IL154002A0 - Method for making an integrated circuit capable of being surface-mounted and resulting circuit - Google Patents
Method for making an integrated circuit capable of being surface-mounted and resulting circuitInfo
- Publication number
- IL154002A0 IL154002A0 IL15400200A IL15400200A IL154002A0 IL 154002 A0 IL154002 A0 IL 154002A0 IL 15400200 A IL15400200 A IL 15400200A IL 15400200 A IL15400200 A IL 15400200A IL 154002 A0 IL154002 A0 IL 154002A0
- Authority
- IL
- Israel
- Prior art keywords
- making
- integrated circuit
- resulting
- circuit capable
- circuit
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
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- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/FR2000/002063 WO2002007208A1 (fr) | 2000-07-18 | 2000-07-18 | Procede de fabrication de circuit integre de type montable en surface et circuit issu du procede |
Publications (1)
Publication Number | Publication Date |
---|---|
IL154002A0 true IL154002A0 (en) | 2003-07-31 |
Family
ID=8847160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL15400200A IL154002A0 (en) | 2000-07-18 | 2000-07-18 | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
Country Status (8)
Country | Link |
---|---|
US (1) | US6989591B1 (fr) |
EP (1) | EP1314196A1 (fr) |
JP (1) | JP2004504722A (fr) |
KR (1) | KR20030059078A (fr) |
AU (1) | AU2000265772A1 (fr) |
CA (1) | CA2416502A1 (fr) |
IL (1) | IL154002A0 (fr) |
WO (1) | WO2002007208A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL154002A0 (en) * | 2000-07-18 | 2003-07-31 | Atmel Grenoble Sa | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
JP4744689B2 (ja) * | 2000-12-11 | 2011-08-10 | パナソニック株式会社 | 粘性流体転写装置及び電子部品実装装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4396140A (en) | 1981-01-27 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Method of bonding electronic components |
US4722470A (en) * | 1986-12-01 | 1988-02-02 | International Business Machines Corporation | Method and transfer plate for applying solder to component leads |
US4759491A (en) * | 1987-05-18 | 1988-07-26 | American Telephone And Telegraph Company | Method and apparatus for applying bonding material to component leads |
JPH01270391A (ja) * | 1988-04-22 | 1989-10-27 | Nec Corp | 予備半田付方法 |
JPH01278967A (ja) * | 1988-05-06 | 1989-11-09 | Senju Metal Ind Co Ltd | 電子部品リードの予備はんだ付け方法 |
JP2810101B2 (ja) * | 1989-04-17 | 1998-10-15 | 日本エー・エム・ピー株式会社 | 電気ピンおよびその製造方法 |
JPH06132439A (ja) * | 1992-10-21 | 1994-05-13 | Ngk Insulators Ltd | セラミックパッケージのめっき方法 |
JPH08167772A (ja) * | 1994-12-14 | 1996-06-25 | Hitachi Ltd | 表面実装電子部品の予備はんだ付け方法 |
US6007348A (en) | 1996-05-07 | 1999-12-28 | Advanced Intercommunications Corporation | Solder ball terminal |
US5847458A (en) * | 1996-05-21 | 1998-12-08 | Shinko Electric Industries Co., Ltd. | Semiconductor package and device having heads coupled with insulating material |
US5839191A (en) * | 1997-01-24 | 1998-11-24 | Unisys Corporation | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package |
US6002172A (en) * | 1997-03-12 | 1999-12-14 | International Business Machines Corporation | Substrate structure and method for improving attachment reliability of semiconductor chips and modules |
DE19807279C2 (de) | 1998-02-23 | 2000-02-17 | Dieter Friedrich | Verfahren zum Herstellen eines elektronischen Bauelementes |
FR2789225B1 (fr) | 1999-02-02 | 2004-09-03 | Thomson Csf | Circuit integre de type montable en surface |
IL154002A0 (en) * | 2000-07-18 | 2003-07-31 | Atmel Grenoble Sa | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
-
2000
- 2000-07-18 IL IL15400200A patent/IL154002A0/xx unknown
- 2000-07-18 EP EP00953253A patent/EP1314196A1/fr not_active Withdrawn
- 2000-07-18 WO PCT/FR2000/002063 patent/WO2002007208A1/fr active Application Filing
- 2000-07-18 KR KR10-2003-7000827A patent/KR20030059078A/ko not_active Application Discontinuation
- 2000-07-18 JP JP2002513012A patent/JP2004504722A/ja active Pending
- 2000-07-18 CA CA002416502A patent/CA2416502A1/fr not_active Abandoned
- 2000-07-18 US US10/333,252 patent/US6989591B1/en not_active Expired - Fee Related
- 2000-07-18 AU AU2000265772A patent/AU2000265772A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2004504722A (ja) | 2004-02-12 |
AU2000265772A1 (en) | 2002-01-30 |
EP1314196A1 (fr) | 2003-05-28 |
CA2416502A1 (fr) | 2002-01-24 |
US6989591B1 (en) | 2006-01-24 |
WO2002007208A1 (fr) | 2002-01-24 |
KR20030059078A (ko) | 2003-07-07 |
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