1982-02-05 | 1983-02-03 | Dispositivo a semicondutturi e procedimento per la sua fabbricazione |
Country Status (9)
Country | Link |
---|---|
US (1) | US4691225A (it) |
KR (1) | KR910002035B1 (it) |
DE (1) | DE3300693A1 (it) |
FR (1) | FR2521350B1 (it) |
GB (2) | GB2115607B (it) |
HK (2) | HK71387A (it) |
IT (1) | IT1161868B (it) |
MY (1) | MY8700602A (it) |
SG (1) | SG36187G (it) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
EP0333237A3 (en) * | 1984-05-18 | 1990-03-21 | BRITISH TELECOMMUNICATIONS public limited company | Integrated circuit chip carrier |
GB8412674D0 (en) * | 1984-05-18 | 1984-06-27 | British Telecomm | Integrated circuit chip carrier |
IL78192A (en) * | 1985-04-12 | 1992-03-29 | Hughes Aircraft Co | Mini chip carrier slotted array |
US4802277A (en) * | 1985-04-12 | 1989-02-07 | Hughes Aircraft Company | Method of making a chip carrier slotted array |
US4762606A (en) * | 1985-04-12 | 1988-08-09 | Hughes Aircraft Company | Mini chip carrier slotted array |
JP2502511B2 (ja) * | 1986-02-06 | 1996-05-29 | 日立マクセル株式会社 | 半導体装置の製造方法 |
US4870476A (en) * | 1986-02-13 | 1989-09-26 | Vtc Incorporated | Integrated circuit packaging process and structure |
EP0246893A3 (en) * | 1986-05-21 | 1989-03-22 | Hitachi, Ltd. | Semiconductor device comprising an insulating wiring substrate and method of manufacturing it |
DE3619636A1 (de) * | 1986-06-11 | 1987-12-17 | Bosch Gmbh Robert | Gehaeuse fuer integrierte schaltkreise |
DE3625263A1 (de) * | 1986-07-25 | 1988-02-04 | Basf Ag | Mikroelektronische bauelemente sowie dickschicht-hybridschaltungen |
US5057461A (en) * | 1987-03-19 | 1991-10-15 | Texas Instruments Incorporated | Method of mounting integrated circuit interconnect leads releasably on film |
JPH02155256A (ja) * | 1988-12-08 | 1990-06-14 | Mitsubishi Electric Corp | 半導体装置 |
US5010038A (en) * | 1989-06-29 | 1991-04-23 | Digital Equipment Corp. | Method of cooling and powering an integrated circuit chip using a compliant interposing pad |
US5014418A (en) * | 1989-07-13 | 1991-05-14 | Gte Products Corporation | Method of forming a two piece chip carrier |
JP2515406B2 (ja) * | 1989-09-05 | 1996-07-10 | 株式会社東芝 | 樹脂封止型半導体装置 |
US5045921A (en) * | 1989-12-26 | 1991-09-03 | Motorola, Inc. | Pad array carrier IC device using flexible tape |
NL9000161A (nl) * | 1990-01-23 | 1991-08-16 | Koninkl Philips Electronics Nv | Halfgeleiderinrichting bevattende een drager en werkwijze voor het vervaardigen van de drager. |
US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US7198969B1 (en) | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
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-
1982
- 1982-12-16 FR FR8221110A patent/FR2521350B1/fr not_active Expired
-
1983
- 1983-01-11 DE DE19833300693 patent/DE3300693A1/de not_active Withdrawn
- 1983-01-24 KR KR1019830000264A patent/KR910002035B1/ko not_active IP Right Cessation
- 1983-01-28 US US06/462,060 patent/US4691225A/en not_active Expired - Lifetime
- 1983-02-01 GB GB08302769A patent/GB2115607B/en not_active Expired
- 1983-02-03 IT IT19413/83A patent/IT1161868B/it active
-
1984
- 1984-05-02 GB GB08411298A patent/GB2138210B/en not_active Expired
-
1987
- 1987-04-23 SG SG361/87A patent/SG36187G/en unknown
- 1987-10-01 HK HK713/87A patent/HK71387A/xx not_active IP Right Cessation
- 1987-10-01 HK HK708/87A patent/HK70887A/xx not_active IP Right Cessation
- 1987-12-30 MY MY602/87A patent/MY8700602A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB2138210B (en) | 1985-10-30 |
GB8411298D0 (en) | 1984-06-06 |
US4691225A (en) | 1987-09-01 |
MY8700602A (en) | 1987-12-31 |
HK70887A (en) | 1987-10-09 |
SG36187G (en) | 1987-09-18 |
KR840003534A (ko) | 1984-09-08 |
GB2115607A (en) | 1983-09-07 |
IT8319413A0 (it) | 1983-02-03 |
GB2115607B (en) | 1985-10-30 |
GB2138210A (en) | 1984-10-17 |
FR2521350A1 (fr) | 1983-08-12 |
FR2521350B1 (fr) | 1986-01-24 |
HK71387A (en) | 1987-10-09 |
GB8302769D0 (en) | 1983-03-02 |
KR910002035B1 (ko) | 1991-03-30 |
DE3300693A1 (de) | 1983-09-22 |
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