TW200745197A - Sealing agent for ship-on-film mounting and a semiconductor part sealed by such sealing agent - Google Patents

Sealing agent for ship-on-film mounting and a semiconductor part sealed by such sealing agent

Info

Publication number
TW200745197A
TW200745197A TW096117172A TW96117172A TW200745197A TW 200745197 A TW200745197 A TW 200745197A TW 096117172 A TW096117172 A TW 096117172A TW 96117172 A TW96117172 A TW 96117172A TW 200745197 A TW200745197 A TW 200745197A
Authority
TW
Taiwan
Prior art keywords
sealing agent
semiconductor part
ship
mounting
cof
Prior art date
Application number
TW096117172A
Other languages
Chinese (zh)
Other versions
TWI406879B (en
Inventor
Hidenori Iida
Toshiyuki Sato
Hiroshi Takasugi
Hiroki Honma
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of TW200745197A publication Critical patent/TW200745197A/en
Application granted granted Critical
Publication of TWI406879B publication Critical patent/TWI406879B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)

Abstract

This invention provides a sealing agent for chip-on-film (COF) mounting capable of making a high reliability semiconductor part, and a high reliability semiconductor part. The sealing agent for COF mounting of this invention contains (A) an epoxy resin, (B) an acid anhydride based hardening agent, and (C) imidazole based and/or triazine based hardening promoter, wherein the content of component (C) is 0.6~10 part by weight with respect to 100 part by weight of the sum of the contents of components (A), (B) and (C). Moreover, the sealing agent for COF mounting of this invention has a gel time at 150 DEG C of 40~130 seconds and a temperature dependency for gelation of from -5 to-13.
TW096117172A 2006-05-15 2007-05-15 Sealing agent for ship-on-film mounting and a semiconductor part sealed by such sealing agent TWI406879B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006134660 2006-05-15

Publications (2)

Publication Number Publication Date
TW200745197A true TW200745197A (en) 2007-12-16
TWI406879B TWI406879B (en) 2013-09-01

Family

ID=38693917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117172A TWI406879B (en) 2006-05-15 2007-05-15 Sealing agent for ship-on-film mounting and a semiconductor part sealed by such sealing agent

Country Status (4)

Country Link
JP (1) JP5317695B2 (en)
KR (1) KR101373791B1 (en)
TW (1) TWI406879B (en)
WO (1) WO2007132827A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5671778B2 (en) * 2008-03-26 2015-02-18 日立化成株式会社 Film-like adhesive for semiconductor sealing, semiconductor device and method for manufacturing the same
JP5647769B2 (en) * 2009-05-13 2015-01-07 ナミックス株式会社 COF sealing resin composition
JP5507162B2 (en) * 2009-09-01 2014-05-28 京セラケミカル株式会社 Electric double layer capacitor
WO2011065365A1 (en) * 2009-11-30 2011-06-03 ナミックス株式会社 Epoxy resin composition for sealing semiconductors, and semiconductor devices
JP5411774B2 (en) * 2010-03-30 2014-02-12 ナミックス株式会社 Pre-feed type liquid semiconductor encapsulating resin composition
CN102477290B (en) * 2010-11-30 2014-01-29 北京华纺高新技术有限公司 Thermo-sensitive discoloration material microcapsule and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0931161A (en) * 1995-07-19 1997-02-04 Shin Etsu Chem Co Ltd Liquid epoxy resin composition
JP2000294894A (en) * 1998-12-21 2000-10-20 Seiko Epson Corp Circuit board, its manufacture, display device using the same and electronics
JP3957942B2 (en) * 2000-03-06 2007-08-15 住友ベークライト株式会社 Liquid encapsulating resin composition and semiconductor device using the same
JP3858705B2 (en) * 2001-01-29 2006-12-20 宇部興産株式会社 Underfill material for COF mounting and electronic components
JP4023594B2 (en) * 2002-07-09 2007-12-19 日本化薬株式会社 Epoxy resin composition and cured product thereof
JP2006213823A (en) * 2005-02-03 2006-08-17 Nippon Kayaku Co Ltd Heat-resistant epoxy resin composition

Also Published As

Publication number Publication date
KR20090015062A (en) 2009-02-11
TWI406879B (en) 2013-09-01
JPWO2007132827A1 (en) 2009-09-24
JP5317695B2 (en) 2013-10-16
WO2007132827A1 (en) 2007-11-22
KR101373791B1 (en) 2014-03-13

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