IT1161868B - Dispositivo a semicondutturi e procedimento per la sua fabbricazione - Google Patents

Dispositivo a semicondutturi e procedimento per la sua fabbricazione

Info

Publication number
IT1161868B
IT1161868B IT19413/83A IT1941383A IT1161868B IT 1161868 B IT1161868 B IT 1161868B IT 19413/83 A IT19413/83 A IT 19413/83A IT 1941383 A IT1941383 A IT 1941383A IT 1161868 B IT1161868 B IT 1161868B
Authority
IT
Italy
Prior art keywords
procedure
manufacture
semiconductive device
semiconductive
Prior art date
Application number
IT19413/83A
Other languages
English (en)
Other versions
IT8319413A0 (it
Inventor
Murakami Gen
Gappa Takeshi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57016231A external-priority patent/JPS58134451A/ja
Priority claimed from JP57016230A external-priority patent/JPS58134450A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8319413A0 publication Critical patent/IT8319413A0/it
Application granted granted Critical
Publication of IT1161868B publication Critical patent/IT1161868B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT19413/83A 1982-02-05 1983-02-03 Dispositivo a semicondutturi e procedimento per la sua fabbricazione IT1161868B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57016231A JPS58134451A (ja) 1982-02-05 1982-02-05 多連フレ−ム
JP57016230A JPS58134450A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
IT8319413A0 IT8319413A0 (it) 1983-02-03
IT1161868B true IT1161868B (it) 1987-03-18

Family

ID=26352511

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19413/83A IT1161868B (it) 1982-02-05 1983-02-03 Dispositivo a semicondutturi e procedimento per la sua fabbricazione

Country Status (9)

Country Link
US (1) US4691225A (it)
KR (1) KR910002035B1 (it)
DE (1) DE3300693A1 (it)
FR (1) FR2521350B1 (it)
GB (2) GB2115607B (it)
HK (2) HK71387A (it)
IT (1) IT1161868B (it)
MY (1) MY8700602A (it)
SG (1) SG36187G (it)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
EP0333237A3 (en) * 1984-05-18 1990-03-21 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
IL78192A (en) * 1985-04-12 1992-03-29 Hughes Aircraft Co Mini chip carrier slotted array
US4802277A (en) * 1985-04-12 1989-02-07 Hughes Aircraft Company Method of making a chip carrier slotted array
US4762606A (en) * 1985-04-12 1988-08-09 Hughes Aircraft Company Mini chip carrier slotted array
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US4870476A (en) * 1986-02-13 1989-09-26 Vtc Incorporated Integrated circuit packaging process and structure
EP0246893A3 (en) * 1986-05-21 1989-03-22 Hitachi, Ltd. Semiconductor device comprising an insulating wiring substrate and method of manufacturing it
DE3619636A1 (de) * 1986-06-11 1987-12-17 Bosch Gmbh Robert Gehaeuse fuer integrierte schaltkreise
DE3625263A1 (de) * 1986-07-25 1988-02-04 Basf Ag Mikroelektronische bauelemente sowie dickschicht-hybridschaltungen
US5057461A (en) * 1987-03-19 1991-10-15 Texas Instruments Incorporated Method of mounting integrated circuit interconnect leads releasably on film
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GB2138210B (en) 1985-10-30
GB8411298D0 (en) 1984-06-06
US4691225A (en) 1987-09-01
MY8700602A (en) 1987-12-31
HK70887A (en) 1987-10-09
SG36187G (en) 1987-09-18
KR840003534A (ko) 1984-09-08
GB2115607A (en) 1983-09-07
IT8319413A0 (it) 1983-02-03
GB2115607B (en) 1985-10-30
GB2138210A (en) 1984-10-17
FR2521350A1 (fr) 1983-08-12
FR2521350B1 (fr) 1986-01-24
HK71387A (en) 1987-10-09
GB8302769D0 (en) 1983-03-02
KR910002035B1 (ko) 1991-03-30
DE3300693A1 (de) 1983-09-22

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