IE49684B1 - Systems for bonding pellets,for example semiconductor chips,to supports - Google Patents
Systems for bonding pellets,for example semiconductor chips,to supportsInfo
- Publication number
- IE49684B1 IE49684B1 IE120080A IE120080A IE49684B1 IE 49684 B1 IE49684 B1 IE 49684B1 IE 120080 A IE120080 A IE 120080A IE 120080 A IE120080 A IE 120080A IE 49684 B1 IE49684 B1 IE 49684B1
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- Prior art keywords
- pellet
- disposition
- bonding
- tbe
- stage
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
A system for bonding pellets, for example semiconductor chips (1, 1n) to supports, for example lead frames (6), has a pellet supply stage (I), a bonding stage (II) and an intermediate stage (III). Pellets (1, 1n) are transferred from the supply stage (I) onto a table (3) of the intermediate stage (II). The position of the table (3) in the X-Y directions and the angular position of the X-Y plane are controlled by control means (13) to bring a pellet (1, 1n) on the table to a desired position for transfer to the bonding stage (III) for bonding to a support (6).
Description
The present invention relates to systems for bonding pellets,for example semiconductor chips,to supports.
Tbe present invention is particularly concerned with the positioning of pellets or small chips, in systems for bonding tbe pellets to supports, for example the positioning of semiconductor chips for bonding to supports such as lead frames, ceramic packages or steins.
A semiconductor manufacturing process generally includes a step for mounting aDd settling a semiconductor element chip (a pellet) such as an IC chip onto a support such as lead frame, a ceramic package or a stem.
In that step, it is important that the pellet is accurately mounted at a specified position on tbe support. Mounting accuracy has a significant effect on the efficiency of a succeeding wire bonding process.
A conventional automatic pellet bonding system has employed a pellet positioning method such that an intermediate stage ls provided between a pellet supply portion and a bonding portion. A pellet ls firstly picked up, by a vacuum chuck, from a tray in which a plurality of pellets (semiconductor chips) are arranged. The pellet is then placed on a top surface of the intermediate stage. At this point, the pellet is accurately positioned and oriented at a specified location on the intermediate stage by DechaDical means comprising a pair of pawls which push cd opposite side edges of the pellet. Finally, the • 49684 positioned pellet is caught by a die collet which accurately travels to and returns from the specified location on the intermediate stage and a predetermined location on a bonding portion.
Although such a bonding system has been used in practice, the problem of severe damage was acknowledged to occur with this system because the mechanical means comprising a pair of pawls would often break.pellets.
In addition, it was desired to handle a variety of sises of pellets. For this purpose an adjustment of the stroke of the pawls was necessary in order to adapt the system to the different sised pellets, which necessitated troublesome adjustment and caused decreased production yield.
On tbe other hand, a system has been proposed for orientating a pellet by using an adjustable rotation mechanism attached to the intermediate stage, without using mechanical pawls. In that proposed system, the position of the pellet in X and Y directions has to be adjusted prior to pick up of the pellet by the vacuum chuck. The above system is described in Japanese Patent Publication No. 44-27536.
Another system has been proposed in Japanese Patent Publication No. 49-22588. In this system, an intermediate stage is not used and the pellet is firstly picked up by a die collet. Information concerning the location of the pellet is detected by means of a TV camera and the detected information is applied to a processing unit. Control signals from the processing unit are then applied to means for adjusting X and Y locations of the pellet and rotational pellet position, which means are installed on supporting means of the bonding stage.
However, these proposed systems without mechanical pawls have not been considered to be a reliable, and have not been considered to offer high speed production systems because it proved in one system almost impossible to pick up a pellet with a vacuum chuck without changing the X and Y locations of the pellet and in the other system the installation of meaDS for adjusting X and Y locations and rotational position on tbe bonding apparatus caused an increase of inertia of the bonding apparatus, which is usually provided with a means for heating the bonding apparatus, thereby increasing mechanical mass in total.
