IL166071A0 - Light filtering image sensor - Google Patents

Light filtering image sensor

Info

Publication number
IL166071A0
IL166071A0 IL16607104A IL16607104A IL166071A0 IL 166071 A0 IL166071 A0 IL 166071A0 IL 16607104 A IL16607104 A IL 16607104A IL 16607104 A IL16607104 A IL 16607104A IL 166071 A0 IL166071 A0 IL 166071A0
Authority
IL
Israel
Prior art keywords
image sensor
filtering image
light filtering
light
sensor
Prior art date
Application number
IL16607104A
Other languages
English (en)
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of IL166071A0 publication Critical patent/IL166071A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
IL16607104A 2004-05-21 2004-12-30 Light filtering image sensor IL166071A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/851,012 US7608811B2 (en) 2004-05-21 2004-05-21 Minimal depth light filtering image sensor

Publications (1)

Publication Number Publication Date
IL166071A0 true IL166071A0 (en) 2006-01-15

Family

ID=35374314

Family Applications (1)

Application Number Title Priority Date Filing Date
IL16607104A IL166071A0 (en) 2004-05-21 2004-12-30 Light filtering image sensor

Country Status (6)

Country Link
US (1) US7608811B2 (ja)
JP (1) JP2005340811A (ja)
CN (1) CN1700476A (ja)
DE (1) DE102005005590B4 (ja)
IL (1) IL166071A0 (ja)
TW (1) TW200600843A (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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US20070001094A1 (en) * 2005-06-29 2007-01-04 Micron Technology, Inc. Infrared filter for imagers
CN101563789B (zh) * 2006-12-12 2012-12-26 英特赛尔美国股份有限公司 具红外线抑制的光传感器及将传感器用于背光控制
US8237121B2 (en) * 2008-02-07 2012-08-07 Omnivision Technologies, Inc. Alternating row infrared filter for an image sensor
KR100992411B1 (ko) * 2009-02-06 2010-11-05 (주)실리콘화일 피사체의 근접여부 판단이 가능한 이미지센서
KR101133154B1 (ko) 2011-02-03 2012-04-06 디지털옵틱스 코포레이션 이스트 상이한 파장을 균일하게 수광하기 위한 차등 높이 실리콘을 포함하는 이면 조사 센서 패키지
KR101095945B1 (ko) 2011-02-03 2011-12-19 테쎄라 노쓰 아메리카, 아이엔씨. 상이한 파장을 균일하게 수광하기 위한 흡광 재료를 포함하는 이면 조사 센서 패키지
US20120199924A1 (en) * 2011-02-03 2012-08-09 Tessera Research Llc Bsi image sensor package with variable light transmission for even reception of different wavelengths
US8513757B1 (en) * 2012-06-08 2013-08-20 Apple Inc. Cover for image sensor assembly with light absorbing layer and alignment features
CN102983145B (zh) * 2012-12-07 2015-07-08 上海丽恒光微电子科技有限公司 红外图像传感器及其形成方法
DE102013202170B4 (de) 2013-02-11 2023-03-09 Robert Bosch Gmbh Optische Sensorchipvorrichtung und entsprechendes Herstellungsverfahren
EP3521782A1 (en) * 2014-03-03 2019-08-07 ams AG Method for operating a directional sensor arrangement
US10614281B2 (en) * 2015-09-15 2020-04-07 Shanghai Oxi Technology Co., Ltd Optical fingerprint imaging system and array sensor
US11156727B2 (en) * 2015-10-02 2021-10-26 Varian Medical Systems, Inc. High DQE imaging device
JP6746941B2 (ja) * 2016-02-19 2020-08-26 大日本印刷株式会社 撮像モジュール、撮像装置
US10120182B2 (en) * 2016-10-03 2018-11-06 Semiconductor Components Industries, Llc Imaging systems with fluidic color filter elements
CN106958920A (zh) * 2017-04-06 2017-07-18 绵阳美菱软件技术有限公司 一种空调、对空调进行控制的***以及空调业务实现方法
KR102452251B1 (ko) * 2017-08-04 2022-10-11 삼성디스플레이 주식회사 표시 장치
US10522579B2 (en) 2017-11-15 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Light blocking layer for image sensor device
CN110248076B (zh) * 2019-07-18 2021-06-01 Oppo广东移动通信有限公司 一种摄像头的保护镜片组件、摄像头组件以及电子设备

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US4081277A (en) * 1976-10-08 1978-03-28 Eastman Kodak Company Method for making a solid-state color imaging device having an integral color filter and the device
JPH04111353A (ja) * 1990-08-31 1992-04-13 Canon Inc 光電変換装置
US5140396A (en) * 1990-10-10 1992-08-18 Polaroid Corporation Filter and solid state imager incorporating this filter
JP2000216368A (ja) * 1999-01-25 2000-08-04 Asahi Optical Co Ltd 撮像装置の赤外カットフィルタ取付け構造
JP2001118967A (ja) * 1999-10-19 2001-04-27 Sanyo Electric Co Ltd 固体撮像素子のパッケージ構造
US6221687B1 (en) * 1999-12-23 2001-04-24 Tower Semiconductor Ltd. Color image sensor with embedded microlens array
US20020063214A1 (en) 2000-11-29 2002-05-30 Taiwan Semiconductor Manufacturing Co. Ltd. Optoelectronic microelectronic fabrication with infrared filter and method for fabrication thereof
JP3719947B2 (ja) * 2001-04-18 2005-11-24 シャープ株式会社 固体撮像装置及びその製造方法
US6765276B2 (en) * 2001-08-23 2004-07-20 Agilent Technologies, Inc. Bottom antireflection coating color filter process for fabricating solid state image sensors
US7008090B2 (en) * 2001-08-30 2006-03-07 Donnelly Corporation Vehicle mirror system with light conduiting member
JP5044878B2 (ja) * 2001-09-19 2012-10-10 ソニー株式会社 固体撮像装置
US6744109B2 (en) * 2002-06-26 2004-06-01 Agilent Technologies, Inc. Glass attachment over micro-lens arrays
US6818962B2 (en) 2002-10-25 2004-11-16 Omnivision International Holding Ltd Image sensor having integrated thin film infrared filter
JP4264251B2 (ja) * 2002-12-09 2009-05-13 富士フイルム株式会社 固体撮像装置とその動作方法
JP3840214B2 (ja) * 2003-01-06 2006-11-01 キヤノン株式会社 光電変換装置及び光電変換装置の製造方法及び同光電変換装置を用いたカメラ
US7223960B2 (en) * 2003-12-03 2007-05-29 Micron Technology, Inc. Image sensor, an image sensor pixel, and methods of forming the same
US20050224694A1 (en) * 2004-04-08 2005-10-13 Taiwan Semiconductor Manufacturing Co. Ltd. High efficiency microlens array
KR100766248B1 (ko) * 2006-07-12 2007-10-12 동부일렉트로닉스 주식회사 이미지 소자 및 이의 제조 방법
JP4147433B2 (ja) 2007-02-19 2008-09-10 セイコーエプソン株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2005340811A (ja) 2005-12-08
US20050258351A1 (en) 2005-11-24
DE102005005590A1 (de) 2005-12-15
TW200600843A (en) 2006-01-01
DE102005005590B4 (de) 2009-01-22
US7608811B2 (en) 2009-10-27
CN1700476A (zh) 2005-11-23

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