JPS5260869A - Method of electroless copper plating - Google Patents

Method of electroless copper plating

Info

Publication number
JPS5260869A
JPS5260869A JP13688175A JP13688175A JPS5260869A JP S5260869 A JPS5260869 A JP S5260869A JP 13688175 A JP13688175 A JP 13688175A JP 13688175 A JP13688175 A JP 13688175A JP S5260869 A JPS5260869 A JP S5260869A
Authority
JP
Japan
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13688175A
Other languages
Japanese (ja)
Inventor
Kenichi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP13688175A priority Critical patent/JPS5260869A/en
Publication of JPS5260869A publication Critical patent/JPS5260869A/en
Pending legal-status Critical Current

Links

JP13688175A 1975-11-14 1975-11-14 Method of electroless copper plating Pending JPS5260869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13688175A JPS5260869A (en) 1975-11-14 1975-11-14 Method of electroless copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13688175A JPS5260869A (en) 1975-11-14 1975-11-14 Method of electroless copper plating

Publications (1)

Publication Number Publication Date
JPS5260869A true JPS5260869A (en) 1977-05-19

Family

ID=15185713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13688175A Pending JPS5260869A (en) 1975-11-14 1975-11-14 Method of electroless copper plating

Country Status (1)

Country Link
JP (1) JPS5260869A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325991A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polyesters
US4325992A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polycarbonates
JPS61270375A (en) * 1985-05-24 1986-11-29 Tokai Rika Co Ltd Molding material and method for plating molding article
JPH01257395A (en) * 1988-04-07 1989-10-13 Hokuriku Electric Ind Co Ltd Manufacture of printed circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325991A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polyesters
US4325992A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polycarbonates
JPS61270375A (en) * 1985-05-24 1986-11-29 Tokai Rika Co Ltd Molding material and method for plating molding article
JPH01257395A (en) * 1988-04-07 1989-10-13 Hokuriku Electric Ind Co Ltd Manufacture of printed circuit board

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