According to the present invention there is provided 2 system fc-r bonding pellets to supports, compri sing:a pellet supply stage, providing a supply of pellets, each having opposed corners, to be bonded to supports;
a pellet bonding stage, for bonding a pellet to a support, an intermediate table, between the supply and ' bonding stages, moveable in X and Y directions and rotatable in tbe X-Y plane, first transfer means .for transferring singly an individual pellet to be bonded from the pellet supply stage on to the·intermediate table, second transfer means, for transferring the individual pellet to be bonded from the intermediate table to the pellet bonding stage, for bonding the pellet to a support, optical sensing means, for detecting the disposition of the individual pellet as placed on the intermediate table by the first transfer means, operable to detect that disposition by sensing an image including one corner of tbe pellet and by sensing an image including another corner.(opposing the said one corner) of the pellet, the disposition of the pellet being recognised in terms of corner co-ordinates, and control means for controlling the X and Y direction positions and the rotational orientation in the X-Y plane of the intermediate table, in dependence upon the detected disposition of the individual pellet disposed on the table, to bring the pellet to a desired disposition, prior to transfer to the pellet bonding stage by the second transfer means.
An embodiment of the present invention can 5 provide for positioning of a chip or pellet for bonding to a support without any substantial risk of damage to the pellet.
An embodiment of tbe present invention can provide for realisation of a high speed pellet bonding system capable of adjusting X and Y directions and rotational orientation of a pellet at a centralised stage with lesser mechanical inertia.
An embodiment of the present invention can provide a reliable pellet bonding system capable of accurately locating a pellet at a predetermined disposition.
Reference will now be made, by way of example, to the accompanying drawings, in wbich:Figure IA is a schematic, partially cross20 sectional illustration of an arrangement used in a conventional pellet bonding system;
Figure IB is a schematic plan view of an intermediate stage of the arrangement of Figure IA ;
Figure 2 is a schematic, partially cross25 sectional illustration of an arrangement used in a pellet bonding _ system according to the present invention;
Figures3A and 3B schematically illustrate relationships between TV scanning areas and chip patterns in a pellet bonding system according to the present invention; and
Figures 4a and 4B schematically illustrate image signal waveforms obtained by a TV camera in a pellet bonding system according to the present invention.
It is believed to be desirable to describe a conventional pellet bonding system before giving a detailed description of an embodiment of the present invention.
Id the conventional system of Fig. IA, a pellet 1 from among a large number of those prepared and available in a tray 2 in a pellet supply stage or area I is attracted and lifted by a vacuum chuck 7 and carried to an intermediate table 3 provided in an intermediate stage or area II. Then, a pellet 1 in the Intermediate stage II is accurately positioned and orientated in a specified location by means of a pair of pawls 4, 4'. Then, a collet 8 which accurately travels between the specified location on said intermediate table 3 and a specified location on a bonding table 5 in a bonding stage or area III attracts and lifts the pellet 1 positioned on said intermediate table 3 and carries it onto support 6, which is, for example, a lead frame mounted on the bonding table 5, for tbe purpose of bonding thepellet 1 to the lead frame 6.
The provision of the intermediate stage II between the pellet supply stage Γ and bonding stage III and positioning of the pellet in the intermediate stage II as explained above has the merit of simplifying the structure of the pellet bonding system as compared with a system wherein positioning is carried out at the pellet supply stage X or at the bonding stage III.
Scwever, in tbe positioning of a pellet by means of pawls 4, 4' tbe pellet 1 is positioned at a specified location by being pinchedby the pair of pawls 4, 4' each of which has an end shape opening as indicated in Fig. IB and therefore such pawls 4, 4' nay cause damage around the pellet 1 when they piDch it.
An embodiment of the present invention will now be explained.
As in the conventional system described above, one pellet 1 from amongst a large number in a tray 2 in a pellet supply stage I as shown in Fig. 2 is attracted by a vacuum chuck 7 and then carried onto an Intermediate table 3 provided in an intermediate stage II, as shown in Fig. 2.
