IN154527B - - Google Patents

Info

Publication number: IN154527B
Authority: IN; India

Application number

IN153/CAL/81A

Other languages

English (en)

Inventor

Tatsuji Kasashima

Shuji Morita

Hiroyuki Hayami

Seiroku Ose

Yoshinori Takada

Fumihiro Nozaki

Original Assignee

Dainichi Nippon Cables Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-02-12

Filing date

1981-02-11

Publication date

1984-11-03

1981-02-11 Application filed by Dainichi Nippon Cables Ltd filed Critical Dainichi Nippon Cables Ltd

1984-11-03 Publication of IN154527B publication Critical patent/IN154527B/en

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating Methods And Accessories (AREA)

IN153/CAL/81A 1980-02-12 1981-02-11 IN154527B (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1629380A JPS56112497A (en)	1980-02-12	1980-02-12	Method and apparatus for production of electrodeposited wire

Publications (1)

Publication Number	Publication Date
IN154527B true IN154527B (fr)	1984-11-03

Family

ID=11912490

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IN153/CAL/81A IN154527B (fr)	1980-02-12	1981-02-11

Country Status (7)

Country	Link
US (1)	US4395320A (fr)
JP (1)	JPS56112497A (fr)
DE (1)	DE3104699A1 (fr)
FR (1)	FR2475583B1 (fr)
GB (1)	GB2071700B (fr)
IN (1)	IN154527B (fr)
IT (1)	IT1135423B (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4904351A (en) *	1982-03-16	1990-02-27	American Cyanamid Company	Process for continuously plating fiber
JPS58213890A (ja) *	1982-06-07	1983-12-12	Kureha Chem Ind Co Ltd	電気泳動電荷を持つ繊維性物質の積層成形物の製造方法及び装置
US4624751A (en) *	1983-06-24	1986-11-25	American Cyanamid Company	Process for fiber plating and apparatus with special tensioning mechanism
US4891105A (en) *	1987-01-28	1990-01-02	Roggero Sein Carlos E	Method and apparatus for electrolytic refining of copper and production of copper wires for electrical purposes
USRE34664E (en) *	1987-01-28	1994-07-19	Asarco Incorporated	Method and apparatus for electrolytic refining of copper and production of copper wires for electrical purposes
US5478457A (en) *	1988-10-06	1995-12-26	Catteeuw; Mario	Apparatus for the continuous electrolytic treatment of wire-shaped objects
US5242571A (en) *	1992-10-26	1993-09-07	Asarco Incorporated	Method and apparatus for the electrolytic production of copper wire
US6328872B1 (en) *	1999-04-03	2001-12-11	Nutool, Inc.	Method and apparatus for plating and polishing a semiconductor substrate
DE10007567C2 (de) *	2000-02-18	2003-08-07	Graf & Co Ag	Verfahren und Vorrichtung zum Herstellen eines Drahtes
US20040065560A1 (en) *	2002-10-03	2004-04-08	O'link Technology L.L.C.	Electroforming device for manufacturing fine metal tubular material
US20050123681A1 (en) *	2003-12-08	2005-06-09	Jar-Wha Lee	Method and apparatus for the treatment of individual filaments of a multifilament yarn
US8137752B2 (en) *	2003-12-08	2012-03-20	Syscom Advanced Materials, Inc.	Method and apparatus for the treatment of individual filaments of a multifilament yarn
WO2006086407A2 (fr) *	2005-02-08	2006-08-17	The University Of Columbia University In The City Of New York	Plaquage et gravure in situ de materiaux recouverts d'un film superficiel
US8496799B2 (en) *	2005-02-08	2013-07-30	The Trustees Of Columbia University In The City Of New York	Systems and methods for in situ annealing of electro- and electroless platings during deposition
US8529738B2 (en) *	2005-02-08	2013-09-10	The Trustees Of Columbia University In The City Of New York	In situ plating and etching of materials covered with a surface film
WO2006110437A1 (fr) *	2005-04-08	2006-10-19	The Trustees Of Columbia University In The City Of New York	Systèmes et procédés de surveillance de bains de placage et d’attaque chimique
WO2007027907A2 (fr) *	2005-09-02	2007-03-08	The Trustees Of Columbia University In The City Of New York	Systeme et procede d'obtention d'une gravure anisotrope de substrats a motifs
EP1870496A1 (fr) *	2006-06-20	2007-12-26	NV Bekaert SA	Appareil et procédé de revêtement électrolytique en continu d'un substrat
JP5185948B2 (ja) *	2006-12-06	2013-04-17	ザトラスティーズオブコロンビアユニヴァーシティインザシティオブニューヨーク	メッキ及びエッチング浴組成をスクリーニングするマイクロ流体システム及び方法
US8241472B2 (en) *	2008-02-07	2012-08-14	Shmuel Altman	Cleaning, pickling and electroplating apparatus
US8357998B2 (en) *	2009-02-09	2013-01-22	Advanced Semiconductor Engineering, Inc.	Wirebonded semiconductor package
US8985050B2 (en) *	2009-11-05	2015-03-24	The Trustees Of Columbia University In The City Of New York	Substrate laser oxide removal process followed by electro or immersion plating
WO2012092505A1 (fr)	2010-12-29	2012-07-05	Syscom Advanced Materials	Fil hybride constitué d'un métal et de fibres métallisées
US8618677B2 (en)	2012-04-06	2013-12-31	Advanced Semiconductor Engineering, Inc.	Wirebonded semiconductor package
CN117305958B (zh) *	2023-10-18	2024-05-14	河南恒创能科金属制品有限公司	一种金刚丝母线加工处理用装置及其加工处理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US1120191A (en) *	1912-04-04	1914-12-08	Gibbs Company	Apparatus for electrolytic production of wire.
US1515092A (en) *	1923-01-01	1924-11-11	Cowper-Coles Sherard Osborn	Process and apparatus for coating wire and other drawn and rolled sections with other metals
US2075331A (en) *	1932-12-30	1937-03-30	Copperweld Steel Co	Method and apparatus for the electrodeposition of metal
US2370973A (en) *	1941-11-22	1945-03-06	William C Lang	Method and apparatus for producing coated wire
BE512758A (fr) *	1951-07-13
US3273190A (en) *	1962-10-23	1966-09-20	Bethlehem Steel Corp	Wire polisher
US3441494A (en) *	1963-05-25	1969-04-29	Kokusai Denshin Denwa Co Ltd	Apparatus to deposit a ferromagnetic film on a conductive wire
JPS4915121U (fr) *	1972-05-15	1974-02-08
US3865701A (en) *	1973-03-06	1975-02-11	American Chem & Refining Co	Method for continuous high speed electroplating of strip, wire and the like
JPS5254464A (en) *	1975-10-29	1977-05-02	Ohara Keiki Seisakushiyo Kk	Apparatus for automatically dividing and weighing dough
JPS588776Y2 (ja) *	1979-07-18	1983-02-17	住友電気工業株式会社	トロリ線の連続電気めっき装置

