HK42179A - Electroless copper plating bath - Google Patents

Electroless copper plating bath

Info

Publication number: HK42179A
Authority: HK; Hong Kong
Prior art keywords: plating bath; copper plating; electroless copper; electroless; bath
Prior art date: 1975-08-19

Application number

HK421/79A

Other languages

English (en)

Original Assignee

Philips Nv

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-08-19

Filing date

1979-06-28

Publication date

1979-07-06

1979-06-28 Application filed by Philips Nv filed Critical Philips Nv

1979-07-06 Publication of HK42179A publication Critical patent/HK42179A/xx

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

HK421/79A 1975-08-19 1979-06-28 Electroless copper plating bath HK42179A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL7509824.A NL164906C (nl)	1975-08-19	1975-08-19	Werkwijze voor de bereiding van een waterig alkalische verkoperbad.

Publications (1)

Publication Number	Publication Date
HK42179A true HK42179A (en)	1979-07-06

Family

ID=19824317

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HK421/79A HK42179A (en)	1975-08-19	1979-06-28	Electroless copper plating bath

Country Status (16)

Country	Link
US (1)	US4118234A (de)
JP (1)	JPS5224939A (de)
AR (1)	AR221469A1 (de)
AT (1)	AT345057B (de)
AU (1)	AU501210B2 (de)
BE (1)	BE845254A (de)
BR (1)	BR7605351A (de)
CA (1)	CA1067652A (de)
CH (1)	CH624994A5 (de)
DE (1)	DE2635397C3 (de)
FR (1)	FR2321551A1 (de)
GB (1)	GB1521364A (de)
HK (1)	HK42179A (de)
IT (1)	IT1066104B (de)
NL (1)	NL164906C (de)
SE (1)	SE430615B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4229218A (en) *	1979-02-05	1980-10-21	Shipley Company Inc.	Self-monitoring electroless plating solution
US4666858A (en) *	1984-10-22	1987-05-19	International Business Machines Corporation	Determination of amount of anionic material in a liquid sample
US4857233A (en) *	1988-05-26	1989-08-15	Potters Industries, Inc.	Nickel particle plating system
US5130168A (en) *	1988-11-22	1992-07-14	Technic, Inc.	Electroless gold plating bath and method of using same
JP4482744B2 (ja) *	2001-02-23	2010-06-16	株式会社日立製作所	無電解銅めっき液、無電解銅めっき方法、配線板の製造方法
WO2015113141A1 (en)	2014-01-31	2015-08-06	Goldcorp Inc.	Process for separation of at least one metal sulfide compristng arsenic and/or antimony from a mixed sulfide concentrate
KR102430365B1 (ko) *	2014-04-10	2022-08-05	아토테크 도이칠란트 게엠베하 운트 콤파니 카게	도금조 조성물 및 팔라듐의 무전해 도금 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1266099B (de) *	1965-02-20	1968-04-11	Schering Ag	Bad fuer die reduktive Kupferabscheidung
US3649350A (en) *	1970-06-29	1972-03-14	Gen Electric	Electroless copper plating
US3708329A (en) *	1971-09-10	1973-01-02	Bell Telephone Labor Inc	Electroless copper plating
BE794048A (fr) *	1972-01-17	1973-07-16	Dynachem Corp	Procede et solution de revetement de cuivre sans traitement electrique

1975
- 1975-08-19 NL NL7509824.A patent/NL164906C/xx not_active IP Right Cessation
1976
- 1976-08-06 DE DE2635397A patent/DE2635397C3/de not_active Expired
- 1976-08-13 US US05/714,111 patent/US4118234A/en not_active Expired - Lifetime
- 1976-08-13 AR AR264333A patent/AR221469A1/es active
- 1976-08-16 AU AU16861/76A patent/AU501210B2/en not_active Expired
- 1976-08-16 IT IT50910/76A patent/IT1066104B/it active
- 1976-08-16 CA CA259,187A patent/CA1067652A/en not_active Expired
- 1976-08-16 CH CH1041976A patent/CH624994A5/de not_active IP Right Cessation
- 1976-08-16 SE SE7609126A patent/SE430615B/xx not_active IP Right Cessation
- 1976-08-16 GB GB33998/76A patent/GB1521364A/en not_active Expired
- 1976-08-16 AT AT608876A patent/AT345057B/de not_active IP Right Cessation
- 1976-08-16 BR BR7605351A patent/BR7605351A/pt unknown
- 1976-08-17 JP JP51097490A patent/JPS5224939A/ja active Granted
- 1976-08-17 BE BE169864A patent/BE845254A/xx not_active IP Right Cessation
- 1976-08-18 FR FR7625075A patent/FR2321551A1/fr active Granted
1979
- 1979-06-28 HK HK421/79A patent/HK42179A/xx unknown

Also Published As

Publication number	Publication date
NL164906B (nl)	1980-09-15
AR221469A1 (es)	1981-02-13
CA1067652A (en)	1979-12-11
BR7605351A (pt)	1977-08-16
JPS5224939A (en)	1977-02-24
IT1066104B (it)	1985-03-04
AU501210B2 (en)	1979-06-14
ATA608876A (de)	1977-12-15
NL164906C (nl)	1981-02-16
JPS5344405B2 (de)	1978-11-29
AU1686176A (en)	1978-02-23
AT345057B (de)	1978-08-25
SE7609126L (sv)	1977-02-20
US4118234A (en)	1978-10-03
CH624994A5 (de)	1981-08-31
DE2635397C3 (de)	1978-11-16
GB1521364A (en)	1978-08-16
FR2321551B1 (de)	1980-05-23
DE2635397A1 (de)	1977-02-24
BE845254A (fr)	1977-02-17
NL7509824A (nl)	1977-02-22
DE2635397B2 (de)	1978-03-23
SE430615B (sv)	1983-11-28
FR2321551A1 (fr)	1977-03-18

Publication	Publication Date	Title
DE2964079D1 (en)	1982-12-30	An electroless copper plating process
JPS51149134A (en)	1976-12-21	Nonncyanideeseries silver plating bath
AU2225477A (en)	1978-08-24	Acid copper plating baths
JPS5464025A (en)	1979-05-23	Acidic copper plating bath
DE3066952D1 (en)	1984-04-19	Electroless copper plating solution
JPS5211132A (en)	1977-01-27	Electroplating bath
IL51772A (en)	1979-09-30	Electroless copper plating
JPS51120938A (en)	1976-10-22	Nickel electroplating bath
HK42179A (en)	1979-07-06	Electroless copper plating bath
JPS5220339A (en)	1977-02-16	Chemical copper plating solution
GB1547028A (en)	1979-06-06	Electroless gold plating baths
JPS5217335A (en)	1977-02-09	Chemical copper plating solution
GB1555709A (en)	1979-11-14	Electroless nickel plating
JPS5215426A (en)	1977-02-05	Electroplating bath
JPS5448646A (en)	1979-04-17	Copper electroplating
JPS5217334A (en)	1977-02-09	Electroless copper plating solution
JPS5260869A (en)	1977-05-19	Method of electroless copper plating
JPS5278632A (en)	1977-07-02	Peeling solution for silver plating
ZA762314B (en)	1977-10-26	Electroless plating substrates
JPS5217333A (en)	1977-02-09	Plating solution
JPS51135836A (en)	1976-11-25	Electroless copper plating solusion
JPS5214537A (en)	1977-02-03	Rhodium plating bath
JPS5211133A (en)	1977-01-27	Electroplating bath
JPS5259028A (en)	1977-05-16	Nonnelectrolytic copper plating bath
JPS5221226A (en)	1977-02-17	Nonnelectric copper plating solution