At the intermediate stage II, a TV camera 9 is mounted just above an intermediate table 3, and this TV camera 9 picks up an image of pellet 1 which has been carried by said vacuum chuck 7 and placed on the intermediate table 3 and converts the image to a time series video signal for sending to a binary controller 10. The video signal is converted to binary signals of values ”0 and 1 in the binary controller 10 and then transferred to a central processing unit (CPU) 11, for example an 8-bit microcomputer.
In a memory 12 the CPU 11 previously stores map data relating to a reference position for a pellet in the intermediate area.
The CPU 11 compares the signal sent from the binary controller 10 with the reference position, calculates a difference between the detected position of pellet 1 on the intermediate table 3 and the reference position, and transmits a signal corresponding to such difference to driving units 14, 15, 16 provided at the stage 13 which supports said intermediate table 3. The driving units 14, 15, 16 of the intermediate table 3 may comprise pulse motors for example, which give displacements of the intermediate table 3 in X, Y and Θ directions (β directions are rotational directions) respectively.
The driving units 14, 15, 16 for the intermediate table 3, using pulse motors, accurately set the pellet 1 to the reference position by displacing the stage 13 in the X, Y and Θ directions in accordance with a signal generated from said CPU 11.
A preferred method of positioning a pellet to a reference position according to this invention is specifically explained as follows.
As an initial step, to establish a reference position, a first pellet is placed on the intermediate .table 3 by hand in the desired reference position for succeeding pellets of the same type which are to be handled automatically. Such placement of a pellet by hand can be effected with an error of less than about 0.1 (mm), which will not cause any problems in a subsequent bonding process using the collet 8.
The TV camera 9 picks up the image of the first pellet illuminated by a light source 9'.
More specifically, the TV camera 9 has a rectangular projection area S, that is a data sampling area, as shown in Fig. 3A and successively shoots images of areas I and II in which opposing two corners N^ and Ng of the first pellet are located respectively. The projection area S is scanned in 256 scanning lines in the X direction in the TV camera 9. The output signal or video signal of the TV camera has waveforms as shown in Figs. 4A and 4B.
Figure 4A shows a waveform which is obtained in case in which a scanning line does not run across the pellet 1 and Fig. 4B corresponds to a case in which a scanning line does cross the pellet 1.
A low level part la which appears in the initial portion of each wave form is a synchronizing signal component and the high level part lb is the image signal component.
As shown in Figs. 4A and 4B, the generally high level image signal part is of a relatively lower level when a scanning spot scanning a line is not on the pellet and a relatively higher level when the scanning spot is on the pellet.
The image signal Is supplied to the binary controller 10 and converted to binary signals indicating high or low by comparison of the level thereof with a reference voltage Is. The comparison of the image signal level and the reference voltage Is may be effected in the binary controller 10 by means of a slicing circuit which is well known in the art. The reference voltage is set at 1.0
(.volt) for example. An image signal level below the reference voltage is converted to, for example, zero (volt) and an image signal level above the reference voltage is converted to 5.0 (volt), by an amplifier.
The comparison output signal of the binary controller 10 is supplied to CPU 11. A high (5 volt) level of this output signal represents 1; a low level (zero volt) represents 0 ln the CPU 11. In this CPU 11, the output signal of the binary controller 10 is sampled or divided into 256 binary signals per one scanning line with a constant time interval between samples or divisions thereby to produce a series of 256 bit signals corresponding to one scanning line. Thus, 256 x 256 bit signal: are obtained which represent the area I and all of these signals are transferred to and stored in memory 12.
Tbe same procedures are followed in respect of area II after the intermediate table has been moved in X and Y directions by predetermined distances by the pulse motors 14 and 15 which are controlled by the CPU 11.
By means of tbe above procedures, reference position data is obtained and stored ln the memory 12. At this stage, reference co-ordinates for the corners Nj and Ng are calculated by the CPU 11 on the basis of tbe position data stored in the memory 12. The thus obtained co-ordinate data (Xy, Yj) and (Xg, Yg) is again transferred to and stored in tbe memory 12 and preparation operations are completed.