1980
- 1980-02-12 JP JP1629380A patent/JPS56112497A/ja active Granted
1981
- 1981-02-05 US US06/231,610 patent/US4395320A/en not_active Expired - Fee Related
- 1981-02-10 DE DE19813104699 patent/DE3104699A1/de not_active Withdrawn
- 1981-02-11 GB GB8104174A patent/GB2071700B/en not_active Expired
- 1981-02-11 IT IT19669/81A patent/IT1135423B/it active
- 1981-02-11 IN IN153/CAL/81A patent/IN154527B/en unknown
- 1981-02-12 FR FR8102776A patent/FR2475583B1/fr not_active Expired

Also Published As

Publication number	Publication date
FR2475583B1 (fr)	1985-11-08
GB2071700A (en)	1981-09-23
JPS629679B2 (fr)	1987-03-02
FR2475583A1 (fr)	1981-08-14
DE3104699A1 (de)	1982-01-07
IT1135423B (it)	1986-08-20
IT8119669A0 (it)	1981-02-11
GB2071700B (en)	1983-09-21
JPS56112497A (en)	1981-09-04
US4395320A (en)	1983-07-26

Publication	Publication Date	Title
FR2475511B1 (fr)	1985-01-04
FR2473046B1 (fr)	1985-03-01
FR2474527B1 (fr)	1984-06-15
FR2475281B1 (fr)	1985-02-08
FR2476791B1 (fr)	1984-05-18
FR2473394B1 (fr)	1984-07-20
DE3152263T1 (fr)	1982-09-23
IN154527B (fr)	1984-11-03
FR2477148B1 (fr)	1983-09-02
FR2473037B1 (fr)	1984-04-06
FR2476331B1 (fr)	1982-03-05
FR2474756B3 (fr)	1982-09-03
FR2474423B1 (fr)	1983-02-18
DE3144406T1 (fr)	1982-07-01
DE3152398T1 (fr)	1982-10-07
FR2474792B1 (fr)	1984-12-28
FR2492336B1 (fr)	1983-07-01
FR2476808B1 (fr)	1982-11-19
FR2477070B1 (fr)	1984-12-28
FR2474593B1 (fr)	1984-04-20
FR2476346B3 (fr)	1983-10-21
FR2476117B1 (fr)	1984-11-09
FR2476190B1 (fr)	1983-10-21
FR2476540B1 (fr)	1983-03-04
FR2476690B1 (fr)	1982-05-07