HK1214561A1 - 發光裝置的分選方法、照明裝置的製造方法以及照明裝置 - Google Patents
發光裝置的分選方法、照明裝置的製造方法以及照明裝置Info
- Publication number
- HK1214561A1 HK1214561A1 HK16102507.4A HK16102507A HK1214561A1 HK 1214561 A1 HK1214561 A1 HK 1214561A1 HK 16102507 A HK16102507 A HK 16102507A HK 1214561 A1 HK1214561 A1 HK 1214561A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- illumination device
- manufacturing
- light emitting
- emitting devices
- binning light
- Prior art date
Links
- 238000005286 illumination Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S10/00—Lighting devices or systems producing a varying lighting effect
- F21S10/02—Lighting devices or systems producing a varying lighting effect changing colors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014052846 | 2014-03-15 | ||
JP2015041827A JP6406069B2 (ja) | 2014-03-15 | 2015-03-03 | 発光装置の選別方法及び照明装置の製造方法並びに照明装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1214561A1 true HK1214561A1 (zh) | 2016-07-29 |
Family
ID=52784898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16102507.4A HK1214561A1 (zh) | 2014-03-15 | 2016-03-04 | 發光裝置的分選方法、照明裝置的製造方法以及照明裝置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10008481B2 (zh) |
EP (1) | EP2930415B1 (zh) |
JP (1) | JP6406069B2 (zh) |
KR (1) | KR102309371B1 (zh) |
CN (1) | CN104907266B (zh) |
HK (1) | HK1214561A1 (zh) |
TW (1) | TWI658233B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10512133B2 (en) * | 2016-01-28 | 2019-12-17 | Ecosense Lighting Inc. | Methods of providing tunable warm white light |
CN109315037B (zh) * | 2016-01-28 | 2022-07-01 | 生态照明公司 | 用于提供具有高显色性的可调白光的*** |
CN106015956A (zh) * | 2016-05-31 | 2016-10-12 | 四川鸣亨科技有限责任公司 | 一种符合铁路信号灯色玻璃坐标的led |
CN106423915B (zh) * | 2016-10-12 | 2018-11-23 | 合肥彩虹蓝光科技有限公司 | 一种测试分选分色的方法 |
US10085320B1 (en) * | 2016-10-21 | 2018-09-25 | Peter Sussman | Pre-calibrated light box |
CN108663856B (zh) * | 2017-03-30 | 2020-01-24 | 京东方科技集团股份有限公司 | 背光模组的制造方法及装置、显示装置及*** |
JP7113245B2 (ja) * | 2017-11-20 | 2022-08-05 | パナソニックIpマネジメント株式会社 | 制御装置、点灯装置及び照明システム |
JP7007595B2 (ja) * | 2019-05-31 | 2022-01-24 | 日亜化学工業株式会社 | 発光装置の製造方法 |
KR20220153374A (ko) * | 2021-05-11 | 2022-11-18 | 한화정밀기계 주식회사 | 기판 상의 복수의 장착점들 각각에 장착되는 발광 소자의 랭크를 결정하기 위한 장치 및 방법 |
CN113394328B (zh) * | 2021-06-08 | 2023-02-10 | 厦门通士达照明有限公司 | 一种非标广色域led照明装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100520152C (zh) * | 2004-09-29 | 2009-07-29 | 皇家飞利浦电子股份有限公司 | 照明设备 |
US7401943B2 (en) * | 2005-06-07 | 2008-07-22 | Fusion Uv Systems, Inc. | Solid-state light sources for curing and surface modification |
ATE541157T1 (de) * | 2005-11-22 | 2012-01-15 | Koninkl Philips Electronics Nv | Beleuchtungssystem mit mehreren lichtquellensätzen |
JP2008147563A (ja) | 2006-12-13 | 2008-06-26 | Sharp Corp | ばらつきのあるledによる均一バックライトの製造方法 |
US8350461B2 (en) * | 2008-03-28 | 2013-01-08 | Cree, Inc. | Apparatus and methods for combining light emitters |
JP5091750B2 (ja) * | 2008-04-11 | 2012-12-05 | スタンレー電気株式会社 | Led照明装置 |
GB2464102A (en) * | 2008-10-01 | 2010-04-07 | Optovate Ltd | Illumination apparatus comprising multiple monolithic subarrays |
KR101081246B1 (ko) * | 2008-11-21 | 2011-11-08 | 엘지이노텍 주식회사 | 발광 장치 및 그 제조방법 |
DE102008064073A1 (de) * | 2008-12-19 | 2010-06-24 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Mehrzahl von LED-Beleuchtungsvorrichtungen und LED-Beleuchtungsvorrichtung |
US8339029B2 (en) * | 2009-02-19 | 2012-12-25 | Cree, Inc. | Light emitting devices and systems having tunable chromaticity |
US7967652B2 (en) * | 2009-02-19 | 2011-06-28 | Cree, Inc. | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
US8531668B2 (en) * | 2009-12-02 | 2013-09-10 | Osram Opto Semiconductors Gmbh | Method for the binning of radiation-emitting, optoelectronic semiconductor components |
JP2012079574A (ja) * | 2010-10-04 | 2012-04-19 | Panasonic Corp | 照明装置の製造方法 |
JP5390566B2 (ja) | 2011-07-14 | 2014-01-15 | シャープ株式会社 | 発光素子の生産装置およびその生産方法、発光モジュールの生産装置およびその生産方法、発光モジュール、光源装置、液晶表示装置 |
JP2013045544A (ja) | 2011-08-23 | 2013-03-04 | Mitsubishi Electric Corp | 発光装置及びledモジュール |
JP5501310B2 (ja) * | 2011-08-23 | 2014-05-21 | 三菱電機株式会社 | Ledモジュール及び発光装置及びledモジュールの製造方法 |
JP4884566B1 (ja) * | 2011-09-27 | 2012-02-29 | 三菱電機株式会社 | Led選択装置及びled選択プログラム及びled選択方法 |
US20140240612A1 (en) * | 2011-10-31 | 2014-08-28 | Sharp Kabushiki Kaisha | Display device, television device, and method of manufacturing display device |
-
2015
- 2015-03-03 JP JP2015041827A patent/JP6406069B2/ja active Active
- 2015-03-11 KR KR1020150033883A patent/KR102309371B1/ko active IP Right Grant
- 2015-03-11 EP EP15158618.7A patent/EP2930415B1/en active Active
- 2015-03-13 CN CN201510111452.1A patent/CN104907266B/zh active Active
- 2015-03-13 US US14/657,846 patent/US10008481B2/en active Active
- 2015-03-13 TW TW104108196A patent/TWI658233B/zh active
-
2016
- 2016-03-04 HK HK16102507.4A patent/HK1214561A1/zh unknown
-
2018
- 2018-05-23 US US15/986,817 patent/US10629569B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2930415B1 (en) | 2019-11-06 |
JP6406069B2 (ja) | 2018-10-17 |
KR20150107647A (ko) | 2015-09-23 |
JP2015195356A (ja) | 2015-11-05 |
KR102309371B1 (ko) | 2021-10-12 |
TW201538885A (zh) | 2015-10-16 |
EP2930415A2 (en) | 2015-10-14 |
EP2930415A3 (en) | 2015-12-16 |
US20180269185A1 (en) | 2018-09-20 |
CN104907266A (zh) | 2015-09-16 |
TWI658233B (zh) | 2019-05-01 |
CN104907266B (zh) | 2018-04-06 |
US20150262979A1 (en) | 2015-09-17 |
US10629569B2 (en) | 2020-04-21 |
US10008481B2 (en) | 2018-06-26 |
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