When actual bonding processes are being conducted, automatic positioning of pellets on the intermediate table 3 is carried out in tbe following manner. A pellet is transferred from the tray 2 onto the intermediate table 3 by the vacuum chuck 7. Position data relating to the position of the pellet is produced in the same manner as mentioned above for the reference pellet by the TV camera 9, binary controller 10 and the CPU 11.
Assuming here that tbe pellet ln to be handled automatically is positioned as shown in Fig. 3B so that one of opposing Ny, corners has co-ordinates (Xg, Yg) aDd the other of these corners tas co-ordinates (X^, Y4), these ce-ordirstes are obtained at this stage by the CPU on the basis of tbe abovementioned position data stored Id the memory 12. Thereafter, the differences between the co-ordinates (Xj, Yj) and (Xg, Yg) and between co-ordinates (Xj, Yg) and (X4, Y4) ar® calculated, and thus the displacements of the corners Ng and N^ in relation to reference positions therefor are obtained. The angular displacement of the pelle.t In is then obtained through a calculation of a tangent based on the difference between the displacements of the corners Ng and N4>
Tbe CPU 11 provides to the pulse motor 16 electric pulses corresponding to the angular displacement to rotate the intermediate table 3 which is driven by the pulse motor through a belt 17 (Fig. 2).
After angular displacement has been corrected as explained above, pellet position data is again produced in tbe same manner as mentioned above. And co-ordinates of ODe of the two opposing corners Ng, N4 are similarly obtained.
These co-ordinates are compared with those of the corresponding corner of the reference pellet thereby to calculate displacements of the pellet in X and Y directions. The CPU 11 provides electric pulses corresponding to the displacements along X and Y directions to the pulse motors 14 and IS respectively. The intermediate stage is driven along X and Y directions by the pulse motors 14 and 15 to correct the displacement, and thus the positioning of the pellet is completed.
In such an embodiment of this invention, damage to tbe pellet is not caused since operations including detection and correction of position of pellet 1 placed on the Intermediate table 3 are performed by means of noncontact processes.
Tbe pellet Inaccurately positioned in the intermediate area II as explained above is carried to the bonding area III by the collet 8 and then bonded onto a support 6. Tbe mechanism used may be the same as in the conventional system described above. In other words, a pellet In is attracted aDd lifted ty the collet 8 mounted to tbe bonding ‘ 49684 bead, the collect travels to and irom the reference position on intermediate stage 3 and a specified position on the bonding table 5 provided in the bonding area III. The pellet is carried onto a support 6 such as lead frame which is accurately positioned on said bonding table 5. Bonding to said lead frame is thus carried out.
As explained above, a pellet bonding system embodying this invention provides non-contact detection and correction of pellet position. Therefore, positioning can be effected accurately without damage to pellets and moreover the reference position and the dimensions of pellets to be handled can be changed accurately and quickly by means of the reference position setter, thus providing for easy change of type of pellet to be bonded and increasing the flexibility of a pellet bonding system.
This invention is Dot limited only to the embodiment described above but can also be employed in a variety of modified forms. For example, any known optical means such as photo-sensor can be used in place of a TV camera for detection of pellet position.
In addition, a magnetic tape or floppy disc can be used in place of memory 12 for setting the-reference position for pellets. Moreover, it is also possible to observe the reference position and cbtecting position of pellets by providing a monitor TV, which is not used in above embodiment.
Moreover, instead of 'having a plurality of pellets, for example semiconductor chips, aligned in a matrix configuration in a teay 2, it is possible to place semiconductor chips on a flexible plastic film.
In such a case, a scribed semiconductor wafer is initially bonded to the flexible plastic film. Then tbe wafer is cracked aDd the flexible plastic film is enlarged or distended thereby dividing tbe wafer into a plurality of chips arrayed on the film. The film with chips may be used in place of the tray 2 carrying the chips.
Moreover, the aboveaentioned embodiment requires or assumes that there is an accurately positioned lead frame providing the support 6. If the lead frame is not accurately positioned, the positional variation from an ideal position (corresponding to the reference position on the intermediate stage) can he allowed for by providing means for detecting the position of tbe lead frame and feedback means connected to the stage 13 through the CPU 11 (to adjust the position of the pellet on the intermediate stage to take into account the true position of the lead frame).
In a system for bonding a semiconductor chip on a supporting means, comprised of a chip supplying portion, an intermediate table and a chip bonding portion, a centralized control means is provided for adjusting X and T directions and rotational orientation of the chip with respect to predetermined location of the chip to be bonded at the chip bonding portion.
Claims (9)
1. A system for bonding pellets to supports, comprising:a pellet supply stage, providing a supply of pellets, each having opposed corners, to be bonded to supports; a pellet bondiDg stage, for bonding a pellet to a support, an intermediate table, between the supply and bonding stages, moveable in X and V directions and rotatable in the X-Y plane, first transfer means, for transferring singly an individual pellet to be bonded from the pellet supply stage on to the intermediate table, second transfer means, for transferring the individual pellet to be bonded from the intermediate table to the pellet bonding stage, for bonding the pellet to a support, optical sensing means, for detecting the disposition of the individual pellet as placed on the intermediate table by the first transfer means, operable to detect that disposition by sensing an image including one corner of the pellet and by sensing an image including another corner (opposing the said one corner) of the pellet, the disposition of the pellet being recognised is terms of corner co-ordinates, and oontrol means for controlling the X and Y direction positions and the rotational orientation in the X-Y plane of the intermediate table, in dependence upon the detected disposition of the individual pellet disposed on the table, to bring the pellet to a desired disposition, prior to transfer to the pellet bonding stage by the second transfer means.
2. A system as claimed in claim 1, wherein the optical sensing means comprise a television camera·..
3. A system as claimed in claim 1 or 2, wherein the optical sensing means are operable to detect tbe disposition of a pellet on tbe table by first sensing tbe image including one corner of tbe pellet, whereafter the table is moved by a predetermined amount so that tbe optical sensing means sense tbe image including another corner (opposing the said ODe corner) of tbe pellet-.
4. A system as claimed in claim 1,2 or 3, wherein a reference disposition, for establishing the said desired disposition is determined by detection of the disposition of a reference pellet placed manually upon the intermediate table, the detected reference disposition of the reference pellet being stored in the control means.
5. A system as claimed in any preceding claim, wherein the control means are operable first to adjust tbe rotational orientation of the table, to bring the pellet on the table to a required orientation consonant with the orientation of a pellet in the desired disposition, and are thereafter operable to adjust the X and T direction positions of the table to bring the pellet to the desired disposition .
6. A system as claimed in any preceding claim, including means operable to sense the disposition of the support in the bonding stage, and operable, in the event that the support is not disposed accurately to a preselected support disposition, to cooperate with the control means to adjust the said desired disposition to take into account such inaccuracy of support disposition.
7. A system as claimed in any preceding claim, for bonding pellets constituted by semiconductor chips to chip supports.
8. A system as claimed in claim 7 , wherein the chip supports are lead frames.
9. A system for bonding pellets to supports, substantially as hereinbefore described with reference to Fig.2, or Figs.2,3A and 3B, or Figs.2 to 4B of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7371979A JPS55165643A (en) | 1979-06-12 | 1979-06-12 | Device for bonding pellet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE801200L IE801200L (en) | 1980-12-12 |
| IE49684B1 true IE49684B1 (en) | 1985-11-27 |
Family
ID=13526306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE120080A IE49684B1 (en) | 1979-06-12 | 1980-06-11 | Systems for bonding pellets,for example semiconductor chips,to supports |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS55165643A (en) |
| GB (1) | GB2056766B (en) |
| IE (1) | IE49684B1 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4372802A (en) * | 1980-06-02 | 1983-02-08 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on printed circuit boards |
| JPS5896739A (en) * | 1981-12-04 | 1983-06-08 | Toshiba Seiki Kk | Hybrid bonding method of semiconductor pellet |
| JPS59210647A (en) * | 1983-05-14 | 1984-11-29 | Matsushita Electric Ind Co Ltd | Pellet bonding device |
| JPS61112336A (en) * | 1984-11-07 | 1986-05-30 | Nec Corp | Die bonder |
| JPH0519953Y2 (en) * | 1985-06-26 | 1993-05-25 | ||
| JPS6237942A (en) * | 1985-08-13 | 1987-02-18 | Matsushita Electronics Corp | Pellet positioning apparatus |
| JPS6362241A (en) * | 1986-09-02 | 1988-03-18 | Toshiba Corp | Wire bonding method |
| JPS62162335A (en) * | 1986-11-07 | 1987-07-18 | Toshiba Seiki Kk | Bonding device for semiconductor pellet |
| KR910006367B1 (en) * | 1987-07-09 | 1991-08-21 | 스미도모덴기고오교오 가부시기가이샤 | Chip package device |
| CH676695A5 (en) * | 1988-05-19 | 1991-02-28 | Bobst Sa | |
| JPH027992A (en) * | 1988-06-27 | 1990-01-11 | Brother Ind Ltd | Pattern registering machine |
| NL8900388A (en) * | 1989-02-17 | 1990-09-17 | Philips Nv | METHOD FOR JOINING TWO OBJECTS |
| JPH02239637A (en) * | 1989-03-14 | 1990-09-21 | Nec Corp | Manufacturing device for semiconductor device |
| US5115545A (en) * | 1989-03-28 | 1992-05-26 | Matsushita Electric Industrial Co., Ltd. | Apparatus for connecting semiconductor devices to wiring boards |
| JPH0450517U (en) * | 1990-09-05 | 1992-04-28 | ||
| JPH0521544A (en) * | 1991-07-12 | 1993-01-29 | Sumitomo Electric Ind Ltd | Method and apparatus for measuring semiconductor element provided with bump |
| DE4228012C2 (en) * | 1992-08-24 | 1996-08-22 | Siemens Ag | Method for spacing two components |
| JP2007158102A (en) * | 2005-12-06 | 2007-06-21 | Shibuya Kogyo Co Ltd | Bonding equipment |
| CN101884089B (en) * | 2007-12-03 | 2012-02-08 | 松下电器产业株式会社 | Chip mounting system |
| JP5065969B2 (en) * | 2008-03-31 | 2012-11-07 | 株式会社日立ハイテクインスツルメンツ | Component mounting equipment |
| CN116387209B (en) * | 2023-06-06 | 2023-09-05 | 北京中科同志科技股份有限公司 | Chip packaging system and chip packaging method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49126268A (en) * | 1973-04-04 | 1974-12-03 | ||
| JPS51131274A (en) * | 1975-05-10 | 1976-11-15 | Fujitsu Ltd | Tip bonding method |
| JPS52149070A (en) * | 1976-06-07 | 1977-12-10 | Toshiba Corp | Locating and inspecting method for semiconductor parts and die bonding device using the same |
| JPS5310968A (en) * | 1976-07-19 | 1978-01-31 | Hitachi Ltd | Pellet bonding method |
-
1979
- 1979-06-12 JP JP7371979A patent/JPS55165643A/en active Granted
-
1980
- 1980-06-10 GB GB8018970A patent/GB2056766B/en not_active Expired
- 1980-06-11 IE IE120080A patent/IE49684B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55165643A (en) | 1980-12-24 |
| GB2056766B (en) | 1984-04-26 |
| JPS6318326B2 (en) | 1988-04-18 |
| IE801200L (en) | 1980-12-12 |
| GB2056766A (en) | 1981-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Patent lapsed |